JP4866779B2 - Conductive connection structure and manufacturing method thereof - Google Patents

Description

 The present invention relates to a conductive connection structure in which wiring of a flexible substrate or wiring of a rigid substrate is electrically connected to each other and a manufacturing method thereof, and more specifically, an anisotropic conductive adhesive film (ACF) or a non-conductive film ( The present invention relates to a conductive connection structure in which wiring of a flexible substrate and wiring of a rigid substrate are electrically connected to each other via a film-like adhesive such as NCF) and a manufacturing method thereof.

Conventionally, wiring of a flexible substrate or a rigid substrate is connected to each other through a film-like adhesive such as an anisotropic conductive adhesive film (Anisotropic Conductive Film, ACF) or a non-conductive film (NCF). As a conductive connection structure formed by electrical connection, for example, a structure as shown in FIG.
In the conductive connection structure 100 of this example, a conductive portion 102 is provided on one surface 101a, a first base material 101 having a conductive substrate 103 attached to the other surface 101b, and a conductive portion 105 is provided on one surface 104a. Further, the second substrate 104 and a chip-on-film (COF) 107 made of an IC chip 106 provided on the other surface 104b of the second substrate 104 are bonded via an adhesive layer 108 made of a film adhesive. It will be. In addition, the conductive portion 102 of the first base material 101 and the conductive portion 105 of the second base material 104 are abutted and electrically connected (see Patent Document 1).

In order to manufacture such a conductive connection structure 100, first, polymer-type conductive ink is printed in a predetermined shape on one surface 101a of the first base material 101 by screen printing or the like to provide a conductive portion 102 (FIG. 9). 10).
Next, the conductive substrate 103 is attached to the other surface 101b of the first base material 101 through an adhesive or by fusing (see FIG. 11).
Next, the conductive portion 102 of the first base material 101 and the conductive portion 105 provided on the one surface 104a of the second base material 104 are brought into contact with each other, and the first base material 101 and the second base material are interposed via a film-like adhesive. By bonding the material 104, the conductive portion 102 and the conductive portion 105 are electrically connected (see FIG. 12), and the conductive connection structure 100 is obtained.
JP 2003-168760 A

 However, in the above-described conductive connection structure 100 and the manufacturing method thereof, an adhesive is interposed more than necessary between the conductive portion 102 of the first base material 101 and the conductive portion 105 of the second base material 104. There is a problem that the conductivity between the conductive part 102 and the conductive part 105 may not be sufficient. In addition, since the contact area between the first base material 101 and the adhesive layer 108 is small, the adhesive force is small, and there is a risk that the electrical connection between the conductive part 102 and the conductive part 105 may be insufficient. In order not to cause a problem, an even greater adhesion was required.

 The present invention has been made in view of the above circumstances, and in the connection between the conductive portions respectively provided on different base materials, the electrical conductivity is high and the adhesive force between the base materials can be increased. It is an object of the present invention to provide a possible conductive connection structure and a manufacturing method thereof.

 In the conductive connection structure of the present invention, the first base material and the second base material are bonded via an adhesive layer made of a film adhesive, and the conductive portion provided on one surface of the first base material, A conductive connection structure in which a conductive portion provided on one surface of the second base material is electrically connected, and a conductive substrate is attached to a surface opposite to the one surface of the first base material, The adhesive layer is provided from one surface of the second base material so as to penetrate the first base material in the thickness direction and over a recess formed in the conductive substrate.

 In the method for producing a conductive connection structure of the present invention, the first base material and the second base material are bonded via an adhesive layer made of a film-like adhesive, and the conductive portion provided on one surface of the first base material And a conductive connection structure manufacturing method in which a conductive portion provided on one surface of the second base material is electrically connected, the step of providing a conductive member on the entire surface of the first base material, A step of adhering a conductive substrate to a surface opposite to one surface of the base material, a through portion that penetrates the first base material in the thickness direction, while forming the conductive member in a conductive portion of a predetermined shape; and The step of forming a recess connected to the penetrating portion on the conductive substrate, and the first base material and the second base material are bonded via a film adhesive, and the first base material is electrically conductive. And a step of electrically connecting the conductive part of the second base material to the conductive part of the second base material .

 In the conductive connection structure of the present invention, the first base material and the second base material are bonded via an adhesive layer made of a film adhesive, and the conductive portion provided on one surface of the first base material, A conductive connection structure in which a conductive portion provided on one surface of the second base material is electrically connected, and a conductive substrate is attached to a surface opposite to the one surface of the first base material, Since the adhesive layer is provided from one surface of the second base material through the first base material in the thickness direction and across the recess formed in the conductive substrate, the adhesive layer, the first base material, and The contact area with the conductive substrate is increased, and the adhesion between the first base material, the second base material, and the conductive substrate is improved. As a result, the adhesion between the conductive portion of the first base material and the conductive portion of the second base material is improved, and the conductivity between them is also improved.

