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JP4846194B2 - Transformer - Google Patents
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JP4846194B2 - Transformer - Google Patents

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Publication number
JP4846194B2
JP4846194B2 JP2003193660A JP2003193660A JP4846194B2 JP 4846194 B2 JP4846194 B2 JP 4846194B2 JP 2003193660 A JP2003193660 A JP 2003193660A JP 2003193660 A JP2003193660 A JP 2003193660A JP 4846194 B2 JP4846194 B2 JP 4846194B2
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JP
Japan
Prior art keywords
conductive film
prevention plate
resistance
transition voltage
peripheral surface
Prior art date
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Expired - Fee Related
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JP2003193660A
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Japanese (ja)
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JP2005032821A (en
Inventor
昌弘 浜口
彦一 国井
宜史 池田
達也 樋口
努 宮西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Industrial Products and Systems Corp
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Toshiba Corp
Toshiba Industrial Products Manufacturing Corp
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Priority to JP2003193660A priority Critical patent/JP4846194B2/en
Publication of JP2005032821A publication Critical patent/JP2005032821A/en
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Description

【0001】
【発明の属する技術分野】
本発明は、一方の巻線に雷サージ、パワーエレクトロニクス機器の高周波サージの侵入があっても、巻線間の移行電圧を低減し、他方の巻線に接続する機器をサージから保護する変圧器に関する。
【0002】
【従来技術】
図10は、従来の混触防止板を有する変圧器の巻線を示す。外側巻線(高圧側巻線)101と内側巻線(低圧側巻線)102は、鉄心103の周りに巻回されており、二つの巻線101,102間に混触防止板104が配置されている。混触防止板104は、金属により形成され、アースされている(図10(b)参照)。また、混触防止板104は鉄心103の磁束に対して1ターンを形成し短絡しないように、1ターン防止部105が形成されている。
【0003】
さて、混触防止板104は、絶縁事故において、高圧側巻線101が低圧側巻線102へ接触することを防ぐ、いわゆる混触防止の役割を果たす。高圧側巻線101の絶縁事故時には、混触防止板104が低圧側巻線102より手前にあるので、アークは低圧側巻線102へは届かず、混触防止板104により地絡する。これにより、高圧側巻線101に絶縁事故が発生しても、低圧側巻線102の電位が高圧側巻線101の電位になるような事故の拡大が防止できる。
【0004】
さて、近年パワーエレクトニクス機器の適用は拡大して来ている。電源においては、変換器、UPS(Uninterruptible Power Supply)などが用いられ、モータドライブとしては、インバータなどが用いられている。ところで、パワーエレクトロニクス機器の主回路を形成するのはIGBT(Insulated Gate Bipolar Transistor)を代表とした半導体スイッチング素子である。半導体スイッチング素子は、過電圧に対して耐力が少ない。これは、スイッチング素子のジャンクション部の電圧耐量が少ないことに起因し、半導体スイッチング素子を使用する上では、十分考慮が必要である。雷サージなどサージが侵入する場合は、半導体スイッチング素子の電圧耐量以下にサージを減衰させる必要がある。
