JP4860437B2 - Module built-in card - Google Patents

Description

 TECHNICAL FIELD The present invention relates to a module built-in card that incorporates a module including an electronic component such as an IC chip. About.

2. Description of the Related Art Conventionally, a card 100 as shown in FIG. 2 has been proposed in order to make an electronic component incorporated in a card visible in a card such as an IC card incorporating a module including electronic components such as an IC chip and a diode. ing.
The card 100 includes a module 101, an adhesive layer 102 made of a transparent adhesive that covers the module 101, and a pair of base materials 103 and 104 that sandwich the module 101 with the adhesive layer 102 interposed therebetween. (For example, refer to Patent Document 1).
In this card 100, in order to make the built-in module 101 visible from the outside, a combination of the transparent adhesive layer 102 and the transparent base materials 103 and 104 is indispensable.
JP 2005-531126 A

By the way, since the card 100 as shown in FIG. 2 is formed by overlapping the module 101 and the base materials 103 and 104 with an adhesive, air bubbles and foreign matters are mixed inside the adhesive layer 102. Adhering spots may occur.
In the card 100, since the adhesive layer 102 and the base materials 103 and 104 are transparent, bubbles and foreign matters mixed therein or adhesion spots of the adhesive layer 102 can be seen from the outside. There was a problem of lowering.
In addition, in order to solve defects such as bubbles and foreign matter, adhesion spots, etc., a method such as vacuum defoaming is also used at the time of card formation, but this method is troublesome and very expensive. there were.

 In recent years, there has been a demand for a card with a built-in module in which a display element is built in as an electronic component and the display portion of the display element can be visually observed from the outside. Therefore, a card with which the display part can be visually observed was not easily obtained.

 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a module built-in card that incorporates a display element as an electronic component, makes the display portion of the display element visible from the outside, and is easy to manufacture. And

 The module built-in card of the present invention is a module built-in card comprising a module having a display element, an adhesive layer that covers the module, and a pair of base materials that sandwich the module through the adhesive layer. The display portion of the display element is fixed to the base material via a transparent adhesive layer, at least the display portion side base material of the pair of base materials is transparent, and the adhesive layer is colored. It is characterized by being.

 The module built-in card of the present invention is a module built-in card comprising a module having a display element, an adhesive layer that covers the module, and a pair of base materials that sandwich the module through the adhesive layer. The display portion of the display element is fixed to the base material via a transparent adhesive layer, at least the display portion side base material of the pair of base materials is transparent, and the adhesive layer is colored. Therefore, since only the part which overlaps with the display part of the base material is transparent and this part is a display window part, the display part can be visually observed from the outer surface side of the base material. In addition, since the display portion of the display element is fixed to the base material by the adhesive layer, bubbles and foreign substances are not mixed between the adhesive layer, the display portion and the base material, and adhesion spots do not occur. Furthermore, since the adhesive layer is colored and exists in the region excluding the display window portion between the pair of base materials, bubbles or foreign matter mixed in the adhesive layer or generated in the adhesive layer The adhesion spots can be made inconspicuous. Therefore, it is possible to suppress a decrease in the yield rate of the module built-in card due to a defect in appearance.

The best mode of the module built-in card of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

1A and 1B are schematic views showing an embodiment of a module built-in card according to the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG.
In FIG. 1, reference numeral 10 is a module built-in card, 11 is a base substrate, 12 is a display element, 13 is a module, 14 is an adhesive layer, 15 is a first substrate, 16 is a second substrate, and 17 is an adhesive layer. Respectively.
The module built-in type card 10 of this embodiment includes a module 13 having a display element 12, an adhesive layer 14 covering the module 13, a pair of first base materials 15 sandwiching the module 13 via the adhesive layer 14, and The second substrate 16 is generally configured.
Moreover, the module 13 is roughly comprised from the base base material 11 and the display element 12 which is mounted in the base base material 11 and has the display part 12a.

Further, the display portion 12 a of the display element 12 is bonded and fixed to a surface (hereinafter referred to as “inner surface”) 15 a of the first base material 15 facing the module 13 through the transparent adhesive layer 17.
The adhesive layer 14 is made of an adhesive containing a colorant and is colored.
Furthermore, the 1st base material 15 and the 2nd base material 16 consist of a transparent base material.
Thus, since the display part 12a of the display element 12 is fixed to the inner surface 15a of the transparent first base material 15 via the transparent adhesive layer 17, it is visually observed from the outer surface 15b side of the first base material 15. It is possible.

