JP4847704B2 - Curable resin composition - Google Patents
Curable resin composition Download PDFInfo
- Publication number
- JP4847704B2 JP4847704B2 JP2005036718A JP2005036718A JP4847704B2 JP 4847704 B2 JP4847704 B2 JP 4847704B2 JP 2005036718 A JP2005036718 A JP 2005036718A JP 2005036718 A JP2005036718 A JP 2005036718A JP 4847704 B2 JP4847704 B2 JP 4847704B2
- Authority
- JP
- Japan
- Prior art keywords
- curable resin
- resin composition
- boron trifluoride
- group
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims description 37
- 229920005989 resin Polymers 0.000 claims description 80
- 239000011347 resin Substances 0.000 claims description 80
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 38
- 150000001875 compounds Chemical class 0.000 claims description 26
- 229910015900 BF3 Inorganic materials 0.000 claims description 19
- 150000001412 amines Chemical class 0.000 claims description 17
- DBIWHDFLQHGOCS-UHFFFAOYSA-N piperidine;trifluoroborane Chemical compound FB(F)F.C1CCNCC1 DBIWHDFLQHGOCS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- 125000005103 alkyl silyl group Chemical group 0.000 claims description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 2
- -1 trimethoxysilyl group Chemical group 0.000 description 44
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 33
- 239000003054 catalyst Substances 0.000 description 28
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 18
- 239000000945 filler Substances 0.000 description 18
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 17
- 239000000243 solution Substances 0.000 description 13
- 239000002841 Lewis acid Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 150000007517 lewis acids Chemical class 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 239000012299 nitrogen atmosphere Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 229920001451 polypropylene glycol Polymers 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000008030 elimination Effects 0.000 description 4
- 238000003379 elimination reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 150000003606 tin compounds Chemical class 0.000 description 4
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 3
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 description 3
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 3
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- OEBXWWBYZJNKRK-UHFFFAOYSA-N 1-methyl-2,3,4,6,7,8-hexahydropyrimido[1,2-a]pyrimidine Chemical compound C1CCN=C2N(C)CCCN21 OEBXWWBYZJNKRK-UHFFFAOYSA-N 0.000 description 2
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- GHKSKVKCKMGRDU-UHFFFAOYSA-N 2-(3-aminopropylamino)ethanol Chemical group NCCCNCCO GHKSKVKCKMGRDU-UHFFFAOYSA-N 0.000 description 2
- GQWWGRUJOCIUKI-UHFFFAOYSA-N 2-[3-(2-methyl-1-oxopyrrolo[1,2-a]pyrazin-3-yl)propyl]guanidine Chemical compound O=C1N(C)C(CCCN=C(N)N)=CN2C=CC=C21 GQWWGRUJOCIUKI-UHFFFAOYSA-N 0.000 description 2
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- OTBHHUPVCYLGQO-UHFFFAOYSA-N bis(3-aminopropyl)amine Chemical compound NCCCNCCCN OTBHHUPVCYLGQO-UHFFFAOYSA-N 0.000 description 2
- 150000001622 bismuth compounds Chemical class 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- XMMDVXFQGOEOKH-UHFFFAOYSA-N n'-dodecylpropane-1,3-diamine Chemical group CCCCCCCCCCCCNCCCN XMMDVXFQGOEOKH-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- RHPBLLCTOLJFPH-UHFFFAOYSA-N piperidin-2-ylmethanamine Chemical compound NCC1CCCCN1 RHPBLLCTOLJFPH-UHFFFAOYSA-N 0.000 description 2
- LTEKQAPRXFBRNN-UHFFFAOYSA-N piperidin-4-ylmethanamine Chemical compound NCC1CCNCC1 LTEKQAPRXFBRNN-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- HZXJVDYQRYYYOR-UHFFFAOYSA-K scandium(iii) trifluoromethanesulfonate Chemical compound [Sc+3].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F HZXJVDYQRYYYOR-UHFFFAOYSA-K 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- JPJIEXKLJOWQQK-UHFFFAOYSA-K trifluoromethanesulfonate;yttrium(3+) Chemical compound [Y+3].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F JPJIEXKLJOWQQK-UHFFFAOYSA-K 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- NSMWYRLQHIXVAP-WDSKDSINSA-N (2s,5s)-2,5-dimethylpiperazine Chemical compound C[C@H]1CN[C@@H](C)CN1 NSMWYRLQHIXVAP-WDSKDSINSA-N 0.000 description 1
- IFNWESYYDINUHV-OLQVQODUSA-N (2s,6r)-2,6-dimethylpiperazine Chemical compound C[C@H]1CNC[C@@H](C)N1 IFNWESYYDINUHV-OLQVQODUSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- XULIXFLCVXWHRF-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidine Chemical compound CN1C(C)(C)CCCC1(C)C XULIXFLCVXWHRF-UHFFFAOYSA-N 0.000 description 1
- OPNUROKCUBTKLF-UHFFFAOYSA-N 1,2-bis(2-methylphenyl)guanidine Chemical compound CC1=CC=CC=C1N\C(N)=N\C1=CC=CC=C1C OPNUROKCUBTKLF-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- FQUYSHZXSKYCSY-UHFFFAOYSA-N 1,4-diazepane Chemical compound C1CNCCNC1 FQUYSHZXSKYCSY-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- SQZCAOHYQSOZCE-UHFFFAOYSA-N 1-(diaminomethylidene)-2-(2-methylphenyl)guanidine Chemical group CC1=CC=CC=C1N=C(N)N=C(N)N SQZCAOHYQSOZCE-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- HDYFAPRLDWYIBU-UHFFFAOYSA-N 1-silylprop-2-en-1-one Chemical class [SiH3]C(=O)C=C HDYFAPRLDWYIBU-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- JOMNTHCQHJPVAZ-UHFFFAOYSA-N 2-methylpiperazine Chemical compound CC1CNCCN1 JOMNTHCQHJPVAZ-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- KRPRVQWGKLEFKN-UHFFFAOYSA-N 3-(3-aminopropoxy)propan-1-amine Chemical compound NCCCOCCCN KRPRVQWGKLEFKN-UHFFFAOYSA-N 0.000 description 1
- ANOPCGQVRXJHHD-UHFFFAOYSA-N 3-[3-(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]propan-1-amine Chemical compound C1OC(CCCN)OCC21COC(CCCN)OC2 ANOPCGQVRXJHHD-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- UVLSCMIEPPWCHZ-UHFFFAOYSA-N 3-piperazin-1-ylpropan-1-amine Chemical group NCCCN1CCNCC1 UVLSCMIEPPWCHZ-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- OMNVECQLILUEFL-UHFFFAOYSA-N 4-(3-aminopropyl)aniline Chemical compound NCCCC1=CC=C(N)C=C1 OMNVECQLILUEFL-UHFFFAOYSA-N 0.000 description 1
- OXEZLYIDQPBCBB-UHFFFAOYSA-N 4-(3-piperidin-4-ylpropyl)piperidine Chemical compound C1CNCCC1CCCC1CCNCC1 OXEZLYIDQPBCBB-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- CBEVWPCAHIAUOD-UHFFFAOYSA-N 4-[(4-amino-3-ethylphenyl)methyl]-2-ethylaniline Chemical compound C1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=CC=2)=C1 CBEVWPCAHIAUOD-UHFFFAOYSA-N 0.000 description 1
- RIUXWEGBWYUUEF-UHFFFAOYSA-N 4-bromo-2-cyclopropyl-1h-pyrrolo[2,3-b]pyridine Chemical group C=1C=2C(Br)=CC=NC=2NC=1C1CC1 RIUXWEGBWYUUEF-UHFFFAOYSA-N 0.000 description 1
- DUZLHGMYNVZMCO-UHFFFAOYSA-N 6-[2-[3-[2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCC2OCC3(CO2)COC(CCC=2N=C(N)N=C(N)N=2)OC3)=N1 DUZLHGMYNVZMCO-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- AMRPLQKEXNYDGZ-UHFFFAOYSA-N N'-[2-[diethoxy(2-phenylethyl)silyl]oxypropyl]ethane-1,2-diamine Chemical compound NCCNCC(C)O[Si](OCC)(OCC)CCC1=CC=CC=C1 AMRPLQKEXNYDGZ-UHFFFAOYSA-N 0.000 description 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
- FCSHMCFRCYZTRQ-UHFFFAOYSA-N N,N'-diphenylthiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=CC=CC=C1 FCSHMCFRCYZTRQ-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- LINDOXZENKYESA-UHFFFAOYSA-N TMG Natural products CNC(N)=NC LINDOXZENKYESA-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- UGJVZXBXVRMUSG-UHFFFAOYSA-K [B+3].[F-].[F-].[F-] Chemical compound [B+3].[F-].[F-].[F-] UGJVZXBXVRMUSG-UHFFFAOYSA-K 0.000 description 1
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical class [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical group NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- ULEAQRIQMIQDPJ-UHFFFAOYSA-N butane-1,2-diamine Chemical compound CCC(N)CN ULEAQRIQMIQDPJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- UURSXESKOOOTOV-UHFFFAOYSA-N dec-5-ene Chemical compound CCCCC=CCCCC UURSXESKOOOTOV-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 150000005673 monoalkenes Chemical class 0.000 description 1
- VLVOIQGDDTVQOB-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)hexane-1,6-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCCCCCN VLVOIQGDDTVQOB-UHFFFAOYSA-N 0.000 description 1
- SCZVXVGZMZRGRU-UHFFFAOYSA-N n'-ethylethane-1,2-diamine Chemical group CCNCCN SCZVXVGZMZRGRU-UHFFFAOYSA-N 0.000 description 1
- ODGYWRBCQWKSSH-UHFFFAOYSA-N n'-ethylpropane-1,3-diamine Chemical group CCNCCCN ODGYWRBCQWKSSH-UHFFFAOYSA-N 0.000 description 1
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical group CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 1
- KGHYGBGIWLNFAV-UHFFFAOYSA-N n,n'-ditert-butylethane-1,2-diamine Chemical compound CC(C)(C)NCCNC(C)(C)C KGHYGBGIWLNFAV-UHFFFAOYSA-N 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- HIDKSOTTZRMUML-UHFFFAOYSA-M potassium;dodecanoate Chemical group [K+].CCCCCCCCCCCC([O-])=O HIDKSOTTZRMUML-UHFFFAOYSA-M 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical group CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- NGXSWUFDCSEIOO-UHFFFAOYSA-N pyrrolidin-3-amine Chemical group NC1CCNC1 NGXSWUFDCSEIOO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- 150000008648 triflates Chemical class 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- CITILBVTAYEWKR-UHFFFAOYSA-L zinc trifluoromethanesulfonate Chemical compound [Zn+2].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F CITILBVTAYEWKR-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、硬化性樹脂組成物及びそれを成分とする湿気硬化型接着剤組成物に関する。より詳細には、特定の硬化性樹脂に、硬化性触媒として三フッ化ホウ素のアミン錯体を配合した硬化性樹脂組成物に関する。 The present invention relates to a curable resin composition and a moisture curable adhesive composition containing the same as a component. More specifically, the present invention relates to a curable resin composition in which a specific curable resin is mixed with an amine complex of boron trifluoride as a curable catalyst.
