JP4860991B2 - Inspection device for optical devices - Google Patents

Description

The present invention relates to an inspection device for optical devices such as an image sensor and a solid-state imaging device.

  Inspection of photoelectric conversion elements, so-called optical devices, such as image sensors and solid-state imaging elements, requires that the image sensor unit be irradiated with light to perform characteristic measurement. For example, in the case of a solid-state image sensor, the inspection is performed by the following method.

  The solid-state imaging device 1 has a size of one chip of 10 mm or less per side, and a sensor region 2 in which hundreds of thousands to millions of optical sensors are embedded is provided at the center of the chip surface. Electrode pads 3 are formed on the four surrounding sides (see FIG. 1).

  In order to inspect the operation of the solid-state imaging device 1, the sensor region 2 is irradiated with light, and the electrical characteristics generated by the incident light are measured by measuring the electrical signal extracted from the electrode pad 3. To check.

  In order to perform the inspection as described above, a device in which a pupil lens is mounted on a cantilever type probe card as shown in FIG. 4 is used. An example of such a conventional inspection apparatus is disclosed in JP-A-11-26521.

Japanese Patent Application Laid-Open No. 11-26521 discloses an integrated inspection device 18 and optical device 17, and the inspection device 18 is a probe card 16 provided with an opening for irradiating light in the central portion. A cantilever type probe 15 is used (see FIG. 5).
JP-A-11-26521

  In the conventional apparatus, when manufacturing a multi-piece, there is a problem that a shadow of a needle is formed on the irradiation light and affects the measurement, and the sensor area 2 is rectangular as shown in FIG. Since 21 is circular, in order to solve the problem that the irradiation light affects the adjacent chip, when taking a large number of chips, it is possible to take a diagonal step of the chip step and install a light shielding plate for the irradiation light. It corresponded by.

  However, in the conventional apparatus, there is a limit that the number of multi-pieces is up to about eight diagonally, and the warp of the substrate and the misalignment of the needles have become problems due to the large opening when multi-pieces are taken.

The present invention provides an inspection apparatus for optical devices that can be set in a multi-piece manner more freely than the conventional apparatus, and can ensure strength by minimizing the opening of the substrate. Objective.

  An optical device inspection apparatus according to the present invention includes a probe card and a lens unit, wherein the probe card and the lens unit are integrally combined, and the probe card is provided with a vertical probe. .

  In the optical device inspection apparatus of the present invention, the probe card includes a main board, a sub board fixed to the main board by a ring bush, a reinforcing plate for reinforcing the main board, and a guide plate in which the probe is inserted. It is preferable that the lens unit is integrally combined with an opening provided in the main substrate and the reinforcing plate.

  In the optical device inspection apparatus of the present invention, it is preferable that an irradiation area formed by the lens unit is limited by the guide plate.

  The inspection device for an optical device of the present invention includes a probe card and a lens unit, and the probe card and the lens unit are combined together, and the probe card is provided with a vertical probe, so that the area is increased. As many as possible can be obtained, and the distance between adjacent test areas can be set to a minimum, so that the areas to be simultaneously tested can be freely set.

  In the optical device inspection apparatus of the present invention, the probe card includes a main board, a sub board fixed to the main board by a ring bush, a reinforcing plate for reinforcing the main board, and a guide plate in which the probe is inserted. Since the lens unit is integrally combined with the opening provided in the main substrate and the reinforcing plate, the opening of the substrate can be minimized, and the strength of the substrate is improved. Can solve the problems of warping and needle misalignment.

  In the optical device inspection apparatus according to the present invention, the irradiation area formed by the lens unit is limited by the guide plate, so that there is no influence on the adjacent chip, and an unnecessary light shielding plate is not required.

  The present invention will be described in detail below with reference to the drawings. FIG. 2 is a schematic view of an optical device inspection apparatus according to the present invention, and FIG. 3 is an overall cross-sectional view of the optical device inspection apparatus.

