JP4835702B2 - Printed wiring board hole filling apparatus and printed wiring board manufacturing method using the same - Google Patents

Description

  The present invention relates to a printed wiring board hole filling apparatus and a method for manufacturing a printed wiring board using the same.

In recent years, so-called build-up substrates with multiple layers are mounted on electronic devices. The electrical connection between the layers of the build-up board is performed using connection means such as a through hole (hereinafter referred to as TH) or an interstitial via hole (hereinafter referred to as IVH) which is a through hole penetrating a predetermined layer. Is well known to do.
The end of the through hole is formed on the outermost layer surface of the printed wiring board, and the end of the through hole is formed in the inner layer of the printed wiring board, and cannot be seen from the outside. Is.

By the way, as the mounting density of the build-up board increases, the hole diameters of TH and IVH are smaller, and the number of holes per board unit area tends to increase.
Therefore, it has been practiced to fill the hole with IV resin and form another layer thereon to effectively use the area. In this case, in order to satisfactorily form the layer to be laminated, It is necessary to make the buried IVH end surface as flat as possible.

In addition, IVH is filled with a conductive filler containing a metal filler, and a via is formed immediately above. This form is called a so-called stack via and is extremely effective for increasing the density. However, in order to form this stack via well, it is necessary to form the surface of the IVH end portion filled in as flat as possible. .
On the other hand, TH is also filled with a filler containing a metal filler, and a pad for soldering an electronic component is formed immediately above the hole. This form is called a so-called pad-on-via (sometimes referred to as a via-in pad) and is an indispensable form for high-density mounting.
In order to satisfactorily form a pad in this pad-on-via, it is necessary to form the hole-filled TH end surface as flat as possible.
That is, unless the above-described stack vias and pads are formed well, the performance and quality of the printed wiring board cannot be maintained. Therefore, it is desired to form the end surfaces of IVH and TH that are filled in as flat as possible. .
A conventional example of the above-described TH or IVH hole filling method is described in Patent Document 1.
The method described in this document uses a cylindrical roll to fill a hole (TH or IVH) of a substrate with a resin, and in a state where the resin is in an uncured state, the substrate is formed by a squeegee arranged so as to sandwich the substrate. The excess resin on both sides is scraped off.
According to this method, since the resin is scraped off without being cured, it is easy to polish and remove excess resin remaining on the substrate surface after the resin is cured.

Japanese Patent Publication No. 6-32373

  However, this conventional method has a problem that a large amount of excess ink is generated because the amount of ink supplied is larger than that of screen printing.

  In addition, the squeegee has a problem that a part of the ink once filled in the hole is scraped off, and the surface of the hole becomes concave, and the flatness is impaired. If a via or pad is formed directly above the recessed end surface, the adhesion between the end surface and the via or pad becomes insufficient, and peeling occurs due to temperature load or thermal shock load applied to the printed wiring board. There was a problem that the printed wiring board would be defective.

  Moreover, when the density of the holes to be filled differs from part to part, there is a problem that the holes are not filled in a uniform amount, and the holes are overfilled or insufficiently filled.

Further, in the printed wiring board, generally, a reference hole as a reference origin in the case of multilayering is provided in a portion close to the periphery (edge) of the substrate.
If a resin such as a filler adheres to the reference hole, the hole diameter may change, the roundness may be lost, etc., causing errors in position detection and the inability to insert a positioning pin. Arise.
As a result, misalignment between layers occurs when multi-layered, and the characteristic as a printed wiring board does not appear. Therefore, a resin is applied to a predetermined range (hereinafter referred to as an adhesion prohibition area) provided with the reference hole. It must not be attached.
However, due to the scraping operation with the squeegee, the surplus resin is thinly spread to the adhesion-prohibited area, and there is a problem that this resin must be removed.

