JP4872091B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging device using a solid-state imaging device such as a CCD (Charge Coupled Device) imager, and more particularly to an imaging device provided with a heat dissipation structure that suppresses a temperature rise of the solid-state imaging device.

  An imaging apparatus such as a digital still camera or a digital video camera is equipped with a solid-state imaging device such as a CCD imager (hereinafter abbreviated as a CCD) that converts light into an electrical signal. This solid-state image sensor rises in temperature due to its own heat generation and ambient heat, and dark current increases at that time. Since the dark current of the solid-state imaging device generates noise in the electric signal obtained by photoelectric conversion, the image quality of the picked-up image is degraded due to the increase of the dark current. In view of this, an imaging apparatus having a heat dissipation structure that suppresses the temperature rise of the solid-state imaging element has been proposed.

  As this type of conventional imaging apparatus, there is an apparatus described in Patent Document 1, for example. Japanese Patent Application Laid-Open No. 2004-133867 describes an image pickup apparatus having a support structure for an image pickup element. The imaging device described in Patent Literature 1 is electrically connected to an optical member that allows imaging light to pass through, a flexible printed board that faces the optical member, and a connection pattern for the flexible printed board, and an imaging surface. Includes an imaging element facing the optical member, and a metal plate support member fixed to the back surface of the imaging surface of the imaging element. The support member is fixed to the main body structure of the imaging device.

  According to the imaging apparatus described in Patent Document 1 having such a configuration, the support member has a role of a heat radiating plate that dissipates heat generated in the imaging element, so that an increase in temperature of the imaging element can be suppressed. Expected to be effective.

  Another example of the conventional imaging apparatus of this type is that described in Patent Document 2, for example. Patent Document 2 describes a heat dissipation structure for a digital camera. The heat dissipation structure of a digital camera described in Patent Document 2 includes an optical system holding frame that houses and holds an imaging optical system, and an imaging element that is positioned on the imaging surface of the imaging optical system and fixed to the optical system holding frame And an exterior that surrounds the optical system holding frame.

  A through hole is provided in the exterior of the heat dissipation structure of the digital camera described in Patent Document 2, and an external heat radiating member made of a material having high thermal conductivity is attached to the through hole. And the metal heat sink with one end part couple | bonded with the image pick-up element is contacting the heat conductive member via the heat conductive member.

  According to the heat dissipation structure of the digital camera described in Patent Document 2 having such a configuration, the heat generated from the image pickup device is transmitted in the order of the heat dissipation plate, the heat conduction member, and the appearance heat dissipation member to be dissipated to the outside of the camera. The

JP 2006-332894 A JP 2005-328202 A

  However, in either case of the imaging device described in Patent Literature 1 and the heat dissipation structure of the digital camera described in Patent Literature 2, the imaging device and other heat source circuit boards, liquid crystal monitor devices, etc. It was arranged in an integral space inside the device body. For this reason, there is a problem that heat is accumulated in the device due to heat generation of the circuit board, the liquid crystal monitor device, etc., and the imaging element is heated.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an imaging device that can suppress the temperature rise of a solid-state imaging device without being affected by heat generated from other components in the device in consideration of the above-described problems. There is.

An imaging apparatus according to the present invention includes a solid-state imaging device that receives light from a subject and converts the light into an electrical signal, a circuit board on which electronic components that process an electrical signal supplied from the solid-state imaging device are mounted, and a solid-state imaging device And an exterior case that houses the circuit board, a first heat dissipation block that partitions the internal space of the exterior case to form a first space in which the solid-state imaging device is disposed, and a predetermined gap from the first heat dissipation block. And a second heat dissipating block that forms a second space in which the circuit board is arranged by partitioning the internal space of the exterior case. The outer case, an opening for exposing the gap between the first heat sink block and the second heat sink block possess, first heat sink block and a second heat sink block, respectively radiating fins on the surface facing each other It has the most important feature.

