JP4843318B2 - Chrome plating material - Google Patents
Chrome plating material Download PDFInfo
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- JP4843318B2 JP4843318B2 JP2006017220A JP2006017220A JP4843318B2 JP 4843318 B2 JP4843318 B2 JP 4843318B2 JP 2006017220 A JP2006017220 A JP 2006017220A JP 2006017220 A JP2006017220 A JP 2006017220A JP 4843318 B2 JP4843318 B2 JP 4843318B2
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- electrochrome
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- 238000007747 plating Methods 0.000 title claims description 186
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims description 81
- 239000000463 material Substances 0.000 title description 10
- 239000011651 chromium Substances 0.000 claims description 74
- 229910052804 chromium Inorganic materials 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000009749 continuous casting Methods 0.000 claims description 8
- 238000002441 X-ray diffraction Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 20
- 239000013078 crystal Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 15
- 238000009713 electroplating Methods 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 12
- 238000005259 measurement Methods 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 11
- 239000011701 zinc Substances 0.000 description 11
- 229910052725 zinc Inorganic materials 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000012935 Averaging Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- -1 mirror-polished Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Continuous Casting (AREA)
Description
本発明は、金属製部材の表面に電気クロムめっき層が設けられているクロムめっき部材に関するものである。 The present invention relates to a chromium plated member in which an electrochrome plated layer is provided on the surface of a metal member.
金属製部材の耐摩耗性を高めるために、金属製部材にクロムめっき処理を施して金属製部材の表面をクロムめっき層で被覆することが行われている。クロムめっきでは、硬質で摩擦係数の小さい皮膜(クロムめっき層)が比較的安価で得られることから金属製部材の保護に多用されている。ところがクロムめっき層の硬度を高くして硬質化すると、耐摩耗性は向上するが、その反面靭性が劣化する。そのため、クロムめっきを施した部材が引張応力を受けたり、熱履歴を受けることによりクロムめっき層が収縮すると、クラックを発生することがある。クロムめっき層にクラックが発生し、このクラックが金属製部材の表面に達すると、腐食原因となる媒体がクロムめっき層の表面からクラック部分を通して侵入し、金属製部材が腐食されて耐食性が劣るという問題があった。 In order to increase the wear resistance of a metal member, the metal member is subjected to a chrome plating process to cover the surface of the metal member with a chrome plating layer. In chromium plating, a hard coating with a small friction coefficient (chromium plating layer) can be obtained at a relatively low cost, so that it is frequently used for protecting metal members. However, when the chromium plating layer is hardened by increasing the hardness, the wear resistance is improved, but the toughness is deteriorated. Therefore, cracks may occur when the chromium plated layer contracts due to the member subjected to chromium plating receiving tensile stress or thermal history. When a crack occurs in the chromium plating layer and the crack reaches the surface of the metal member, the corrosive medium enters from the surface of the chromium plating layer through the crack portion, and the metal member is corroded, resulting in poor corrosion resistance. There was a problem.
そこで熱履歴を受けても耐食性を劣化させないクロムめっき部品として特許文献1の技術が提案されている。この技術では、めっき処理により圧縮残留応力を付与したクロムめっき層を部品の表面に設けることで、200℃程度の熱履歴を受けた場合におけるクラックの発生を防止している。そしてこの文献には、クロムめっき層の結晶子の大きさを9nm以上とすれば、熱履歴を経た後の状態でもクラックが生じないことが開示されており、結晶子の大きさが大きくなりすぎると、クロム層の結晶構造そのものが変化し始めるため、結晶子の上限は16nm未満とすればよいことや、クロム層におけるクラック発生はクロム層の残留応力と結晶子の大きさに依存することが記載されている。 Therefore, the technique of Patent Document 1 has been proposed as a chromium-plated part that does not deteriorate the corrosion resistance even if it receives a thermal history. In this technology, a chromium plating layer to which compressive residual stress is applied by plating is provided on the surface of the component, thereby preventing the occurrence of cracks when a thermal history of about 200 ° C. is received. This document discloses that if the crystallite size of the chromium plating layer is 9 nm or more, cracks do not occur even after the thermal history, and the crystallite size becomes too large. Since the crystal structure itself of the chromium layer itself starts to change, the upper limit of the crystallite may be less than 16 nm, and the occurrence of cracks in the chromium layer may depend on the residual stress of the chromium layer and the size of the crystallite. Are listed.
ところで鋼の連続鋳造用鋳型として現在最も汎用されているのは、CuあるいはCu合金製の鋳型(以下、Cu系鋳型と称することがある)である。こうした鋳型は、熱伝導率が高く、優れた冷却効率が得られる。 By the way, the most widely used mold for continuous casting of steel is a mold made of Cu or a Cu alloy (hereinafter sometimes referred to as a Cu-based mold). Such a mold has a high thermal conductivity and an excellent cooling efficiency can be obtained.
連続鋳造する際には、溶鋼の酸化を防止すると共に、溶鋼あるいは鋳片が鋳型内面と直接接触するのを防止し、更には鋳型内面と凝固殻との間に潤滑性を持たせるため、フラックスが使用されている。しかし鋳型の内表面に形成されるフラックス層の厚みは不均一であるため、溶鋼あるいは鋳片が鋳型内面と直接接触するのを完全に防止できず、鋳型内面が損傷する。 In continuous casting, flux is used to prevent oxidation of the molten steel, to prevent the molten steel or slab from coming into direct contact with the inner surface of the mold, and to provide lubricity between the inner surface of the mold and the solidified shell. Is used. However, since the thickness of the flux layer formed on the inner surface of the mold is not uniform, the molten steel or slab cannot be completely prevented from coming into direct contact with the inner surface of the mold, and the inner surface of the mold is damaged.
また、最近では溶鋼の原料としてスクラップを使用することがあるが、スクラップ中に混入している亜鉛に起因する鋳型内面の溶損も、鋳型寿命短縮の大きな原因になっていることが確認されている。即ち、溶鋼中に亜鉛が混入してくると、これが鋳型のメニスカス部分に凝縮し、溶融亜鉛によってCu系鋳型の内面が侵食されて溶損する。 Recently, scrap is sometimes used as a raw material for molten steel, but it has been confirmed that melting of the inner surface of the mold caused by zinc contained in the scrap is a major cause of shortening the mold life. Yes. That is, when zinc is mixed into the molten steel, it is condensed at the meniscus portion of the mold, and the inner surface of the Cu-based mold is eroded by the molten zinc and melts.
そこで最近ではCu系鋳型の表面に保護皮膜を形成することによって溶損の軽減を図っている。こうした保護皮膜に求められる要求特性としては、鋳型のメニスカス側では溶鋼と接触するため溶鋼の温度に耐える耐熱性(耐クラック性)と耐溶融亜鉛性が求められる。一方、鋳型の出側では凝固殻と接触するため耐摩耗性が求められる。そのため保護皮膜としてクロムめっき膜が好適に設けられている。 Therefore, recently, the melting loss is reduced by forming a protective film on the surface of the Cu-based mold. The required properties required for such a protective coating are required to have heat resistance (crack resistance) and molten zinc resistance that can withstand the temperature of the molten steel because it contacts the molten steel on the meniscus side of the mold. On the other hand, wear resistance is required because it contacts the solidified shell on the exit side of the mold. Therefore, a chromium plating film is suitably provided as a protective film.
しかし連続鋳造用鋳型を使用する際には、高温の溶鋼との接触による急速加熱と、溶鋼を凝固させる際の水冷などによる急速冷却という過酷な熱サイクル(熱履歴)を受けるため、クロムめっき層には大きな引張応力が作用する。そのためクロムめっき層が厳しい熱履歴を受けると、クロムめっき層にクラックが発生して膜の剥離が生じたり、あるいは該クラックを通して溶融亜鉛が侵入して鋳型が腐食されてしまう等の問題が生じる。 However, when a continuous casting mold is used, the chromium plating layer is subjected to severe thermal cycles (thermal history) of rapid heating by contact with high-temperature molten steel and rapid cooling by water cooling when solidifying the molten steel. A large tensile stress acts on. Therefore, when the chrome plating layer receives a severe heat history, cracks occur in the chrome plating layer and the film peels off, or the molten zinc enters through the cracks and the mold is corroded.