Further, the ratio (aspect ratio) between the depth DP of the hole to be filled such as IVH and TH and the hole diameter D (aspect ratio): When DP / D is large or the hole diameter D is very small, filling is difficult and insufficient filling. Easy to be.
In order to improve this, the substrate transport speed has been reduced, or the film thickness (amount) of the filler transferred onto the substrate surface by the transfer roll has been increased (increased).
However, if the conveying speed is slowed down, the productivity is lowered, and if the film thickness is increased, bubbles contained in the resin are easily mixed into the pores such as IVH, and voids are formed after the filler is cured. There was a problem that caused poor connection of the wiring board.

  Therefore, the present invention can extremely flatten the filling surface in the resin filling process into the holes of IVH and TH of the printed wiring board resin, and can stably fill the ink regardless of the distribution density of the holes. Provided is a printed wiring board hole filling apparatus capable of producing a printed wiring board with high productivity and reliability, which can be efficiently collected, can prevent interlayer displacement in multi-layering, and a printed wiring board manufacturing method using the same. There is to do.

In order to solve the above problems, the present invention provides the following printed wiring board hole filling apparatus and a printed wiring board manufacturing method using the same.
1) In a printed wiring board hole filling apparatus that performs a hole filling process by filling the through hole of a substrate having a through hole with a filling material, a conveying unit that conveys the substrate at a conveyance speed V in a predetermined conveyance direction; A transfer roller that rotates at a speed Vr, is arranged so that a peripheral surface having a predetermined axial length Lr contacts the surface of the substrate, and transfers and applies the filler adhered to the peripheral surface to the surface of the substrate; A squeegee body formed at a predetermined length L and disposed perpendicular to the transport direction so as to include a contact range of the transfer roller with respect to the substrate to be transported, and the squeegee body at both ends of the squeegee body A pair of guide portions arranged in an orthogonal direction, and is in sliding contact with the surface of the substrate conveyed downstream of the transfer roller in the conveyance direction and applied with the transfer roller. One A first squeegee that scrapes off the first squeegee, and a first squeegee that is disposed downstream of the first squeegee in the transport direction and is in sliding contact with the surface of the substrate, and further scrapes off the filler left scraped by the first squeegee. 2 squeegees, a plurality of pressurizing means arranged on the back side of the substrate in a direction orthogonal to the transport direction and pressing the substrate, and the pressing forces of the plurality of pressurizing means are set independently. Pressing means,
The printed wiring board hole filling, wherein the transport speed V and the peripheral speed Vr are set to V <Vr, and the axial length Lr and the length L are set to Lr <L equipment.
2) The printed wiring board formed by a hole filling process for filling the filling material into the through hole of the substrate having a through hole, 1) Symbol manufacture of printed wiring board produced using the printed circuit board hole filling device mounting A method of applying the filler to the surface of the substrate with the transfer roller and filling the through hole with the filler; and filling the surface of the substrate with the first and second squeegees. producing how the printed wiring board and a step of scraping the wood after the other, and curing the filling material filled in the through hole, the.

According to the present invention, there is an effect that a highly reliable printed wiring board can be manufactured without causing peeling of pads and stack vias.
In addition, the printed circuit board can be produced at low cost by reducing the number of manufacturing steps and man-hours.

It is a figure explaining the Example of the printed wiring board hole-filling apparatus of this invention. It is a figure explaining an example of the printed wiring board manufactured in the Example of this invention. It is a figure explaining the 1st principal part of the Example of the printed wiring board hole-filling apparatus of this invention. It is a figure explaining the 2nd principal part of the Example of the printed wiring board hole-filling apparatus of this invention. It is a figure explaining the effect | action of the 2nd principal part of the Example of this invention. It is a perspective view explaining the 3rd principal part of the Example of this invention, and its effect | action. It is a figure explaining the 4th principal part in the Example of the printed wiring board hole-filling apparatus of this invention. It is a fragmentary sectional view which shows an example of the printed wiring board manufactured by the Example of this invention.