  According to the imaging apparatus of the present invention, the internal space of the exterior case is divided into the first space part in which the solid-state imaging device is arranged and the second space part in which the circuit board is arranged, so that the solid-state imaging is performed by the heat generated from the circuit board. A good captured image can be obtained without increasing the temperature of the element.

  Hereinafter, the best mode for carrying out the imaging apparatus of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following mode.

  FIG. 1 is an external perspective view showing a first embodiment of the imaging apparatus of the present invention, and FIG. 2 is an exploded perspective view in a state where a heat radiating member is removed from the imaging apparatus shown in FIG. The imaging device 1 is a so-called machine vision camera that performs imaging based on a signal supplied via a cable (not shown) and is used when performing inspection or measurement in a production line. The imaging device 1 includes a camera body 2 having a substantially rectangular parallelepiped shape and having a lens mount portion 28 on the front surface, and a heat radiating member 3 attached to the surface of the camera body 2 by a fixing method such as a fixing screw.

  As shown in FIG. 2, the heat radiating member 3 of the imaging device 1 includes an upper heat radiating member 3A attached to the upper surface of the camera body 2, a left heat radiating member 3B attached to the left side, and a right heat radiating member 3C attached to the right side. It is made up of. The three heat radiating members 3A to 3C are formed of a member having high thermal conductivity, for example, an aluminum alloy, and are formed of plate bodies set to have the same size as the upper surface and the left and right side surfaces of the camera body 2, respectively. Yes.

  The upper heat radiating member 3A has a plurality of heat radiating fins 4A formed on the front surface and a plurality of vent holes 5A penetrating the front and back surfaces. The plurality of heat radiating fins 4 </ b> A are each formed of a protruding strip projecting substantially vertically from the surface of the upper heat radiating member 3 </ b> A and extending in the longitudinal direction. The plurality of vent holes 5A are disposed at positions corresponding to first openings 48A described later of the camera body 2.

  Similarly to the upper heat radiating member 3A, the left heat radiating member 3B has a plurality of heat radiating fins 4B projecting substantially vertically from the surface and extending in the longitudinal direction, and a second opening 48B (described later) of the camera body 2. And a plurality of vent holes 5B arranged at positions corresponding to the above. Similarly, the right heat radiating member 3C is disposed at a position corresponding to a plurality of heat radiating fins 4C protruding substantially vertically from the surface and extending in the longitudinal direction, and a third opening 48C described later of the camera body 2. A plurality of vents 5C are provided.

  FIG. 3 is an exploded perspective view of the camera body 2. As shown in FIG. 3, the camera body 2 includes an exterior case 11 formed of a substantially rectangular parallelepiped housing, an imaging unit 12 provided in the exterior case 11, a circuit board 13, and an interior space of the exterior case 11. The first heat radiating block 14, the second heat radiating block 15 that is opposed to the first heat radiating block 14 with a predetermined gap 16 and partitions the internal space of the outer case 11 are provided. The imaging unit 12 has a CCD 72 that shows a specific example of a solid-state imaging device that receives light from a subject and converts it into an electrical signal. The circuit board 13 is mounted with electronic components that process electrical signals supplied from the CCD 72.

  The outer case 11 of the camera body 2 is formed of a metal having high thermal conductivity, for example, stainless steel or aluminum alloy. The exterior case 11 includes a front panel 21 having a lens mount portion 28 and forming a front surface, a rear panel 22 facing the front panel 21 and forming a back surface, and a cover panel 23 forming upper and left and right side surfaces. The base panel 24 forms the bottom surface.

  The front panel 21 of the exterior case 11 is provided with a through hole 26 penetrating the front and back surfaces and two screw insertion holes 27 (only one is shown in FIG. 3) penetrating the front and back surfaces. Light from the subject passes through the through hole 26 of the front panel 21, and fixing screws (not shown) for fixing the front panel 21 to the base panel 24 are inserted into the two screw insertion holes 27.

