JP4856470B2 - Wiring board - Google Patents

Description

  The present invention provides a wiring comprising: a heat radiating member for mounting an electronic component such as a light emitting element or an IC chip on an upper element mounting surface; and a substrate body made of an insulating material that penetrates and fixes a column portion of the heat radiating member. Regarding the substrate.

In order to easily obtain a high-intensity light amount, a multilayer substrate made of ceramic, a heat dissipation member that penetrates and joins between the front and back surfaces of the multilayer substrate, an LED element mounted on the upper surface of the heat dissipation member, and the LED There has been proposed a light-emitting device including a package provided on the laminated substrate so as to surround an element and having a light reflection surface on the inside (see, for example, Patent Document 1).
However, in the above light emitting device, when a heat radiating member made of metal is inserted into the two upper and lower holes of the multilayer substrate, there is no gap between the inner wall of the hole and the side surface of the heat radiating member. For this reason, electrolytic Ni plating and electrolytic Au plating cannot be applied to the side surface of the heat radiating member, and corrosion on the side surface of the heat radiating member may not be prevented.

JP 2006-29687 A (pages 1 to 18, FIG. 1) Japanese Patent Laid-Open No. 10-29687 (pages 1 to 7, FIGS. 1 and 2)

On the other hand, when the upper part of the metal heat dissipating member is inserted into the through hole of the ceramic package body and the package main body and the heat dissipating member are fixed, the upper part of the heat dissipating member and the inner surface of the through hole An electronic component package has been proposed in which gaps of two sizes, large and small, are formed between them to facilitate the circulation of the cleaning liquid and prevent the plating liquid from remaining (see, for example, Patent Document 2).
However, in the electronic component package, since a gap having a small width is located on the entire circumference between the upper portion of the heat dissipation member and the inner surface of the through hole, the positioning of the heat dissipation member with respect to the package body is not possible. It becomes difficult to carry out with high precision in the planar direction of the package body. As a result, there has been a problem that it is difficult to eliminate an error when the heat radiating member and the package body are joined by brazing.

  The present invention solves the problems described in the background art, and the positioning and fixing of the substrate body made of an insulating material and the metal heat dissipating member are made with high precision, and the metal plating is securely applied to the side surface of the heat dissipating member. It is an object of the present invention to provide an applied wiring board.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problems, the present invention has been conceived by bringing the substrate body and the heat radiating member into direct surface contact with each other in a small area.
That is, the first wiring board according to the present invention (Claim 1) is made of an insulating material, and has a substrate body having a front surface and a back surface, a through hole penetrating between the front surface and the back surface of the substrate body, and the through hole. A pillar portion having an element mounting surface at the upper end is inserted into the hole, and a base portion connected to the bottom of the pillar portion is fixed to the back surface of the substrate body or a recess that is adjacent to the through-hole and opens to the back surface of the substrate body. A protrusion that protrudes from and touches one of the lower portions to the other lower portion between the inner wall of the through hole of the plate body and the side surface of the column portion of the opposing heat dissipation member . and forming along the entire circumference of the inner wall and the side surface, formed gap along the entire periphery of the side surface of the columnar portion between the inner wall and the side of the pillar portion of the through hole via the projection It is characterized by being.

According to this, positioning and fixation in the plane direction between the substrate body and the heat radiating member are accurately performed by the protrusions, and along the entire circumference between the inner wall of the through hole and the side surface of the column part. since inter-gap is formed, the metal plating is reliably coated on the side surface of the pillar portion through such a gap. Therefore, it is possible to provide a wiring board with high dimensional accuracy and which hardly erodes the heat radiating member.
The insulating material includes high-temperature fired ceramics such as alumina, low-temperature fired ceramics such as glass-ceramics, and epoxy resins.
Further, the heat radiating member is made of Cu, Al having high thermal conductivity, or an alloy based on these, and has a form in which the column portion is erected from a central portion on the upper surface of the base portion.
Further, the fixing between the substrate body and the heat dissipation member is performed between the back surface of the substrate body and the upper surface of the heat dissipation member, between the ceiling surface of the recess of the substrate body and the upper surface of the heat dissipation member, or the ceiling surface of the recess. For example, brazing or bonding is performed between the side surface and the upper surface and side surface of the heat dissipation member.
In addition, the projection is a part of the insulating member protruding from the inner wall of the through hole of the substrate main body, or include collision strip made of a part of a metallic material which projects from the side surface of the heat radiating member.

In addition , the protrusion of the substrate body is formed by, for example, reducing the inner dimension of the punched hole that is a part of the through hole of the green sheet that forms the protrusion, among a plurality of green sheets to be laminated, or When the heat radiating member is press-molded from a metal material, it is obtained by forming a step portion on the entire circumference between the column portion and the base portion.

On the other hand, the second wiring board according to the present invention (Claim 2 ) is made of an insulating material, has a substrate body having a front surface and a back surface, a through hole penetrating between the front surface and the back surface of the substrate body, and the through hole. A column member having an element mounting surface at its upper end is inserted into the hole, and a base portion connected to the lower side of the column unit is fixed to a recess adjacent to the through hole and opened on the back surface of the substrate body. A protrusion that protrudes from and contacts one side to the other between the upper part of the side surface of the recess that opens to the back surface of the substrate body and the upper part of the side surface of the base part of the opposing heat dissipation member . While forming along the entire circumference ,
Through the protrusion, the entire circumference between the side surface of the inner wall and the column portion of the through hole, and along the entire circumference of the free position and the said projecting portion between the side surface and the base of the recess A gap is formed.

