JP4875810B2 - Fluorine resin bond grinding wheel and manufacturing method - Google Patents
Fluorine resin bond grinding wheel and manufacturing method Download PDFInfo
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- JP4875810B2 JP4875810B2 JP2001244352A JP2001244352A JP4875810B2 JP 4875810 B2 JP4875810 B2 JP 4875810B2 JP 2001244352 A JP2001244352 A JP 2001244352A JP 2001244352 A JP2001244352 A JP 2001244352A JP 4875810 B2 JP4875810 B2 JP 4875810B2
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- Prior art keywords
- fluororesin
- grindstone
- abrasive grains
- grinding wheel
- manufacturing
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Description
【0001】
【発明の属する技術分野】
本発明は、ラッピングおよびポリシングなどの研磨加工に使用するフッ素樹脂ボンド研磨用砥石およびその製造方法に関するものである。
【0002】
【従来の技術】
最近の電子関係部品や金型関連部品では鏡面加工が要求される上に、加工物に端面ダレなどが無い高形状精度も要求されている。このような精密加工は従来用いられている低弾性ポリシングパッドや軸付き砥石および研磨用テープでは実現困難であった。また、研削盤による鏡面加工ではメタルボンド砥石、ビトリファイド砥石、レジンボンド砥石などで極微細砥粒を使用しているため、高精度な機構をもつ機械が必要となる。
【0003】
一般に生産ラインでの鏡面加工は、遊離砥粒方式と固定砥粒方式に2分類できる。遊離砥粒方式では、液体を用いるため大量のスラリー廃液が生じ、環境上の問題があった。他方、固定砥粒方式では、砥石と加工物の間に砥粒欠落片や研磨後の粉塵及び塵埃が挟まれて、スクラッチ(線状の深い傷)が発生しやすい。
【0004】
【発明が解決しようとする課題】
上記のような点から、鏡面加工においてスクラッチが発生せず、加工物に端面ダレが起きず、高能率で研磨加工が可能であり、従来のポリシングマシンや研削盤などの鏡面加工機がそのまま使用でき、環境に優しい固定砥粒方式で使用できる中弾性の砥石が望まれている。
【0005】
本発明は、このような要望に合致したフッ素樹脂ボンド研磨用砥石を製造する方法を提供することを課題とする。
【0006】
【課題を解決するための手段】
本発明は、フッ素樹脂粉末から作製した顆粒と砥粒を混合し、得られた混合物を加圧成形し、得られた成形物を焼成することを特徴とする多孔質フッ素樹脂ボンド鏡面研磨用砥石の製造方法である。
【0007】
本発明方法により製造される研磨用砥石は、多孔質のフッ素樹脂中に砥粒が混入されていることを特徴とするフッ素樹脂ボンド研磨用砥石である。
【0008】
本発明方法に用いられる砥粒としては、ダイヤモンド粒、酸化セリウム粒、酸化珪素粒等が好ましい。
【0009】
本発明方法に用いられるフッ素樹脂としてはPTFE(ポリテトラフルオロエチレン)が好ましいが、それ以外のフッ素樹脂も使用できる。
【0010】
本発明による研磨用砥石を製造するには、粉末状PTFE(25〜30μm)を顆粒状(70〜700μm)にし、得られた顆粒に砥粒(0.3〜30μm)を冷間にて混ぜ合わせる。PTFE顆粒と砥粒の混合比は、重量で、8:2前後が好ましいが、この値は限定的なものではない。砥粒の混合比が大き過ぎると、PTFE顆粒と砥粒の密着性が低下する。その後、混合物を好ましくは20MPa以上の圧力で砥石の形、例えばドーナツ型に加圧成形し、成形物を高温炉にて好ましくは360〜380℃で約18時間焼成する。
【0011】
【発明の実施の形態】
つぎに、本発明を実施例に基づいて具体的に説明する。
【0012】