  Further, a lens mount portion 28 formed so as to surround the through hole 26 is provided on the surface of the front panel 21. The lens mount portion 28 is formed of a cylindrical body that protrudes substantially perpendicularly to the surface of the front panel 21. A thread groove 27 a into which a lens unit (not shown) is screwed is formed on the inner surface of the lens mount portion 28. Further, two fixing pieces 29 each having a screw hole are provided on the back surface of the front panel 21. A fixing screw (not shown) for fixing the front panel 21 to the cover panel 23 is screwed into each screw hole of the two fixing pieces 29.

  The rear panel 22 is provided with a plurality of input / output holes 31 that penetrate the front and back surfaces and two screw insertion holes 32 that also penetrate the front and back surfaces. The input / output hole 31 forms an input / output connector together with the input / output substrate 34 disposed on the rear surface side of the rear panel 22. Examples of the input / output connector include a power connector to which a cable for supplying power to the camera body 2 is attached, a signal connector to which a cable for inputting and outputting signals is attached, and the like.

A fixing screw (not shown) for fixing the rear panel 22 to the base panel 24 is inserted into the two screw insertion holes 32, 32 of the rear panel 22. A fixing piece 33 having a screw hole is provided on the rear surface of the rear panel 22. The screw hole in the fixing piece 33, fixing screws (not shown) for securing the rear panel 2 2 to the cover panel 23 is screwed.

  The cover panel 23 includes an upper surface plate 41 that forms the upper surface of the outer case 11, a left side surface plate 42 that forms the left side surface as viewed from the front, and a right side surface plate 43 that forms the right side surface. The top panel 41 of the cover panel 23 has a plurality of front panel screw insertion holes 45, a rear panel screw insertion hole 46, a first opening 48A, and a plurality of positions formed at positions corresponding to the circuit board 13. A circuit board opening window 49 and the like are provided.

  The two front panel screw insertion holes 45 are formed on one short side (front side) of the upper surface plate 41. A fixing screw (not shown) for fixing the front panel 21 to the cover panel 23 is inserted through the two front panel screw insertion holes 45. The rear panel screw insertion hole 46 is formed on the other short side (rear side) of the upper surface plate 41. A fixing screw (not shown) for fixing the rear panel 22 to the cover panel 23 is inserted into the rear panel screw insertion hole 46.

  The first opening 48 </ b> A is disposed at a position corresponding to the gap 16 formed between the first heat dissipation block 14 and the second heat dissipation block 15. The first opening 48A is formed in a rectangular shape corresponding to the gap 16 between the first and second heat dissipation blocks 14 and 15, and its two long sides are substantially parallel to the short side of the top plate 41. Has been extended.

  The left side plate 42 of the cover panel 23 is provided with two cover panel screw insertion holes 47 (only one of which is shown in FIG. 3), a second opening 48B, and the like. Similarly, the right side plate 43 is provided with two cover panel screw insertion holes 47 and a third opening 48C.

  The two cover panel screw insertion holes 47 of the left side plate 42 and the two cover panel screw insertion holes 47 of the right side plate 43 are respectively formed on the long sides serving as the tip portions of the left and right side plates 42, 43. And facing each other. These four cover panel screw insertion holes 47 are inserted with fixing screws (not shown) for fixing the cover panel 23 to the base panel 24, respectively.

  The second and third openings 48B and 48C are arranged at positions corresponding to the gaps 16 between the first and second heat radiation blocks 14 and 15 in the same manner as the first openings 48A of the top plate 41. They are facing each other. The second and third openings 48B and 48C are formed in a rectangular shape corresponding to the gap 16, and their long sides extend substantially parallel to the short sides of the left and right side plates 42 and 43, respectively. .