According to this, the projection is positioned and fixed in the planar direction between the substrate body and the heat radiating member with high accuracy, and between the inner wall of the through hole and the side surface of the column portion, and the side surface and base of the recess. A gap is formed along the entire circumference with the side surface of the portion. For this reason, metal plating is reliably coat | covered on the side surface of a pillar part and a base part through this clearance gap. Therefore, it is possible to provide a wiring board with high dimensional accuracy and which hardly erodes the heat radiating member.
The method for forming the protrusion is the same as that for the first wiring board .

Further, according to the present invention, the through hole of the substrate main body and the pillar portion of the heat radiating member, or the recess of the substrate main body and the base portion of the heat radiating member are substantially similar in plan view. Claim 3) is also included .
In addition, the present invention includes a wiring board on which the light emitting element is mounted on the element mounting surface of the heat dissipation member .

In other words, according to the present invention, the through hole of the substrate main body and the column part of the heat dissipation member are substantially similar rectangles in plan view, and the inner wall of the through hole or the column part exhibiting such a rectangle. The wiring board in which the said protrusion is formed along the perimeter of the lower part in the thickness direction of this side surface can be included .
Also in this case, it is possible to obtain a wiring board with high dimensional accuracy and which hardly erodes the heat radiating member.

Further, according to the present invention, the through hole of the substrate main body and the column part of the heat radiating member have a similar circular shape in plan view, and the inner wall of the through hole or the side surface of the column part exhibiting the circular shape. along the entire circumference of the lower portion in the thickness direction, wherein the projection is formed can comprise a wiring board.
Also in this case, it is possible to obtain a wiring board with high dimensional accuracy and which hardly erodes the heat radiating member.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a plan view showing a wiring board 1 which is an embodiment of the first wiring board according to the present invention, FIG. 2 is a vertical sectional view taken along line XX in FIG. 1, and FIG. FIG. 2 is a perspective view including a vertical cross section of a substrate body 2 constituting the wiring substrate 1.
As shown in FIGS. 1 and 2, the wiring substrate 1 includes a substrate body 2 having a front surface 3 and a back surface 4, a through hole 5 that penetrates between the front surface 3 and the back surface 4 of the substrate body 2, and the through hole 5. And a base 9 inserted into and fixed to the recess 9, which is adjacent to the periphery of the substrate body 2, is open to the back surface 4 of the substrate body 2, and the column portion 12 is inserted into the through hole 5. A heat radiating member (heat sink) 10 having a portion 16 is provided.
As shown in FIGS. 2 and 3, the substrate body 2 is formed by integrally laminating ceramic layers c1 to c3 made of alumina (insulating material), for example, and has a substantially square shape in plan view and a substantially flat plate-like body. The through hole 5 has a square shape in plan view, and a protrusion 8 is provided on the inner side along the entire circumference of the lower portion of the inner wall 6.

A wiring layer having a predetermined pattern is formed between the ceramic layers c1 to c3. These wiring layers are electrically connected to each other via via conductors penetrating the ceramic layers c1 to c3, and are formed on the front surface 3 and the back surface 4. The connected pads (both not shown) are electrically connected. Such wiring layers, via conductors, and pads are made of W or Mo.
Further, the heat radiating member 10 is made of a Cu alloy, and as shown in FIGS. 1 and 2, a square columnar column 12 having a square (rectangular) element mounting surface 13 at the upper end, and such a column 12. And a base portion 16 having a square shape in a plan view connected to the entire circumference below. In the heat radiating member 10, the column portion 12 and the base portion 16 are inserted into the through hole 5 and the depression 9 of the substrate body 2, and the space between the base portion 16 and the depression 9 is brazed via an Ag brazing ( Fixed) or bonded (fixed) with an organic adhesive.

As shown in FIGS. 1 and 2, the lower portion of the side surface 14 of the column portion 12 in the heat radiating member 10 and the tip end surface 7 of the protruding portion 8 projecting inward from the lower portion of the inner wall 6 in the through hole 5 of the substrate body 2 are as follows. The gaps s having a constant width are formed along the entire circumference of the column portion 12 between the inner wall 6 of the through hole 5 and the side surface 14 of the column portion 12 above the surface. The gap s is open on the surface 3 side of the substrate body 2.
Further, on the element mounting surface 13 of the pillar portion 12 of the heat radiating member 10, the side surfaces 14, and the bottom surface of the base portion 16, a Ni plating film having a thickness of about 1 to 20 μm and an Au plating having a thickness of about 0.1 to 6 μm. A membrane (both not shown) is coated.
In addition, the element mounting surface 13 of the column portion 12 of the heat radiating member 10 is substantially flush with the surface 3 of the substrate body 2. On the element mounting surface 13, an electronic component 18 such as an IC chip or a light emitting element such as an LED is provided. It is mounted via Ag solder or conductive adhesive. Further, the electronic component 18 and the pad formed on the surface 3 of the substrate body 2 are electrically connected via a bonding wire (not shown).

