JP4863810B2 - Manufacturing method of electronic equipment - Google Patents

Description

The present invention relates to a method of manufacturing an electronic device including electronic components such as a power transistor, a microprocessor, a choke coil, a laser diode, and an electric motor, and more particularly, suppresses a high temperature when the electronic component operates and generates heat. It is about.

  Some electronic devices include electronic components that generate heat and become high temperature when operated, such as a power transistor, a microprocessor, a choke coil, a laser diode, and an electric motor. When such an exothermic electronic component reaches a temperature higher than a predetermined temperature, the electronic component or the electronic device malfunctions, and further, damage such as destruction of the built-in circuit or peripheral circuit of the electronic device occurs. In order to prevent the occurrence of such harm, various measures have been proposed in the past for suppressing the temperature of electronic components from becoming high.

  For example, in Patent Document 1 below, cooling is performed by enclosing a metal having a melting point lower than the melting point or decomposition temperature of the hollow container and lower than the upper limit operating temperature of the electronic component inside the hollow container formed of a high thermal conductivity material. By attaching the element to the upper surface of the electronic component mounted on the circuit board opposite to the circuit board, the heat generated from the electronic component is absorbed and stored by melting the metal, preventing the electronic component from becoming hot. ing.

In Patent Document 2 below, Al ₂ O ₃ having a circuit pattern formed on the upper surface is used.
In a circuit board composed of an insulating plate made of a member and a substrate made of an aluminum member in close contact with the lower surface of the insulating plate, an electronic component is mounted on the upper surface of the insulating plate and sealed with respect to the entire surface of the substrate. By encapsulating a heat storage material made of a paraffin member in such a cavity, heat generated from the electronic component is absorbed and stored by melting the heat storage material, and the electronic component is prevented from reaching a high temperature.

  In Patent Document 3 below, an electronic component is mounted on the upper surface of a circuit board, a casing containing a solid coolant such as paraffin is fixed to the lower surface of the circuit board, and solid cooling is performed on the inner side of the ceiling portion of the casing. By providing the fin so as to come into contact with the agent over a wide area, the heat generated from the electronic component is absorbed by the melting of the solid coolant to be stored, and the electronic component is prevented from becoming high temperature.

  In Patent Document 4 below, a slurry in which a phase-change substance is encapsulated in a small amount is enclosed in a container or a flexible bag, and the container or bag is brought into contact with the electronic component, thereby generating heat from the electronic component. Is absorbed and stored by the phase change from the solid to the liquid of the slurry, and the electronic component is prevented from becoming high temperature.

  Further, in Patent Document 5 below, a heat radiating sheet formed by laminating a metal sheet such as aluminum or copper and an adhesive heat conductive member containing a heat softening material such as paraffin wax is used as an electronic component and a heat The metal sheet is connected to the electronic component, and the heat conductive member is connected to the heat dissipating member, and the heat generated from the electronic component is transferred from the solid to the liquid of the heat conductive member. The change absorbs heat and transmits it to the heat dissipating member to suppress the electronic component from becoming high temperature.

  Furthermore, in the following Patent Document 6, a semiconductor device is mounted on a lid portion of a box, a heat storage material is provided in the box, and a heat dissipation member introduced into the heat storage material connected to the box is provided. The heat storage material contains tin, bismuth, and zinc in a ratio of 40: 56: 4. The heat radiating member is provided under the semiconductor device, the heat conduction shaft is connected to the inside of the box, and the heat radiating portion is formed radially in a direction intersecting the axial length direction from the axis via the heat conduction shaft Is provided. The heat storage material has a liquid phase volume that is less than the volume of the space obtained by subtracting the volume of the heat radiating member from the volume of the internal space formed by the housing portion and the lid portion of the box, that is, the volume of the box. It is enclosed. For this reason, when the heat storage material is a solid phase, the heat storage material contracts, so that a decompressed gap is formed on the lid side of the internal space of the box.

