JP4847396B2 - Probe, probe device for signal detection, probe device for signal supply, and inspection device - Google Patents

Description

  The present invention includes a probe including a detection electrode for detecting an electric signal flowing through a conductor pattern of a test object in a non-contact manner and a shield electrode provided with an insulator sandwiched around the detection electrode, and the probe. The present invention relates to a probe device for signal detection, a probe device for signal supply (hereinafter, also simply referred to as a probe device when they are not distinguished from each other), and an inspection device including the probe device.

As this type of inspection apparatus, a substrate inspection apparatus disclosed in Japanese Patent No. 2994259 is known. This board inspection apparatus is an apparatus for inspecting (testing) the quality of a conductor pattern on a board to be inspected, and is a contact probe that can contact an electrode on a wide pitch side in a conductor pattern, and an inspection object on a narrow pitch side in a conductor pattern A non-contact sensor that detects an electromagnetic field generated in the electrode and outputs a detection signal, a waveform processing circuit that processes the detection signal, and the like are configured. In this board inspection apparatus, it is possible to determine the presence or absence of a defect in the conductor pattern by comparing the voltage level of the detection signal corresponding to the electromagnetic field detected by the non-contact sensor and the reference value. In this case, the non-contact sensor is provided with a shield that prevents radiation waves (electromagnetic fields) from the electrodes on the wide pitch side from reaching the non-contact sensor. For this reason, in this board | substrate inspection apparatus, it is possible to reduce the influence of the radiated wave from other than the inspection object electrode of the narrow pitch side.
Japanese Patent No. 2994259 (page 4-5, Fig. 1)

  However, the above substrate inspection apparatus has the following problems. That is, in this board inspection apparatus, the influence of radiation waves (disturbances) from other than the inspection target electrode is reduced by the shield provided in the non-contact sensor. In this case, this type of shield is generally formed of a conductive material and connected to the ground potential, and is provided around the non-contact sensor with an insulator interposed therebetween. That is, the non-contact sensor and the shield are capacitively coupled via the insulator. For this reason, part of the detection signal output from the non-contact sensor flows to the shield side due to the capacitance between the non-contact sensor and the shield, and the detection signal output from the non-contact sensor to the waveform processing circuit. As a result of the decrease in the signal level (attenuation of the detection signal), the sensitivity of the non-contact sensor decreases accordingly.

  The attenuation rate of the detection signal increases as the capacitance between the non-contact sensor and the shield increases. Further, the capacitance between the non-contact sensor and the shield is inversely proportional to the distance between the two. Therefore, in order to keep the attenuation rate of the detection signal low, that is, to improve the sensitivity of the non-contact sensor, it is preferable to increase the distance between the two. However, the longer the distance from the non-contact sensor to the shield, the lower the shielding effect, and it is more susceptible to disturbance from other than the inspection target. In other words, it becomes difficult to improve the directivity of the non-contact sensor. Therefore, the above-described substrate inspection apparatus using this type of non-contact sensor has a problem that it is difficult to improve both the sensitivity and directivity of the non-contact sensor, resulting in difficulty in improving inspection accuracy. Exists.

  On the other hand, in order to enable inspection of a substrate that is difficult to contact with a contact probe that supplies inspection signals due to a narrow electrode pitch, and a substrate that is easily damaged by contact with the contact probe, the above-described non-contact sensor There is known an inspection apparatus that supplies an inspection signal in a non-contact manner using a non-contact type probe having the same configuration as in FIG. In this case, also in this type of inspection apparatus, in the same manner as the phenomenon in the non-contact sensor described above, a part of the inspection signal flows to the shield side, and the signal level of the detection signal supplied to the electrode of the substrate is lowered. However, the directivity of the non-contact type probe is low, and the inspection signal is supplied to an electrode different from the supply target electrode. As a result, it is difficult to improve the inspection accuracy.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a probe, a probe apparatus, and an inspection apparatus that can improve the inspection accuracy in the inspection of a conductor pattern.

  In order to achieve the above object, the probe according to claim 1 is provided between the conductor pattern and the conductor pattern as the inspection signal is supplied in a state in which the probe is brought close to the conductor pattern of the inspection object to which the inspection signal is supplied. A probe having a detection electrode for detecting an electric signal flowing through the capacitance of the electrode, and a shield electrode provided with an insulator around the detection electrode, the detection electrode and the An intermediate electrode maintained in a floating state is provided between the shield electrode and an insulator.

  The probe according to claim 2 is the probe according to claim 1, wherein the detection electrode is formed in a columnar shape, and the intermediate electrode is formed in a cylindrical shape and surrounds the detection electrode. The shield electrode is formed in a cylindrical shape and surrounds the intermediate electrode.

  The probe according to claim 3 is the probe according to claim 1, wherein the detection electrode is formed in a thin plate shape and provided on a substrate, and the intermediate electrode is formed in a frame shape and the detection. The detection electrode is provided on the substrate so as to surround the detection electrode in a non-contact state, and the shield electrode is formed in a frame shape and surrounds the intermediate electrode in a non-contact state with the intermediate electrode Thus, it is provided on the substrate.

  Furthermore, the probe according to claim 4 is the probe according to any one of claims 1 to 3, wherein the insulator is made of foamable polyethylene.

  In this case, the detection electrode can be formed such that the maximum width of the end face facing the conductor pattern is shorter than the width of the conductor pattern in the state of being close to the conductor pattern.

  According to a fifth aspect of the present invention, there is provided a supply electrode for supplying an inspection signal via an electrostatic capacitance between the probe pattern and the supply electrode in a state where the probe is brought close to the conductor pattern of the inspection object. A probe having a shield electrode provided around an electrode with an insulator interposed therebetween, and an intermediate electrode maintained in a floating state sandwiches the insulator between the supply electrode and the shield electrode Is provided.

  The probe according to claim 6 is the probe according to claim 5, wherein the supply electrode is formed in a columnar shape, and the intermediate electrode is formed in a cylindrical shape and surrounds the supply electrode. The shield electrode is formed in a cylindrical shape and surrounds the intermediate electrode.

  The probe according to claim 7 is the probe according to claim 5, wherein the supply electrode is formed in a thin plate shape and provided on a substrate, and the intermediate electrode is formed in a frame shape and the supply. The shield electrode is formed on the substrate so as to surround the supply electrode in a non-contact state with the electrode for use, and the shield electrode is formed in a frame shape and surrounds the intermediate electrode in a non-contact state with the intermediate electrode Thus, it is provided on the substrate.

  The probe according to claim 8 is the probe according to any one of claims 5 to 7, wherein the insulator is made of foamable polyethylene.

  In this case, the supply electrode can be formed so that the maximum width of the end surface facing the conductor pattern is shorter than the width of the conductor pattern in the state of being close to the conductor pattern.

  A probe device for signal detection according to claim 9 is a probe according to any one of claims 1 to 4, and a processing circuit that executes predetermined processing on the electrical signal detected by the probe. It has.

  According to a tenth aspect of the present invention, a signal supply probe apparatus includes the probe according to any one of the fifth to eighth aspects, and an inspection signal output unit that outputs the inspection signal to the probe.

  An inspection apparatus according to an eleventh aspect includes a signal detection probe apparatus according to the ninth aspect, an inspection signal supply unit that supplies an inspection signal to a conductor pattern of an inspection object, and the signal detection probe. And an inspection unit for inspecting the conductor pattern based on a processing signal processed by the processing circuit of the apparatus.