The wiring board 1 as described above was manufactured as follows.
A ceramic slurry was prepared by mixing raw materials composed of alumina powder particles, a resin binder, a plasticizer, a solvent, and the like in advance. The ceramic slurry was subjected to a doctor blade method to form three-layer green sheets having a square shape in plan view and different thicknesses.
Next, a through hole having a square cross section is formed by punching with a punch and a die receiving hole in the relatively thick green sheet of the three layers, and the through hole is formed in the relatively thin green sheet. A through-hole having a square cross section with slightly smaller vertical and horizontal dimensions was formed by punching similar to the above. On the remaining green sheets, through holes having a square cross section having a larger vertical and horizontal dimension than the two through holes were formed by punching similar to the above.

Next, a required number of via holes are respectively formed around each through hole in the three-layer green sheet in which the through holes are formed, and a conductive paste containing W or Mo powder is filled therein to fill the vias. A conductor was formed. Further, conductive paste was screen-printed with a predetermined pattern on at least one of the front and back surfaces of these green sheets to form wiring layers and pads following the pattern.
The green sheet laminate was formed by laminating and pressure-bonding the remaining two layers of green sheets on both sides of the green sheet having the through hole of the minimum size, individually and so that the through holes were concentrically connected. The green sheet laminate was heated and fired at a predetermined temperature range. As a result, the substrate body 2 is formed of the ceramic layers c1 to c3 and has the front surface 3, the back surface 4, the through hole 5, the protrusion 8 protruding from the entire periphery of the lower portion of the inner wall 6 of the through hole 5, and the depression 9. Obtained.

On the other hand, a plate-shaped material made of a Cu alloy is pressed by a male / female die, so that the base portion 16 having a square shape in plan view and the element mounting surface 13 and the side surface having a square shape in a plan view standing from the center portion thereof. The heat radiating member 10 which consists of the pillar part 12 which has 14 was formed.
Next, as shown by the arrows in FIG. 4, the column portion 12 of the heat radiating member 10 in which a sheet of Ag wax (not shown) is arranged on the upper surface and each side surface of the base portion 16 is inserted into the through hole 5 of the substrate body 2. At the same time, the base portion 16 was inserted into the recess 9 of the substrate body 2. At this time, the front end surface 7 of the protrusion 8 of the substrate body 2 is in surface contact with the entire periphery of the lower portion of each side surface 14 of the column portion 12 of the heat radiating member 10, and the side surface 14 above these and the inner wall of the through hole 5. A gap s of about several tens to several hundreds of μm was formed between the two.
Further, the substrate body 2 and the heat radiating member 10 were heated to about 700 to 900 ° C. to melt the Ag brazing, and the substrate body 2 and the heat radiating member 10 were fixed by brazing.

Then, Ni and Au electroplating were sequentially applied to the element mounting surface 13, the side surface 14, and the bottom surface of the base portion 16 of the column portion 12 in the heat radiating member 10 fixed to the substrate body 2. At this time, the plating solution for each electrolytic plating was sufficiently circulated through the gaps s on each side surface 14 of the column portion 12 of the heat radiating member 10.
As a result, the Ni and Au plating films could be reliably coated on the side surface 14 of the column part 12. Through the above steps, the wiring board 1 shown in FIGS. 1 and 2 was obtained.
According to the wiring board 1 as described above, the protrusion 8 allows the substrate body 2 and the heat radiating member 10 to be positioned and fixed in the planar direction with high accuracy, and the inner wall 6 and the pillar portion of the through hole 5. Since the gap s is formed between the twelve side surfaces 14, the Ni and Au plating films are reliably covered also on the side surfaces 14 of the column portions 12 through the gaps s. Therefore, the wiring substrate 1 is high in dimensional accuracy and the heat radiating member 10 is hardly corroded. When the heat radiating member 10 is made of an Al alloy, adhesion is used instead of the brazing.

FIG. 5 is a partial plan view schematically showing a wiring board 1a as a reference form, and FIG. 6 is a vertical sectional view thereof.
As shown in FIGS. 5 and 6, the wiring board 1 a is adjacent to a substrate body 2 a having a front surface 3 and a back surface 4, a through hole 5 penetrating between the front surface 3 and the back surface 4, and the periphery of the through hole 5. The base body 2 a has a recess 9 that opens to the back surface 4, and a column portion 12 is inserted into the through-hole 5, and is connected to the lower portion of the column portion 12, and has a base portion 16 that is inserted into and fixed to the recess 9. A member 10 is provided.
As shown in FIGS. 5 and 6, the substrate body 2 a is formed by integrally laminating the same ceramic layers c1 to c3 as described above, and has a square shape in plan view and a substantially flat plate-like body. The through-hole 5 is square in plan view, and is divided for each central portion of each side at the top of the inner wall 6, and a plurality of protrusions 8 a are provided on the inside.
In addition, the same via conductors and wiring layers as those described above are formed between the ceramic layers c1 to c3, and pads similar to the above are also formed on the front surface 3 and the back surface 4.

As shown in FIGS. 5 and 6, in the heat dissipation member 10 similar to the above, the column portion 12 and the base portion 16 are inserted into the through hole 5 and the depression 9 of the substrate body 2 a, and the base portion 16 and the depression 9 are arranged. Are brazed (fixed) via Ag brazing, or are bonded (fixed) with an organic adhesive.
Moreover, the upper part of the side surface 14 of the column part 12 in the heat radiating member 10 and the tip surfaces 7 of the plurality of projecting parts 8a projecting from the upper part of the inner wall 6 in the through hole 5 of the substrate body 2a are in surface contact with each other. A gap s having a certain width is formed along the entire circumference of the column portion 12 between the inner wall 6 of the through hole 5 and the side surface 14 of the column portion 12 below the through hole 5. The gap s communicates with the surface 3 side of the substrate body 2 through a gap between the protrusions 8a and 8a.

