JP4839019B2 - Substrate processing system, substrate processing method, program, and storage medium - Google Patents

Description

The present invention relates to a substrate processing system, the substrate processing method, a flop Rogura arm及 beauty storage medium, in particular, a substrate processing system using a closed vessel for storing a substrate of a predetermined number, the substrate processing method, flop Rogura arm及 beauty storage medium About.

  A substrate such as a semiconductor wafer subjected to plasma processing such as film formation or etching needs to be transported in a clean atmosphere in order to prevent dust from adhering to the substrate. Therefore, the conventional substrate processing system is disposed in a room, for example, a clean room, which is maintained in a clean atmosphere by an air cleaner or the like.

  However, in recent years, the miniaturization of the circuit of the semiconductor wafer has progressed drastically, and the required level of cleanliness in the clean room has rapidly increased. For example, the size of dust to be removed has been reduced to about 0.1 μm. However, it has been difficult to increase the cleanliness to the required level in the conventional clean room from the viewpoint of the limit of the capacity of the air cleaner and the cost.

  Therefore, when transporting the substrates, a pod that stores a predetermined number of, for example, 25 substrates and isolates them from the surrounding atmosphere is used. 2. Description of the Related Art A substrate processing system that removes a substrate from a pod and carries it in a plasma processing apparatus while preventing dust from entering is used. This substrate processing system can prevent dust of about 0.1 μm from adhering to the substrate without raising the cleanliness of the clean room to the required level.

  In the substrate processing system described above, a SMIF (Standard of Mechanical Interface) is used as an apparatus for taking out a substrate from a pod. 9A, the SMIF 70 is disposed in front of a cassette chamber (hereinafter referred to as “C / C”) 71 included in a plasma processing apparatus (not shown), and is a box-shaped hermetically communicating with the C / C 71. An enclosure 72 that is a chamber, a pod placement unit 73 disposed on the front surface of the enclosure 72, and a fan filter unit (not shown) that keeps the atmosphere in the enclosure 72 clean (for example, Non-Patent Document 1). reference.).

  The pod placement unit 73 includes an inverted saddle-shaped slide cover 74 that slides upward in the drawing and a pod stand 76 on which the pod 75 is placed. The enclosure 72 places a substrate cassette 77 described later on the pod. It has the conveyance arm 78 conveyed between the part 73 and C / C71.

In the SMIF 70, as shown in FIGS. 9B and 9C, when taking out the substrate from the pod 75, the slide cover 74 slides upward to lift the pod cover 79 from the pod 75, and from the pod 75 to the substrate cassette 77. To separate. At this time, the space formed by the slide cover 74 and the pod stand 76 in which the substrate cassette 77 is retained communicates with the inside of the enclosure 72 via a slide door (not shown) disposed on the front surface of the enclosure 72. It is cleaned by the fan filter unit. Thereafter, the transfer arm 78 carries the substrate cassette 77 on the pod stand 76 into the C / C 71. Further, the substrate cassette 77 in which the plasma-treated substrate is stored is stored in the pod 75 in the reverse order of the above-described procedure, and the pod 75 is placed on the pod stand 76.
"CX-PAL47", [online], Sony Corporation, [searched July 22, 2004], Internet <URL: http://www.sony.co.jp/Products/SC-HP/cx_pal/ vol47 / pdf / cxeye.pdf>

  However, in the substrate processing system described above, an unprocessed substrate is stored in a pod (hereinafter referred to as “processed pod”) 75 in which an operator stores a plasma-processed substrate placed on a pod stand 76. Pod (hereinafter referred to as “unprocessed pod”) 75 must be replaced manually.

  In particular, in order to improve the throughput of the substrate processing, it is necessary to quickly exchange the processed pod 75 and the unprocessed pod 75. Therefore, while the substrate processing system is performing plasma processing on the substrate, the work is performed. Although it is necessary for a person to hold the unprocessed pod 75 and wait on the SMIF 70 side, in recent years, the size of the substrate has increased, and the weight of one pod 75 has increased, which increases the burden on the operator. It was.

  On the other hand, in order not to increase the burden on the worker, when the worker does not stand by on the SMIF 70 side, after the processed pod 75 is placed on the pod stand 76, the worker has a plurality of unprocessed pods 75. Since one unprocessed pod 75 is carried out from a stocker (not shown) in which is stored, and the pod 75 is replaced with a processed pod 75, there is a problem that the substrate processing throughput is significantly reduced.

The purpose of the present invention is to prevent dust from adhering to the substrate without increasing the cleanliness of the clean room to a predetermined level , and smoothly transport the cassette containing the substrate without increasing the burden on the operator , the substrate processing system capable of improving the throughput of the substrate processing substrate processing method to provide a flop Rogura arm及 beauty storage medium.

In order to achieve the above object, a substrate processing system according to claim 1 is a substrate processing apparatus for performing plasma processing on a substrate in a predetermined atmosphere, and a plurality of substrates processed by the substrate processing apparatus or a plurality of processed substrates. a closed container storage device for containing the closed container cassette accommodating the substrate is stored, tightly closed from said Ru is connected to the substrate processing apparatus, a fan filter unit to maintain the internal atmosphere of the sealed chamber clean, and the sealing a is a substrate processing system including through the chamber and the hermetic container storage apparatus, and a substrate loading and unloading apparatus comprising a substrate transport arm, which transports the cassette between the substrate processing apparatus, the sealed container storage apparatus, the mounting table in which the sealed container is placed in order to perform the storage of the cassette into the take-out and the sealed container of the cassette from the sealed container, Storing a first closed container storage means for storing said sealed container for storing the cassette accommodating the substrate whose serial plasma processing has not been performed, the cassette accommodating the substrate on which the plasma treatment has been performed a second closed container storage means for storing said closed container, said closed container, between the first closed container storage means and the mounting table, and, said mounting base and said second closed container storage means possess a closed container transfer means for transferring between the said substrate transport arm has a portal shape, provided with a mounting portion for mounting the cassette in a lower portion, a fulcrum provided in the upper portion The cassette is placed on the mounting portion and transported between the mounting table and the substrate processing apparatus by a pendulum motion centered .

  The substrate processing system according to claim 2 is the substrate processing system according to claim 1, connected to the substrate processing apparatus, connected to the substrate processing apparatus, and a processing content setting device for setting processing contents of the plasma processing. The operation of the substrate processing apparatus is controlled based on the processing content set in the processing content setting apparatus, and the operations of the substrate carry-in / out apparatus and the sealed container storage apparatus are controlled by communication via the substrate processing apparatus. And a control device.