【0005】
サージの侵入先(この場合は高圧側とする)とパワーエレクトロニクス機器(この場合は低圧側とする)間に変圧器がある場合、変圧器に混触防止板104があると高圧側巻線101を金属でシールドするので、低圧側巻線102にはサージのコモンモードはほとんど移行しない。ノーマルモードについてもサージの周波数が高周波であるので、鉄心103へは鉄心外と同じ程度しか磁束が流れず、高圧側巻線101と低圧側巻線間102の結合が弱く、ノーマルモードサージの低圧側への移行は極めて小さくなる。
【0006】
このように、変圧器に混触防止板104があるとパワーエレクトロニクス機器に対して過電圧となるようなサージの移行を極端に小さくでき、信頼性を確保できる。
【0007】
さて、近年パワーエレクトロニクス機器のスイッチング動作により発生する高周波サージが、電源ラインに伝播し、計器の誤作動など種々の不具合を発生することがあり、ノイズカット装置などを追加するなどして対策している。
【0008】
これに対して影響を受ける機器との間に、変圧器が存在する場合、混触防止板104を設置することにより、影響を受ける機器への高周波サージの伝播を大きく低減できる。上述のサージとパワーエレクトロニクス機器より生じる高周波サージは、数10kHzから数MHzの周波数であるので、同じ原理でサージの移行を大きく低減できる。
【0009】
ところで、パワーエレクトロニクス機器からは、多くの高調波電流と高周波電流が発生する。これらの電流が低圧側巻線102に流れ、それにより、高調波及び高周波磁束が発生し、これらが大きいと、混触防止板104は、金属からなるので大きな電流が流れ、過熱することがある。図10の巻線においてスタック方向に巻線を分割すると、磁束の鉄心半径方向成分が大きくなり、これにより、混触防止板104の電流が更に大きくなり、混触防止板104をより過熱しやすくなる。
【0010】
【発明が解決しようとする課題】
混触防止板104の過熱に対する対策として、混触防止板104の周りの絶縁物を高耐熱性のものとしたり、また、冷却性を強化するため冷却スペースを大きく確保するなどしているため、変圧器が大きくなってしまう欠点があった。
【0011】
本発明は上記事情に鑑みなされたもので、その目的は、サージの移行を抑制しつつ、コンパクトで、製作性の良い変圧器を提供することにある。
【0012】
【課題を解決するための手段】
請求項1記載の変圧器は、絶縁筒の周面にカーボンパウダーが充填された樹脂を塗布もしくは吹き付けることにより固有抵抗値0.01〜100Ω・mでかつ膜厚10〜100μmである抵抗導電膜を施して形成された移行電圧防止板を、巻線間に配置し、この移行電圧防止板の抵抗導電膜を接地して構成され、前記移行電圧防止板の前記抵抗導電膜は、前記絶縁筒の外周面もしくは内周面に、周方向の両端部に隙間を有して形成され、更に、前記絶縁筒の内周面もしくは外周面に、前記隙間を補完するように形成されて、前記絶縁筒の外周面及び内周面においてオーバーラップ部が形成されていることを特徴とする。
このような構成によれば、移行電圧防止板の抵抗導電膜は、抵抗分を有しているので、渦電流が流れることを極力抑制するようになり、従って、耐熱性および冷却性についてそれほど考慮する必要がなくなって、コンパクトで、かつ、製作性を良くすることができる。
そして、移行電圧防止板は、絶縁筒の周面にカーボンパウダーが充填された樹脂を塗布もしくは吹き付けることにより形成されるので、工作性が良く、信頼性のある抵抗導電膜が得られる。
更に、抵抗導電膜の製作性を良好とし、鉄心の商用周波磁束に対して高抵抗ながら短絡することをなくすので、抵抗導電膜による損失を低減できる。
【0019】
【発明の実施の形態】
(第1の実施例)
以下、本発明の第1の実施例について、図1ないし図5を参照しながら説明する。
図1に示すように、外側巻線1と内側巻線2とが、鉄心3の周りに巻回されており、二つの円筒状の巻線1,2の間には、抵抗導電体である移行電圧防止板4が挿入されている。外側巻線1は、一般的に高圧側巻線であり、電源系統からサージの侵入がある。内側巻線2は、一般的に低圧側巻線であり、パワーエレクトロニクス機器のサージの侵入がある。移行電圧防止板4は、図2のように、絶縁筒5の外周全域に抵抗導電膜6を塗布または吹きつけするなどして形成され、抵抗導電膜6は接地されている(図1(b)参照)。この場合、絶縁筒5は、樹脂で円筒状に一体形成されたものでもよく、或いは、プレスボードを円筒状に曲成されたものでもよい。
【0020】
抵抗導電膜6を製作する方法としては、金属粒子を樹脂に充填する方法など種々ある。しかしながら、その中で、変圧器に適用するためには、広い面積を効率よく製作することが求められ、絶縁物の変形に際しても割れない柔軟性をもち、また、高い信頼性が要求される。この実施例では、図3に示すように、微細なカーボンパウダー7を樹脂である例えばエポキシ樹脂8に充填、すなわち、均一に分散するようによく混ぜ合わせる。混ぜ合わせた液を塗布または吹き付けなどにより絶縁筒5に付着させ、乾燥させて抵抗導電膜6が構成される。
【0021】
