JP4871897B2 - Indirect lighting - Google Patents

Description

  The present invention relates to an indirect lighting fixture having a plurality of surface mount packages. The present invention relates to an indirect luminaire that allows a large current to flow through the light emitting diode and is easy to attach to a wall or ceiling. Further, the present invention can prevent damage to the light emitting layer in the light emitting diode due to vibration or heat by connecting the gold wire by soldering to a metal member made of a metal plate member instead of connecting by wire bonding. The present invention relates to an indirect lighting fixture composed of a plurality of light emitting diodes. Furthermore, the present invention relates to an indirect lighting device that can efficiently irradiate light from the light emitting portion because the upper surface of the light emitting diode is not covered with a sealing material.

For example, in a lighting fixture provided with a plurality of light emitting diodes in Japanese Patent Application Laid-Open No. 2008-21615, a plurality of light emitting diodes are mounted in a cylindrical structure in a spherical housing, and the spherical housing is movably supported by a holding cup. Yes. Since the spherical housing to which the light emitting diode is attached is supported by the upper edge of the holding cup, the angle of the cylindrical structure to which the light emitting diode is attached can be changed. The lighting fixture having the above-described structure can easily change the irradiation direction of light from the light emitting diode to a desired direction.
JP 2008-21615 A

  Although the lighting fixture described in the said patent publication can change the irradiation direction of light, the strong thin light of each light emitting diode was directly noticed, and the whole could not be softly illuminated. In particular, in recent years, light-emitting diodes can increase the amount of current that flows and have high luminance. In addition, a lighting fixture composed of a plurality of light emitting diodes is inconvenient for the entire lighting because each of the light emitting diodes is emphasized.

  In order to solve the above-described problems, the present invention changes the whole light into a soft light as well as a light emitted from a single light source, even though it is composed of a plurality of light emitting diodes. It aims at providing the indirect lighting fixture which can do. An object of the present invention is to provide an indirect lighting apparatus that is excellent in mass productivity, withstands a large current and thermal stress, is maintained at a high strength, is easy to manufacture, and is easy to attach and detach.

(First invention)
The indirect lighting fixture according to the first aspect of the present invention attaches a plurality of surface-mounted LED packages that emit light toward the wall or ceiling with a predetermined interval between the plurality of surface-mounted LED packages and the wall or ceiling. A spacer having a flange, a power supply plug provided on the spacer, and an opaque or translucent decorative plate attached to the opposite surface of the flange to which the surface mount LED package is attached. It is characterized by being.

(Second invention)
In the indirect lighting fixture of the second invention, the plurality of surface-mounted LED packages of the first invention are attached to a flange of the spacer via a ring-shaped wiring board.

(Third invention)
In the indirect lighting fixture of the third invention, the power supply plug of the first invention or the second invention can be fixed to the jack provided in the wall or the ceiling with a single touch.

(Fourth invention)
In the indirect lighting device of the fourth invention, the surface-mount type LED packages of the first to third inventions are provided with a phosphor film and emit white light having a color temperature of 2600K to 7100K.

(Fifth invention)
In the indirect lighting fixture of the fifth invention, the flange provided in the spacer of the first to fourth inventions is inclined with respect to the wall or the ceiling.

  According to the indirect lighting fixture of the present invention, the entire light emitted from the plurality of light emitting diodes can be changed to soft light as well as light emitted from one light source.

  According to the indirect lighting fixture of the present invention, a large current can be passed through each light emitting diode, and the attachment to the wall is facilitated by the power supply plug and the wall jack of the indirect lighting fixture.

  According to the indirect lighting apparatus of the present invention, since wire bonding or the like is not used for connection between the electrode of the light emitting diode and the metal substrate, etc., not only is the reliability high for a long period of time, but the light emitting diode or the like is sealed with a filler. Since it is not necessary to stop, it is possible to obtain a lighting apparatus that is inexpensive and excellent in mass production.

  According to the indirect lighting apparatus of the present invention, the upper partial electrode of the upper and lower electrode type light emitting diode connected to one metal substrate and the other metal substrate are connected by, for example, a plate-shaped or ribbon-shaped metal member. In addition to allowing a large current to flow, it is excellent in heat dissipation and can be mitigated even if thermal stress occurs. In particular, according to the present invention, since each connection portion is joined by soldering without using wire bonding, an indirect lighting device including a plurality of light emitting diodes is provided without vibration applied to the joining portion and / or the light emitting layer. Can now get.