  In the method for producing a conductive connection structure of the present invention, the first base material and the second base material are bonded via an adhesive layer made of a film-like adhesive, and the conductive portion provided on one surface of the first base material And a conductive connection structure manufacturing method in which a conductive portion provided on one surface of the second base material is electrically connected, the step of providing a conductive member on the entire surface of the first base material, A step of adhering a conductive substrate to a surface opposite to one surface of the base material, a through portion that penetrates the first base material in the thickness direction, while forming the conductive member in a conductive portion of a predetermined shape; and The step of forming a recess connected to the penetrating portion on the conductive substrate, and the first base material and the second base material are bonded via a film adhesive, and the first base material is electrically conductive. And at least a step of electrically connecting the conductive portion of the second base material with the film. The adhesive flows so as to fill the space formed by the second base material, the conductive portion, the penetrating portion of the first base material 11 and the concave portion of the conductive substrate, and forms an adhesive layer. Electrical connection between the conductive part of the first base material and the conductive part of the second base material is eliminated more than necessary between the conductive part of the first base material and the conductive part of the second base material (interface). Can be secured sufficiently. Therefore, the electrical conductivity between the conductive part of the first base material and the conductive part of the second base material can be improved. Moreover, at the time of adhesion | attachment of a 1st base material and a 2nd base material, a film-form adhesive removes the space formed from the 2nd base material, an electroconductive part, the penetration part of the 1st base material 11, and the recessed part of an electroconductive board | substrate. Since it flows so as to fill and forms an adhesive layer, the adhesive strength of the first base material, the second base material and the conductive substrate is improved.

The best mode of the conductive connection structure and the manufacturing method thereof of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(Conductive connection structure)
FIG. 1 is a schematic cross-sectional view showing an embodiment of the conductive connection structure of the present invention.
In the conductive connection structure 10 of this embodiment, the first base material 11 provided with the conductive portion 12 on one surface 11a and the second base material 14 provided with the conductive portion 15 on the one surface 14a are film-shaped. The conductive portion 12 and the conductive portion 15 are abutted and electrically connected to each other through an adhesive layer 18 made of an adhesive. In addition, the conductive substrate 13 is attached to the other surface 11b of the first base material 11, and the adhesive layer 18 penetrates the first base material 11 in the thickness direction from the one surface 14a of the second base material 14, and is conductive. It is provided across the recess 13 a formed in the conductive substrate 13. Further, an IC chip 16 is provided on the other surface 14 b of the second base material 14, and the second base material 14, the conductive portion 15, and the IC chip 16 form a chip-on-film (COF) 17.

The first base material 11 is provided with a through portion 11c that penetrates in the thickness direction.
The conductive substrate 13 adhered to the first base material 11 is connected to the penetrating portion 11c of the first base material 11 and has a surface 13b in contact with the first base material 11 as a base end. A recess 13a having an opening diameter equal to 11c is provided. The depth of the recess 13a is not particularly limited, but is provided so as not to penetrate the conductive substrate 13.
The adhesive layer 18 is provided so as to fill a space formed by the second base material 14, the conductive portion 15, the conductive portion 12, the through portion 11 c of the first base material 11, and the concave portion 13 a of the conductive substrate 13. Yes.

 Examples of the first base material 11 and the second base material 14 include polyamide resin base materials, polyester resin base materials such as polyethylene terephthalate (PET), polyolefin resin base materials, polyimide resin base materials, and ethylene-vinyl alcohol. Polymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polychlorinated biphenyl resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene Examples thereof include plastic substrates such as styrene copolymer resin substrates and polyethersulfone resin substrates.

As a material forming the conductive portions 12 and 15, polymer type conductive ink, conductive foil, metal plating, or the like is used.
Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
Examples of the conductive foil include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Examples of the metal plating include copper plating, silver plating, gold plating, and platinum plating.

The conductive substrate 13 is not particularly limited, and examples thereof include a wiring substrate in which a metal wiring or a wiring made of polymer-type conductive ink is provided on one surface of an insulating base, an ITO substrate, and the like.
The IC chip 16 is not particularly limited.

 As the film-like adhesive forming the adhesive layer 18, an anisotropic conductive adhesive film (ACF), a non-conductive film (NCF), or the like is used.