 As the base substrate 11, at least the surface layer portion is made of woven fabric, nonwoven fabric, mat, paper or the like made of inorganic fibers such as glass fiber or alumina fiber, or a combination thereof, or organic fibers such as polyester fibers or polyamide fibers. Woven fabrics, nonwoven fabrics, mats, papers, etc., or combinations thereof, or composite substrates formed by impregnating them with resin varnish, polyamide resin substrates, polyester resin substrates, polyolefin resin substrates Material, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin Base material, Acrylonitrile butadiene styrene copolymer resin base material, Polyethers Plastic base materials such as phon resin base materials, or surface treatment such as mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing, or various easy adhesion processing. It selects from well-known things, such as what gave. Among these, an electrically insulating film or sheet made of polyethylene terephthalate or polyimide is preferably used.

 As the display element 12, particle transfer electronic paper such as an electrophoretic display, liquid crystal display (LCD), electrochromic device (ECD), electroluminescence (EL), light emitting diode (LED), or the like is used. .

As the adhesive forming the adhesive layer 14, an adhesive that is liquid before use and is cured by applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation is used. Examples of such an adhesive include a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin. A two-component curable adhesive that cures by the reaction between the main agent and the curing agent without applying external conditions is also used.
Examples of the thermosetting resin include phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, and acrylic reaction resin.

Examples of the ultraviolet curable resin include an ultraviolet curable acrylic resin, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable polyurethane resin, an ultraviolet curable epoxy acrylate resin, and an ultraviolet curable imide acrylate resin. .
Electron beam curable resins include electron beam curable acrylic resins, electron beam curable urethane acrylate resins, electron beam curable polyester acrylate resins, electron beam curable polyurethane resins, electron beam curable epoxy acrylate resins, and cationic curable resins. Etc.
Examples of the two-component curable adhesive include a mixture of polyester resin and polyisocyanate prepolymer, a mixture of polyester polyol and polyisocyanate, a mixture of urethane and polyisocyanate, and the like.

 As a specific example of such an adhesive, a two-component mixture comprising a main agent (trade name: Aronmighty AP-317A, manufactured by Toagosei Co., Ltd.) and a curing agent (trade name: Aronmighty AP-317B, manufactured by Toagosei Co., Ltd.). Type epoxy adhesive, main component (trade name: MLT2900, manufactured by Etec) and two-component mixed urethane adhesive composed of a curing agent (trade name: G3021-B174, manufactured by Etec).

 As the colorant contained in the adhesive layer 14, known inorganic pigments, organic pigments, dyes and the like are used. By this colorant, the adhesive layer 14 is colored in an arbitrary color.

As the first base material 15 and the second base material 16, transparent base materials having excellent light transmittance are used. For example, polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT). ), A base material made of a polyester resin such as polyethylene naphthalate (PEN); a base material made of a polyolefin resin such as polyethylene (PE) or polypropylene (PP); polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, etc. Base material made of polyfluorinated ethylene resin; Base material made of polyamide resin such as nylon 6, nylon 6,6; Vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon Base material comprising: polymethacrylic Base material made of acrylic resin such as methyl acid, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, etc .; base material made of polystyrene ;; base material made of polycarbonate (PC) ;; base material made of polyarylate A substrate made of polyimide; a substrate made of paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, or the like is used. Among these substrates, a substrate made of polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polyethylene naphthalate (PEN), or the like is preferable from the viewpoint of mechanical strength, dimensional stability, and solvent resistance. In view of transparency, processability, and cost, a substrate made of polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PET-G) is more preferable.
In addition, the first base material 15 and the second base material 16 may be either colorless and transparent or colored and transparent, but are colorless and transparent from the viewpoint of easily recognizing information displayed on the display unit 12a of the display element 12. Is preferred.

As the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 17, a pressure-sensitive adhesive that has both liquid and solid properties, is always wet, has low fluidity, and maintains its own shape. Examples of such adhesives include acrylic resins, polyurethane resins, epoxy resins, urethane resins, natural rubber adhesives, synthetic rubber adhesives, hot melt adhesives, and the like.
Specific examples of the pressure-sensitive adhesive include film double-sided tape (trade name: No705, manufactured by Teraoka Seisakusho), double-sided tape (trade name: TL-85F-12, manufactured by Lintec Corporation), and the like.

