JP4860596B2 - Thermal test equipment - Google Patents

Description

  The present invention relates to a thermal test apparatus suitable for use in performing a thermal test on a device under test such as an electronic component by alternately providing a high temperature environment and a low temperature environment.

  In general, since electronic components are used in various environments, durability performance in a predetermined temperature range from a low temperature environment to a high temperature environment is required. Therefore, a thermal test and a thermal shock test are usually performed on electronic parts used for new products and new applications, which alternately provide a high temperature environment and a low temperature environment.

  Conventionally, as a thermal test apparatus based on a typical principle used in such a thermal test (thermal shock test), a heating system and a cooling system are provided in separate casings, and are switched by an on-off valve to the test tank. A method of obtaining a high temperature environment or a low temperature environment by selectively supplying hot air and cold air, and a heating system and a cooling system are provided in the same housing, and the operation of the heating system and the cooling system is selectively turned on (OFF) to a high temperature. There is a system for obtaining an environment or a low temperature environment. As the former system, a cooling / heating test apparatus disclosed in Patent Document 1 is known, and as the latter system, a rapid heating / cooling type cooling / heating system disclosed in Patent Document 2 is known. Test equipment is known.

The cooling / heating test apparatus disclosed in Patent Document 1 includes a test tank, a fan-installed tank that includes an external air introduction port and is connected to the test tank via a gas supply port, and is connected to the test tank via a communication port. And a high-temperature bath connected to the test chamber via a gas suction port, a low-temperature bath connected to the test chamber via a gas supply port and a gas suction port, an exhaust port provided in the test chamber, a communication port and outside air Opening / closing damper common to the inlet, opening / closing damper of the gas supply port and gas suction port, opening / closing damper of the gas supply port and gas suction port, and opening / closing damper of the exhaust port, and The rapid heating / cooling type thermal testing apparatus disclosed in Patent Document 2 is provided with a test object mounting plate and an openable / closable lid that covers the upper surface of the apparatus housing, and is sealed with the lid closed. Test room to form and test The mounting plate is provided with a suction port and air outlet, and the cooling coil and heater with sufficient heat exchange performance with respect to the capacity of the test chamber and the air in the test chamber are indicated below the test sample mounting plate. A fan that circulates like this, and a cover that covers these to form an air circulation path, and a refrigerator that circulates the refrigerant through the cooling coil is provided outside the cover, and the rotation of the fan, the refrigerator, and the heater The operation is controlled so that the temperature in the test chamber is rapidly increased or decreased.
JP-A-6-082354 JP-A-8-136442

  By the way, in the conventional thermal test apparatus described above, the system (Patent Document 1) in which the heating system and the cooling system are provided in separate casings has the advantage of being able to quickly switch between the high temperature environment and the low temperature environment, but the entire apparatus. Since the heating system and the cooling system are always operated, there is a disadvantage that the power consumption becomes large. On the other hand, in the method of providing the heating system and the cooling system in the same housing (Patent Document 2), While the entire device is downsized and either the heating system or the cooling system is operated, it has the advantage of reducing power consumption, but it has the disadvantage that it cannot quickly switch between the high temperature environment and the low temperature environment. .

  As described above, in the conventional thermal test apparatus, it is not easy to satisfy both the rapid switching between the high temperature environment and the low temperature environment and the reduction of the overall apparatus size and the reduction of power consumption. When one request is satisfied, there is a conflicting problem that it becomes difficult to satisfy the other request. Moreover, along with the downsizing and higher density of electronic devices, electronic components have been further miniaturized, but since optimization for small electronic components has not been considered at all, When performing a thermal test of a small electronic component, there is a problem in that power consumption is wasted and the test performance and the like cannot be adapted flexibly.

  The object of the present invention is to provide a thermal test apparatus that solves such problems in the background art.

  In order to solve the above-described problems, the present invention is configured so that at least a high-temperature environment and a low-temperature environment can be alternately applied to the device under test P accommodated in the inside of the test tank 2, and a thermal test for the device under test P ... is performed. In configuring the thermal test apparatus 1 to be performed, at least one or more thermo modules 4 using Peltier elements are arranged on the upper surface of the heat sink type heat exchanger 3 having fin portions 3f projecting downward. A heat transfer plate 5 is arranged on the upper surface of the thermo modules 4... And a cover portion 6 that opens and closes the heat transfer plate 5 is provided. When the cover portion 6 is closed, the heat transfer plate 5 is connected to the bottom surface portion 2 d. The test chamber mechanism Ma constituting the test chamber 2 to be performed, the heat exchange chamber Cc facing the fins 3f, the cooling gas chamber Ca provided below the heat exchange chamber Cc via the partition wall portion 32, and the cooling gas Room C The gas cooling unit 15 having the cooler 7 using the Stirling cooler 7s facing the cooling unit 7cs is provided, and the heat exchange chamber Cc is reached from the cooling gas chamber Ca through the first vent hole Cao. A circulation air passage R extending from the chamber Cc to the cooling gas chamber Ca through the second vent hole Cai, blower fans 16a and 16b for circulating the cooling gas Ac through the circulation air passage R, and the heat exchange chamber Cc and the cooling gas chamber Ca. A cooling mechanism Mb including a blower unit 17 having an opening / closing mechanism unit 18 that opens and closes a circulation air passage R therebetween, and a controller 8 that controls the operation of the thermomodule 4... And the cooler 7. To do.