  Furthermore, the inspection apparatus according to claim 12 is the inspection apparatus according to claim 11, further comprising an electrode plate configured to be proximate to one end of each of the plurality of conductor patterns, and the inspection signal supply unit includes: The inspection signal is supplied to each conductor pattern via a capacitance between the electrode plate brought close to the one end and the one end.

  According to a thirteenth aspect of the present invention, there is provided a probe apparatus for supplying a signal according to the tenth aspect, and an electric signal flowing through the conductor pattern in accordance with the supply of the inspection signal by the probe apparatus for supplying the signal. A processing circuit for executing a predetermined process, and an inspection unit for inspecting the conductor pattern based on a processing signal processed by the processing circuit.

  An inspection apparatus according to claim 14 is the inspection apparatus according to claim 13, further comprising an electrode plate configured to be close to one end of each of the plurality of conductor patterns, wherein the processing circuit includes the one end. The predetermined processing is performed on the electric signal detected by the electrode plate via a capacitance between the electrode plate brought close to the part and the one end.

  An inspection apparatus according to claim 15 is a probe apparatus for signal detection according to claim 9, a probe apparatus for signal supply according to claim 10, and the inspection signal from the probe apparatus for signal supply. And an inspection unit for inspecting the conductor pattern based on the processing signal processed by the signal detecting probe device.

  An inspection apparatus according to claim 16 is the inspection apparatus according to any one of claims 11 to 15, wherein a movement mechanism capable of moving the probe in an arbitrary direction, and the movement mechanism are controlled to control the probe. And a control unit for bringing the tip portion close to the conductor pattern.

  According to the probe of claim 1, by providing the intermediate electrode maintained in a floating state between the detection electrode and the shield electrode, the distance between the detection electrode and the shield electrode is increased and the distance between the two is increased. Even if the attenuation of the electrical signal detected by the detection electrode is reduced by reducing the capacitance of the probe and the sensitivity of the probe is improved, the detection range is limited to a narrow range by the presence of the floating electrode. The directivity of can be improved. Therefore, according to this probe, both improvement in sensitivity and directivity can be realized. As a result, the inspection accuracy in the inspection of the conductor pattern of the inspection object can be sufficiently improved.

  According to the probe of claim 2, the detection electrode is formed in a column shape, the intermediate electrode formed in a cylindrical shape is provided so as to surround the detection electrode, and the shield electrode formed in a cylindrical shape is provided with the intermediate electrode. Since it is provided so as to surround it, the portion other than the end face of the detection electrode can be surely covered with the shield electrode, so that the influence of disturbance can be suppressed to a sufficiently low level.

  According to the probe of claim 3, the detection electrode formed in a thin plate shape is provided on the substrate, and the intermediate electrode formed in a frame shape is provided on the substrate so as to surround the detection electrode. Since the formed shield electrode is provided on the substrate so as to surround the intermediate electrode, the cost of manufacturing the probe can be sufficiently reduced because the configuration is simple.

  Furthermore, according to the probe of claim 4, by forming the insulator with foamable polyethylene having a low dielectric constant, the capacitance between the detection electrode and the shield electrode can be further reduced, The attenuation rate of the electric signal can be further reduced.

  In this case, for example, an inspection signal is supplied to the conductor pattern adjacent to the conductor pattern to be inspected by forming the detection electrode so that the maximum width of the end surface facing the conductor pattern is shorter than the width of the conductor pattern. Even if it has been done, it is possible to reliably prevent a situation in which an electric signal flowing through the capacitance between the adjacent conductor patterns is erroneously detected by the detection electrode.

  According to the probe of claim 5, since the intermediate electrode maintained in a floating state is provided between the supply electrode and the shield electrode, the directivity of the probe can be sufficiently improved. As a result, the inspection signals can be concentrated and supplied in a narrow range, so that a sufficiently high level of the inspection signal can be supplied to the conductor pattern to be inspected. In addition, since the directivity of the probe can be sufficiently improved, the influence due to the supply of the inspection signal to other conductor patterns adjacent to the conductor pattern to be inspected can be suppressed sufficiently low. Therefore, according to this probe, the inspection accuracy in the inspection of the conductor pattern of the inspection object can be sufficiently improved.

  According to the probe of claim 6, the supply electrode is formed in a column shape, the intermediate electrode formed in a cylindrical shape is provided so as to surround the supply electrode, and the shield electrode formed in a cylindrical shape is provided with the intermediate electrode. Since it is provided so as to surround it, the portion other than the end face of the supply electrode can be reliably covered with the shield electrode, so that the leakage of the inspection signal (supply of the inspection signal to the conductor other than the inspection target) is ensured. Can be prevented.

  Further, according to the probe of claim 7, the supply electrode formed in a thin plate shape is provided on the substrate, and the intermediate electrode formed in a frame shape is provided on the substrate so as to surround the supply electrode, and the frame shape is provided. Since the formed shield electrode is provided on the substrate so as to surround the intermediate electrode, the cost of manufacturing the probe can be sufficiently reduced because the configuration is simple.

  Further, according to the probe of claim 8, since the insulator is formed of foamable polyethylene having a low dielectric constant, the capacitance between the supply electrode and the shield electrode can be kept small. The attenuation rate of the service signal can be sufficiently reduced.

  In this case, by forming the supply electrode so that the maximum width of the end face facing the conductor pattern is shorter than the width of the conductor pattern, the inspection signal is supplied to another conductor pattern adjacent to the conductor pattern to be inspected. Can be prevented more reliably.

  Further, according to the probe device for signal detection according to claim 9, by providing the probe according to any one of claims 1 to 4, it is possible to realize the same effect as the effect of these probes. it can.

  Further, according to the probe device for supplying a signal according to claim 10, by providing the probe according to any one of claims 5 to 8, it is possible to realize the same effect as that of these probes. it can.

  Further, according to the inspection apparatus of the eleventh aspect, by providing the probe device for signal detection according to the ninth aspect, an effect similar to the effect of each probe included in the probe apparatus is realized. be able to.

  Furthermore, according to the inspection apparatus of claim 12, each of the inspection signal supply units is connected to each end of each of the plurality of conductor patterns via the capacitance between the electrode plate and each end. By supplying inspection signals to the conductor pattern, the pitch of one end of the conductor pattern is extremely narrow. An inspection signal can be reliably supplied to the conductor pattern.

  In addition, according to the inspection apparatus of the thirteenth aspect, by providing the signal supply probe apparatus according to the tenth aspect, an effect similar to the effect of each probe included in the probe apparatus is realized. be able to.

  Further, according to the inspection apparatus of claim 14, the processing circuit is detected by the electrode plate via the capacitance between the electrode plate brought close to each one end portion of each of the plurality of conductor patterns and each end portion. By performing a predetermined process on the electrical signal, the pitch of one end of the conductor pattern is extremely narrow, and it is difficult to individually contact a signal detection contact probe with each end. Even when it is difficult to detect an electric signal by the above-described probe device for signal detection, the electric signal can be reliably detected.

  In addition, according to the inspection apparatus of the fifteenth aspect, since the signal detection probe apparatus of the ninth aspect and the signal supply probe apparatus of the tenth aspect are provided, the supply of the inspection signal and the electricity Both signal detections can be performed in a non-contact manner using a probe. For this reason, unlike the configuration in which the contact probe is brought into direct contact with the conductor pattern, the conductor pattern can be reliably prevented from being damaged by the contact of the probe.