The preferred embodiments of the present invention will be described with reference to FIGS.
FIG. 1 is a diagram for explaining an embodiment of the printed wiring board hole-filling device of the present invention,
FIG. 2 is a diagram illustrating an example of a printed wiring board manufactured in an embodiment of the present invention.
FIG. 3 is a diagram for explaining a first main part of an embodiment of the printed wiring board hole-filling device of the present invention,
FIG. 4 is a diagram for explaining a second main part of the embodiment of the printed wiring board hole-filling device of the present invention,
FIG. 5 is a diagram for explaining the operation of the second main part of the embodiment of the present invention.
FIG. 6 is a perspective view for explaining the third main part of the embodiment of the present invention and its operation,
FIG. 7 is a diagram for explaining a fourth main part in the embodiment of the printed wiring board hole-filling device of the present invention,
FIG. 8 is a partial cross-sectional view showing an example of a printed wiring board manufactured according to the embodiment of the present invention.

The printed wiring board hole filling apparatus of the present invention and a method for producing a printed wiring board using the same will be described.
First, a core substrate 1 (hereinafter referred to as a substrate 1) which is a base of a printed wiring board manufactured in this embodiment will be described with reference to FIG.

The substrate 1 is a rectangular thin plate having a width W, a length L, and a thickness t, and is formed of a known material for a printed wiring board such as glass epoxy.
A plurality of multi-layer matching reference holes 1H are provided on both end sides in the width W direction, and a predetermined range from the both ends to the distance W1 including the reference holes 1H should not be attached with a filler or the like. It is designated as an adhesion prohibition area A.
A portion (application area B) other than the adhesion prohibition area A of the substrate 1 is provided with a predetermined number of IVH2.
In this embodiment, the dimensions are W = 406 mm, L = 340 mm, t = 1.0 mm, W1 = 13 mm.

FIG. 1 is a side view for explaining a printed wiring board hole filling apparatus for filling IVH 2 of substrate 1 with filler 3 and a filling process.
As the filler 3, a commercially available filled paste or ink for filled vias can be used, but is not limited thereto. In order to obtain conductivity, a paste containing a metal filler can be used.

  The hole-filling device 80 includes a filler accommodating portion 6, a transfer roller 5, squeegee devices 7A and 7B, and a substrate conveying means 8. The substrate 1 filled with the filler 3 is arranged in the conveying direction D in FIG. Then, it is conveyed by the conveying means 8.

Further, a pressure roller 10 may be provided on the opposite side of the transfer roller 5 with respect to the substrate 1.
FIG. 1 shows the pressure roller 10, and details thereof will be described later.

The transfer roller 5 is formed in a cylindrical shape having a length Lr (in the depth direction in the drawing) that rotates in the direction of the arrow in the drawing around the shaft 5A, and is disposed so as to contact the lower surface 1b of the substrate 1 being conveyed. ing.
This width Lr is set to be the same as the width of the application area B of the substrate 1, and in this embodiment, Lr = W−W1 × 2 = 380 mm.
The filler supply unit 6 is a container for storing the filler 3, and the transfer roller 5 is disposed so that a part of the transfer roller 5 is immersed in the filler 3 stored in the container.
The two squeegee devices 7A and 7B are each provided with a pair of squeegees arranged so as to face each other so as to sandwich the substrate 1 to be conveyed.

  Here, the squeegees 7A and 7B will be described in detail. In the following description, the squeegee 7A is referred to as a first squeegee, and the squeegee 7B is referred to as a second squeegee.

First, the first squeegee 7A will be described with reference to FIGS.
The first squeegee 7 </ b> A is a squeegee that first scrapes off an excess of the filler transferred by the transfer roll 5, and includes a pair of squeegees that face each other with the substrate 1 interposed therebetween.
The pair of squeegees includes an elastic squeegee main body 7Aa and a squeegee holder 7Ab for holding the squeegee main body 7Aa.