JP 2004-152905 A Japanese Patent No. 2798656 Japanese Utility Model Publication No. 2-15786 US Patent No. 5007478 JP 2002-305271 A JP 2004-247423 A

  As mentioned above, by attaching a heat storage body such as metal, paraffin, or slurry directly or indirectly to the electronic component, the heat generated from the electronic component is released to the heat storage body and the electronic component is prevented from becoming hot. Was. However, if a gap containing air is interposed between the heat storage body and the electronic component, the heat conductivity of the air is low, so that heat generated from the electronic component is efficiently released to the heat storage body, and the electronic component becomes high temperature. Can not be suppressed. In particular, when the heat storage body is enclosed in a container as in Patent Documents 1 to 4 and 6, a gap containing air is easily formed in the container. In patent document 6, the space | gap is formed between the heat radiating member or heat storage body in a container, and an electronic component, without taking into consideration that air will interfere with the heat conduction to a heat radiating member or a heat storage body. In this case, the air gap can be removed from the inside of the container by heating the heat storage body into a liquid state and then pouring it gently into the container. However, air may still remain from the inside of the container. In addition, since air is contained in the liquid heat storage body and it is very difficult to completely remove the air, the heat storage body repeats the phase change between the solid and the liquid in the container. Air may appear, and an air gap may be formed between the heat storage body in the container and the electronic component. Furthermore, it takes time and effort to gently pour the heat storage body into a liquid state after it is heated in the manufacturing process of the electronic device.

  The present invention solves the above-described problems, and the problem is to efficiently store heat generated from the electronic components of the electronic device while reducing labor and time required in the manufacturing process of the electronic device. It is to prevent the electronic component from getting hot and getting hot.

In the method for manufacturing an electronic device according to the present invention, the ceiling portion having the thermal conductivity of the container is provided with an uneven portion with respect to the inside of the container, and the solid heat storage body is a volume excluding the recessed portion on the inside of the container. It is molded in a larger volume and almost the same shape as the inside of the container, a heat storage body is fitted inside from the opening of the container, a lid is closed so as to close the opening, and the heat storage body is enclosed in the container. Attach the container ceiling to the bottom of the part.

  In this way, it is not necessary to heat the heat accumulator into a liquid state and then gently pour it into the container, and simply fit the heat accumulator into the container in a solid state and cover the container, It is possible to reduce labor and time required in the manufacturing process of the electronic device. Further, when the heat storage body melts in the container, an air gap is formed in the concave portion of the ceiling portion of the container, and the air existing between the container and the heat storage body or the solid of the heat storage body in the container Since the air exposed from the heat storage body due to repeated phase change of liquid and liquid is guided to the air gap in the concave portion and accumulates in the concave portion, the vicinity of the tip of the convex portion of the ceiling of the container and the heat storage body It is possible to close the gap so that the gap is reduced. For this reason, when an electronic component operates and generates heat, the heat generated from the electronic component is efficiently released to the heat storage body via the convex portion of the ceiling of the container, and the electronic component is prevented from becoming high temperature. Is possible.

In another method for manufacturing an electronic device according to the present invention, an uneven portion is provided on the inside of the container on the ceiling having heat conductivity of the container, and the solid state heat storage body is removed from the recess on the inside of the container. The volume is larger than the volume of the container and is formed in the same shape as the opening of the container, the heat storage body is fitted inside the opening of the container, the lid is pressed against the heat storage body, and the cover is opened while the heat storage body is deformed. The lid is fixed to the edge of the opening, the heat storage body is sealed in the container, and the ceiling of the container is attached to the lower surface of the electronic component.

  In this way, it is not necessary to heat the heat storage body into a liquid state and then gently pour it into the container, and because the heat storage body is pressed and deformed by the lid, the heat storage body is placed in a simple solid state in the container. It can be simply inserted, and it is possible to reduce labor and time required in the manufacturing process of the electronic device. Further, when the heat storage body melts in the container, an air gap is formed in the concave portion of the ceiling portion of the container, and the air existing between the container and the heat storage body or the solid of the heat storage body in the container Since the air exposed from the heat storage body due to repeated phase change of liquid and liquid is guided to the air gap in the concave portion and accumulates in the concave portion, the vicinity of the tip of the convex portion of the ceiling of the container and the heat storage body It is possible to close the gap so that the gap is reduced. For this reason, when an electronic component operates and generates heat, the heat generated from the electronic component is efficiently released to the heat storage body via the convex portion of the ceiling of the container, and the electronic component is prevented from becoming high temperature. Is possible.