The optical device inspection apparatus 4 of the present invention includes a probe card 5 and a lens unit 6, and the probe card 5 and the lens unit 6 are combined together. The probe card 5 is provided with a vertical probe 7.

The probe card 5 includes a main board 8, a sub board 10 fixed to the main board 8 by a ring bush 9, a reinforcing plate 11 for reinforcing the main board 8, and a guide plate 12 into which the probe 7 is inserted. The lens unit 6 is integrally combined with an opening provided in the main substrate 8 and the reinforcing plate 11.

An optical device inspection method using the optical device inspection apparatus of the present invention will be described. In this embodiment, a solid-state image sensor 1 as shown in FIG. 1 is used as an optical device.

As shown in FIG. 2, the light irradiated from the light source device 13 passes through the lens unit 6 and is irradiated onto the optical device of the object to be measured. At this time, the light passing through the lens unit 6 passes through an opening provided in the guide plate 12, but a part of the light (20 region shown in FIG. 4) is blocked by the guide plate 12, The irradiation region 21 is substantially the same range as the sensor region 2 of the solid-state imaging device 1 and has almost no influence on other adjacent solid-state imaging devices 1.

  In this way, the probe 7 is brought into contact with the electrode pad 3 in a state where the sensor region 12 is irradiated with light, thereby measuring an electrical signal taken out from the electrode pad 3 and inspecting the solid-state imaging device 1. Do.

Thus, an optical device for inspecting device 4 of the present invention, instead of the light shielding plate or the like which has been required in the conventional inspection apparatus, the guide plate 12 to limit the irradiation area by blocking the light.

Testing apparatus 4 for optical devices of the present invention, because of the use of vertical probe 7, as compared with the inspection apparatus using the conventional cantilever-type probe, it is possible to more closely the inspection area adjacent test The relative movement between the region and the probe card can be simplified.

  This can be realized by the fact that the probes can be arranged at a narrower pitch because the probes 7 are vertical. As a result, it is possible to freely set a measurement area.

Inspection system for optical devices of the present invention, unlike the conventional inspection apparatus, by the lens unit 6 to the probe card 5 not combined probe card 5 and the lens unit 6 is merely parts are combined together Thus, design restrictions that are conventionally limited for each individual part can be relaxed, and a more accurate inspection apparatus can be realized.

FIG. 2A is a plan view of an entire solid-state image sensor as an optical device and a partially enlarged plan view thereof, and FIG. 1 is a schematic cross-sectional view of an optical device inspection apparatus. 1 is an overall cross-sectional view of an optical device inspection apparatus. FIG. 6 is a schematic cross-sectional view of a conventional optical device inspection apparatus. The schematic sectional drawing of the inspection apparatus for optical devices of another conventional embodiment. The top view which shows the irradiation area | region at the time of using the conventional inspection apparatus for conventional optical devices.

DESCRIPTION OF SYMBOLS 1 Fixed image pick-up element 2 Sensor area | region 3 Electrode pad 4 Optical device inspection apparatus 5 Probe card 6 Lens unit 7 Probe 8 Main board 9 Ring bush 10 Sub board 11 Reinforcement plate 12 Guide plate 13 Wafer 14 Light source device 15 Cantilever type probe 16 Probe Card 17 Optical device 18 Inspection device 19 Lens unit 20 Area of light blocked by guide plate 21 Irradiation area

Claims (2)

An inspection device for an optical device for inspecting a light receiving element, comprising a probe card and a lens unit, wherein the probe card and the lens unit are integrally combined, and the probe card is constituted by a main board and a ring bush. A sub-board fixed to the main board, a reinforcing plate that reinforces the main board, and a guide plate in which a vertical probe is inserted and held, and in an opening provided in the main board and the reinforcing plate An inspection device for an optical device, wherein the lens units are integrally combined, and light emitted from the lens unit passes through an opening of the guide plate.   The optical device inspection apparatus according to claim 1, wherein an irradiation area formed by the lens unit is limited by the guide plate.