The squeegee main body 7Aa is a rectangular plate-like member made of urethane rubber having a hardness of 90, with a thickness t7 = 10 mm, a width W7 = 50 mm, and a length (depth in the drawing) L7 = 384 mm. Further, the tip portion is arranged so as to be substantially orthogonal to the substrate 1 (attack angle θ1 is about 90 °).
NBR (nitrile butadiene rubber) is also suitable as a material for the squeegee body 7Aa.
The squeegee holder 7Ab is made of aluminum and fixes the squeegee main body 7Aa.

The first squeegee 7A is configured so that the shape of the squeegee tip contacting the substrate 1 is substantially U-shaped. FIG. 4 shows this, and is a view of the first squeegee 7A as viewed from the squeegee body 7Aa side.
That is, the squeegee main body 7Aa, a pair of guide portions 7Ac connected to both ends of the squeegee main body 7Aa in a direction substantially orthogonal thereto, and a squeegee holder 7Ad connected to the squeegee holder 7Ab and holding the guide portion 7Ac. It is equipped with.
Since this guide portion 7Ac mainly regulates the protrusion of the filler 3 toward the adhesion-prohibited area rather than the action of scraping out the filler 3, it is desirable that the guide portion 7Ac is softer than the squeegee body 7Aa.

The depth length L of the squeegee body 7Aa is set to be equal to or slightly larger than the filler application range of the lower surface 1b of the substrate 1.
In this embodiment, it is set to be larger by 2 mm on one side.
The length Lr of the transfer roller 5 is set so that Lr <L.

Next, the second squeegee 7B will be described with reference to FIG. The second squeegee 7B is a squeegee that scrapes off the surplus filler remaining after the first squeegee 7A.
The second squeegee 7B includes an elastic squeegee body 7Ba and a squeegee holder 7Bb for holding the squeegee main body 7Ba.

The squeegee main body 7Ba is a rectangular plate-like member made of urethane rubber having a hardness of 90, with a thickness t7 = 10 mm, a width W7 = 50 mm, and a length (depth in the drawing) L7 = 500 mm. Further, the tip end portion is inclined and tapered so that the attack angle θ2 when it is arranged so as to be orthogonal to the substrate 1 is approximately 45 °.
This attack angle θ2 is preferably set in the range of 30 ° to 80 ° in order to remove the remainder of the filler 3 well and to obtain good flatness of the surface of the filled holes as described later.
NBR is also suitable as a material for the squeegee body 7Ba. The squeegee holder 7Bb is made of aluminum and fixes the squeegee body 7Ba.

Next, the process of filling the filler 3 into the IVH 2 provided on the substrate 1 will be described with reference to FIG. In this figure, IVH2 is omitted.
First, when the transfer roller 5 immersed in the filler accommodating portion 6 rotates, the filler 3 adheres to the surface thereof, and the transfer roller 5 rotates in the direction of the arrow while pressing the substrate 1. 3 is transferred and applied to the application area B of the lower surface 1 b of the substrate 1.
By this transfer coating, the filler 3 is filled in the holes of IVH2.
Then, the substrate 1 is conveyed in the direction D of the arrow while passing between the first squeegee 7A and then between the second squeegees 7B.

In order to press the first and second squeegees 7A and 7B against the substrate 1 to be brought into sliding contact with each other, the pressure applied thereto is performed by applying an air cylinder (not shown) having a cylinder diameter of φ10 mm to the squeegee holders 7Ab and 7Bb. The application pressure is 0.2 Mpa.
This is because if the pressure is as low as about 0.1 Mpa, the surface of the substrate 1 cannot be firmly scratched and a large amount of filler 3 remains, and conversely, if the pressure is as high as about 0.3 Mpa, the squeegee body 7Aa, This is because 7Ba is excessively deformed and an appropriate convex amount (10 μm or less to be described later) on the surface of the filler 3 filled with IVH2 cannot be obtained.

Most of the surplus of the filler 3 transferred to the surface of the substrate 1 is scraped off by the first squeegee 7A, and then surplus residue scraped off by the first squeegee 7A by the second squeegee 7B. Make sure to scrape.
By this two-step scraping, the surplus portion of the filler 3 is reliably scraped off, and the surface of the filler 3 filled in the IVH 2 is not at least recessed with respect to the upper and lower surfaces 1a and 1b of the substrate 1.