 In the conductive connection structure 10 of this embodiment, the adhesive layer 18 penetrates the through-hole 11 c formed in the first base material 11 from the one surface 14 a of the second base material 14, and the recess 13 a formed in the conductive substrate 13. Since the contact area between the adhesive layer 18 and the first base material 11 and the conductive substrate 13 is increased, the adhesive strength of the first base material 11, the second base material 14, and the conductive substrate 13 is increased. Will improve. As a result, the adhesion between the conductive portion 12 and the conductive portion 15 is improved, and the conductivity between them is also improved.

(Manufacturing method of conductive connection structure)
Next, with reference to FIGS. 2-7, the manufacturing method of the conductive connection structure of this embodiment is demonstrated.
First, a conductive member 12A made of polymer-type conductive ink, conductive foil, metal plating, or the like is provided on the entire surface 11a of the first substrate 11 (see FIGS. 2 and 3).
Next, the conductive substrate 13 is adhered to the other surface 11b of the first base material 11 through an adhesive or by fusing (see FIG. 4).

Next, the conductive member 12A is formed on the conductive portion 12 having a predetermined shape by laser or etching, and the penetrating portion 11c that penetrates the first base material 11 in the thickness direction and the conductive substrate 13 are connected to the penetrating portion 11c. A recess 13a is formed (see FIG. 5).
Next, the first substrate 11 and the second chip-on-film (COF) 17 that is separately produced are passed through a film-like adhesive such as an anisotropic conductive adhesive film (ACF) or a non-conductive film (NCF). While adhering the base material 14, the conductive part 12 of the first base material 11 and the conductive part 15 of the second base material 14 are electrically connected to obtain the conductive connection structure 10 (see FIGS. 6 and 7).
In addition, the formation method of the electroconductive part 15 of the 2nd base material 14 may be the same as that of the electroconductive part 12, or the method by screen printing etc. of a polymer type conductive ink may be sufficient.

 In the manufacturing method of the conductive connection structure of this embodiment, after providing the conductive member 12A on the entire surface 11a of the first base material 11, the conductive member 12A is formed on the conductive portion 12 having a predetermined shape, and the first base material 11 11 through the thickness direction, and a recess 13a connected to the through-hole portion 11c in the conductive substrate 13, and the first base material 11 and the second base material 14 through a film adhesive. Therefore, the film-like adhesive forms a space formed by the second base material 14, the conductive portion 15, the conductive portion 12, the through portion 11 c of the first base material 11 and the concave portion 13 a of the conductive substrate 13. Since the adhesive layer 18 is formed by flowing so as to be filled, the adhesive does not exist more than necessary between the conductive portion 12 and the conductive portion 15 (interface). Secure enough connections That. Therefore, the electrical conductivity between the conductive part 12 and the conductive part 15 can be improved. In addition, when the first base material 11 and the second base material 14 are bonded, the film adhesive includes the second base material 14, the conductive part 15, the conductive part 12, the through part 11 c of the first base material 11, and the conductive property. Since it flows so that the space formed from the recessed part 13a of the board | substrate 13 may be filled and the contact bonding layer 18 is formed, the adhesive force of the 1st base material 11, the 2nd base material 14, and the electroconductive board | substrate 13 improves.

It is a schematic sectional drawing which shows one Embodiment of the conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the electrically conductive connection structure of this invention. It is a schematic sectional drawing which shows an example of the conventional conductive connection structure. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional conductive connection structure. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional conductive connection structure. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional conductive connection structure. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional conductive connection structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Conductive connection structure, 11 ... 1st base material, 12 ... Conductive part, 13 ... Conductive substrate, 14 ... 2nd base material, 15 ... Conductive part, 16 * ..IC chip, 17 ... chip on film, 18 ... adhesive layer.

Claims (2)

The first base material and the second base material are bonded via an adhesive layer made of a film adhesive, and the conductive portion provided on one surface of the first base material and provided on the one surface of the second base material A conductive connection structure in which the conductive part is electrically connected,
A conductive substrate is attached to a surface opposite to one surface of the first base material, and the adhesive layer penetrates the first base material in a thickness direction from one surface of the second base material, and the conductive substrate A conductive connection structure characterized in that the conductive connection structure is provided across a recess formed in the substrate. The first base material and the second base material are bonded via an adhesive layer made of a film adhesive, and the conductive portion provided on one surface of the first base material and provided on the one surface of the second base material A method for manufacturing a conductive connection structure in which a conductive part is electrically connected,
A step of providing a conductive member on the entire surface of the first base material, a step of attaching a conductive substrate to a surface opposite to the one surface of the base material, and forming the conductive member on a conductive portion of a predetermined shape, Forming a penetrating portion penetrating the first base material in the thickness direction, a step of forming a concave portion connected to the penetrating portion in the conductive substrate, and forming the first base material and the second base material into a film shape. And a step of electrically connecting the conductive part of the first base material and the conductive part of the second base material. Production method.

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