  In this case, according to a preferred aspect of the invention, the test tank mechanism Ma can be provided with the auxiliary heating unit 11 in addition to the thermo modules 4... As the auxiliary heating unit 11 at least in the thermo modules 4. The heating fluid Ah is supplied to the auxiliary heating unit using the heaters 11a arranged, the auxiliary heating unit using the rod-shaped heater 11b embedded in the heat exchanger 3, and the gas passage 11c formed inside the heat exchanger 3. One or two or more auxiliary heating parts that circulate can be used. Moreover, the auxiliary | assistant cooling part 12 which ventilates the gas Aa for cooling with respect to the heat exchanger 3 can also be provided. On the other hand, the cooling mechanism Mb can be provided with a gas supply unit 19 that supplies dehumidified air or inert gas to the circulation air passage R. On the other hand, the test tank mechanism Ma can also be configured as a test tank mechanism Mae for a thermal shock test by providing the cover section 6 with a stirring mechanism section 20 that stirs the air inside the test tank 2.

  According to the thermal test apparatus 1 according to the present invention having such a configuration, the following remarkable effects can be obtained.

  (1) A thermo module 4 using Peltier elements is arranged on the upper surface of the heat exchanger type heat exchanger 3, and a heat transfer plate 5 is arranged on the upper surface of the thermo module 4. On the other hand, a cover portion 6 that opens and closes is provided, and when this cover portion 6 is closed, a test tank mechanism Ma that constitutes the test tank 2 having the heat transfer plate 5 as the bottom surface portion 2d, and a cooling gas that cools the heat exchanger 3 Since the cooling mechanism Mb using the cooler 7 for obtaining Ac is provided, in addition to being able to quickly switch between a high temperature environment and a low temperature environment, it is possible to reduce the overall size of the apparatus and further reduce power consumption. .

  (2) The cooling mechanism Mb includes a gas cooling unit 15 having a Stirling cooler 7s constituting the cooler 7 and a cooling gas chamber Ca for storing the cooling gas Ac cooled by the Stirling cooler 7s, and a cooling gas chamber Ca. A circulation air passage R that reaches the heat exchanger 3 through one vent hole Cao, and from the heat exchanger 3 to the cooling gas chamber Ca through the second vent hole Cai, and the cooling gas Ac circulates in the circulation air passage R. Since the blower unit 17 having the blower fans 16a and 16b for blowing air is provided, it is possible to avoid waste of power consumption when performing a thermal test of a small electronic component and to respond flexibly to a test performance for the small electronic component. be able to. That is, by using the Stirling cooler 7s having an inherent characteristic of being excellent in cooling performance such as rapid cooling although the cooling output cannot be increased, it is optimal for a thermal test particularly for a small electronic component.

  (3) Since the cooling gas chamber Ca is arranged below the heat exchanger 3, the cooling gas Ac is heat exchanged even when the cooling gas Ac is not used by utilizing the property that the cooling gas Ac accumulates below. It is possible to avoid problems that affect the container 3 side.

  (4) Since the air blowing unit 17 is provided with the opening / closing mechanism 18 that opens and closes the circulation air passage R between the heat exchanger 3 and the cooling gas chamber Ca, the cooling gas Ac is used even when the cooling gas Ac is not used. Can be reliably prevented from leaking from the gas cooling unit 15 to the heat exchanger 3 side.

  (5) According to a preferred embodiment, if the auxiliary heating unit 11 is provided in the test tank mechanism Ma in addition to the thermo modules 4..., The auxiliary heating unit 11 can be used in combination with the thermo modules 4. When shifting from a low temperature environment to a high temperature environment, a steep temperature rise can be realized, and the shift can be made more quickly.

  (6) According to a preferred embodiment, if the auxiliary cooling unit 12 for blowing the cooling gas Aa is provided to the heat exchanger 3, the thermo module 4 is allowed to cool in the heating mode by the thermo module 4. By increasing the cooling effect on the side, the heating capacity of the thermo modules 4 can be further increased.

  (7) If the gas supply part 19 which supplies dehumidified air or an inert gas with respect to the circulation ventilation path R is provided in the cooling mechanism Mb by a suitable aspect, the inside of the circulation ventilation path R can always be maintained at the optimal pressure. At the same time, generation of frost can be prevented.

  (8) According to a preferred embodiment, by providing the cover unit 6 in the test tank mechanism Ma with the stirring mechanism unit 20 for stirring the air inside the test tank 2, the test tank mechanism Mae for the thermal shock test may be configured. The thermal shock test can be performed using the configuration other than the cover 6 as it is. Therefore, for example, if the cover for the thermal shock test is treated as an option and can be replaced with the cover 6, the thermal test device (thermal shock test device) can be easily changed to the thermal shock test device (thermal test device). it can.

  Next, the best embodiment according to the present invention will be given and described in detail with reference to the drawings.

  First, the configuration of the thermal test apparatus 1 according to the present embodiment will be specifically described with reference to FIGS.