  According to the inspection apparatus of claim 16, when the probe is provided with a moving mechanism capable of moving in any direction, the shape of the conductor patterns is different from each other or the conductor patterns are randomly arranged. In addition, the probe can be reliably brought close to the conductor pattern (one end or the other end of the conductor pattern).

  Hereinafter, the best mode of a probe, a probe device, and an inspection device according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described with reference to the drawings. A circuit board inspection apparatus 1 shown in FIG. 1 is an example of an inspection apparatus according to the present invention, and is configured to be able to perform a predetermined electrical inspection on the flexible board 100 shown in FIG. Here, the flexible substrate 100 is an example of an inspection object in the present invention, and is configured by providing a plurality of conductor patterns 102 on a substrate body 101 as shown in the figure. In this case, the pitch of each conductor pattern 102 is such that one end 102a (the lower end in the figure) is wide and the other end 102b (the upper end in the figure) is narrow.

  On the other hand, as shown in FIG. 1, the circuit board inspection apparatus 1 includes a probe apparatus (signal detection probe apparatus according to the present invention) 2, a moving mechanism 3, an inspection signal supply unit 4, an amplifier 5, and A / D conversion. The unit 6 includes an operation unit 7, a display unit 8, a control unit 9, a storage unit 10, and a mounting table 50 (see FIG. 3).

  The probe device 2 includes a probe 11 and an I / V conversion circuit 12. The probe 11 is an example of a probe according to the present invention, and is configured by a triaxial cable (triple coaxial cable). Specifically, as shown in FIGS. 2 and 3, the probe 11 includes a detection electrode 21, a first insulator 22, a floating electrode 23, a second insulator 24, a shield electrode 25, and a covering 26, It is configured as a column as a whole. The detection electrode 21 is formed in a columnar shape (an example of a columnar shape in the present invention) from a conductive material, and a base end portion (an upper end portion in both drawings) is a signal input terminal (I / V conversion circuit 12). (Not shown). Further, the detection electrode 21 is formed in a columnar shape whose diameter is shorter than the width of the other end portion 102 b of the conductor pattern 102 of the flexible substrate 100. That is, the detection electrode 21 has a conductor pattern in which the maximum width (the diameter of the circular end face in this configuration) of the end face (circular end face shown in FIG. 2) facing the conductor pattern 102 is close to the conductor pattern 102. It is formed so as to be shorter than the width of the other end portion 102 b in 102. In this case, the inspection electrode 21 is inspected as described later when the tip portion (the lower end portion in both figures) is close to the conductor pattern 102 of the flexible substrate 100 at the time of inspection, that is, in a state of being capacitively coupled to the conductor pattern 102. The current signal Si (electrical signal in the present invention) flowing through the electrostatic capacitance C0 between the conductor pattern 102 and the detection electrode 21 in accordance with the supply of the use signal Se is detected without contact.

  The first insulator 22 is made of, for example, expandable polyethylene. As shown in FIGS. 2 and 3, the first insulator 22 is formed in a cylindrical shape and is provided so as to surround the detection electrode 21. The floating electrode 23 corresponds to the intermediate electrode in the present invention, is formed in a cylindrical shape from a conductive material, and is provided so as to surround the detection electrode 21 with the first insulator 22 interposed therebetween. In this case, the floating electrode 23 is maintained in an electrically floating state (a state in which it is not electrically connected to the ground potential or other electrodes (the detection electrode 21 and the shield electrode 25)) as shown in both drawings. And has a function of improving the directivity of the probe 11 by functioning as a shield.

  The second insulator 24 is made of, for example, expandable polyethylene. Further, as shown in FIGS. 2 and 3, the second insulator 24 is formed in a cylindrical shape and is provided so as to surround the floating electrode 23. The shield electrode 25 is an electrode for preventing (shielding) the influence of disturbance, is formed of a conductive material, and is connected to the ground potential via the I / V conversion circuit 12. Further, as shown in both drawings, the shield electrode 25 is formed in a cylindrical shape and is provided so as to surround the floating electrode 23 with the second insulator 24 interposed therebetween. The covering 26 is formed in a cylindrical shape with an insulating material (for example, a thermoplastic elastomer) and is provided so as to surround (cover) the shield electrode 25.

Here, in this probe 11, since the floating electrode 23 is provided between the detection electrode 21 and the shield electrode 25 with the first insulator 22 and the second insulator 24 sandwiched therebetween, the floating electrode 23 is provided. Both sensitivity and directivity can be improved as compared with conventional probes (probe 311 shown in FIG. 5 and probe 411 shown in FIG. 6) that are not used. More specifically, the attenuation rate of the current signal Si (decrease in the sensitivity of the probe 11) caused by the capacitance between the detection electrode 21 and the shield electrode 25 is determined between the detection electrode 21 and the shield electrode 25. The larger the capacitance between, the larger. The capacitance is inversely proportional to the distance between the detection electrode 21 and the shield electrode 25. In this case, as shown in FIG. 4, for example, the capacitance between the detection electrode 21 and the floating electrode 23 in the probe 11 is C1, and the capacitance between the floating electrode 23 and the shield electrode 25 is C2. Assuming that the capacitance between the detection electrode 21 and the shield electrode 25, that is, the combined capacitance of C1 and C2, is C3, the following relational expression is established.
1 / C3 = 1 / C1 + 1 / C2 (1)

4 and 5, the first insulator 22 and the second insulator 24 in the probe 11 and the first insulator 322 of the conventional probe 311 are formed of the same material, respectively, and these The thickness of each insulator 22, 24, 322 (that is, the distance L1 between the detection electrode 21 and the floating electrode 23, the distance L2 between the floating electrode 23 and the shield electrode 25, and the detection electrode 321 of the probe 311) And the shield electrode 325 have the same length L3), the capacitance C4 between the detection electrode 321 and the shield electrode 325 and the capacitances C1 and C2 described above are as follows. The following relational expression holds.
C1 = C2 = C4 Formula (2)
The following relational expression holds between C3 and C4 from the above formulas (1) and (2).
1 / C3 = 1 / C4 + 1 / C4 = 2 / C4
C3 = C4 / 2
That is, in the probe 11, the combined capacitance C3 between the detection electrode 21 and the shield electrode 25 is ½ of the capacitance C4 between the detection electrode 321 and the shield electrode 325 in the probe 311. Therefore, in the probe 11, the attenuation rate of the current signal Si is suppressed to a small extent because the capacitance is small, and the sensitivity of the probe 11 is improved.

4 and 6, the first insulator 22 and the second insulator 24 in the probe 11 and the first insulator 422 of the conventional probe 411 are formed of the same material, respectively, and the first insulator When the thickness of the insulator 422 (that is, the distance L4 between the detection electrode 421 and the shield electrode 425) is twice the distance L1 between the detection electrode 21 and the floating electrode 23, the detection electrode in the probe 411 The following relational expression is established between the electrostatic capacitance C5 between 421 and the shield electrode 425 and the above-described electrostatic capacitances C1 and C2.
C1 = C2 = 2 × C5. ... Formula (3)
The following relational expressions hold between C3 and C5 from the above formulas (1) and (3).
1 / C3 = 1 / (2 × C5) + 1 / (2 × C5) = 1 / C5
C3 = C5
That is, the combined capacitance C3 between the detection electrode 21 and the shield electrode 25 in the probe 11 and the capacitance C5 between the detection electrode 421 and the shield electrode 425 in the detection electrode 421 are the same value. become.