  According to the present invention, the vicinity of the tip of the convex portion of the ceiling of the container and the heat storage body can be brought into close contact with each other so that the air gap is reduced. Heat generated from the electronic component can be released to the heat storage body, and the electronic component can be prevented from reaching a high temperature. In addition, it is not necessary to heat the heat storage body into a liquid state and then pour it gently into the container. Instead, the heat storage body can be simply inserted into the container in a solid state, which takes time and effort in the manufacturing process of the electronic device. Can be reduced.

  FIG. 1 is a cross-sectional view of an electronic apparatus 1 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. The electronic component 5 provided in the electronic device 1 is composed of an electronic component having a heat generating property that generates heat and becomes high temperature by operation, such as a power transistor, a microprocessor, a choke coil, a laser diode, or an electric motor. The electronic component 5 is mounted on the center of the upper surface of the metal substrate 3 by surface mounting or the like. It is preferable that there are few air gaps between the electronic component 5 and the metal substrate 3. An electric circuit (not shown) is formed on the surface of the metal substrate 3. The end of the upper surface of the metal substrate 3 and the lower surface of the case 2 are fixed by screws or the like (not shown). The electronic component 5 is covered with the case 2 at the upper side and the side, and covered with the metal substrate 3 at the lower side. The metal substrate 3 is also used as a lid for closing the lower side of the case 2. The case 2 and the metal substrate 3 are formed of a metal material having thermal conductivity and heat dissipation such as aluminum.

  A container 4 is attached below the metal substrate 3. The container 4 is comprised from the main-body part 4a and the ceiling part 4b. The main body 4a is formed in a rectangular parallelepiped or cubic box shape. The ceiling part 4b is also used as a lid for closing the upper part of the main body part 4a. The main body 4a and the ceiling 4b are formed of a metal material having thermal conductivity and heat dissipation such as aluminum. The main body 4a and the ceiling 4b are fixed with screws. A heat accumulator 7 is enclosed in the container 4. The heat storage body 7 is made of a material, such as paraffin wax, that absorbs heat and stores heat during phase change from solid to liquid (melting). The melting point of the heat storage body 7 is lower than the melting point of each material of the container 4, the case 2, and the metal substrate 3 or the decomposition temperature of the case 2 and the metal substrate 3, and is equal to or lower than the upper limit temperature of the electronic component 5. As a specific example of the heat storage body 7, a synthetic wax FT115 manufactured by Nippon Seiwa Co., Ltd. can be used. The melting point of this synthetic wax is 114 ° C.

  The upper surface of the ceiling portion 4b of the container 4 and the lower surface of the metal substrate 3 are attached in close contact with each other via an adhesive sheet or grease having thermal conductivity. That is, the ceiling portion 4 b is attached to the lower surface of the electronic component 5 so that the air gap is reduced. On the lower surface of the ceiling portion 4b, a convex portion 4c that protrudes with respect to the heat storage body 7 and a concave portion 4d that is recessed are provided. The convex part 4c is provided in the center of the ceiling part 4b. The tip of the convex portion 4c is a horizontal plane. The vicinity of the tip of the convex portion 4 c is in contact with the heat storage body 7. As shown in FIG. 2, the recess 4d is provided so as to surround all the directions of the protrusion 4c. A gap 6 containing air is provided near the bottom of the recess 4d. The volume of the gap 6 is smaller than the volume of the convex portion 4c. Surfaces other than the surface facing the gap 6 of the heat accumulator 7 are in close contact with the inner surface of the main body portion 4a of the container 4 and the surface near the tip of the convex portion 4c of the ceiling portion 4b so as to reduce the air gap. As shown in FIGS. 1 and 2, the electronic component 5 is attached in a region directly above the convex portion 4 c. That is, the electronic component 5 is not attached directly above the recess 4d. Thereby, air does not intervene between the electronic component 5 and the heat storage body 7. Moreover, the heat of the electronic component 5 is efficiently conducted to the heat storage body 7 through the convex portion 4c.