  In the thermal test apparatus 1, reference numeral 31 denotes a heat-insulating body, which includes an upper heat exchange chamber Cc and a lower cooling gas chamber Ca partitioned by a partition wall portion 32 provided at an intermediate position in the vertical direction. Is provided. Further, in the partition wall 32, when FIG. 1 is the front, the first vent hole Cao is formed at the left side position, and the second vent hole Cai is formed at the right side position. Thereby, while the cooling gas chamber Ca, the 1st ventilation port Cao, the heat exchange chamber Cc, and the 2nd ventilation port Cai comprise the circulation ventilation path R through which the cooling gas Ac mentioned later circulates, the cooling gas chamber Ca is mentioned later. It is arranged below the heat exchanger 3 that performs. As described above, if the cooling gas chamber Ca is arranged below the heat exchanger 3, the cooling gas Ac can be used even when the cooling gas Ac is not used by utilizing the property that the cooling gas Ac accumulates below. Problems that affect the heat exchanger 3 side can be avoided. Therefore, since the installation of the opening / closing mechanism for blocking the cooling gas Ac can be omitted, there is an advantage that the configuration can be simplified.

  On the other hand, a test tank mechanism Ma is disposed at the center of the upper surface of the body 31. The test tank mechanism Ma passes through the upper wall portion of the machine body 31 and faces the heat exchange chamber Cc. The test tank mechanism Ma includes a heat sink type heat exchanger 3. The heat exchanger 3 is integrally formed of a material having high thermal conductivity, such as an aluminum material, and as shown in FIG. 2, the upper plate portion 3u having a flat upper surface and a lower surface from the lower surface of the upper plate portion 3u. Is formed of a large number of fin portions 3f. The heat exchanger 3 is attached to the airframe 31 so that the fin portions 3f are located inside the heat exchange chamber Cc. At this time, the slits between the fin portions 3f are parallel to the circulation air passage R. To arrange.

  3, a plurality of thermo modules 4 using Peltier elements are arranged on the upper surface of the upper plate portion 3u of the heat exchanger 3. At this time, the heat receiving plate 35 is interposed between the thermo modules 4... And the upper plate portion 3u. The heat receiving plate 35 is a plate material made of a material having a high thermal conductivity and a small thermal expansion coefficient, for example, a plate material made of a carbon material and having a thickness of 3 to 5 [mm], or a thickness made of a ceramic material. A plate material having a thickness of 0.6 to 5 [mm] is used. The thermo modules 4 may be directly disposed on the upper surface of the upper plate portion 3u. However, since ceramics are often used for the lower part of the Peltier elements constituting the thermo modules 4 ..., the lower parts of the Peltier elements are usually used. By interposing the heat receiving plate 35 having substantially the same thermal expansion coefficient as that of the heat receiving plate 35, there is an advantage that the heat receiving plate 35 can block the heat shrinkage on the heat exchanger 3 side. Therefore, by using such a heat receiving plate 35, the temperature repetition durability of the Peltier element can be further improved.

  Further, on the upper surface of the heat receiving plate 35, a plurality of heaters 11a constituting the auxiliary heating unit 11 are arranged side by side in the thermo modules 4. Thus, if the auxiliary heating unit 11 is provided in the test tank mechanism Ma in addition to the thermo modules 4..., The auxiliary heating unit 11 can be used in addition to the thermo modules 4. When shifting to the environment, there is an advantage that a steep temperature rise can be realized and the shift can be made more quickly.

  On the other hand, a heat transfer plate 5 is disposed on the upper surface of the thermo modules 4. The heat transfer plate 5 is made of a material having a high thermal conductivity and a small thermal expansion coefficient. Therefore, the heat transfer plate 5 can be formed in substantially the same manner as the heat receiving plate 35 described above, except for the thickness. The illustrated heat transfer plate 5 uses a ceramic material that has a small specific heat and is thinner than the heat receiving plate 35, and is a flat plate having a lateral width of about 90 to 150 [mm]. The heat transfer plate 5 constitutes a substantial bottom surface portion 2d in the test tank 2, and a plurality of small electronic components (test object P ...) can be placed on the top surface. Since ceramics are usually used for the upper part of the Peltier elements constituting the thermo modules 4..., The use of a ceramic material for the heat transfer plate 5 makes it possible to warp the Peltier elements even at a high temperature of about 100 [° C.]. It becomes the same level as. Therefore, a good thermal contact with a small heat capacity can be maintained, the heat load is extremely reduced, and the temperature change can be accelerated even with a small input power. In addition, since it is an electrically insulating material, an energization test can be performed well. It should be noted that a slight gap is provided between the above-described heaters 11a ... and the heat transfer plate 5 so that the heaters 11a ... and the heat transfer plate 5 are not in direct contact with each other. Thereby, the uniformity at the time of heating the heat-transfer plate 5 with heater 11a ... can be improved. Further, a frame-like test tank side wall block 36 surrounding the heat receiving plate 35, the thermo modules 4,..., The heater 11a, and the heat transfer plate 5 is fixed to the upper surface of the upper plate portion 3u. The side wall block 36 is formed of a heat insulating material and is in close contact with the heat transfer plate 5 from above.