  In this case, the range in which the detection electrode 421 of the probe 411 detects the current signal Si via the capacitance between the probe pattern 411 (the range in which the inspection signal Se flowing through the conductor pattern 102 is detected) is as shown in FIG. As shown in FIG. 5, the area of the conductor pattern 102 facing the detection electrode 421 is not covered by the shield electrode 425 (the area E2 indicated by a broken line in the figure). On the other hand, since the probe 11 includes the floating electrode 23 that also functions as a shield, the range in which the detection electrode 21 detects the current signal Si is as shown in FIG. Of the portion facing the electrode 21, the range is not shielded by the floating electrode 23 (range E <b> 1 shown in the figure). In this case, since the distance L1 between the detection electrode 21 and the floating electrode 23 is twice the distance L4 between the detection electrode 421 and the shield electrode 425, the range E1 is smaller than the range E2. Therefore, the directivity of the probe 11 is sufficiently improved than the directivity of the probe 411.

  The I / V conversion circuit 12 corresponds to a processing circuit in the present invention, and converts the current signal Si detected by the probe 11 into a voltage signal Sv (processed signal in the present invention) (predetermined processing in the present invention) and outputs it. To do. In this case, the probe 11 is directly connected to the I / V conversion circuit 12 in order to suppress the attenuation of the current signal Si.

  The moving mechanism 3 is controlled by the control unit 9 in the direction along the placement surface 51 (the surface on which the flexible substrate 100 is placed) on the placement table 50 (see FIG. 3) (the left-right direction in FIG. The probe device 2 is moved in a direction from the front side to the back side in FIG. 5 (XY direction) and a direction in which it is in contact with and away from the placement surface 51 (vertical direction in the figure: Z direction), that is, an arbitrary direction. As shown in FIG. 1, the inspection signal supply unit 4 includes a power supply unit 31, a switching circuit 32, and a plurality of signal supply probes 33. The power supply unit 31 outputs an inspection signal Se (for example, an AC signal). As shown in the figure, the switching circuit 32 includes the same number of switches 32a as the probes 11 and shifts to an on state or an off state in accordance with the control of the control unit, thereby inspecting signals for the signal supply probes 33. Se output and output stop. The signal supply probe 33 is connected to one end portion 102 a of the conductor pattern 102 on the flexible substrate 100 and supplies the inspection signal Se from the power supply unit 31 to the conductor pattern 102. In this case, the inspection signal supply unit 4 includes the same number of signal supply probes 33 as the number of conductor patterns 102 in the flexible substrate 100.

  The amplifier 5 amplifies the voltage signal Sv output from the I / V conversion circuit 12 of the probe apparatus 2 with a predetermined amplification factor. The A / D converter 6 performs analog / digital conversion on the voltage signal Sv amplified by the amplifier 5 and outputs voltage data Dv. The operation unit 7 includes various switches such as a power switch and an inspection start switch, and outputs an operation signal So when these switches are operated. The display unit 8 performs various displays according to the control of the control unit 9.

  The control unit 9 corresponds to the inspection unit in the present invention, and executes various processes according to the operation signal So from the operation unit 7. Specifically, the control unit 9 controls the output of the inspection signal Se by the power supply unit 31 of the inspection signal supply unit 4 and also controls the on / off of the switch 32 a in the switching circuit 32 of the inspection signal supply unit 4. . Further, the control unit 9 calculates the voltage value Vd based on the voltage data Dv output from the A / D conversion unit 6 and compares the voltage value Vd with the reference value Vs stored in the storage unit 10. Thus, the quality of the conductor pattern 102 is determined (inspected). That is, the control unit 9 determines the quality of the conductor pattern 102 based on the current signal Si detected by the probe 11. Further, the control unit 9 causes the display unit 8 to display the pass / fail determination result for the conductor pattern 102. The storage unit 10 stores the reference value Vs and temporarily stores the voltage value Vd calculated by the control unit 9. As shown in FIG. 3, the mounting table 50 is configured to be capable of mounting the flexible substrate 100.

  Next, a method for inspecting the quality of the conductor pattern 102 of the flexible substrate 100 using the circuit board inspection apparatus 1 and the operation of the circuit board inspection apparatus 1 at that time will be described.

  First, as shown in FIG. 3, the flexible substrate 100 is mounted and fixed on the mounting surface 51 of the mounting table 50. Next, as shown in FIG. 1, the signal supply probe 33 in the inspection signal supply unit 4 of the circuit board inspection apparatus 1 is brought into contact with one end portion 102 a of each conductor pattern 102. Subsequently, the operation unit 7 is operated to operate the circuit board inspection apparatus 1. At this time, the control unit 9 controls the power supply unit 31 of the inspection signal supply unit 4 to start outputting the inspection signal Se.

  Further, the control unit 9 controls the switching circuit 32 of the inspection signal supply unit 4 to shift one of the switches 32a (for example, the leftmost switch 32a in the figure) to the ON state. The other switches 32a except for the switch 32a are shifted to the off state. As a result, the inspection signal Se from the power supply unit 31 is supplied via the signal supply probe 33 to one end portion 102 a of one of the conductor patterns 102.

  Next, the control unit 9 controls the moving mechanism 3 to connect the probe 11 to the other end 102b of the conductor pattern 102 to which the inspection signal Se is supplied (in this example, the leftmost conductor pattern 102 in FIG. 1). The probe device 2 is moved so that the distal end portions are close to each other. In this case, as shown in FIG. 3, the probe 11 brought close to the other end 102 b of the conductor pattern 102 is capacitively coupled to the conductor pattern 102. For this reason, with the supply of the AC inspection signal Se to the conductor pattern 102, the detection electrode 21 of the probe 11 is connected to the conductor pattern 102 via the capacitance (capacitance C0 shown in the figure). The current signal Si flows (that is, the current signal Si is detected by the detection electrode 21). In this case, since the detection electrode 21 is formed so that the maximum width of the end surface facing the conductor pattern 102 is shorter than the width of the other end portion 102b of the conductor pattern 102, for example, the conductor pattern 102 to be inspected Even if the inspection signal Se is supplied to the adjacent conductor pattern 102, the current signal Si flowing through the capacitance between the adjacent conductor pattern 102 is detected (incorrectly detected) by the detection electrode 21. Is surely prevented.

  Next, the I / V conversion circuit 12 of the probe device 2 converts the current signal Si detected by the probe 11 into a voltage signal Sv. Subsequently, the amplifier 5 amplifies the voltage signal Sv at a predetermined amplification factor, and the A / D converter 6 performs analog / digital conversion on the amplified voltage signal Sv and outputs voltage data Dv. Next, the control unit 9 calculates the voltage value Vd based on the voltage data Dv and stores it in the storage unit 10. Subsequently, the control unit 9 controls the switching circuit 32 of the inspection signal supply unit 4 to sequentially switch the switch 32a for shifting to the on state or the off state, and controls the moving mechanism 3 to move the probe 11. The voltage value Vd is calculated and stored for all the conductor patterns 102 in the flexible substrate 100.