なお、300℃レベルの熱履歴を受けてもクラックを発生しないクロム層としては、スパッタ処理で得られたクロム層がある。しかしスパッタ処理で得られたクロム層の硬度はHv250程度の低硬度となるため、耐摩耗性が要求される部材の被覆には適しておらず、またボイド(空隙)ができやすいため、耐溶融亜鉛性にも劣る。更に、スパッタリングするには、金属製部材の形状に制約を受け汎用性がない。また、電気めっきで得られたクロムめっき層と比べると相対的に高価になる。
本発明は、この様な状況に鑑みてなされたものであり、その目的は、300℃以上の厳しい熱履歴を受けてもクラックが発生し難い電気クロムめっき層が設けられたクロムめっき部材を提供する。また、本発明の他の目的は、耐摩耗性にも優れたクロムめっき部材を提供することにある。 The present invention has been made in view of such a situation, and an object of the present invention is to provide a chromium plated member provided with an electrochromic plating layer that is unlikely to crack even when subjected to a severe thermal history of 300 ° C. or higher. To do. Another object of the present invention is to provide a chromium plated member having excellent wear resistance.
300℃以上の厳しい熱履歴を受けてもクラックが発生し難い電気クロムめっき層を設けたクロムめっき部材を提供すべく検討を重ねた。その結果、電気クロムめっき層の結晶子を大きくすると共に、結晶方位を不揃いになるように制御すれば、厳しい熱履歴を受けても熱収縮せず、クラックの発生を防止できることを見出し、本発明を完成した。 Studies were repeated to provide a chromium-plated member provided with an electrochrome-plated layer that is unlikely to crack even under severe heat history of 300 ° C. or higher. As a result, it has been found that if the crystallites of the electrochromic plating layer are enlarged and the crystal orientation is controlled to be uneven, even if a severe thermal history is received, thermal contraction does not occur and cracking can be prevented. Was completed.
即ち、本発明に係るクロムめっき部材とは、金属製部材の表面に電気クロムめっき層が設けられたクロムめっき部材であって、前記電気クロムめっき層における結晶子の平均直径が16.0nm以上であると共に、X線回折法による{211}と{222}のピーク強度比({211}/{222})が0.10以上である点に要旨を有する。 That is, the chromium plating member according to the present invention is a chromium plating member in which an electrochromic plating layer is provided on the surface of a metal member, and the average diameter of crystallites in the electrochromic plating layer is 16.0 nm or more. In addition, the point is that the peak intensity ratio ({211} / {222}) between {211} and {222} by X-ray diffraction is 0.10 or more.
靭性を高めるために前記電気クロムめっき層の硬度は、Hv600以下のものであることが好ましい。450℃の熱履歴を受けた場合におけるクラックの発生を防止するには、前記電気クロムめっき層の膜厚が5μm以上のものであることが好ましい。 In order to increase toughness, the electrochromic plating layer preferably has a hardness of Hv 600 or less. In order to prevent the occurrence of cracks when receiving a thermal history of 450 ° C., the electrochrome plating layer preferably has a thickness of 5 μm or more.
耐摩耗性を一層高めるには、前記電気クロムめっき層の上層に、該電気クロムめっき層よりも硬度が高く、且つ硬度Hv600を超える硬質層を設けたものであることが好ましい。 In order to further improve the wear resistance, it is preferable that a hard layer having a hardness higher than that of the electrochromic plating layer and exceeding a hardness of Hv600 is provided on the electrochromic plating layer.
本発明には、上記クロムめっき部材で構成されている連続鋳造用鋳型も含まれる。 The present invention also includes a continuous casting mold composed of the chrome plated member.
本発明によれば、耐摩耗性を劣化させることなく、300℃以上の厳しい熱履歴を受けてもクラックが発生し難い電気クロムめっき層を設けたクロムめっき部材を提供できる。前記電気クロムめっき層は、厳しい熱履歴を受けてもクラックが発生し難いため、例えば腐食原因となる媒体がクロムめっき層の表面からクラック部分を通して侵入することはなく、部材の腐食を防止できる。上記電気クロムめっき層の上層に、硬質層を設ければ、クロムめっき部材の耐摩耗性を向上させることができる。 ADVANTAGE OF THE INVENTION According to this invention, the chromium plating member which provided the electrochromic plating layer which is hard to generate | occur | produce a crack even if it receives the severe thermal history of 300 degreeC or more, without degrading abrasion resistance can be provided. Since the electrochrome plating layer is unlikely to crack even when subjected to severe thermal history, for example, a medium that causes corrosion does not enter through the crack portion from the surface of the chromium plating layer, and corrosion of the member can be prevented. If a hard layer is provided above the electrochrome plating layer, the wear resistance of the chromium plating member can be improved.
本発明では、電気めっきによってクロムめっき層を形成する。電気めっきを採用することで、スパッタリング処理で得られたクロムめっき層よりも高硬度化でき、耐摩耗性を確保できる。また低コスト化も実現できる。しかし電気めっきで得られたクロムめっき層は、スパッタリング処理で得られたクロム層に比べて硬度が高いため、熱履歴を受けた場合のクラック発生を抑制するのが一般には困難である。熱履歴を受けた場合に電気クロムめっき層にクラックが発生するのは、電気クロムめっき層が収縮するためであり、この収縮は、電気クロムめっき層の結晶粒界に存在する格子欠陥量に影響を受ける。格子欠陥量は結晶粒界が多くなると増加し、熱履歴を受けたときにクラックが発生し易くなる。そこで結晶粒界を少なくすれば、格子欠陥量が減り、熱履歴を受けても熱収縮が抑えられ、電気めっきで得られたクロムめっき層であっても、クラックの発生が防止できる。結晶粒界を少なくするには、結晶子を大きくすればよい。 In the present invention, the chromium plating layer is formed by electroplating. By adopting electroplating, it is possible to make the hardness higher than that of the chromium plating layer obtained by the sputtering process, and to ensure wear resistance. Cost reduction can also be realized. However, since the chromium plating layer obtained by electroplating has a higher hardness than the chromium layer obtained by sputtering, it is generally difficult to suppress the occurrence of cracks when subjected to a thermal history. When the thermal history is applied, cracks occur in the electrochromic plating layer because the electrochromic plating layer shrinks, and this shrinkage affects the amount of lattice defects present at the grain boundaries of the electrochromic plating layer. Receive. The amount of lattice defects increases as the number of crystal grain boundaries increases, and cracks tend to occur when subjected to a thermal history. Therefore, if the number of crystal grain boundaries is reduced, the amount of lattice defects is reduced, thermal shrinkage can be suppressed even when subjected to a thermal history, and the occurrence of cracks can be prevented even in a chromium plating layer obtained by electroplating. In order to reduce the crystal grain boundaries, the crystallites should be enlarged.
ところが結晶子を大きくしても300℃レベル以上の厳しい熱履歴を受けた場合には、クラックが発生することがあった。そこで本発明者らは厳しい熱履歴を受けた場合でもクラックの発生を防止すべく更に検討を重ねた。その結果、クロムめっき層の結晶方位を不揃い方向に制御すればよいことが判明し、具体的には結晶方位を{211}方向と{222}方向にバラつかせればよいことが分かった。 However, even if the crystallites are enlarged, cracks may occur when a severe thermal history of 300 ° C. or higher is received. Therefore, the present inventors have further studied to prevent the occurrence of cracks even when a severe thermal history is received. As a result, it was found that the crystal orientation of the chromium plating layer should be controlled in an uneven direction. Specifically, it was found that the crystal orientation should be varied in the {211} direction and the {222} direction.
