JP4851982B2 - Method and apparatus for manufacturing card-shaped parts - Google Patents

Description

  The present invention relates to a card-shaped component manufacturing method and apparatus suitable for use in manufacturing a card-shaped component containing an electronic component.

  In general, card-type components incorporating electronic components such as IC chips and memory elements are widely used. An IC card is known as a typical card-shaped part. Conventionally, as a method for manufacturing this type of IC card, the IC card manufacturing method disclosed in Patent Document 1 is known.

The manufacturing method disclosed in Patent Document 1 is an IC card manufacturing method in which an input / output terminal is exposed on an IC chip mounting substrate, an electrically insulating cover sheet is covered, and fusion is integrally performed by heating and pressing. The IC chip mounting substrate is embedded in a sheet-like insulating material having fluidity so that the bottom surface of the IC chip is brought into contact with the bottom surface of the IC chip so that the top surface is exposed. It is manufactured by molding.
Japanese Patent Publication No. 3-63778

  However, the above-described conventional IC card manufacturing method has the following problems.

  First, it follows the general manufacturing procedure, such as wiring board preparation, semiconductor chip mounting, sealing part mounting, etc., so a combination of independent manufacturing steps is required and the manufacturing process is not interrupted. Construction of a series of production lines becomes difficult. Therefore, the productivity decreases with the increase in the number of manufacturing steps (manufacturing time), and there is a limit to increase the production efficiency (mass productivity).

  Secondly, since it is necessary to combine independent manufacturing processes, the cost of production equipment (production machines) is increased, and it is necessary to secure a large equipment space, so it is not possible to save space in production factories. . In addition, it is necessary to prepare a wiring board such as a separately manufactured printed circuit board, which causes an increase in cost from the side of the parts and materials used.

  An object of the present invention is to provide a card-shaped component manufacturing method and apparatus that solve the problems in the background art.

In order to solve the above-described problems, a method for manufacturing a card-shaped component according to the present invention is as follows.
When manufacturing the card-shaped component P which includes the electronic component 3..., At least the first lead frame 7 which is continuous from the first hoop portion 5 and has a plurality of lead frames 7 mounted with the electronic component 3. A second hoop material 9 using a belt-shaped resin sheet supplied from the hoop material 6 and the second hoop portion 8 is used, and the second hoop material 9 is placed at the position of each lead 4 in the first hoop material 6. A plurality of corresponding connection holes 14 are provided, and the first hoop material 6 and the second hoop material 9 are thermocompression bonded to expose a part of each lead 4 to each connection hole 14. 4... Bulges into the respective connection holes 14 by a predetermined protrusion length Lp... To obtain the first substrate material Pa, and the first hoop material 6 in the first substrate material Pa. Trimming to obtain second substrate material Pb A step (S6), a frame separating step (S7) for separating the remaining frame 10 of the first hoop material 6 excluding at least the leads 4 ... from the second substrate material Pb to obtain a third substrate material Pc, and a third substrate material A second thermocompression bonding step (S11) in which the fourth substrate material Pd is obtained by thermocompression bonding of the Pc electronic component 3 side and the third hoop material 12 using the belt-shaped resin sheet supplied from the third hoop portion 11; The fourth substrate material Pd is cut to obtain a card-shaped part P... (S13).

  In this case, according to a preferred aspect of the invention, the first hoop material 6 and the second hoop material 9 can be provided with feed holes 6h... 9h at regular intervals along the longitudinal direction.

  On the other hand, a card-shaped component manufacturing apparatus 1 according to the present invention is a device for manufacturing a card-shaped component P including electronic components 3 in order to solve the above-described problem, and is at least continuous in a belt shape. A first hoop portion 5 for supplying a first hoop material 6 having a plurality of lead frames 4 mounted with electronic components 3... And a position of each lead 4. And a second hoop portion 8 for supplying a second hoop material 9 having a plurality of connection holes 14 in which a part of each lead 4 is exposed when the first hoop material 6 is thermocompression bonded. The first elastic surface 31u is used for the third hoop portion 11 for supplying the third hoop material 12 using the belt-shaped resin sheet and the press surface located on the first hoop material 6 side, and the second hoop material 9 is used. On the press surface located on the side, the first The second elastic surface 31d having a hardness different from that of the surface 31u is used, and the ratio between the hardness of the first elastic surface 31u and the hardness of the second elastic surface 31d is determined by connecting each lead 4 to the connection hole 14 in the thermocompression pressing. The first thermocompression press part 21 for obtaining the first substrate material Pa by thermocompression bonding of the first hoop material 6 and the second hoop material 9 is selected by selecting a ratio in which the predetermined protrusion length Lp. A trimming press portion 23 for trimming the first hoop material 6 in the first substrate material Pa to obtain the second substrate material Pb, and a remaining frame of the first hoop material 6 excluding at least the leads 4 from the second substrate material Pb. 10 is separated to obtain a third substrate material Pc, and a second thermocompression bonding to obtain a fourth substrate material Pd by thermocompression bonding of the third substrate material Pc to the electronic component 3 side and the third hoop material 12. Cut the press part 26 and the fourth substrate material Pd. Grayed and is characterized in that it comprises a cutting unit 28 to obtain a card-shaped component P with.

