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JP4873682B2 - Parts feeder - Google Patents
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JP4873682B2 - Parts feeder - Google Patents

Parts feeder Download PDF

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JP4873682B2
JP4873682B2 JP2005032502A JP2005032502A JP4873682B2 JP 4873682 B2 JP4873682 B2 JP 4873682B2 JP 2005032502 A JP2005032502 A JP 2005032502A JP 2005032502 A JP2005032502 A JP 2005032502A JP 4873682 B2 JP4873682 B2 JP 4873682B2
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component
parts
rotating means
transport
electronic component
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JP2006219230A (en
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佳明 原
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Description

本発明は、半導体素子等の小型電子部品を搬送し、各種の処理工程を行う処理装置に供給するためのパーツフィーダに関するものである。   The present invention relates to a parts feeder for transporting small electronic components such as semiconductor elements and supplying them to a processing apparatus that performs various processing steps.

半導体素子等の小型電子部品は、その製造工程や実装工程において、種々の処理装置間で搬送され、受け渡しが行われる。このように、各種の処理装置に対して電子部品を搬送し、供給する装置として、パーツフィーダが開発されており、一般的には、部品を搬送する搬送経路と、搬送経路に振動を与えて部品を連続的に移動させる振動機構と、部品をピックアップして取り出し、処理装置に供給するエスケープ機構等を備えている。   Small electronic components such as semiconductor elements are transported and delivered between various processing devices in the manufacturing process and the mounting process. In this way, parts feeders have been developed as devices for transporting and supplying electronic components to various processing devices. In general, vibrations are applied to the transport route for transporting components and the transport route. A vibration mechanism for continuously moving the parts, an escape mechanism for picking up and taking out the parts, and supplying the parts to the processing apparatus are provided.

例えば、特許文献1に記載されているパーツフィーダは、円形の振動パーツフィーダと直線型の供給振動フィーダとを組み合わせて、多数の部品を連続的に搬送し、搬送経路終端において、吸着パッドによって部品をピックアップして取り出すものである。   For example, the parts feeder described in Patent Document 1 is a combination of a circular vibration part feeder and a linear supply vibration feeder, and continuously conveys a large number of parts. Is picked up and taken out.

図4は、このようなパーツフィーダにおける供給振動フィーダに関する概略を示したものである。この供給振動フィーダにおいて、左右のガイド部12が設けられた搬送経路13上に並んだ電子部品Sは、搬送方向に対して斜めに振動が加えられることによって、搬送経路13上を順次搬送される。そして搬送経路13終端部まで搬送された電子部品Sは、ストッパ22により所定位置で停止、進行を制御され、順次エスケープ(切出し)に受け渡される。このエスケープは、電子部品Sを受け取ると、平行に移動し、外観検査、電気検査等の各種処理工程間を搬送する搬送手段に設けられた保持機構4に電子部品Sを受け渡す。
特開昭63−218421号公報
FIG. 4 schematically shows a supply vibration feeder in such a parts feeder. In this supply vibration feeder, the electronic components S arranged on the conveyance path 13 provided with the left and right guide portions 12 are sequentially conveyed on the conveyance path 13 by applying vibrations obliquely with respect to the conveyance direction. . The electronic component S transported to the end of the transport path 13 is controlled to stop and advance at a predetermined position by the stopper 22 and sequentially delivered to escape (cutout). When the electronic component S is received, the escape moves in parallel and delivers the electronic component S to the holding mechanism 4 provided in the conveying means for conveying between various processing steps such as appearance inspection and electrical inspection.
JP 63-218421 A

上記のような従来のパーツフィーダでは、図4に示すように、エスケープが搬送経路13より電子部品Sを受け取る位置にある状態から保持機構4へ受け渡す位置に移動した際に、エスケープ上の電子部品Sの保持が十分になされていないと、エスケープが移動した勢いでエスケープ上の電子部品Sがずれたり、搬送経路13とエスケープとの間に生じる搬送経路13終端の隙間15に部品が落ち込んでしまうことがある。そして、再度エスケープが搬送経路13側に移動した際に、この隙間15に部品が詰まってしまうことがあった。   In the conventional parts feeder as described above, as shown in FIG. 4, when the escape moves from the position where it receives the electronic component S from the transport path 13 to the position where it is delivered to the holding mechanism 4, If the component S is not sufficiently held, the electronic component S on the escape is displaced due to the movement of the escape, or the component falls into the gap 15 at the end of the conveyance path 13 generated between the conveyance path 13 and the escape. May end up. Then, when the escape is moved again to the conveyance path 13 side, the gap 15 may be clogged with parts.

また、エスケープは、搬送経路13より電子部品Sを受け取る位置にある状態から保持機構4へ受け渡す位置との間を往復運動するため、高速での搬送に限界があり、非効率的であった。   In addition, since the escape reciprocates between the position where the electronic component S is received from the transport path 13 and the position where the electronic component S is delivered to the holding mechanism 4, there is a limit to high-speed transport, which is inefficient. .