Furthermore, the same Ni and Au plating films as those described above are coated on the element mounting surface 13 of each of the pillar portions 12, the side surfaces 14, and the bottom surface of the base portion 16 of the heat radiating member 10.
The element mounting surface 13 of the pillar portion 12 of the heat radiating member 10 has substantially the same height as the surface 3 of the substrate body 2a, and an electronic component 18 such as an IC chip is mounted in the same manner as described above. In addition, the electronic component 18 and the pad formed on the surface 3 of the substrate body 2a are electrically connected via a bonding wire (not shown). However, if the pad is formed on the surface 3 where the protrusion 8a is located, the pad is relatively short. It can conduct | electrically_connect with an electronic component via the said wire.

As shown in FIGS. 5 and 6, the wiring board 1 a of the reference form has a through hole having a square shape in a plan view formed on the green sheet serving as the uppermost ceramic layer c <b> 2, and the central portion of each side protrudes inward. Except for punching as described above, it could be manufactured through the same steps as described above.
Also in the wiring board 1a as described above, the positioning and fixing of the board body 2a and the heat radiating member 10 in the planar direction are accurately performed by the plurality of protrusions 8a. Further, since the gap s is formed between the gap between the protrusions 8a and 8a and the inner wall 6 of the through hole 5 and the side surface 14 of the column part 12, the side surface of the column part 12 is interposed via the gap and the gap s. 14 is also securely covered with a Ni and Au plating film. Therefore, the wiring board 1a has high dimensional accuracy and the heat radiating member 10 is hardly corroded.

Figure 7 is a plan view showing a wiring substrate 1b of the different reference embodiment.
The wiring board 1b includes a board body 2b similar to the board body 2a and a heat radiating member 10. The wiring board 1b is different from the wiring board 1a in that the planar view is almost L in each through hole having a square cross section formed in the uppermost ceramic layer c2 including the surface 3 of the board body 2b. It is the point which is divided | segmented into the character-shaped protrusion 8b and protruded inside. For this reason, the through-holes that are square in plan view formed on the green sheet to be the uppermost ceramic layer c2 are punched out so that the vicinity of each corner protrudes inward, and the same steps as described above are performed. I was able to manufacture it.

Also in the wiring board 1b of the reference form, the plurality of protrusions 8b accurately position and fix the board body 2 and the heat radiating member 10 in the planar direction. Further, since the gap s is formed between the gap between the protrusions 8b and 8b and the inner wall 6 of the through hole 5 and the side surface 14 of the column portion 12, the side surface of the column portion 12 is interposed via the gap and the gap s. 14 is also securely covered with a Ni and Au plating film. Therefore, the wiring board 1a has high dimensional accuracy and the heat radiating member 10 is hardly corroded.

Figure 8 is a vertical sectional view similar to FIG 6 showing a wiring board 1c of different reference embodiment in further.
The wiring board 1c includes a board body 2c made of ceramic layers c1 to c4 and a heat radiating member 10 in the same manner as the board bodies 2a and 2b. The wiring board 1c is different from the wiring boards 1a and 1b in a through-hole having a square cross section formed in a relatively thin ceramic layer c2 that forms the middle layer of the substrate body 2c. In the vicinity, a projection 8c that is linear or substantially L-shaped in plan view is divided and projected inward. A gap is located between the plurality of protrusions 8c, 8c, and a gap s is formed between the side surface 14 of the column part 12 and the inner wall 6 of the through hole 5 at the upper and lower sides thereof.
The wiring board 1c is formed by punching through holes having a square shape in plan view formed on the green sheet to be the middle ceramic layer c2 so that the vicinity of each corner protrudes inward, or the plan view is substantially + -shaped. Except for punching, it could be manufactured through the same steps as described above.
The same effects as those of the wiring boards 1a and 1b were also obtained in the wiring board 1c of the reference embodiment .

FIG. 9 is a similar vertical cross-sectional view showing a wiring board 1 d of a modification of the wiring board 1. As shown in FIG. 9, the wiring substrate 1 d has a front surface 3 and a back surface 4, and includes a substrate body 2 d made of ceramic layers c <b> 2 and c <b> 3 and a heat radiating member 10.
The wiring board 1d is different from the wiring board 1 in that the protrusion 8 is formed flush with the back surface 4 of the board body 2d, and the gap s is located above the protrusion 8. The heat radiating member 10 is brazed or bonded (adhered) to the back surface 4 of the substrate body 2 d on the upper surface of the base portion 16. For this reason, since the side surface and the bottom surface of the base portion 16 of the heat radiating member 10 protrude below the back surface 4 of the substrate body 2d, heat from the electronic component 18 mounted on the element mounting surface 13 is radiated more efficiently. can do.
The same effects as those of the wiring board 1 were obtained with the wiring board 1c.
The wiring boards 1a to 1c may also be configured using the board body 2d.