従来、湿気硬化型の硬化性樹脂として、分子内に加水分解性シリル基等の含珪素特性基を持つ硬化性樹脂、特にアルコール脱離型のアルコキシシリル基末端のものが多く用いられている。アルコール脱離型硬化性樹脂としては、分子内にトリメトキシシリル基あるいはメチルジメトキシシリル基を有するメタノール脱離型硬化性樹脂、及び、分子内にトリエトキシシリル基あるいはメチルジエトキシシリル基を有するエタノール脱離型硬化性樹脂が一般的である。 Conventionally, as a moisture curable resin, a curable resin having a silicon-containing characteristic group such as a hydrolyzable silyl group in the molecule, particularly an alcohol-eliminated alkoxysilyl group-terminated one, is often used. Alcohol detachable curable resins include methanol detachable curable resins having a trimethoxysilyl group or methyldimethoxysilyl group in the molecule, and ethanol having a triethoxysilyl group or methyldiethoxysilyl group in the molecule. A detachable curable resin is common.
これら二つの中では、環境に優しいエタノール脱離型硬化性樹脂を使用するのが好ましい。しかしながら、エタノール脱離型硬化性樹脂は、一般的な硬化触媒である有機錫化合物等の硬化触媒を用いると著しく硬化が遅いという欠点を有するため、これまでメタノール脱離型硬化性樹脂を使用せざるを得なかった。 Of these two, it is preferable to use an environmentally friendly ethanol detachable curable resin. However, since the ethanol detachable curable resin has a drawback that the curing is extremely slow when a curing catalyst such as an organic tin compound, which is a general curing catalyst, is used, a methanol detachable curable resin has been used so far. I had to.
また、エタノール脱離型硬化性樹脂を用いた際、硬化を速めるために有機錫化合物等の硬化触媒を多量に用いる方法もあるが、添加量に対する硬化速度の増大は十分でなく、さらにある程度の添加量以上になると硬化速度の増大はほとんど見られなくなる。また、有機錫化合物等の硬化触媒を多量に用いる場合、環境負荷が非常に大きいという問題を有していた。 In addition, there is a method of using a large amount of a curing catalyst such as an organic tin compound in order to accelerate curing when using an ethanol detachable curable resin, but the increase in the curing rate relative to the added amount is not sufficient, and to some extent When the amount exceeds the addition amount, almost no increase in the curing rate is observed. In addition, when a large amount of a curing catalyst such as an organic tin compound is used, there is a problem that the environmental load is very large.
本発明は、上記の諸問題を解決するためになされたものであって、その目的とするところは、エタノール脱離型硬化性樹脂を用いて、通常の一般的な硬化触媒を用いた場合におけるメタノール脱離型硬化性樹脂と同等以上の硬化速度を示す硬化性樹脂組成物を提供することにある。さらには、有機錫系触媒等の硬化触媒を使用しないことにより、環境に対する負荷が少ない硬化性樹脂組成物を提供することにある。 The present invention has been made in order to solve the above-mentioned problems, and its object is to use an ethanol detachable curable resin and a normal general curing catalyst. An object of the present invention is to provide a curable resin composition that exhibits a curing rate equal to or higher than that of a methanol detachable curable resin. Furthermore, it is providing the curable resin composition with little load with respect to an environment by not using curing catalysts, such as an organotin type catalyst.
上記の目的を達成するために、本発明者らは鋭意研究した結果、特定の硬化触媒を用いた場合に、エタノール脱離型反応性シリル基を有する硬化性樹脂を用いても硬化が非常に速いことを見出し、本発明を完成するに至った。本発明は次の第1〜3の発明から構成される。 In order to achieve the above object, the present inventors have conducted intensive research. As a result, when a specific curing catalyst is used, the curing is very difficult even when a curable resin having an ethanol elimination reactive silyl group is used. We found it fast and completed the present invention. The present invention is composed of the following first to third inventions.
すなわち、第1の発明は、分子内にジエトキシアルキルシリル基を含有し、硫黄原子を含有する結合を含有しない、数平均分子量が1,000〜150,000である硬化性樹脂(A)と、三フッ化ホウ素のアミン錯体である一種以上の化合物とを含有してなる硬化性樹脂組成物であって、上記硬化性樹脂(A)100質量部当り、三フッ化ホウ素のアミン錯体を0.001〜10質量部含有することを特徴とする硬化性樹脂組成物である。 That is, the first invention contains diethoxy alkylsilyl group in the molecule, and does not contain a bond containing a sulfur atom, and the number average molecular weight of 1,000 to 150,000 curable resin (A) , a curable resin composition comprising a compound or compounds is an amine complex of boron trifluoride, the curable resin (a) 100 parts by mass of per amine complex of boron trifluoride 0 It is a curable resin composition characterized by containing 0.001-10 mass parts .
第2の発明は、上記硬化性樹脂(A)の主鎖骨格がポリオキシアルキレンであることを特徴とする第1の発明の硬化性樹脂組成物である。 The second invention is the curable resin composition of the first invention, wherein the main chain skeleton of the curable resin (A) is polyoxyalkylene .
第3の発明は、上記三フッ化ホウ素のアミン錯体である一種以上の化合物が、三フッ化ホウ素モノエチルアミン錯体及び/又は三フッ化ホウ素ピペリジン錯体であることを特徴とする第1又は2のいずれかの発明の硬化性樹脂組成物である。 According to a third aspect of the invention , the one or more compounds that are an amine complex of boron trifluoride are a boron trifluoride monoethylamine complex and / or a boron trifluoride piperidine complex . It is a curable resin composition of any invention.
本発明に係る硬化性樹脂組成物は、分子内にエタノール脱離型反応性シリル基であるジエトキシアルキルシリル基を有する特定構造の硬化性樹脂(A)、三フッ化ホウ素のアミン錯体である一種以上の化合物を特定の割合で含有してなる硬化性樹脂組成物であるので、環境に非常に優しく、かつ、硬化が速い。 The curable resin composition according to the present invention is a curable resin (A) having a specific structure having a diethoxyalkylsilyl group which is an ethanol elimination reactive silyl group in the molecule, and an amine complex of boron trifluoride. Since it is a curable resin composition containing one or more compounds at a specific ratio, it is very environmentally friendly and cures quickly.
エタノール脱離型反応性シリル基を有する硬化性樹脂(A)は、硬化時の加水分解反応によって生成する化合物がエタノールであるため、メタノール脱離型硬化性樹脂と比較して環境負荷が非常に小さい。 In the curable resin (A) having an ethanol detachable reactive silyl group, since the compound produced by the hydrolysis reaction at the time of curing is ethanol, the environmental load is much higher than that of the methanol detachable curable resin. small.