さらに、図5(a)に示すように搬送する電子部品Sが細長いものの場合は、搬送経路13内での搬送の際に整然と並んで搬送されてこない。したがって、エスケ−プに載置された際、エスケープ上の電子部品Sの姿勢が不安定となり、位置決め精度が低く、エスケープが移動した勢いで電子部品Sがエスケープから落下したり、吸着ミス及び吸着穴詰り等のトラブルが発生していた。   Furthermore, as shown in FIG. 5A, when the electronic parts S to be transported are elongated, they are not transported in an orderly manner when transporting in the transport path 13. Therefore, when the electronic component S is placed on the escape, the posture of the electronic component S on the escape becomes unstable, the positioning accuracy is low, and the electronic component S falls from the escape due to the movement of the escape, or a suction error and suction Troubles such as clogging occurred.

また、このような細長い電子部品Sは、振動を与えることによって部品が順次搬送される際に向きがばらばらになってしまうため、図5(a)に示すような搬送方向に対し左右にリードが位置するような通常の方法では搬送できず、図5(b)に示すように、搬送方向に対し前後にリードが位置するような搬送方法となっていた。このため、図5(c)に示すように、前後の電子部品Sが相互に重なり合い又はガイドと先行する電子部品Sとの隙間に後方の電子部品Sが入り込むことがあった。このようなことがエスケープへの受渡し位置で発生すると、例えば二つの電子部品Sが重なったまま受け渡される等、適切に受渡しが行えず、エスケープに対して順序良く電子部品Sを受け渡す手段が必要であった。   Further, since the elongated electronic component S is scattered when the components are sequentially conveyed by applying vibration, the leads are left and right with respect to the conveying direction as shown in FIG. It was not possible to carry by the normal method as positioned, and as shown in FIG. 5B, the carrying method was such that the leads were positioned in the front and rear directions with respect to the carrying direction. For this reason, as shown in FIG. 5C, the front and rear electronic components S may overlap each other, or the rear electronic component S may enter the gap between the guide and the preceding electronic component S. When such a situation occurs at the delivery position to the escape, for example, the two electronic components S are delivered while being overlapped. For example, there is no means for delivering the electronic components S in order with respect to the escape. It was necessary.

本発明は、上記のような従来技術の問題点を解決するために提案されたものであり、その目的は、エスケープに部品を載置する際の位置決め精度が高く、安定した部品の搬送と取り出しを可能とするパーツフィーダを提供することにある。   The present invention has been proposed in order to solve the above-described problems of the prior art, and the object thereof is high positioning accuracy when placing parts on the escape, and stable transportation and removal of parts. It is to provide a parts feeder that makes it possible.

上記の目的を達成するため、請求項1に記載の発明は、部品に対して各種処理を行う工程処理機構間に部品を吊り上げながら搬送する搬送手段に対して部品を供給するパーツフィーダであって、前記部品が移動する搬送経路を有する搬送機構と、回転しながら前記搬送機構から前記部品を受け取るとともに前記搬送手段に前記受け取った部品を受け渡す回転手段を有する授受機構と、を備え、前記回転手段は、前記搬送機構の終端から部品の排出方向に沿って前記回転手段の外周まで伸ばした線分を仮想線分A、当該仮想線分Aと前記回転手段の外周との接点を始点として前記回転手段の回転方向に延ばした接線を仮想線Bとしたとき、仮想線分Aと仮想線Bとがなす前記回転手段とは反対側につくられる劣角が鈍角となるように配置され、且つ、前記搬送手段が前記部品を吊り上げる受渡位置で少なくとも重なるように、前記搬送手段の下方に潜って配置され、前記授受機構は、前記回転手段の外周に上面から凹形溝状、且つ前記搬送機構の授受位置に移動したときに奥行き方向が前記搬送機項の排出方向と一致するように掘り込まれ、前記回転手段が受け取った部品を保持する搭載部と、前記搬送機構と前記回転手段との前記部品の受取位置に前記回転手段とは別体として設けられ、前記受取位置の前記搭載部を上方から覆い、且つ前記回転手段の前記搬送手段との前記受渡位置を露出させたカバーと、斜め下方向を向くように前記搭載部に設けられ、前記受け取った部品を前記回転手段の中心方向及び前記搭載部の底面方向に吸着する吸着部と、を有すること、を特徴とする。 In order to achieve the above object, the invention described in claim 1 is a parts feeder that supplies a part to a conveying means that conveys the part while lifting the part between process processing mechanisms that perform various processes on the part. A transfer mechanism having a transfer path along which the component moves, and a transfer mechanism having a rotating unit that receives the component from the transfer mechanism while rotating and delivers the received component to the transfer unit, rotating means, the line segment a virtual line a which is extended to the outer periphery of said rotating means along from the end in the discharging direction of part of the transport mechanism, as a starting point the point of contact with the outer circumference of the virtual line segment a and said rotating means when a tangent extending in the direction of rotation of said rotating means and a virtual line B, are arranged so minor angle made on the opposite side to the rotation means formed by the virtual line a and the virtual line B is obtuse And such that said conveyor means overlap at least at the transfer position lifting the component, are arranged dived below the conveying means, said transfer mechanism, the rotating means concave groove shape from the top surface to the outer periphery of, and the transport A mounting portion that holds the components received by the rotating means, the depth direction being indented so that the depth direction coincides with the discharging direction of the transporting machine term when moved to the delivery position of the mechanism, the transport mechanism, and the rotating means; the said rotating means to receive position of the component is provided separately, the not covering the mounting portion of the receiving position from above, and and a cover to expose the delivery position of the conveying means of said rotating means , provided in the mounting portion so as to face obliquely downward, to said, to have a suction unit for sucking the received component toward the bottom of the central direction and the mounting portion of the rotating means .