  Next, the control unit 9 executes a quality determination process for the conductor pattern 102. In this pass / fail determination process, the control unit 9 compares the voltage values Vd for all the conductor patterns 102 stored in the storage unit 10 with the reference values Vs stored in the storage unit 10. In this case, when the voltage value Vd is equal to or higher than the reference value Vs, the control unit 9 determines that the conductor pattern 102 is in a good state without being disconnected. On the other hand, when the voltage value Vd is smaller than the reference value Vs, there is a possibility that the conductor pattern 102 is disconnected. Therefore, the control unit 9 determines that the conductor pattern 102 is in a defective state. Next, the control unit 9 stores the pass / fail determination result for each conductor pattern 102 in the storage unit 10. Thereby, the quality determination process is completed.

  Next, the control unit 9 reads the result of the pass / fail determination process from the storage unit 10 and causes the display unit 8 to display the result. Thereby, the inspection of the conductor pattern 102 of the flexible substrate 100 is completed. In this case, as described above, in this circuit board inspection apparatus 1, since the probe 11 is provided with the floating electrode 23, the capacitance between the detection electrode 21 and the shield electrode 25 in the probe 11 is kept small. Thus, the sensitivity of the probe 11 is improved. Further, since the floating electrode 23 is provided on the probe 11, the directivity of the probe 11 is sufficiently improved. Therefore, it is possible to accurately inspect the conductor pattern 102 based on the current signal Si having a sufficiently high level and sufficiently small influence of disturbance.

  As described above, according to the probe 11, the probe device 2, and the circuit board inspection device 1, the first insulator 22 and the second insulator 24 are sandwiched between the detection electrode 21 and the shield electrode 25 and are in a floating state. By providing the floating electrode 23, the distance between the detection electrode 21 and the shield electrode 25 is increased to reduce the capacitance between them, thereby reducing the attenuation rate of the current signal Si and the sensitivity of the probe 11. Even if it is improved, the directivity of the probe 11 can be improved by limiting the detection range to a narrow range due to the presence of the floating electrode 23. Therefore, according to the probe 11, the probe device 2, and the circuit board inspection device 1, both the sensitivity improvement and the directivity improvement of the probe 11 can be realized. As a result, the inspection accuracy in the inspection of the conductor pattern 102 is sufficiently obtained. Can be improved.

  Further, according to the probe 11, the probe device 2, and the circuit board inspection device 1, the detection electrode 21 is formed in a column shape, and the floating electrode 23 formed in a cylindrical shape is sandwiched between the first insulators 22 and the detection electrode 21. The shield electrode 25 formed in a cylindrical shape is provided so as to surround the floating electrode 23 with the second insulator 24 interposed therebetween, so that portions other than the end face of the detection electrode 21 are shielded. Therefore, the influence of disturbance can be suppressed to a sufficiently low level.

  Further, according to the probe 11, the probe device 2, and the circuit board inspection device 1, the first insulator 22 and the second insulator 24 are made of foamed polyethylene having a low dielectric constant, so that the detection electrode 21 and the shield are shielded. As a result of the capacitance between the electrode 25 and the electrode 25 being further reduced, the attenuation rate of the current signal Si can be further reduced.

  In addition, according to the probe 11, the probe device 2, and the circuit board inspection device 1, the detection electrode 21 is set so that the maximum width of the end surface facing the conductor pattern 102 is shorter than the width of the other end portion 102 b of the conductor pattern 102. For example, even if the inspection signal Se is supplied to the conductor pattern 102 adjacent to the conductor pattern 102 to be inspected, the current flows through the capacitance between the conductor pattern 102 and the adjacent conductor pattern 102. A situation in which the current signal Si is detected (incorrectly detected) by the detection electrode 21 can be reliably prevented.

  Next, the configuration of the circuit board inspection apparatus 1a shown in FIG. 8 will be described with reference to the drawings. In addition, in the following description, the same code | symbol is attached | subjected about the component same as each component of the above-mentioned circuit board inspection apparatus 1, and the overlapping description is abbreviate | omitted. The circuit board inspection apparatus 1a is another example of the inspection apparatus according to the present invention, and is configured to be able to execute a predetermined electrical inspection on the flexible board 500 shown in FIG. Here, the flexible substrate 500 is another example of the inspection object in the present invention, and is configured by providing a plurality of conductor patterns 502 on a substrate body 501 as shown in FIG. In this case, the pitch of each conductor pattern 502 is extremely narrow at one end 502a (the lower end in the figure) and wide at the other end 102b (the upper end in the figure).

  On the other hand, as shown in FIG. 8, the circuit board inspection apparatus 1a includes a probe device 2, a moving mechanism 3, an inspection signal supply unit 4a, an amplifier 5, an A / D conversion unit 6, an operation unit 7, a display unit 8, and a control. It is comprised including the part 9, the memory | storage part 10, and the mounting base 50 (refer FIG. 3). In this case, the inspection signal supply unit 4a includes a power supply unit 31 and an electrode plate 34 as shown in FIG. The electrode plate 34 is formed in a plate shape from a conductive material. The inspection signal supply unit 4a is provided between the electrode plate 34 and each one end 502a in a state where the electrode plate 34 is brought close to one end 502a of each (all) conductor pattern 502 in the flexible substrate 500. The inspection signal Se is supplied to each (all) conductor patterns 502 via the capacitance.

  When inspecting the quality of the conductor pattern 502 of the flexible substrate 500 using the circuit board inspection apparatus 1a, first, the flexible substrate 500 is mounted on the mounting table 50 and fixed. Next, as shown in FIG. 8, the electrode plate 34 of the inspection signal supply unit 4 a is brought close to one end portion 502 a of each conductor pattern 502. At this time, the inspection signal Se output from the power supply unit 31 is supplied to each conductor pattern 502 via the capacitance between the electrode plate 34 and each one end portion 502a.

  Next, the moving mechanism 3 so that the tip of the detection electrode 21 in the probe 11 is close to the other end 502b of one of the conductor patterns 502 (for example, the leftmost conductor pattern 502 in FIG. 8). Moves the probe device 2, and the I / V conversion circuit 12 of the probe device 2 converts the current signal Si detected by the probe 11 into a voltage signal Sv. Subsequently, the A / D conversion unit 6 performs analog / digital conversion on the voltage signal Sv amplified by the amplifier 5 and outputs voltage data Dv, and the control unit 9 calculates the voltage value Vd based on the voltage data Dv. And stored in the storage unit 10. Next, the control unit 9 calculates and stores the voltage values Vd for all the conductor patterns 502 in the flexible substrate 500 while controlling the moving mechanism 3 to move the probe 11.

  Subsequently, the control unit 9 executes a pass / fail determination process for the conductor pattern 502, stores the pass / fail determination result for each conductor pattern 502 in the storage unit 10, and causes the display unit 8 to display the determination result. Thereby, the inspection of the conductor pattern 502 of the flexible substrate 500 is completed. In this case, in the circuit board inspection apparatus 1a, as described above, the electrode plate 34 of the inspection signal supply unit 4a is brought close to the one end portion 502a of each (all) conductor pattern 502 in the flexible substrate 500, whereby the power supply The inspection signal Se output from the section 31 is supplied to each conductor pattern 502 via the electrostatic capacitance between the electrode plate 34 and each one end section 502a. Therefore, even when the pitch of the one end portions 502a of the conductor pattern 502 is extremely narrow as in the flexible substrate 500, the inspection signal Se can be reliably supplied to each conductor pattern 502.

