JP4875927B2 - Resin molding equipment - Google Patents

Description

  The present invention relates to a resin mold apparatus that covers a resin mold region of a mold with a release film and compresses and molds a molded product together with a sealing resin.

As a resin molding method for resin molding a molded product with a semiconductor chip mounted on a lead frame or a wiring board, a transfer molding method in which a sealing resin supplied to a pot is filled into a cavity through a mold runner gate or a place of the cavity There is a method of compression molding by supplying a fixed amount of sealing resin. A resin mold apparatus for compression molding that can be molded with a simple mold structure and capable of taking a large number of pieces and reducing unnecessary resin to be scrapped is suitably used.
JP-A-2002-36270 JP-A-2003-133350

  In recent years, miniaturization and high-density mounting of semiconductor devices have progressed, and POP (Package / On / Package) type semiconductor devices have been manufactured. In this semiconductor device, since the substrates on which the semiconductor chips are mounted are stacked to be electrically connected, there is a need to form the resin mold portion as thin as possible considering the connection between the terminals.

  An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a resin mold apparatus that seals the resin mold portion within the thickness range of the substrate.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, the first means is a resin molding apparatus for carrying a compression molding by carrying the molded product together with the sealing resin into the mold die, and carrying the substrate peripheral portion of the molded product into the mold die. And a mold for clamping a molded product in which a predetermined amount of sealing resin is supplied to a substrate recess on which a semiconductor chip is mounted, the resin mold region of the mold clamping surface being covered with a release film. A predetermined amount of sealing resin supplied to the substrate recess is pressed by the clamping operation of the mold die to seal the semiconductor chip disposed in the substrate recess within the substrate plate thickness range.
The molded product may be a resin substrate with a substrate recess formed thereon, or a substrate recess extending from the die pad on which the adhesive film is adhered to the back side of the lead frame to mount the semiconductor chip to the inner lead portion. Either of them may be formed.

  Further, the second means is a resin molding apparatus for carrying in the compression molding by carrying the molded product together with the sealing resin into the mold die, and carrying the substrate peripheral portion of the molded product into the mold die. The carrier mold and the resin mold region of the mold clamping surface are covered with a release film, a sealing material is provided on the opposing mold clamping surface, and a predetermined amount of sealing resin is supplied to the substrate recess on which the semiconductor chip is mounted. And a pressure reducing mechanism for depressurizing a resin mold region closed by the sealing material in accordance with the clamping operation of the molding die, and the sealing material by the clamping operation of the molding die. The semiconductor mold region disposed in the substrate recess is pressed by pressing a predetermined amount of the sealing resin supplied to the substrate recess while reducing the pressure of the resin mold region closed by the pressure reducing mechanism. Characterized by sealing the chip with the substrate thickness ranges.

If the above-mentioned resin molding apparatus is used, the mold mold presses a predetermined amount of sealing resin supplied to the substrate recess by the clamping operation, and seals the semiconductor chip arranged in the substrate recess within the substrate plate thickness range. Therefore, the thickness of the resin mold part of the semiconductor device can be reduced to substantially the same as that of the substrate. Therefore, it is possible to contribute to downsizing of the POP type semiconductor device.
Further, the mold mold presses a predetermined amount of the sealing resin supplied to the substrate recess while reducing the pressure of the resin mold region closed by the sealing material before clamping the molded product by the decompression mechanism. Since the semiconductor chip arranged on the substrate is sealed in the substrate plate thickness range, the molding quality can be improved without generating voids in the sealing resin.
By using the above resin molding equipment, productivity is improved because it is suitable for taking a large number of molded products with high molding quality, and unnecessary resin such as molded product gate runners is not generated in the sealing resin. The post-processing process after mold release can also be simplified.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. The resin molding apparatus will be described by exemplifying an apparatus that carries a molded product together with a sealing resin into a mold and performs compression molding.