以上の態様によれば、回転手段が搬送経路から部品を受け取る際に、搬送経路を有する搬送機構と、受け取った部品を各工程処理機構間で搬送させる搬送手段との間を平行移動により往復することなく、その場で回転することによって、部品を搬送経路から受け取るとともに、各工程処理機構間を搬送させる搬送機構に受け渡すことができる。また、搬送経路と回転手段の間に隙間を生じさせずに隣接させて前記搬送機構及び回転手段を設置することができるため、この隙間に電子部品が落下したり、詰まることがない。そして、搭載部の設置位置及び形状、カバー、及び吸着部によって、部品搭載部に載置された部品の位置決め精度が高くなり、このような安定した部品の搬送と取り出しが可能となる。 According to the above aspect, when the rotating means receives a part from the transport path, the reciprocating movement is reciprocated between the transport mechanism having the transport path and the transport means for transporting the received part between the process processing mechanisms. Without rotating, the parts can be received from the transport path and transferred to the transport mechanism for transporting between the process processing mechanisms. Further, since the conveying mechanism and the rotating means can be installed adjacent to each other without generating a gap between the conveying path and the rotating means , the electronic component does not fall or clog the gap. The placement position and shape of the mounting portion, the cover, and the suction portion increase the positioning accuracy of the component placed on the component mounting portion, and enables such stable transportation and removal of the component.

請求項2に記載の発明は、請求項1に記載のパーツフィーダにおいて、前記回転手段は、外周の回転軌跡が前記搬送手段の周回軌跡と2点で交差するように重なって配置され、前記授受機構は、前記2点のそれぞれで前記搬送手段に前記部品を受け渡すようにしてもよい。 According to a second aspect of the present invention, in the parts feeder according to the first aspect of the invention, the rotating means is arranged so that an outer peripheral rotation trajectory intersects with a circular trajectory of the conveying means at two points, and the transfer is performed. The mechanism may deliver the component to the conveying means at each of the two points.

以上の態様によれば、回転手段に載置された部品が、工程処理機構の種類によって、例えば搬送手段がリード部を横方向に保持する必要がある場合や、リード部を縦方向に保持する必要がある場合に、受渡し位置を搬送手段の種類ごとにずらすことで、様々な種類の工程処理機構に対応でき、汎用性が高くなる。According to the above aspect, depending on the type of the process processing mechanism, for example, the component placed on the rotating unit may hold the lead part in the vertical direction when the transport unit needs to hold the lead part in the horizontal direction. When necessary, by shifting the delivery position for each type of transport means, it is possible to deal with various types of process processing mechanisms, and versatility is enhanced.

請求項3に記載の発明は、請求項1又は請求項2に記載のパーツフィーダにおいて、前記回転手段には、等間隔に配置された4つの前記搭載部が設けられているようにしてもよい。 According to a third aspect of the present invention, in the parts feeder according to the first or second aspect, the rotating means may be provided with four mounting portions arranged at equal intervals. .

請求項に記載の発明は、請求項1乃至請求項3のいずれか1項に記載のパーツフィーダにおいて、前記回転手段には、回転手段上の搭載部に電子部品を載置したまま受渡しミス部品排出位置に達した際、前記吸着部からエアーを逆流させることで電子部品を排出する部品排出手段を備えることを特徴とする。 According to a fourth aspect of the present invention, in the parts feeder according to any one of the first to third aspects of the present invention, the rotating means has a delivery error while placing an electronic component on the mounting portion on the rotating means. When the component discharge position is reached, a component discharge means is provided for discharging the electronic component by causing air to flow backward from the suction portion.

以上の態様により、回転手段上に載置された電子部品が搬送機構に設けられた保持機構によりピックアップされなかった場合でも、当該部品を部品搭載部から取り除く作業が不要であり、また、当該部品が回転手段上の部品搭載部に取り残されることにより生じる機械の故障等を回避できる。 According to the above aspect, even when the electronic component placed on the rotating means is not picked up by the holding mechanism provided in the transport mechanism, it is not necessary to remove the component from the component mounting portion. It is possible to avoid a machine failure or the like caused by being left in the component mounting portion on the rotating means .