  The substrate processing system according to claim 3 is the substrate processing system according to claim 1 or 2, wherein the sealed container storage device and the substrate carry-in / out device, and the substrate carry-in / out device and the substrate processing device can communicate with each other. Connected and when the closed container storage device notifies the substrate processing apparatus via the substrate carry-in / out device that the closed container has been transferred from the first closed container storage means to the mounting table, The control device enables the substrate processing apparatus to set the processing content of the plasma processing applied to the substrate stored in another sealed container in the treatment content setting device.

The substrate processing method according to claim 4, wherein, in a closed container storage device storing a closed container for storing a cassette accommodating a substrate, is placed on the mounting table said closed container, taken out of the cassette from the sealed container and wherein the cassette is taken out storing step and stores this in the cassette into the closed container, the mounting table of the hermetic container storage apparatus the cassette via a sealed chamber inside is maintained in a clean atmosphere by the fan filter unit and the substrate a cassette conveying step of conveying between the processing device, the substrate taken out from the cassette is carried into the substrate processing apparatus comprising a substrate processing method and a substrate processing step of performing up plasma treatment, the sealed container storage in the apparatus, the sealed containers for storing the cassette accommodating the substrate on which the plasma processing has not been performed A first closed container storage step storing, in the hermetic container storage device, the storing the sealed vessel for storing the cassette accommodating the substrate on which the plasma treatment has been performed by removing from the mounting table and 2 of the sealed container storage step, in the hermetic container storage device, before the sealed container to store the cassette in which the plasma treatment has been stored in said first closed container storage step accommodating the substrate not subjected possess a sealed container transfer step of transferring to the mounting table, in the cassette carrying step, it has a portal shape, provided with a mounting portion for mounting the cassette on the bottom, about a fulcrum provided in the upper portion the cassette carrying arm to carry out a pendulum motion to, benzalkonium be conveyed by placing the cassette on the placement section between the mounting table the substrate processing apparatus The features.

Claim 5, wherein the program is in a closed container storage device storing a closed container for storing a cassette accommodating a substrate, wherein the sealed container was placed on the stage, extraction and the sealing of the cassette from the sealed container a cassette take-out storage step performs storing of the cassette into the vessel, the mounting table and the substrate processing apparatus prior to the hermetic container storage apparatus the cassette via a sealed chamber inside is maintained in a clean atmosphere by the fan filter unit a program for executing a substrate processing method in a computer having a substrate processing step of a cassette conveying step of conveying, the flop plasma process on a substrate taken out from the substrate processing apparatus in the loaded the cassette applied in between, the substrate processing method, in the sealed container storage device, said have plasma treatment is performed And have the sealed container first closed container storage step storing of storing the cassette accommodating the substrate, in the hermetic container storage device for storing the cassette accommodating the substrate on which the plasma treatment has been performed a second closed container storage step storing and removing the closed container from the mounting table, wherein in a sealed container storage device, the said first of said plasma processing stored in a sealed container storage step is not performed It possesses a sealed container transfer step of transferring the sealed container for storing the cassette accommodating the substrate to the mounting table, in the cassette conveying step has a gate-like shape, placing the cassette in the lower The mounting table and the substrate processing apparatus are provided by a cassette transfer arm that includes a mounting portion and performs a pendulum motion around a fulcrum provided at an upper portion. It characterized that you conveyed by placing the cassette on the placement section between.

Storage medium according to claim 6, wherein, in a closed container storage device storing a closed container for storing a cassette accommodating a substrate, is placed on the mounting table said closed container, taken out of the cassette from the sealed container and the a cassette take-out storage step performs storing of the cassette into the sealed container, the mounting table and the substrate processing before the closed container storage apparatus the cassette via a sealed chamber inside is maintained in a clean atmosphere by the fan filter unit storing a cassette conveying step of conveying between the device, the program for executing a substrate processing method in a computer having a substrate processing step of performing up plasma process on a substrate taken out from the cassette is carried into the substrate processing apparatus a computer-readable storage medium, the substrate processing method, the sealed container storage In location, and the sealed container first closed container storage step storing of storing the cassette accommodating the substrate on which the plasma processing has not been performed, in the hermetic container storage apparatus, the plasma processing is performed a second closed container storage step storing and removing the closed container for storing the cassette accommodating the substrate from the mounting table in the hermetic container storage device, stored in the first closed container storage step It was, possess a sealed container transfer step of transferring the sealed container for storing the cassette accommodating the substrate on which the plasma treatment is not subjected to the mounting table, in the cassette conveying step, the gate-shape A cassette carrying part that has a placement part for placing the cassette in the lower part and performs a pendulum motion around a fulcrum provided in the upper part By the arm, it characterized that you conveyed by placing the cassette on the placement section between the mounting table the substrate processing apparatus.

According to the substrate processing system according to claim 1, the substrate processing method according to claim 4, the program according to claim 5, and the storage medium according to claim 6, the atmosphere in which the conveyance of the cassette containing the substrate is kept clean. While the plasma processing is being performed on the substrate stored in the sealed container mounted on the mounting table of the substrate carry-in / out device, the operator is not performing the plasma processing. The sealed container for storing the substrate can be stored in the first sealed container storage means. When the substrate subjected to the plasma treatment is stored in the sealed container and the sealed container is mounted on the mounting table, the sealed container is stored. The container is removed from the mounting table and stored in the second sealed container storage means, and the operator can recover the sealed container stored in the second sealed container storage means. Therefore, dust can be prevented from adhering to the substrate without increasing the cleanliness of the clean room in which the substrate processing system is arranged to a predetermined level, and the throughput of the substrate processing can be improved without increasing the burden on the operator. .

  According to the substrate processing system of claim 2, the control device controls the operation of the substrate processing device based on the set processing content, and the substrate carry-in / out device and the sealed container storage device by communication via the substrate processing device. Therefore, the operation of the entire substrate processing system can be controlled without providing communication means or other control devices.

  According to the substrate processing system of the third aspect, the closed container storage device and the substrate carry-in / out device, and the substrate carry-in / out device and the substrate processing device are connected so as to be communicable with each other. When the substrate processing apparatus is informed via the substrate carry-in / out device that it has been transferred from the one closed container storage means to the mounting table, the control apparatus stores the substrate processing apparatus in another sealed container in the treatment content setting apparatus. Since the processing contents of the plasma processing performed on the substrate to be set can be set, the sealed container in which the substrate is stored is stored in another sealed container while the substrate is subjected to the plasma processing. The processing content of the plasma processing performed on the substrate can be set.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, a substrate processing system and an airtight container storage device according to an embodiment of the present invention will be described.

  FIG. 1 is a diagram showing a schematic configuration of a plasma processing system as a substrate processing system according to the present embodiment.