(First invention)
The indirect lighting fixture according to the first aspect of the present invention includes at least a surface-mounted LED package, a spacer, a power supply plug, and a decorative board. The surface mount LED package includes, for example, a metal substrate or a conductive film, a light emitting diode provided between the plurality of metal substrates or the conductive film, and a phosphor layer that converts light of the light emitting diode into a desired color tone. And at least. In the surface mount LED package assembly, a plurality of surface mount LED packages are attached to a conductive film of a ring-shaped wiring board.

  The at least one light emitting diode is joined by a plate-shaped metal member having a width between the upper partial electrode and the metal substrate or conductive film, for example, a metal ribbon. Each light emitting diode is provided with a reflection frame, and a phosphor layer is provided in an opening of the reflection frame.

  In the ring-shaped wiring substrate, for example, a plurality of metal substrates or conductive films formed on an insulating substrate at intervals are formed in a ring shape in series. Further, the ring-shaped wiring board is formed of a conductive film in the same manner as described above, in which a substrate such as Al is often an insulating film. One of the metal substrate or the conductive film and one electrode of the light emitting diode, the other electrode of the light emitting diode and the metal member, and the metal member and the other of the metal substrate or the conductive film are connected by solder.

  The spacer has a predetermined interval between the surface mount LED package and a wall or ceiling, and reflects light from the surface mount LED package to the wall or ceiling to obtain a desired light distribution. Is. The spacer is, for example, an insulating member having a truncated cone shape, and the ring-shaped wiring board is attached to a base portion. The spacer has a power supply plug attached to the top of the truncated cone. The decorative board is slightly larger than the size of the ring-shaped wiring board, and after irradiating the light from the surface-mounted LED package on the wall or ceiling side, the reflective board reflects the desired place from the periphery of the decorative board. Irradiate. The shape of the decorative board can be arbitrarily determined in consideration of the design with the surroundings. Moreover, the said decorative board is transparent or semi-transparent, and it can be made to harmonize with the circumference | surroundings by deform | transforming arbitrarily in a shape.

(Second invention)
In the indirect lighting fixture according to the second aspect of the invention, the surface-mounted LED package according to the first aspect of the invention is fitted to the spacer in a state where a plurality of the surface-mounted LED packages are placed on the ring-shaped wiring board. The spacer has one end closed and a flange on which the ring-shaped wiring board is placed protruding from the other end. The flange provided on the spacer is attached with a ring-shaped wiring board on which a surface mount LED package is mounted.

(Third invention)
In the indirect lighting fixture of the third invention, the power supply plug of the first invention or the second invention is provided on the top of the spacer. Moreover, the jack fitted to the power supply plug is provided inside the wall or ceiling (back side). The power plug is fixed to a jack provided inside (back side) of the wall or ceiling with one touch, and can supply power to the light emitting diode.

(Fourth invention)
In the lighting fixture of the fourth invention, a phosphor film is provided at the opening of the reflection frame in the surface-mounted LED package. The phosphor film used emits white light having a color temperature of 2600K to 7100K. However, the phosphor film having a wider color temperature can also be used. In the surface mount LED package, the light emitting diode may be a gallium nitride based upper / lower electrode type light emitting diode. The gallium nitride based upper / lower electrode type light emitting diode is formed, for example, from the bottom to the lower electrode, the substrate, the n-type gallium nitride based semiconductor layer, the quantum well structure type active layer, the p-type gallium nitride based semiconductor layer, and the upper partial electrode. Has been. The gallium nitride based upper / lower electrode type light emitting diode not only facilitates bonding of each electrode and metal member by soldering, but also provides good heat dissipation and high brightness even when a large current (eg, 350 mA) is applied. .

(Fifth invention)
The indirect lighting fixture of the 5th invention can change the angle of the flange provided in the spacer. The flange can be partially brightened by being inclined with respect to the wall or ceiling. For example, the indirect lighting device can make a specific place such as a foot brighter or different color than other places. In addition, the indirect lighting device can be brightened by widening or narrowing a specific place such as a foot.