請求項に記載の発明は、請求項1乃至請求項4のいずれか1項に記載のパーツフィーダにおいて、前記搬送経路終端部には、搬送された部品を停止させるストッパと、搬送途中の部品の停止、進行を制御する吸着機構とを備えることを特徴とする。 According to a fifth aspect of the present invention, in the parts feeder according to any one of the first to fourth aspects, the terminal portion of the transport path includes a stopper for stopping the transported parts, And a suction mechanism for controlling the stop and progress of the parts.

以上の態様によれば、搬送経路から部品搭載部に搭載される電子部品より後方の部品については、搬送機構に設置されたバキュームストッパ及びストッパが連動して作動することにより電子部品の移動が制限されて搭載される電子部品と連なることなく、最終端の電子部品のみを回転式エスケープの受け取りタイミングに合わせて順序良く受け渡すことができるとともに、搬送経路内の最終端部品より後方の電子部品について、より適切な誘導が可能となる。   According to the above aspect, for the components behind the electronic components mounted on the component mounting portion from the conveyance path, the movement of the electronic components is restricted by the interlocking of the vacuum stopper and the stopper installed in the conveyance mechanism. Without being connected to the electronic components that are mounted, only the final electronic components can be delivered in order according to the timing of receiving the rotary escaper, and the electronic components behind the final electronic components in the transport path More appropriate guidance is possible.

本発明によれば、エスケープに部品を載置する際の位置決め精度が高く、安定した部品の搬送と取り出しが実現可能であり、しかも高速運転可能なパーツフィーダを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the positioning accuracy at the time of mounting components on an escape is high, can implement | achieve the stable conveyance and taking-out of components, and can provide the parts feeder which can be drive | operated at high speed.

次に、本発明を実施するための最良の形態を、図1及び図2を参照して説明する。   Next, the best mode for carrying out the present invention will be described with reference to FIGS.

[実施形態の構成]
本実施形態のパーツフィーダは、図1(a)、(b)に示すように、搬送機構1、ストッパ機構2及び本発明の要部である回転式エスケープ31を備えたエスケープ機構3とによって構成されている。
[Configuration of the embodiment]
As shown in FIGS. 1 (a) and 1 (b), the parts feeder of the present embodiment is configured by a transport mechanism 1, a stopper mechanism 2, and an escape mechanism 3 having a rotary escape 31 that is a main part of the present invention. Has been.

搬送機構1は、電子部品Sが移動する直線状の部品搬送面11と、電子部品Sの両側に電子部品Sの左右方向をガイドするガイド部12とからなる搬送経路13と、搬送経路13の終端部に設けられたストッパ機構2を構成する真空吸着式のバキュームストッパ21及び搬送経路13の上方に回動可能に設けられたストッパ22とからなる。
このストッパ機構2を構成するバキュームストッパ21及びストッパ22は、後述のエスケープ3の回転と連動して吸着あるいは昇降を行う。
The conveyance mechanism 1 includes a conveyance path 13 including a linear component conveyance surface 11 on which the electronic component S moves, a guide portion 12 that guides the left and right directions of the electronic component S on both sides of the electronic component S, and a conveyance path 13. It comprises a vacuum suction type vacuum stopper 21 constituting the stopper mechanism 2 provided at the end portion and a stopper 22 provided so as to be rotatable above the transport path 13.
The vacuum stopper 21 and the stopper 22 constituting the stopper mechanism 2 are attracted or lifted in conjunction with the rotation of the escape 3 described later.

ストッパ22の回動(上昇、下降)のタイミングと、搭載された部品を移動させる回転式エスケープ31の間欠回転タイミング、あるいは搬送経路13上にある最終端部品を一旦停止させるバキュームストッパ21の保持開放のタイミングとはすべて連動している。   Timing of rotation (up and down) of the stopper 22 and intermittent rotation timing of the rotary escape 31 for moving the mounted component, or holding and releasing of the vacuum stopper 21 for temporarily stopping the final end component on the transport path 13 All timings are linked.

エスケープ機構3は、回転式エスケープ31と、回転式エスケープ31を駆動させる駆動モータ5とからなる。回転式エスケープ31は、搬送機構1から電子部品Sを受け取る部品搭載溝32と、部品搭載溝32に直結する吸着部33とを回転式エスケープ31上に等間隔に4つ配置している。回転式エスケープ31上には、等間隔に設けられた4個の部品搭載溝32が、回転式エスケープ31の直径Lから回転方向に向かってずらし、前記回転式エスケープ上にオフセット部分16を設けて直径Lと平行する平行線M上に配置されている。   The escape mechanism 3 includes a rotary escape 31 and a drive motor 5 that drives the rotary escape 31. The rotary escape 31 has four component mounting grooves 32 that receive the electronic components S from the transport mechanism 1 and four suction portions 33 that are directly connected to the component mounting grooves 32 arranged at equal intervals on the rotary escape 31. Four component mounting grooves 32 provided at equal intervals on the rotary escape 31 are shifted from the diameter L of the rotary escape 31 in the rotation direction, and an offset portion 16 is provided on the rotary escape 31. It is arranged on a parallel line M parallel to the diameter L.