  In FIG. 1, a plasma processing system 1 is disposed adjacent to a plasma processing apparatus (substrate processing apparatus) 2 for performing plasma processing, for example, etching processing, on a semiconductor wafer W as a substrate, and described later. A semiconductor wafer that has not been subjected to an etching process (hereinafter referred to as “unprocessed semiconductor wafer”) W is taken out from the pod 3 or a semiconductor wafer that has been subjected to an etching process on the pod 3 (hereinafter referred to as “processed semiconductor wafer”). .) SMIF (substrate loading / unloading device) 4 for storing W and a pod (sealed container) that is arranged adjacent to SMIF 4 and stores unprocessed semiconductor wafer W in SMIF 4 (hereinafter referred to as “unprocessed pod”) 3) and a pod for storing the processed semiconductor wafer W from the SMIF 4 (hereinafter referred to as “processed pod”) ) And a pre-loader (closed container storage device) 5 for recovering 3. The pod 3 is a substantially box-shaped hermetic container. The pod 3 has a reverse pod-shaped pod cover and a bottom surface that can be separated from each other. The pod 3 stores a predetermined number, for example, a wafer cassette 7 that contains 25 semiconductor wafers. Thereby, the pod 3 isolates the semiconductor wafer W from the ambient atmosphere. When the pod 3 is separated into the pod cover and the bottom surface, the wafer cassette 7 is placed on the bottom surface.

  The plasma processing apparatus 2 includes a process chamber (hereinafter referred to as “P / C”) 6 as a processing chamber for performing an etching process on the semiconductor wafer W and a cassette chamber (hereinafter referred to as “C / C”) that receives a wafer cassette 7 described later from the SMIF 4. 8) and a transfer chamber (hereinafter referred to as “T / C”) 10 having a transfer arm 9 for transferring the semiconductor wafer W. In this plasma processing apparatus 2, the atmosphere inside P / C6, C / C8, and T / C10 is all cleaned. Although not shown in FIG. 1, the plasma processing apparatus 2 includes four P / C 6, one T / C 10, and two C / C 8.

  For example, the P / C 6 is disposed on the processing chamber 11 formed in a cylindrical shape by a conductive material such as aluminum, an exhaust pipe 14 connected to a lower portion of the processing chamber 11, and a bottom surface in the processing chamber 11. A susceptor 12 as a lower electrode on which the semiconductor wafer W is placed, a high-frequency power source 15 connected to the susceptor 12, and a shower as an upper electrode that is disposed facing the susceptor 12 and is formed in a flat hollow disk shape. A head 13, a supply pipe 17 that is connected to the shower head 13, passes through the center of the upper surface of the processing chamber 11 and communicates with the etching gas supply source 16, and is arranged at equal intervals in the circumferential direction around the entire circumference of the processing chamber 11. A plurality of cylindrical magnets (not shown) formed of permanent magnets.

The processing chamber 11 has an airtight structure and is evacuated by a vacuum pump (not shown) through the exhaust pipe 14 to form a vacuum atmosphere of 1.33 Pa (10 ⁻² Torr) or less, for example.

  The susceptor 12 sucks and holds the semiconductor wafer W by a Coulomb force such as an electrostatic chuck (not shown) attached to the upper surface. In addition, a focus ring 18 for converging plasma to be described later toward the semiconductor wafer W is disposed around the surface of the susceptor 12 on which the semiconductor wafer W is attracted and held. A high frequency voltage of 13.56 MHz is applied to the susceptor 12 from the high frequency power supply 15 during the plasma processing.

  The shower head 13 is grounded and maintains a ground potential during plasma processing. Further, the etching gas supplied from the supply pipe 17 is uniformly ejected into the entire processing chamber 11.

In P / C 6, when performing an etching process on the semiconductor wafer W, the semiconductor wafer W is placed on the susceptor 12 in the processing chamber 11, the inside of the processing chamber 11 is evacuated, and the semiconductor wafer is subjected to the Coulomb force of the electrostatic chuck. W is sucked and held on the susceptor 12. Next, the etching gas from the supply pipe 17 is supplied into the processing chamber 11 through the shower head 13, and the gas pressure of the etching gas is set to, for example, 1.33 Pa (10 ⁻² Torr) or less.

  After that, a high frequency voltage of 13.56 MHz is applied from the high frequency power supply 15 to the susceptor 12, and glow discharge is performed between the susceptor 12 and the shower head 13 via the etching gas to generate plasma from the etching gas. At this time, since electrons in the plasma are much lighter than reactive ions and radicals (active species), the electrons preferentially flow into the susceptor 12, which causes the susceptor 12 to be negatively self-biased, and thus the susceptor 12. A potential difference is generated between the self-bias potential and the plasma potential, and an electric field in the vertical direction is formed between the plasma and the susceptor 12 due to the potential difference.

  Further, a horizontal magnetic field is applied to the processing chamber 11 by an all-cylindrical magnet, and the applied horizontal magnetic field forms an orthogonal electromagnetic field orthogonal to the electric field formed in the vertical direction described above. Due to the action, electrons in the plasma perform a cycloidal motion in the vicinity of the susceptor 12, and active species such as reactive ions in the plasma are further activated to generate plasma by a magnetron that has been densified. The generated plasma etches the surface of the semiconductor wafer W.

  The C / C 8 has a receiving table 19 for receiving a wafer cassette 7 transferred by a wafer cassette transfer arm 27 described later in the SMIF 4. C / C 8 communicates with an enclosure 23 (described later) in SMIF 4, and is further connected to T / C 10 via a gate valve 20. The gate valve 20 is a slide valve. When the gate valve 20 is opened, C / C8 and T / C10 communicate. When the gate valve 20 is closed, communication between C / C8 and T / C10 is cut off. Is done.

  The T / C 10 includes a transfer arm 9 and an exhaust pipe 21 that decompresses the inside of the T / C 10. The transfer arm 9 is a SCARA-type arm, has a plurality of arm members and a pick for holding the semiconductor wafer W, takes out the unprocessed semiconductor wafer W from the wafer cassette 7 placed on the receiving table 19. The processed semiconductor wafer W is transferred to the susceptor 12 and is collected from the susceptor 12 and stored in the wafer cassette 7. When the transfer arm 9 loads and unloads the semiconductor wafer W between the T / C 10 and P / C 6, the exhaust pipe 21 depressurizes the inside of the T / C 10 to a level equivalent to that in the processing chamber 11. When the semiconductor wafer W is loaded / unloaded between T / C 10 and C / C 8, the inside of the T / C 10 is maintained at substantially atmospheric pressure.

