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JP4835404B2 - Circuit board with electronic circuit components - Google Patents
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JP4835404B2 - Circuit board with electronic circuit components - Google Patents

Circuit board with electronic circuit components Download PDF

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JP4835404B2
JP4835404B2 JP2006312780A JP2006312780A JP4835404B2 JP 4835404 B2 JP4835404 B2 JP 4835404B2 JP 2006312780 A JP2006312780 A JP 2006312780A JP 2006312780 A JP2006312780 A JP 2006312780A JP 4835404 B2 JP4835404 B2 JP 4835404B2
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electronic circuit
circuit board
circuit component
cover member
component
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JP2008130737A (en
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祝仁 小坂
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board with electronic circuit component, which has superior tamper resistance. <P>SOLUTION: The circuit board with electronic circuit component 100 is provided with a circuit board 1 where wiring patterns 2 are formed, an electronic circuit component 3 which is loaded on the circuit board 1 and in which one or more terminals 33 are arranged on an upper face and a cover member 4 which covers the electronic circuit component 3 and at least a part of the circuit board 1 and is formed of a metal material fixed to the electronic circuit component 3 and the circuit board 1 by insulating adhesive 5. The cover member 4 and the terminal 33 of the electronic circuit component 3 are fixed by adhesive 5. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

本発明は、電子回路部品が搭載された電子回路部品付回路基板に関する。   The present invention relates to a circuit board with electronic circuit components on which electronic circuit components are mounted.

近年、ＩＣカード等の普及に伴い、電子回路部品における耐タンパ性の重要性が高まっている。耐タンパ性とは、電子回路部品内の情報や内部構造の読取・偽造・変造・改竄等の不正行為に対して、これに対抗するため電子回路部品を備える装置自体に設けられた防護機能である。
例えば、特許文献１には、プリント配線板の表裏と導体パターンとの間に不透明層が設けられ、回路の無断複製の防止が図られたプリント配線板が開示されている。
特開平１０−１６３５８０号公報 In recent years, with the spread of IC cards and the like, the importance of tamper resistance in electronic circuit components is increasing. Tamper resistance is a protective function provided in the device itself equipped with electronic circuit components to counter this against illegal acts such as reading, counterfeiting, alteration, tampering, etc. of information and internal structure in electronic circuit components. is there.
For example, Patent Document 1 discloses a printed wiring board in which an opaque layer is provided between the front and back surfaces of a printed wiring board and a conductor pattern to prevent unauthorized duplication of circuits.
Japanese Patent Laid-Open No. 10-163580

しかしながら、上述の特許文献１のように回路基板上に不透明層を設けただけでは、当該不透明層を取り除くなどの電子回路部品のタンパ行為が容易に行えるため、耐タンパ性が低いという問題があった。   However, simply providing an opaque layer on the circuit board as in the above-mentioned Patent Document 1 makes it easy to tamper with electronic circuit components such as removing the opaque layer, resulting in low tamper resistance. It was.

本発明の課題は、より優れた耐タンパ性を有する電子回路部品付回路基板を提供することである。   The subject of this invention is providing the circuit board with an electronic circuit component which has the more excellent tamper resistance.

上記課題を解決するため、請求項１に記載の発明は、電子回路部品付回路基板において、
配線パターンが形成された回路基板と、
前記回路基板に搭載され、上面に複数の端子が設けられた複数の電子回路部品と、
前記複数の電子回路部品側の前記回路基板全体を被覆するとともに、前記複数の電子回路部品及び前記回路基板に絶縁性の接着剤により固着された金属材料からなるカバー部材と、
を備え、
前記複数の端子の間には配線パターンが設けられ、
前記カバー部材と、前記複数の電子回路部品の上面および前記複数の端子とが前記接着剤により固定されていることを特徴とする。 In order to solve the above problems, the invention according to claim 1 is a circuit board with electronic circuit components,
A circuit board on which a wiring pattern is formed;
Mounted on the circuit board, a plurality of electronic circuit components multiple terminals are provided on the upper surface,
With covering the entire circuit board of the plurality of electronic circuit components side, and a cover member made of a metal material is fixed by an insulating adhesive to the plurality of electronic circuit components and the circuit board,
With
A wiring pattern is provided between the plurality of terminals,
The cover member, upper surfaces of the plurality of electronic circuit components, and the plurality of terminals are fixed by the adhesive.