  The cover panel 23 is provided with four first block screw insertion holes 51 (three are shown in FIG. 3) and four second block screw insertion holes 52 (three are shown in FIG. 3). It has been. Four first block screw insertion holes 51 are formed on the upper surface plate 41 and one on each of the left and right side plates 42 and 43, respectively, on the front side of the first to third openings 48A to 48C, respectively. Is arranged. A fixing screw (not shown) for fixing the first heat radiation block 14 is inserted into each of the four first block screw insertion holes 51.

  The four second block screw insertion holes 52 of the cover panel 23 are arranged to face the four first block screw insertion holes 51 across the first to third openings 48A to 48C. A fixing screw (not shown) for fixing the second heat radiation block 15 is inserted into each of the four second block screw insertion holes 52.

  The base panel 24 includes two front panel fixing pieces 61 for fixing the front panel 21, two rear panel fixing pieces 62 for fixing the rear panel 22, and four cover panel fixing pieces 63 for fixing the cover panel 23. And four board bosses 64 for fixing the circuit board 13 are provided.

  The two front panel fixing pieces 61 continuously and vertically protrude from the short side of the front side of the base panel 24 and have screw holes, respectively. Fixing screws (not shown) that are respectively inserted through the two screw insertion holes 27 of the front panel 21 are screwed into the screw holes of the two front panel fixing pieces 61.

  The two rear panel fixing pieces 62 continuously and vertically protrude from the short side of the rear side of the base panel 24 and have screw holes, respectively. Fixing screws (not shown) that are respectively inserted through the two screw insertion holes 32 of the rear panel 22 are screwed into the screw holes of the two rear panel fixing pieces 62.

  The four cover panel fixing pieces 63 continuously project from each of the two long sides of the base panel 24 in a substantially vertical manner and each have a screw hole. Fixing screws (not shown) that are respectively inserted through the four cover panel screw insertion holes 47 of the cover panel 23 are screwed into the screw holes of the four cover panel fixing pieces 63.

  The four substrate bosses 64 are arranged so as to form four square corners from the center to the rear side of the base panel 24. Each of the four board bosses 64 has a screw hole, and a fixing screw (not shown) for fixing the circuit board 13 is screwed into the screw hole.

The base panel 24 is provided with a recess 66, two first block screw insertion holes 67, and two second block screw insertion holes 68. The recess 66 is formed in a substantially rectangular shape, and one short side is continuous with the short side on the front side of the base panel 24. The recess 6 6, the flexible wiring board 84 of the CCD board unit 81 to be described later is housed.

  The two first block screw insertion holes 67 are disposed on both sides of the two long sides of the recess 66 and face each other with the recess 66 interposed therebetween. A fixing screw (not shown) for fixing the first heat radiation block 14 is inserted into each of the two first block screw insertion holes 67. Further, the two second block screw insertion holes 68 are opposed to each other across the recess 66, similarly to the two first block screw insertion holes 67. A fixing screw (not shown) for fixing the second heat radiating block 15 is inserted into each of the two second block screw insertion holes 68.

  The imaging unit 12 of the camera body 2 includes a CCD storage member 71 fixed to the front panel 21, a CCD 72, a CCD holding plate 73 that presses the CCD 72 against the CCD storage member 71, and a first specific example of a heat transfer member. It includes a heat transfer sheet 74 shown, a heat transfer plate 75 showing a second specific example of the heat transfer member, and a Peltier element 76 showing a specific example of the cooling element. The CCD housing member 71 of the image pickup unit 12 is formed of a circular frame corresponding to the lens mount portion 28 of the front panel 21 and has an opening window 71a through which light from the subject passes.

  The CCD 72 includes a flat CCD body 77 and a pair of terminal portions 78 and 78 that project substantially vertically from two sides of the CCD body 77 that face each other in the vertical direction. The surface opposite to the surface from which the pair of terminal portions 78 and 78 of the CCD main body 77 protrudes is a light receiving surface 77 a that receives light from the subject, and is opposed to the opening window 71 a of the CCD housing member 71. Yes.