  The T / C 10 is connected to the P / C 6 via the gate valve 22. The gate valve 22 is a slide valve. When the gate valve 22 is opened, the T / C 10 and the processing chamber 11 of the P / C 6 communicate with each other. When the gate valve 22 is closed, the T / C 10 and the processing chamber 11 are connected. Is disconnected.

  The SMIF 4 includes an enclosure (sealed chamber) 23 that is a box-like sealed chamber communicating with the C / C 8, a pod mounting portion (substrate take-out storage means) 24 disposed on the front surface of the enclosure 23, A fan filter unit (not shown) for keeping the atmosphere clean.

  The pod mounting unit 24 includes an inverted saddle-shaped slide cover 25 that slides upward in the drawing, and a pod base (mounting base) 26 on which the pod 3 is placed. The enclosure 23 transports the wafer cassette 7. A wafer cassette transfer arm (substrate transfer means) 27 is provided. The wafer cassette transfer arm 27 is a gate-shaped arm, and has a mounting portion on which the wafer cassette 7 is mounted. Further, the wafer cassette transfer arm 27 is capable of pendulum movement around a fulcrum provided at the upper part, and the fulcrum is movable with respect to the enclosure 23 in the vertical direction in the figure. 23 is smoothly transported between the pod placement unit 24 and the C / C 8 via 23.

  In the SMIF 4, when the semiconductor wafer W is taken out from the pod 3, the slide cover 25 slides upward to lift the pod cover from the pod 3 and separate the wafer cassette 7 from the pod 3. At this time, the wafer cassette 7 is held on the pod base 26 together with the bottom surface of the pod 3. When the semiconductor wafer W is stored in the pod 3, the slide cover 25 on which the separated pod cover is placed slides downward to cover the wafer cassette 7 placed on the pod stand 26 and the bottom surface.

  The plasma processing system 1 has two SMIFs 4, and the two SMIFs 4 are arranged corresponding to two C / Cs 8 respectively.

  The spare loader 5 has a table-like unprocessed pod port (first sealed container storage means) 28 for mounting and storing the unprocessed pod 3, and a shelf shape for mounting and storing the processed pod 3. Processed pod port (second hermetically sealed container storage means) 29 and a plate-shaped pod transfer base 30 which is provided upright on the side surface of the auxiliary loader 5 and extends to the upper space of the pod mounting portion 24 in the SMIF 4. With.

  The pod transfer base 30 includes a pod arm (sealed container transfer means) 31 that holds the pod 3 and a pod mounted on the unprocessed pod port 28, the processed pod port 29, or the pod mounting unit 24. The pod arm 31 transports the unprocessed pod 3 from the unprocessed pod port 28 to the pod base 26 along the guide groove 31A, and also transfers the processed pod 3 to the pod. Transfer from the table 26 to the processed pod port 29.

  Since the unprocessed pod port 28 and the processed pod port 29 are exposed to a work environment in which the worker performs work, for example, an atmosphere in a clean room, the worker stockers the unprocessed pod 3 at a desired timing. Can be taken out and stored in the unprocessed pod port 28, and the processed pod 3 stored in the processed pod port 29 can be recovered.

  The plasma processing system 1 has two spare loaders 5, and the two spare loaders 5 are arranged corresponding to the two SMIFs 4, respectively.

  The plasma processing system 1 also includes a system controller, which will be described later with reference to FIG. 4, for controlling the operations of the plasma processing apparatus 2, the SMIF 4, and the auxiliary loader 5.

  Next, a plasma processing method as a substrate processing method according to the present embodiment will be described.

  FIG. 2 is a diagram illustrating a plasma processing method as a substrate processing method according to the present embodiment, and FIGS. 2A to 2F are diagrams illustrating each operation in the plasma processing method.

  First, the operator places the unprocessed pod 3 on the unprocessed pod port 28 (see FIG. 2A), and transfers the pod 3 on which the pod arm 31 is mounted to the pod base 26 for placement. (Airtight container transfer step) (see FIG. 2B). Thereafter, the operator places another unprocessed pod 3 on the unprocessed pod port 28 at a desired timing (see FIG. 2C). The other unprocessed pod 3 placed is stored in the unprocessed pod port 28 until the pod 3 placed on the pod stand 26 is removed (first sealed container storage step).

  Next, the pod placement unit 24 slides the slide cover 25 upward to separate the unprocessed pod 3 into a pod cover and a bottom surface (substrate removal and storage step) (see FIG. 2D). At this time, since the space formed by the slide cover 25 and the pod base 26 is cleaned by the fan filter unit, the bottom surface and the wafer cassette 7 are placed on the pod base 26 in the cleaned atmosphere.

  Next, the wafer cassette transfer arm 27 transfers the wafer cassette 7 to the receiving table 19 in the C / C 8 (substrate transfer step) (see FIGS. 2D and 2E), and the transfer arm 9 is not moved from the wafer cassette 7. The semiconductor wafer W to be processed is taken out for each wafer and loaded into the processing chamber 11 of the P / C 6, and the P / C 6 performs an etching process on the loaded semiconductor wafer W (substrate processing step). When the semiconductor wafer W is etched, the transfer arm 9 collects the semiconductor wafer W from the processing chamber 11 and stores it in the wafer cassette 7. The carry-in / out of the semiconductor wafer W by the transfer arm 9 and the etching process by the P / C 6 are repeated by the number of semiconductor wafers W accommodated in the wafer cassette 7.

  When all the semiconductor wafers W accommodated in the wafer cassette 7 placed on the receiving table 19 are etched, the wafer cassette carrying arm 27 carries the wafer cassette 7 to the pod table 26 and places it thereon. (Substrate carry-in / out step) (see FIGS. 2E and 2D). Then, the slide cover 25 on which the separated pod cover is placed slides downward, and the pod cover is placed on the wafer cassette 7 and the bottom surface placed on the pod base 26 (substrate removal and storage step) (FIG. 2C). reference). Thereby, the wafer cassette 7 is sealed in the pod 3.

  Next, the pod arm 31 removes the processed pod 3 from the pod base 26, and transfers and places the processed pod 3 on the processed pod port 29 (sealed container transfer step) (see FIG. 2F). The placed processed pod 3 is stored in the processed pod port 29 until the operator collects it (second sealed container storage step). Then, the worker collects the processed pod 3 stored at a desired timing.

  Next, the pod arm 31 transfers the other unprocessed pod 3 stored in the unprocessed pod port 28 to the pod base 26 and mounts it (see FIGS. 2A and 2B). Thereafter, the operator places another unprocessed pod 3 on the unprocessed pod port 28 at a desired timing (see FIG. 2C).

  Then, the above processing is repeated until the end of the lot.