  On the other hand, the body 31 is provided with a cover portion 6 that opens and closes with respect to the heat transfer plate 5. The cover portion 6 includes a cover portion main body 6m formed of a heat insulating material and a hinge portion 6h that supports the rear end of the cover portion main body 6m at the rear upper end of the machine body 31 so as to be capable of rotational displacement. A concave portion 37 that forms a part of the internal space of the test tank 2 is provided on the lower surface of the cover body 6m, and the lower surface of the cover body 6m is located around the concave portion 37 at an outer position of the concave portion 37. A rubber grip 38 is attached. Forming the cover main body 6m from a heat insulating material means that the cover main body 6m itself is integrally formed from a heat insulating material, and forming the cover main body 6m from a non-insulating material. This includes the case of covering with a heat insulating material. Thereby, the cover body 6m can be moved up and down with respect to the heat transfer plate 5 (side wall block 36). When the cover body 6m is lowered and closed, the rubber grip 38 comes into pressure contact with the upper surface of the side wall block 36. A closed test tank 2 having a bottom surface portion 2d is configured, and when it is lifted and opened, the test object P (small electronic component) is put in and out of the upper surface of the heat transfer plate 5. be able to.

  Further, a cooling mechanism Mb using a cooler 7 that obtains a cooling gas Ac that cools the heat exchanger 3 is disposed in the body 31. The cooling mechanism Mb includes a Stirling cooler 7 s constituting the cooler 7, a gas cooling unit 15 having a cooling gas chamber Ca that stores the cooling gas Ac cooled by the Stirling cooler 7 s, and the first ventilation port Cao from the cooling gas chamber Ca. Through which the heat exchanger 3 reaches the heat exchanger 3 and through the second air vent Cai to the cooling gas chamber Ca, and the air blowing fan which circulates the cooling gas Ac through the air circulation passage R. The ventilation part 17 which has 16a, 16b is provided. As shown in FIG. 2, the Stirling cooler 7 s is attached to the rear wall surface of the cooling gas chamber Ca, and the protruding cooling portion 7 cs passes through the side wall portion of the airframe 31 and faces the cooling gas chamber Ca. And it couple | bonds with the heat sink type cooling fin part 39 distribute | arranged inside the cooling gas chamber Ca. Reference numeral 40 denotes a heat insulating part. The Stirling cooler 7s encloses helium as a working gas in a compression vessel and incorporates a piston and a displacer that reciprocate up and down, and operates through processes of isothermal compression, isothermal cooling, isothermal expansion, and isothermal heating. . In particular, the Stirling cooler is small and light, and with a small volume, it can be rapidly cooled from 25 [° C.] to −50 [° C.] in about 1 minute. As the Stirling cooler 7s, for example, “Sterling cooler (model number: MA-SCUC08) manufactured by Shinei Co., Ltd.” can be used. As described above, by using the Stirling cooler 7s having an inherent characteristic of being excellent in cooling performance such as rapid cooling although the cooling output cannot be increased, it is most suitable for a thermal test especially for small electronic components. This is advantageous in that it is possible to avoid waste of power consumption when performing the thermal test and to adapt flexibly to the test performance for small electronic components.

  On the other hand, the blower fans 16a and 16b constituting the blower unit 17 include motor units 41a and 41b disposed on the upper surface of the body 31 and on the left and right sides of the test tank mechanism Ma. The upper shafts of the fan shafts 42a and 42b are connected to the rotation shafts of the motor units 41a and 41b, and the lower ends of the fan shafts 42a and 42b pass through the upper wall portion of the airframe 31 and are inside the heat exchange chamber Cc. To reach. And fan part 43a, 43b is attached to the front-end | tip (lower end) of fan shaft 42a, 42b, and fan part 43a, 43b is made to face the 1st ventilation hole Cao and the 2nd ventilation hole Cai, respectively.

  Further, the cooling mechanism Mb is provided with a gas supply unit 19 for supplying dehumidified air or inert gas to the circulation air passage R. Illustrative uses nitrogen gas (inert gas). The gas supply unit 19 is connected to one of the heat exchange chambers Cc to supply a nitrogen gas to the heat exchange chamber Cc, and connected to the other of the heat exchange chambers Cc to connect the nitrogen gas to the heat exchange chamber. A nitrogen gas discharge system 51 that can discharge from Cc is provided. The nitrogen gas supply system 45 includes a nitrogen gas supply source 46, and this nitrogen gas supply source 46 is connected to the heat exchange chamber Cc via an electromagnetic valve 47 and an orifice joint 48. A pressure switch 49 detects the pressure on the outflow side of the electromagnetic valve 47, and the electromagnetic valve 47 is controlled by the pressure switch 49. On the other hand, the nitrogen gas discharge system 51 connects the orifice joint 52 connected to the heat exchange chamber Cc to the atmosphere via the electromagnetic valve 53. A pressure switch 54 detects the pressure on the outflow side of the orifice joint 52, and the solenoid valve 53 is controlled by the pressure switch 54. In addition, a safety valve 55 is connected to the nitrogen gas discharge system 51, and when the internal pressure of the heat exchange chamber Cc reaches an abnormal pressure (2 to 2.5 [kPa]), the safety valve 55 is opened. By using the joints 48 and 52, a sudden pressure change is avoided. Thus, if the gas supply part 19 which supplies dehumidification air or an inert gas with respect to the circulation ventilation path R is provided in the cooling mechanism Mb, while the inside of the circulation ventilation path R can always be maintained at the optimal pressure, There is an advantage that the occurrence can be prevented.

