JP4856908B2 - 粉末焼結造形装置及び粉末焼結造形方法 - Google Patents
粉末焼結造形装置及び粉末焼結造形方法 Download PDFInfo
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- JP4856908B2 JP4856908B2 JP2005202779A JP2005202779A JP4856908B2 JP 4856908 B2 JP4856908 B2 JP 4856908B2 JP 2005202779 A JP2005202779 A JP 2005202779A JP 2005202779 A JP2005202779 A JP 2005202779A JP 4856908 B2 JP4856908 B2 JP 4856908B2
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- Prior art keywords
- refrigerant
- thin layer
- powder material
- cooling
- powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
Description
図1は、本発明の実施の形態に係る粉末焼結造形装置の構成を示す斜視図である。
次に、造形部101Bにおける他の第1乃至第8の冷却手段について、図8乃至図10を参照しながら説明する。
次に、図3、図5乃至図7を参照してこの発明の実施の形態である粉末焼結造形方法について説明する。図3は粉末焼結造形方法を示すフローチャート、図5乃至図7は、粉末焼結造形方法を示す工程断面図である。この場合、図1の粉末焼結造形装置を用い、冷媒としてガス状の冷媒を用いるものとする。
2 ミラー(レーザ光出射手段)
3a、3b、4 容器
5a、5b フィードシリンダ
6 パートシリンダ(作業台)
7、7a、7b、7c、7d リコータローラ(薄層形成手段)
8 粉末材料
8a 粉末材料の薄層
8b 焼結した薄層
11、11a、11b、11c、11d 冷媒ガイド
12、12a、12b、12c、12e、12f、12g 冷媒の導入口
14、14a、14b、14c 冷媒の流出口
101A レーザ光出射部
101B 造形部
101C 制御装置
Claims (1)
- 作業台と、
前記作業台の降下手段と、
前記作業台上に粉末材料の薄層を形成する薄層形成手段と、
一層の前記粉末材料の薄層ごとに選択的に加熱して焼結する加熱焼結手段と、
ガス状又は液状の冷媒を流して前記加熱して焼結した薄層を冷却する冷却手段と、
前記作業台を下げて該作業台上に前記粉末材料の薄層を形成させ、一層の該粉末材料の薄層ごとに描画パターンに基づき選択的に加熱して焼結させ、該焼結した一層の薄層ごとに、或いは該焼結した複数の薄層ごとに、前記焼結した薄層の上に新たな粉末材料の薄層を形成する前に、前記焼結した薄層の表面に前記冷却手段からガス状又は液状の冷媒を流して、冷却させる制御手段と
を有し、
前記冷却手段は、さらに、前記作業台に対向する平面を有する冷媒ガイドを有し、
前記冷媒ガイドを前記作業台上に移動させて前記作業台と前記冷媒ガイドの平面との間に前記ガス状の冷媒の流路を形成し、該流路に前記ガス状の冷媒を流すようにしていることを特徴とする粉末焼結造形装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005202779A JP4856908B2 (ja) | 2005-07-12 | 2005-07-12 | 粉末焼結造形装置及び粉末焼結造形方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005202779A JP4856908B2 (ja) | 2005-07-12 | 2005-07-12 | 粉末焼結造形装置及び粉末焼結造形方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011192828A Division JP5552100B2 (ja) | 2011-09-05 | 2011-09-05 | 粉末焼結造形方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007021747A JP2007021747A (ja) | 2007-02-01 |
| JP4856908B2 true JP4856908B2 (ja) | 2012-01-18 |
Family
ID=37783146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005202779A Expired - Fee Related JP4856908B2 (ja) | 2005-07-12 | 2005-07-12 | 粉末焼結造形装置及び粉末焼結造形方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4856908B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11471945B2 (en) | 2019-10-18 | 2022-10-18 | Sodick Co., Ltd. | Lamination molding apparatus |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4258571B2 (ja) * | 2007-05-14 | 2009-04-30 | パナソニック電工株式会社 | 三次元形状造形物の製造方法及び製造装置 |
| GB0917936D0 (en) * | 2009-10-13 | 2009-11-25 | 3D Printer Aps | Three-dimensional printer |
| JP6570542B2 (ja) | 2014-01-16 | 2019-09-04 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 三次元物体の生成 |
| EP3094469B1 (en) | 2014-01-16 | 2019-11-13 | Hewlett-Packard Development Company, L.P. | Generating a three-dimensional object |
| RU2650155C2 (ru) | 2014-01-16 | 2018-04-09 | Хьюлетт-Паккард Дивелопмент Компани, Л.П. | Формирование трехмерных объектов |
| US10012088B2 (en) | 2014-01-20 | 2018-07-03 | United Technologies Corporation | Additive manufacturing system utilizing an epitaxy process and method of operation |
| TWI571379B (zh) * | 2015-03-16 | 2017-02-21 | 研能科技股份有限公司 | 立體成型裝置 |
| US10668533B2 (en) | 2015-07-17 | 2020-06-02 | Applied Materials, Inc. | Additive manufacturing with coolant system |
| US10131015B2 (en) | 2015-12-25 | 2018-11-20 | Technology Research Association For Future Additive Manufacturing | Three-dimensional laminating and shaping apparatus, control method of three-dimensional laminating and shaping apparatus, and control program of three-dimensional laminating and shaping apparatus |
| JP6653590B2 (ja) * | 2016-02-16 | 2020-02-26 | 株式会社アスペクト | 冷却最適化装置及び冷却最適化方法 |
| JP7066878B2 (ja) | 2018-06-01 | 2022-05-13 | アプライド マテリアルズ インコーポレイテッド | 付加製造のためのエアナイフ |
| JP6748181B2 (ja) * | 2018-12-14 | 2020-08-26 | 株式会社ソディック | 積層造形装置 |
| US11400649B2 (en) | 2019-09-26 | 2022-08-02 | Applied Materials, Inc. | Air knife assembly for additive manufacturing |
| US11413817B2 (en) | 2019-09-26 | 2022-08-16 | Applied Materials, Inc. | Air knife inlet and exhaust for additive manufacturing |
| CN113059195B (zh) * | 2021-06-03 | 2021-08-13 | 西安赛隆金属材料有限责任公司 | 一种粉床铺粉装置及粉床增材制造设备 |
| JP2023160072A (ja) * | 2022-04-21 | 2023-11-02 | 大同特殊鋼株式会社 | 積層造形装置および積層造形方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE521124C2 (sv) * | 2000-04-27 | 2003-09-30 | Arcam Ab | Anordning samt metod för framställande av en tredimensionell produkt |
| US6841116B2 (en) * | 2001-10-03 | 2005-01-11 | 3D Systems, Inc. | Selective deposition modeling with curable phase change materials |
-
2005
- 2005-07-12 JP JP2005202779A patent/JP4856908B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11471945B2 (en) | 2019-10-18 | 2022-10-18 | Sodick Co., Ltd. | Lamination molding apparatus |
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| Publication number | Publication date |
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| JP2007021747A (ja) | 2007-02-01 |
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