粉末状PTFE(約28μm)を顆粒状(約400μm)にし、得られた顆粒にダイヤモンド粒(約25μm)を冷間にて混ぜ合わせた。PTFE顆粒と砥粒の混合比は、重量で、約8:2とした。その後、混合物を35MPaの圧力で砥石の形に加圧成形し、成形物を高温炉にて370℃で約18時間焼成した。
【0013】
こうして得られた、ダイヤモンド砥粒混入の多孔質PTFEの砥石の電子顕微鏡写真(倍率500倍および2000倍)を図1および図2にそれぞれ示す。
【0014】
図1および図2の電子顕微鏡写真から分かるように、砥石の内部および表面には多数の空孔部がある。
【0015】
図3は加工面接触部での砥石の単粒弾性特性を表したものである。砥石表面上をマイクロビッカース型圧子でX−Y方向にピッチ3mmで6点測定した。高弾性点が高密度近傍であり、低弾性点は空孔部近傍と想定される。この図で変位とは、砥石が砥粒をかみ込んだ場合の砥粒の粒径に相当する。高弾性係数は約13.7mN/μmであり、例えば、10μm径の砥粒が脱落し、再び研削面にかみ込んでも単粒当り約0.137Nの荷重である。この程度の荷重では通常の電子機器用素材ではスクラッチが発生するおそれはない。
【0016】
鏡面加工実験
実施例で得られた、ダイヤモンド砥粒を混入した多孔質PTFEからなる砥石を用いて、ダイヤモンド砥粒を混入した多孔質PTFEの砥石で電子部品の表面を研磨した。
【0017】
実験1
砥石仕様:外径43mm、内径29mm、厚み7mmのドーナツ状砥石。粒径:8〜16μm
研磨条件:回転数=450rpm、送り=50mm/min
実験結果を図3に示す。その結果、PV(波形の上下の差)=26.6nm、Ra(表面粗さ)=3.8nmとなり、これまでの砥石と比較して大きな粒径でもスクラッチフリーの超鏡面を実現できる。
【0018】
本発明による砥石は、固定砥粒方式のみならず、固定砥粒方式と遊離砥粒方式の組み合わせにも使用できる。
【0019】
【発明の効果】
本発明では、多孔質のフッ素樹脂を砥石のベースとしているので、鏡面加工においてスクラッチが発生せず、加工物に端面ダレが起きず、高能率で研磨加工が可能であり、従来のポリシングマシンや研削盤などの鏡面加工機がそのまま使用でき、環境に優しい固定砥粒方式で使用できる。
【0020】
砥粒としては、ダイヤモンド、酸化セリウム(SeO2 )、酸化珪素(SiO2 )などのあらゆる砥粒が適用できる。
【図面の簡単な説明】
【図1】図1は、実施例で得られた、ダイヤモンド砥粒を混入した多孔質PTFEからなる砥石断面の電子顕微鏡写真(倍率500倍)である。図中、FはPTFEを、Dはダイヤモンド粒をそれぞれ示す。
【図2】図2は、実施例で得られた、ダイヤモンド砥粒を混入した多孔質PTFEからなる砥石断面の電子顕微鏡写真(倍率2000倍)である。図中、FはPTFEを、Dはダイヤモンド粒をそれぞれ示す。
【図3】図3は、単粒弾性特性を示すグラフである。
【図4】図4は、鏡面加工実験結果を示すグラフである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fluororesin bond polishing grindstone used for polishing such as lapping and polishing, and a method for producing the same.
[0002]
[Prior art]
In recent electronic-related parts and mold-related parts, mirror surface processing is required, and high shape accuracy is also required in which there is no end sagging on the workpiece. Such precision machining has been difficult to achieve with conventional low-elasticity polishing pads, grinding wheels with shafts, and polishing tapes. In addition, mirror finishing with a grinder uses ultrafine abrasive grains such as metal bond grindstones, vitrified grindstones, and resin bond grindstones, so that a machine with a highly accurate mechanism is required.