請求項１に記載の発明によれば、電子回路部品付回路基板において、配線パターンが形成された回路基板と、回路基板に搭載され、上面に複数の端子が設けられた複数の電子回路部品と、複数の電子回路部品側の回路基板全体を被覆するとともに、複数の電子回路部品及び回路基板に絶縁性の接着剤により固着された金属材料からなるカバー部材と、が備わり、複数の端子の間には配線パターンが設けられ、カバー部材と、複数の電子回路部品の上面および複数の端子とが接着剤により固定されている。
したがって、電子回路部品がカバー部材により覆われているため、電子回路部品を見ることが不可能となるとともに、カバー部材が電子回路部品及び回路基板に接着剤により固着されているため、カバー部材を取り除こうとしたり、カバー部材と電子回路部品とを引き離そうとすると、電子回路部品が破損するため、より優れた耐タンパ性を有する電子回路部品付回路基板を提供することができる。また、カバー部材は金属材料からなるため、専用の放熱材を別途設けることなく、電子回路部品からの熱を放熱することができる。さらに、端子とカバー部材とが絶縁性の接着剤を介して接着されているので、カバー部材が金属であっても端子に対して影響を与えることがない。 According to the invention described in claim 1, in the circuit board with electronic circuit components, and a circuit board on which a wiring pattern is formed, is mounted on a circuit board, a plurality of electronic circuit components in which the terminal of the multiple is provided on the upper surface When, with covers the entire circuit board of the plurality of electronic circuit components side, and a cover member made of a metallic material which is secured by a plurality of electronic circuit components and circuit board insulating adhesive, it is equipped with a plurality of terminals A wiring pattern is provided therebetween, and the cover member, the upper surfaces of the plurality of electronic circuit components, and the plurality of terminals are fixed by an adhesive.
Therefore, since the electronic circuit component is covered with the cover member, it is impossible to see the electronic circuit component, and the cover member is fixed to the electronic circuit component and the circuit board with an adhesive. If an attempt is made to remove or an attempt is made to separate the cover member and the electronic circuit component, the electronic circuit component is damaged. Therefore, a circuit board with an electronic circuit component having more excellent tamper resistance can be provided. Further, since the cover member is made of a metal material, heat from the electronic circuit component can be radiated without providing a dedicated heat radiating material. Furthermore, since the terminal and the cover member are bonded via an insulating adhesive, the terminal is not affected even if the cover member is a metal.

以下、図面を参照しながら、本発明の実施の形態について説明する。なお、発明の範囲は図示例に限定されない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. The scope of the invention is not limited to the illustrated example.

図１は、本実施形態の電子回路部品付回路基板１００の概略的な平面透視図である。また、図２は、図１のＡ−Ａ線における電子回路部品付回路基板１００の要部断面図である。
本実施形態における電子回路部品付回路基板１００は、例えば、図１及び図２に示すように、配線パターン２が形成された回路基板１と、この回路基板１上の配線パターン２と、回路基板１上に搭載された複数の電子回路部品３と、カバー部材４と、等を備えて構成されている。カバー部材４は、例えば、電子回路部品３と、回路基板１とを被覆しており、電子回路部品３と回路基板１とに接着剤５により固着されている。 FIG. 1 is a schematic perspective plan view of a circuit board 100 with an electronic circuit component according to the present embodiment. FIG. 2 is a cross-sectional view of the main part of the circuit board 100 with an electronic circuit component taken along the line AA in FIG.
A circuit board 100 with an electronic circuit component in the present embodiment includes, for example, a circuit board 1 on which a wiring pattern 2 is formed, a wiring pattern 2 on the circuit board 1, and a circuit board, as shown in FIGS. 1 includes a plurality of electronic circuit components 3 mounted on 1, a cover member 4, and the like. The cover member 4 covers, for example, the electronic circuit component 3 and the circuit board 1 and is fixed to the electronic circuit component 3 and the circuit board 1 with an adhesive 5.

回路基板１は、配線パターン２が形成されるとともに、電子回路部品３が搭載される絶縁性の基板である。回路基板１としては、例えば、紙フェノール樹脂、紙エポキシ樹脂、ガラスエポキシ樹脂等の絶縁板の中から適宜選択して適用することができる。   The circuit board 1 is an insulating board on which a wiring pattern 2 is formed and an electronic circuit component 3 is mounted. As the circuit board 1, for example, an appropriate insulating plate such as paper phenol resin, paper epoxy resin, or glass epoxy resin can be selected and applied.