  If the surfaces 2a and 2b of the filler 3 filled in IVH2 in this way are not concave and the convex amount d from the upper and lower surfaces 1a and 1b of the substrate 1 is 10 μm or less, this will be performed in a later step. Pads and vias formed immediately above can be formed satisfactorily.

  In the examples, via fill paste AE1125V2 manufactured by Tatsuta System Electronics Co., Ltd. was used as filler 3 (hole filling ink).

By the way, as described above, the first squeegee 7A is pressed and brought into contact with the lower surface 1b of the substrate 1, the substrate 1 is conveyed in the direction D, and the surplus portion of the filler 3 applied by the transfer roller 5 is scraped off. When removed, the filler 3 scraped out by the squeegee body 7Aa is blocked by the pair of guide portions 7Ac and does not protrude to the adhesion prohibition area A side (see FIG. 5).
Therefore, a small amount of filler remaining in the form of a thin film on the surface of the substrate 1 after scraping falls within the depth length L of the squeegee body 7Aa and does not remain in the filler adhesion prohibition area A.
Therefore, since the filling material removal step in the adhesion prohibition area A is not necessary, a printed wiring board can be manufactured at a low cost.

  In FIG. 5, the second squeegee 7B is omitted. However, as described above, most of the excess filler 3 can be removed by the first squeegee 7A. Even if it does not exist, the filler does not adhere to the filler adhesion prohibition area A. Of course, it goes without saying that it may be U-shaped.

Next, collection of ink attached to the squeegee will be described in detail.
When the resin adhering to the squeegee is reattached to the substrate by scraping, there is a problem that stable filling cannot be performed, and polishing for ensuring flatness after curing of the filled resin becomes difficult. In addition, in order to perform filling with a minimum amount of ink without waste, it is preferable to efficiently recover and reuse excess ink.
Moreover, it is important to keep the squeegee itself clean at all times from the viewpoint of maintenance of the apparatus and, consequently, quality improvement.

By the way, the squeegee needs to have an appropriate attack angle in order to exhibit good scraping properties. However, when the tip of the squeegee is formed with such an attack angle, the squeegee adheres to this part. It becomes quite difficult to remove the resin and clean the squeegee.
In that respect, the filling device of the embodiment is provided with a plurality of squeegees, that is, the first and second squeegees 7A and 7B, each having a different attack angle, and a large amount of scraping is carried out to adhere the filler. The easy squeegee 7A has an attack angle of about 90 °, which makes it very easy to remove the adhering filler.
That is, it is possible to obtain an effect that a large amount of the filler can be scraped off and the resin attached to the squeegee can be easily recovered and cleaned.
The attack angle θ1 where this effect is most noticeable is 90 °, but it is good if θ1 = 90 ° ± 10 °.

On the other hand, the second squeegee 7B is formed with an attack angle θ2 of 30 ° to 80 °, but the surplus filler removed by this squeegee is very small and the filler 3 adhering to the squeegee is very small. There is no need to re-collect or clean frequently.
As described above, the filling of the filler 3 into the holes, scraping of the unnecessary filler 3 and the recovery of the filler 3 attached to the squeegee 7Aa can be performed very well.

  Here, the removal (recovery and cleaning) of the filler 3 attached to the first squeegee 7A will be described in detail with reference to FIG.

The filling device 80 of the embodiment includes a wiper 9 that scrapes off the filler adhering to the squeegee 7A on the upstream side of the substrate 1 of the first squeegee 7A.
FIG. 6A shows a process in which the filler 3 on the surface of the substrate 1 conveyed in the direction of arrow D in the figure is scraped off by the first squeegee 7A.
The squeegee body 7Aa is urged so as to sandwich the substrate 1 with the appropriate pressure described above (in the direction of arrow P).
On the other hand, the wiper 9 is disposed at a standby position separated from the squeegee 7A by a wiper holding device (not shown).