  3A to 3C are diagrams illustrating a method for manufacturing the electronic device 1. First, as shown in FIG. 3A, the solid state heat storage body 7 is formed with a hollow recess 4d formed inside the container 4 in a state where the main body 4a and the ceiling 4b of the container 4 are combined (FIG. 1 and the like). The volume is larger than the removed volume, and is formed in substantially the same shape as the cavity. That is, the heat storage body 7 is not heated to be in a liquid state, but can be accommodated inside the container 4 in the solid state and can be engaged with the uneven portions 4d and 4c of the ceiling portion 4b of the container 4 on the upper surface. It shape | molds in the shape which has the parts 7c and 7d. And the heat storage body 7 is inserted from the lower surface side through the opening 4e of the main body 4a of the container 4, and is fitted inside the main body 4a as shown in FIG. 3B. By cutting the heat storage body 7, the shape of the heat storage body 7 can be matched with the concave and convex portions 4 d and 4 c of the container 4. In addition, by using a mold suitable for the uneven portions 4d and 4c of the container 4, the liquid heat storage body 7 is poured into the mold and solidified, so that the heat storage body 7 having a shape suitable for the uneven portions 4d and 4c is previously obtained. You may make it.

  Next, the lower surface of the ceiling part 4b of the container 4 is brought close to and opposed to the opening 4e of the main body part 4a, and the uneven parts 4d and 4c of the ceiling part 4b and the uneven part 7c of the heat storage body 7 as shown in FIG. 7d is engaged, the end of the ceiling 4b is placed on the edge of the opening 4e, the opening 4e is closed with the ceiling 4b, and the container 4 is covered. Next, the end of the ceiling part 4 b is fixed on the edge of the opening 4 e with screws 8, the ceiling part 4 b is attached to the main body part 4 a, and the heat storage body 7 is enclosed in the container 4. Then, as shown in FIGS. 1 and 2, the ceiling 4b of the container 4 is attached to the lower surface of the electronic component 5 via the metal substrate 3 so as to reduce the air gap, and directly above the convex portion 4c. The electronic component 5 is disposed on the surface. When the heat storage body 7 in the container 4 is heated and melted (phase change from solid to liquid), the volume of the heat storage body 7 expands. As the heat storage body 7 melts and expands, the surface other than the surface facing the gap 6 of the heat storage body 7 as shown in FIG. 1 is the inner surface of the main body portion 4a of the container 4 and the tip of the convex portion 4c of the ceiling portion 4b. Adhere to the nearby surface so that there is less air gap.

  In the manufacturing process of the electronic device 1, the heat storage body 7 in the container 4 may be heated and melted together with the container 4 so as to be in close contact with the inner surface of the container 4. If it does in this way, even if the electronic device 1 shakes at the time of the shipment after manufacture of the electronic device 1, the time of transportation, etc., the shading of the heat storage body 7 in the container 4 can be prevented. Further, in the manufacturing process of the electronic device 1, the heat storage body 7 in the container 4 is not heated and remains in a solid state, and the electronic component 5 is operated by heat generated when the electronic device 1 is used by the user. The heat storage body 7 in the container 4 may be heated and melted so as to be in close contact with the inner surface of the container 4. If it does in this way, deterioration of the heat storage body 7 and the container 4 can be prevented, and lifetime improvement can be achieved.

  4A to 4D are diagrams for explaining another manufacturing method of the electronic device 1. First, as shown in FIG. 4A, the solid state heat storage body 7 is larger than the volume excluding the hollow recess 4d formed inside the container 4 in a state where the main body 4a and the ceiling 4b of the container 4 are combined. It is formed into a volume and substantially the same shape as the opening 4 e of the container 4. And the heat storage body 7 is inserted from the opening 4e of the main-body part 4a of the container 4 from the lower surface side, and is fitted inside the main-body part 4a as shown in FIG. 4B.