カーボンパウダー7は、一部が接触し、一部が離れた状態で存在する、しかし、混ぜ合わせが十分であると規定の固有抵抗値が得られる。この電気伝導のメカニズムは、カーボンパウダー7の接触の電気伝導とカーボンパウダー7間にエキシポ樹脂8があると樹脂層が極めて薄く、トンネル効果により電気伝導を生じさせ、その存在確率で固有抵抗値が決まると考えられている。
【0022】
この抵抗導電膜6は、発明者の実験により、高温の寿命試験においても規定の抵抗値を保ち、剥がれなどを生じることがなく、高い信頼性をもつことが確認されている。
【0023】
以下、本実施例の作用・効果について説明する。
ノーマルモードのサージが外側巻線1に印加される場合の概念的な集中定数の等価回路を図4に示めす。外側巻線1と移行電圧防止板4間の静電容量をCs、移行電圧防止板4と内側巻線2間の静電容量をCu、内側巻線2の対地間静電容量をCe、移行電圧防止板4の対アース抵抗をRとする。実際には、これらの諸量は分布定数として扱わなければならないが、説明を簡単にするために集中回路として扱う。
【0024】
移行電圧防止板4がない場合は、サージの高周波成分に対してCs,Cu,Ceの各静電容量で決まるCeの分担電圧が、移行電圧となる。一方、移行電圧防止板4がある場合は、Rにより中段でサージ電流をアースにバイパスすることにより移行電圧防止板4上の分担電圧が、大きく低減される。このため、移行電圧が大幅に低減できる。
【0025】
次に、移行電圧防止板4の商用周波の磁束に対する振る舞いを考えてみる。上述のようにパワーエレクトロニクス機器の発生する高調波、高周波電流は、場合により、鉄心3の半径方向の磁束も生じさせる。この磁束が移行電圧防止板4を貫通することにより、渦電流が磁束と鎖交するように流れる。しかし、この渦電流は、移行電圧防止板4が抵抗分を有するので、極めて小さくなる。従って、この高調波による損失もほとんどない。
【0026】
このため、抵抗導電体である移行電圧防止板4は、従来の混防止板104を用いた場合の様な発熱はなく、移行電圧防止板4の周辺に耐熱性の絶縁物を用いる必要がなく、冷却を強化するため冷却スペースを大きく確保するといった必要がなくなり、コンパクトで、製作性の良い変圧器が得られる。
【0027】
しかして、移行電圧防止板4の構成としては、スペースを小さくするため、絶縁物上に抵抗導電膜を形成することが望ましい。そして、移行電圧防止板4に確実な抵抗値を得るための抵抗導電膜6の膜厚は、発明者の実験では、10μm以上必要であり、また、剥がれや割れを発生させない上限の値としては、100μmであることが分かった。このように、信頼性の面から抵抗導電膜6の膜厚は、10〜100μmの範囲であることが必要である。
【0028】
一方、この範囲の膜厚において、抵抗導電膜6の固有抵抗を変化させたところ、図5のように、100Ω・m以上になると極端に電圧の移行率が上昇した。これは、図4の等価回路において、Rが大きくなって抵抗導電膜6の電位が上昇したためである。抵抗導電膜6を絶縁筒5の周方向に全面に形成させると、抵抗導電膜6が、鉄心3の磁束に対して1ターンを形成し、抵抗短絡する回路となる。これにより、抵抗導電膜6の周方向に商用周波の電流が流れる。この場合、発明者の実験では、抵抗導電膜6の固有抵抗値を0.01Ω・m以上にすれば、周方向に流れる商用周波の電流は無視できるだけ小さくなり、これにより、発生する損失も無視できることがわかった。
【0029】
このように、抵抗導電膜6を膜厚10〜100μmと固有抵抗を0.01〜100Ω・mの範囲にすることで、信頼性のある、抵抗導電膜6の周を一巡する電流による損失をなくすことが可能となる。
【0030】
(第2の実施例)
以下、本発明の第2の実施例について、図6を参照しながら説明する。
第2の実施例では、前記第1の実施例の移行電圧防止板4の代わりに抵抗導電体である移行電圧防止板9を用いたものであり、それ以外の構成は、第1の実施例と同様である。
【0031】
移行電圧防止板9は、図6に示すように、例えばプレスボード10a,11a上に抵抗導電膜特に高抵抗導電膜10b11bを形成した単位防止板10,11を各2個計4個周方向につないである。この場合、単位防止板10,10のプレスボード10a,10aの端部は単位防止板11,11の高抵抗導電膜11b,11bの端部と接触し、以って、高抵抗導電膜10b,11bのいずれかが半径方向に必ず存在し、且つ、高抵抗導電膜10b,11bが電気的に接触されない分断部が形成されるようになっている。尚、高抵抗導電膜10b,11bは接地されている。
【0032】
これにより、鉄心3(図1参照)周りに高抵抗導電膜10b,11bが、1ターンを形成しないので、第1の実施例で記した抵抗導電膜6のような固有抵抗の下限値0.01Ω・mの制限を受けることがない。また、移行電圧防止板9を形成する単位防止板10,11を、鉄心3を中心として周方向に分割し配置するので、製作性を良好に出来る。
【0033】
(第3の実施例)
以下、本発明の第3の実施例について、図7を参照しながら説明する。
第3の実施例では、前記第1の実施例の移行電圧防止板4の代わりに抵抗導電体である移行電圧防止板12を用いたものであり、それ以外の構成は、第1の実施例と同様である。
【0034】