  As described above, according to the circuit board inspection apparatus 1 a, the inspection signal supply unit 4 a is configured to reduce the electrostatic capacitance between the electrode plate 34 brought close to the one end portion 502 a of each conductor pattern 502 and each end portion 502 a. By supplying the inspection signal Se to each conductor pattern 502, the pitch of the one end portion 502a of the conductor pattern 502 is extremely narrow, and it is difficult to individually contact the signal supply probe 33 with each one end portion 502a. Even in this case, the inspection signal Se can be reliably supplied to each conductor pattern 502.

  Next, the configuration of the circuit board inspection apparatus 1b shown in FIG. 9 will be described with reference to the drawings. The circuit board inspection device 1b is another example of the inspection device according to the present invention, and is configured to be able to perform a predetermined electrical inspection on the flexible substrate 100 described above, for example. Specifically, the circuit board inspection device 1b includes a probe device (signal supply probe device according to the present invention) 2a, a moving mechanism 3, an amplifier 5, an A / D converter 6, an operation, as shown in FIG. Unit 7, display unit 8, control unit 9, storage unit 10, I / V conversion circuit 12, switching circuit 32, signal inspection probe 33a, and mounting table 50 (see FIG. 3).

  The probe device 2a includes a probe 11a and a power supply unit 31. The probe 11a is configured similarly to the probe 11 described above, as shown in FIGS. In this case, the detection electrode 21 of the probe 11 a supplies the inspection signal Se via the electrostatic capacitance between the electrode 11 and the conductor pattern 102 in a state where the electrode 21 is in proximity to the conductor pattern 102 of the flexible substrate 100. That is, in the circuit board inspection apparatus 1b, the detection electrode 21 of the probe 11a functions as an electrode for supplying the inspection signal Se (hereinafter, the detection electrode 21 of the probe 11a is also referred to as “supply electrode 21a”). .

  In the circuit board inspection apparatus 1b, the power supply unit 31 functions as an inspection signal output unit in the present invention, and outputs an inspection signal Se to the probe 11a. In this circuit board inspection apparatus 1b, the moving mechanism 3 moves the probe 11a of the probe apparatus 2a in an arbitrary direction. Furthermore, in this circuit board inspection apparatus 1b, the signal inspection probe 33a connected to the one end 102a of the conductor pattern 102 detects and switches the current signal Si flowing through the conductor pattern 102 as the inspection signal Se is supplied. The current signal Si is output to the I / V conversion circuit 12 via the circuit 32.

  When inspecting the quality of the conductor pattern 102 of the flexible substrate 100 using the circuit board inspection device 1b, the flexible substrate 100 is first mounted on the mounting table 50 and fixed. Next, as shown in FIG. 9, the signal inspection probe 33 a is brought into contact with one end portion 102 a of each conductor pattern 102. Subsequently, the control unit 9 controls the switching circuit 32 to shift one of the switches 32a (for example, the leftmost switch 32a in the figure) to the ON state and remove the switch 32a. The other switch 32a is turned off.

  Next, the moving mechanism 3 moves the probe so that the tip of the supply electrode 21a is close to the other end 102b of one of the conductor patterns 102 (for example, the leftmost conductor pattern 102 in FIG. 9). 11a is moved. At this time, the inspection signal Se output from the power supply unit 31 is supplied to each conductor pattern 102 via the capacitance between the supply electrode 21a of the probe 11a and the other end 102b.

  Here, since the floating electrode 23 is provided on the probe 11a, the directivity of the probe 11a is sufficiently improved. Therefore, in this circuit board inspection apparatus 1b, the inspection signal Se can be concentrated and supplied in a narrow range as compared with the configuration using the probe 411 (see FIG. 6) that does not include the floating electrode 23. it can. Therefore, in this circuit board inspection apparatus 1b, a sufficiently high level of the inspection signal Se can be supplied to the conductor pattern 102 to be inspected. In addition, since the directivity of the probe 11a is sufficiently improved, the supply of the inspection signal Se to other conductor patterns 102 adjacent to the conductor pattern 102 to be inspected is suppressed to a low level. As a result, the influence due to the supply of the inspection signal Se to the other conductor patterns 102 can be suppressed sufficiently low.

  Subsequently, the I / V conversion circuit 12 converts the current signal Si input via the signal inspection probe 33a and the switching circuit 32 into the voltage signal Sv (predetermined processing in the present invention). Next, the A / D conversion unit 6 performs analog / digital conversion on the voltage signal Sv amplified by the amplifier 5 and outputs voltage data Dv, and the control unit 9 calculates a voltage value Vd based on the voltage data Dv. To be stored in the storage unit 10. Subsequently, the control unit 9 controls the switching circuit 32 to sequentially switch the switch 32a that shifts to the on state or the off state, and also controls the moving mechanism 3 to move the probe 11a while moving all the probes in the flexible substrate 100. The voltage value Vd for the conductor pattern 102 is calculated and stored.

  Next, the control unit 9 executes the pass / fail determination process for the conductor pattern 102 to store the pass / fail determination result for each conductor pattern 102 in the storage unit 10 and to display the determination result on the display unit 8. Thereby, the inspection of the conductor pattern 102 of the flexible substrate 100 is completed.

  As described above, according to the circuit board inspection apparatus 1b, since the probe apparatus 2a having the probe 11a provided with the floating electrode 23 is provided, the directivity of the probe 11a is sufficiently improved. The signal Se can be supplied concentratedly in a narrow range. Therefore, according to the circuit board inspection apparatus 1b, a sufficiently high level of the inspection signal Se can be supplied to the conductor pattern 102 to be inspected. In addition, since the directivity of the probe 11a is sufficiently improved, the influence of the inspection signal Se being supplied to another conductor pattern 102 adjacent to the conductor pattern 102 to be inspected can be suppressed sufficiently low. .

  Next, the configuration of the circuit board inspection apparatus 1c shown in FIG. 10 will be described with reference to the drawings. The circuit board inspection apparatus 1c is another example of the inspection apparatus according to the present invention, and is configured to be able to perform a predetermined electrical inspection on the flexible substrate 500 described above, for example. Specifically, the circuit board inspection apparatus 1c includes a probe device 2a, a moving mechanism 3, an amplifier 5, an A / D conversion unit 6, an operation unit 7, a display unit 8, a control unit 9, and a storage as shown in FIG. The unit 10 includes the I / V conversion circuit 12, the electrode plate 34, and the mounting table 50 (see FIG. 3). In this case, in this circuit board inspection apparatus 1c, in a state where the electrode plate 34 is brought close to one end portion 502a of each conductor pattern 502 in the flexible substrate 500, the electrode plate 34 receives the inspection signal Se for each conductor pattern 502. A current signal Si flowing through the electrostatic capacitance between the electrode plate 34 and each of the one end portions 502a with the supply is detected.

  When inspecting the quality of the conductor pattern 502 of the flexible substrate 500 using the circuit board inspection device 1c, first, the flexible substrate 500 is mounted on the mounting table 50 and fixed. Next, as shown in FIG. 10, the electrode plate 34 is brought close to one end portion 502 a of each conductor pattern 502. Subsequently, the moving mechanism 3 moves the probe so that the tip of the supply electrode 21a is close to the other end 502b of one of the conductor patterns 502 (for example, the leftmost conductor pattern 502 in the figure). 11a is moved.