部品搭載溝32は回転式エスケープ31の上面から掘り込まれた凹形溝状になっており、さらに上面はカバー34を設けることで、搭載された部品を両側面及び奥側あるいは上面からガイドし、位置決めの役割をする。また、部品搭載溝32の奥側下面には、搭載された電子部品Sを吸着する吸着部33が設けられており、上面に設けられたカバー34は、部品搭載溝32に搭載された電子部品Sの吸着効果を高めるための役割も果たす。   The component mounting groove 32 has a concave groove shape dug from the upper surface of the rotary escape 31. Further, a cover 34 is provided on the upper surface to guide the mounted component from both sides and the back or upper surface. , Play a role of positioning. In addition, a suction portion 33 that sucks the mounted electronic component S is provided on the lower surface on the back side of the component mounting groove 32, and the cover 34 provided on the upper surface is an electronic component mounted in the component mounting groove 32. It also plays a role in enhancing the adsorption effect of S.

工程処理機構に搬送する搬送手段である回転テーブル17には、回転式エスケープ31から電子部品Sを受け取る保持機構4が設けられている。   A holding mechanism 4 that receives the electronic component S from the rotary escape 31 is provided on the turntable 17 that is a transfer means for transferring to the process processing mechanism.

回転式エスケープ31には、次工程の搬送手段に受け渡すために電子部品Sを吸着する保持機構4にピックアップさせる受渡し位置を、図1(a)に示すように、受渡し位置A及び受渡し位置Bの2ヵ所に設け、また、受渡しミス排出位置Cを設けている。すなわち、回転式エスケープ31が1/4ずつ間欠回転するごとに、電子部品Sは受渡し位置A、受渡し位置B、受渡しミス排出位置Cに順次移動するように構成されている。   In the rotary escape 31, as shown in FIG. 1A, delivery positions A and delivery positions B are picked up by the holding mechanism 4 that picks up the electronic component S for delivery to the transport means in the next process. In addition, a delivery error discharge position C is provided. That is, each time the rotary escape 31 is intermittently rotated by ¼, the electronic component S is sequentially moved to the delivery position A, the delivery position B, and the delivery error discharge position C.

[実施形態の作用]
搬送機構1の搬送経路13に送り込まれた電子部品Sは、振動及びエアー等により部品搬送面11上をガイド部12に左右方向をガイドされながら、エスケープ機構3方向に向かって順次搬送される。
[Operation of the embodiment]
The electronic components S sent to the transport path 13 of the transport mechanism 1 are sequentially transported in the direction of the escape mechanism 3 while being guided in the left-right direction on the component transport surface 11 by the guide portion 12 by vibration and air.

搬送経路13終端まで搬送された電子部品Sは、ストッパ22が下方へ回動することによって一旦停止させられ、回転式エスケープ31の部品搭載溝32が所定の位置に停止していることがセンサー等で確認された後、ストッパ22は上方へ回動し、最終端の電子部品Sが回転式エスケープ31の部品搭載溝32へと誘導される。この時、部品搭載溝32に直結している吸着部33が作動し、受け渡される電子部品Sを吸着するので、電子部品Sは回転式エスケープ31の部品搭載溝32又はカバー34をガイドとして所定の位置に搭載される。   The electronic component S transported to the end of the transport path 13 is temporarily stopped when the stopper 22 is rotated downward, and the component mounting groove 32 of the rotary escape 31 is stopped at a predetermined position. After that, the stopper 22 rotates upward, and the electronic component S at the final end is guided to the component mounting groove 32 of the rotary escape 31. At this time, the suction portion 33 directly connected to the component mounting groove 32 is operated to suck the electronic component S to be delivered, so that the electronic component S is predetermined using the component mounting groove 32 or the cover 34 of the rotary escape 31 as a guide. It is mounted at the position.

その後、部品搭載溝32に搭載されると同時に、ストッパ22は再び下降し、次に受け渡される電子部品S1を停止させると同時に回転式エスケープ31が1/4回転し、受渡し位置Aまで電子部品S1を移動させる。受渡し位置Aまで移動した電子部品S1は、吸着保持機構4により吸着され、次の工程処理機構へと搬送される。   Thereafter, at the same time as being mounted in the component mounting groove 32, the stopper 22 is lowered again, and the electronic component S <b> 1 to be delivered next is stopped, and at the same time, the rotary escape 31 is rotated by ¼ to reach the delivery position A. Move S1. The electronic component S1 that has moved to the delivery position A is sucked by the suction holding mechanism 4 and conveyed to the next process processing mechanism.