従って、本発明に係るクロムめっき部材は、金属製部材の表面に電気クロムめっき層が設けられたクロムめっき部材であって、電気クロムめっき層の結晶子が大きくなっていると共に、電気クロムめっき層の結晶方位が不揃い方向に制御されているものである。 Therefore, the chromium plating member according to the present invention is a chromium plating member in which an electrochromic plating layer is provided on the surface of a metal member, and the crystallites of the electrochromic plating layer are large, and the electrochromic plating layer The crystal orientation is controlled in an uneven direction.
具体的には、結晶子の平均直径が16.0nm以上になっている。結晶子の平均直径が16.0nm未満では、結晶粒界が多くなるため、格子欠陥が増える。その結果、熱履歴を受けたときの収縮が大きくなり、クロムめっき層にクラックが発生しやすくなる。そこで本発明では、結晶子の直径を大きくした。前記平均直径は、好ましくは16.5nm以上であり、より好ましくは17nm以上、特に好ましくは17.5nm以上である。結晶子の平均直径の上限は限定されず、できるだけ大きい方が好ましい。最も理想的には電気クロムめっき層自体が単結晶であればよい。なお、X線回折装置(XRD)にて算出される結晶子の上限は数十μm程度(例えば20〜30μm程度)である。 Specifically, the average diameter of the crystallites is 16.0 nm or more. When the average diameter of the crystallites is less than 16.0 nm, the number of crystal grain boundaries increases, resulting in an increase in lattice defects. As a result, the shrinkage when receiving a thermal history is increased, and cracks are likely to occur in the chromium plating layer. Therefore, in the present invention, the diameter of the crystallite is increased. The average diameter is preferably 16.5 nm or more, more preferably 17 nm or more, and particularly preferably 17.5 nm or more. The upper limit of the average diameter of the crystallite is not limited and is preferably as large as possible. Most ideally, the electrochrome plating layer itself may be a single crystal. The upper limit of the crystallite calculated by the X-ray diffractometer (XRD) is about several tens of μm (for example, about 20 to 30 μm).
なお、結晶子とは、単結晶とみなせる微結晶を意味する。一般に電気めっきで得られる電気クロムめっき層における結晶子の平均直径は、5〜10nm程度である。 The crystallite means a microcrystal that can be regarded as a single crystal. Generally, the average diameter of crystallites in an electrochrome plating layer obtained by electroplating is about 5 to 10 nm.
上記結晶子の直径は、X線回折装置による特性X線Cu−Kαを用い、Cr(222)回折面で行い、回折プロファイルの広がり(積分幅)の測定結果を下記Scherrerの式に算入して求めた。なお、積分幅には、Cauchy関数により補正した値を用いた。Kα線の波長は、1.54Åである。
D=K・λ/βcosθ
式中、Dは結晶子の直径(Å)、Kは定数(1.05)、λは測定X線波長(Å)、βは結晶子の直径による回折線の広がり(積分幅;単位はラジアン)、θは回折線のブラック角、を夫々示している。
The diameter of the crystallite is measured on a Cr (222) diffraction surface using characteristic X-ray Cu-Kα by an X-ray diffractometer, and the measurement result of the spread (integration width) of the diffraction profile is included in the Scherrer equation below. Asked. Note that a value corrected by the Cauchy function was used as the integral width. The wavelength of the Kα ray is 1.54 mm.
D = K · λ / βcos θ
Where D is the crystallite diameter (Å), K is a constant (1.05), λ is the measured X-ray wavelength (Å), β is the broadening of the diffraction line due to the crystallite diameter (integral width; unit is radians) ), Θ represents the black angle of the diffraction line.
結晶子の測定位置は電気クロムめっき層の表面とし、測定箇所は5箇所として測定結果を平均することで平均直径を算出する。 The measurement position of the crystallite is the surface of the electrochrome plating layer, the measurement place is five places, and the average diameter is calculated by averaging the measurement results.
電気クロムめっき層の結晶子を大きくすることは、該電気クロムめっき層のクラック発生を低減するのに有効であるが、それだけでは不十分である。そこで本発明では、上述したように、クロムめっき層の結晶方位を不揃いとなるように制御した。結晶方位の不揃いの程度は、X線回折によって評価できる。即ち、本発明の電気クロムめっき層は、X線回折法(XRD回折)によるピーク強度比({211}/{222})が、0.10以上である。ピーク強度比が0.10未満では、{222}方向への配向度が強くなり過ぎるため、熱履歴を受けると特定の方向に収縮してクラックを生じ易い。特に、熱履歴が300℃以上になると収縮が大きくなり、クラックが生じ易くなる。ピーク強度比は0.2以上であることが好ましく、より好ましくは0.4以上である。特にピーク強度比が0.4以上であれば、400〜500℃以上の熱履歴を受けてもクラックが発生し難くなる。ピーク強度比の上限は特に限定されないが、例えば0.5程度である。 Enlarging the crystallites of the electrochromic plating layer is effective in reducing the occurrence of cracks in the electrochromic plating layer, but it is not sufficient by itself. Therefore, in the present invention, as described above, the chrome plating layer is controlled so that the crystal orientation is not uniform. The degree of crystal orientation irregularity can be evaluated by X-ray diffraction. That is, the electrochromic plating layer of the present invention has a peak intensity ratio ({211} / {222}) by an X-ray diffraction method (XRD diffraction) of 0.10 or more. When the peak intensity ratio is less than 0.10, the degree of orientation in the {222} direction becomes too strong. In particular, when the thermal history is 300 ° C. or higher, shrinkage increases and cracks are likely to occur. The peak intensity ratio is preferably 0.2 or more, more preferably 0.4 or more. In particular, when the peak intensity ratio is 0.4 or more, cracks are hardly generated even when a thermal history of 400 to 500 ° C. or more is received. The upper limit of the peak intensity ratio is not particularly limited, but is about 0.5, for example.
なお、工業用クロムめっき浴として一般に使用されるサージェント浴で成膜した電気クロムめっき層について、X線回折法で上記ピーク強度比を測定すると0.01〜0.1程度であり、{222}方向への配向度が強い。 In addition, about the electrochromic plating layer formed in the Sargent bath generally used as an industrial chromium plating bath, when the said peak intensity ratio is measured with a X ray diffraction method, it is about 0.01-0.1, {222} Strong degree of orientation in the direction.
上記ピーク強度比({211}/{222})は、X線回折装置により特性X線Cu−Kα(Kα線の波長は、1.54Å)を用い、得られたX線回折チャートより{211}と{222}のピーク強度を夫々算出し、これらの比({211}のピーク強度/{222}のピーク強度)から求まる値である。 The peak intensity ratio ({211} / {222}) is determined from {211] from the obtained X-ray diffraction chart using characteristic X-ray Cu-Kα (Kα-ray wavelength is 1.54Å) using an X-ray diffractometer. } And {222} peak intensities are calculated respectively, and the values obtained from these ratios ({211} peak intensity / {222} peak intensity).
上記ピーク強度の測定位置は電気クロムめっき層の表面とし、測定箇所は5箇所として、測定結果を平均することでピーク強度比を算出する。なお、ベースラインは、ピークの無い3点を平均して求めた。 The peak intensity ratio is calculated by averaging the measurement results with the measurement position of the peak intensity being the surface of the electrochrome plating layer and the measurement place being five. The baseline was obtained by averaging three points with no peak.