移行電圧防止板12は、図7に示すように、円形状の絶縁筒13を用い、その外周面に抵抗導電膜14を形成したもので、抵抗導電膜14は、周方向に1ターンを形成しないように、周方向が有端となる端部14a,14aを有するものである。そして、絶縁筒13の内周面には、抵抗導電膜14は、半径方向に必ず存在するように、抵抗導電膜14の端部14a,14a間の隙間を補間するように抵抗導電膜、特に、高抵抗導電膜15が形成されている。この場合、高抵抗導電膜15は、絶縁筒13を介して抵抗導電膜14の端部14a,14aにオーバーラップするようになっている。
【0035】
これにより、鉄心3周りに抵抗導電膜14が、1ターンを形成しないので、第1の実施例で記した抵抗導電膜6のような固有抵抗の下限値0.01Ω・mの制限を受けることがない。
【0036】
(第4の実施の形態)
以下、本発明の第4の実施の形態について図8を参照しながら説明する。
第4の実施例では、下記構成以外は、前記第1の実施例と同様である。
外側巻線1へは、リード16,16により電力が供給されるので、移行電圧防止板4の上、下端部付近をリード16,16が通ることになる。
【0037】
移行電圧防止板4は、極めて薄い抵抗導電膜6を有するので、その上、下端部には電界が集中する。そこで本実施例では、抵抗導電膜6の上、下端部にシールド17,17を施し、抵抗導電膜6の電界を緩和して絶縁強度を向上させる。シールド17の構造としては、例えば、金属丸棒を円弧状に整形したものであり、機種や容量によって適切なものが選ばれ、リード16を中心として周方向に所定の幅寸法を有する。シールド17は、一端または両端を直接接地に落とす構造、また、一端または両端を抵抗導電膜4に接続することによっても目的を達せられる。
【0038】
このように、外側巻線1のリード16など電圧が高い構造物を移行電圧防止板4に近接して配置でき、変圧器のコンパクト化が可能となる。
【0039】
(第5の実施例)
以下、本発明の第5の実施の形態について、図9を参照してしながら説明する。
前記第1の実施例の抵抗導電膜6を絶縁筒5の表面に塗布または吹きつけするなどして移行電圧防止板4を形成すると、場合により、抵抗導電膜6の表面のカーボンパウダー7が、一部が出てくる所謂染みでることがある。カーボンパウダー7は、微粒子であり、仮に変圧器内にわずかに存在しても絶縁破壊などの重大な事故を引き起こすことはない。しかし、変圧器が、定格以上の負荷で運転されるなど製作時には考慮しない運転状況となると、カーボンパウダー7の量が多くなり、寿命を決定する要因になりうる。
【0040】
変圧器は、極めて高品質であることが要求される機器である。そこで、万一の場合でも、カーボンパウダー7の変圧器内部への拡散を防ぐために、抵抗導電膜6の表面に絶縁物を重ねる。例えば、図9のように抵抗導電膜6上に樹脂膜18をコーティングするなどにより形成する。これにより、抵抗導電膜6からカーボンパウダー7の飛散を防止し、変圧器を更に高信頼性することができる。
【0041】
(その他の実施例)
第5の実施例において抵抗導電膜6上に樹脂膜をコーティングする構成としたが、絶縁フィルムを重ね合わす構成としても良い。
抵抗導電体たる移行電圧防止板としては、絶縁体と抵抗導電膜との組み合わせにより構成したが、これに限らず、絶縁物を有しない抵抗導電体そのもので構成してもよい。
【0042】
【発明の効果】
本発明は以上の説明から明らかなように、巻線間に抵抗導電体を設けることにより、損失が少なく、コンパクトで製作性が良い変圧器を得ることができる。
【図面の簡単な説明】
【図1】 本発明の第1の実施例を示す全体の横断面図(a)およびB−B線に沿う断面図(b)
【図2】 移行電圧防止板の拡大断面図
【図3】 抵抗導電膜の構造図
【図4】 集中回路図
【図5】 抵抗導電膜の固有抵抗−電圧移行率特性図
【図6】 本発明の第2の実施例を示す移行電圧防止板の横断面図
【図7】 本発明の第3の実施例を示す図6相当図
【図8】 本発明の第4の実施例を示す全体の横断面図(a)およびC−C線に沿う断面図(b)
【図9】 本発明の第5の実施例を示す図2相当図
【図10】 従来技術を示す全体の横断面図(a)およびA−A線に沿う断面図(b)
【符号の説明】
1は外側巻線、2は内側巻線、3は鉄心、4は移行電圧防止板(抵抗導電体)、5は絶縁筒、6は抵抗導電膜、7はカーボンパウダー、8はエキシポ樹脂、9は移行電圧防止板(抵抗導電体)、10は単位防止板、10aはプレスボード、10bは高抵抗導電膜、11は単位防止板、11aはプレスボード、11bは高抵抗導電膜、12は移行電圧防止板(抵抗導電体)、13は絶縁筒、14は抵抗導電膜、15は高抵抗導電膜、16はリード、17はシールド、18は樹脂膜である。
[0001]
BACKGROUND OF THE INVENTION
The present invention reduces a transition voltage between windings and protects a device connected to the other winding from a surge even if a lightning surge or a high-frequency surge intrudes into a power electronics device in one winding. About.