  On the other hand, a controller 8 shown in FIG. 4 is provided. The controller 8 is connected to the gas supply unit 19, the thermo module 4, the heater 11 a, the Stirling cooler 7 s, and the blower fans 16 a and 16 b. The controller 8 is equipped with a microcomputer and performs operation control (sequence control) on the thermo modules 4..., The heaters 11 a..., The Stirling cooler 7 s and the blower fans 16 a and 16 b according to the stored control program. FIG. 5 shows a control pattern that is sequence-controlled in accordance with a control program.

  Next, the usage method and operation | movement of the thermal test apparatus 1 which concern on this embodiment are demonstrated according to the flowchart shown in FIG. 6, referring each figure.

  This thermal test apparatus 1 is particularly suitable for use in a thermal test of a small electronic component, and hereinafter, a case where a thermal test of a small electronic component is performed will be described. First, when performing a thermal test, the cover 6 of the test tank 2 is opened, and a predetermined number of test pieces P (small electronic components) are set in the internal space (test chamber) of the test tank 2, that is, FIG. As shown in FIG. 2, a predetermined number of test objects P are placed on the heat transfer plate 5 (step S1). When the device under test P is set, the cover 6 is closed and locked. As a result, the rubber grip 38 of the cover 6 is pressed against the upper surface of the side wall block 36, and the test chamber in which the test object P is set is sealed. In addition, when the test chamber becomes a high temperature environment and the internal pressure becomes high, it can escape from between the rubber grip 38 and the side wall block 36 in the press contact state.

  Next, the operation switch of the controller 8 is turned ON. Thereby, the gas supply part 19 will be in an operation state, and the controller 8 will switch the valve | bulb not shown in the nitrogen gas supply source 46 to an open side, and will enclose nitrogen gas in the circulation ventilation path R (step S2). At this time, in the initial stage, the solenoid valves 47 and 53 are switched to the open side to discharge the air in the circulation air passage R to the outside by supplying nitrogen gas, and the nitrogen gas is filled in the circulation air passage R. If so, the solenoid valves 47 and 53 are closed. Thereby, the inside of the heat exchange chamber Cc is maintained at a slight positive pressure (set pressure) of 50 to 600 [Pa]. That is, when the internal pressure of the heat exchange chamber Cc becomes equal to or lower than the set pressure, the pressure switch 49 detects the pressure and the electromagnetic valve 47 is switched to the open side. As a result, nitrogen gas is supplied from the nitrogen gas supply system 45 into the circulation air passage R to increase the internal pressure. On the other hand, if the internal pressure of the heat exchange chamber Cc exceeds the set pressure, it is detected by the pressure switch 54 and the electromagnetic valve 53 is switched to the open side. As a result, the nitrogen gas in the circulation air passage R is discharged to the outside (atmosphere) through the nitrogen gas discharge system 51 to lower the internal pressure. As a result, the internal pressure of the heat exchange chamber Cc is always maintained at a set pressure (slight positive pressure).

  Further, the controller 8 turns on the Stirling cooler 7s. As a result, the Stirling cooler 7s is activated, and the cooling fin section 39 is cooled by the cooling section 7sc (step S3). As a result, the gas (nitrogen gas) in the cooling gas chamber Ca is cooled by the cooling fins 39 to obtain the cooling gas Ac, and the cooling gas Ac is stored in the cooling gas chamber Ca. Since the temperature of the cooling gas chamber Ca is detected by a temperature sensor (not shown), the controller 8 starts a thermal test when the target cooling temperature is reached.

  In the thermal test, the control pattern shown in FIG. 5, that is, the cooling mode Dc for maintaining the low temperature environment (−40 [° C.]) for the low temperature setting time and the heating for maintaining the high temperature environment (+125 [° C.]) for the high temperature setting time. The mode Dh is executed according to a control pattern that repeats alternately. In FIG. 5, Ts indicates the tendency of the internal temperature of the test chamber 2, and Tr indicates the tendency of the internal temperature of the cooling gas chamber Ca. Za is a +125 [° C.] period in the heating mode, Zb is a transition period from +125 [° C.] to −40 [° C.], Zc is a −40 [° C.] period in the cooling mode, and Zd is −40 [° C. ] To +125 [° C.] respectively.

  In the cooling mode Dc, energization control of the thermo modules 4... At the same time, the blower fans 16a and 16b are turned on (step S6). As a result, the upper surfaces of the thermo modules 4 are cooled, the inside of the test tank 2 is brought into a low temperature environment via the heat transfer plate 5, and heat is radiated from the lower surfaces of the thermo modules 4. This heat radiation is transmitted to the heat exchanger 3 via the heat receiving plate 35, and heat is exchanged in the heat exchange chamber Cc. That is, the blower fans 16a and 16b rotate in opposite directions, and the cooling gas Ac in the cooling gas chamber Ca reaches the heat exchange chamber Cc through the first vent hole Cao as indicated by the dotted arrow Fc shown in FIG. Thereafter, the heat exchanger 3 is cooled (heat exchanged) by the cooling gas Ac because it circulates along the circulation air passage R that reaches the cooling gas chamber Ca through the second vent hole Cai. The internal temperature of the test tank 2 is detected by a temperature sensor (not shown), and the inside of the test tank 2 is temperature-controlled by a cooling mode Dc that is maintained in a cooling environment of −40 [° C.] (step S7). ). This cooling mode Dc is performed only for the low temperature setting time. When the low temperature setting time has elapsed, the controller 8 turns off the blower fans 16a and 16b (steps S8 and S9).