  According to the substrate processing system, the closed container storage device, and the substrate processing method according to the present embodiment, the semiconductor wafer W is stored in the pod 3, and the semiconductor wafer W is removed from the pod 3 placed on the pod base 26 of the SMIF 4. After being taken out, it is transported in a cleaned atmosphere and subjected to plasma treatment. Further, the untreated pod 3 placed on the untreated pod port 28 by the operator at a desired timing is untreated pod. The processed pod 3 stored in the port 28 is removed from the pod table 26 and stored in the processed pod port 29, and then the unprocessed pod 3 stored in the unprocessed pod port 28 is transferred to the pod table 26. Since the wafer is transferred, the plasma processing is performed on the semiconductor wafer W stored in the pod 3 placed on the pod base 26 of the SMIF 4. While being applied, the operator can store the unprocessed pod 3 in the unprocessed pod port 28, and the operator can store the processed pod 3 stored in the processed pod port 29 at a desired timing. The pod 3 can be collected. Accordingly, it is possible to prevent the dust from adhering to the semiconductor wafer W without increasing the cleanliness of the work environment where the plasma processing system is disposed, for example, the clean room to a predetermined level, and without increasing the burden on the operator. Throughput can be improved.

  Next, a communication system between the devices in the plasma processing system 1 described above will be described.

  FIG. 3 is a diagram showing a communication system between apparatuses in the plasma processing system of FIG.

  In FIG. 3, in the plasma processing system 1, the spare loader 5 and the SMIF 4, and the SMIF 4 and the plasma processing apparatus 2 are communicably connected to each other via a communication cable or the like. Device) 32 and recipe setting device (processing content setting device) 33 are communicably connected via a communication cable or the like.

  The recipe setting device 33 has a display panel (not shown) for displaying a recipe input GUI (Graphical User Interface) 34 as shown in FIG. The recipe input GUI 34 includes a processing lot input unit 35 that can input an etching processing recipe in the current processing lot, and a reserved lot input unit 36 that can input an etching processing recipe in a subsequent processing lot. The person sets the recipe for the etching process to be executed by the P / C 6 in the recipe input GUI 34.

  The host computer 32 controls the operation of the plasma processing apparatus 2 based on the recipe set through the recipe input GUI 34 in the recipe setting device 33. Further, the operations of the SMIF 4 and the backup loader 5 are also controlled by communication via the plasma processing apparatus 2.

  In the plasma processing system 1, the host computer 32 controls the operation of the plasma processing apparatus 2 and controls the operations of the SMIF 4 and the standby loader 5 through communication via the plasma processing apparatus 2, so that other communication means, for example, There is no need to lay a communication cable or the like that connects the host computer 32 and the SMIF 4 or the spare loader 5 so that they can communicate directly with each other, and when installing, modifying, or maintaining the plasma processing system 1, other computers For example, since it is not necessary to change the setting of a computer (PC 88 in FIG. 4 to be described later) that supervises the entire factory where the plasma processing system 1 is installed, the installation / repair cost of the plasma processing system 1 can be reduced. The maintenance of the plasma processing system 1 can be easily performed.

  Next, the communication system between the devices in the plasma processing system 1 described above will be described more specifically.

  FIG. 4 is a diagram illustrating a schematic configuration of a system controller in the plasma processing system 1.

  4, the system controller includes an EC (Equipment Controller) 89, a plurality of, for example, three MCs (Module Controllers) 90, 91, 92, and a switching hub 93 that connects the EC 89 and each MC. The system controller is connected from the EC 89 via a LAN (Local Area Network) 101 to a PC 88 as a MES (Manufacturing Execution System) that manages the manufacturing process of the entire factory where the plasma processing system 1 is installed. The MES cooperates with the system controller to feed back real-time information relating to processes in the factory to a core business system (not shown) and makes a determination relating to the process in consideration of the load of the entire factory.

  The EC 89 is a central control unit that controls each MC to control the entire operation of the plasma processing system 1. The EC 89 has a CPU, RAM, HDD, etc., and the CPU controls each MC according to a menu of a processing method of the wafer W designated by the user or the like in the recipe setting device 33, that is, a program corresponding to the recipe. By transmitting a signal, the operations of the plasma processing apparatus 2, the SMIF 4, and the spare roller 5 are controlled.

  The switching hub 93 switches the MC as a connection destination of the EC 89 in accordance with a control signal from the EC 89.

  MCs 90, 91, and 92 are control units that control operations of the P / C 6, C / C 8, and T / C 10, the SMIF 4, and the backup loader 5 of the plasma processing apparatus 2. Each MC also has a CPU, RAM, HDD, etc., and transmits a control signal to an end device described later. Note that the system controller included in the plasma processing system 1 in FIG. 1 includes P / C6, C / C8, SMIF4, and T in order to control a plurality of P / C6, C / C8, and SMIF4, and T / C10. Although there are a number of MCs corresponding to the number of / C10, FIG. 4 shows three MCs. The spare loader 5 is connected to the SMIF 4 via a HUB (not shown) and is controlled by the MC that controls the SMIF 4.

  Each MC is connected to each I / O (input / output) module 97, 98, 99 via a GHOST network 95 by a DIST (Distribution) board 96. The GHOST network 95 is a network realized by an LSI called GHOST (General High-Speed Optimum Scalable Transceiver) mounted on an MC board included in the MC. A maximum of 31 I / O modules can be connected to the GHOST network 95. In the GHOST network 95, the MC corresponds to the master and the I / O module corresponds to the slave.

  The I / O module 97 includes a plurality of I / O units 100 connected to each component (hereinafter referred to as “end device”) in one P / C 6, and includes a control signal to each end device and each end device. The output signal from the device is transmitted. For example, each component of the etching gas supply source 16 in the P / C 6 corresponds to the end device connected to the I / O unit 100 in the I / O module 97.

  The I / O modules 98 and 99 have the same configuration as the I / O module 97, and each of the MC 91 and 92 and the I / O modules 98 and 99 corresponding to C / C8, T / C10, and SMIF4. Since the connection relationship is the same as the connection relationship between the MC 90 and the I / O module 97 described above, description thereof will be omitted.

  Each GHOST network 95 is also connected to an I / O board (not shown) that controls input / output of digital signals, analog signals, and serial signals in the I / O unit 100.

  In the plasma processing system 1, when performing the above-described plasma processing, the CPU of the EC 89 performs switching hub 93, MC90 (MC91, 92), GHOST network 95, and I / O module according to a program corresponding to the processing. The plasma processing is executed by transmitting a control signal to a desired end device via the I / O unit 100 in 97 (I / O modules 98 and 99).