  The CCD pressing plate 73 is formed in a substantially disc shape corresponding to the CCD housing member 71. The CCD holding plate 73 has a pair of elongated holes 73a and 73a that allow the pair of terminal portions 78 and 78 of the CCD 72 to pass therethrough, and a square hole 73b that exposes the surface from which the pair of terminal portions 78 and 78 of the CCD main body 77 protrudes. Is provided.

  The heat transfer sheet 74 is made of, for example, a resin material having elasticity, and is formed in a square shape corresponding to the square hole 73 b of the CCD pressing plate 73. The heat transfer sheet 74 has elasticity, and has a role of transmitting heat generated by the CCD 72 to the heat transfer plate 75 and a role of a cushion material for the CCD 72.

  The heat transfer plate 75 is made of a metal having high thermal conductivity, for example, stainless steel or aluminum alloy, and has a square shape equivalent to the heat transfer sheet 74. The Peltier element 76 is an element that absorbs one surface by applying a drive signal of a predetermined voltage, moves the absorbed heat to the opposite surface, and generates heat. The heat absorbing surface is used as a cooling surface. In this way, the cooling effect is achieved. The Peltier element 76 is arranged with the cooling surface 76a facing the heat transfer plate 75 side.

In the assembled state of the imaging unit 12, the heat transfer sheet 74, the heat transfer plate 75, and the Peltier element 76 are stacked in close contact. The heat transfer sheet 7 4 are in close contact with the surface opposite to the light receiving surface 77a of the CCD body 77 through the square hole 73b of the CCD holding plate 73.

  A CCD substrate unit 81 is disposed behind the imaging unit 12. The CCD substrate unit 81 includes a mounting board 82 on which the CCD 72 is mounted, a control board 83 on which electronic components (driver ICs) that control driving of the CCD 72 are mounted, and the mounting board 82 and the control board 83. It consists of a flexible wiring board 84 to be connected.

  The mounting board 82 is provided with a through hole 82 a through which the Peltier element 76 penetrates. A pair of sockets 86, 86 to which a pair of terminal portions 78, 78 of the CCD 72 are soldered are attached to the surface of the mounting substrate 82 facing the imaging unit 12. As described above, the flexible wiring board 84 of the CCD substrate unit 81 is accommodated in the recess 66 provided in the base panel 24 of the outer case 11 and covered with the wiring board cover 88.

  A first heat dissipation block 14 and a second heat dissipation block 15 are interposed between the mounting substrate 82 and the control substrate 83 of the CCD substrate unit 81. The mounting board 82 is fixed to the first heat dissipation block 14, and the control board 83 is fixed to the second heat dissipation block 15.

  The first and second heat radiating blocks 14 and 15 are made of a metal having high thermal conductivity, for example, stainless steel or aluminum alloy, and each has a flat plate shape having a predetermined thickness. The planar shapes of the first and second heat radiation blocks 14 and 15 are substantially quadrangles that block the internal space of the outer case 11 in the front-rear direction. The first heat dissipation block 14 and the second heat dissipation block 15 are arranged so that their respective planes are substantially parallel to the front and back surfaces of the front panel 21 and the rear panel 22, and face each other with a gap 16 therebetween. Is done.

  A pair of fixing boss portions 91 and 91 for fixing the mounting substrate 82 are provided on the flat surface 14a which is the surface on the front panel 21 side of the first heat radiation block 14. A screw hole is formed in each of the pair of fixing boss portions 91, 91, and a fixing screw (not shown) for fixing the mounting substrate 82 is screwed into each screw hole. Further, the Peltier element 76 penetrating the through hole 82 a of the mounting substrate 82 is brought into contact with the flat surface 14 a of the first heat dissipation block 14.