  In this case, the 1st cooling part 22 which cools the 1st board | substrate material Pa can be provided between the 1st thermocompression-bonding press part 21 and the trimming press part 23 by the suitable aspect of invention. Further, a second cooling part 27 for cooling the fourth substrate material Pd can be provided between the second thermocompression pressing part 26 and the cutting part 28.

  According to the card-shaped component manufacturing method and apparatus 1 according to the present invention as described above, the following remarkable effects can be obtained.

  (1) A strip-shaped resin supplied from the first hoop material 6 and the second hoop portion 8 having a plurality of lead frames 7 which are continuous from the first hoop portion 5 and are mounted with the electronic components 3. Since the process includes the step of thermocompression bonding the second hoop material 9 using a sheet, a series of production lines that do not interrupt the production process can be easily constructed, and thus the productivity associated with a reduction in the number of production steps (manufacturing time). In addition, the production efficiency (mass productivity) can be improved.

  (2) Since a series of production lines can be constructed without interrupting the production process, the production facility (production machine) can be greatly reduced in cost, and a large facility space is not required, so that the production plant can be saved. In addition, since a separately manufactured wiring board such as a printed circuit board is not required, cost reduction from the side of the parts and materials used can be realized.

  (3) Since the first hoop material 6 is used which has a plurality of lead frames 7 which are continuous from the first hoop portion 5 and have a plurality of lead frames 7 on which the electronic components 3 are mounted, the first thermocompression bonding step (S4) and the subsequent steps. The mounting process of the electronic components 3 in the above becomes unnecessary, and adverse effects such as unnecessary stress being applied to each substrate material Pa in the first thermocompression bonding step (S4) and thereafter can be eliminated.

  (4) The second hoop material 9 corresponds to the position of each lead 4 in the first hoop material 6, and one of the leads 4 when the second hoop material 9 and the first hoop material 6 are thermocompression bonded. Since the plurality of connection holes 14 are exposed so that the connection holes 14 are arranged in the recesses, it is possible to protect the soldered portions and the like welded to the connection holes 14.

  (5) Since the elastic surface 31 u is used for the press surface located at least on the first hoop material 6 side in the first thermocompression-bonding press portion 21, even if there are irregularities on the surface of the first hoop material 6. The first hoop material 6 and the second hoop material 9 can be uniformly thermocompression bonded by the flat elastic surface 31u (press surface).

  (6) In the 1st thermocompression-bonding press part 21, while using the 1st elastic surface 31u for the press surface located in the 1st hoop material 6 side, it is 1st elasticity in the press surface located in the 2nd hoop material 9 side. The second elastic surface 31d having a hardness different from that of the surface 31u is used, and the ratio between the hardness of the first elastic surface 31u and the hardness of the second elastic surface 31d is determined by connecting each lead 4 to the connection hole 14 in the thermocompression pressing. Since the ratio of bulging by a predetermined protrusion length Lp is selected in the interior, each lead 4 can be reliably bulged by a predetermined protrusion length Lp in the connection hole 14 at the time of thermocompression pressing. In addition, it is possible to prevent displacement of the first hoop material 6 and the second hoop material 9 after the first thermocompression bonding step (S4). Further, the projection length Lp can be arbitrarily changed by selecting (changing) the ratio.

  (7) According to a preferred embodiment, if the first hoop material 6 and the second hoop material 9 are provided with feed holes 6h... 9h. The first hoop material 6 and the second hoop material 9 can be positioned easily and accurately without providing an advanced positioning mechanism on the press portion 21 side.

  (8) If the 1st cooling part 22 which cools the 1st board | substrate material Pa is provided between the 1st thermocompression-bonding press part 21 and the trimming press part 23 by a suitable aspect, the 1st group after thermocompression bonding will be provided. By quickly cooling the plate material Pa, the trimming press unit 23 can always perform accurate trimming.

  (9) According to a preferred embodiment, if the second cooling part 27 for cooling the fourth substrate material Pd is provided between the second thermocompression press part 26 and the cutting part 28, the fourth substrate material Pd after thermocompression bonding. By cooling quickly, the cutting unit 28 can always perform accurate cutting.