  At this time, the inspection signal Se output from the power supply unit 31 is supplied to each conductor pattern 502 via the capacitance between the supply electrode 21a of the probe 11a and the other end 502b. In this case, since the probe 11a is provided with the floating electrode 23, a sufficiently high level of the inspection signal Se is supplied to the conductor pattern 502 to be inspected in the same manner as the circuit board inspection apparatus 1b. The supply of the inspection signal Se to other conductor patterns 502 adjacent to the conductor pattern 502 to be inspected can be suppressed to a low level.

  Next, the electrode plate 34 detects the current signal Si flowing through the capacitance between the electrode plate 34 and each one end portion 502a as the inspection signal Se is supplied to the conductor pattern 502, and performs I / V conversion. The circuit 12 converts the current signal Si into a voltage signal Sv. Subsequently, the A / D conversion unit 6 performs analog / digital conversion on the voltage signal Sv amplified by the amplifier 5 and outputs voltage data Dv, and the control unit 9 calculates the voltage value Vd based on the voltage data Dv. And stored in the storage unit 10. Next, the control unit 9 calculates and stores the voltage values Vd for all the conductor patterns 502 in the flexible substrate 500 while controlling the moving mechanism 3 to move the probe 11a.

  Next, the control unit 9 executes a pass / fail determination process for the conductor pattern 502, stores the pass / fail determination result for each conductor pattern 502 in the storage unit 10, and causes the display unit 8 to display the determination result. Thereby, the inspection of the conductor pattern 502 of the flexible substrate 500 is completed. In this case, in the circuit board inspection apparatus 1c, as described above, the electrode plate 34 is brought close to the one end portion 502a of each conductor pattern 502 in the flexible substrate 500, whereby the electrode plate 34 is supplied with the supply of the inspection signal Se. It is possible to detect the current signal Si flowing through the electrostatic capacitance between the first end portion 502a and each end portion 502a. For this reason, like the flexible substrate 500, the pitch of the one end portions 502a of the conductor pattern 502 is extremely narrow, and it is difficult to individually contact the signal inspection probes 33a (see FIG. 9) with each one end portion 502a. Even in this case, the current signal Si can be reliably detected.

  As described above, according to the circuit board inspection apparatus 1c, the I / V conversion circuit 12 generates the electrostatic capacitance between the electrode plate 34 brought close to the one end portion 502a of each conductor pattern 502 and each one end portion 502a. By converting the current signal Si detected by the electrode plate 34 to the voltage signal Sv, the pitch of the one end portion 502a of the conductor pattern 502 is extremely narrow, and the signal supply probe 33 is individually connected to each one end portion 502a. Even when it is difficult to make contact, or when it is difficult to detect the current signal Si by the probe 11, the current signal Si can be reliably detected.

  Next, the configuration of the circuit board inspection apparatus 1d shown in FIG. 11 will be described with reference to the drawings. The circuit board inspection apparatus 1d is another example of the inspection apparatus according to the present invention, and is configured to be able to perform a predetermined electrical inspection on the flexible board 600 shown in FIG. Here, the flexible substrate 600 is another example of the inspection object in the present invention. As shown in the figure, the flexible substrate 600 has a plurality of conductor patterns 602a, 602b, 602c (hereinafter referred to as “conductor” when not distinguished from each other). A pattern 602 ”) is provided on the substrate body 601.

  On the other hand, as shown in FIG. 11, the circuit board inspection apparatus 1d includes probe devices 2 and 2a, a pair of moving mechanisms 3a and 3b, an amplifier 5, an A / D conversion unit 6, an operation unit 7, a display unit 8, and a control unit. 9, the memory | storage part 10 and the mounting base 50 (refer FIG. 3) are comprised. In this case, the moving mechanism 3a moves the probe device 2 (probe 11) in an arbitrary direction, and the moving mechanism 3b moves the probe 11a of the probe device 2a in an arbitrary direction.

  When inspecting the quality of the conductor pattern 602 of the flexible board 600 using the circuit board inspection apparatus 1d, first, the flexible board 600 is mounted on the mounting table 50 and fixed. Next, for example, the moving mechanism 3a moves the probe device 2 so that the tip of the probe 11 is close to one end 603 of the conductor pattern 602a, and the tip of the supply electrode 21a is the other end 604 of the conductor pattern 602a. The moving mechanism 3b moves the probe 11a so that the probe 11a approaches. At this time, the inspection signal Se output from the power supply unit 31 is supplied to the conductor pattern 602a via the capacitance between the supply electrode 21a of the probe 11a and the other end 604.

  In this case, in this circuit board inspection apparatus 1d, the moving mechanisms 3a and 3b move the probe apparatus 2 and the probe 11a in arbitrary directions, respectively. Therefore, like the flexible board 600, the shapes of the conductor patterns 602 are different from each other. Even in the case where the conductor pattern 602 is randomly arranged, the probes 11 and 11a can be reliably brought close to the one end 603 and the other end 604 of the conductor pattern 602, respectively. Further, in this circuit board inspection apparatus 1d, both the supply of the inspection signal Se and the detection of the current signal Si can be performed in a non-contact manner using the probes 11 and 11a, so that the conductor pattern 602 is surely damaged. It is possible to prevent it.

  Subsequently, the I / V conversion circuit 12 of the probe device 2 converts the current signal Si detected by the probe 11 into a voltage signal Sv. Next, the A / D conversion unit 6 performs analog / digital conversion on the voltage signal Sv amplified by the amplifier 5 and outputs voltage data Dv, and the control unit 9 calculates a voltage value Vd based on the voltage data Dv. To be stored in the storage unit 10. Next, the control unit 9 calculates and stores the voltage values Vd for all the conductor patterns 602 in the flexible substrate 600 while moving the probes 11 and 11a by controlling the moving mechanisms 3a and 3b.

  Next, the control unit 9 executes a pass / fail determination process for the conductor pattern 602, stores the pass / fail determination result for each conductor pattern 602 in the storage unit 10, and causes the display unit 8 to display the determination result. Thereby, the inspection of the conductor pattern 602 of the flexible substrate 600 is completed. In this case, for example, the probe 11 is brought close to one end 603 or the other end 604 in one of the pair of adjacent conductor patterns 602, and the probe 11a is brought close to the one end 603 or the other end 604 in the other conductor pattern 602. By calculating the voltage value Vd, it is possible to inspect a short circuit between the adjacent conductor patterns 602.

  As described above, according to the circuit board inspection apparatus 1d, since the probe apparatuses 2 and 2a are provided, both the supply of the inspection signal Se and the detection of the current signal Si can be performed without contact using the probes 11 and 11a. It can be carried out. For this reason, unlike the configuration in which the contact probe is in direct contact with the conductor pattern 602, the conductor pattern 602 can be reliably prevented from being damaged by the contact of the probe.

  In addition, this invention is not limited to said structure. For example, although an example in which the present invention is applied to the cylindrical probes 11 and 11a has been described above, the present invention can also be applied to a plate-like probe 211 as shown in FIG. As shown in the figure, the probe 211 includes a substrate (insulating substrate) 212 made of an insulating material, and a detection electrode 221, a floating electrode 223, and a shield electrode provided (formed) on the substrate 212. 225 is provided.