上記電気クロムめっき層は、金属製部材の表面に少なくとも1層設けられていればよいが、上記要件を満足する電気クロムめっき層を2層以上設けてもよい。例えば2層設ける場合は、金属製部材の表面側に設けるクロムめっき層の結晶子の平均直径を、該クロムめっき層の表面に設ける第二クロムめっき層の結晶子の平均直径と同じとするか、あるいは第二クロムめっき層の結晶子の平均直径よりも大きくすることが好ましい。また、クロムめっき層のピーク強度比を、第二クロムめっき層のピーク強度比と同じとするか、あるいは第二クロムめっき層のピーク強度比よりも大きくすることが好ましい。なお、3層以上設ける場合については2層の場合と同様である。 Although the said electrochromic plating layer should just be provided at least 1 layer on the surface of metal members, you may provide two or more electrochromic plating layers which satisfy the said requirements. For example, when two layers are provided, is the average diameter of the crystallites of the chromium plating layer provided on the surface side of the metal member equal to the average diameter of the crystals of the second chromium plating layer provided on the surface of the chromium plating layer? Or it is preferable to make it larger than the average diameter of the crystallites of the second chromium plating layer. Moreover, it is preferable that the peak intensity ratio of the chromium plating layer is the same as the peak intensity ratio of the second chromium plating layer or is larger than the peak intensity ratio of the second chromium plating layer. The case of providing three or more layers is the same as the case of two layers.
上記電気クロムめっき層の膜厚は特に限定されないが、1〜50μmとすることがよい。膜厚が1μm未満では、電気クロムめっき層に微細なクラックが入ってもめっき層を貫通するため、耐食性を充分に向上させることが難しい。膜厚は、より好ましくは2μm以上、さらに好ましくは5μm以上、特に好ましくは10μm以上である。特に、450℃の熱履歴を受けた場合におけるクラックの発生を防止するには、電気クロムめっき層の膜厚を5μm以上とすることが推奨される。しかし膜厚が50μmを超えると、電気クロムめっき層が厚くなり過ぎて却ってクラックが発生しやすくなり、耐食性が劣化する。膜厚は、より好ましくは45μm以下、さらに好ましくは40μm以下、特に好ましくは35μm以下である。 Although the film thickness of the said electrochromic plating layer is not specifically limited, It is good to set it as 1-50 micrometers. If the film thickness is less than 1 μm, it is difficult to sufficiently improve the corrosion resistance because it penetrates the plated layer even if fine cracks occur in the electrochrome plated layer. The film thickness is more preferably 2 μm or more, further preferably 5 μm or more, and particularly preferably 10 μm or more. In particular, in order to prevent the occurrence of cracks when subjected to a thermal history of 450 ° C., it is recommended that the thickness of the electrochrome plating layer be 5 μm or more. However, if the film thickness exceeds 50 μm, the electrochrome plating layer becomes too thick and cracks are likely to occur, and the corrosion resistance deteriorates. The film thickness is more preferably 45 μm or less, further preferably 40 μm or less, and particularly preferably 35 μm or less.
上記電気クロムめっき層によれば、クラック発生の低減と適当な硬度確保を両立できる。上記電気クロムめっき層の硬度は、例えばHv350以上、好ましくはHv380以上、更に好ましくはHv400以上である。なお、一般の電気クロムめっき層の硬度を測定するとHv900以上であるが、このレベルまで高硬度化し過ぎると上記したように電気クロムめっき層の結晶子の平均直径や結晶方位を制御しても、熱履歴を受けたときにクラックが発生し易くなる。従って電気クロムめっき層の硬度は、例えばHv600以下、より好ましくはHv590以下にすることが推奨される。 According to the electrochrome plating layer, it is possible to achieve both reduction of crack generation and securing of appropriate hardness. The hardness of the electrochrome plating layer is, for example, Hv 350 or higher, preferably Hv 380 or higher, more preferably Hv 400 or higher. In addition, when the hardness of a general electrochrome plating layer is measured, it is Hv 900 or higher, but if the hardness is increased to this level too much, as described above, even if the average diameter and crystal orientation of the crystallites of the electrochrome plating layer are controlled, Cracks are likely to occur when receiving a thermal history. Therefore, it is recommended that the hardness of the electrochrome plating layer is, for example, Hv 600 or less, more preferably Hv 590 or less.
上記電気クロムめっき層の硬度は、電気クロムめっき層の断面をミクロビッカース硬度計で測定すればよい。測定時の荷重は0.49N(50gf)とする。硬度の測定箇所は5箇所とし、測定結果のうち最大値と最小値を除いた3点を平均して硬度を算出する。 The hardness of the electrochrome plating layer may be determined by measuring the cross section of the electrochrome plating layer with a micro Vickers hardness meter. The load during measurement is 0.49 N (50 gf). The hardness is measured at five locations, and the hardness is calculated by averaging three points of the measurement results excluding the maximum and minimum values.
本発明では、上記電気クロムめっき層の表面に、該電気クロムめっき層よりも硬度が高い硬質層を設けることが好ましい。硬質層を設けることで、クロムめっき部材の耐摩耗性を一段と向上させることができる。前記硬質層は、耐摩耗性を確保するために、硬度が上記電気クロムめっき層よりも高く、且つHv600を超えるものであればよい。硬質層の硬度は、より好ましくはHv800以上、更に好ましくはHv900以上である。硬質層の硬度の上限は特に限定されないが、硬度が高すぎると靭性が低くなり過ぎて硬質層の剥離を生じるため、例えばHv1500以下とする。 In this invention, it is preferable to provide the hard layer whose hardness is higher than this electrochromic plating layer on the surface of the said electrochromic plating layer. By providing the hard layer, the wear resistance of the chromium plating member can be further improved. The hard layer only needs to have a hardness higher than that of the electrochrome plating layer and higher than Hv600 in order to ensure wear resistance. The hardness of the hard layer is more preferably Hv800 or higher, and still more preferably Hv900 or higher. The upper limit of the hardness of the hard layer is not particularly limited, but if the hardness is too high, the toughness becomes too low and the hard layer is peeled off.
硬質層の種類は特に限定されず、例えば硬質クロム層や硬質Ni−Pめっき層、CrN層、TiN層などが挙げられる。特に硬質クロム層を設けると、上記電気クロムめっき層との間の密着性が良好になるため好ましい。 The kind of hard layer is not specifically limited, For example, a hard chromium layer, a hard Ni-P plating layer, a CrN layer, a TiN layer etc. are mentioned. In particular, it is preferable to provide a hard chromium layer because the adhesion with the electrochrome plating layer is improved.
硬質クロム層は、結晶子の平均直径が16.0nm以上であると共に、X線回折法による{211}と{222}のピーク強度比({211}/{222})が0.10以上であることが好ましい。結晶子の平均直径と上記ピーク強度比がこれらの範囲を満足すれば、300℃以上の厳しい熱履歴を受けてもクラックが発生し難いからである。 The hard chromium layer has an average diameter of crystallites of 16.0 nm or more and a peak intensity ratio ({211} / {222}) of {211} and {222} by X-ray diffraction method of 0.10 or more. Preferably there is. This is because if the average diameter of the crystallites and the peak intensity ratio satisfy these ranges, cracks hardly occur even when subjected to a severe thermal history of 300 ° C. or higher.
硬質層は、上記電気クロムめっき層の表面に積層して設ければよいが、電気クロムめっき層と硬質層の間に中間層を設けてもよい。 The hard layer may be provided by being laminated on the surface of the electrochrome plating layer, but an intermediate layer may be provided between the electrochrome plating layer and the hard layer.
硬質層の膜厚は特に限定されないが、10〜50μm程度とすればよい。10μm未満では、硬質層を設けても耐摩耗性を充分に高めることができない。しかし50μmを超えると膜厚が大きくなり過ぎてクラックが多量に発生し易い。 Although the film thickness of a hard layer is not specifically limited, What is necessary is just to be about 10-50 micrometers. When the thickness is less than 10 μm, the wear resistance cannot be sufficiently improved even if a hard layer is provided. However, if it exceeds 50 μm, the film thickness becomes too large and a large amount of cracks are likely to occur.
上記電気クロムめっき層の表面に、上記硬質クロム層を積層した場合は、電気クロムめっき層と硬質クロム層の膜厚の合計を100μm以下とすることが好ましい。 When the hard chrome layer is laminated on the surface of the electrochrome plating layer, the total film thickness of the electrochrome plating layer and the hard chromium layer is preferably 100 μm or less.