FIG. 6B shows a state where the substrate 1 has passed through the squeegee 7A.
In this state, the pair of squeegee main bodies 7Aa and 7Aa are in contact with each other due to the passage of the substrate, and a part of the scraped filler 3 is attached to the surface.

FIG. 6C shows a process in which the wiper 9 moves so as to contact the squeegee 7A, and the filler 3 is removed by sliding the surface of the squeegees 7Aa and 7Aa downward from above.
The wiper 9 moves along the movement path indicated by reference numeral 9a by the operation of the wiper holding device, scrapes the filler 3 from the squeegee main body 7Aa and drops it into the filler accommodating portion 6 disposed below the wiper 9. Thereby, the surplus filler 3 is recovered.
The range in which the wiper 9 moves on the squeegee 7Aa and wipes the resin is desirably the entire surface from one end to the other end of the upper and lower squeegees 7Aa, but only the ink adhered to at least the upper squeegee 7Aa. You may make it scrape.
Thereafter, the wiper 9 returns to the standby position along the movement route indicated by reference numeral 9b.
The filler removal and collection operation by the wiper 9 is set to be performed for each substrate in conjunction with the transport operation of the substrate 1.

By this removal and recovery operation, the filler 3 attached to the first squeegee 7A is reliably recovered and the surface of the squeegee body 7Aa is always kept clean, and the quality of the printed wiring board manufactured by this hole filling device is improved. .
The collection of the filler 3 does not have to be directly collected in the filler container 6 as shown in FIG. 6, but may be collected in another collection container.

Now, the inventor is able to fill the filler very well even for a hole having a large ratio DP / D (aspect ratio) DP / D (aspect ratio) between the depth DP and the diameter D of the hole to be filled. As a result of earnest research on the device, it has been found that this can be realized by making the peripheral speed Vr of the transfer roll 5 faster than the transport speed V of the substrate 1.
From this relationship, it has been found that the filling performance is drastically improved. As a result of further research, by setting this speed ratio Vr / V as 2 ≦ Vr / V ≦ 5, the aspect ratio of the hole and the size of the hole diameter Regardless of this, it has been found that good filling properties can always be obtained.

Table 1 shows the results of evaluating the filling properties with respect to holes having an aspect ratio of 0.8 to 5.0 with the speed ratio Vr / V in the range of 0.6 to 5.4.
This evaluation is
◎: Filling property, productivity, and squeezing property are all good ○: The squeezing property is normal and the other two are good △: The filling property is good, but the other two are inferior ×: Productivity, The squeezing property is good, but the filling property is inferior. As the weighting of the evaluation items, filling property (unfilling or filling without voids) is the first priority item, and productivity and squeezing property are additional items.
This is because the poor fillability is a fatal problem that loses the basic performance as a substrate.
Five-level evaluations ◎, ○, △ can be used as substrates.

この表から、アスペクト比によらず、速度比Ｖｒ／ＶがＶｒ／Ｖで基板の性能が確保され使用可能であり、特に、２．０〜５．０の範囲において、極めて安定し優れた充填性が得られることがわかる。

From this table, regardless of the aspect ratio, the speed ratio Vr / V is Vr / V and the performance of the substrate is ensured and can be used. Especially, in the range of 2.0 to 5.0, extremely stable and excellent filling It can be seen that sex is obtained.

Next, the pressure roller 10 will be described in detail.
FIG. 7 is a view of the position of the transfer roll 5 in FIG. 1 as viewed from the left.
The core substrate 1 is pressed from below by the transfer roll 5 having the rotating shaft 5A, while the opposite side surface of the substrate 1 is pressed from above by the plurality of pressure rollers 10A to 10C. This pressing is performed by cylinders 10A1 to 10C1 respectively connected to the pressure rollers 10A to 10C, and the pressing forces Pa, Pb, and Pc can be set independently for each cylinder.