  Next, the lower surface of the ceiling portion 4b of the container 4 is brought close to and opposed to the opening 4e of the main body portion 4a, and the ceiling portion 4b is placed on the heat storage body 7 as shown in FIG. 4C. At this time, the front end surface of the convex portion 4c of the ceiling portion 4b and the upper surface of the heat storage body 7 are in contact with each other, and the end portion of the ceiling portion 4b and the edge of the opening 4e of the main body portion 4a are separated from each other. Next, as shown in FIG. 4D, the ceiling portion 4b is pressed against the heat storage body 7 to be indented, and the end of the ceiling portion 4b is brought into contact with the edge of the opening 4e while the heat storage body 7 is deformed. The opening 4e is closed with the part 4b, and the container 4 is covered. Next, the end of the ceiling part 4 b is fixed on the edge of the opening 4 e with screws 8, the ceiling part 4 b is attached to the main body part 4 a, and the heat storage body 7 is enclosed in the container 4. Then, as shown in FIGS. 1 and 2, the ceiling 4b of the container 4 is attached to the lower surface of the electronic component 5 via the metal substrate 3 so as to reduce the air gap, and directly above the convex portion 4c. The electronic component 5 is disposed on the surface. When the heat storage body 7 in the container 4 is heated and melted, the volume of the heat storage body 7 increases, and the surface other than the surface facing the gap 6 of the heat storage body 7 as shown in FIG. It closely adheres to the inner surface of 4a and the surface near the tip of the convex portion 4c of the ceiling portion 4b so that the air gap is reduced.

  When the electronic component 5 operates and generates heat after manufacturing the electronic device 1 described above, the generated heat is transmitted to the heat storage body 7 via the metal substrate 3 and the convex portion 4c of the ceiling portion 4b of the container 4, and the heat storage body 7 is Thaw. At this time, since the heat storage body 7 absorbs heat from the electronic component 5 and stores the heat, the electronic component 5 is prevented from becoming a high temperature that is equal to or higher than the operation upper limit temperature.

  If it carries out as mentioned above, when the thermal storage body 7 enclosed in the container 4 will melt | dissolve, the clearance 6d of the air will be formed in the recessed part 4d of the ceiling part 4b of the container 4, and it exists between the container 4 and the thermal storage body 7 The air that has been generated or the air that has been exposed from the heat storage body 7 due to the repeated phase change between the solid and liquid of the heat storage body 7 in the container 4 is guided to the gap 6 and accumulates in the recess 4d. The vicinity of the tip of the convex portion 4c of 4b and the heat storage body 7 can be brought into close contact with each other so as to reduce the air gap. For this reason, when the electronic component 5 operates and generates heat, the heat from the electronic component 5 is efficiently released to the heat storage body 7 via the convex portion 4c of the ceiling portion 4b of the container 4, and the electronic component 5 is heated to a high temperature. It becomes possible to suppress becoming.

  In addition, since the concave portion 4d and the gap 6 serving as a place for accumulating air are provided at a position in the container 4 directly below the electronic component 5, it is necessary to heat the heat storage body 7 into a liquid state and then pour it gently into the container 4. However, it is sufficient to simply fit the heat storage body 7 in the container 4 in a solid state, and it is possible to reduce labor and time required in the manufacturing process of the electronic device 1. In particular, as shown in FIG. 3A and the like, when the solid state heat accumulator 7 is formed in a volume larger than the volume excluding the concave portion 4d of the cavity of the container 4 and substantially the same shape as the cavity, the heat accumulator 7 is fitted in the main body 4a of the container 4, and then the lid is easily placed on the container 4 simply by placing the ceiling 4b on the edge of the opening 4e and fixing the ceiling 4b to the main body 4a. It is possible to reduce labor and time for the process. 4A or the like, when the solid state heat storage body 7 is formed in a volume larger than the volume excluding the hollow recess 4d of the container 4 and substantially the same shape as the opening 4e of the main body 4a. Makes it possible to reduce the labor and time required for the molding process of the heat storage element 7.