  Since the controller 8 immediately shifts to the heating mode Dc upon completion of the cooling mode Dc, the controller 8 reverses the energization direction to the thermomodules 4 and controls the energization so as to enter the heating mode (steps S10, S4, S11, S12). At the same time, the heaters 11a are turned on (step S13). Thus, the heat transfer plate 5 is heated by the thermo modules 4... And the heaters 11 a. At this time, the temperature of the heat transfer plate 5 is detected by a temperature sensor (not shown), and if the heat transfer plate 5 reaches +125 [° C.] where the heat transfer plate 5 becomes a high temperature environment, the controller 8 turns off the heaters 11a (step S1). S14, S15). Thereafter, temperature control is performed by the heating mode Dh maintained in a high temperature environment of +125 [° C.] by energizing only the thermo modules 4... (Step S16). And if high temperature setting time passes and heating mode Dh is complete | finished, it will transfer to cooling mode Dc immediately (step S17, S10, S4). The above cooling mode Dc and heating mode Dh are repeated over a predetermined thermal test time.

  Therefore, according to such a thermal test apparatus 1 according to the present embodiment, the thermo modules 4 using Peltier elements are arranged on the upper surface of the heat exchanger 3 for heat exchange, and the upper surface of the thermo module 4. The test plate 2 is provided with a heat transfer plate 5 and a cover portion 6 that opens and closes with respect to the heat transfer plate 5, and the heat transfer plate 5 serves as a bottom surface portion 2 d when the cover portion 6 is closed. In addition to being able to quickly switch between a high-temperature environment and a low-temperature environment, since there is provided a cooling mechanism Mb using a test tank mechanism Ma that performs cooling and a cooler 7 that obtains a cooling gas Ac that cools the heat exchanger 3, the apparatus The overall size can be reduced, and the power consumption can be reduced.

  Next, a thermal test apparatus 1 according to a modified embodiment of the present invention will be described with reference to FIGS.

  7 and 8 show a modification example of the auxiliary heating unit 11. The auxiliary heating unit 11 shown in FIG. 7 uses rod-shaped heaters 11b embedded in the heat exchanger 3 instead of the heaters 11a, and is a cross section viewed from the front in FIG. 7A. While showing a structure, the structure seen from the side surface direction is shown in FIG.7 (b). In this case, the heater block 61 formed of a carbon material or the like is formed with a plurality of holes from the side surface, and the small heaters 11b are respectively inserted into the holes to constitute the heater unit 62, and the heater unit 62 is replaced with a heat exchanger. 3 may be placed on the upper surface of the plate.

  Moreover, the auxiliary heating part 11 shown in FIG. 8 distribute | circulates the heating fluid Ah to the gas channel | path 11c ... formed in the inside of the heat exchanger 3. As shown in FIG. In this case, 65 is a heating unit provided outside, and is configured by incorporating a heater 65h inside the heater case 65c. Accordingly, if normal temperature air is supplied into the heater case 65c from one end side using the air pump 66, a heated fluid (heated air) Ah can be obtained from the other end side of the heater case 65c. The fluid Ah may be supplied to one end of the gas passage 11c through a supply tube 67 formed of a silicon material or the like. The heating fluid Ah in the gas passages 11c is discharged from the other end via the exhaust tube 68. In this case, the temperature of the heating fluid Ah is detected by the temperature sensor 69, and the heater 65h is feedback-controlled by the temperature controller 70 so that the temperature of the heating fluid Ah becomes 60 to 65 [° C.]. Since the heating fluid Ah requires a small air volume, a small diaphragm pump is sufficient for the air pump 66. In this modified example, since an electric circuit is not disposed in the vicinity of the test tank 2 where the temperature changes drastically, it is advantageous from the viewpoint of avoiding electric leakage or failure. The auxiliary heating unit 11 in FIG. 8 can also be used as an auxiliary cooling unit. That is, by turning off the heater 65h and supplying ambient air to the gas passages 11c, the high-temperature heat exchanger 3 can be cooled (remaining heat is removed), and thus can be used as an auxiliary to the cooling mechanism Mb described above. .

  FIG. 9 is provided with an auxiliary cooling unit 12 that blows a cooling gas Aa to the heat exchanger 3, and in the heating mode, the cooling capacity of the heat exchanger 3 is increased and the thermo module 4 is increased. The heating ability can be increased. In the present specification, the term “cooling” means that the cooled heat exchanger 3 is warmed. The auxiliary cooling unit 12 includes dampers 81a and 81b which are attached to the first ventilation port Cao and the second ventilation port Cai and open and close the first ventilation port Cao and the second ventilation port Cai, respectively, in the airframe 31 of FIG. Prepare. In this case, the dampers 81a and 81b are rotationally displaced by a solenoid (not shown) or the like. In addition, the wall surface of the airframe 31 located on both sides in the front-rear direction of the slit between the fin portions 3f in the heat exchanger 3 in the heat exchange chamber Cc is provided with a first communication port 82a and a second communication port 82b, respectively. The air passage forming frame 83 is attached to the first air passage 82a and the second air passage 82b so that both ends of the second air passage Rs face each other. Accordingly, the dampers 81a and 81b are respectively rotated by 90 ° to selectively open and close the first vent hole Cao, the second vent hole Cai, or the first series of vent holes 82a and the second communication port 82b. it can. On the other hand, in the middle of the air passage forming frame 83, a heat sink type heat exchange unit 84 having fin portions on the upper and lower sides is provided, with the upper side facing the second air passage Rs and the lower side facing the outside air. Reference numerals 85a and 85b denote blower fans disposed in the second air passage Rs.