配線パターン２は、例えば、回路基板１の表面に貼られた銅箔等の導電体に対して、絶縁する不要な部分をエッチング液により溶かして配線部分のみを残すエッチングや、めっき等が行われることにより形成されている。配線パターン２は、回路基板１に搭載された各電子回路部品３を電気的に接続する役割を果たしており、例えば、後述するように、電子回路部品３の上面に設けられた端子３３を、他の端子３２、３３等に接続している。   The wiring pattern 2 is subjected to, for example, etching, plating, or the like that dissolves an unnecessary portion to be insulated with an etching solution to a conductor such as a copper foil attached to the surface of the circuit board 1 to leave only the wiring portion. It is formed by. The wiring pattern 2 plays a role of electrically connecting each electronic circuit component 3 mounted on the circuit board 1. For example, as will be described later, a terminal 33 provided on the upper surface of the electronic circuit component 3 is connected to another wiring pattern 2. Are connected to the terminals 32, 33 and the like.

カバー部材４は、例えば、金属材料から成り、断面コ字状に形成されている。当該カバー部材４は、電子回路部品３全体を被覆して当該電子回路部品３の上面部全体に接着剤５により固着されるとともに、回路基板１全体を被覆して当該回路基板１の端部に接着剤５により固着されている。
金属材料としては、例えば、アルミニウム、アルミニウム合金、銅、マグネシウム等の熱伝導率の高い材料が用いられ、電子回路部品３からの熱を大気中に放熱する放熱材としての機能を果たす。また、接着剤５としては、例えば、絶縁性接着剤が用いられ、カバー部材４を電子回路部品３或いは回路基板１に接着する。 The cover member 4 is made of, for example, a metal material and has a U-shaped cross section. The cover member 4 covers the entire electronic circuit component 3 and is fixed to the entire upper surface portion of the electronic circuit component 3 with an adhesive 5, and covers the entire circuit board 1 and covers the end portion of the circuit board 1. It is fixed by an adhesive 5.
As the metal material, for example, a material having high thermal conductivity such as aluminum, aluminum alloy, copper, magnesium, or the like is used, and functions as a heat radiating material that radiates heat from the electronic circuit component 3 to the atmosphere. Further, as the adhesive 5, for example, an insulating adhesive is used, and the cover member 4 is bonded to the electronic circuit component 3 or the circuit board 1.

図３は、図２のＢ−Ｂ線における電子回路部品付回路基板１００の要部断面図であり、図４は、本実施形態の電子回路部品付回路基板１００に搭載される電子回路部品３の平面図である。
電子回路部品３は、例えば、１つの筐体３１内に、ダイオード、トランジスタ、コンデンサ、抵抗器等の素子を収容するＩＣ（集積回路）等の半導体素子や、コンデンサ、ダイオード、抵抗器等であり、各電子回路部品３が回路基板１上にハンダ付け等により接着され、配線パターン２と電気的に接続されている。 3 is a cross-sectional view of the main part of the circuit board 100 with an electronic circuit component taken along the line BB in FIG. 2, and FIG. 4 shows the electronic circuit component 3 mounted on the circuit board 100 with an electronic circuit component of the present embodiment. FIG.
The electronic circuit component 3 is, for example, a semiconductor element such as an IC (integrated circuit) that accommodates elements such as a diode, a transistor, a capacitor, and a resistor, a capacitor, a diode, a resistor, and the like in one casing 31. Each electronic circuit component 3 is bonded to the circuit board 1 by soldering or the like, and is electrically connected to the wiring pattern 2.