[0002]
[Prior art]
FIG. 10 shows a winding of a transformer having a conventional anti-contact plate. The outer winding (high-voltage side winding) 101 and the inner winding (low-voltage side winding) 102 are wound around the iron core 103, and an anti-contact plate 104 is disposed between the two windings 101, 102. ing. The anti-contact plate 104 is made of metal and grounded (see FIG. 10B). Further, the anti-contact plate 104 is formed with a one-turn prevention portion 105 so as to form one turn with respect to the magnetic flux of the iron core 103 and prevent short circuit.
[0003]
Now, the incompatibility prevention plate 104 plays a role of preventing so-called incompatibility that prevents the high-voltage side winding 101 from contacting the low-voltage side winding 102 in an insulation accident. At the time of an insulation failure of the high-voltage side winding 101, since the anti-contact plate 104 is in front of the low-voltage side winding 102, the arc does not reach the low-voltage side winding 102 and is grounded by the anti-contact plate 104. Thereby, even if an insulation accident occurs in the high-voltage side winding 101, it is possible to prevent the accident from expanding such that the potential of the low-voltage side winding 102 becomes the potential of the high-voltage side winding 101.
[0004]
In recent years, the application of power electronics equipment has been expanding. A converter, a UPS (Uninterruptible Power Supply), etc. are used for the power source, and an inverter or the like is used for the motor drive. By the way, a semiconductor switching element represented by an IGBT (Insulated Gate Bipolar Transistor) forms a main circuit of a power electronics device. The semiconductor switching element has low proof strength against overvoltage. This is due to the fact that the withstand voltage of the junction portion of the switching element is small, and sufficient consideration is necessary when using the semiconductor switching element. When a surge such as a lightning surge enters, it is necessary to attenuate the surge below the withstand voltage of the semiconductor switching element.
[0005]
If there is a transformer between the surge intrusion destination (in this case, the high voltage side) and the power electronics device (in this case, the low voltage side), the high voltage side winding 101 is connected if the transformer has the anti-contact plate 104. Since the shield is made of metal, the common mode of surge hardly transfers to the low-voltage side winding 102. Since the surge frequency is also high in the normal mode, the magnetic flux flows to the iron core 103 to the same extent as the outside of the iron core, and the coupling between the high-voltage side winding 101 and the low-voltage side winding 102 is weak. The side shift is very small.
[0006]
As described above, when the transformer has the incompatibility prevention plate 104, a surge transition that causes an overvoltage with respect to the power electronics device can be extremely reduced, and reliability can be ensured.
[0007]
In recent years, high-frequency surges generated by switching operations of power electronics equipment can propagate to the power supply line and cause various malfunctions such as instrument malfunctions. Yes.
[0008]
On the other hand, when a transformer exists between the affected devices, the propagation of high frequency surges to the affected devices can be greatly reduced by installing the anti-contact plate 104. Since the above-mentioned surge and the high-frequency surge generated from the power electronics equipment have a frequency of several tens of kHz to several MHz, the surge transition can be greatly reduced by the same principle.
[0009]
By the way, many harmonic currents and high frequency currents are generated from power electronics equipment. These current flows to the low-voltage side winding 102, thereby harmonics and high-frequency magnetic flux is generated when these are large, incompatible prevention plate 104, the size name current flows because made of metal, to be overheated is there. Dividing the winding in the stack direction in the winding of FIG. 10, the core radial component of the magnetic flux is increased and thereby, current of incompatible prevention plate 104 is further increased, easier to overheat and crossed prevention plate 104 .
[0010]
[Problems to be solved by the invention]
As countermeasures against overheating of the anti-contact plate 104, the insulation around the anti-contact plate 104 is made of high heat resistance, and a large cooling space is secured to enhance cooling performance. There was a drawback that would become larger.
[0011]
The present invention has been made in view of the above circumstances, and an object thereof is to provide a transformer that is compact and has good manufacturability while suppressing the transition of surge.
[0012]
[Means for Solving the Problems]
The transformer according to claim 1 is a resistive conductive film having a specific resistance value of 0.01 to 100 Ω · m and a film thickness of 10 to 100 μm by applying or spraying a resin filled with carbon powder on a peripheral surface of an insulating cylinder. The transition voltage prevention plate formed by applying the transition voltage prevention plate is disposed between the windings, and the resistance conductive film of the transition voltage prevention plate is grounded. The outer peripheral surface or the inner peripheral surface of the insulating cylinder is formed with a gap at both ends in the circumferential direction, and further, the inner peripheral surface or the outer peripheral surface of the insulating cylinder is formed so as to complement the gap. The overlap part is formed in the outer peripheral surface and inner peripheral surface of a cylinder, It is characterized by the above-mentioned.
According to such a configuration, the resistance conductive film of the transition voltage prevention plate has a resistance component, so that the flow of eddy current is suppressed as much as possible, and accordingly, heat resistance and cooling performance are not much considered. This eliminates the need to do this, makes it compact and improves the manufacturability.
And since the transition voltage prevention board is formed by apply | coating or spraying the resin with which carbon powder was filled to the surrounding surface of the insulation cylinder, workability is good and a reliable resistive conductive film is obtained.