  Moreover, the contact area of the convex part 4c and the thermal storage body 7 becomes large by making the volume of the clearance gap 6 of the recessed part 4d of the ceiling part 4b of the container 4 smaller than the volume of the convex part 4c. For this reason, it becomes possible to more efficiently prevent the heat generated from the electronic component 5 to escape to the heat storage body 7 and to prevent the electronic component 5 from reaching a high temperature.

  Further, by attaching the electronic component 5 in the region directly above the convex portion 4 c of the ceiling portion 4 b of the container 4, only the metal substrate 3 and the convex portion 4 c exist between the heat storage body 7 and the electronic component 5. As a result, there are almost no air gaps. That is, the air gap between the electronic component 5 and the heat storage body 7 can be extremely reduced. For this reason, it becomes possible to more efficiently transmit the heat generated from the electronic component 5 from the entire lower surface of the electronic component 5 to the entire convex portion 4c and escape to the heat storage body 7, thereby suppressing the electronic component 5 from becoming high temperature. .

  Furthermore, since the container 4, the metal substrate 3, and the case 2 have thermal conductivity and heat dissipation, after the heat generated from the electronic component 5 is stored in the heat storage body 7, the container 4, the metal substrate 3, And it can dissipate outside from case 2 and can prevent that the thermal storage body 7 melt | dissolves all. For this reason, it becomes possible to continue suppressing that the thermal storage body 7 and the electronic component 5 become high temperature.

  The present invention can adopt various forms other than the embodiment described above. For example, in the above embodiment, the example in which the ceiling portion 4b of the container 4 is also used as a lid has been described. However, the present invention is not limited to this, and other than this, for example, a bottom portion other than the ceiling portion 4b of the container 4 Alternatively, the side portion may be used as a lid. FIG. 5 is a cross-sectional view of an electronic apparatus 1 according to another embodiment of the present invention. In FIG. 5, for convenience, the same reference numerals are given to the same and corresponding parts as those in FIGS. 1 to 4D. In the electronic device 1 of FIG. 5, the ceiling 4b of the container 4 is integrated with the main body 4a, and the main body 4a and the separate bottom 4f are used as a lid. When manufacturing the electronic apparatus 1, the solid state heat storage body 7 formed as shown in FIG. 3A or 4A is inserted from the upper surface side through the opening 4g below the main body portion 4a of the container 4, It fits inside the part 4a. Next, the bottom 4f is brought into contact with the edge of the opening 4g, the opening 4g is closed with the bottom 4f, and the container 4 is covered. Alternatively, the bottom portion 4f is pressed against the heat storage body 7, and the heat storage body 7 is sunk into the ceiling portion 4b and deformed, the end of the bottom portion 4f is brought into contact with the edge of the opening 4g, and the opening 4g is formed at the bottom portion 4f. The container 4 is closed and closed. Next, the bottom part 4 f is fixed to the edge of the opening 4 g of the main body part 4 a with a screw or the like, and the heat storage body 7 is enclosed in the container 4. Then, as shown in FIG. 5, the ceiling 4b of the container 4 is attached to the lower surface of the electronic component 5 via the metal substrate 3 so that the air gap is reduced, and the electronic component 5 is directly above the convex portion 4c. Place. When the heat storage body 7 in the container 4 is heated and melted, the volume of the heat storage body 7 increases, and the surface other than the surface facing the gap 6 of the heat storage body 7 as shown in FIG. 4a is in close contact with the inner surface of the side portion of 4a, the surface near the tip of the convex portion 4c of the ceiling portion 4b, and the inner surface of the bottom portion 4f so as to reduce the air gap.