[First embodiment]
In FIG. 1, a carrier 1 is carried into a mold while supporting a substrate peripheral portion of a product (work) W. The carrier 1 has a set plate 3 provided with a stepped portion 2 for supporting a substrate, and a pressing plate 4 that sandwiches the workpiece W by being superimposed on the peripheral portion of the substrate and the set plate 3. As the workpiece W, for example, an adhesive tape (polyimide tape or the like) 6 adhered to the back side of the lead frame 5 or a resin substrate is used. In the case of the lead frame 5, a stepped portion is formed by pressing or etching from the die pad on which the semiconductor chip 7 is mounted to the inner lead portion 5a. A substrate recess 8 is formed as a whole by the shape of the lead frame 5 and the adhesive tape 6. The semiconductor chip 7 is connected to the inner lead portion 5a by wire bonding. Further, in the case of a resin substrate, a substrate recess may be formed by etching or cutting.

  A predetermined amount of sealing resin 9 is supplied to the substrate recess 8 before the work W is carried into the mold with the carrier 1. The sealing resin 9 may be a solid resin, a powdery resin, a granular resin, or a liquid resin, and a capacity for sealing the substrate recess 8 is supplied. Except for the solid resin, the resin is weighed and supplied according to the substrate recess 8 in advance. The supply of the sealing resin 9 to the work W may be performed before the work W is carried into the mold or after the work W is carried in.

  The mold includes an upper mold 10 and a lower mold 11. In the upper mold 10, an upper mold block 13 is provided on an upper mold base 12. A pressing block 14 is floatingly supported on the upper mold block 13 by a spring 15. A sealing material 16 is provided between the pressing block 14 and the upper mold block 13. The spring 15 biases the pressing block 14 so as to always contact the upper mold block 13.

  A set recess 17 for avoiding interference with the carrier 1 is provided on the clamp surface of the pressing block 14. A movable block 18 is provided in the sliding hole 14 a provided in the pressing block 14. The movable block 18 is floatingly supported so as to face the substrate recess 8 of the workpiece W. That is, the movable block 18 is fixed to the lower end of the guide rod 19 supported so as to be movable in the mold opening / closing direction of the upper mold block 13. A flange 20 that regulates the lowered position of the movable block 18 is integrally provided at the upper end of the guide rod 19. A spring 21 is inserted between the flange 20 and the upper die block 13, and the guide rod 19 and the movable block 18 are always urged downward. The movable block 18 enters and presses into the substrate recess 8 to which the sealing resin 9 is supplied, and absorbs the variation in the resin amount by the bending of the spring 21.

A release film 22 that covers the resin mold region is supported by suction on the clamp surface of the upper mold 10, that is, the clamp surfaces of the pressing block 14 and the movable block 18. As the release film 22, a film material having predetermined heat resistance, peelability from the sealing resin 9, and flexibility is used.
The upper mold block 13 is formed with a flow path 23 that communicates the area surrounded by the sealing material 16 with the outside of the mold, and the flow path 24 that communicates the clamp surface of the pressing block 14 with the outside of the mold. Each is provided. The flow paths 23 and 24 are connected to vacuum suction devices 25 and 26 provided outside the mold. By operating the vacuum suction devices 25 and 26, air is sucked through the gap between the movable block 18 and the sliding hole 14 a and the flow path 24, and the release film 22 is clamped on the upper mold 10, that is, the pressing block 14 and the movable block. It is adapted to be sucked and held by 18 clamping surfaces.

  In the lower mold 11, a lower mold support block 28 is provided on the lower mold base 27. The lower mold support block 28 is positioned and supported by a guide pin (not shown) on the workpiece W sandwiched between the carriers 1. A set recess 29 for avoiding interference with the carrier 1 is provided on the clamp surface of the lower mold support block 28. Further, a flow path 30 is provided for communicating the clamp surface of the lower mold support block 28 with the outside of the mold. The flow path 30 is connected to a vacuum suction device 31 provided outside the mold. By operating the vacuum suction device 31, the work W is sucked through the flow path 30 and positioned.