  The detection electrode 221 is formed in a thin plate shape, and is provided at a central portion on the substrate 212. The floating electrode 223 corresponds to the intermediate electrode in the present invention, is formed in a frame shape, and is provided on the substrate 212 so as to surround the detection electrode 221 in a non-contact state with respect to the detection electrode 221. It has been. In this case, the portion 222 between the detection electrode 221 and the floating electrode 223 in the substrate 212 functions as an insulator in the same manner as the first insulator 22 described above. The shield electrode 225 is formed in a frame shape and is provided on the substrate 212 so as to surround the floating electrode 223 in a non-contact state with respect to the floating electrode 223. In this case, the portion 224 between the floating electrode 223 and the shield electrode 225 in the substrate 212 functions as an insulator in the same manner as the second insulator 24 described above. Also in the probe 211, the same effect as that of the probe 11 can be realized by providing the floating electrode 223 with the substrate 212 as an insulator sandwiched between the detection electrode 221 and the shield electrode 225. Further, according to the probe 211, the production cost of the probe 211 can be sufficiently reduced by the simple structure.

  Further, a probe 211a (see FIG. 7) that is configured in the same manner as the probe 211 and in which the detection electrode 221 functions as the supply electrode 221a for supplying the inspection signal Se can be employed. In this probe 211a, the same effect as that of the probe 11a can be realized, and the manufacturing cost can be sufficiently reduced by the simple structure.

  In addition, although the example in which the first insulator 22 and the second insulator 24 are formed of expandable polyethylene has been described above, other insulating materials can be used instead of the expandable polyethylene. Furthermore, although it mentioned above about the example which test | inspects the flexible substrate 100,500,600 as a test object, as a test object, it is not limited to this, For bare board, a hard substrate, the glass substrate for organic EL, and a flat panel display Of course, the circuit board inspection apparatuses 1 and 1a to 1d can be used for inspection of an arbitrary substrate such as a glass substrate (for liquid crystal). Further, in the circuit board inspection apparatuses 1 and 1b described above, the magnitude of the current signal Si flowing through each switch 32a is measured, and a short circuit between the conductor patterns 102 is inspected based on the measured value of the current signal Si. It is also possible to add a function to

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. It is a perspective view which shows the structure of the probes 11 and 11a. It is explanatory drawing for demonstrating the test | inspection method using the circuit board test | inspection apparatus. It is another explanatory drawing for demonstrating the electrical property of the probes 11 and 11a. 4 is an explanatory diagram for explaining electrical characteristics of a probe 311. FIG. 4 is an explanatory diagram for explaining electrical characteristics of a probe 411. FIG. It is a perspective view which shows the structure of the probes 211 and 211a. It is a block diagram which shows the structure of the circuit board inspection apparatus 1a. It is a block diagram which shows the structure of the circuit board inspection apparatus 1b. It is a block diagram which shows the structure of the circuit board inspection apparatus 1c. It is a block diagram which shows the structure of the circuit board inspection apparatus 1d.

Explanation of symbols

1, 1a, 1b, 1c, 1d, circuit board inspection device 2, 2a probe device 3, 3a, 3b moving mechanism 4, 4a inspection signal supply unit 9 control unit 11, 11a, 211, 211a probe 12 I / V conversion Circuits 21 and 221 Detection electrodes 21a and 221a Supply electrodes 22 First insulators 23 and 223 Floating electrodes 24 Second insulators 25 and 225 Shield electrodes 31 Power supply portions 34 Electrode plates 100, 500, 600 Flexible substrates 102, 502, 602a, 602b, 602c Conductor pattern 102a, 502a, 603 One end 102b, 502b, 604 The other end 212 Substrate 222,224 Part Se Inspection signal Si Current signal Sv Voltage signal

Claims (16)

Detection for detecting an electrical signal flowing through a capacitance between the inspection pattern and the conductor pattern when the inspection signal is supplied in proximity to the conductor pattern of the inspection object to which the inspection signal is supplied A probe provided with an electrode for use and a shield electrode provided with an insulator around the detection electrode,
A probe in which an intermediate electrode maintained in a floating state is provided between the detection electrode and the shield electrode with an insulator interposed therebetween. The detection electrode is formed in a columnar shape,
The intermediate electrode is formed in a cylindrical shape and surrounds the detection electrode,
The probe according to claim 1, wherein the shield electrode is formed in a cylindrical shape and surrounds the intermediate electrode. The detection electrode is formed in a thin plate shape and provided on a substrate,
The intermediate electrode is formed on the substrate so as to be formed in a frame shape and surround the detection electrode in a non-contact state with the detection electrode,
The probe according to claim 1, wherein the shield electrode is formed in a frame shape and is provided on the substrate so as to surround the intermediate electrode in a non-contact state with the intermediate electrode.   The probe according to any one of claims 1 to 3, wherein the insulator is made of foamable polyethylene. Provided with a supply electrode for supplying a signal for inspection via a capacitance between the conductor pattern and a conductor pattern of the inspection object, with an insulator around the supply electrode A probe having a shield electrode formed thereon,
A probe in which an intermediate electrode maintained in a floating state is provided between the supply electrode and the shield electrode with an insulator interposed therebetween. The supply electrode is formed in a columnar shape,
The intermediate electrode is formed in a cylindrical shape and is provided so as to surround the supply electrode,
The probe according to claim 5, wherein the shield electrode is formed in a cylindrical shape and surrounds the intermediate electrode. The supply electrode is formed in a thin plate shape and provided on a substrate,
The intermediate electrode is formed on the substrate so as to surround the supply electrode in a non-contact state with the supply electrode while being formed in a frame shape,
The probe according to claim 5, wherein the shield electrode is formed in a frame shape and is provided on the substrate so as to surround the intermediate electrode in a non-contact state with the intermediate electrode.   The probe according to claim 5, wherein the insulator is made of foamable polyethylene.   A probe device for signal detection, comprising: the probe according to any one of claims 1 to 4; and a processing circuit that performs predetermined processing on the electrical signal detected by the probe.   9. A probe device for signal supply, comprising: the probe according to claim 5; and a test signal output unit that outputs the test signal to the probe.   The signal detection probe device according to claim 9, an inspection signal supply unit that supplies an inspection signal to a conductor pattern of an inspection object, and a processing signal processed by the processing circuit of the signal detection probe device And an inspection unit for inspecting the conductor pattern based on the above. An electrode plate configured to be proximate to one end of each of the plurality of conductor patterns,
The inspection signal supply unit supplies the inspection signal to each conductor pattern via an electrostatic capacitance between the electrode plate and the one end that is brought close to the one end. The inspection device described.   A probe device for signal supply according to claim 10, and a processing circuit for executing a predetermined process on an electric signal flowing through the conductor pattern in accordance with the supply of the inspection signal by the probe device for signal supply, An inspection apparatus comprising: an inspection unit that performs inspection of the conductor pattern based on a processing signal processed by the processing circuit. An electrode plate configured to be proximate to one end of each of the plurality of conductor patterns,
The processing circuit performs the predetermined processing on the electrical signal detected by the electrode plate via a capacitance between the electrode plate and the one end portion that are brought close to the one end portion. The inspection apparatus according to claim 13 to be executed.   The signal detection probe device according to claim 9, the signal supply probe device according to claim 10, and the signal detection flow that flows along with the supply of the inspection signal from the signal supply probe device An inspection apparatus comprising: an inspection unit that performs an inspection of the conductor pattern based on a processing signal processed by the probe apparatus.   The moving mechanism which can move the said probe to arbitrary directions, and the control part which controls the said moving mechanism and makes the front-end | tip part of the said probe adjoin to the said conductor pattern are provided in any one of Claim 11 to 15 Inspection equipment.

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