Furthermore, since the resistance conductive film can be manufactured with good performance and the short-circuiting with high resistance to the commercial frequency magnetic flux of the iron core is eliminated, loss due to the resistance conductive film can be reduced.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
The first embodiment of the present invention will be described below with reference to FIGS.
As shown in FIG. 1, an outer winding 1 and an inner winding 2 are wound around an iron core 3, and a resistance conductor is provided between two cylindrical windings 1 and 2. A transition voltage prevention plate 4 is inserted. The outer winding 1 is generally a high-voltage side winding, and a surge enters from the power supply system. The inner winding 2 is generally a low voltage side winding, and there is a surge intrusion of power electronics equipment. As shown in FIG. 2, the transition voltage prevention plate 4 is formed by applying or spraying a resistive conductive film 6 over the entire outer periphery of the insulating cylinder 5, and the resistive conductive film 6 is grounded (FIG. 1B). )reference). In this case, the insulating cylinder 5 may be formed integrally with resin in a cylindrical shape, or may be formed by bending a press board into a cylindrical shape.
[0020]
There are various methods for producing the resistive conductive film 6, such as a method of filling metal particles into a resin. However, in order to apply to a transformer, it is required to manufacture a large area efficiently, to have flexibility that does not break even when the insulator is deformed, and to require high reliability. In this embodiment, as shown in FIG. 3, fine carbon powder 7 is filled in resin such as epoxy resin 8, that is, mixed well so as to be uniformly dispersed. The mixed liquid is applied to the insulating cylinder 5 by application or spraying and dried to form the resistive conductive film 6.
[0021]
The carbon powder 7 exists in a state where part of the carbon powder 7 is in contact and part of the carbon powder 7 is separated. However, if the mixing is sufficient, a specified specific resistance value is obtained. The electrical conduction mechanism is that when the carbon powder 7 is in contact with the epoxy resin 8 between the carbon powder 7, the resin layer is extremely thin, causing electrical conduction by the tunnel effect. It is considered to be decided.
[0022]
This resistance conductive film 6 has been confirmed by the inventors' experiments to maintain a specified resistance value even in a high-temperature life test, without causing peeling, and to have high reliability.
[0023]
Hereinafter, the operation and effect of the present embodiment will be described.
FIG. 4 shows a conceptual lumped constant equivalent circuit when a normal mode surge is applied to the outer winding 1. The capacitance between the outer winding 1 and the transition voltage prevention plate 4 is Cs, the capacitance between the transition voltage prevention plate 4 and the inner winding 2 is Cu, and the capacitance between the inner winding 2 and the ground is Ce. Let R be the resistance to ground of the voltage prevention plate 4. In practice, these quantities must be treated as distributed constants, but are treated as a lumped circuit for the sake of simplicity.
[0024]
When the transition voltage prevention plate 4 is not provided, the shared voltage of Ce determined by the capacitances of Cs, Cu, and Ce with respect to the high-frequency component of the surge is the transition voltage. On the other hand, when there is the transition voltage prevention plate 4, the shared voltage on the transition voltage prevention plate 4 is greatly reduced by bypassing the surge current to the ground at R in the middle stage. For this reason, the transition voltage can be greatly reduced.
[0025]
Next, let us consider the behavior of the transition voltage prevention plate 4 with respect to the magnetic flux of the commercial frequency. As described above, the harmonics and high-frequency currents generated by the power electronics equipment also generate magnetic flux in the radial direction of the iron core 3 in some cases. When this magnetic flux penetrates the transition voltage prevention plate 4, an eddy current flows so as to be linked to the magnetic flux. However, this eddy current is extremely small because the transition voltage prevention plate 4 has a resistance component. Therefore, there is almost no loss due to this harmonic.
[0026]
Therefore, transition voltage prevention plate 4 is a resistive conductor not heat generation, such as in the case of using a conventional mixing tactile prevention plate 104, it is necessary to use a heat-resistant insulating material around the transition voltage prevention plate 4 Therefore, there is no need to secure a large cooling space to enhance cooling, and a compact transformer with good manufacturability can be obtained.
[0027]
Therefore, as the configuration of the transition voltage prevention plate 4, it is desirable to form a resistive conductive film on the insulator in order to reduce the space. The film thickness of the resistive conductive film 6 for obtaining a certain resistance value in the transition voltage prevention plate 4 is required to be 10 μm or more in the inventor's experiment, and as an upper limit value that does not cause peeling or cracking. It was found to be 100 μm. Thus, from the viewpoint of reliability, the thickness of the resistive conductive film 6 needs to be in the range of 10 to 100 μm.