ルイス酸及びその誘導体から選ばれる一種以上の化合物(B)は、加熱硬化性のエポキシ樹脂の硬化触媒として著名であるが、エタノール脱離型反応性シリル基との協働作用により硬化性を相乗効果的に高めることは、本発明者が見いだした知見であり、非公知である。硬化性が相乗効果的に高められる理由としては、例えば、ルイス酸誘導体として三フッ化ホウ素ピペリジン錯体を例に挙げると、三フッ化ホウ素ピペリジン錯体が上記エタノール脱離型反応性シリル基と相互作用することによって、エタノール脱離型反応性シリル基中のエトキシ基の脱離能が高まり、その結果として、シリル基同士のカップリング反応が促進されるということが推察される。 One or more compounds (B) selected from Lewis acids and their derivatives are prominent as curing catalysts for heat-curable epoxy resins, but synergistically cure with ethanol-eliminated reactive silyl groups. Increasing effectively is a finding found by the present inventor and is not known. The reason why the curability is synergistically enhanced is, for example, when boron trifluoride piperidine complex is exemplified as a Lewis acid derivative, and boron trifluoride piperidine complex interacts with the above ethanol-elimination-type reactive silyl group. By doing so, it is speculated that the elimination ability of the ethoxy group in the ethanol elimination type reactive silyl group is enhanced, and as a result, the coupling reaction between the silyl groups is promoted.
1.硬化性樹脂(A)について
本発明の組成物の一成分である硬化性樹脂(A)は、分子内に、エタノール脱離型反応性シリル基であるジエトキシアルキルシリル基を有する硬化性樹脂である。エタノール脱離型反応性シリル基とは、触媒等の効果によりシリル基がカップリング反応を起こす際に脱離してくる化合物がエタノールである加水分解性シリル基のことであり、具体的には、下記一般式(1)で示される基である。このようなエタノール脱離型反応性シリル基含有硬化性樹脂は、硬化に伴い生成して揮散する化合物がエタノールであり、一般的に使用されるメタノール脱離型反応性シリル基含有硬化性樹脂と比較して、圧倒的に環境負荷が小さい。
1. About curable resin (A) The curable resin (A) which is one component of the composition of the present invention is a curable resin having a diethoxyalkylsilyl group which is an ethanol-elimination-type reactive silyl group in the molecule. is there. The ethanol-eliminated reactive silyl group is a hydrolyzable silyl group in which the compound that is eliminated when the silyl group undergoes a coupling reaction due to the effect of a catalyst or the like is ethanol. Specifically, is shown Ru group by the following general formula (1). Such an ethanol-elimination-type reactive silyl group-containing curable resin is a compound that is generated and volatilized upon curing, and is a commonly used methanol-elimination-type reactive silyl group-containing curable resin. In comparison, the environmental impact is overwhelmingly small.
但し、Xはエトキシ基を、R1は炭素数1〜20個のアルキル基を、nは1を、それぞれ示す。 X represents an ethoxy group, R 1 represents an alkyl group having 1 to 20 carbon atoms, and n represents 1 .
上記硬化性樹脂(A)の主鎖骨格は特に限定されず、要求される性能・用途等に応じて適宜選択し得る。主鎖骨格について、一例を挙げれば、ポリオキシアルキレン、飽和炭化水素系重合体、ビニル重合体(例えば、(メタ)アクリル酸エステルモノマー共重合体)、ポリチオール、ポリエステル、オルガノポリシロキサン及びポリカーボネート等がある。これらのうち、好ましくは、ポリオキシアルキレン、飽和炭化水素系重合体及びビニル重合体であり、さらに好ましくは、ポリオキシアルキレン及びビニル重合体である。また、これら主鎖骨格へのエタノール脱離型反応性シリル基の導入方法としては、ヒドロシラン化合物を用いたヒドロシリル化反応が使用できる。以下、これらの硬化性樹脂の製造方法について例示する。 The main chain skeleton of the curable resin (A) is not particularly limited, and may be appropriately selected according to required performance and use. Examples of the main chain skeleton include polyoxyalkylene, saturated hydrocarbon polymer, vinyl polymer (for example, (meth) acrylic acid ester monomer copolymer), polythiol, polyester, organopolysiloxane, and polycarbonate. is there. Of these, polyoxyalkylene, saturated hydrocarbon polymer and vinyl polymer are preferable, and polyoxyalkylene and vinyl polymer are more preferable. As the method of introducing ethanol detachable reactive silyl groups to these backbone skeleton, you can use the hydrosilylation reaction with hydrosilane compounds. Hereinafter, it illustrates the preparation method of these curable resin.
主鎖骨格がポリオキシアルキレン重合体である上記硬化性樹脂(A)としては、特開昭55−137129号公報、特開平5−59267号公報等に記載されるような硬化性樹脂がある。主鎖骨格であるポリオキシアルキレン重合体としては、具体的にはポリオキシエチレン、ポリオキシプロピレン、ポリオキシブチレン、ポリオキシヘキシレン、ポリオキシテトラメチレン等の共重合物が挙げられる。これらのうち、特に好ましいものは、ポリオキシプロピレン共重合体である。 Examples of the curable resin (A) whose main chain skeleton is a polyoxyalkylene polymer include curable resins described in JP-A Nos. 55-137129 and 5-59267. Specific examples of the polyoxyalkylene polymer as the main chain skeleton include copolymers such as polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxyhexylene, and polyoxytetramethylene. Among these, a polyoxypropylene copolymer is particularly preferable.
主鎖骨格が炭化水素系重合体である上記硬化性樹脂(A)としては、特開昭64−22904号公報等に記載されるような硬化性樹脂がある。主鎖骨格である炭化水素系重合体としては、エチレン、プロピレン、1−ブテン、イソブテン、1−ヘキセン等の炭素数1〜6個のモノオレフィンを主モノマーとした重合体、ブタジエン、イソプレン等のジオレフィンの単独重合体、これらジオレフィンと上記モノオレフィンとの共重合体の水素添加物等が挙げられる。これらの炭化水素系重合体の中でも、イソブテンを主モノマーとした重合体、ブタジエン重合体の水素添加物は、末端への官能基の導入や分子量の調節がし易く、又、末端官能基の数を多くすることができるので好ましい。 Examples of the curable resin (A) whose main chain skeleton is a hydrocarbon-based polymer include curable resins as described in JP-A No. 64-22904. Examples of the hydrocarbon polymer as the main chain skeleton include polymers having 1 to 6 carbon monoolefins such as ethylene, propylene, 1-butene, isobutene and 1-hexene as main monomers, butadiene, isoprene and the like. Examples include homopolymers of diolefins, hydrogenated products of copolymers of these diolefins and the above monoolefins, and the like. Among these hydrocarbon polymers, polymers with isobutene as the main monomer and hydrogenated products of butadiene polymers are easy to introduce functional groups at the terminals and adjust the molecular weight. Can be increased, which is preferable.
主鎖骨格がビニル重合体である上記硬化性樹脂(A)としては、分子内に少なくとも1個の重合性アルケニル基を有する化合物の重合体が挙げられる。分子内に少なくとも1個の重合性アルケニル基を有する化合物を重合してビニル重合体の主鎖骨格とする反応は、従来公知の反応・手法が用いられる。これらのビニル重合体の中でも、(メタ)アクリル酸エステルモノマーの共重合体が、特に好ましい。さらに、本発明に記載の硬化性樹脂(A)及び/又は他の硬化性化合物の存在下で行ってもよい。 Examples of the curable resin (A) whose main chain skeleton is a vinyl polymer include a polymer of a compound having at least one polymerizable alkenyl group in the molecule. For the reaction of polymerizing a compound having at least one polymerizable alkenyl group in the molecule to form the main chain skeleton of the vinyl polymer, conventionally known reactions and methods are used. Among these vinyl polymers, a copolymer of (meth) acrylic acid ester monomers is particularly preferable. Furthermore, you may carry out in presence of curable resin (A) and / or another curable compound as described in this invention.
また、本発明に好適に用いられる硬化性樹脂(A)には、分子内に極性要素部分が含有される硬化性樹脂も含まれる。ここで、極性要素部分とは、ウレタン結合、尿素結合、置換尿素結合、アミド結合、ヒドロキシル基、第一級アミノ基、第二級アミノ基及び第三級アミノ基等の酸素原子、窒素原子を含有する結合又は官能基等を指すが、硫黄原子を含有する結合は含まれない。上記硬化性樹脂(A)の分子内に上記極性要素部分が含有される場合には、硬化がさらに促進され好ましい。 Further, the curable resin (A) suitably used in the present invention includes a curable resin containing a polar element portion in the molecule. Here, the polar component parts, a urethane bond, urea bond, location換尿containing bond, A bromide binding, human Dorokishiru group, primary amino group, secondary amino group and a tertiary oxygen atom or an amino group , refers to binding or functional group containing ChissoHara child, it does not include binding containing a sulfur atom. When the polar element part is contained in the molecule of the curable resin (A), curing is further promoted, which is preferable.