Figure 10 is a plan view showing a wiring substrate 20 of a different embodiment from that of the wiring substrate 1, 1d of the first wiring board according to the present invention, Figure 11, along the arrow of the line Y-Y in FIG. 10 FIG.
As shown in FIGS. 10 and 11, the wiring substrate 20 includes a substrate body 22 having a front surface 23 and a back surface 24, and a through hole 25 having a circular shape in plan view that passes between the front surface 23 and the back surface 24 of the substrate body 22. , Adjacent to the periphery of the through-hole 25, open in the back surface 24 of the substrate body 22 in a plan view with a circular recess 29, and the pillar portion 22 is inserted into the through-hole 25, and continues below the pillar portion 32, A heat radiating member 30 having a base portion 36 inserted and fixed in the recess 29 is provided.
As shown in FIGS. 10 and 11, the substrate body 22 is formed by integrally laminating the same ceramic layers c1 to c3 as described above, and has a square shape in plan view and a substantially flat plate-like body. The through hole 25 has a circular shape in plan view, and a ring-shaped protrusion 28 protrudes inward along the entire circumference of the lower portion of the inner wall 26.

In addition, the same via conductors and wiring layers as those described above are formed between the ceramic layers c1 to c3, and pads similar to the above are also formed on the front surface 23 and the back surface 24.
Furthermore, the heat radiating member 30 is made of a Cu alloy, and as shown in FIGS. 10 and 11, a columnar column 32 having an element mounting surface 33 having a circular shape in plan view at the upper end, and a lower portion of the column 32. The base portion 36 is a circular and disk-like base portion 36 in a plan view continuous to the entire circumference. The heat radiating member 30 has its column part 32 and base part 36 inserted into the through hole 25 and the depression 29 of the substrate body 22 and brazed between the base part 36 and the depression 29 via an Ag brazing. Or it is bonded by an organic adhesive.

As shown in FIGS. 10 and 11, it projects inward from the lower part of the side surface (circumferential surface) 34 of the column part 32 in the heat radiating member 30 and the lower part of the inner wall (inner peripheral surface) 26 in the through hole 25 of the substrate body 22. The front end surface 27 of the protruding portion 28 is in surface contact with each other, and a gap s of a certain width dimension is formed between the inner wall 26 of the through hole 25 and the side surface 34 of the column portion 32 above the column portion 32. It is formed along the entire circumference. The gap s opens on the surface 23 side of the substrate body 22.
The element mounting surface 33, the side surface 34, and the bottom surface of the base portion 36 of the column portion 32 of the heat radiating member 30 are covered with the same Ni plating film and Au plating film (both not shown). .
The element mounting surface 33 of the pillar portion 32 of the heat dissipation member 30 is substantially flush with the surface 23 of the substrate body 22, and the electronic component 18 such as an IC chip, the light emitting element, etc. are conductive on the element mounting surface 23. It is mounted via an adhesive. Further, the electronic component 18 and the pad formed on the surface 23 of the substrate body 22 are electrically connected via a bonding wire (not shown).

The wiring board 20 forms a three-layer green sheet in the same manner as described above, punches through-holes having circular cross-sections having different inner diameters, and presses the columnar column 32 and the disk-shaped base. Other than forming the heat radiating member 30 composed of the base portion 36, it could be manufactured by the same method as the wiring board 1.
According to the wiring board 20 as described above, the ring-shaped protrusion 28 allows the substrate body 22 and the heat radiating member 30 to be positioned and fixed in the plane direction with high accuracy, and the inner wall 26 of the through hole 25. Since a gap s having a constant width is formed between the side wall 34 of the column part 32 and the side surface 34 of the column part 32 is reliably covered with the Ni and Au plating film via the gap s. Therefore, the wiring board 20 has high dimensional accuracy and the heat radiation member 30 is hardly corroded.

FIG. 12 is a partial plan view showing a wiring board 20a of another reference form, and FIG. 13 is a vertical sectional view thereof.
As shown in FIGS. 12 and 13, the wiring board 20 a includes a board body 22 a similar to the board body 20 a and a heat radiating member 30. The wiring board 20a is different from the wiring board 20 in that a plurality of protrusions having a circular shape in plan view are formed in a circular through-hole formed in the uppermost ceramic layer c3 including the surface 23 of the board body 22a. The point is that the portion 28a is divided so as to protrude inward at substantially equal intervals. For this reason, the through hole formed in the green sheet to be the uppermost ceramic layer c3 in the plan view is substantially circular in the same manner as described above, except that a plurality of projecting portions 28a project along the inner periphery. It was able to be manufactured by going through each process.

  Also in the wiring board 20a as described above, the positioning and fixing of the board main body 22a and the heat radiating member 30 in the planar direction are accurately performed by the plurality of protrusions 28a. Further, since the gap s is formed between the gap between the protrusions 28a and 28a and between the inner wall 26 of the through hole 25 and the side surface 34 of the column part 32, the side surface of the column part 32 is interposed via the gap and the gap s. 34 is also securely coated with the same Ni and Au plating films as described above. Therefore, the wiring board 20a has high dimensional accuracy and the heat radiation member 30 is hardly corroded.