  Thus, in the cooling mode, if the dampers 81a and 81b are displaced to open the first vent hole Cao and the second vent hole Cai and close the first series of vent holes 82a and the second communication port 82b, FIG. A similar cooling mode can be performed. On the other hand, in the heating mode, the dampers 81a and 81b are displaced, the first vent hole Cao and the second vent hole Cai are closed, the first series of vent holes 82a and the second communication port 82b are opened, and air is blown. If the fans 85a and 85b are turned on, the gas in the second air passage Rs is warmed by the heat exchanging unit 84 to a temperature around 10 to 35 [° C.]. And the warmed gas Aa circulates along the 2nd ventilation path Rs as shown by the dotted line arrow Fa, and the heat exchanger 3 is left to cool (heat exchange). Thus, if the auxiliary cooler 12 that blows the gas Aa for cooling to the heat exchanger 3 is provided, in the heating mode by the thermo modules 4..., The cool on the cool side of the thermo modules 4. By increasing the effect, there is an advantage that the heating capacity of the thermo modules 4 can be further increased. The auxiliary cooling unit 12 in FIG. 9 can also be used for heat dissipation in the cooling mode. Further, if the damper 81a (81b) is positioned at an intermediate position between the first series opening 82a (second communication opening 82b) and the first ventilation opening Cao (second ventilation opening Cai), the first series opening 82a. , The second communication port 82b, the first ventilation port Cao and the second ventilation port Cai can all be opened to quickly cool or release heat.

  In FIG. 10, an opening / closing mechanism 18 that opens and closes the circulation air passage R between the heat exchanger 3 and the cooling gas chamber Ca is provided in the air blowing unit 17. That is, the air cylinders 91a and 91b are disposed on the upper surface of the body 31 on the left and right sides of the test tank mechanism Ma, and the valve shafts 92a and 92b connected to the output rods of the air cylinders 91a and 91b are heat exchanged. The interior of the chamber Cc is reached. And valve part 93a, 93b is attached to the front-end | tip (lower end) of valve shaft 92a, 92b, and this valve part 93a, 93b is made to face the 1st ventilation port Cao and the 2nd ventilation port Cai, respectively. Thus, if the opening / closing mechanism part 18 that opens and closes the circulation air passage R between the heat exchanger 3 and the cooling gas chamber Ca is provided in the air blowing part 17, the cooling gas is used even when the cooling gas Ac is not used. There exists an advantage which can prevent reliably that Ac leaks from the gas cooling part 15 to the heat exchanger 3 side.

  FIG. 11 is configured as a test tank mechanism Mae for a thermal shock test by providing a stirring mechanism section 20 for stirring the air inside the test tank 2 in the cover section 6 of the test tank mechanism Ma. In this case, the stirring mechanism unit 20 includes a motor 95 attached to the upper surface of the cover unit 6, and the rotating shaft 96 connected to the rotating shaft of the motor 95 faces the recessed portion 37, so that the tip of the rotating shaft 96 (lower end) ) Is attached with a stirring fan 97. Further, an upper bucket 98 u formed of a net using a stainless material is disposed at a position where the rotation of the stirring fan 97 is not hindered. On the other hand, on the upper surface of the heat transfer plate 5, a heat sink type heat exchange block 99 formed of an aluminum material or a copper material is placed, and a predetermined gap is opened on the heat exchange block 99 so that a stainless steel material is placed. A lower bucket 98d constituted by the net used is installed. Thus, when the cover 6 is closed, the upper bucket 98u covers the lower bucket 98d, so that the DUT P is set in the lower bucket 98d and the agitating fan 97 is rotated. A thermal shock test can be performed. Thus, if it comprises as the test tank mechanism Mae for thermal shock tests by providing the stirring mechanism part 20 which stirs the air inside the test tank 2 in the cover part 6 in the test tank mechanism Ma, the cover part 6 The thermal shock test can be performed using the configuration other than that as it is. Therefore, for example, if the cover for the thermal shock test is treated as an option and can be replaced with the cover 6, the thermal test device (thermal shock test device) can be easily changed to the thermal shock test device (thermal test device). it can.

  In addition, in the modified embodiment shown in FIGS. 7-11, the same code | symbol was attached | subjected to the same part (same functional part) as FIGS. 1-6, and the structure was clarified. Therefore, in FIGS. 7 to 11, detailed description of the same parts (same function parts) as those in FIGS. 1 to 6 is omitted.

  Although the best embodiment has been described in detail above, the present invention is not limited to such an embodiment, and departs from the gist of the present invention in the detailed configuration, shape, material, quantity, numerical value, and the like. It can be changed, added, or deleted as long as it is not.