[0028]
On the other hand, when the specific resistance of the resistive conductive film 6 was changed in the film thickness in this range, the voltage transfer rate extremely increased when the resistivity became 100 Ω · m or more as shown in FIG. This is because in the equivalent circuit of FIG. 4, R increases and the potential of the resistive conductive film 6 increases. When the resistive conductive film 6 is formed on the entire surface in the circumferential direction of the insulating cylinder 5, the resistive conductive film 6 forms one turn with respect to the magnetic flux of the iron core 3 to form a resistance short circuit. Thereby, a commercial frequency current flows in the circumferential direction of the resistive conductive film 6. In this case, in the experiment of the inventor, if the specific resistance value of the resistive conductive film 6 is set to 0.01 Ω · m or more, the current of the commercial frequency flowing in the circumferential direction becomes as small as possible, thereby ignoring the generated loss. I knew it was possible.
[0029]
In this way, by setting the resistance conductive film 6 to a film thickness of 10 to 100 μm and a specific resistance in the range of 0.01 to 100 Ω · m, it is possible to reduce loss due to a reliable current that makes a round of the resistance conductive film 6. It can be eliminated.
[0030]
(Second embodiment)
The second embodiment of the present invention will be described below with reference to FIG.
In the second embodiment, a transition voltage prevention plate 9 which is a resistive conductor is used instead of the transition voltage prevention plate 4 of the first embodiment, and the other configurations are the same as in the first embodiment. It is the same.
[0031]
As shown in FIG. 6, the transition voltage prevention plate 9 has, for example, two unit prevention plates 10 and 11 each having resistance conductive films, particularly high resistance conductive films 10b and 11b formed on press boards 10a and 11a, for a total of four rounds. Connected in the direction. In this case, the end portions of the press boards 10a and 10a of the unit prevention plates 10 and 10 are in contact with the end portions of the high resistance conductive films 11b and 11b of the unit prevention plates 11 and 11, and thus the high resistance conductive films 10b and 10b. 11b is necessarily present in the radial direction, and a divided portion is formed in which the high-resistance conductive films 10b and 11b are not electrically contacted. The high resistance conductive films 10b and 11b are grounded.
[0032]
As a result, the high resistance conductive films 10b and 11b do not form one turn around the iron core 3 (see FIG. 1). Therefore, the lower limit value of the specific resistance of the resistance conductive film 6 described in the first embodiment is 0. There is no limit of 01Ω · m. In addition, since the unit prevention plates 10 and 11 forming the transition voltage prevention plate 9 are divided and arranged in the circumferential direction around the iron core 3, the manufacturability can be improved.
[0033]
(Third embodiment)
The third embodiment of the present invention will be described below with reference to FIG.
In the third embodiment, a transition voltage prevention plate 12 which is a resistive conductor is used in place of the transition voltage prevention plate 4 of the first embodiment, and other configurations are the same as in the first embodiment. It is the same.
[0034]
As shown in FIG. 7, the transition voltage prevention plate 12 uses a circular insulating cylinder 13 and has a resistance conductive film 14 formed on the outer peripheral surface thereof. The resistance conductive film 14 forms one turn in the circumferential direction. In order to avoid this, the end portions 14a and 14a have ends in the circumferential direction. The resistance conductive film 14, particularly the resistance conductive film 14 is interpolated between the end portions 14 a and 14 a of the resistance conductive film 14 so that the resistance conductive film 14 always exists in the radial direction on the inner peripheral surface of the insulating cylinder 13. A high resistance conductive film 15 is formed. In this case, the high resistance conductive film 15 overlaps the end portions 14 a and 14 a of the resistance conductive film 14 via the insulating cylinder 13.
[0035]
As a result, since the resistive conductive film 14 does not form one turn around the iron core 3, it is limited by the lower limit of 0.01 Ω · m of the specific resistance as in the resistive conductive film 6 described in the first embodiment. There is no.
[0036]
(Fourth embodiment)
Hereinafter, a fourth embodiment of the present invention will be described with reference to FIG.
The fourth embodiment is the same as the first embodiment except for the following configuration.
Since electric power is supplied to the outer winding 1 through the leads 16 and 16, the leads 16 and 16 pass through the upper portion of the transition voltage prevention plate 4 and the vicinity of the lower end thereof.
[0037]
Since the transition voltage prevention plate 4 has a very thin resistance conductive film 6, the electric field concentrates on the lower end portion. Therefore, in this embodiment, shields 17 and 17 are provided on the upper and lower ends of the resistive conductive film 6 to relax the electric field of the resistive conductive film 6 and improve the insulation strength. As the structure of the shield 17, for example, a metal round bar is shaped into an arc shape, and an appropriate one is selected depending on the model and capacity, and has a predetermined width dimension around the lead 16 in the circumferential direction. The shield 17 can be achieved by a structure in which one end or both ends are directly grounded, and by connecting one end or both ends to the resistive conductive film 4.
[0038]
In this way, a structure having a high voltage such as the lead 16 of the outer winding 1 can be disposed close to the transition voltage prevention plate 4, and the transformer can be made compact.