FIG. 14 is a vertical sectional view showing a wiring board 20b of another reference form. As shown in the figure, the wiring board 20b has a front surface 23 and a back surface 24, and includes a substrate body 22b made of ceramic layers c1 to c4 and the same heat dissipation member 30 as described above.
The wiring board 20b of this reference form is different from the wiring boards 20 and 20a as shown in FIG. 14 in that a through-hole having a circular cross section formed in a relatively thin ceramic layer c2 that forms the middle layer of the board body 22b. A plurality of projecting portions 28b having a circular arc shape in plan view are divided on the inner periphery of the inner surface and projecting inward. A gap is located between the protrusions 28b, 28b, and a gap s is formed between the side surface 34 of the column part 32 and the inner wall 26 of the through hole 25 above and below the protrusion 28b.

The wiring board 20b described above could be manufactured through the same steps as described above, except that a through-hole having a circular shape in a plan view and having a minimum inner diameter was formed on the green sheet serving as the intermediate ceramic layer c2. Also with this wiring board 20b, the same effects as those of the wiring boards 20 and 20a were obtained.
9, in the wiring boards 20, 20 a, and 20 b, the heat dissipation member 30 is brazed or bonded (adhered) to the back surface 24 of the substrate bodies 22, 22 a, and 22 b on the upper surface of the base portion 36. It is good also as a form to do. According to this embodiment, the same effect as described above can be obtained, and the side surface and the bottom surface of the base portion 36 of the heat radiating member 30 protrude below the back surface 24 of the substrate bodies 22, 22 a, 22 b. Heat from the electronic component 18 mounted on the surface 33 can be radiated more efficiently.

Figure 15 is the same as defined above vertical sectional view showing a wiring substrate 40a in an embodiment of the second wiring board according to the present invention.
As shown in FIG. 15, the wiring substrate 40 a has a front surface 43 and a back surface 44, and includes a substrate body 42 a composed of ceramic layers c <b> 1 to c <b> 3 that are substantially the same as the substrate body 2, and the heat radiating member 10. The substrate main body 42a has a square (rectangular) through-hole 45 passing through between the front surface 43 and the back surface 44, and a hollow in a plan view adjacent to the periphery of the through-hole 45 and opened to the back surface 44 side. 49, and a protrusion 48a protruding toward the through hole 45 from the entire circumference of the upper portion of the side surface of the recess 49. When the column portion 12 of the heat radiating member 10 is inserted into the through hole 45 through the gap s, the tip surface 47 of the protrusion 48 a is in surface contact with the side surface of the base portion 16 of the heat radiating member 10. For this reason, a gap s is also formed over the entire circumference between the side surface of the base portion 16 located below the protrusion 48 a and the side surface of the recess 49.

The heat radiating member 10 is brazed or bonded (adhered) to the ceiling surface of the recess 49 of the substrate body 42a on the upper surface of the base portion 16. Further, the same Ni and Au plating films as those described above are coated on the side surface 14 of the column portion 12 and the side surface of the base portion 16 of the heat radiating member 10 through the gaps s.
In addition, the same via conductors and wiring layers as those described above are formed between the ceramic layers c1 to c3, and pads similar to the above are also formed on the front surface 43 and the back surface 44 of the substrate body 42a. The electronic component 18 mounted on the element mounting surface 13 of the heat radiating member 10 is electrically connected to the pad formed on the surface 43 of the substrate body 42a.

FIG. 16 is a vertical sectional view similar to the above showing a wiring board 40b of a reference form in the second wiring board. The wiring board 40b includes the same board body 42b and the heat radiating member 10 as those described above. The wiring board 40a is different from the wiring board 40a in the central part on the back surface 44 side or each side of each side of the recess 49 of the board body 42b. A plurality of protrusions 48b that protrude from the vicinity of the corner toward the through hole 45 are divided and formed. For this reason, a gap s is formed over the entire circumference between the side surface of the recess 49 excluding the protrusion 48 b and the side surface of the base portion 16. The gap s communicates with the back surface 44 side of the substrate body 42b through the gap between the protrusions 48b and 48b.

FIG. 17 is a vertical sectional view similar to the above showing a wiring board 40c of a different reference form in the second wiring board. The wiring board 40c includes the same board body 42c as described above and the heat radiating member 10. The wiring board 40a is different from the wiring board 40a in that the board body 42c is formed of ceramic layers c2 to c5. A plurality of protrusions 48c protruding toward the through hole 45 from the central portion of the middle position in the thickness direction or the vicinity of each corner of each side surface of the recess 49 are points. For this reason, two upper and lower gaps s are formed over the entire circumference between the side surface of the recess 49 excluding the protrusion 48 c and the side surface of the base portion 16. The upper gap s communicates with the back surface 44 side of the substrate main body 42b through the gap between the protrusions 48c and 48c.
The wiring boards 40a to 40c as described above could also be manufactured by the same method as described above.

According to the wiring boards 40a to 40c as described above, the protrusions 48a to 48c accurately position and fix the board bodies 42a to 42c and the heat radiating member 10 in the planar direction. Further, Ni and Au plating films having a required thickness are coated on each side surface of the base portion 16 as well as each side surface 14 of the column portion 12 of the heat radiating member 10 through the upper and lower gaps s.
The cylindrical through holes 25 and the disk-shaped depressions 29 are formed in the substrate bodies 42a to 42c, and the heat radiating members 30a and 30b including the columnar column part 32 and the disk-shaped base part 36 are fixed. Further, by providing a ring-shaped or a plurality of arc-shaped protrusions similar to the protrusions 48a to 48c, a single gap s or two upper and lower gaps s may be formed as in FIGS. Is possible.