また、仮に受渡し位置Aにおいて、電子部品Sがピックアップされなかった場合には、回転式エスケープ31上の回転により電子部品Sが受渡しミス排出位置Cに移動したとき、センサーにより電子部品Sの有無を判定し、吸着部33から部品搭載溝32に向かってエアーを逆流させることにより電子部品Sを強制的に排出する。
[実施形態の効果]
If the electronic component S is not picked up at the delivery position A, when the electronic component S moves to the delivery mistake discharge position C due to the rotation on the rotary escape 31, the presence or absence of the electronic component S is detected by the sensor. The electronic component S is forcibly discharged by making a determination and causing air to flow backward from the suction portion 33 toward the component mounting groove 32.
[Effect of the embodiment]

本実施形態によれば、回転式エスケープ31が搬送経路13から電子部品Sを受け取る際に平行移動により往復することなく、その場で回転することによって電子部品Sを搬送経路13から受け取るとともに保持機構4に受け渡すことができる。したがって、搬送経路13と回転式エスケープ31の間に隙間を生じさせずに隣接させて設置することが可能となることから、搬送経路13と回転式エスケープ31との間に電子部品Sが落ち込み、詰まることがない。また、回転式エスケープ31が回転して載置された電子部品Sを移動させることにより、従来の往復運動に比して高速回転が可能となることから、効率的な電子部品Sの搬送が行うことができる。   According to the present embodiment, when the rotary escape 31 receives the electronic component S from the transport path 13, the electronic device S is received from the transport path 13 by rotating on the spot without reciprocating by parallel movement, and the holding mechanism. 4 can be handed over. Therefore, since it becomes possible to install adjacently without generating a gap between the conveyance path 13 and the rotary escape 31, the electronic component S falls between the conveyance path 13 and the rotary escape 31, There is no clogging. Moreover, since the rotary escape 31 rotates to move the placed electronic component S, it can be rotated at a higher speed than the conventional reciprocating motion, so that the electronic component S is efficiently conveyed. be able to.

また、回転式エスケープ31上に配置される部品搭載溝32が凹形溝状に形成されていることから、搬送経路13から移動してきた電子部品Sがこの部品搭載溝32に3方向を囲まれる状態で載置される上、吸着部33及びカバー34の作用によって載置された電子部品Sが吸着されるため、部品の位置決め精度が高くなり安定した部品の搬送が可能となる。   In addition, since the component mounting groove 32 disposed on the rotary escape 31 is formed in a concave groove shape, the electronic component S moved from the transport path 13 is surrounded by the component mounting groove 32 in three directions. In addition to being placed in a state, the electronic component S placed by the action of the suction portion 33 and the cover 34 is sucked, so that the positioning accuracy of the component is increased and the component can be transported stably.

さらに、回転式エスケープ31上の受渡しミス排出位置Cで保持機構4に回収されずに残された電子部品Sを、吸着部33によりエアーを逆流させることで強制的に排出する。これにより、当該電子部品Sが回転式エスケープ31上の部品搭載溝32に取り残されることによって生じる、電子部品Sが部品搭載溝32に詰まる等の故障を回避することができる。   Further, the electronic component S that is left without being collected by the holding mechanism 4 at the delivery error discharge position C on the rotary escape 31 is forcibly discharged by causing the suction portion 33 to flow back air. Thereby, it is possible to avoid a failure such as the electronic component S being clogged in the component mounting groove 32 caused by the electronic component S being left in the component mounting groove 32 on the rotary escape 31.

また、図2(a)で示すように、部品搭載溝32が回転式エスケープ31の直径Lから回転方向にずらして平行線M上に形成されているため、回転式エスケープ31が、搬送経路13から電子部品S12を受け取った後、回転式エスケープ31上の部品搭載溝32に載置された電子部品S12は、回転式エスケープ31の回転外周軌道に沿って搬送経路13最終端の電子部品S13から離れるように搬送手段まで搬送される。そのため、図2(b)で示すように、後方の電子部品S13と先行の電子部品S12のリードが相互に入り込むことなく、スムーズに電子部品S12を部品搭載溝32に載置させ、保持機構4へと受け渡すことが可能となり、安定した電子部品Sの搬送が確保できる。   Further, as shown in FIG. 2A, the component mounting groove 32 is formed on the parallel line M so as to be shifted in the rotational direction from the diameter L of the rotary escape 31. After receiving the electronic component S12 from the electronic component S12, the electronic component S12 placed in the component mounting groove 32 on the rotary escape 31 is moved from the electronic component S13 at the final end of the transport path 13 along the rotation outer peripheral track of the rotary escape 31. It is transported to the transport means so as to leave. Therefore, as shown in FIG. 2B, the electronic component S12 is smoothly placed in the component mounting groove 32 without the leads of the rear electronic component S13 and the preceding electronic component S12 entering each other, and the holding mechanism 4 It is possible to deliver the electronic component S stably.

搬送経路13上の電子部品Sが回転式エスケープ31に移動を行う際に、ストッパ22及びバキュームストッパ21が連動して作動することにより、エスケープ機構3に受け渡されるべき最終端の電子部品Sが移動を行う際、それ以降の電子部品Sはバキュームストッパ21により移動が制限されるとともに、回転式エスケープ31の受け取りタイミングに合わせて順序良く電子部品Sを送り出せるので、搬送経路13から回転式エスケープ31上の部品搭載溝32への受渡しをスムーズに行うことができる。   When the electronic component S on the transport path 13 moves to the rotary escape 31, the stopper 22 and the vacuum stopper 21 operate in conjunction with each other so that the final electronic component S to be delivered to the escape mechanism 3 is When moving, the electronic component S thereafter is restricted from being moved by the vacuum stopper 21, and the electronic component S can be sent out in order in accordance with the reception timing of the rotary escape 31, so that the rotary escape from the transport path 13. The delivery to the component mounting groove 32 on 31 can be performed smoothly.