  Next, the best embodiment according to the present invention will be given and described in detail with reference to the drawings.

  First, the configuration of the card-shaped component manufacturing apparatus 1 according to the present embodiment will be described with reference to FIGS.

  FIG. 1 shows an overall schematic diagram of the manufacturing apparatus 1. The manufacturing apparatus 1 includes a first material supply unit 20, a first thermocompression press unit 21, a first cooling unit 22, a trimming press unit 23, a frame separation unit 24, a second material supply unit 25, and a second material sequentially from the previous stage. A thermocompression pressing part 26, a second cooling part 27, and a cutting part 28 are provided.

  The first material supply unit 20 includes a first hoop unit 5 and a second hoop unit 8. The first hoop portion 5 is obtained by winding the first hoop material 6 around the first reel 42 in a roll shape, and can sequentially feed the first hoop material 6 from the first reel 42 that is rotatably supported. . As shown in FIG. 3, the first hoop material 6 has a plurality of lead frames 7, which are continuous in a band shape. For example, the first hoop material 6 is made of a general lead frame made of a copper alloy having a thickness of 50 to 100 μm. It can be manufactured using the method. The illustrated lead frame 7 has a shape in which four leads 4 are connected to a frame main body 44 via dam bars 43. 6h are feed holes formed at regular intervals along the longitudinal direction of the frame body 44.

  Further, the first hoop material 6 according to the present embodiment is configured by connecting (mounting) the IC chips 3 to the leads 4 in the lead frames 7 in advance, that is, the IC chips 3 and the leads 4. A module connected by bonding wires 46... Therefore, the first hoop material 6 is manufactured in advance by a wire bonding process or a chip bonding process. As described above, if the IC chips (electronic components) 3... Are provided in advance on the first hoop material 6, the mounting process of the IC chips 3. There is an advantage that it is possible to avoid adverse effects such as unnecessary stress being applied to each substrate material (Pa ...) after the crimping step.

  On the other hand, the second hoop portion 8 is obtained by winding the second hoop material 9 around the second reel 48 in a roll shape, and sequentially feeds the second hoop material 9 from the second reel 48 that is rotatably supported. Can do. As shown in FIG. 4, the second hoop material 9 uses a belt-shaped resin sheet using a synthetic resin such as a thermoplastic resin. The second hoop material 9 corresponds to the position of each lead 4 in the first hoop material 6, and a part of each lead 4 is exposed when the second hoop material 9 and the first hoop material 6 are thermocompression bonded. A plurality of connection holes 14 are formed. The size of the connection holes 14 is formed smaller than the size of the leads 4 as shown by phantom lines in FIG. With such a configuration, the connection holes 14 are arranged in the recesses, so that it is possible to protect the soldered portions and the like welded to the connection holes 14. Further, the second hoop material 9 is formed with feed holes 9h at regular intervals along the longitudinal direction. The positions of the feed holes 9h are formed at positions positioned with respect to the positions of the feed holes 6h formed in the first hoop material 6.

  And the 1st hoop part 5 mentioned above is arrange | positioned above the 2nd hoop part 8, and the 1st hoop material 6 to let | feed out makes the bonded side of IC chip 3 ... the upper side. A supply sprocket 41 is disposed between the material supply unit 20 and the first thermocompression press unit 21. In the supply sprocket 41, engagement pins (not shown) are provided at regular intervals in the circumferential direction of the outer peripheral surface, and the feed holes 9h provided in the second hoop material 9 are provided in the engagement pins. And the feed holes 6h of the first hoop material 6 are engaged together.

  On the other hand, the first thermocompression pressing section 21 includes a lower fixed press panel 52d with a built-in heater 51d and a heating heater 51u, and an upper movable press panel 52u that is lifted by a lift 53. And has a function of thermocompression bonding the first hoop material 6 and the second hoop material 9. In this case, as shown in FIG. 2 (a), an elastic sheet (elastic mat) 54d formed with a constant thickness by an elastic material such as silicon rubber is fixed to the upper surface of the fixed press panel 52d and is movable. Similarly, an elastic sheet (elastic mat) 54u formed in a certain thickness by an elastic material such as silicon rubber is fixed to the lower surface of the press panel 52u. As a result, the lower surface of the elastic sheet 54u becomes the first elastic surface 31u, and the first elastic surface 31u functions as an upper press surface pressed against the upper surface of the first hoop material 6, and the upper surface of the elastic sheet 54d is the second elastic surface. The second elastic surface 31d functions as a lower press surface that comes into pressure contact with the lower surface of the second hoop material 9. As described above, if the elastic surface 31 u is used at least on the press surface located on the first hoop material 6 side in the first thermocompression-bonding press portion 21, even if the surface of the first hoop material 6 is uneven. The first hoop material 6 and the second hoop material 9 can be uniformly thermocompression bonded by the flat elastic surface 31u (press surface). The heating temperature and the applied pressure during the thermocompression pressing can be arbitrarily selected from the viewpoint of the properties of the material used for the second hoop material 9 and the protection of the IC chip 3 in the first hoop material 6.