  FIG. 1 (a) is an embodiment of the present invention, and is a schematic diagram showing a state in which a surface-mounted LED package is formed in a ring shape. FIG. 1 (B) illustrates a mounting state of light emitting diodes in the surface-mounted LED package. It is sectional drawing. 1 (a) and 1 (b), a surface-mounted LED package 12 has a light emitting diode 121, a metal substrate or conductive film 124, and an upper electrode of the light emitting diode 121 and a metal substrate or conductive film 124 '. The metal member 122, the metal substrate or conductive film 124 ′ bonded to the metal member 122, the reflection frame 123, and the phosphor film 15 are configured.

  The ring-shaped wiring substrate 111 is formed on a metal substrate or conductive film 112, 112 ′ on an insulating substrate or an insulating member covering the metal substrate. A plurality of surface mounted LED packages 12 are bonded to the metal substrate or conductive films 112 and 112 '. A socket 113 is provided at the end of the metal substrate or conductive film 112, 112 ′.

  The metal member 122 is made of a metal ribbon, for example. The reflection frame 123 is attached to the metal substrate 124 or the conductive film 124 ′ with a thermosetting resin adhesive. The reflection frame 123 is provided with the phosphor film 15 at the opening.

  The ring-shaped wiring substrate 111 can be deformed in consideration of the design of an ellipse, a rectangle, or a room other than the circle shown in FIG. In addition, the metal substrate or the conductive films 112 and 112 ′ can be formed on a ceramic substrate or a synthetic resin substrate. For example, the metal substrate 112 and the lower electrode of the light emitting diode 121, the upper partial electrode of the light emitting diode and the metal member 122, and the metal member 122 and the other metal substrate 112 ′ are soldered without using wire bonding or the like. It is joined by. Since the joining of each part is solder, not only can a large current flow without damaging the joining part of the light emitting diode 121 and the light emitting part, but it is not necessary to fill with an insulating member.

  The light emitting diode 121 is, for example, a gallium nitride upper / lower electrode type light emitting diode. The reflection frame 123 is joined to the metal substrates 124, 124 'or the conductive film by an adhesive of silicone resin, epoxy resin, polyimide resin, glass, or brazing material. The surface mount type LED packages 12 are, for example, six in the light emission FIG. 1 (a), and are connected in series via the metal substrate or the conductive films 112 and 112 ', but the number is arbitrarily increased or decreased. it can. The reflection frame 123 may be a member made of, for example, alumina, a composite ceramic of alumina and glass, or the like.

  The metal member 122 that connects the upper partial electrode of the light emitting diode 121 or the conductive metal substrate or conductive film 124 'is, for example, a gold ribbon having a thickness of 25 μm and a width of 150 μm. Can be increased or decreased around the center. Since the gold ribbon is made of strip-shaped gold, heat conduction is good and a large current can flow. Further, since the gold ribbon reflects light well, it can efficiently radiate light to the outside without making a shadow.

  The light emitting diode 121 is, for example, a gallium nitride based upper / lower electrode type light emitting diode, and has an active layer between a p-type gallium nitride semiconductor layer and an n-type gallium nitride semiconductor layer. The gallium nitride gallium nitride upper / lower electrode type light emitting diode has an upper surface light emitting portion and a partial electrode on the upper side of the one semiconductor layer, and a lower electrode joined to the package electrode on the lowermost layer of the other semiconductor layer. . The upper surface of the electrode in the gallium nitride based upper / lower electrode type light emitting diode of the present invention has fine irregularities, and high luminance can be obtained by flowing a large current.

  The light emitting diode assembly 12 is, for example, a square of 10 mm × 10 mm, and the width of the slit between the metal substrates 112 and 112 ′ is 0.5 mm. The gallium nitride upper / lower electrode type light emitting diode has a size of 1.0 mm × 1.0 mm and a thickness of 0.5 mm.

  FIG. 2 is a schematic cross-sectional view for explaining an indirect lighting apparatus having a surface-mounted LED package attached thereto according to an embodiment of the present invention. In FIG. 2, the indirect lighting fixture 20 includes a ring-shaped wiring substrate 111, a metal substrate or conductive films 112 and 112 ′, a surface-mounted LED package 11 composed of a plurality of light emitting diodes, a spacer 21, a power supply plug 22, It is comprised at least from the decorative board 23. The spacer 21 is formed by integrally molding an Al member into a truncated conical shape, and has one end closed and a flange 211 on which the ring-shaped wiring board 111 is placed protrudes at the other end. The surface mount LED package 11 is placed on a flange 211 provided on the spacer 21.