また、これらの極性要素部分の中では、ウレタン結合、尿素結合、置換尿素結合、アミド結合、第一級アミノ基、第二級アミノ基及び第三級アミノ基等の含窒素極性部分を有するものが、硬化がさらに促進されるため好ましい。硬化がさらに促進される理由としては、硬化性樹脂の分子内に存在する上記極性要素部分が三フッ化ホウ素のアミン錯体との分子的相性の良いドメインとなり、本発明における三フッ化ホウ素のアミン錯体が上記含珪素特性基中の加水分解性シリル基と相互作用する効果がさらに向上することによって、加水分解性シリル基中の加水分解性基の脱離能がさらに高まり、その結果として、シリル基同士のカップリング反応がさらに促進されるためであると推察される。 Further, among these polar component parts, a urethane bond, urea bond, location換尿containing bond, A bromide coupling, primary amino groups, nitrogen-containing polar moieties such as secondary amino groups and tertiary amino group It is preferable to have a material because curing is further accelerated. The reason why the curing is further promoted is that the polar element portion present in the molecule of the curable resin becomes a domain having good molecular compatibility with the amine complex of boron trifluoride, and the amine of boron trifluoride in the present invention By further improving the effect of the complex interacting with the hydrolyzable silyl group in the above silicon-containing characteristic group, the ability to desorb the hydrolyzable group in the hydrolyzable silyl group is further increased. This is presumably because the coupling reaction between groups is further promoted.
このような分子内に極性要素部分が含有される硬化性樹脂の製造方法としては、特許第3030020号公報等に記載される方法が挙げられる。 Examples of a method for producing a curable resin in which a polar element portion is contained in the molecule include a method described in Japanese Patent No. 3030020.
上記硬化性樹脂(A)の分子量は特に限定されないが、数平均分子量が500〜150,000が好ましく、1,000〜60,000がより好ましく、2,000〜20,000が特に好ましい。 The molecular weight of the curable resin (A) is not particularly limited, but the number average molecular weight is preferably 500 to 150,000, more preferably 1,000 to 60,000, and particularly preferably 2,000 to 20,000.
2.三フッ化ホウ素のアミン錯体である一種以上の化合物について
本発明の組成物の一成分である三フッ化ホウ素のアミン錯体である一種以上の化合物は、上記硬化性樹脂(A)の硬化触媒として有用であり、極めて短時間裡に硬化性樹脂(A)を硬化させる。
2. About one or more compounds which are amine complexes of boron trifluoride One or more compounds which are amine complexes of boron trifluoride which is one component of the composition of the present invention is a curing catalyst for the curable resin (A). The curable resin (A) is cured in a very short time.
上記ルイス酸及びその誘導体から選ばれる一種以上の化合物のうち、ルイス酸としては、塩化チタン、塩化すず、塩化ジルコニウム、塩化アルミニウム、塩化鉄、塩化亜鉛、臭化亜鉛、塩化銅、塩化アンチモン等の金属ハロゲン化物、及び、三フッ化ホウ素、三塩化ホウ素、三臭化ホウ素等のハロゲン化ホウ素化合物、トリフルオロメタンスルホン酸トリメチルシリル、スカンジウムトリフラート、イットリウムトリフラート、ジンクトリフラート等の金属トリフラート化合物等が挙げられる。上記硬化性樹脂(A)に及ぼす効果は、上記ルイス酸の酸性の強さによって影響されるものと考えられる。 Among one or more compounds selected from the above Lewis acids and derivatives thereof , Lewis acids include titanium chloride, tin chloride, zirconium chloride, aluminum chloride, iron chloride, zinc chloride, zinc bromide, copper chloride, antimony chloride, etc. Metal halides such as boron trifluoride, boron trichloride, boron tribromide, etc., metal triflate compounds such as trimethylsilyl trifluoromethanesulfonate, scandium triflate, yttrium triflate, zinc triflate, etc. . The effect on the curable resin (A) is considered to be influenced by the acid strength of the Lewis acid.
ルイス酸の誘導体としては、上記ルイス酸とルイス塩基との錯体、例えば、上記ルイス酸のアミン錯体、アルコール錯体、エーテル錯体等、チオール錯体、スルフィド錯体、カルボン酸錯体、水錯体等が例示される。 Examples of Lewis acid derivatives include complexes of the above Lewis acids and Lewis bases, such as amine complexes, alcohol complexes, ether complexes of the above Lewis acids, thiol complexes, sulfide complexes, carboxylic acid complexes, water complexes, and the like. .
アミン錯体に用いるアミン化合物としては、アンモニア、モノエチルアミン、トリエチルアミン、ピペリジン、アニリン、モルホリン、シクロヘキシルアミン、n−ブチルアミン、モノエタノールアミン、ジエタノールアミン、トリエタノールアミン、グアニジン、2,2,6,6−テトラメチルピペリジン、1,2,2,6,6−ペンタメチルピペリジン、N−メチル−3,3′−イミノビス(プロピルアミン)、エチレンジアミン、ジエチレントリアミン、トリエチレンジアミン、ペンタエチレンジアミン、1,2−ジアミノプロパン、1,3−ジアミノプロパン、1,2−ジアミノブタン、1,4−ジアミノブタン、1,9−ジアミノノナン、ATU(3,9−ビス(3−アミノプロピル)−2,4,8,10−テトラオキサスピロ[5.5]ウンデカン)、CTUグアナミン、ドデカン酸ジヒドラジド、ヘキサメチレンジアミン、m−キシリレンジアミン、ジアニシジン、4,4′−ジアミノ−3,3′−ジエチルジフェニルメタン、ジアミノジフェニルエーテル、3,3′−ジメチル−4,4′−ジアミノジフェニルメタン、トリジンベース、m−トルイレンジアミン、o−フェニレンジアミン、m−フェニレンジアミン、p−フェニレンジアミン、メラミン、1,3−ジフェニルグアニジン、ジ−o−トリルグアニジン、1,1,3,3−テトラメチルグアニジン、ビス(アミノプロピル)ピペラジン、N−(3−アミノプロピル)−1,3−プロパンジアミン、ビス(3−アミノプロピル)エーテル、サンテクノケミカル社製ジェファーミン等の複数の第一級アミノ基を有する化合物、ピペラジン、シス−2,6−ジメチルピペラジン、シス−2,5−ジメチルピペラジン、2−メチルピペラジン、N,N′−ジ−t−ブチルエチレンジアミン、2−アミノメチルピペリジン、4−アミノメチルピペリジン、1,3−ジ−(4−ピペリジル)−プロパン、4−アミノプロピルアニリン、ホモピペラジン、N,N′−ジフェニルチオ尿素、N,N′−ジエチルチオ尿素、N−メチル−1,3−プロパンジアミン等の複数の第二級アミノ基を有する化合物、更に、メチルアミノプロピルアミン、エチルアミノプロピルアミン、エチルアミノエチルアミン、ラウリルアミノプロピルアミン、2−ヒドロキシエチルアミノプロピルアミン、1−(2−アミノエチル)ピペラジン、N−アミノプロピルピペラジン、3−アミノピロリジン、1−o−トリルビグアニド、2−アミノメチルピペラジン、N−アミノプロピルアニリン、エチルアミンエチルアミン、2−ヒドロキシエチルアミノプロピルアミン、ラウリルアミノプロピルアミン、2−アミノメチルピペリジン、4−アミノメチルピペリジン、式 H2N(C2H4NH)nH(n≒5)で表わされる化合物(商品名:ポリエイト、東ソー社製)、N−アルキルモルホリン、1,8−ジアザビシクロ[5.4.0]ウンデセン−7、6−ジブチルアミノ−1,8−ジアザビシクロ[5.4.0]ウンデセン−7、1,5−ジアザビシクロ[4.3.0]ノネン−5、1,4−ジアザビシクロ[2.2.2]オクタン、ピリジン、N−アルキルピペリジン、1,5,7−トリアザビシクロ[4.4.0]デカ−5−エン、7−メチル−1,5,7−トリアザビシクロ[4.4.0]デカ−5−エン等の複環状第三級アミン化合物等の他、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルメチルジエトキシシラン、4−アミノ−3−ジメチルブチルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン、N−3−[アミノ(ジプロピレンオキシ)]アミノプロピルトリエトキシシラン、(アミノエチルアミノメチル)フェネチルトリエトキシシラン、N−(6−アミノヘキシル)アミノプロピルトリエトキシシラン、N−フェニル−γ−アミノプロピルトリエトキシシラン、N−(2−アミノエチル)−11−アミノウンデシルトリエトキシシラン等のアミノシラン化合物が挙げられる。Amine compounds used for the amine complex include ammonia, monoethylamine, triethylamine, piperidine, aniline, morpholine, cyclohexylamine, n-butylamine, monoethanolamine, diethanolamine, triethanolamine, guanidine, 2,2,6,6-tetra Methylpiperidine, 1,2,2,6,6-pentamethylpiperidine, N-methyl-3,3'-iminobis (propylamine), ethylenediamine, diethylenetriamine, triethylenediamine, pentaethylenediamine, 1,2-diaminopropane, 1 , 3-diaminopropane, 1,2-diaminobutane, 1,4-diaminobutane, 1,9-diaminononane, ATU (3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxa Spyro[ .5] undecane), CTU guanamine, dodecanoic acid dihydrazide, hexamethylenediamine, m-xylylenediamine, dianisidine, 4,4'-diamino-3,3'-diethyldiphenylmethane, diaminodiphenyl ether, 3,3'-dimethyl- 4,4'-diaminodiphenylmethane, tolidine base, m-toluylenediamine, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, melamine, 1,3-diphenylguanidine, di-o-tolylguanidine, 1, 1,3,3-tetramethylguanidine, bis (aminopropyl) piperazine, N- (3-aminopropyl) -1,3-propanediamine, bis (3-aminopropyl) ether, Jeffamine manufactured by Sun Techno Chemical Co., Ltd. Multiple