  In the illustrated embodiment, the hardness of the first elastic surface 31u and the hardness of the second elastic surface 31d are different. In this case, the hardness of the first elastic surface 31u is set to be relatively smaller than the hardness of the second elastic surface 31d, that is, as shown in FIG. 2B, the hardness of the first elastic surface 31u and the second elasticity The ratio of the hardness of the surface 31d is selected to be a ratio that causes each of the leads 4 to bulge into the connection holes 14 by a predetermined protruding length Lp during the thermocompression pressing. Thereby, at the time of thermocompression pressing, each lead 4 can be reliably bulged into the connection hole 14 by a predetermined protrusion length Lp, and the first hoop material 6 after the first thermocompression bonding step described later. And the position shift of the second hoop material 9 can be prevented. In particular, the projection length Lp can be arbitrarily changed by selecting (changing) the ratio.

  On the other hand, the first cooling unit 22 includes a lower fixed cooling platen 56d incorporating a coolant jacket 55d, and an upper movable cooling platen 56u that incorporates a coolant jacket 55u and is raised and lowered by a lifting unit 57. And having a function of forcibly cooling the first substrate material Pa sent out from the first thermocompression press part 21. In this case, elastic sheets (elastic mats) 58d and 58u formed with a constant thickness by an elastic material such as silicon rubber are fixed to the upper surface of the fixed cooling platen 56d and the lower surface of the movable cooling platen 56u, respectively. However, an elastic material having a lower hardness than that of the first thermocompression pressing part 21 side can be used for cooling. The cooling temperature and the cooling time in the second cooling unit 22 are preferably selected so that the cooling can be forcibly cooled to around normal temperature in consideration of the heating temperature and the manufacturing cycle time in the first thermocompression pressing unit 21. . If such a first cooling unit 22 is provided, the first substrate material Pa after thermocompression bonding can be quickly cooled, preferably forcibly cooled to near normal temperature, so that accurate trimming is always performed in the next trimming process. be able to.

  The trimming press part 23 includes a lower support base 61 and an upper cutter part 63 that is raised and lowered by an elevating part 62, and four leads 4 in the lead frame 7 that are crimped to the upper surface of the second hoop material 9. It has a function of cutting the dam bar 43. The frame separation unit 24 includes a separation sprocket 65 and a frame collection unit 66. In this case, the separation sprocket 65 has a function of separating the remaining frame 10 excluding the leads 4 in the lead frames 7 of the first hoop material 6 from the second substrate material Pb sent out from the trimming press portion 23, The separated remaining frame 10 is taken up by a collection reel 67 of a frame collection unit 66 disposed above the separation sprocket 65.

  A second material supply unit 25 is disposed following the frame separation unit 24. The second material supply unit 25 includes the third hoop unit 11. The 3rd hoop part 11 winds the 3rd hoop material 12 on the 3rd reel 71 in roll shape, and can sequentially draw | feed out the 3rd hoop material 12 from the 3rd reel 71 supported so that rotation was possible. . As shown in FIG. 5, the third hoop material 12 uses a belt-shaped resin sheet using a synthetic resin such as a thermoplastic resin. Further, the third hoop material 12 is formed with feed holes 12h at regular intervals along the longitudinal direction. The positions of the feed holes 12h are formed at positions positioned with respect to the positions of the feed holes 6h formed in the first hoop material 6. The third hoop portion 11 is disposed above the first hoop material 6. On the other hand, a supply sprocket 72 is disposed between the third hoop portion 11 and the first hoop material 6, and a positioning sprocket 73 that contacts the lower surface of the second hoop material 9 is disposed. The sprockets 72 and 73 are the same as the supply sprocket 41 described above, and engagement pins (not shown) are provided at regular intervals in the circumferential direction of the outer peripheral surface.

  The second thermocompression press section 26 includes a lower fixed press board section 76d with a built-in heater 75d, and an upper movable press board section 76u with a built-in heating heater 75u and raised and lowered by an elevating section 77. And having the function of thermocompression bonding the third hoop material 12 supplied from the third hoop portion 11 and the third chip material Pc side of the third substrate material Pc sent out from the frame separation portion 24 (separation sprocket 65). In this case, elastic sheets (elastic mats) 78d and 78u formed with a constant thickness by an elastic material such as silicon rubber are fixed to the upper surface of the fixed press platen 76d and the lower surface of the movable press platen 76u, respectively. The heating temperature and the applied pressure during the thermocompression pressing can be arbitrarily selected in consideration of the properties of the materials used for the second hoop material 9 and the third hoop material 12. In addition, unlike the first thermocompression press part 21 side, the elastic sheets 78d and 78u need to ensure flatness, and therefore it is not necessary to increase the hardness or to provide it.