  The structure of the carrier 1 is demonstrated with reference to Fig.3 (a) (b). FIG. 3A is a plan view of the set plate 3. FIG. 3B is a side view thereof, and FIG. 3C is a plan view of the holding plate 4. The set plate 3 is formed in a rectangular frame shape, and a stepped portion 2 corresponding to the substrate thickness (the thickness of the lead frame 5 and the polyimide tape 6) is formed on the inner peripheral edge. In FIG. 3A, the resin mold region is indicated by a broken line M. The holding plate 4 is formed in a flat frame, and a guide hole 32 is provided at a corner portion. Guide pins 33 to be inserted into the guide holes 32 protrude from the corners of the set plate 3. With the work W supported by the stepped portion 2 of the set plate 3, the holding plate 4 is overlapped, and the guide pin 33 is fitted into the guide hole 32 to hold the work W.

  As shown in FIGS. 4A and 4B, the workpiece W may be an individual substrate in which the semiconductor chip 7 is mounted on the lead frame 5 and wire-bonded to the inner lead portion 5a. In addition, as shown in FIGS. 5A and 5B, the semiconductor chip 7 is arranged in a matrix on the lead frame 5, and each semiconductor chip 7 is any of the substrates connected to the inner lead portion 5a by wire bonding. Good.

Next, an example of a molding operation for resin-molding the workpiece W will be described.
In FIG. 1, a release film 22 is adsorbed and held on the upper clamp surface of the mold mold that has been opened. For example, a liquid resin is weighed in the substrate recess 8 and supplied by potting, and the work W supported by the carrier 1 is carried into a mold. The workpiece W is positioned and placed on the lower mold support block 28 of the lower mold 11 and is sucked and held by operating the vacuum suction device 31. At this time, the carrier 1 is accommodated in the set recess 17 of the upper mold 10 and the set recess 29 of the lower mold 11 and does not interfere with the mold clamping surface.

Next, in FIG. 2, the upper mold 10 is lowered and the work W is clamped by the pressing block 14 and the support block 28. At this time, the movable block 18 presses the substrate recess 8 to which the predetermined amount of sealing resin 9 is supplied to the semiconductor chip 7 to seal the semiconductor chip 7 disposed in the substrate recess 8 within the substrate plate thickness range. At this time, the variation in the resin amount of the sealing resin 9 is absorbed by the bending of the spring 21. After the sealing resin 9 is thermally cured, the mold is opened and the work is taken out together with the carrier 1.
Thus, the thickness of the resin mold part of the semiconductor device can be reduced to substantially the same as that of the substrate. Therefore, it is possible to contribute to downsizing of the POP type semiconductor device. In addition, since unnecessary resin such as a molded product gate runner is not generated in the sealing resin 9, it is possible to simplify the mold maintenance and post-processing steps after the mold release.

[Second Embodiment]
Next, another example of the resin molding apparatus will be described with reference to FIGS.
In FIG. 6, since the schematic configuration of the mold is the same as that of the first embodiment, the following description focuses on the different configurations. The present embodiment is provided with a pressure reducing mechanism for reducing the pressure of the resin mold region closed by the sealing material in accordance with the clamping operation of the mold. Specifically, a sealing material 34 is provided on the clamp surface of the lower mold support block 28 on which the work W is positioned and supported so as to surround the work W. Further, a flow path 35 is provided to communicate the clamp surface of the lower mold support block 28 with the outside of the mold. The flow path 35 is connected to a vacuum suction device 36 provided outside the mold. The resin mold space is decompressed by operating the vacuum suction device 36 in a state where the pressing block 14 presses the sealing material 34 and the resin mold region is closed.

  7A and 7B, the release film 22 is held by suction on the upper clamp surface of the mold. For example, a liquid resin is weighed in the substrate recess 8 and supplied by potting, and the work W supported by the carrier 1 is carried into a mold. As shown in FIG. 7A, the workpiece W may be an individual substrate in which the semiconductor chip 7 is mounted on the lead frame 5 and wire-bonded to the inner lead portion 5a, or a matrix substrate. It may be.

  In FIG. 7B, the movable block 18 has a predetermined amount of sealing resin while the pressure of the resin mold space is reduced by operating the vacuum suction device 36 in a state where the pressing block 14 is closed by pressing the sealing material 34. The substrate recess 8 supplied with 9 is pressed to be resin-molded. As a result, the semiconductor chip 7 disposed in the substrate recess 8 can be sealed within the substrate plate thickness range, and the molding quality can be improved without generating voids in the sealing resin 9.