なお、電気クロムめっき層と硬質クロム層を積層した場合は、断面を顕微鏡で観察すれば、硬質クロム層を設けているかどうか確認できる。顕微鏡としては、光学顕微鏡、走査型電子顕微鏡(SEM)、透過型電子顕微鏡(TEM)のいずれをも用いることができる。また、簡便には、積層部分の硬度を数箇所測定すれば、硬質クロム層を設けているかどうか確認できる。 In addition, when an electrochrome plating layer and a hard chromium layer are laminated | stacked, if the cross section is observed with a microscope, it can be confirmed whether the hard chromium layer is provided. As the microscope, any of an optical microscope, a scanning electron microscope (SEM), and a transmission electron microscope (TEM) can be used. Moreover, simply, if the hardness of a laminated part is measured several places, it can be confirmed whether the hard chromium layer is provided.
上記電気クロムめっき層などの基材となる金属製部材は、特に限定されず、例えば、銅や銅合金、鉄、鋼、アルミニウム、アルミニウム合金、チタン合金、マグネシウム合金などが挙げられる。なお、本発明のクロムめっき部材を連続鋳造用鋳型の素材として用いる場合には、冷却効率を高める観点から、上記基材として銅または銅合金を用いることが好ましい。 The metal member used as a base material such as the electrochrome plating layer is not particularly limited, and examples thereof include copper, copper alloy, iron, steel, aluminum, aluminum alloy, titanium alloy, and magnesium alloy. In addition, when using the chromium plating member of this invention as a raw material of the casting_mold | template for continuous casting, it is preferable to use copper or a copper alloy as said base material from a viewpoint of improving cooling efficiency.
本発明のクロムめっき部材は、溶鋼と接触する鋳型のメニスカス側に用いる素材として好適である。一方、上記電気クロムめっき層の上層に、硬質層として硬質クロム層を設けた部材は、耐摩耗性にも優れているため、凝固殻と接触する鋳型の出側に用いる素材として好ましく用いることができる。 The chromium-plated member of the present invention is suitable as a material used on the meniscus side of a mold that comes into contact with molten steel. On the other hand, a member provided with a hard chromium layer as a hard layer on the upper layer of the electrochromic plating layer is also excellent in wear resistance, so that it is preferably used as a material used on the exit side of the mold in contact with the solidified shell. it can.
本発明に係るクロムめっき部材は、上記要件を満足するものであり、その製法は特に限定されないが、製法の一例を次に説明する。 The chrome-plated member according to the present invention satisfies the above requirements, and its manufacturing method is not particularly limited, but an example of the manufacturing method will be described below.
上記要件を満足するクロムめっき部材は、電気めっき時の浴温を65〜100℃とすると共に、電流密度を50〜500A/dm2として電気めっきすることで得られる。 A chromium plated member satisfying the above requirements is obtained by electroplating with a bath temperature of 65 to 100 ° C. and a current density of 50 to 500 A / dm 2 during electroplating.
浴温を65〜100℃として金属製部材の表面に電気クロムめっき層を設ける。浴温が65℃未満では、結晶子が小さくなり、また電気クロムめっき層が{222}方向への配向度が強いものとなり、結晶方位が不揃いにならない。浴温は、好ましくは70℃以上、より好ましくは75℃以上である。しかし浴温が100℃を超える場合には、オートクレーブ等の内圧制御容器が必要となり、作業性が悪くなるし、コスト高になるため、浴温は100℃以下とする。浴温は、好ましくは95℃以下である。 An electrochrome plating layer is provided on the surface of the metal member at a bath temperature of 65 to 100 ° C. When the bath temperature is less than 65 ° C., the crystallites are small, and the electrochrome plating layer has a strong degree of orientation in the {222} direction, so that the crystal orientation is not uneven. The bath temperature is preferably 70 ° C. or higher, more preferably 75 ° C. or higher. However, when the bath temperature exceeds 100 ° C., an internal pressure control container such as an autoclave is required, and the workability is deteriorated and the cost is increased. The bath temperature is preferably 95 ° C. or lower.
本発明のクロムめっき部材を製造するに当たっては、通常よりも浴温を高めに設定するのであるが、浴温だけを高めても電気クロムめっき層における結晶子の直径と結晶方位の不揃い程度は充分に制御できない。そこで浴温の制御に加えて、電気クロムめっきする際の電流密度を50〜500A/dm2とする。電流密度が50A/dm2未満では、成膜速度が小さく、結晶子の成長が損なわれ、且つCr粒の吸着時に結晶方位を合わせやすいと考えられるため、結晶子が小さくなり、しかも結晶方位も{222}方向に揃ってしまう。また成膜速度が小さいと、膜中に取り込まれる水素量が多くなり、水素の存在により歪みを多く生じると考えられ、その結果、電気クロムめっき層の硬度が高くなりすぎる。更に、成膜速度が小さくなり、コスト高となる。電流密度は、好ましくは100A/dm2以上であり、より好ましくは150A/dm2以上である。しかし電流密度が500A/dm2を超えると、部材の端部や凸部等にめっき不良を生じ、めっき層が剥離することがあるため、電流密度は500A/dm2以下とする。電流密度は、好ましくは450A/dm2以下、より好ましくは400A/dm2以下、特に好ましくは350A/dm2以下とする。 In manufacturing the chromium plating member of the present invention, the bath temperature is set higher than usual, but even if only the bath temperature is increased, the degree of unevenness of the crystallite diameter and crystal orientation in the electrochrome plating layer is sufficient. Cannot be controlled. So the bath in addition to the control of the temperature, the current density at the time of electric chromium plating and 50~500A / dm 2. When the current density is less than 50 A / dm 2 , the film formation rate is low, the growth of crystallites is impaired, and it is considered that the crystal orientation is easily adjusted during the adsorption of Cr grains. They are aligned in the {222} direction. Further, when the film formation rate is low, the amount of hydrogen taken into the film increases, and it is considered that a large amount of distortion occurs due to the presence of hydrogen, and as a result, the hardness of the electrochrome plating layer becomes too high. Furthermore, the film forming speed is reduced, and the cost is increased. The current density is preferably 100 A / dm 2 or more, more preferably 150 A / dm 2 or more. However, if the current density exceeds 500 A / dm 2 , defective plating may occur at the end portions or convex portions of the member, and the plating layer may be peeled off. Therefore, the current density is set to 500 A / dm 2 or less. The current density is preferably 450 A / dm 2 or less, more preferably 400 A / dm 2 or less, and particularly preferably 350 A / dm 2 or less.
上記電気クロムめっきは、パルス電流にてパルス印加電気クロムめっきしてもよい。パルスを印加するとCr粒の吸着時において、水素発生反応が起こる前に、電気が断ち切られると考えられ、膜中に取り込まれる水素量が少なくなって、膜中の歪み量が減少する。こうした結果、熱履歴を受けたときのクラックの発生をより一層防止できる。 The electrochromic plating may be pulsed electrochromic plating with a pulse current. When a pulse is applied, it is considered that electricity is cut off before the hydrogen generation reaction occurs at the time of adsorption of Cr particles, and the amount of hydrogen taken into the film decreases, and the amount of strain in the film decreases. As a result, the occurrence of cracks when receiving a thermal history can be further prevented.