  The spacer 21 is provided with a power plug 22 at the top of the truncated cone. The power supply plug 22 supplies power to the light emitting diode 121 in the surface mount LED package 11 through a metal substrate or conductive films 112 and 112 ′, a socket 113, and a lead wire 212. The decorative plate 23 is made of a transparent or translucent member provided on the flange 211 of the spacer 21 on the side opposite to the surface-mounted LED package 11. The decorative plate 23 is provided so that light from the light emitting diode 121 is reflected by the wall or ceiling 32 and is irradiated in a desired direction. Since the plurality of light emitting diodes 121 are reflected by the wall or ceiling 32, the surroundings can be illuminated like a single light source instead of a plurality of lights.

  FIG. 3 is a schematic cross-sectional view for explaining a state where the indirect lighting apparatus is attached to a wall or a ceiling according to the embodiment of the present invention. In FIG. 3, a wall or ceiling 32 is provided with a jack 31 for connecting the power plug 22 in advance. In the indirect lighting fixture 20, the power plug 22 is fitted into the jack 31 provided inside (or the back side) of the wall or ceiling 32 with one touch, and power is supplied to the light emitting diode 121. Light from the light emitting diode 121 is reflected by the wall or ceiling 32 and is emitted as soft light from the periphery of the decorative plate 23. That is, the indirect lighting fixture looks like a single light source even though it is composed of a plurality of light emitting diodes.

  The flange 211 is parallel to the wall or ceiling 32 in FIG. 3, but can be inclined with one side narrower or wider. The inclined flange can make a part of the room brighter or darker, for example, by attaching the decorative plate 23. Moreover, the decorative board 23 can increase the variation of indirect illumination by combining with the said inclination and / or the designed shape.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. Although this embodiment is described with a pair of insulated metal substrates or package electrodes, a plurality of gallium nitride upper and lower electrode type light emitting diodes and package electrodes are connected in series and / or in parallel. It goes without saying that it can be done. As the phosphor layer and the gallium nitride upper / lower electrode type light emitting diode used in the present invention, known or well-known ones can be used.

(A) is an example of the present invention, and is a schematic diagram showing a state in which a surface-mounted LED package is formed in a ring shape. (B) is a cross-sectional view for explaining a mounting state of a light-emitting diode in the surface-mounted LED package. It is. Example 1 In the Example of this invention, it is a schematic sectional drawing for demonstrating the indirect lighting fixture which attached the surface mount type LED package. In the Example of this invention, it is a schematic sectional drawing for demonstrating the state which attached the indirect lighting fixture to the wall or the ceiling.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Surface mount type LED package assembly 111 ... Ring-shaped wiring board 112, 112 '... Conductive film 113 ... Socket 12 ... Surface mount type LED package 121 ... Light emitting diode 122- ..Metal member 123 ... Reflective frame 124, 124 '... Metal substrate or conductive film 20 ... Lighting fixture 21 ... Spacer 211 ... Flange 212 ... Lead wire 22 ... Plug 23 ... Decorative plate 31 ... Jack 32 ... Wall or ceiling

Claims (5)

A plurality of surface mount LED packages;
A spacer having a flange for attaching the plurality of surface-mounted LED packages that emit light toward the wall or the ceiling with a predetermined interval between the wall or the ceiling;
A power supply plug provided in the spacer;
An opaque or translucent decorative board attached to the opposite surface of the flange to which the surface mount LED package is attached;
An indirect luminaire characterized by comprising at least.   The indirect lighting device according to claim 1, wherein the plurality of surface-mount LED packages are attached to a flange of the spacer via a ring-shaped wiring board.   The indirect lighting apparatus according to claim 1, wherein the power supply plug can be fixed with a single touch to a jack provided in a wall or a ceiling.   The indirect illumination according to any one of claims 1 to 3, wherein the surface-mount LED package is provided with a phosphor film and emits white light having a color temperature of 2600K to 7100K. Instruments.   The indirect lighting device according to any one of claims 1 to 4, wherein a flange provided on the spacer is inclined with respect to a wall or a ceiling.

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