[0003]
In general, mirror finishing on a production line can be classified into two types: a free abrasive grain method and a fixed abrasive grain method. In the free abrasive method, a large amount of slurry waste liquid is generated due to the use of a liquid, which causes environmental problems. On the other hand, in the fixed abrasive system, scratches (linear deep scratches) are likely to occur due to sandwiched pieces of abrasive grains or dust and dust after polishing between the grindstone and the workpiece.
[0004]
[Problems to be solved by the invention]
From the above points, scratches do not occur in mirror finishing, end face sagging does not occur on the workpiece, and polishing can be performed with high efficiency, and conventional polishing machines such as polishing machines and grinding machines can be used as they are. A medium elastic grindstone that can be used in an environmentally friendly fixed abrasive method is desired.
[0005]
This invention makes it a subject to provide the method of manufacturing the grindstone for fluororesin bond grinding | polishing which met such a request.
[0006]
[Means for Solving the Problems]
The present invention is a porous fluororesin bond mirror polishing grindstone characterized by mixing granules and abrasive grains prepared from fluororesin powder, press-molding the obtained mixture, and firing the obtained molded product It is a manufacturing method .
[0007]
Polishing grindstone manufactured Ri by the present invention process is a fluorocarbon resin bonded abrasive grinding wheel wherein the abrasive grains in the fluororesin porous are mixed.
[0008]
As abrasive grains used in the method of the present invention, diamond grains , cerium oxide grains , silicon oxide grains and the like are preferable.
[0009]
The fluororesin used in the method of the present invention is preferably PTFE (polytetrafluoroethylene), but other fluororesins can also be used.
[0010]
In order to manufacture the grinding wheel according to the present invention, powdery PTFE (25-30 μm) is granulated (70-700 μm), and the obtained granules are mixed with abrasive grains (0.3-30 μm) in the cold. Match. The mixing ratio of PTFE granules and abrasive grains is preferably about 8: 2 by weight, but this value is not limited. When the mixing ratio of the abrasive grains is too large, the adhesion between the PTFE granules and the abrasive grains is lowered. Thereafter, the mixture is pressure-molded into a grindstone shape, for example, a donut shape, preferably at a pressure of 20 MPa or more, and the molded product is fired in a high-temperature furnace, preferably at 360-380 ° C. for about 18 hours.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be specifically described based on examples.
[0012]
Powdered PTFE (about 28 μm) was granulated (about 400 μm), and diamond granules (about 25 μm) were mixed with the resulting granule in the cold. The mixing ratio of PTFE granules and abrasive grains was about 8: 2 by weight. Thereafter, the mixture was pressure-molded into a grindstone shape at a pressure of 35 MPa, and the molded product was fired at 370 ° C. for about 18 hours in a high-temperature furnace.
[0013]
Electron micrographs (500 × and 2000 × magnification) of the porous PTFE grindstone mixed with diamond abrasive grains thus obtained are shown in FIGS. 1 and 2, respectively.
[0014]
As can be seen from the electron micrographs of FIGS. 1 and 2, there are a large number of pores in and on the surface of the grindstone.
[0015]
FIG. 3 shows the single grain elastic characteristics of the grindstone at the processed surface contact portion. Six points on the surface of the grindstone were measured with a micro Vickers type indenter in the XY direction at a pitch of 3 mm. It is assumed that the high elastic point is near the high density and the low elastic point is near the hole. In this figure, the displacement corresponds to the grain size of the abrasive grains when the grindstone bites the abrasive grains. The high elastic modulus is about 13.7 mN / μm. For example, even if abrasive grains with a diameter of 10 μm drop off and bite into the ground surface again, the load is about 0.137 N per single grain. With such a load, there is no possibility that scratches will occur in ordinary electronic device materials.