  The second cooling unit 27 includes a lower fixed cooling platen 82d incorporating a coolant jacket 81d, and an upper movable cooling platen 82 that incorporates a cooling liquid jacket 81u and is raised and lowered by an elevating unit 83. The fourth substrate material Pd fed from the second thermocompression press section 26 has a function of forcibly cooling. The second cooling unit 27 can be configured in the same manner as the first cooling unit 22. Reference numerals 84d and 84u denote elastic sheets fixed to the upper surface of the fixed cooling platen portion 82d and the lower surface of the movable cooling platen portion 82u, respectively. Further, the cooling temperature and the cooling time in the second cooling unit 27 are preferably selected so that the cooling can be forcibly cooled to around the normal temperature in consideration of the heating temperature and the manufacturing cycle time in the second thermocompression pressing unit 26. . By providing such a second cooling part 27, the fourth substrate material Pd after thermocompression bonding can be quickly cooled, preferably forcibly cooled to near room temperature, so that accurate cutting is always performed in the next cutting process. be able to.

  The cutting unit 28 includes a cutting unit 85 that cuts the fourth substrate material Pd fed from the second cooling unit 27 into a predetermined shape. By cutting the fourth substrate material Pd, the target card-shaped component P is cut. Get. The manufacturing apparatus 1 shown in FIG. 1 shows only a basic configuration related to the present invention, and general configurations such as a transport mechanism and a sequence control mechanism are omitted. Therefore, other general various mechanisms required for the production line can use known techniques.

  Next, the card-shaped component manufacturing method according to the present embodiment using the manufacturing apparatus 1 having such a configuration will be described with reference to FIGS. 1 to 4 and FIGS. explain.

  First, the first hoop material 6 is supplied from the first hoop portion 5 and the second hoop material 9 is supplied from the second hoop portion 8 (steps S1 and S2). That is, the first hoop material 6 is fed out from the first reel 42 of the first hoop portion 5 and the second hoop material 9 is fed out from the second reel 48 of the second hoop portion 8 to have a guide roller function. It is supplied to the first thermocompression pressing part 21 via the sprocket 41. At this time, the first hoop material 6 with the bonded side of the IC chip 3 on the upper side is superimposed on the upper surface of the second hoop material 9, and the feed holes 6h of the first hoop material 6 and the feed of the second hoop material 9 are overlapped. The holes 9h are simultaneously engaged with engaging pins (not shown) of the supply sprocket 41, and positioning between the first hoop material 6 and the second hoop material 9 is performed by the positioning function of the supply sprocket 41 ( Step S3). Thereby, positioning of the 1st hoop material 6 and the 2nd hoop material 9 can be performed easily and correctly, without providing an advanced positioning mechanism in the 1st thermocompression-bonding press part 21 side which performs thermocompression bonding. FIG. 8 shows the first hoop material 6 and the second hoop material 9 before the supply sprocket 41, and FIG. 9 shows the first hoop material 6 and the second hoop material 9 after passing through the supply sprocket 41. Indicates.

  Next, the first hoop material 6 and the second hoop material 9 sent out from the supply sprocket 41 are thermocompression bonded in the first thermocompression bonding step (first thermocompression press part 21) (step S4). In this case, the first hoop material 6 and the second hoop material 9 are supplied between the movable press platen portion 52u (first elastic surface 31u) and the fixed press platen portion 52d (second elastic surface 31d) raised by the elevating unit 53. If the predetermined position is set, the movable press panel 52u is lowered, and the first hoop material 6 and the second hoop material 9 are thermocompression bonded. The press panel portions 52u and 52d are heated by heating heaters 51u and 51d, respectively.

  Further, the hardness of the second elastic surface 31d and the hardness of the first elastic surface 31u are set at a predetermined ratio so that the hardness of the first elastic surface 31u is smaller than the hardness of the second elastic surface 31d. At the time of press bonding, as shown in FIG. 2 (b), the respective leads 4 bulge into the connection holes 14 by a predetermined protruding length Lp. Thereby, the position shift of the 2nd hoop material 9 and the 1st hoop material 6 after a 1st thermocompression bonding process is prevented reliably, and it can contribute to ensuring of manufacture quality and a yield improvement. In FIG. 10, the 1st board | substrate material Pa obtained by the 1st thermocompression-bonding press part 21 is shown.