primary amino A compound having: piperazine, cis-2,6-dimethylpiperazine, cis-2,5-dimethylpiperazine, 2-methylpiperazine, N, N'-di-t-butylethylenediamine, 2-aminomethylpiperidine, 4-amino Methylpiperidine, 1,3-di- (4-piperidyl) -propane, 4-aminopropylaniline, homopiperazine, N, N'-diphenylthiourea, N, N'-diethylthiourea, N-methyl-1,3 A compound having a plurality of secondary amino groups such as propanediamine, methylaminopropylamine, ethylaminopropylamine, ethylaminoethylamine, laurylaminopropylamine, 2-hydroxyethylaminopropylamine, 1- (2- Aminoethyl) piperazine, N-aminopropylpiperazine, 3- Aminopyrrolidine, 1-o-tolylbiguanide, 2-aminomethylpiperazine, N-aminopropylaniline, ethylamineethylamine, 2-hydroxyethylaminopropylamine, laurylaminopropylamine, 2-aminomethylpiperidine, 4-aminomethylpiperidine, compounds of the formula H 2 n (C 2 H 4 NH) n H (n ≒ 5) ( trade name: Porieito, manufactured by Tosoh Corporation), N- alkyl morpholine, 1,8-diazabicyclo [5.4.0] Undecene-7,6-dibutylamino-1,8-diazabicyclo [5.4.0] undecene-7,1,5-diazabicyclo [4.3.0] nonene-5, 1,4-diazabicyclo [2.2 .2] Octane, pyridine, N-alkylpiperidine, 1,5,7-triazabicyclo [4.4. In addition to bicyclic tertiary amine compounds such as deca-5-ene and 7-methyl-1,5,7-triazabicyclo [4.4.0] dec-5-ene, γ-aminopropyltri Ethoxysilane, γ-aminopropylmethyldiethoxysilane, 4-amino-3-dimethylbutyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ- Aminopropylmethyldiethoxysilane, N-3- [amino (dipropyleneoxy)] aminopropyltriethoxysilane, (aminoethylaminomethyl) phenethyltriethoxysilane, N- (6-aminohexyl) aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltriethoxysilane, N- (2-aminoethyl) -11-aminoundec Examples thereof include aminosilane compounds such as rutriethoxysilane.
アルコール錯体に用いるアルコール類としては、メタノール、エタノール、n−プロパノール、n−ブタノール等の一級アルコール、イソプロパノール、2−ブタノール等のニ級アルコール等が例示される。エーテル錯体に用いるエーテル類としては、ジメチルエーテル、ジエチルエーテル、ジn−ブチルエーテル等が例示される。 Examples of alcohols used in the alcohol complex include primary alcohols such as methanol, ethanol, n-propanol and n-butanol, and secondary alcohols such as isopropanol and 2-butanol. Examples of ethers used in the ether complex include dimethyl ether, diethyl ether, and di-n-butyl ether.
上記ルイス酸の中では、塩化チタン(IV)、塩化すず(IV)、塩化ジルコニウム(IV)、塩化アルミニウム(III)、スカンジウムトリフラート、イットリウムトリフラート、トリフルオロメタンスルホン酸トリメチルシリル、三塩化ホウ素、三フッ化ホウ素が好ましい。これらのうちでも、塩化ジルコニウム(IV)、トリフルオロメタンスルホン酸トリメチルシリル、ハロゲン化ホウ素が好ましく、特にハロゲン化ホウ素のうちでも、触媒活性や入手のしやすさの点から三フッ化ホウ素が特に好ましい。また、上記ルイス酸の錯体としては、ハロゲン化ホウ素の錯体が好ましく、それらのなかでも特に三フッ化ホウ素の錯体が、取り扱いが容易であるなどの点で、好ましい。 Among the above Lewis acids, titanium chloride (IV), tin chloride (IV), zirconium chloride (IV), aluminum chloride (III), scandium triflate, yttrium triflate, trimethylsilyl trifluoromethanesulfonate, boron trichloride, trifluoride Boron is preferred. Of these, zirconium (IV) chloride, trimethylsilyl trifluoromethanesulfonate, and boron halide are preferable, and boron trifluoride is particularly preferable from the viewpoint of catalytic activity and availability. Further, as the Lewis acid complex, a boron halide complex is preferable, and among them, a boron trifluoride complex is particularly preferable in terms of easy handling.
又、三フッ化ホウ素の錯体の中でも、安定性と触媒活性を兼ね備えたアミン錯体が特に好ましい。ルイス酸やその誘導体は、上記の化合物を成分とする市販品を用いることができ、市販品としては、エアプロダクツ・ジャパン社製、商品名:アンカー1040,1115,1170,1222、BAK1171等が挙げられる。 Of the boron trifluoride complexes, amine complexes having both stability and catalytic activity are particularly preferred. As the Lewis acid and derivatives thereof, commercially available products containing the above compounds as components can be used. Examples of commercially available products include Air Products Japan, trade names: Anchors 1040, 1115, 1170, 1222, BAK1171, and the like. It is done.
上記三フッ化ホウ素のアミン錯体である一種以上の化合物の上記硬化性樹脂(A)に対する添加混合方法は、特に限定されず、例えば、室温下で添加してもよいし、加熱下で添加してもよいが、加熱工程を経て添加混合した方が、分散性が高まるため好ましい。 Adding and mixing method for the curable resin (A) one or more compounds is an amine complex of boron trifluoride is not particularly limited, for example, may be added at room temperature, added with heating under However, it is preferable to add and mix through a heating step because dispersibility increases.
上記三フッ化ホウ素のアミン錯体である一種以上の化合物は、単独で用いてもよいし、二種以上併用してもよい。また、上記三フッ化ホウ素のアミン錯体である一種以上の化合物の配合割合は、上記硬化性樹脂(A)100重量部あたり0.001〜10重量部であり、特に好ましくは0.01〜5重量部である。 One or more compounds that are the boron trifluoride amine complex may be used alone or in combination of two or more. The mixing ratio of the amine complex and one or more compounds of the boron trifluoride is above Symbol curable resin (A) 0.001 to 10 parts by weight per 100 parts by weight, particularly preferably 0.01 ~ 5 parts by weight.
本発明の硬化性樹脂組成物は、上記硬化性樹脂(A)及び三フッ化ホウ素のアミン錯体を必須成分として含有するものであるが、それらの成分以外に、さらに、他の硬化触媒、シランカップリング剤、充填材、各種添加剤などを要求される性能に応じて配合することができる。 The curable resin composition of the present invention contains the curable resin (A) and an amine complex of boron trifluoride as essential components. In addition to these components, other curable catalyst, silane A coupling agent, a filler, various additives, etc. can be mix | blended according to the performance requested | required.
本発明に係る硬化性樹脂組成物に配合できる上記硬化触媒としては、公知の触媒化合物を、本発明の効果を損なわない範囲内で使用できる。具体例としては、有機錫化合物、有機ビスマス化合物、有機チタン化合物等の有機金属化合物、アミン化合物等の塩基性化合物、リン酸系化合物等の酸性化合物等が挙げられる。 As the curing catalyst that can be blended in the curable resin composition according to the present invention, a known catalyst compound can be used within a range that does not impair the effects of the present invention. Specific examples include organic tin compounds, organic bismuth compounds, organic metal compounds such as organic titanium compounds, basic compounds such as amine compounds, and acidic compounds such as phosphoric acid compounds.
本発明に係る硬化性樹脂組成物に配合できる上記シランカップリング剤としては、公知のシランカップリング剤が使用できる。具体的には、アミノシラン化合物、エポキシシラン化合物、メルカプトシラン化合物、(メタ)アクリルシラン化合物、イソシアネートシラン化合物、ビニルシラン化合物等の分子内にエトキシシリル基を有するシランカップリング剤が挙げられる。 A known silane coupling agent can be used as the silane coupling agent that can be blended in the curable resin composition according to the present invention. Specific examples include silane coupling agents having an ethoxysilyl group in the molecule, such as aminosilane compounds, epoxy silane compounds, mercaptosilane compounds, (meth) acryl silane compounds, isocyanate silane compounds, and vinyl silane compounds.