電子回路部品３の筐体３１の両側面には、配線パターン２と接続するための複数の端子３２が設けられている。さらに、当該電子回路部品３には、筐体３１の上面部において、電子回路部品３内の配線バターン２を接続したり、或いは他の電子回路部品３に接続するための一又は複数（例えば、図１、図２及び図４の電子回路部品３では２つ）の端子３３が設けられている。
当該端子３３は、カバー部材４の下面に絶縁性の接着剤５を介して固定されている。具体的には、端子３３は、電子回路部品３の筐体３１上面部において突出するように設けられており、同一又は他の電子回路部品３に設けられた他の端子３２、３３と、配線パターン２を介して接続されている。そして、電子回路部品３の上面に設けられた当該端子３３は、電子回路部品１又は回路基板１と、カバー部材４とを接着するための接着剤５の中に挟み込まれて埋設されている。
すなわち、電子回路部品１を覆うカバー部材４を取り除こうとすると、カバー部材４と、電子回路部品３と、を固着する接着剤５の中に埋設された端子３３が破損し、その結果、当該端子３３を収容する電子回路部品３の筐体３１内部もが破損することとなる。 A plurality of terminals 32 for connecting to the wiring pattern 2 are provided on both side surfaces of the casing 31 of the electronic circuit component 3. Furthermore, the electronic circuit component 3 is connected to the wiring pattern 2 in the electronic circuit component 3 on the upper surface portion of the housing 31 or to one or a plurality of other electronic circuit components 3 (for example, Two terminals 33 are provided in the electronic circuit component 3 of FIGS. 1, 2, and 4.
The terminal 33 is fixed to the lower surface of the cover member 4 via an insulating adhesive 5. Specifically, the terminal 33 is provided so as to protrude from the upper surface portion of the housing 31 of the electronic circuit component 3, and other terminals 32 and 33 provided on the same or other electronic circuit components 3 and wiring They are connected via pattern 2. The terminal 33 provided on the upper surface of the electronic circuit component 3 is sandwiched and embedded in an adhesive 5 for bonding the electronic circuit component 1 or the circuit board 1 and the cover member 4.
That is, when the cover member 4 covering the electronic circuit component 1 is to be removed, the terminal 33 embedded in the adhesive 5 that fixes the cover member 4 and the electronic circuit component 3 is damaged, and as a result, the terminal The inside of the housing 31 of the electronic circuit component 3 that accommodates the 33 is also damaged.

以上説明した本発明を適用した電子回路部品付回路基板１００によれば、配線パターン２が形成された回路基板１と、回路基板１に搭載され、上面に一又は複数の端子３３が設けられた電子回路部品３と、電子回路部品３と、回路基板１の少なくとも一部とを被覆するとともに、電子回路部品３及び回路基板１に絶縁性の接着剤５により固着された金属材料からなるカバー部材４と、が備わり、カバー部材４と、電子回路部品３の端子３３とが接着剤５により固定されている。
したがって、電子回路部品３がカバー部材４により覆われているため、電子回路部品３を見ることが不可能となるとともに、カバー部材４が電子回路部品３及び回路基板１に接着剤５により固着されているため、カバー部材４を取り除こうとしたり、カバー部材４と電子回路部品３とを引き離そうとすると、電子回路部品３が破損するため、より優れた耐タンパ性を有する電子回路部品付回路基板１００を提供することができる。
また、カバー部材４は金属材料からなるため、専用の放熱材を別途設けることなく、電子回路部品３からの熱を放熱することができる。
さらに、端子３３とカバー部材４とが絶縁性の接着剤５を介して接着されているので、カバー部材４が金属であっても端子３３に対して影響を与えることがない。 According to the circuit board 100 with an electronic circuit component to which the present invention described above is applied, the circuit board 1 on which the wiring pattern 2 is formed, and the circuit board 1 is mounted, and one or more terminals 33 are provided on the upper surface. A cover member made of a metal material that covers the electronic circuit component 3, the electronic circuit component 3, and at least a part of the circuit board 1 and is fixed to the electronic circuit component 3 and the circuit board 1 with an insulating adhesive 5. 4, and the cover member 4 and the terminal 33 of the electronic circuit component 3 are fixed by the adhesive 5.
Therefore, since the electronic circuit component 3 is covered with the cover member 4, it is impossible to see the electronic circuit component 3, and the cover member 4 is fixed to the electronic circuit component 3 and the circuit board 1 with the adhesive 5. Therefore, if the cover member 4 is to be removed or the cover member 4 and the electronic circuit component 3 are separated, the electronic circuit component 3 is damaged, and therefore the circuit board 100 with electronic circuit components having more excellent tamper resistance. Can be provided.
Further, since the cover member 4 is made of a metal material, the heat from the electronic circuit component 3 can be radiated without separately providing a dedicated heat radiating material.
Furthermore, since the terminal 33 and the cover member 4 are bonded via the insulating adhesive 5, the terminal 33 is not affected even if the cover member 4 is a metal.