  A plurality of heat radiation fins 92 (see FIG. 4) extending in the vertical direction are provided on the flat surface 14b of the first heat radiation block 14 facing the second heat radiation block 15. Further, six screw holes 93 (three are shown in FIG. 3) for fixing the first heat radiating block 14 to the cover panel 23 and the base panel 24 of the outer case 11 are formed on the peripheral surface of the first heat radiating block 14. ) Is provided. Two of these six screw holes 93 are arranged on the upper surface and the lower surface of the first heat radiation block 14 and one on each of the left and right side surfaces.

  Similar to the first heat dissipation block 14, a plurality of heat dissipation fins 95 extending in the vertical direction are provided on the flat surface 15 a of the second heat dissipation block 15 facing the first heat dissipation block 14. Similarly to the first heat dissipation block 14, two screw holes 96 (FIG. 3) are arranged on the peripheral surface of the second heat dissipation block 15, two on the upper and lower surfaces and one on the left and right side surfaces. 3 are shown). A control board 83 is fixed to a flat surface 15b which is a surface of the second heat radiation block 15 on the rear panel 22 side by a fixing method such as a fixing screw.

  The circuit board 13 of the camera body 2 is fixed to four board bosses 64 provided on the base panel 24 by fixing screws (not shown), and is arranged behind the control board 83. The circuit board 13 includes three boards stacked in the vertical direction at a predetermined interval, and is electrically connected to the input / output board 34 and the control board 83 by a flexible wiring board (not shown). . The circuit board 13 generates a control signal based on a signal supplied from an external device via the input / output board 34 and outputs the control signal to the control board 83 or is supplied from the CCD 72 via the control board 83. Processes electrical signals and outputs them to external devices.

  FIG. 4 is a cross-sectional view of the image pickup apparatus 1, and FIG. 5 is a vertical cross-sectional view of the image pickup apparatus 1. As shown in FIGS. 4 and 5, in the state in which the imaging device 1 is assembled, the internal space of the exterior case 11 includes a first space portion 98 formed by the first heat dissipation block 14 and a second heat dissipation block 15. The second space 99 is formed by the following steps. The gap 16 formed between the first heat dissipation block 14 and the second heat dissipation block 15 is exposed by the first to third openings 48A to 48C of the outer case 11. That is, the gap 16 is an air layer formed by outside air.

  In the first space portion 98 in the exterior case 11, a mounting substrate 82 for the imaging unit 12 and the CCD substrate unit 81 is disposed. In the second space 99, the circuit board 13 and the control board 83 of the CCD board unit 81 are arranged. As a result, the circuit board 13 and the CCD 72 of the imaging unit 12 are not affected by each other's heat generation, and each heat generation is radiated separately.

  The heat radiation of the imaging apparatus having such a configuration will be described with reference to FIGS. First, heat radiation generated from the CCD 72 of the imaging unit 12 will be described. When shooting is started by the imaging apparatus 1, the CCD 72 of the imaging unit 12 converts light from the subject into an electrical signal and generates heat. At this time, the Peltier element 76 cools the CCD 72 via the heat transfer plate 75 and the heat transfer sheet 74. At the same time, the surface of the Peltier element 76 that contacts the first heat dissipation block 14 generates heat.

The heat generated by the Peltier element 76 is transmitted to the first heat radiating block 14 and radiated to the gap 16 formed between the first and second heat radiating blocks 14 and 15 through the heat radiating fins 92. Then, heat radiated into the gap 16, the first through the third opening 48A～48 C to expose the gap 16 and is discharged to the outside through the vent 5A~5C of the heat radiating member 3.

  Thereby, it is possible to suppress an increase in the temperature of the CCD 72 and to obtain a good image quality. Further, since the heat generated from the CCD 72 does not stay in the second space 99, it is possible to prevent the temperature of the circuit board 13 from rising due to the influence of the heat generated from the CCD 72. A decrease in signal processing capability can be suppressed.