上記シランカップリング剤は、単独で用いてもよいし、二種以上併用してもよいが、特にアミノシラン化合物を用いることが好ましい。上記シランカップリング剤の配合割合は、好ましくは上記硬化性樹脂(A)100重量部あたり0.1〜20重量部であり、特に好ましくは1〜10重量部である。 Although the said silane coupling agent may be used independently and may be used together 2 or more types, it is preferable to use an aminosilane compound especially. The blending ratio of the silane coupling agent is preferably 0.1 to 20 parts by weight, particularly preferably 1 to 10 parts by weight, per 100 parts by weight of the curable resin (A).
本発明に係る硬化性樹脂組成物に配合できる上記充填剤としては、公知の充填材が使用できるが、具体的には、炭酸カルシウム系充填剤、各種処理炭酸カルシウム系充填剤、炭酸マグネシウム系充填剤、有機高分子系充填剤、クレー系充填剤、タルク系充填剤、シリカ系充填剤、フュームドシリカ系充填剤、ガラスバルーン、プラスチックバルーン等の各種バルーン系充填剤、水酸化アルミニウム、水酸化マグネシウム等の金属水酸化物系充填剤、フィブリル化繊維系充填剤等が挙げられる。 As the filler that can be blended in the curable resin composition according to the present invention, known fillers can be used. Specifically, calcium carbonate filler, various treated calcium carbonate filler, magnesium carbonate filler. Agents, organic polymer fillers, clay fillers, talc fillers, silica fillers, fumed silica fillers, various balloon fillers such as glass balloons and plastic balloons, aluminum hydroxide, hydroxylation Examples thereof include metal hydroxide fillers such as magnesium, fibrillated fiber fillers, and the like.
上記シリカ系充填材としては、親水性シリカ系粉体、疎水性シリカ系粉体、溶融石英ガラス系粉体等が挙げられるが、これらの中では、特に、疎水性シリカ系粉体が好ましい。上記充填材は、単独で用いてもよいし、二種以上併用してもよい。また、上記充填材は、粒径が10nm〜500μmのものが好適であるが、好ましくは100nm〜200μm、特に好ましくは1.0〜100μmのものである。さらに、上記充填材の配合割合は、上記硬化性樹脂(A)100重量部あたり、1〜500重量部を含有するのが好適であるが、好ましくは1〜300重量部、特に好ましくは1〜200重量部である。 Examples of the silica-based filler include hydrophilic silica-based powders, hydrophobic silica-based powders, and fused silica glass-based powders. Among these, hydrophobic silica-based powders are particularly preferable. The said filler may be used independently and may be used together 2 or more types. The filler preferably has a particle size of 10 nm to 500 μm, preferably 100 nm to 200 μm, particularly preferably 1.0 to 100 μm. Furthermore, the blending ratio of the filler is preferably 1 to 500 parts by weight per 100 parts by weight of the curable resin (A), preferably 1 to 300 parts by weight, particularly preferably 1 to 1 part by weight. 200 parts by weight.
本発明に係る硬化性樹脂組成物に配合できる上記各種添加剤としては、本発明の効果を損なわない範囲内で、粘着性付与剤(タッキファイアー)、揺変剤、脱水剤、希釈剤、可塑剤、難燃剤、オリゴマー、老化防止剤、紫外線吸収剤、顔料、チタネートカップリング剤、アルミニウムカップリング剤、桐油等の乾性油等の公知の原料が挙げられるが、これらに限定されるものではない。 The various additives that can be blended in the curable resin composition according to the present invention include a tackifier, a thixotropic agent, a dehydrating agent, a diluent, a plasticizer within a range not impairing the effects of the present invention. Well-known raw materials such as agents, flame retardants, oligomers, anti-aging agents, ultraviolet absorbers, pigments, titanate coupling agents, aluminum coupling agents, and tung oil, but are not limited thereto. .
本発明の硬化性樹脂組成物は、例えば、電気電子用、建材用、家庭用、各種工事用等で用いられる接着剤、シーラント、塗料、コーティング剤、目止め剤(例えば、コンクリー トのひび割れ補修において注入剤が漏れないようにひび割れを覆う目止め剤)、注型剤、被覆剤等に有効に用いることができる。 The curable resin composition of the present invention can be used, for example, for adhesives, sealants, paints, coating agents, sealants (for example, repairing cracks in concrete) used for electrical and electronic products, building materials, households, and various constructions. Can be effectively used as a sealing agent for covering cracks so as not to leak the injection agent), a casting agent, a coating agent, and the like.
以下、本発明を実施例により詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to examples.
(硬化性樹脂(A)の合成)
(合成例1)
反応容器に、3−アミノプロピルトリエトキシシラン221.4gを窒素雰囲気下80℃で撹拌しながらアクリル酸ラウリル240.4gを1時間かけて滴下し、さらに、80℃で10時間反応させた後、50℃で7日間反応させることで、分子内にトリエトキシシリル基及び第2級アミノ基を有する反応物(SE−1)を得た。(Synthesis of curable resin (A))
(Synthesis Example 1)
To the reaction vessel, 220.4 g of 3-aminopropyltriethoxysilane was added dropwise over 1 hour while stirring at 80 ° C. under a nitrogen atmosphere, and further reacted at 80 ° C. for 10 hours. By reacting at 50 ° C. for 7 days, a reaction product (SE-1) having a triethoxysilyl group and a secondary amino group in the molecule was obtained.
別の反応容器に、PMLS4012(商品名:旭硝子ウレタン社製、ポリオキシプロピレンジオール、数平均分子量10,000)を900g、PR3007(商品名:旭電化工業社製、ポリオキシエチレン含有ポリオキシプロピレンジオール、数平均分子量3,000)を100g及びトリレンジイソシアネートを43.0g入れた後、窒素雰囲気下にて撹拌混合しながら、90℃で8時間反応させることで、分子内にイソシアネート基を有するポリオキシアルキレン樹脂(PB−1)を得た。その後、反応物(SE−1)を121.6g添加し、窒素雰囲気下にて撹拌混合しながら、90℃で2時間反応させることで、分子内にトリエトキシシリル基を有する硬化性樹脂(SB−1)を得た。23℃における硬化性樹脂(SB−1)の粘度は、60,000mPa・s(BH型粘度計、No.7ローター、10回転)であった。以下、粘度はすべて同じ条件で測定した。 In another reaction vessel, 900 g of PMLS 4012 (trade name: manufactured by Asahi Glass Urethane Co., Ltd., polyoxypropylene diol, number average molecular weight 10,000), PR3007 (trade name: manufactured by Asahi Denka Kogyo Co., Ltd., polyoxyethylene-containing polyoxypropylene diol) , 100 g of number average molecular weight 3,000) and 43.0 g of tolylene diisocyanate were added, followed by reaction at 90 ° C. for 8 hours while stirring and mixing in a nitrogen atmosphere, so An oxyalkylene resin (PB-1) was obtained. Thereafter, 121.6 g of the reaction product (SE-1) was added, and the mixture was reacted at 90 ° C. for 2 hours while stirring and mixing in a nitrogen atmosphere, thereby curable resin (SB) having a triethoxysilyl group in the molecule. -1) was obtained. The viscosity of the curable resin (SB-1) at 23 ° C. was 60,000 mPa · s (BH viscometer, No. 7 rotor, 10 rotations). Hereinafter, all viscosities were measured under the same conditions.
(合成例2)
反応容器に、PMLS4012(商品名:旭硝子ウレタン社製、ポリオキシプロピレンジオール、数平均分子量10,000)を900g、PMLS3011(商品名:旭硝子ウレタン社製、ポリオキシプロピレントリオール、数平均分子量10,000)100g及び3−イソシアネートプロピルトリエトキシシランを56.1g入れた後、さらにネオスタンU−600(商品名:日東化成社製、ビスマス化合物)を100ppmとなるように添加し、窒素雰囲気下にて撹拌混合しながら、90℃で4時間反応させることで、分子内にトリエトキシシリル基を有する硬化性樹脂(SB−2)を得た。23℃における硬化性樹脂(SB−2)の粘度は、10,000mPa・sであった。(Synthesis Example 2)
In a reaction vessel, 900 g of PMLS4012 (trade name: manufactured by Asahi Glass Urethane Co., Ltd., polyoxypropylenediol, number average molecular weight 10,000), PMLS3011 (trade name: manufactured by Asahi Glass Urethane Co., Ltd., polyoxypropylene triol, number average molecular weight 10,000) ) After adding 100 g and 56.1 g of 3-isocyanatopropyltriethoxysilane, further add Neostan U-600 (trade name: manufactured by Nitto Kasei Co., Ltd., bismuth compound) to 100 ppm and stir in a nitrogen atmosphere. A curable resin (SB-2) having a triethoxysilyl group in the molecule was obtained by reacting at 90 ° C. for 4 hours while mixing. The viscosity of the curable resin (SB-2) at 23 ° C. was 10,000 mPa · s.