[0016]
The surface of the electronic component was polished with a porous PTFE grindstone mixed with diamond abrasive grains, using the grindstone made of porous PTFE mixed with diamond abrasive grains obtained in the mirror surface processing experiment example.
[0017]
Experiment 1
Whetstone specifications: A donut-shaped whetstone having an outer diameter of 43 mm, an inner diameter of 29 mm, and a thickness of 7 mm. Particle size: 8-16 μm
Polishing conditions: Rotational speed = 450 rpm, Feed = 50 mm / min
The experimental results are shown in FIG. As a result, PV (difference between upper and lower waveforms) = 26.6 nm and Ra (surface roughness) = 3.8 nm, and a scratch-free ultra-mirror surface can be realized even with a larger particle size than conventional grindstones.
[0018]
The grindstone according to the present invention can be used not only for a fixed abrasive method, but also for a combination of a fixed abrasive method and a free abrasive method.
[0019]
【Effect of the invention】
In the present invention, porous fluororesin is used as the base of the grindstone, so that scratching does not occur in mirror finishing, end face sagging does not occur in the workpiece, and polishing can be performed with high efficiency. Mirror finishing machines such as grinding machines can be used as they are, and they can be used in an environmentally friendly fixed abrasive system.
[0020]
As the abrasive grains, any abrasive grains such as diamond, cerium oxide (SeO 2 ), and silicon oxide (SiO 2 ) can be applied.
[Brief description of the drawings]
FIG. 1 is an electron micrograph (magnification 500 times) of a cross section of a grindstone made of porous PTFE mixed with diamond abrasive grains, obtained in an example. In the figure, F represents PTFE, and D represents diamond grains.
FIG. 2 is an electron micrograph (magnification 2000 times) of a cross section of a grindstone made of porous PTFE mixed with diamond abrasive grains, obtained in an example. In the figure, F represents PTFE, and D represents diamond grains.
FIG. 3 is a graph showing single grain elastic characteristics.
FIG. 4 is a graph showing the result of a mirror surface processing experiment.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001244352A JP4875810B2 (en) | 2001-08-10 | 2001-08-10 | Fluorine resin bond grinding wheel and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001244352A JP4875810B2 (en) | 2001-08-10 | 2001-08-10 | Fluorine resin bond grinding wheel and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003053669A JP2003053669A (en) | 2003-02-26 |
| JP4875810B2 true JP4875810B2 (en) | 2012-02-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001244352A Expired - Fee Related JP4875810B2 (en) | 2001-08-10 | 2001-08-10 | Fluorine resin bond grinding wheel and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4875810B2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283857A (en) * | 1987-05-15 | 1988-11-21 | Asahi Chem Ind Co Ltd | Polishing cloth |
| JP2958349B2 (en) * | 1989-06-29 | 1999-10-06 | 旭ダイヤモンド工業株式会社 | Porous grinding wheel and its manufacturing method |
| JP2680740B2 (en) * | 1991-02-08 | 1997-11-19 | 三菱重工業株式会社 | Method for manufacturing resin bond superabrasive grindstone |
| JPH10106987A (en) * | 1996-09-30 | 1998-04-24 | Hitachi Chem Co Ltd | Cerium oxide abrasive agent and polishing method of substrate |
| JP3350459B2 (en) * | 1998-10-28 | 2002-11-25 | 株式会社ノリタケカンパニーリミテド | Manufacturing method of composite whetstone |
| JP2001156030A (en) * | 1999-11-30 | 2001-06-08 | Mitsubishi Materials Silicon Corp | Grinding roller for semiconductor wafer and method for grinding semiconductor wafer using the same |
| JP4554799B2 (en) * | 2000-11-08 | 2010-09-29 | 聰 井上 | Polishing tool based on fluororesin |
-
2001
- 2001-08-10 JP JP2001244352A patent/JP4875810B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2003053669A (en) | 2003-02-26 |
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