パルス印加電気クロムめっきする場合は、浴温を65〜100℃とすると共に、パルス電流の最大電流密度を50〜500A/dm2とし、更に周波数を100〜1000Hzとする。周波数が100Hz未満では、浴温と最大電流密度を適切に制御しても、結晶子が小さくなると共に、結晶方位の{222}方向への配向が強くなる。また周波数が小さいと、パルスを印加することによる効果が殆ど得られず、成膜速度を低めるだけとなる。周波数は、好ましくは150Hz以上、より好ましくは200Hz以上である。しかし周波数が1000Hzを超えると、結晶子が小さくなり、電気クロムめっき層の硬度が高くなる。周波数は、好ましくは900Hz以下であり、より好ましくは800Hz以下である。なお、最小電流密度は0A/dm2以下(極性が反対となる場合を含む)とすればよい。 When pulsed electrochromic plating is performed, the bath temperature is set to 65 to 100 ° C., the maximum current density of the pulse current is set to 50 to 500 A / dm 2 , and the frequency is set to 100 to 1000 Hz. If the frequency is less than 100 Hz, even if the bath temperature and the maximum current density are appropriately controlled, the crystallites become smaller and the orientation of the crystal orientation in the {222} direction becomes stronger. On the other hand, if the frequency is small, the effect of applying the pulse is hardly obtained, and only the film forming speed is lowered. The frequency is preferably 150 Hz or more, more preferably 200 Hz or more. However, when the frequency exceeds 1000 Hz, the crystallites become small, and the hardness of the electrochrome plating layer becomes high. The frequency is preferably 900 Hz or less, and more preferably 800 Hz or less. The minimum current density may be 0 A / dm 2 or less (including the case where the polarities are opposite).
上記パルス電流の波形は特に限定されないが、電気クロムめっき処理時間に対するめっき成膜されている時間の比率(めっき成膜されている時間/全めっき処理時間)は、0.25〜0.9であることが好ましい。比率が0.25未満では、成膜速度が低すぎるため、所望の膜厚を得るのに時間がかかりすぎる。一方、比率が0.9を超えると水素発生反応を断ち切ることが困難となる。 The pulse current waveform is not particularly limited, but the ratio of the time during which the plating film is formed to the electrochromic plating time (the time during which the plating film is formed / the total plating time) is 0.25 to 0.9. Preferably there is. If the ratio is less than 0.25, the film forming speed is too low, and it takes too much time to obtain a desired film thickness. On the other hand, when the ratio exceeds 0.9, it is difficult to cut off the hydrogen generation reaction.
なお、電気クロムめっきを施す途中で処理条件(例えば、浴温や電流密度、周波数など)を徐々に変化させて硬度に傾斜がつくようにしてもよい。また、電気クロムめっきする際には、撹拌(例えば、空気撹拌や振動等)や不純物のろ過、液循環等を行うことが好ましい。 In addition, the treatment conditions (for example, bath temperature, current density, frequency, etc.) may be gradually changed during electrochromic plating so that the hardness is inclined. In addition, when electrochromic plating is performed, it is preferable to perform stirring (for example, air stirring or vibration), filtration of impurities, liquid circulation, and the like.
電気クロムめっき浴としては、サージェント浴を用いることができる。サージェント浴とは、クロム酸と硫酸を主成分とするめっき浴であり、このめっき浴を用いると、比較的硬質な電気クロムめっき層を工業的に高速で成膜できる。サージェント浴は、めっき液に対して、無水クロム酸を100〜400g/L、三価クロムを1〜20g/L、硫酸を1.0〜5.0g/L含んでいることが好ましい。 As the electrochrome plating bath, a sergeant bath can be used. The Sargent bath is a plating bath containing chromic acid and sulfuric acid as main components, and when this plating bath is used, a relatively hard electrochrome plating layer can be formed industrially at high speed. The Sargent bath preferably contains 100 to 400 g / L of chromic anhydride, 1 to 20 g / L of trivalent chromium, and 1.0 to 5.0 g / L of sulfuric acid with respect to the plating solution.
特に、電気クロムめっき浴中の無水クロム酸は、270〜400g/Lとすることが好ましい。無水クロム酸を270g/L以上に高めることで、電気クロムめっき層の成膜速度を大きくすることができ、適正な膜質の厚めっきを容易に行うことができる。 In particular, the chromic anhydride in the electrochromic plating bath is preferably 270 to 400 g / L. By increasing the chromic anhydride to 270 g / L or more, the deposition rate of the electrochromic plating layer can be increased, and thick plating with an appropriate film quality can be easily performed.
電気クロムめっき浴には、活性剤を添加してもよい。活性剤としては、例えば、有機スルホン酸などが挙げられる。活性剤を添加する場合は、めっき液に対して、有機スルホン酸を5〜10g/L程度添加すればよい。 An activator may be added to the electrochrome plating bath. Examples of the activator include organic sulfonic acid. When the activator is added, about 5 to 10 g / L of organic sulfonic acid may be added to the plating solution.
上記電気クロムめっき層の表面に、該電気クロムめっき層よりも硬度が高い硬質層を設けるときの条件は特に限定されず、公知の方法を採用できる。硬質層として、硬質クロム層を設ける場合は、コスト面を考慮すると電気めっきを採用することが好ましい。電気めっきする際は、クロムめっき浴を2種類用意してもよいし、同じクロムめっき浴を用いて電気めっきの途中で処理条件を変えて成膜してもよい。電気クロムめっき法で同じクロムめっき浴を用いて電気クロムめっき層よりも硬度が大きい硬質クロム層を設けるには、クロムめっき浴としてサージェント浴を用いる場合は、例えば、めっき浴の浴温を下げるか、電気クロムめっき時の電流密度を小さくすればよい。また、パルス電流にてパルス印加電気クロムめっき法によって硬質クロム層を設けるには、例えば、周波数や電気クロムめっき処理時間に対するめっき成膜されている時間の比率(めっき成膜されている時間/全めっき処理時間)を、硬質クロム層の硬度が大きくなるようにめっき浴の組成に応じて制御すればよい。なお、硬質クロム層をスパッタ処理で設けてもよい。 Conditions for providing a hard layer having a hardness higher than that of the electrochrome plating layer on the surface of the electrochrome plating layer are not particularly limited, and a known method can be employed. When a hard chromium layer is provided as the hard layer, it is preferable to employ electroplating in consideration of cost. When electroplating, two types of chromium plating baths may be prepared, or the same chromium plating bath may be used to form a film by changing processing conditions during electroplating. In order to provide a hard chromium layer having a hardness higher than that of the electrochromic plating layer using the same chromium plating bath in the electrochromic plating method, when using a Sargent bath as the chromium plating bath, for example, lowering the bath temperature of the plating bath. The current density during electrochrome plating may be reduced. Further, in order to provide a hard chromium layer by a pulse applied electrochromic plating method with a pulse current, for example, a ratio of a time during which a plating film is formed with respect to a frequency or an electrochromic plating time (a time during which a plating film is formed / total time The plating time) may be controlled according to the composition of the plating bath so that the hardness of the hard chromium layer is increased. Note that a hard chromium layer may be provided by sputtering.
上記電気クロムめっき層の表面に硬質クロム層を設ける場合は、電気クロムめっき層と硬質クロム層の硬度に傾斜がつくように連続成膜してもよい。 When a hard chrome layer is provided on the surface of the electrochrome plating layer, the electrochrome plating layer and the hard chromium layer may be continuously formed so that the hardness is inclined.
以下、本発明を実験例によって更に詳細に説明するが、下記実験例は本発明を限定する性質のものではなく、前・後記の趣旨に適合し得る範囲で適当に変更して実施することも可能であり、それらはいずれも本発明の技術的範囲に含まれる。 Hereinafter, the present invention will be described in more detail with reference to experimental examples, but the following experimental examples are not intended to limit the present invention, and may be implemented with appropriate modifications within a range that can meet the purpose described above and below. These are all possible and are within the scope of the present invention.
実験例1
脱酸して得られたCu製のφ8×100mmの丸棒の表面に、サージェント浴を用いて電気クロムめっきして電気クロムめっき層を形成したものを試験片として用い、下記試験を行った。
Experimental example 1
The following test was performed using as a test piece what formed the electrochromic plating layer by carrying out the electrochromic plating using the Sargent bath on the surface of the round bar made from Cu obtained by deoxidation.