  1 and 7, the pressure roller 10 is disposed at a position facing the transfer roll 5, but is free in the transport direction D of the substrate 1 and the width direction of the substrate 1 (left and right direction in FIG. 7). Can be placed in position.

According to this configuration, optimal filling corresponding to the distribution density of the holes to be filled can be performed on the substrate 1. Specifically, the pressing force of the pressure roller corresponding to the range where the distribution density of the holes is high is made larger than the pressing force of the other ranges.
As a result, even if the distribution density of the holes is high, the applied pressure is increased accordingly, so that each hole is sufficiently filled, and variation in filling in the substrate surface is suppressed, and a high-quality printed wiring board. Can be manufactured.

FIG. 8 is a cross-sectional view showing an example of a printed wiring board manufactured in the above-described embodiment.
This printed wiring board 90 has IVH2 on the core substrate 92. The filler 3 is appropriately filled in the IVH2 by the apparatus of the embodiment and the method using the same, and then the filler 3 is cured, and the IVH2 is cured. Both end portions 2a and 2b are formed extremely flat.
Therefore, peeling between the stack via 91 and the IVH 2 formed immediately above the IVH 2 does not occur, and the printed wiring board is extremely reliable.

The embodiment of the present invention is not limited to the configuration and procedure described above, and it goes without saying that modifications may be made without departing from the scope of the present invention.
In the above-described embodiment, the through-hole is described as IVH2, but the same can be applied to TH as well.

1 (Core) substrate 1a Upper surface 1b Lower surface 1H Reference hole 2 IVH
2a, 2b Surface (end face)
3 Filler 3a, 3b Excess filler 5 Transfer roller 5A Shaft 6 Filler container 7A, 7B First and second squeegee devices 7Aa, 7Ba Squeegee body 7Ab, 7Bb, 7Ad, 7Bd Squeegee holder 7Ac Guide part 8 Conveying means 9 Wiper 10 Pressure roller 80 Hole filling device 90 Printed wiring board 92 Core substrate A Adhesion prohibition area B Application area D Transport direction L, Lg, Lr Length Pa to Pc Pressure W, W1 Width (distance)
d Convex amount t Thickness θ1, θ2 Attack angle

Claims (2)

In a printed wiring board hole filling apparatus that performs a hole filling process by filling a filler in the through hole of a substrate having a through hole,
Transport means for transporting the substrate in a predetermined transport direction at a transport speed V;
A transfer roller that rotates at a peripheral speed Vr, is arranged so that a peripheral surface having a predetermined axial length Lr abuts on the surface of the substrate, and transfers and applies a filler adhered to the peripheral surface to the surface of the substrate. When,
A squeegee body formed with a predetermined length L and disposed perpendicular to the transport direction so as to include the contact range of the transfer roller with respect to the substrate to be transported, and perpendicular to the squeegee body at both ends of the squeegee body A pair of guide portions that are connected in a direction to be slidably contacted with the surface of the substrate that is transported downstream of the transfer roller in the transport direction and of the filler applied by the transfer roller. A first squeegee that scrapes off a portion;
A second squeegee that is disposed downstream of the first squeegee in the transport direction and is in sliding contact with the surface of the substrate, and further scrapes off the filler left scraped by the first squeegee;
A plurality of pressurizing means for pressing the substrate arranged in a direction orthogonal to the transport direction on the back side of the substrate;
Pressing means for independently setting the pressing forces of the plurality of pressing means;
With
The printed wiring board hole-filling device, wherein the transport speed V and the peripheral speed Vr are V <Vr, and the axial length Lr and the length L are Lr <L. The printed wiring board formed by a hole filling process for filling the filling material into the through hole of the substrate having a through-hole, a manufacturing method of a printed wiring board produced by using the filling printed circuit board holes according to claim 1 Symbol mounting device Because
Applying the filler to the surface of the substrate with the transfer roller and filling the through hole with the filler;
Scraping back and forth the filler on the surface of the substrate with the first and second squeegees;
Curing the filler filled in the through hole. A method for manufacturing a printed wiring board, comprising:

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