  Specifically, the CPU controls the plasma processing system 1 as described above by transmitting control signals to the end devices of P / C6, C / C8, T / C10, and SMIF4.

  In the system controller of FIG. 4, the plurality of end devices are not directly connected to the EC 89, but the I / O unit 100 connected to the plurality of end devices is modularized to form an I / O module. Since the / O module is connected to the EC 89 via the MC and the switching hub 93, the communication system can be simplified.

  Further, the control signal transmitted by the CPU of the EC 89 includes the address of the I / O unit 100 connected to the desired end device and the address of the I / O module including the I / O unit 100. The switching hub 93 refers to the address of the I / O module in the control signal, and the GHOST of the MC refers to the address of the I / O unit 100 in the control signal, so that the switching hub 93 and the MC transmit the control signal to the CPU. It is possible to eliminate the necessity of making the previous inquiry, thereby realizing smooth transmission of the control signal.

  Next, the operation and communication sequence in the plasma processing system 1 described above will be described.

  FIG. 6 is a diagram showing an operation and a communication sequence in the plasma processing system of FIG.

  In FIG. 6, when the operator activates the plasma processing system 1, the plasma processing apparatus 2 inquires the host computer 32 about the recipe for the first lot etching process (hereinafter referred to as “the first lot recipe”) (1), and the host. The computer 32 returns the recipe set in the processing lot input unit 35 in the recipe setting device 33 to the plasma processing device 2 (2).

  Then, when the worker places the unprocessed pod 3 of the first lot on the unprocessed pod port 28 (3) and transfers the pod 3 on which the pod arm 31 is mounted to the pod base 26, the spare loader 5 The SMIF 4 is notified that the transfer (loading) of the pod 3 has been completed (4), and the SMIF 4 which has received the notification notifies the plasma processing apparatus 2 that the pod 3 has already been placed on the pod base 26 (5). ). Here, if the recipe of the first lot can be canceled in the communication after (5), the recipe of the first lot has already been transmitted to the plasma processing apparatus 2 in the communication of (2). Even if the recipe of the first lot is deleted from the processing lot input unit 35 of the input GUI 34, the recipe of the first lot remains in the plasma processing apparatus 2, and the plasma processing apparatus 2 may cause a conflict. Therefore, in the plasma processing system 1, in the communication after (5), the host computer 32 performs control so that the recipe setting apparatus 33 cannot cancel the recipe of the first lot via the plasma processing apparatus 2. Specifically, the processing lot input unit 35 makes it impossible to input a new recipe and erase the set recipe.

  Next, when the pod 3 of the first lot is transferred from the unprocessed pod port 28, the worker places the unprocessed pod 3 of the second lot on the unprocessed pod port 28 (6). The placed pod 3 in the second lot is notified from the SMIF 4 to the spare loader 5 that the removal (unloading) of the processed pod 3 in the first lot, which will be described later, from the pod stand 26 is completed (21). Until unprocessed pod port 28 is stored.

  Next, the host computer 32 starts reservation (queuing) that allows the plasma processing apparatus 2 to input the recipe for the second lot etching process (hereinafter referred to as “the recipe for the second lot”) in the recipe setting apparatus 33. (7), the plasma processing apparatus 2 that has received the notification enables the second lot recipe to be input in the reserved lot input unit 36 in the recipe input GUI 34.

  Then, the plasma processing apparatus 2 requests the SMIF 4 to lock (fix) the pod 3 with respect to the pod base 26 (8), and further requests the loading of the wafer cassette 7 to the C / C 8 (9). Upon receiving these requests, the SMIF 4 takes out the wafer cassette 7 from the pod 3 and loads the wafer cassette 7 into the C / C 8. When the loading of the wafer cassette 7 to C / C 8 is completed, the fact is notified to the plasma processing apparatus 2 (10). The plasma processing apparatus 2 having received the notification starts the etching process for the first lot and reports to that effect to the host computer 32 (11).

  Next, the plasma processing apparatus 2 inquires the host computer 32 about the recipe of the second lot (12), the host computer 32 returns the recipe set in the reserved lot input unit 36 to the plasma processing apparatus 2 (13), and The recipe setting device 33 is notified again of the start of queuing to enable the input of the recipe for the second lot etching process (14).

  Thereafter, when the etching process for the first lot is completed, the plasma processing apparatus 2 reports the fact to the host computer 32 (15), and further requests the SMIF 4 to unload the wafer cassette 7 in the C / C 8 ( 16) The SMIF 4 that has received the request starts unloading the wafer cassette 7 from the C / C 8 to the pod base 26. First, the SMIF 4 informs the plasma processing apparatus 2 to that effect (17). When the unlocking from the pod base 26 of the pod 3 is completed, the fact is notified to the plasma processing apparatus 2 (18, 19).

  Next, the spare loader 5 requests the unloading (transfer) of the first processed pod 3 placed on the pod base 26 to the processed pod port 29 in the SMIF 4 (20), and the pod arm 31 When the unloading is completed, the SMIF 4 notifies that to the auxiliary loader 5 and the plasma processing apparatus 2 (21, 22). Then, the worker collects the processed pod 3 of the first lot placed on the processed pod port 29 and stored (23).

  Thereafter, when the pod arm 31 transports the second unprocessed pod 3 stored in the unprocessed pod port 28 to the pod base 26, the auxiliary loader 5 has completed the transfer (loading) of the pod 3 to the SMIF 4. (24), and the SMIF 4 that has received the notification notifies the plasma processing apparatus 2 that the pod 3 is already placed on the pod base 26 (25). Here, in the communication after (25), the host computer 32 performs control so that the recipe setting apparatus 33 cannot cancel the recipe of the second lot via the plasma processing apparatus 2.

  Next, when the pod 3 of the second lot is transferred from the unprocessed pod port 28, the worker places the unprocessed pod 3 of the third lot on the unprocessed pod port 28 (26). The placed pod 3 in the third lot is notified (38) from the SMIF 4 to the spare loader 5 that the unloading from the pod stand 26 of the processed pod 3 in the second lot described later has been completed. Until the raw pod port 28 is stored.

  Next, the host computer 32 informs the plasma processing apparatus 2 of the start of queuing that allows the recipe setting apparatus 33 to input the recipe for the third lot etching process (27), and receives the received plasma processing. The apparatus 2 makes it possible to input the recipe for the third lot etching process in the reserved lot input unit 36 in the recipe input GUI 34.