また、回転式エスケープ31上に、次工程へ搬送するために保持機構4が電子部品Sをピックアップする受渡し位置が2箇所設けられていることにより、単一の次工程処理機構のみならず、目的に合わせて複数の工程処理機構と連結させることが可能となる。例えば、搬送手段がリード部を横方向に保持する必要がある場合やリード部を縦方向に保持する必要がある場合等、部品搭載溝32を複数個設けておくことによって、様々な工程処理機構に対応できる。   In addition, since the holding mechanism 4 picks up the electronic component S to be transported to the next process on the rotary escape 31, two delivery positions are provided, not only a single next process processing mechanism but also a purpose. Accordingly, it is possible to connect to a plurality of process processing mechanisms. For example, when the conveying means needs to hold the lead portion in the horizontal direction or when the lead portion needs to be held in the vertical direction, by providing a plurality of component mounting grooves 32, various process processing mechanisms are provided. It can correspond to.

[他の実施形態]
本発明は、上記の実施形態に限定されるものではなく、例えば、図3に示すように、テストコンタクト(電気特性検査)、マーキング及び外観検査等の各工程処理機構において、衛星テーブル14として使用可能である。
[Other Embodiments]
The present invention is not limited to the above-described embodiment. For example, as shown in FIG. 3, it is used as a satellite table 14 in each process processing mechanism such as test contact (electric characteristic inspection), marking, and appearance inspection. Is possible.

テストコンタクト処理工程は、通常、他の工程処理機構に比べ部品1個当りに対し長時間の処理時間が必要となる。このため、テストコンタクトにかかる処理時間が律速することで生産性を左右することになる。この対策として、回転式エスケープ31の考えを取り入れ、テスト中に衛星テーブル14に部品を渡しておけばメインテーブルはテスト終了を待たずに回転できるようになる。   The test contact processing process usually requires a longer processing time for each component than other process processing mechanisms. For this reason, the processing time for the test contact is rate-determined, which affects the productivity. As a countermeasure, if the concept of the rotary escape 31 is taken in and parts are passed to the satellite table 14 during the test, the main table can be rotated without waiting for the end of the test.

マーキング処理工程においても、衛星テーブル14として使用すれば、小型で場所を取らず高速で処理することが可能となる。また、外観検査処理工程においても、同様に衛星テーブル14として使用すれば、コンパクトに設置でき、しかも高速処理することが可能となる。   Even in the marking process, if it is used as the satellite table 14, it is small and can be processed at high speed without taking up space. Similarly, in the appearance inspection process, if it is used as the satellite table 14, it can be installed compactly and can be processed at high speed.

本発明の実施形態におけるパーツフィーダの全体構成を示す平面図(a)及び側面図(b)。The top view (a) and side view (b) which show the whole structure of the parts feeder in embodiment of this invention. 本発明の実施形態におけるエスケープ機構の構成を示す拡大図。The enlarged view which shows the structure of the escape mechanism in embodiment of this invention. 本発明の他の実施形態を示す構成図。The block diagram which shows other embodiment of this invention. 従来のエスケープ機構を示す構成図。The block diagram which shows the conventional escape mechanism. 従来のエスケープ機構を示す構成図。The block diagram which shows the conventional escape mechanism.

符号の説明Explanation of symbols

1…搬送機構
2…ストッパ機構
3…エスケープ機構
4…保持機構
5…駆動モータ
11…部品搬送面
12…ガイド部
13…搬送経路
14…衛星テーブル
15…隙間
16…オフセット部分
17…回転テーブル
21…バキュームストッパ
22…ストッパ
31…回転式エスケープ
32…部品搭載溝
33…吸着部
34…カバー
A、B…受渡し位置
C…受渡しミス排出位置
L…直径
M…平行線
S、S1、S12、S13…電子部品
DESCRIPTION OF SYMBOLS 1 ... Conveyance mechanism 2 ... Stopper mechanism 3 ... Escape mechanism 4 ... Holding mechanism 5 ... Drive motor 11 ... Component conveyance surface 12 ... Guide part 13 ... Conveyance path 14 ... Satellite table 15 ... Gap 16 ... Offset part 17 ... Rotary table 21 ... Vacuum stopper 22 ... Stopper 31 ... Rotary escape 32 ... Part mounting groove 33 ... Suction part 34 ... Cover A, B ... Delivery position C ... Delivery error discharge position L ... Diameter M ... Parallel line S, S1, S12, S13 ... Electronic parts

Claims (5)