上記サージェント浴の組成は、クロム酸と硫酸を主成分とし、これに活性剤として、めっき液に対して有機スルホン酸を8g/L添加したものを用いた。なお、サージェント浴は、無水クロム酸を300g/L、硫酸を5.0g/L、三価クロムを5g/L含んでいる。 The composition of the Sargent bath used was composed of chromic acid and sulfuric acid as main components and an organic sulfonic acid of 8 g / L added to the plating solution as an activator. The Sargent bath contains 300 g / L of chromic anhydride, 5.0 g / L of sulfuric acid, and 5 g / L of trivalent chromium.
電気クロムめっきは、めっき浴の浴温を表1に示した温度とし、表1に示した電流密度で一定で行った。得られた電気クロムめっき層の厚さは30μmである。 The electrochrome plating was performed at a constant current density shown in Table 1 with the bath temperature of the plating bath shown in Table 1. The thickness of the obtained electrochrome plating layer is 30 μm.
得られた電気クロムめっき層の結晶子の直径とピーク強度比を、X線回折装置(リガク電気社製のX線回折装置「RINT ULTIMA PC(装置名)」)を用いて上述した手順で測定した。測定位置は、試験片の中央部における電気クロムめっき層の表面とし、5箇所測定して平均を求めた。結果を下記表1に併せて示す。 The crystallite diameter and peak intensity ratio of the obtained electrochrome plating layer were measured by the procedure described above using an X-ray diffractometer (X-ray diffractometer “RINT ULTIMA PC (device name)” manufactured by Rigaku Electric Co., Ltd.). did. The measurement position was the surface of the electrochromic plating layer at the center of the test piece, and the average was obtained by measuring five locations. The results are also shown in Table 1 below.
次に、上記試験片の断面における電気クロムめっき層の硬度を測定した。硬度の測定にはミクロビッカース硬度計(株式会社アカシ社製の「Hardness Tester MVK−G2(装置名)」)を用い、荷重は0.49Nとした。硬度の測定箇所は5箇所とし、測定結果のうち最大値と最小値を除いた3点を平均して硬度を算出した。結果を下記表1に示す。 Next, the hardness of the electrochrome plating layer in the cross section of the test piece was measured. For the measurement of hardness, a micro Vickers hardness meter (“Hardness Tester MVK-G2 (device name)” manufactured by Akashi Co., Ltd.) was used, and the load was 0.49N. Hardness was measured at five locations, and the hardness was calculated by averaging three points from the measurement results excluding the maximum and minimum values. The results are shown in Table 1 below.
次に、得られた電気クロムめっき層が熱履歴を受けた場合におけるクラック発生の有無を、溶融亜鉛浸漬試験で評価した。溶融亜鉛浸漬試験は、上記試験片を450℃の溶融亜鉛中に20分間浸漬し、浸漬後における試験片を長さ方向に縦に切断したものを樹脂に埋め込み、鏡面研磨し、Cu基材(丸棒)と電気クロムめっき層との界面を光学顕微鏡を用いて400倍で観察して行った。観察位置は試験片の中央部と端部とし、電気クロムめっき層の表面長さに対して、Cu基材と電気クロムめっき層が密着している部分の長さの割合を算出し、平均したものを皮膜健全率とする。上記電気クロムめっき層を設けた試験片を、450℃の溶融亜鉛中に浸漬することで電気クロムめっき層に熱履歴を与えることができ、このときクラックが発生した電気クロムめっき層については、クラック部分から亜鉛が浸透し、Cu基材の表面に達することで、Cu基材が腐食され、電気クロムめっき層の剥離を発生させるため、皮膜健全率を算出することでクラックの発生度合いを評価できる。皮膜健全率は、60%以上の場合を合格とし、60%未満の場合を不合格とする。 Next, the presence or absence of cracks in the case where the obtained electrochrome plating layer received a thermal history was evaluated by a hot dip immersion test. In the molten zinc immersion test, the test piece was immersed in molten zinc at 450 ° C. for 20 minutes, the test piece after immersion was cut vertically in the length direction, embedded in resin, mirror-polished, and a Cu substrate ( The interface between the round bar) and the electrochrome plating layer was observed at 400 times using an optical microscope. The observation position is the center and end of the test piece, and the ratio of the length of the portion where the Cu base and the electrochromic plating layer are in close contact with each other is calculated and averaged with respect to the surface length of the electrochromic plating layer. The thing is defined as the film soundness rate. The test piece provided with the above-mentioned electrochromic plating layer can be given a thermal history by immersing it in molten zinc at 450 ° C. Since zinc penetrates from the part and reaches the surface of the Cu base, the Cu base is corroded and peeling of the electrochrome plating layer is generated. Therefore, the degree of occurrence of cracks can be evaluated by calculating the film soundness rate. . The film soundness rate is determined to be acceptable when it is 60% or more, and unacceptable when it is less than 60%.
表1から次のように考察できる。No.1〜3は、本発明で規定する要件を満足する例であり、電気クロムめっき層の結晶子サイズとピーク強度比が適切に制御されているため、皮膜健全率が高く、300℃以上の厳しい熱履歴を受けてもクラックの発生を低減できている。一方、No.4〜6は、本発明で規定する要件を満足しない例であり、300℃以上の熱履歴に耐えられず、多くのクラックが発生したため、Cu基材が腐食されている。 From Table 1, it can be considered as follows. No. 1-3 are examples that satisfy the requirements defined in the present invention, and the crystallite size and peak intensity ratio of the electrochromic plating layer are appropriately controlled, so that the film soundness rate is high and severe at 300 ° C. or higher. The occurrence of cracks can be reduced even when subjected to a thermal history. On the other hand, no. Nos. 4 to 6 are examples that do not satisfy the requirements defined in the present invention, and the Cu base material is corroded because it cannot withstand a thermal history of 300 ° C. or higher and many cracks are generated.
実験例2
上記実験例1において、電気クロムめっきの代わりに、パルス印加電気クロムめっきして電気クロムめっき層を形成した。パルス印加電気クロムめっきは、めっき浴の浴温を表2に示した温度とし、表2に示した電流密度を最大電流密度とし、最小電流密度を0A/dm2として行った。電気クロムめっき処理時間に対するめっき成膜されている時間の比率(めっき成膜されている時間/全めっき時間)は、0.5とした。周波数は一定として正弦波を付与して成膜した。得られた電気クロムめっき層の厚さは30μmである。なお、No.15とNo,21については、めっき時間を変えて電気クロムめっき層の厚さを制御し、No.15は3μm、No.21は5μmとした。
Experimental example 2
In Experimental Example 1, instead of electrochromic plating, pulsed electrochromic plating was performed to form an electrochromic plating layer. Pulsing electric chromium plating is a bath temperature of the plating bath to a temperature shown in Table 2, the current density shown in Table 2 the maximum current density, the minimum current density was performed with 0A / dm 2. The ratio of the plating film formation time to the electrochrome plating treatment time (plating film formation time / total plating time) was 0.5. The film was formed by applying a sine wave with a constant frequency. The thickness of the obtained electrochrome plating layer is 30 μm. In addition, No. For No. 15 and No. 21, the plating time was changed to control the thickness of the electrochrome plating layer. 15 is 3 μm. 21 was 5 μm.
得られたパルス印加電気クロムめっき層の結晶子の直径、ピーク強度比、硬度、および皮膜健全率を、上記実験例1と同じ手順で測定した。結果を下記表2に併せて示す。 The crystallite diameter, peak intensity ratio, hardness, and film soundness rate of the obtained pulse applied electrochromic plating layer were measured by the same procedure as in Experimental Example 1. The results are also shown in Table 2 below.