  Then, the plasma processing apparatus 2 requests the SMIF 4 to lock the pod 3 with respect to the pod base 26 (28), and further requests the loading of the wafer cassette 7 to the C / C 8 (29). Upon receiving these requests, the SMIF 4 takes out the wafer cassette 7 from the pod 3 and loads the wafer cassette 7 into the C / C 8. When the loading of the wafer cassette 7 to C / C 8 is completed, the fact is notified to the plasma processing apparatus 2 (30). The plasma processing apparatus 2 that has received the communication starts the etching process for the second lot and reports to that effect to the host computer 32 (31).

  Thereafter, when the etching process for the second lot is completed, the plasma processing apparatus 2 reports the fact to the host computer 32 (32), and further requests the SMIF 4 to unload the wafer cassette 7 in the C / C 8 ( 33) The SMIF 4 that has received the request starts unloading from the C / C 8 of the wafer cassette 7 to the pod base 26. First, the SMIF 4 informs the plasma processing apparatus 2 to that effect (34), and further performs the unloading. When the unlocking from the pod base 26 of the pod 3 is completed, the fact is notified to the plasma processing apparatus 2 (35, 36).

  Next, the spare loader 5 requests the unloading of the second processed pod 3 placed on the pod base 26 in the SMIF 4 to the processed pod port 29 (37), and the pod arm 31 performs the unloading. When completed, the SMIF 4 notifies the reserve loader 5 and the plasma processing apparatus 2 accordingly (38, 39). Then, the worker collects the processed pod 3 of the second lot placed and stored in the processed pod port 29 (40).

  Then, after the third lot, the above-described operation and communication are repeated.

  According to the operation and communication sequence of FIG. 6 described above, the reserve loader 5 notifies the plasma processing apparatus 2 via the SMIF 4 that the pod 3 has been transferred from the unprocessed pod port 28 to the pod base 26 (4). 5, 24, 25) and the host computer 32 sends the recipe for the next lot etching process (hereinafter referred to as “recipe for the next lot”) to the plasma processing apparatus 2 in the reserved lot input unit 36 in the recipe setting apparatus 33. This allows the operator to set a recipe for the next lot at a desired timing.

  In the embodiment described above, the number of the unprocessed pod ports 28 and the processed pod ports 29 included in the spare loader 5 is one, but the number of the unprocessed pod ports and the processed pod ports is not limited to this. For example, as shown in FIG. 7, the reserve loader 50 may include two processed pod ports 51 and one unprocessed pod port 28. The degree of freedom of the collection timing can be increased. Further, the spare loader may be provided with a plurality of unprocessed pod ports, thereby increasing the degree of freedom in placing the unprocessed pod 3 by the operator.

  In the above-described embodiment, the plasma processing system 1 includes the plasma processing apparatus 2, the SMIF 4, the spare loader 5, the host computer 32, and the recipe setting apparatus 33. Without being limited thereto, as shown in FIG. 8, the plasma processing system may further include an AGV (Automated Guided Vehicle) 60 that is an autonomous control type transport robot that transports the pod 3. The burden can be further reduced. In this plasma processing system, the operation of the AGV 60 is controlled by the host computer 32. Since the AGV 60 is communicatively connected to the standby loader 5 via optical communication, the backup loader 5, SMIF 4, and plasma processing apparatus are connected. 2, communication with the host computer 32 is possible, and it is not necessary to install new communication means such as a communication cable for communication with the host computer 32.

  In the embodiment described above, the etching process is performed on the semiconductor wafer W, but the plasma process performed on the semiconductor wafer W is not limited to this, and may be a film forming process such as a metal CVD process.

  In the above-described embodiment, the substrate to be processed is a semiconductor wafer. However, the substrate to be processed is not limited to this, and is, for example, a glass substrate such as an LCD (Liquid Crystal Display) or an FPD (Flat Panel Display). May be.

  Another object of the present invention is to supply a computer, for example, the EC 89, a storage medium that records software program codes for realizing the functions of the above-described embodiment, and the computer CPU stores the program in the storage medium. It is also achieved by reading and executing the code.

  In this case, the program code itself read from the storage medium realizes the functions of the above-described embodiment, and the program code and the storage medium storing the program code constitute the present invention.

  Examples of the storage medium for supplying the program code include RAM, NV-RAM, floppy (registered trademark) disk, hard disk, optical disk, magneto-optical disk, CD-ROM, CD-R, CD-RW, and DVD. (DVD-ROM, DVD-RAM, DVD-RW, DVD + RW), magnetic tape, non-volatile memory card, other ROM, etc. may be used as long as they can store the program code. Alternatively, the program code may be supplied to the computer by downloading from another computer or database (not shown) connected to the Internet, a commercial network, a local area network, or the like.

  Further, by executing the program code read by the CPU, not only the functions of the present embodiment are realized, but also an OS (operating system) running on the CPU based on the instruction of the program code. Includes a case where part or all of the actual processing is performed and the above-described functions of the present embodiment are realized by the processing.

 Further, after the program code read from the storage medium is written in a memory provided in a function expansion board inserted into the computer or a function expansion unit connected to the computer, the function expansion is performed based on the instruction of the program code. This includes a case where the CPU or the like provided in the board or the function expansion unit performs part or all of the actual processing, and the above-described functions of the present embodiment are realized by the processing.

  The form of the program code may include an object code, a program code executed by an interpreter, script data supplied to the OS, and the like.

It is a figure which shows schematic structure of the plasma processing system as a substrate processing system which concerns on embodiment of this invention. It is a figure explaining the plasma processing method as a substrate processing method concerning this embodiment, and Drawing 2 (A)-(F) is a figure explaining each operation in a plasma processing method. It is a figure which shows the communication system between apparatuses in the plasma processing system of FIG. It is a figure which shows schematic structure of the system controller in the plasma processing system of FIG. It is a figure which shows the recipe input GUI which the recipe setting apparatus in FIG. 3 has. It is a figure which shows the operation | movement and communication sequence in the plasma processing system of FIG. It is a figure which shows schematic structure of the modification of the plasma processing system of FIG. It is a figure which shows the modification of the communication system between the apparatuses of FIG. FIG. 9A is a diagram showing a schematic configuration of the SMIF used in the conventional substrate processing system, FIG. 9A is a diagram when the pod is placed on the SMIF, and FIG. 9B is a diagram in which the substrate cassette is separated from the pod. FIG. 9C is a diagram when the substrate cassette is transferred to the cassette chamber.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plasma processing system 2 Plasma processing apparatus 3 Pod 4 SMIF
5 Preloader 6 Process chamber 7 Wafer cassette 8 Cassette chamber 9 Transfer arm 10 Transfer chamber 23 Enclosure 24 Pod placement unit 25 Slide cover 26 Pod table 27 Wafer cassette transfer arm 28 Unprocessed pod ports 29 and 51 Processed pod ports 30 Pod Transfer base 31 Pod arm 32 Host computer 33 Recipe setting device 34 Recipe input GUI
35 Processing lot input part 36 Reserved lot input part 60 AGV