部品に対して各種処理を行う工程処理機構間に部品を吊り上げながら搬送する搬送手段に対して部品を供給するパーツフィーダであって、
前記部品が移動する搬送経路を有する搬送機構と、
回転しながら前記搬送機構から前記部品を受け取るとともに前記搬送手段に前記受け取った部品を受け渡す回転手段を有する授受機構と、
を備え、
前記回転手段は、
前記搬送機構の終端から部品の排出方向に沿って前記回転手段の外周まで伸ばした線分を仮想線分A、当該仮想線分Aと前記回転手段の外周との接点を始点として前記回転手段の回転方向に延ばした接線を仮想線Bとしたとき、仮想線分Aと仮想線Bとがなす前記回転手段とは反対側につくられる劣角が鈍角となるように配置され、
且つ、前記搬送手段が前記部品を吊り上げる受渡位置で少なくとも重なるように、前記搬送手段の下方に潜って配置され、
前記授受機構は、
前記回転手段の外周に上面から凹形溝状、且つ前記搬送機構の授受位置に移動したときに奥行き方向が前記搬送機構の排出方向と一致するように掘り込まれ、前記回転手段が受け取った部品を保持する搭載部と、
前記搬送機構と前記回転手段との前記部品の受取位置に前記回転手段とは別体として設けられ、前記受取位置の前記搭載部を上方から覆い、且つ前記搬送手段との前記受渡位置で前記搭載部の上部を露出させたカバーと、
斜め下方向を向くように前記搭載部に設けられ、前記受け取った部品を前記回転手段の中心方向及び前記搭載部の底面方向に吸着する吸着部と、
を有すること、
を特徴とするパーツフィーダ。
A parts feeder that supplies parts to a conveying means that conveys the parts while lifting the parts between process processing mechanisms that perform various processes on the parts,
A transport mechanism having a transport path along which the component moves;
A receiving and receiving mechanism having rotating means for receiving the parts from the conveying mechanism while rotating and delivering the received parts to the conveying means;
With
The rotating means includes
A line segment extending from the end of the transport mechanism to the outer periphery of the rotating means along the component discharge direction is a virtual line segment A, and a contact point between the virtual line segment A and the outer periphery of the rotating means is a starting point. When the tangent line extending in the rotation direction is the imaginary line B, the subordinate angle formed on the opposite side of the rotation means formed by the imaginary line segment A and the imaginary line B is arranged so as to be an obtuse angle,
And it is arranged under the transport means so as to overlap at least at the delivery position where the transport means lifts the component,
The transfer mechanism is
A concave groove-like shape on the outer periphery of the rotating means, and a part received by the rotating means that has been dug so that the depth direction coincides with the discharging direction of the transport mechanism when moved to the transfer position of the transport mechanism A mounting portion for holding,
Wherein the rotating means is provided separately, the not covering the mounting portion of the receiving position from above, and the at the delivery position of the transfer means to the receiving position of the part of the rotation means and said transport mechanism A cover exposing the top of the mounting part ;
An adsorbing portion that is provided in the mounting portion so as to face obliquely downward, and adsorbs the received component in a central direction of the rotating means and a bottom surface direction of the mounting portion ;
Having
Parts feeder characterized by.
前記回転手段は、
外周の回転軌跡が前記搬送手段の周回軌跡と2点で交差するように重なって配置され、
前記授受機構は、
前記2点のそれぞれで前記搬送手段に前記部品を受け渡すこと、
を特徴とする請求項1記載のパーツフィーダ。
The rotating means includes
It is arranged so that the outer rotation trajectory intersects with the circular trajectory of the transport means at two points,
The transfer mechanism is
Delivering the parts to the conveying means at each of the two points;
The parts feeder according to claim 1.
前記回転手段には、等間隔に配置された4つの前記搭載部が設けられていること特徴とする請求項1又は2記載のパーツフィーダ。   The parts feeder according to claim 1 or 2, wherein the rotating means is provided with four mounting parts arranged at equal intervals. 前記回転手段には、回転手段上の前記搭載部に電子部品を載置したまま受渡しミス部品排出位置に達した際、前記吸着部からエアーを逆流させることで電子部品を排出する部品排出手段を備えることを特徴とする請求項1乃至3のいずれか1項に記載のパーツフィーダ。   The rotating means includes component discharging means for discharging the electronic component by causing air to flow backward from the suction portion when the delivery error component discharging position is reached while the electronic component is mounted on the mounting portion on the rotating means. The parts feeder according to any one of claims 1 to 3, wherein the parts feeder is provided. 前記搬送経路の終端部には、搬送された部品を停止させるストッパと、搬送途中の部品の停止、進行を制御する吸着機構とを備えることを特徴とする請求項1乃至4のいずれか1項に記載のパーツフィーダ。   The terminal part of the said conveyance path | route is equipped with the stopper which stops the conveyed component, and the adsorption | suction mechanism which controls the stop and progress of the component in the middle of conveyance, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. The parts feeder described in 1.
JP2005032502A 2005-02-09 2005-02-09 Parts feeder Expired - Fee Related JP4873682B2 (en)

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