  For example, although the case where nitrogen gas was used as the cooling gas Ac was shown, other inert gas or dehumidified air may be used. The dehumidified air in this case includes a case where dehumidified air is sealed from the outside and a case where the enclosed normal air is dehumidified by a dehumidifying device built in the body 31. Further, the Peltu elements constituting the thermo module 4 may be configured arbitrarily, for example, by being constituted by two-stage overlapping. Furthermore, although the case where the Stirling cooler 7s was used as the cooler 7 was shown, use of the other cooler 7 is not excluded. Therefore, the cooler 7 using a Peltier device may be used. On the other hand, the auxiliary heating unit 11 may be a heating means other than the illustrated auxiliary heating unit, or a plurality of different auxiliary heating units may be combined as necessary. Note that the thermal test apparatus 1 according to the present embodiment is optimal for use in a thermal test of small electronic components (device under test P...), But various medium and large sizes that can be set in the test tank 2 as well as small electronic components. In addition, it can be used in the same manner for thermal testing of various electronic parts and other parts and articles.

A partial cross-sectional front view of a thermal test apparatus according to the best embodiment of the present invention, A partial cross-sectional side view of the thermal test apparatus, Sectional front view showing enlarged test tank mechanism in the same thermal test apparatus, Block system diagram showing a control system in the thermal test apparatus, Control pattern diagram when performing a thermal test with the same thermal test equipment, A flow chart for explaining a method of use and operation of the thermal test apparatus; The modification example of the auxiliary | assistant heating part in the thermal test apparatus which concerns on the modified embodiment of this invention is shown, (a) is the cross-sectional block diagram seen from the front direction, (b) is the block diagram seen from the side surface direction, A partial cross-sectional front view showing another modified example of the auxiliary heating unit in the same thermal test apparatus, It is a thermal test apparatus according to another modified embodiment of the present invention, a partial cross-sectional front view including the configuration of the auxiliary cooling unit, It is a thermal test apparatus according to another modified embodiment of the present invention, a partial cross-sectional front view including the configuration of the opening and closing mechanism part, A partial cross-sectional front view including a test tank mechanism for a thermal shock test, which is a thermal test apparatus according to another modified embodiment of the present invention,

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1: Thermal test apparatus, 2: Test tank, 2d: Bottom part of test tank, 3: Heat exchanger, 3f ...: Fin part, 4 ...: Thermo module, 5: Heat transfer plate, 6: Cover part, 7: Cooler, 7s: Stirling cooler, 7cs: Stirling cooler cooling unit, 8: Controller, 11: Auxiliary heating unit, 11a ...: Heater, 11b ...: Rod heater, 11c ...: Gas passage, 12: Auxiliary cooling unit 15: Gas cooling section, 16a: Blower fan, 16b: Blower fan, 17: Blower section, 18: Opening / closing mechanism section, 19: Gas supply section, 20: Stirring mechanism section, 32: Partition wall section, P ...: Covered Specimen, Ma: Test tank mechanism, Mb: Cooling mechanism, Mae: Test tank mechanism for thermal shock test, Ac: Cooling gas, Ah: Heated fluid, Aa: Cooling gas, Ca: Cooling gas chamber, Cao : First vent, Cai: Second vent, C : Heat exchange chamber, R: circulating air passage

Claims (6)

  In a thermal test apparatus for performing a thermal test on the DUT by alternately providing a high temperature environment and a low temperature environment to the DUT accommodated in the test tank, a heat sink type having a fin portion protruding downward At least one thermo module using a Peltier element is arranged on the upper surface of the heat exchanger, and a heat transfer plate is arranged on the upper surface of the thermo module, and a cover portion that opens and closes to the heat transfer plate is provided. A test tank mechanism that constitutes the test tank having the heat transfer plate as a bottom surface portion when the cover portion is closed, a heat exchange chamber facing the fin portion, and a partition wall portion below the heat exchange chamber A cooling gas chamber provided via the cooling gas chamber and a gas cooling unit having a cooler using a Stirling cooler with the cooling unit facing the cooling gas chamber, and from the cooling gas chamber A circulation fan passage that leads to the heat exchange chamber through one vent hole and from the heat exchange chamber to the cooling gas chamber through a second vent hole, a blower fan that circulates and sends the cooling gas to the circulation fan passage, and A cooling mechanism including a blower having an opening / closing mechanism that opens and closes a circulation blower path between the heat exchange chamber and the cooling gas chamber; and a controller that controls the operation of the thermo module and the cooler. Thermal test equipment characterized by   The thermal test apparatus according to claim 1, wherein the test tank mechanism includes an auxiliary heating unit in addition to the thermo module.   The auxiliary heating unit is formed at least in the auxiliary heating unit using a heater arranged side by side in the thermo module, the auxiliary heating unit using a rod-shaped heater embedded in the heat exchanger, and the heat exchanger The thermal test apparatus according to claim 2, wherein one or two or more auxiliary heating parts for circulating a heating fluid through the gas passage are used.   The thermal test apparatus according to claim 1, further comprising an auxiliary cooling unit that blows a cooling gas to the heat exchanger.   The thermal test apparatus according to claim 1, wherein the cooling mechanism includes a gas supply unit that supplies dehumidified air or an inert gas to the circulation air passage.   The said test tank mechanism is comprised as a test tank mechanism for thermal shock tests by providing the stirring mechanism part which stirs the air inside the said test tank in the said cover part. Thermal test equipment.

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