なお、本発明は、発明の趣旨を逸脱しない範囲において種々の改良並びに設計の変更を行っても良い。
例えば、本実施形態では、カバー部材４が、電子回路部品３と回路基板１の一部のみを被覆するように設けられているが、カバー部材４が回路基板１全体を被覆して封止するように設けられていても良い。
カバー部材４の材料は、金属以外にも樹脂等であっても良い。
また、電子回路部品３の上面に設けられる端子３３の形状・数は上記実施形態において説明したものに限られず、任意に設定可能である。 In the present invention, various improvements and design changes may be made without departing from the spirit of the invention.
For example, in this embodiment, the cover member 4 is provided so as to cover only a part of the electronic circuit component 3 and the circuit board 1, but the cover member 4 covers and seals the entire circuit board 1. It may be provided as follows.
The material of the cover member 4 may be a resin other than metal.
Further, the shape and number of the terminals 33 provided on the upper surface of the electronic circuit component 3 are not limited to those described in the above embodiment, and can be arbitrarily set.

本実施形態の電子回路部品付回路基板の概略的な平面透視図である。It is a rough plane perspective view of the circuit board with an electronic circuit component of this embodiment. 図１のＡ−Ａ線における電子回路部品付回路基板の要部断面図である。It is principal part sectional drawing of the circuit board with an electronic circuit component in the AA line of FIG. 図２のＢ−Ｂ線における電子回路部品付回路基板の要部断面図である。It is principal part sectional drawing of the circuit board with an electronic circuit component in the BB line of FIG. 本実施形態の電子回路部品付回路基板に搭載される電子回路部品の平面図である。It is a top view of the electronic circuit component mounted in the circuit board with an electronic circuit component of this embodiment.

符号の説明Explanation of symbols

１００ 電子回路部品付回路基板
１ 回路基板
２ 配線パターン
３ 電子回路部品
３３ 端子
４ カバー部材
５ 接着剤 DESCRIPTION OF SYMBOLS 100 Circuit board 1 with electronic circuit components Circuit board 2 Wiring pattern 3 Electronic circuit components 33 Terminal 4 Cover member 5 Adhesive

Claims (1)

配線パターンが形成された回路基板と、
前記回路基板に搭載され、上面に複数の端子が設けられた複数の電子回路部品と、
前記複数の電子回路部品側の前記回路基板全体を被覆するとともに、前記複数の電子回路部品及び前記回路基板に絶縁性の接着剤により固着された金属材料からなるカバー部材と、
を備え、
前記複数の端子の間には配線パターンが設けられ、
前記カバー部材と、前記複数の電子回路部品の上面および前記複数の端子とが前記接着剤により固定されていることを特徴とする電子回路部品付回路基板。 A circuit board on which a wiring pattern is formed;
Mounted on the circuit board, a plurality of electronic circuit components multiple terminals are provided on the upper surface,
With covering the entire circuit board of the plurality of electronic circuit components side, and a cover member made of a metal material is fixed by an insulating adhesive to the plurality of electronic circuit components and the circuit board,
With
A wiring pattern is provided between the plurality of terminals,
The circuit board with an electronic circuit component, wherein the cover member, upper surfaces of the plurality of electronic circuit components, and the plurality of terminals are fixed by the adhesive.
JP2006312780A 2006-11-20 2006-11-20 Circuit board with electronic circuit components Expired - Fee Related JP4835404B2 (en)

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JP2006312780A JP4835404B2 (en) 2006-11-20 2006-11-20 Circuit board with electronic circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006312780A JP4835404B2 (en) 2006-11-20 2006-11-20 Circuit board with electronic circuit components

Publications (2)

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JP2008130737A JP2008130737A (en) 2008-06-05
JP4835404B2 true JP4835404B2 (en) 2011-12-14

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US9456512B2 (en) 2012-08-31 2016-09-27 Bluebird Inc. Mobile terminal
EP2892161B1 (en) 2012-08-31 2017-08-02 Bluebird Inc. Mobile terminal provided with security function
JP7046149B1 (en) 2020-12-01 2022-04-01 三菱電機株式会社 Electronic circuit equipment and its manufacturing method

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