Next, heat radiation generated in the second space 99 will be described. When shooting is started by the image pickup apparatus 1, the circuit board 13 generates heat by processing a signal supplied from the CCD 72 and the like. Due to this heat generation, the second space 99 is warmed. The heat of the second space 99 is radiated to the gap 16 through the second heat radiating block 15, and passes through the first to third openings 48 </ b> A to 48 </ b> C and the vent holes 5 </ b> A to 5 </ b> C of the heat radiating member 3. Is released to the outside.

  The heat of the second space 99 is transmitted to the upper heat radiating member 3A of the heat radiating member 3 from the plurality of circuit board opening windows 49 provided in the outer case 11, and is radiated to the outside through the heat radiating fins 4A. Furthermore, the heat of the second space 99 is transmitted to the upper heat radiating member 3A, the left heat radiating member 3B, and the right heat radiating member 3C through the exterior case 11, and is radiated through the heat radiating fins 4A to 4C.

Note that when the imaging apparatus 1 starts photographing, the control board 83 of the CCD substrate unit 81 also generates heat. The heat generated from the control board 83 is radiated into the gap 16 through the second heat radiating block 15, through the first to third openings 48A～48 C, the vent 5A~5C of the heat radiating member 3 Released to the outside.

  Thereby, it can prevent that the 2nd space part 99 becomes high temperature, and it can prevent that the temperature of the circuit board 13 rises and signal processing capability falls. Further, since the heat of the second space 99 is not transmitted to the first space 98, it is possible to prevent the temperature of the CCD 72 from rising due to the heat generated from the circuit board 13.

  In the present embodiment, the heat radiating member 3 is attached to the surface of the camera body 2. However, the imaging device according to the present invention may be the camera body 2 without providing the heat radiating member 3. In this case, the exterior case 11 is not provided with the circuit board opening window 49 so that dust such as dust or dirt does not enter the second space 99.

  In the present embodiment, the outer case 11 is formed of a metal having high thermal conductivity in order to enhance the heat dissipation effect. However, the present invention is not limited to this. The exterior case according to the present invention may be formed of a member having a low thermal conductivity, for example, a synthetic resin such as acrylonitrile / butadiene / styrene resin (ABS resin).

In the present embodiment, the CCD 72 is cooled using the Peltier element 76. However, the imaging apparatus according to the present invention is not limited to this configuration. The imaging apparatus of the present invention, be configured to dissipate heat transferred to the first heat sink block 1 4 by CCD 72 (solid-state image pickup device) the heat transfer sheet 74 and the heat transfer plate 75 the heat generated from the (heat transfer member) You can also.

  Furthermore, in the present embodiment, the control board 83 of the CCD substrate unit 81 is fixed to the second heat dissipation block 15 and arranged in the second space 99. However, the image pickup apparatus of the present invention has a control function. The substrate 83 may be stored in the recess 66 of the base panel 24. In this case, the flexible wiring board 84 connected to the mounting board 82 can be shortened, and the signal transmission speed between the mounting board 82 and the control board 83 can be further increased.

  As described above, according to the imaging apparatus of the present invention, the first space portion in which the solid-state imaging device is disposed and the circuit board are disposed in the internal space of the exterior case by the first heat radiation block and the second heat radiation block. Divided into the second space part. And the clearance gap between the 1st heat radiating block and the 2nd heat radiating block was exposed by the opening part provided in the exterior case. For this reason, it is possible to prevent the temperature of the solid-state imaging device from rising due to the influence of heat generated from the circuit board, and obtain a good captured image.

  In addition, since the solid-state imaging device and the first heat dissipation block are brought into contact with each other via the heat transfer member and the cooling member, it is possible to suppress a temperature rise due to heat generation of the solid-state imaging device itself and to generate heat generated in the cooling member. It is possible to radiate heat from one heat radiation block to the outside.

  Further, since the heat radiation fins are provided on the mutually opposing surfaces of the first heat radiation block and the second heat radiation block, the heat generated on the first space portion side and the heat generated on the second space portion side can be efficiently performed, respectively. It can dissipate heat.