  Furthermore, the 1st board | substrate material Pa sent out from the 1st thermocompression-bonding press part 21 is cooled by the 1st cooling process (1st cooling part 22) (step S5). In this case, if the first substrate material Pa is supplied between the movable cooling platen 56u (elastic sheet 58u) and the fixed cooling platen 56d (elastic sheet 58d) raised by the elevating unit 57 and is set at a predetermined position, it is movable. The cooling board part 56u descends and the first substrate material Pa is forcibly cooled. The cooling platens 56u and 56d are cooled by the cooling liquid flowing through the cooling liquid jackets 55u and 55d, respectively.

  Next, the first substrate material Pa sent out from the first cooling unit 22 is trimmed by a trimming process (trimming press unit 23) (step S6). In this case, if the first substrate material Pa is supplied between the cutter unit 63 raised by the elevating unit 62 and the support base 61 and set at a predetermined position, the cutter unit 63 descends and is placed on the upper surface of the second hoop material 9. The second substrate material Pb is obtained by cutting the space between the four leads 4 and the dam bars 43 in the lead frame 7 that is crimped.

  Then, the second substrate material Pb is supplied to the frame separation unit 24, and the remaining frame 10 of the first hoop material 6 excluding at least the leads 4 ... is separated from the second substrate material Pb by the frame separation step (step S7). ). In this case, when the second substrate material Pb passes through the separation sprocket 65, the remaining frame 10 of the first hoop material 6 is wound around the recovery reel 67 disposed above and recovered (step S8). ).

  The third substrate material Pc from which the remaining frame 10 has been separated is supplied to the second thermocompression press section 26 via the positioning sprocket 73. On the other hand, the third hoop material 12 is fed out from the third hoop portion 11 and is superimposed on the IC chip 3 side of the third substrate material Pc via the supply sprocket 72, and second heat is transmitted via the positioning sprocket 73. The pressure is supplied to the press unit 26 (steps S9 and S10). At this time, the IC chip 3 is sandwiched between the lower second hoop material 9 and the upper third hoop material 12, and the feed holes 9 h of the second hoop material 9. The feed holes 12h are simultaneously engaged with engaging pins (not shown) of the positioning sprocket 73, and positioning between the third substrate material Pc and the third hoop material 12 is performed by the positioning function of the positioning sprocket 73. . Thereby, positioning of the 3rd board | substrate material Pc and the 3rd hoop material 12 can be performed easily and correctly, without providing an advanced positioning mechanism in the 2nd thermocompression-bonding press part 26 side which performs thermocompression bonding. FIG. 11 shows the third substrate material Pc and the third hoop material 12.

  The third substrate material Pc and the third hoop material 12 sent out from the positioning sprocket 73 are thermocompression bonded by the second thermocompression bonding step (second thermocompression press part 26) (step S11). In this case, the third substrate material Pc and the third hoop material 12 are supplied between the movable press platen 76u (elastic sheet 78u) and the fixed press platen 76d (elastic sheet 78d) raised by the elevating / lowering unit 77, and at a predetermined position. If it is set to (4), the movable press board part 76u will descend | fall, and the 4th board | substrate material Pd will be obtained by the 3rd board | substrate material Pc and the 3rd hoop material 12 being thermocompression-bonded. The press panel portions 76u and 76d are heated by heating heaters 75u and 75d, respectively. FIG. 12 shows the fourth substrate material Pd obtained by the second thermocompression bonding step.

  Furthermore, the 4th board | substrate material Pd sent out from the 2nd thermocompression-bonding press part 26 is cooled by the 2nd cooling process (2nd cooling part 27) (step S12). In this case, if the fourth substrate material Pd is supplied between the movable cooling platen 82u (elastic sheet 84u) and the fixed cooling platen 82d (elastic sheet 84d) raised by the elevating unit 83 and is set at a predetermined position, it is movable. The cooling platen 82u is lowered and the fourth substrate material Pd is forcibly cooled. Each of the cooling platens 82u and 82d is cooled by the cooling liquid flowing through the cooling liquid jackets 81u and 81d.

  Next, the fourth substrate material Pd is sent to the cutting unit 28 and cut by the cutting process (step S13). That is, the fourth substrate material Pd is cut into a predetermined shape by the cutting portion 85 in the cutting portion 28. Thereby, the target card-shaped component P can be obtained (step S14). 6 and 13 show the obtained card-shaped part P. FIG. Reference numerals 91a and 91b indicated by phantom lines in FIG. 13 indicate lead wires connected to the leads 4 through soldered portions.

  Next, a modified embodiment of the manufacturing apparatus 1 (manufacturing method) according to the present invention will be described with reference to FIGS.