  In the above-described embodiment, the work W is exemplified by the case where the semiconductor chip 7 is connected to the substrate by wire bonding. However, the work W can also be applied to the work W in which the semiconductor chip 7 is flip-chip connected to the substrate.

It is sectional drawing of the resin mold apparatus which concerns on 1st Example. It is sectional drawing of the metal mold | die clamp state of the resin mold apparatus of FIG. It is the top view and right view of a set plate which comprise a carrier, and the top view of a holding plate. It is the top view and front view of the workpiece | work separated into pieces. It is the top view and front view of a matrix type workpiece. It is sectional drawing of the resin mold apparatus which concerns on 2nd Example. It is the top view of a workpiece | work, and operation | movement explanatory drawing of the principal part of a mold die.

Explanation of symbols

W Work 1 Carrier 2 Stepped part 3 Set plate 4 Holding plate 5 Lead frame 5a Inner lead part 6 Adhesive tape 7 Semiconductor chip 8 Substrate recess 9 Sealing resin 10 Upper mold 11 Lower mold 12 Upper mold base 13 Upper mold block 14 Press Block 14a Sliding hole 15, 21 Spring 16 Sealing material 17, 29 Set recess 18 Moving block 19 Guide rod 20 Flange 22 Release film 23, 24, 30 Flow path 25, 26, 31 Vacuum suction device 27 Lower mold base 28 Lower mold Support block 32 Guide hole 33 Guide pin

Claims (4)

In a resin mold apparatus that carries a molded product together with a sealing resin into a mold and compresses it,
A carrier that supports the peripheral edge of the substrate of the molded product and is carried into the mold,
The mold mold surface is coated with a release film, and includes a mold for clamping a molded product in which a predetermined amount of sealing resin is supplied to a substrate recess on which a semiconductor chip is mounted,
A resin molding apparatus characterized in that a predetermined amount of sealing resin supplied to a substrate recess is pressed by a clamping operation of the mold die to seal a semiconductor chip disposed in the substrate recess within a substrate plate thickness range. . The mold mold includes a pressing block that is floatingly supported by the mold block and formed with a set recess that avoids interference between the carrier and the mold clamping surface, and a sliding hole of the pressing block that faces the substrate recess. A movable block supported in a floating manner and a support block for positioning and supporting a molded product,
2. The resin molding apparatus according to claim 1, wherein the movable block presses and seals the concave portion of the substrate to which a predetermined amount of sealing resin is supplied by the clamping operation of the mold. In a resin mold apparatus that carries a molded product together with a sealing resin into a mold and compresses it,
A carrier that supports the peripheral edge of the substrate of the molded product and is carried into the mold,
A molded product in which the resin mold region of the mold clamping surface is covered with a release film, a sealing material is provided on the opposing mold clamping surface, and a predetermined amount of sealing resin is supplied to the substrate recess on which the semiconductor chip is mounted The mold mold for clamping,
A pressure reducing mechanism for reducing the pressure of the resin mold region closed by the sealing material in accordance with the clamping operation of the mold,
A semiconductor chip disposed in the substrate recess is pressed by pressing a predetermined amount of the sealing resin supplied to the substrate recess while the resin mold region closed by the sealing material by the clamping operation of the mold die is decompressed by the decompression mechanism. A resin mold apparatus for sealing in a substrate plate thickness range. The mold mold includes a pressing block that is floatingly supported by the mold block and formed with a set recess that avoids interference between the carrier and the mold clamping surface, and a sliding hole of the pressing block that faces the substrate recess. A movable block that is supported in a floating manner, a support block in which a molded product is positioned and supported, and a sealing material that surrounds the molded product is provided, and a flow path that communicates the clamp surface of the support block and the outside of the mold. Equipped with a vacuum suction device that connects to the outside of the mold,
The vacuum block is operated with the pressure block pressed against the sealing material and the resin mold region is closed by the clamping operation of the mold, and the movable block is supplied to the substrate recess while reducing the resin mold space. 4. The resin molding apparatus according to claim 3, wherein the sealing resin is pressed and sealed.

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