  Moreover, since the exterior case is formed from a member having high thermal conductivity, and the heat radiating member is attached to the surface of the exterior case, the heat radiation effect for the heat generated in the exterior case can be enhanced. As a result, the various electronic components placed in the exterior case are not affected by heat, can fully demonstrate their performance, function, etc., and stably perform high-speed and high-accuracy imaging. Can do.

  The present invention is not limited to the embodiment described above and shown in the drawings, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, an example in which a machine vision camera is applied as an imaging device has been described. However, the present invention can also be applied to a digital still camera, a digital video camera, and other imaging devices.

  In the embodiment, an example in which a CCD (Charge Coupled Device) is applied as a solid-state imaging device has been described. However, the present invention can also be applied to other solid-state imaging devices such as a CMOS (Complementary Metal Oxide Semiconductor) imager. Furthermore, in the above-described embodiment, the lens unit is configured separately from the camera body. However, the imaging apparatus of the present invention may be configured so that the lens is integrated with the camera body.

It is the perspective view which looked at 1st Embodiment of the imaging device of this invention from the front side. It is the disassembled perspective view which decomposed | disassembled 1st Embodiment of the imaging device of this invention into the camera main body and the heat radiating member. It is a disassembled perspective view of the camera main body which concerns on 1st Embodiment of the imaging device of this invention. 1 is a cross-sectional view of a first embodiment of an imaging apparatus of the present invention. 1 is a longitudinal sectional view of a first embodiment of an imaging apparatus of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Imaging device, 2 ... Camera body, 3 ... Heat radiation member, 3A ... Upper heat radiation member, 3B ... Left heat radiation member, 3C ... Right heat radiation member, 11 ... Exterior case, 12 ... Imaging unit, 13 ... Circuit board, 14 ... First heat dissipating block, 15 ... second heat dissipating block, 16 ... gap, 21 ... front panel, 22 ... rear panel, 23 ... cover panel, 24 ... base panel, 28 ... lens mount, 48A ... first opening 48B ... second opening, 48C ... third opening, 49 ... circuit board opening window, 71 ... CCD housing member, 72 ... CCD (solid-state imaging device), 73 ... CCD presser plate, 74 ... heat transfer Sheet, 75 ... Heat transfer plate, 76 ... Peltier element (cooling element), 81 ... Substrate unit for CCD, 82 ... Mounting board, 83 ... Control board, 84 ... Flexible Wiring board, 98 ... first space, 99 ... second space

Claims (5)

A solid-state image sensor that receives light from a subject and converts it into an electrical signal; and
A circuit board on which electronic components for processing electrical signals supplied from the solid-state imaging device are mounted;
An outer case for housing the solid-state imaging device and the circuit board;
A first heat dissipating block that divides the internal space of the exterior case and forms a first space in which the solid-state imaging device is disposed;
A second heat dissipating block that faces the first heat dissipating block with a predetermined gap and forms a second space in which the circuit board is disposed by partitioning the internal space of the outer case, and
The outer case may have a opening for exposing the gap between the first heat sink block and the second heat sink block,
The imaging apparatus according to claim 1, wherein the first heat radiation block and the second heat radiation block each have a heat radiation fin on a surface facing each other . The imaging device according to claim 1, wherein the solid-state imaging element and the first heat dissipation block are in contact with each other via a heat transfer member. The imaging apparatus according to claim 1, wherein the solid-state imaging element and the first heat radiation block are in contact with each other via a cooling element arranged so that the solid-state imaging element side serves as a cooling surface. The imaging apparatus according to claim 1, wherein the exterior case is formed from a member having high thermal conductivity, and a heat radiating member is attached to a surface of the exterior case. The imaging device according to claim 4 , wherein the heat radiating member is attached to a surface of the exterior case where the opening is provided, and has a vent hole at a position corresponding to the opening.

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