Claims (6)

A substrate processing apparatus for performing plasma processing on the substrate in a predetermined atmosphere;
A sealed container storage device for storing a sealed container storing a plurality of substrates to be processed by the substrate processing apparatus or a cassette storing a plurality of processed substrates;
Tight closed from said Ru is connected to the substrate processing apparatus, the fan filter unit to maintain the internal atmosphere to clean the sealed chamber, and said between via the sealed chamber and the sealed container storage apparatus and the substrate processing apparatus the substrate processing system and a substrate loading and unloading apparatus comprising a substrate transport arm, which transports the cassettes,
The sealed container storage device is:
A mounting table on which the hermetic container is placed for taking out the cassette from the hermetic container and storing the cassette in the hermetic container;
First sealed container storage means for storing the sealed container for storing the cassette containing the substrate not subjected to the plasma treatment;
Second sealed container storage means for storing the sealed container storing the cassette containing the substrate subjected to the plasma treatment;
Wherein the sealed container, between the first closed container storage means and the mounting table, and possess a closed container transfer means for transferring between the mounting table and the second closed container storage means,
The substrate transfer arm has a gate shape, includes a mounting portion for mounting the cassette at a lower portion, and the mounting table, the substrate processing apparatus, and the like by a pendulum movement centering on a fulcrum provided at the upper portion. The substrate processing system characterized in that the cassette is placed on the placement section and conveyed between the two. A processing content setting device connected to the substrate processing apparatus for setting the processing content of the plasma processing;
Connected to said substrate processing apparatus, the processing to control the operation of the substrate processing apparatus based on the processing contents set in the content setting device, the substrate loading and unloading device and said sealed by communication via the pre-Symbol substrate processing apparatus The substrate processing system according to claim 1, further comprising a control device that controls an operation of the container storage device. The closed container storage device and the substrate carry-in / out device, and the substrate carry-in / out device and the substrate processing apparatus are connected to be communicable with each other,
When the hermetic container storage device before Symbol sealed container is notifying the substrate processing apparatus through a pre Symbol substrate loading and unloading apparatus that is transferred to the mounting table from the first closed container holding means, wherein the control device 3. The substrate according to claim 1, wherein the substrate processing apparatus is configured to set the processing content of the plasma processing applied to the substrate stored in the other sealed container in the treatment content setting device. Processing system. In an airtight container storage device for storing an airtight container for storing a cassette containing a substrate, the airtight container is placed on a mounting table, the cassette is removed from the airtight container, and the cassette is stored in the airtight container. A cassette removal and storage step to be performed;
A cassette conveying step for conveying the cassette between the mounting table and the substrate processing apparatus of the hermetic container storage device via a hermetic chamber whose interior is maintained in a clean atmosphere by a fan filter unit;
A substrate processing method having a substrate processing step of performing plasma processing on a substrate taken out from the cassette carried into the substrate processing apparatus,
In the sealed container storage device, a first sealed container storage step for storing the sealed container that stores the cassette containing the substrate that has not been subjected to the plasma treatment;
In the sealed container storage device, a second sealed container storage step of removing and storing the sealed container for storing the cassette containing the substrate subjected to the plasma treatment from the mounting table;
In the sealed container storage device, the sealed container for transporting the sealed container storing the cassette storing the substrate not subjected to the plasma treatment, stored in the first sealed container storage step, to the mounting table. A transfer step,
In the cassette carrying step, the mounting table is provided by a cassette carrying arm having a gate shape, having a placing portion for placing the cassette at a lower portion, and performing a pendulum motion around a fulcrum provided at the upper portion. A substrate processing method , wherein the cassette is placed on the mounting portion and transported between the apparatus and the substrate processing apparatus. In a closed container storage device storing a closed container for storing a cassette accommodating a substrate, it is placed on the mounting table the sealed container, the storage of the cassette into the take-out and the sealed container of the cassette from the sealed container A cassette removal and storage step to be performed;
A cassette conveying step of conveying between the mounting table and the substrate processing apparatus prior to the hermetic container storage apparatus the cassette via a sealed chamber inside is maintained in a clean atmosphere by the fan filter unit,
A program for executing a substrate processing method and a substrate processing step of the substrate taken out performing flop plasma processing from the cassette, which is carried into the substrate processing apparatus to the computer,
The substrate processing method includes:
In the sealed container storage device, a first sealed container storage step for storing the sealed container that stores the cassette containing the substrate that has not been subjected to the plasma treatment;
In the hermetic container storage device, a second closed container storage step storing said sealed container for storing the cassette accommodating the substrate on which the plasma treatment has been performed by removing from the mounting table,
In the hermetic container storage device, a sealed container transfer transferring the sealed container to store the cassette in which the plasma treatment has been stored in said first closed container storage step accommodating the substrate not subjected to the loading table and a step to Yes,
In the cassette carrying step, the mounting table is provided by a cassette carrying arm having a gate shape, having a placing portion for placing the cassette at a lower portion, and performing a pendulum motion around a fulcrum provided at the upper portion. program characterized that you conveyed by placing the cassette on the placement section between said substrate processing apparatus. In a closed container storage device storing a closed container for storing a cassette accommodating a substrate, it is placed on the mounting table the sealed container, the storage of the cassette into the take-out and the sealed container of the cassette from the sealed container A cassette removal and storage step to be performed;
A cassette conveying step of conveying between the mounting table and the substrate processing apparatus prior to the hermetic container storage apparatus the cassette via a sealed chamber inside is maintained in a clean atmosphere by the fan filter unit,
A computer-readable storage medium storing a program for executing a substrate processing method in a computer having a substrate processing step of performing up plasma process on a substrate taken out from the cassette is carried into the substrate processing apparatus,
The substrate processing method includes:
In the sealed container storage device, a first sealed container storage step for storing the sealed container that stores the cassette containing the substrate that has not been subjected to the plasma treatment;
In the hermetic container storage device, a second closed container storage step storing said sealed container for storing the cassette accommodating the substrate on which the plasma treatment has been performed by removing from the mounting table,
In the hermetic container storage device, wherein stored in the first closed container storage step, a closed container for transporting the closed container for storing the cassette accommodating the substrate on which the plasma treatment is not subjected to the loading table possess and transfer step,
In the cassette carrying step, the mounting table is provided by a cassette carrying arm having a gate shape, having a placing portion for placing the cassette at a lower portion, and performing a pendulum motion around a fulcrum provided at the upper portion. It said substrate processing storage medium characterized that you conveyed by placing the cassette on the placement section with the device.

Images