Figure 18 is the same as defined above vertical sectional view showing a wiring substrate 50a of the respective embodiments and the different embodiments of the first wiring board.
As shown in FIG. 18, the wiring board 50 a includes a board body 2 e made of the same ceramics c1 and c3 as described above, and having the through holes 5 and the depressions 9, and a heat radiating member 10 a fixed thereto in the same manner as described above. ing. The heat radiating member 10 a is integrally provided with a projecting portion 17 a having a square frame shape in plan view along the entire circumference between the column portion 12 and the base portion 16. When the column portion 12 of the heat radiating member 10 is inserted into the through hole 5 through the gap s, the tip surface of the protrusion 17a is in surface contact with the lower portion of the inner wall 6 of the through hole 5 in the substrate body 2e. For this reason, a gap s having a constant width is formed over the entire circumference between the side surface 14 of the column part 12 positioned above the protrusion 17a and the inner wall 6 of the through hole 5. Each of the side surfaces 14 of the column part 12 is coated with a Ni and Au plating film having a required thickness. In addition, the said heat radiating member 10a was able to be easily shape | molded with the press including the protrusion 17a.

FIG. 19 is a vertical sectional view showing a wiring board 50b which is another reference form. The wiring board 50b includes the same board body 2e as described above and the same heat radiation member 10b fixed thereto in the same manner as described above. The heat radiating member 10 b is integrally provided with a plurality of protrusions 17 b that protrude outward from the intermediate position in the thickness direction for each side surface 14 of the column part 12. When the column portion 12 of the heat radiating member 10b is inserted into the through hole 5 through the gap s, the tip surface of each protrusion 17b is in surface contact with the intermediate portion of the inner wall 6 of the through hole 5 in the substrate body 2e. . For this reason, a gap s is formed over the entire circumference between the side surface 14 of the column 12 positioned above and below the protrusion 17b and the inner wall 6 of the through hole 5, and the upper gap s and the protrusion 17b, A Ni and Au plating film having a required thickness is covered for each side surface 14 of the column part 12 through a gap between the 17b.
In addition, since the heat radiating member 10b protrudes the protrusion 17a from the intermediate position of the side surface 14 of the pillar part 12, it is formed by cutting or precision casting, for example.

According to the wiring boards 50a and 50b as described above, the protrusions 17a and 17b accurately position and fix the board body 2e and the heat radiating member 10 in the planar direction. Furthermore, Ni and Au plating films of a required thickness are covered for each side surface 14 of the column portion 12 of the heat radiating member 10 through the gaps s.
Note that the heat dissipation member may have a configuration in which a plurality of protrusions are provided along the upper portion of the side surface 14 of the column portion 12. Further, the cylindrical through hole 25 and the disk-shaped depression 29 are formed in the substrate body 2e, and the heat radiating members 30c and 30d including the columnar column part 32 and the disk-shaped base part 36 are fixed. It is also possible to form the gap s shown in FIGS. 18 and 19 by providing a ring-shaped or a plurality of arc-shaped protrusions similar to the protrusions 17a and 17b.

Figure 20 is the same as defined above vertical sectional view showing a wiring board 50c of the respective embodiments and the different embodiments of the second wiring board.
As shown in FIG. 20, the wiring board 50c includes the same board body 2e as described above and a heat radiation member 10c fixed to the ceiling surface of the recess 9 of the board body 2e. The heat radiating member 10 c is provided with a protrusion 17 c that protrudes outward from the upper portion in the thickness direction for each side surface of the base portion 16 on the entire circumference. When the column portion 12 of the heat radiating member 10 is inserted into the through hole 5 through the gap s, the tip end surface of the protrusion 17c is in surface contact with the upper portion of each side surface of the recess 9 in the substrate body 2e. For this reason, a gap s is formed between the side surface of the pace portion 16 positioned below the protrusion 17c and the side surface of the recess 9 so as to open to the back surface 4 over the entire circumference. Ni and Au plating films of a required thickness are respectively coated on the side surface 14 of the column portion 12 and the side surface of the pace portion 16 via the gap s and the upper gap s.

FIG. 21 is a vertical sectional view showing a wiring board 50d which is still another reference form. The wiring board 50d includes the same substrate body 2e as described above and the same heat radiation member 10d fixed to the substrate body 2e as described above. As shown in FIG. 21, the heat radiating member 10 d is integrally provided with a plurality of protrusions 17 d that protrude outward from an intermediate position in the thickness direction for each side surface of the base portion 16. When the column portion 12 of the heat radiating member 10d is inserted into the through hole 5 through the gap s, the tip surface of each protrusion 17d is in surface contact with the intermediate portion in the thickness direction of each side surface of the recess 9 in the substrate body 2e. ing. Therefore, a gap s is formed over the entire circumference between the side surface of the base portion 16 positioned above and below the protrusion 17d and the side surface of the recess 9, and the gap between the upper gap s and the protrusions 17d and 17d is formed. A Ni and Au plating film having a required thickness is coated on each side surface of the base portion 16 via the gap.
The wiring boards 50c and 50d as described above can achieve the same effects as the wiring boards 50a and 50b. The heat radiating members 10c and 10d are also formed by cutting or precision casting. Further, the heat radiating member may have a configuration in which a plurality of protrusions are divided and provided along the lower portion of each side surface of the base portion 16.