表2から次のように考察できる。No.11〜15は、本発明で規定する要件を満足する例であり、電気クロムめっき層の結晶子サイズとピーク強度比が適切に制御されているため、皮膜健全率が高く、300℃以上の厳しい熱履歴を受けてもクラックの発生を低減できている。一方、No.16〜19は、本発明で規定する要件を満足しない例であり、300℃以上の熱履歴に耐えられず、多くのクラックが発生したため、Cu基材が腐食されている。 It can be considered from Table 2 as follows. No. 11 to 15 are examples satisfying the requirements defined in the present invention, and the crystallite size and the peak intensity ratio of the electrochromic plating layer are appropriately controlled, so that the film soundness rate is high and severe at 300 ° C. or higher. The occurrence of cracks can be reduced even when subjected to a thermal history. On the other hand, no. 16-19 is an example which does not satisfy the requirements prescribed | regulated by this invention, and since it cannot endure the heat history of 300 degreeC or more and many cracks generate | occur | produced, Cu base material is corroded.
No.20とNo.21は参考例である。No.20は、パルス印加電気クロムめっき時の電流密度が本発明で推奨する範囲から外れているために、試験片の中央部における電気クロムめっき層の皮膜健全率は良好であったが、試験片の端部における電気クロムめっき層には剥離が認められた。No.21は、電気クロムめっき層の厚さが薄すぎる例であり、450℃の熱履歴を受けるとクラックの発生を充分に抑えることができず、クラックから亜鉛が浸透してCu基材の耐食性を改善できていない。 No. 20 and no. 21 is a reference example. No. No. 20, because the current density at the time of pulse-applied electrochromic plating is out of the range recommended in the present invention, the film soundness rate of the electrochromic plating layer at the center of the test piece was good. Peeling was observed in the electrochrome plating layer at the end. No. No. 21 is an example in which the thickness of the electrochromic plating layer is too thin. When a thermal history of 450 ° C. is received, the generation of cracks cannot be sufficiently suppressed, and zinc penetrates from the cracks, and the corrosion resistance of the Cu base material is reduced. It has not improved.
実験例3
脱酸して得られたCu製のディスク状試験片(φ44mm×8mm)の表面に、上記実験例1のNo.3または上記実験例2のNo.14に示したのと同じ条件で電気クロムめっき層を形成した後、水洗や乾燥をせず、同じめっき浴中で、該電気クロムめっき層の表面に硬質層を設けた。硬質層としては、上記実験例1のNo.4、上記実験例1のNo.5、または上記実験例2のNo.12に示したのと同じ条件で電気クロムめっき層を設けた。但し、硬質層として上記実験例1のNo.4に示した電気クロムめっき層を設ける場合には、上記実験例1のNo.3または上記実験例2のNo.14に示した電気クロムめっき層を形成した後、浴温を10分かけて50℃まで冷却し、この温度で保持して電気めっきした。浴温を冷却しながら電気めっきしているため、硬質層の硬度には傾斜がついている。
Experimental example 3
On the surface of a Cu disk-shaped test piece (φ44 mm × 8 mm) obtained by deoxidation, No. 1 of Experimental Example 1 was applied. 3 or No. 3 in Experimental Example 2 above. After forming the electrochromic plating layer under the same conditions as shown in FIG. 14, a hard layer was provided on the surface of the electrochromic plating layer in the same plating bath without washing and drying. As the hard layer, No. 1 in Experimental Example 1 was used. 4, No. 1 in Experimental Example 1 above. 5 or No. 5 in Experimental Example 2 above. The electrochrome plating layer was provided under the same conditions as shown in FIG. However, as a hard layer, No. 1 in Experimental Example 1 above. When the electrochrome plating layer shown in FIG. 3 or No. 3 in Experimental Example 2 above. After the electrochrome plating layer shown in FIG. 14 was formed, the bath temperature was cooled to 50 ° C. over 10 minutes, and kept at this temperature for electroplating. Since the electroplating is performed while cooling the bath temperature, the hardness of the hard layer is inclined.
電気クロムめっき層の表面に、硬質層を設けた試験片の耐摩耗性を摺動摩耗試験を行って評価した。摺動摩耗試験は、摺動摩耗試験機としてピンオンディスク型の試験機を用いた。摺動試験条件は、相手ピン材としてAl2O3製のφ5mmの丸棒を用い、摺動速度を1m/秒、荷重を98N(10kgf)、摺動距離を1kmとして乾式で行なった。試験片の摩耗による減少量を測定し、下記基準で耐摩耗性を評価した。結果を下記表3に示す。なお、相手ピン材としてAl2O3製の丸棒を用いたのは、連続鋳造用鋳型と凝固鋳片中のAl2O3介在物が接触して連続鋳造用鋳型の表面が摩耗することが考えられるからである。 The wear resistance of a test piece provided with a hard layer on the surface of the electrochrome plating layer was evaluated by a sliding wear test. In the sliding wear test, a pin-on-disk type tester was used as a sliding wear tester. The sliding test conditions were dry using a round bar of φ5 mm made of Al 2 O 3 as the mating pin material, a sliding speed of 1 m / sec, a load of 98 N (10 kgf), and a sliding distance of 1 km. The amount of decrease due to wear of the test piece was measured, and the wear resistance was evaluated according to the following criteria. The results are shown in Table 3 below. In addition, the Al 2 O 3 round bar was used as the mating pin material because the continuous casting mold and the Al 2 O 3 inclusions in the solidified slab contacted to wear the surface of the continuous casting mold. Because it is possible.
[耐摩耗性の評価基準]
◎:摩耗による試験片の減少量が50mg未満であり、耐摩耗性に特に優れている。
○:摩耗による試験片の減少量が50〜100mgであり、耐摩耗性に優れている。
×:摩耗による試験片の減少量が100mgを超えており、耐摩耗性に劣っている。
[Evaluation criteria for wear resistance]
A: The amount of decrease in the test piece due to wear is less than 50 mg, and the wear resistance is particularly excellent.
A: The amount of decrease in the test piece due to wear is 50 to 100 mg, and the wear resistance is excellent.
X: The amount of decrease in the test piece due to wear exceeds 100 mg, and the wear resistance is poor.
表3から次のように考察できる。No.31〜34は、本発明で規定する要件を満足する例であり、電気クロムめっき層の上層に、該電気クロムめっき層よりも硬度が高く、且つ硬度Hv600を超える硬質層を設けているため、耐摩耗性に優れている。一方、No.35とNo.36は、硬質層の硬度が、電気クロムめっき層の硬度よりも小さいか、電気クロムめっき層の硬度よりも大きいが600Hv以下のため、耐摩耗性に劣っている。 From Table 3, it can be considered as follows. No. 31 to 34 are examples that satisfy the requirements defined in the present invention, and since a hard layer having a hardness higher than that of the electrochromic plating layer and a hardness exceeding Hv600 is provided on the upper layer of the electrochromic plating layer, Excellent wear resistance. On the other hand, no. 35 and No. No. 36 is inferior in wear resistance because the hardness of the hard layer is smaller than the hardness of the electrochromic plating layer or larger than the hardness of the electrochromic plating layer but 600 Hv or less.
Claims (5)
前記電気クロムめっき層における結晶子の平均直径が16.0nm以上であると共に、X線回折法による{211}と{222}のピーク強度比({211}/{222})が0.10以上であることを特徴とするクロムめっき部材。 A chromium plated member provided with an electrochrome plated layer on the surface of a metal member,
The average diameter of the crystallites in the electrochrome plating layer is 16.0 nm or more, and the peak intensity ratio ({211} / {222}) of {211} and {222} by the X-ray diffraction method is 0.10 or more. A chrome-plated member, wherein
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| JP4840109B2 (en) * | 2006-12-06 | 2011-12-21 | マツダ株式会社 | Sliding member and manufacturing method thereof |
| CN101977704B (en) | 2008-03-28 | 2013-03-13 | 新日铁住金株式会社 | Cr-plating treatment method of mandrel, mandrel and method of manufacturing seamless pipe using the mandrel |
| MX2021016036A (en) | 2019-06-26 | 2022-02-03 | Hitachi Astemo Ltd | Cylinder device, metal sliding component and method for producing metal sliding component. |
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