  First, FIG. 14 shows a modified embodiment using the second hoop material 9 without the connection holes 14. Therefore, in this case, the leads 4 are not used as original leads, but are used for, for example, a built-in antenna or the like, or a mounting plate for mounting the IC chip (electronic component) 3 on the second hoop material 9. Available as

  FIG. 15 shows a modified embodiment of the first thermocompression press part 21. In selecting the hardness of the elastic surface 31u used for the movable press panel 52u (on the first hoop material 6 side), the first thermocompression press part 21 has a hardness that does not deform the leads 4 during the thermocompression press. 4 is selected so as not to bulge into the connection holes 14. Therefore, the hardness of the elastic surface 31d used for the fixed press panel 52d (second hoop material 9 side) is not particularly limited, and can desirably be selected to be equal to or larger than the hardness of the elastic surface 31u, and the elastic surface is not necessarily selected. It is not necessary to provide the elastic surface 31u at least on the press surface located on the first hoop material 6 side.

  Furthermore, FIG. 16 uses the elastic surface 31u for the press surface located at least on the first hoop material 6 side in the first thermocompression-bonding press portion 21, and connects the leads 4 to the connection holes 14 on the elastic surface 31u. Are provided with protrusions 32u that protrude by a predetermined protrusion length Lp. Accordingly, there is an advantage that the predetermined protrusion length Lp... That bulges the leads 4 into the connection holes 14 can be easily and reliably realized by only one elastic surface 31u.

  Therefore, according to the manufacturing method and the manufacturing apparatus 1 of the card-shaped component according to the present embodiment including such a modified embodiment, the electronic components 3... Are mounted continuously in a strip shape supplied from the first hoop unit 5. Since the process includes the step of thermocompression bonding the first hoop material 6 having a plurality of lead frames 7 and the second hoop material 9 using the strip-shaped resin sheet supplied from the second hoop portion 8, a series of manufacturing processes is not interrupted. Thus, the production line can be easily constructed, and therefore, the productivity can be improved along with the reduction in the number of manufacturing steps (manufacturing time), and further, the production efficiency (mass productivity) can be improved. In addition, since a series of production lines can be constructed in which the production process is not interrupted, the cost of production equipment (production machines) can be greatly reduced, and a large equipment space is not required, thereby saving space in a production factory or the like. In addition, since a separately manufactured wiring board such as a printed circuit board is not required, cost reduction from the side of the parts and materials used can be realized. In addition, since the first hoop material 6 is used which has a plurality of lead frames 7 which are continuously provided in a strip shape and are mounted with the electronic components 3... Supplied from the first hoop portion 5, the electronic components 3 after the first thermocompression bonding step are used. The mounting process is not required, and adverse effects such as unnecessary stress being applied to each substrate material Pa after the first thermocompression bonding process can be eliminated.

  The best embodiment and the modified embodiment have been described in detail above. However, the present invention is not limited to such an embodiment, and the present invention is not limited to such a configuration, shape, material, quantity, numerical value, and the like. Any change, addition, or deletion can be made without departing from the scope of the above.

  For example, the number of electronic components 3 to be connected (mounted) to one lead frame 7 may be one as illustrated or plural. Various electronic components such as an IC chip and a memory element can be applied to the electronic components 3. On the other hand, the card-shaped component P can be used for various electronic circuit components such as an IC card and chip built-in components (IC module, VGA substrate, etc.). Furthermore, the card-shaped part P can be used as an IC card or the like as it is, and a part or all of the card-shaped part P may be molded by insert molding using an injection molding machine or the like as necessary.

Schematic diagram showing a card-shaped component manufacturing apparatus according to the best embodiment of the present invention, Extraction expanded sectional view of the 1st thermocompression press part in the manufacturing device, The top view which shows a part of 1st hoop material used for the manufacturing apparatus, The top view which shows a part of 2nd hoop material used for the manufacturing apparatus, The top view which shows a part of 3rd hoop material used for the manufacturing apparatus, A partially broken plan view of a card-shaped part manufactured by a manufacturing method according to the best embodiment of the present invention, Process diagram for explaining the manufacturing method step by step, Sectional drawing in the XX line position in FIG. 3 which shows the 1st hoop material and the 2nd hoop material at the time of manufacture by the manufacturing method, Sectional drawing in the XX line position in FIG. 3 which shows the 1st hoop material and the 2nd hoop material before the 1st thermocompression bonding process at the time of manufacture by the manufacturing method, Sectional drawing in the XX line position in FIG. 3 which shows the 1st board | substrate material after the 1st thermocompression bonding process at the time of manufacture by the manufacturing method, Sectional drawing in the XX line position in FIG. 3 which shows the 3rd board | substrate material and the 3rd hoop material after the flame separation process at the time of manufacture by the manufacturing method, Sectional drawing in the XX line position in FIG. 3 which shows the 4th board | substrate material after the 2nd thermocompression bonding process at the time of manufacture by the manufacturing method, Sectional drawing in the YY line position in FIG. 6 which shows the card-shaped components manufactured by the manufacturing method, Sectional drawing in the YY line position in FIG. 6 which shows the card-type components manufactured by the manufacturing method which concerns on the modified embodiment of this invention, Extraction expanded sectional view of the 1st thermocompression-bonding press part in a manufacturing device concerning a change embodiment of the present invention, Extraction expanded sectional view of the 1st thermocompression-bonding press part in a manufacturing device concerning other change embodiments of the present invention,