The present invention is not limited to the embodiments described above.
The insulating material forming the substrate body may be ceramic such as aluminum nitride or mullite, glass-ceramic which is a kind of low-temperature fired ceramic, or various resins.
Further, the substrate body is not limited to a flat surface, and may have a cavity that opens to the surface, and the through hole and the recess are formed between the bottom surface and the back surface of the cavity. When a light emitting element is mounted on the element mounting surface of the heat dissipating member that is substantially flush with the bottom surface of the cavity, the light of the light emitting element is reflected off the side surface of the cavity and emitted to the outside. In this case, it is desirable that the side surface of the cavity has a substantially conical shape inclined so as to spread toward the surface side of the substrate body.

Furthermore, the inner wall of the through hole of the substrate main body, on both the sides of the recess of the same substrate main body may be a single collision portion along the entire circumference as forms respectively. Alternatively, the sides and both Noto side and the base end of the column portion of the heat radiating member may be a single collision portion along the entire circumference as forms respectively.
Furthermore, Ni and Ag plating films may be coated on the side surface of the column part and the side surface of the base part in the heat dissipation member.
In addition, the wiring board of the present invention may be in the form of a multi-piece substrate in which a plurality of wiring boards are arranged vertically and horizontally.

The top view which shows the wiring board which is one form of the 1st wiring board by this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The perspective view containing the vertical cross section of the board | substrate body which comprises the said wiring board. Schematic which shows the manufacturing process of the said wiring board. The top view which shows the outline of the wiring board which is a reference form. The vertical sectional view of the wiring board of the above-mentioned reference form . The top view which shows the wiring board of a different reference form. Furthermore, the vertical sectional view which shows the wiring board of a different reference form. The vertical sectional view which shows the wiring board of the deformation | transformation form of the said wiring board. Plan view showing a wiring substrate of a different embodiment from the first of the wiring board. FIG. 11 is a vertical sectional view taken along the line YY in FIG. 10. The partial top view which shows the wiring board of another reference form. The vertical sectional view of the wiring board of the above-mentioned reference form . Furthermore, the vertical sectional view which shows the wiring board of a different reference form. The vertical sectional view showing the wiring board of one form in the 2nd wiring board. The vertical sectional view showing the wiring board of the reference form of the above-mentioned wiring board. The vertical sectional view which shows the wiring board of the reference form from which the said wiring board differs. Vertical cross-sectional view showing a wiring substrate of a different embodiment and the respective embodiments of the first wiring board. The vertical sectional view which shows the wiring board which is another reference form. Vertical cross-sectional view showing a wiring substrate of a different embodiment and the respective embodiments of the second wiring board. Furthermore, the vertical sectional view which shows the wiring board which is another reference form.

1, 1d, 20, 40a, 50a, 50c … Wiring board 2, 2d, 2e, 22, 42a ……………… Board body 3 , 23, 43 …………………………… 4, 24, 44 …………………………………… Back 5, 25, 45 ………………………………… Through hole 6, 26, 46 …………… ………………… Inner wall 8, 17a, 17c, 28, 48a ………… Protrusions 9 , 29, 49 ………………………………… Dimple 10 , 10a, 10c, 30, 30c ……… Heat dissipation member 12, 32 ……………………………………… Pillar 13, 33 ………………………………………… Mounting surface 14, 34… …………………………………… Side 16, 36 ………………………………………… Base part c1 to c3 ……………………………… ……… Ceramic layer s …… ................................................ gap

Claims (4)

A substrate body made of an insulating material and having a front surface and a back surface;
A through hole penetrating between the front surface and the back surface of the substrate body,
A pillar part having an element mounting surface at the upper end is inserted into the through hole, and a base part connected to the lower part of the pillar part is formed in a back surface of the substrate body or a recess that is adjacent to the through hole and opens on the back surface of the substrate body. A heat radiating member to be fixed;
Between the inner wall of the through hole of the substrate main body and the side surface of the column portion of the heat radiation member facing each other, a protruding portion that protrudes from and touches the lower portion of the other to the other lower portion is provided on the entire circumference of the inner wall and the side surface. And forming along
A gap is formed along the entire circumference of the side surface of the column portion between the inner wall of the through hole and the side surface of the column portion via the protrusion.
A wiring board characterized by that. A substrate body made of an insulating material and having a front surface and a back surface;
A through hole penetrating between the front surface and the back surface of the substrate body,
A heat dissipation member in which a pillar portion having an element mounting surface at the upper end is inserted into the through hole, and a base portion connected to the bottom of the pillar portion is fixed to a recess adjacent to the through hole and opened on the back surface of the substrate body; With
The upper side surface of the recess opening to the rear surface of the substrate main body, between the upper side of the base portion opposing the heat radiation member, the projection contacting protruding from either one to the other, all of the above aspects While forming along the circumference ,
Through the protrusion, the entire circumference between the side surface of the inner wall and the column portion of the through hole, and along the entire circumference of the free position and the said projecting portion between the side surface and the base of the recess A gap is formed,
A wiring board characterized by that. The through hole of the substrate main body and the column portion of the heat dissipation member, or the recess of the substrate main body and the base portion of the heat dissipation member are substantially similar in plan view .
The wiring board according to claim 1 or 2 , wherein A light emitting element is mounted on the element mounting surface of the heat dissipation member .
The wiring board according to any one of claims 1 to 3, wherein

Images