  Moreover, although the example which provided the convex part 4c by which the front-end | tip became the horizontal surface was given to the ceiling part 4b of the container 4 in the above embodiment, this invention is not limited only to this, For example, FIG. As shown in FIG. 6, a convex portion 4h that is inclined from the tip to the bottom of the concave portion 4j may be provided at the center of the ceiling portion 4b. In FIG. 6, for convenience, the same parts as those in FIGS. 1 to 5 and corresponding parts are denoted by the same reference numerals. The shape of the convex portion 4h may be, for example, a triangular prism shape as shown in FIG. 7, a conical shape as shown in FIG. 8, or a polygonal pyramid other than these. In this way, the cross-sectional shape of the air gap 9 formed in the recess 4j and the recess 4j is a triangle or a trapezoid. When the heat accumulator 7 is melted, the air present in the container 4 rises along the inclined side surface of the convex portion 4h without accumulating below the tip of the convex portion 4h, so that the concave portion 4j Therefore, the vicinity of the tip of the convex portion 4h and the heat storage body 7 can be brought into close contact with each other without any air gap.

  Moreover, although the example which provided the uneven | corrugated | grooved part 4d, 4j, 4c, 4h one each in the ceiling part 4b of the container 4 was given in the above embodiment, this invention is not restricted only to this, Other than this In addition, for example, a plurality of concavo-convex portions may be provided on the ceiling of the container, or a plurality of concave portions may be provided.

  Furthermore, in the above embodiment, the example in which the ceiling portion 4b of the container 4 is attached to the lower surface of the electronic component 5 via the metal substrate 3, but the present invention is not limited to this, and besides this, For example, you may make it attach the ceiling part of a container to the lower surface of an electronic component directly or through the adhesive sheet, grease, etc. which have heat conductivity. Moreover, you may provide a vent on the side surface of a container for the purpose of suppressing the raise of the container internal pressure by the volume expansion of a thermal storage body. At this time, it is preferable that the position where the vent hole is provided is higher than the upper surface of the heat storage body when the heat storage body in the container is melted and its volume is expanded. In addition, a filter that does not allow liquid to pass through the vent hole may be provided so that the container is inclined and the heat accumulator does not flow out of the vent hole when the heat accumulator is melted. As a specific example of the filter, a sintered metal filter can be used. In the sintered metal filter, the fluororesin film covers the entire periphery of the metal powder. Since this coating has little influence on the size of the air holes of the filter, it hardly reduces the filtration performance. Moreover, most liquids can be repelled by the difference in surface tension.

It is sectional drawing of the electronic device which concerns on embodiment of this invention. It is AA sectional drawing of FIG. It is a figure explaining the manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the other manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the other manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the other manufacturing method of the electronic device which concerns on embodiment of this invention. It is a figure explaining the other manufacturing method of the electronic device which concerns on embodiment of this invention. It is sectional drawing of the electronic device which concerns on other embodiment of this invention. It is sectional drawing of the electronic device which concerns on other embodiment of this invention. It is a figure which shows the principal part of the electronic device which concerns on other embodiment of this invention. It is a figure which shows the principal part of the electronic device which concerns on other embodiment of this invention.

Explanation of symbols

1 Electronic equipment 4 Container 4b Ceiling (lid)
4c, 4h Convex part 4d, 4j Concave part 4e, 4g Opening 4f Bottom part (lid)
5 Electronic parts 6, 9 Clearance with air in recess 7 Heat storage

Claims (2)

An uneven part is provided on the inside of the container on the ceiling part having thermal conductivity of the container,
The solid state heat accumulator is molded in a volume larger than the volume excluding the concave portion inside the container and in the same shape as the inside of the container,
The heat storage body is fitted inside from the opening of the container,
Cover the container so as to close the opening, contain the heat storage body in the container,
A method for manufacturing an electronic device, comprising: attaching a ceiling portion of the container to a lower surface of an electronic component. An uneven part is provided on the inside of the container on the ceiling part having thermal conductivity of the container,
The solid state heat accumulator is molded in a volume larger than the volume excluding the concave portion inside the container and in the same shape as the opening of the container,
The heat storage body is fitted inside from the opening of the container,
While pressing the lid against the heat storage body and deforming the heat storage body, the lid is brought into contact with the edge of the opening,
Fixing the lid to the edge of the opening, enclosing the heat storage body in a container;
A method for manufacturing an electronic device, comprising: attaching a ceiling portion of the container to a lower surface of an electronic component.

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