(合成例3)
反応容器に、N−β(アミノエチル)−γ−アミノプロピルトリエトキシシラン 185.1g及びN−β(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン 70.3gを窒素雰囲気下80℃で撹拌しながらアクリル酸メチル 172.2gを1時間かけて滴下し、さらに、80℃で10時間反応させた後、50℃で7日間反応させることで、分子内にトリエトキシシリル基、メチルジエトキシシリル基及び第2級アミノ基を有する反応物(SE−3)を得た。(Synthesis Example 3)
In a reaction vessel, 185.1 g of N-β (aminoethyl) -γ-aminopropyltriethoxysilane and 70.3 g of N-β (aminoethyl) -γ-aminopropylmethyldiethoxysilane were stirred at 80 ° C. in a nitrogen atmosphere. Then, 172.2 g of methyl acrylate was added dropwise over 1 hour, and further reacted at 80 ° C. for 10 hours, followed by reaction at 50 ° C. for 7 days, so that a triethoxysilyl group and methyldiethoxysilyl in the molecule. And a reaction product (SE-3) having a secondary amino group.
別の反応容器に、PMLS4012(商品名:旭硝子ウレタン社製、ポリオキシプロピレンジオール、数平均分子量10,000)を900g、PR5007(商品名:旭電化工業社製、ポリオキシエチレン含有ポリオキシプロピレンジオール、数平均分子量5,000)を100g及びイソホロンジインシアネートを52.3g入れ、さらにジオクチル錫ジラウレートを50ppmとなるように添加し、窒素雰囲気下にて撹拌混合しながら、90℃で5時間反応させることで、分子内にイソシアネート基を有するポリオキシアルキレン樹脂(PB−3)を得た。その後、反応物(SE−3)を107.3g添加し、窒素雰囲気下にて撹拌混合しながら、90℃で1時間反応させることで、分子内にトリエトキシシリル基及びメチルジエトキシシリル基を有する硬化性樹脂(SB−3)を得た。23℃における硬化性樹脂(SB−3)の粘度は、53,000mPa・sであった。 In another reaction vessel, 900 g of PMLS4012 (trade name: manufactured by Asahi Glass Urethane Co., Ltd., polyoxypropylene diol, number average molecular weight 10,000), PR5007 (trade name: manufactured by Asahi Denka Kogyo Co., Ltd., polyoxyethylene-containing polyoxypropylene diol) In addition, 100 g of a number average molecular weight of 5,000) and 52.3 g of isophorone diisocyanate are added, and dioctyltin dilaurate is further added to 50 ppm, and the mixture is reacted at 90 ° C. for 5 hours while stirring and mixing in a nitrogen atmosphere. Thus, a polyoxyalkylene resin (PB-3) having an isocyanate group in the molecule was obtained. Thereafter, 107.3 g of the reaction product (SE-3) was added and reacted at 90 ° C. for 1 hour while stirring and mixing in a nitrogen atmosphere, so that triethoxysilyl group and methyldiethoxysilyl group were formed in the molecule. A curable resin (SB-3) was obtained. The viscosity of the curable resin (SB-3) at 23 ° C. was 53,000 mPa · s.
(合成例4)
反応容器に、上記硬化性樹脂(SB−1)を100g入れ、窒素雰囲気下、90℃まで昇温した。別に、メタクリル酸メチルを40g、メタクリル酸ラウリルを30g、メタクリル酸ステアリル10g、3−アクリロキシプロピルトリエトキシシランを3g、3−メルカプトプロピルトリエトキシシランを8g及び2,2’−アゾビス(2,4−ジメチルバレロニトリル)0.7gを混合したモノマー混合液を30分かけて滴下し、重合反応を行った。さらに、90℃で30分反応させた後、2,2’−アゾビス(2,4−ジメチルバレロニトリル)0.2gとメチルエチルケトン1gの混合溶液を滴下し、重合反応を行った。さらに、90℃で30分反応させた後、2,2’−アゾビス(2,4−ジメチルバレロニトリル)0.1gとメチルエチルケトン1gの混合溶液を滴下し、重合反応を行った。さらに、90℃で30分反応させた後、未反応の諸成分を減圧留去して、分子内にトリエトキシシリル基を有する硬化性樹脂(SB−4)を得た。23℃における硬化性樹脂(SB−4)の粘度は、160,000mPa・sであった。(Synthesis Example 4)
In a reaction vessel, 100 g of the curable resin (SB-1) was added, and the temperature was raised to 90 ° C. in a nitrogen atmosphere. Separately, 40 g of methyl methacrylate, 30 g of lauryl methacrylate, 10 g of stearyl methacrylate, 3 g of 3-acryloxypropyltriethoxysilane, 8 g of 3-mercaptopropyltriethoxysilane, and 2,2′-azobis (2,4 -Dimethylvaleronitrile) A monomer mixture mixed with 0.7 g was added dropwise over 30 minutes to conduct a polymerization reaction. Furthermore, after reacting at 90 ° C. for 30 minutes, a mixed solution of 0.2 g of 2,2′-azobis (2,4-dimethylvaleronitrile) and 1 g of methyl ethyl ketone was added dropwise to carry out a polymerization reaction. Furthermore, after reacting at 90 ° C. for 30 minutes, a mixed solution of 0.1 g of 2,2′-azobis (2,4-dimethylvaleronitrile) and 1 g of methyl ethyl ketone was added dropwise to carry out a polymerization reaction. Furthermore, after making it react at 90 degreeC for 30 minutes, unreacted various components were depressurizingly distilled and curable resin (SB-4) which has a triethoxysilyl group in a molecule | numerator was obtained. The viscosity of the curable resin (SB-4) at 23 ° C. was 160,000 mPa · s.
(合成例5)
反応容器に、N−β(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン234.4gを窒素雰囲気下80℃で撹拌しながらアクリル酸メチル 172.2gを1時間かけて滴下し、さらに、80℃で10時間反応させた後、50℃で7日間反応させることで、分子内にメチルジエトキシシリル基及び第2級アミノ基を有する反応物(SE−5)を得た。(Synthesis Example 5)
While stirring 234.4 g of N-β (aminoethyl) -γ-aminopropylmethyldiethoxysilane at 80 ° C. in a nitrogen atmosphere, 172.2 g of methyl acrylate was added dropwise to the reaction vessel over 1 hour. After reacting at 10 ° C. for 10 hours, the reaction product (SE-5) having a methyldiethoxysilyl group and a secondary amino group in the molecule was obtained by reacting at 50 ° C. for 7 days.
別の反応容器に、PMLS4012(商品名:旭硝子ウレタン社製、ポリオキシプロピレンジオール、数平均分子量10,000)を900g、PR5007(商品名:旭電化工業社製、ポリオキシエチレン含有ポリオキシプロピレンジオール、数平均分子量5,000)を100g及びトリレンジイソシアネートを41.0g入れ、窒素雰囲気下にて撹拌混合しながら、90℃で10時間反応させることで、分子内にイソシアネート基を有するポリオキシアルキレン樹脂(PB−5)を得た。その後、反応物(SE−5)を92.2g添加し、窒素雰囲気下にて撹拌混合しながら、90℃で2時間反応させることで、分子内にメチルジエトキシシリル基を有する硬化性樹脂(SB−5)を得た。23℃における硬化性樹脂(SB−5)の粘度は、55,000mPa・sであった。 In another reaction vessel, 900 g of PMLS4012 (trade name: manufactured by Asahi Glass Urethane Co., Ltd., polyoxypropylene diol, number average molecular weight 10,000), PR5007 (trade name: manufactured by Asahi Denka Kogyo Co., Ltd., polyoxyethylene-containing polyoxypropylene diol) Polyoxyalkylene having an isocyanate group in the molecule by adding 100 g of a number average molecular weight of 5,000) and 41.0 g of tolylene diisocyanate and reacting at 90 ° C. for 10 hours while stirring and mixing in a nitrogen atmosphere. Resin (PB-5) was obtained. Thereafter, 92.2 g of the reaction product (SE-5) was added, and the mixture was allowed to react at 90 ° C. for 2 hours while stirring and mixing in a nitrogen atmosphere, whereby a curable resin having a methyldiethoxysilyl group in the molecule ( SB-5) was obtained. The viscosity of the curable resin (SB-5) at 23 ° C. was 55,000 mPa · s.
(触媒溶液の調製)
表1に示す割合(質量部)でそれぞれの化合物を混合し、触媒溶液(CS−1)〜(CS−5)を調製した。(Preparation of catalyst solution)
Each compound was mixed in the ratio (mass part) shown in Table 1, and catalyst solution (CS-1)-(CS-5) was prepared.