[0039]
(Fifth embodiment)
Hereinafter, a fifth embodiment of the present invention will be described with reference to FIG.
When the transition voltage prevention plate 4 is formed by applying or spraying the resistance conductive film 6 of the first embodiment to the surface of the insulating cylinder 5, the carbon powder 7 on the surface of the resistance conductive film 6 may be Some may come out with so-called stains. The carbon powder 7 is a fine particle, and even if it is slightly present in the transformer, it does not cause a serious accident such as dielectric breakdown. However, if the transformer is operated at a load exceeding its rating, such as when it is in an operating condition that is not taken into account at the time of manufacture, the amount of carbon powder 7 increases, which may be a factor that determines the service life.
[0040]
A transformer is a device that is required to be extremely high quality. Therefore, even in the unlikely event, an insulator is placed on the surface of the resistive conductive film 6 in order to prevent the carbon powder 7 from diffusing into the transformer. For example, it is formed by coating a resin film 18 on the resistive conductive film 6 as shown in FIG. Thereby, scattering of the carbon powder 7 from the resistive conductive film 6 can be prevented, and the transformer can be made more reliable.
[0041]
(Other examples)
Although the resin film is coated on the resistive conductive film 6 in the fifth embodiment, a structure in which insulating films are stacked may be used.
The transition voltage prevention plate as a resistive conductor is configured by a combination of an insulator and a resistive conductive film, but is not limited thereto, and may be configured by a resistive conductor itself having no insulator.
[0042]
【The invention's effect】
As is clear from the above description, the present invention can provide a transformer with low loss, compactness, and good manufacturability by providing a resistance conductor between windings.
[Brief description of the drawings]
FIG. 1 is an overall cross-sectional view (a) showing a first embodiment of the present invention and a cross-sectional view taken along line BB (b).
2 is an enlarged cross-sectional view of a transition voltage prevention plate. FIG. 3 is a structural diagram of a resistive conductive film. FIG. 4 is a lumped circuit diagram. FIG. 5 is a characteristic resistance-voltage transition rate characteristic diagram of a resistive conductive film. FIG. 7 is a cross-sectional view of a transition voltage preventing plate showing a second embodiment of the invention. FIG. 7 is a view corresponding to FIG. 6 showing a third embodiment of the invention. FIG. 8 is an overall view showing the fourth embodiment of the invention. Cross-sectional view (a) and cross-sectional view along line CC (b)
FIG. 9 is a view corresponding to FIG. 2 showing a fifth embodiment of the present invention. FIG. 10 is a cross-sectional view of the entire prior art and FIG.
[Explanation of symbols]
1 is an outer winding, 2 is an inner winding, 3 is an iron core, 4 is a transition voltage prevention plate (resistance conductor), 5 is an insulating cylinder, 6 is a resistance conductive film, 7 is carbon powder, 8 is an epoxy resin, 9 Is a voltage blocking plate (resistance conductor), 10 is a unit prevention plate, 10a is a press board, 10b is a high resistance conductive film, 11 is a unit prevention plate, 11a is a press board, 11b is a high resistance conductive film, and 12 is a transfer A voltage prevention plate (resistance conductor), 13 is an insulating cylinder, 14 is a resistance conductive film, 15 is a high resistance conductive film, 16 is a lead, 17 is a shield, and 18 is a resin film.

Claims (1)

絶縁筒の周面にカーボンパウダーが充填された樹脂を塗布もしくは吹き付けることにより固有抵抗値0.01〜100Ω・mでかつ膜厚10〜100μmである抵抗導電膜を施して形成された移行電圧防止板を、巻線間に配置し、この移行電圧防止板の抵抗導電膜を接地して構成され、
前記移行電圧防止板の前記抵抗導電膜は、前記絶縁筒の外周面もしくは内周面に、周方向の両端部に隙間を有して形成され、更に、前記絶縁筒の内周面もしくは外周面に、前記隙間を補完するように形成されて、前記絶縁筒の外周面及び内周面においてオーバーラップ部が形成されていることを特徴とする変圧器。
Transition voltage prevention formed by applying or spraying resin filled with carbon powder on the peripheral surface of the insulating cylinder to provide a resistance conductive film having a specific resistance value of 0.01 to 100Ω · m and a film thickness of 10 to 100 μm The plate is arranged between the windings, and the resistance conductive film of the transition voltage prevention plate is grounded.
The resistance conductive film of the transition voltage prevention plate is formed on the outer peripheral surface or inner peripheral surface of the insulating cylinder with a gap at both ends in the circumferential direction, and further, the inner peripheral surface or outer peripheral surface of the insulating cylinder Further, the transformer is formed so as to complement the gap, and an overlap portion is formed on the outer peripheral surface and the inner peripheral surface of the insulating cylinder.
JP2003193660A 2003-07-08 2003-07-08 Transformer Expired - Fee Related JP4846194B2 (en)

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