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1: Manufacturing apparatus, 3 ...: Electronic component, 4 ...: Lead, 5: 1st hoop part, 6: 1st hoop material, 6h ...: Feed hole, 7 ...: Lead frame, 8: 2nd hoop part, 9 : Second hoop material, 9h ...: feed hole, 10: remaining frame, 11: third hoop part, 12: third hoop material, 14 ...: connection hole, 21: first thermocompression press part, 22: first Cooling section, 23: trimming press section, 24: frame separating section, 26: second thermocompression pressing section, 27: second cooling section, 28: cutting section, 31u: elastic surface (first elastic surface), 31d: first Two elastic surfaces, P ...: Card-shaped parts, Pa: First substrate material, Pb: Second substrate material, Pc: Third substrate material, Pd: Fourth substrate material, S4: First thermocompression bonding step, S6: Trimming Process, S7: Frame separation process, S11: Second thermocompression bonding process, S13: Cutting process, L ...: the protruding length

Claims (5)

  In a method for manufacturing a card-type component incorporating an electronic component, at least supplied from a first hoop material and a second hoop portion having a plurality of lead frames on which the electronic component is mounted, which are continuous in a strip shape supplied from the first hoop portion A second hoop material using a strip-shaped resin sheet is provided, and the second hoop material is provided with a plurality of connection holes corresponding to the positions of the leads in the first hoop material, and the first hoop material The second hoop material is thermocompression-bonded to expose a part of each lead in each connection hole, and each lead is swelled into each connection hole by a predetermined protruding length to form a first substrate material. A first thermocompression step, a trimming step of trimming the first hoop material in the first substrate material to obtain a second substrate material, and a remaining portion of the first hoop material excluding at least leads from the second substrate material A frame separating step for separating a ram to obtain a third substrate material, and a third hoop material using a band-shaped resin sheet supplied from the electronic component side of the third substrate material and a third hoop portion are thermocompression bonded. A card-shaped component manufacturing method comprising: a second thermocompression bonding step of obtaining a fourth substrate material; and a cutting step of cutting the fourth substrate material to obtain the card-shaped component.   2. The method of manufacturing a card-shaped part according to claim 1, wherein the first hoop material and the second hoop material have feed holes at regular intervals along the longitudinal direction.   In a card-type component manufacturing apparatus incorporating an electronic component, at least a first hoop portion that supplies a first hoop material having a plurality of lead frames that are continuous in a strip shape and on which electronic components are mounted, and a strip-shaped resin sheet are used. In addition, a second hoop material corresponding to the position of each lead in the first hoop material and having a plurality of connection holes in which a part of each lead is exposed when thermocompression is applied to the first hoop material is supplied. A second hoop material, a third hoop material for supplying a third hoop material using a belt-shaped resin sheet, and a press surface located on the first hoop material side, the first elastic surface being used, and the second hoop material A second elastic surface having a hardness different from that of the first elastic surface is used as the press surface located on the side, and the ratio of the hardness of the first elastic surface to the hardness of the second elastic surface is determined during thermocompression pressing. Before each lead A first thermocompression press part that obtains a first substrate material by thermocompression bonding the first hoop material and the second hoop material by selecting a ratio that bulges by a predetermined protruding length inside the connection hole; A trimming press part for trimming the first hoop material in the first substrate material to obtain a second substrate material, and a remaining frame of the first hoop material excluding at least leads from the second substrate material are separated into a third base A frame separating unit for obtaining a plate material, a second thermocompression pressing unit for obtaining a fourth substrate material by thermocompression bonding the electronic component side of the third substrate material and the third hoop material, and cutting the fourth substrate material. A card-shaped component manufacturing apparatus comprising a cutting unit for obtaining the card-shaped component.   4. The card-shaped component manufacturing apparatus according to claim 3, further comprising a first cooling section that cools the first substrate material between the first thermocompression pressing section and the trimming press section.   The card-shaped component manufacturing apparatus according to claim 3, further comprising a second cooling unit that cools the fourth substrate material between the second thermocompression pressing unit and the cutting unit.

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