(参考実施例1)
密閉容器に、上記硬化性樹脂(SB−1)を100g及び上記触媒溶液(CS−1)を4.2g入れ、減圧下混練りして、硬化性樹脂組成物を得た。
( Reference Example 1)
In a sealed container, 100 g of the curable resin (SB-1) and 4.2 g of the catalyst solution (CS-1) were added and kneaded under reduced pressure to obtain a curable resin composition.
(参考実施例2)
密閉容器に、上記硬化性樹脂(SB−1)を100g及び上記触媒溶液(CS−2)を7.2g入れ、減圧下混練りして、硬化性樹脂組成物を得た。
( Reference Example 2)
In a sealed container, 100 g of the curable resin (SB-1) and 7.2 g of the catalyst solution (CS-2) were added and kneaded under reduced pressure to obtain a curable resin composition.
(参考実施例3)
密閉容器に、上記硬化性樹脂(SB−2)を100g及び上記触媒溶液(CS−1)を4.2g入れ、減圧下混練りして、硬化性樹脂組成物を得た。
( Reference Example 3)
In a sealed container, 100 g of the curable resin (SB-2) and 4.2 g of the catalyst solution (CS-1) were added and kneaded under reduced pressure to obtain a curable resin composition.
(実施例4)
密閉容器に、上記硬化性樹脂(SB−3)を100g及び上記触媒溶液(CS−1)を4.2g入れ、減圧下混練りして、硬化性樹脂組成物を得た。Example 4
In a sealed container, 100 g of the curable resin (SB-3) and 4.2 g of the catalyst solution (CS-1) were added and kneaded under reduced pressure to obtain a curable resin composition.
(参考実施例5)
密閉容器に、上記硬化性樹脂(SB−4)を100g及び上記触媒溶液(CS−1)を4.2g入れ、減圧下混練りして、硬化性樹脂組成物を得た。
( Reference Example 5)
In a sealed container, 100 g of the curable resin (SB-4) and 4.2 g of the catalyst solution (CS-1) were added and kneaded under reduced pressure to obtain a curable resin composition.
(実施例6)
密閉容器に、上記硬化性樹脂(SB−5)を100g及び上記触媒溶液(CS−4)を5.0g入れ、減圧下混練りして、硬化性樹脂組成物を得た。(Example 6)
In a sealed container, 100 g of the curable resin (SB-5) and 5.0 g of the catalyst solution (CS-4) were added and kneaded under reduced pressure to obtain a curable resin composition.
(参考比較例1)
反応容器に、上記硬化性樹脂(SB−1)を100g及び上記触媒溶液(CS−3)を4.2g入れ混練りして、硬化性樹脂組成物を得た。
( Reference Comparative Example 1)
In a reaction vessel, 100 g of the curable resin (SB-1) and 4.2 g of the catalyst solution (CS-3) were added and kneaded to obtain a curable resin composition.
(参考比較例2)
反応容器に、上記硬化性樹脂(SB−2)を100g及び上記触媒溶液(CS−3)を4.2g入れ混練りして、硬化性樹脂組成物を得た。
( Reference Comparative Example 2)
In a reaction vessel, 100 g of the curable resin (SB-2) and 4.2 g of the catalyst solution (CS-3) were added and kneaded to obtain a curable resin composition.
(比較例3)
反応容器に、上記硬化性樹脂(SB−3)を100g及び上記触媒溶液(CS−3)を4.2g入れ混練りして、硬化性樹脂組成物を得た。(Comparative Example 3)
In a reaction vessel, 100 g of the curable resin (SB-3) and 4.2 g of the catalyst solution (CS-3) were added and kneaded to obtain a curable resin composition.
(参考比較例4)
反応容器に、上記硬化性樹脂(SB−4)を100g及び上記触媒溶液(CS−3)を4.2g入れ混練りして、硬化性樹脂組成物を得た。
( Reference Comparative Example 4)
In a reaction vessel, 100 g of the curable resin (SB-4) and 4.2 g of the catalyst solution (CS-3) were added and kneaded to obtain a curable resin composition.
(比較例5)
反応容器に、上記硬化性樹脂(SB−5)を100g及び上記触媒溶液(CS−5)を5.0g入れ混練りして、硬化性樹脂組成物を得た。(Comparative Example 5)
In a reaction container, 100 g of the curable resin (SB-5) and 5.0 g of the catalyst solution (CS-5) were put and kneaded to obtain a curable resin composition.
(参考例1)
3−アミノプロピルトリエトキシランの代わりに、3−アミノプロピルトリメトキシシランを用いた以外は合成例1と同様に製造し、硬化性樹脂(RB−1)を得た。反応容器に、上記硬化性樹脂(RB−1)を100g、トルエンを4g、及び、No.918を1.0g入れ混練りして、硬化性樹脂組成物を得た。(Reference Example 1)
A curable resin (RB-1) was obtained in the same manner as in Synthesis Example 1 except that 3-aminopropyltrimethoxysilane was used instead of 3-aminopropyltriethoxysilane. In a reaction vessel, 100 g of the curable resin (RB-1), 4 g of toluene, and 1.0 g of 918 was added and kneaded to obtain a curable resin composition.
(皮張り時間の測定)
上記の実施例、比較例、参考実施例、参考比較例及び参考例1で得られた硬化性樹脂組成物をそれぞれ50℃で7日間静置した後、皮張り時間を測定した。それぞれの皮張り時間を表2に示した。皮張り時間は、硬化性樹脂組成物を、23℃及び相対湿度50%の雰囲気下に放置し、指触により表面に張った硬化皮膜が指に転着しなくなるまでの時間として求めた。以下の皮張り時間も、同様の方法により求めたものである。表中、例えば「2’30”」とあるのは、皮張り時間が2分30秒であったことを示す。
(Measure skinning time)
The curable resin compositions obtained in the above Examples, Comparative Examples, Reference Examples, Reference Comparative Examples and Reference Example 1 were each allowed to stand at 50 ° C. for 7 days, and then the skinning time was measured. Each skinning time is shown in Table 2. The skinning time was determined as the time until the cured film stretched on the surface by finger touch was not transferred to the finger after leaving the curable resin composition in an atmosphere of 23 ° C. and 50% relative humidity. The following skinning time was also obtained by the same method. In the table, for example, “2′30” ”indicates that the skinning time was 2 minutes and 30 seconds.
表2の結果から、本発明における硬化性樹脂組成物は、エタノール脱離型硬化性樹脂を使っているため環境に優しいだけでなく、硬化が遅いという欠点を補い従来のメタノール脱離型硬化性樹脂以上の硬化性を有していることがわかる。 From the results shown in Table 2, the curable resin composition of the present invention is not only environmentally friendly because it uses an ethanol detachable curable resin, but also compensates for the disadvantage of slow curing, and has a conventional methanol detachable curable property. It turns out that it has curability more than resin.
本発明にかかる硬化性樹脂組成物は、例えば、接着剤、シーラント、塗料、コーティング剤、目止め剤、注型剤、被覆剤等の用途に好適に用いることができ、さらには、環境に優しいエタノール脱離型硬化性樹脂を用いるにもかかわらず、実用に適した硬化速度及び接着性を達成でき、産業上非常に有用である。 The curable resin composition according to the present invention can be suitably used for applications such as adhesives, sealants, paints, coating agents, sealants, casting agents, coating agents, and the like, and is also environmentally friendly. Despite the use of an ethanol detachable curable resin, a curing rate and adhesiveness suitable for practical use can be achieved, which is very useful industrially.
Claims (3)
三フッ化ホウ素のアミン錯体である一種以上の化合物とを含有してなる硬化性樹脂組成物であって、
硬化性樹脂(A)100質量部当り、三フッ化ホウ素のアミン錯体を0.001〜10質量部含有することを特徴とする硬化性樹脂組成物。 Containing diethoxy alkylsilyl group in the molecule, and does not contain a bond containing a sulfur atom, and the number average molecular weight of 1,000 to 150,000 curable resin (A), the
A curable resin composition comprising at least one compound which is an amine complex of boron trifluoride ,
A curable resin composition containing 0.001 to 10 parts by mass of an amine complex of boron trifluoride per 100 parts by mass of the curable resin (A).
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| JP4685470B2 (en) * | 2005-01-18 | 2011-05-18 | コニシ株式会社 | Method for producing curable resin composition |
| JP4592427B2 (en) * | 2005-01-18 | 2010-12-01 | コニシ株式会社 | Curing catalyst for curable silicone resin and curable silicone resin composition |
| WO2008099858A1 (en) | 2007-02-13 | 2008-08-21 | Kaneka Corporation | Curable composition |
| JP2008266521A (en) * | 2007-04-24 | 2008-11-06 | Konishi Co Ltd | Moisture-curable resin composition |
| JP2010260910A (en) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | Curable silicone-based resin composition |
| JP2010260909A (en) * | 2009-04-30 | 2010-11-18 | Konishi Co Ltd | Curable silicone-based resin composition |
| JPWO2011090046A1 (en) * | 2010-01-20 | 2013-05-23 | コニシ株式会社 | Curable resin composition |
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