 The module built-in type card 10 of this embodiment includes a module 13 having a display element 12, an adhesive layer 14 covering the module 13, a pair of first base materials 15 sandwiching the module 13 via the adhesive layer 14, and The display part 12a of the display element 12 is fixed to the 1st base material 15 through the transparent adhesion layer 17, the 1st base material 15 is transparent, and the contact bonding layer 14 is colored. Therefore, since only the part which overlaps with the display part 12 of the 1st base material 15 is transparent and this part is the display window part 18, it displays from the outer surface 15b side of the 1st base material 15. The part 12a can be visually observed. Further, since the display unit 12 a of the display element 12 is fixed to the first base material 15 by the adhesive layer 12, bubbles and foreign matters are mixed between the adhesive layer 12, the display unit 12 a and the first base material 15. And no adhesion spots occur. Furthermore, since the adhesive layer 14 is colored and is present in the region excluding the display window portion 18 between the first base material 15 and the second base material 16, bubbles mixed in the adhesive layer 14 are present. It is possible to make the adhesion spots generated on the adhesive layer 14 inconspicuous. Therefore, it is possible to suppress a decrease in the non-defective product rate of the module built-in card 10 due to a defect in appearance, and it is possible to protect confidentiality inside the card.

In this embodiment, the module built-in card 10 in which the first base material 15 and the second base material 16 are transparent is exemplified, but the module built-in card of the present invention is not limited to this. In the module built-in card of the present invention, it is sufficient that at least the base material on the display unit side of the display element is transparent among the pair of base materials sandwiching the module.
Moreover, in this embodiment, although the module built-in type card | curd 10 provided with what has the display element 12 as the module 13 was illustrated, the module built-in type card | curd of this invention is not limited to this. In the module built-in card of the present invention, the module may include electronic components such as an antenna, an IC chip, a battery, and a diode in addition to the display element.

Next, with reference to FIG. 1, the manufacturing method of the module built-in type card | curd 10 of this embodiment is demonstrated.
First, a predetermined amount of adhesive that forms the adhesive layer 14 is applied to the inner surface 15 a of the first base material 15.
Next, an adhesive forming the adhesive layer 17 formed according to the shape of the display portion 12a of the display element 12 is applied or pasted to a predetermined position on the inner surface 15a of the first base material 15.
Next, the display unit 12a of the display element 12 is bonded and fixed to the inner surface 15a of the first base material 15 via this adhesive, thereby arranging the module 13 at a predetermined position on the inner surface 15a of the first base material 15. To do.
Next, after arranging the second substrate 16 so that the module 13, the adhesive and the adhesive are sandwiched between the first substrate 15 and the second substrate 16, the outer surface 15b side of the first substrate 15 and the second group From the outer surface 16a side of the material 16, the first base material 15, the second base material 16, the module 13, a laminate composed of a pressure-sensitive adhesive and an adhesive, a pressure treatment and a treatment for curing the adhesive, for example, heating, ultraviolet irradiation By irradiating with an electron beam and aging (the reaction is allowed to stand for a curing reaction with time), the adhesive is cured, and the module built-in card 10 in which the laminate is integrated is obtained.

 According to the manufacturing method of the module built-in card 10 of this embodiment, the display portion 12a of the display element 12 is bonded to the inner surface 15a of the first base material 15 via the adhesive, and therefore the adhesive layer 12 and the display portion Air bubbles and foreign substances are not mixed between 12a and the first base material 15, and adhesion spots do not occur. Therefore, the module built-in type card 10 having excellent appearance can be obtained without using a technique such as vacuum defoaming.

It is the schematic which shows one Embodiment of the module built-in type card | curd which concerns on this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic sectional drawing which shows the conventional card of a module built-in type.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Module built-in type card, 11 ... Base base material, 12 ... Display element, 13 ... Module, 14 ... Adhesive layer, 15 ... First base material, 16 ... Second substrate, 17 ... adhesive layer.

Claims (1)

A module built-in card comprising a module having a display element, an adhesive layer covering the module, and a pair of base materials sandwiching the module via the adhesive layer,
The display part of the display element is fixed to the base material via a transparent adhesive layer, at least the display part side base material is transparent among the pair of base materials, and the adhesive layer is colored. Module built-in type card characterized by

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