JP4879957B2 - Substrate processing apparatus having sensing unit - Google Patents

Description

The present invention relates to a sensing unit and a substrate processing apparatus having the same, and more particularly to a sensing unit using an elastic member and a substrate processing apparatus having the same.

  In the manufacture of semiconductor-based devices, such as integrated circuits or flat panel displays, each material layer is alternately deposited or etched from the surface of the substrate. During this manufacturing process, various material layers, such as borophosphosilicate glass (BPSG), polysilicon, metal, etc. are deposited on the substrate. Each deposited layer may be patterned by well-known techniques such as photoresist processing. Thereafter, each portion of the deposited layer is etched to form various features, such as interconnect lines, vias, trenches, and the like.

As can be understood by ordinary technicians, in semiconductor processes such as etching processes, a number of parameters in the processing chamber should be tightly controlled to obtain good results, and one such parameter is Temperature. In plasma processing systems, the quality of etching (and the resulting performance of the semiconductor substrate device) is very sensitive to component temperature variations and requires precise control. Furthermore, as feature sizes continue to decrease, there is an increasing need to provide plasma processing equipment with better temperature control in order to provide accurate and consistent manufacturing of semiconductor devices. .

In the chamber of the plasma processing apparatus, a support plate on which a substrate is placed and a shower head for supplying a source gas to the top of the support plate are provided. The shower head has an injection plate facing the support plate, and the injection plate injects source gas onto the upper portion of the support plate.

The spray plate is exposed to the plasma during operation, and the plasma releases heat energy, thus increasing the temperature of the spray plate. Therefore, in order to control the temperature of the plasma processing apparatus, it is necessary to control the temperature of the injection plate. For this purpose, it is necessary to accurately measure the temperature of the injection plate.
JP 2004-31934 A

  The present invention is to solve the above-described problems, and an object of the present invention is to provide a sensing unit that can accurately measure the temperature of a spray plate and a substrate processing apparatus having the sensing unit.

Another object of the present invention is to provide a sensing unit capable of accurately controlling the temperature in the chamber and a substrate processing apparatus having the sensing unit.

Further objects of the present invention will become more apparent through the following detailed description and the accompanying drawings.

  According to the present invention, a substrate processing apparatus includes a chamber that provides a process space in which a process is performed on a substrate; a support plate that is provided in the chamber and on which the substrate is placed; and is provided on an upper portion of the support plate; A shower head having a main body whose lower part is opened, and an injection plate connected to the lower part of the main body and supplying source gas to the upper part of the support plate; a sensor having one end in contact with the upper surface of the injection plate; And a sensing unit having an elastic member that provides an elastic force in a direction toward the ejection plate with respect to the sensor.

  The shower head further includes a fixed plate provided inside the main body and on the upper portion of the injection plate, the sensing unit includes a housing on which the sensor is mounted; and the housing is installed on the fixed plate. The elastic member may provide an elastic force to the housing.

  The housing has a fastening hole through which the fastener is penetrated, one end of the elastic member is in contact with a pressure surface of the fastening hole, and the other end of the elastic member has a larger diameter than the fastening hole. Connected to the head of the fastener.

  The housing has a flange portion that is disposed around the sensor and has a fastening hole through which the fastener passes, the fixing plate has a fixing surface to which the flange portion is fixed, and the sensing unit May further include a sealing pad provided between the flange portion and the fixing surface to maintain airtightness.

  The fixing plate further includes a sealing surface positioned below the fixing surface inside the fixing surface, and the sensing unit is provided between the sealing pad and the sealing surface to maintain a hermetic seal. Can further be included.

  The fixing plate is an upper electrode that generates plasma using the source gas supplied from the shower head together with the support plate.

  The shower head includes: a diffusion plate provided between the fixed plate and the injection plate; and a cooling plate provided between the diffusion plate and the injection plate to adjust the temperature of the injection plate. Further can be included.

  According to the present invention, the sensing unit includes: a sensor whose one end is in contact with the measurement surface of the measurement object; and an elastic member that provides an elastic force to the sensor in a direction toward the measurement surface.

  The sensing unit further includes: a housing in which the sensor is mounted; and a fastener that installs the housing on a fixing member disposed adjacent to the measurement surface; and the elastic member is attached to the housing. In contrast, an elastic force can be provided.

  According to the present invention, the sensor can be brought into close contact with the measurement surface of the measurement object, and a good contact state can always be maintained. Therefore, the reliability of the measurement value of the measurement object can be increased, and accurate control is possible through this.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to FIGS. 1 and 2 . Each embodiment of the present invention can be modified in various forms, and the scope of the present invention should not be analyzed as being limited to each embodiment described below. This embodiment is provided to explain the present invention in more detail to those who have ordinary knowledge in the technical field to which the invention pertains. Accordingly, the shape of each element is exaggerated in the drawings to emphasize a clearer description.

  In the following, a process using plasma will be described as an example, but the technical idea and scope of the present invention are not limited to this, and the present invention includes various semiconductor manufacturing apparatuses that require temperature measurement in the chamber. It can be applied to.

  FIG. 1 is a diagram schematically showing a substrate processing apparatus 1 according to the present invention.

  The substrate processing apparatus 1 includes a chamber 10, a support plate 20, a lifting member 30, a shower head 50, and an exhaust unit 60. The chamber 10 provides a process space in which a process for the substrate 12 is performed, and the process space is closed from the outside. The exhaust unit 60 exhausts the gas inside the chamber 10 when the process proceeds, and makes the inside of the chamber 10 in a vacuum state. The support plate 20 is provided in the lower part of the chamber 10, and the substrate 12 is placed on the upper part of the support plate 20 and etched by plasma during the process. The support plate 20 is also an electrostatic chuck (ESC). A plurality of elevating members 30 are arranged on the edge portion of the support plate 20, and each elevating member 30 moves the substrate 12 up and down while supporting the edge portion of the substrate 12 placed on the upper portion of the support plate 20.

  The shower head 50 is disposed on the support plate 20, supplies a source gas to the top of the support plate 20, and generates plasma from the source gas supplied together with the support plate 20. The shower head 50 includes a main body 52 and an injection plate 54 connected to the lower portion of the main body 52. The main body 52 has a shape in which the lower part is opened, and the injection plate 54 is coupled to the lower part in which the main body 52 is opened. The main body 52 is placed on the support plate 20 by a support shaft 52a.

  The shower head 50 further includes a cooling plate 55, a diffusion plate 57 and an upper electrode 59. The cooling plate 55 is coupled to the upper surface of the injection plate 54 and adjusts the temperature of the injection plate 54 using the refrigerant flowing through the refrigerant passage 55b. The diffusion plate 57 is provided above the cooling plate 55 and diffuses the source gas supplied from the outside toward the injection plate 54. The upper electrode 59 is provided on the diffusion plate 57 and is connected to a separate high frequency generator. The upper electrode 59 can form an electric field on the upper portion of the support plate 20 together with the grounded support plate 20, and can generate plasma from the source gas supplied to the upper portion of the support plate 20. On the other hand, the source gas is supplied to the inside of the main body 52 from the outside, and is supported through the through hole 59a of the upper electrode 59, the diffusion hole 57a of the diffusion plate 57, the through hole 55a of the cooling plate 55, and the injection hole 54a of the injection plate 54. 20 is supplied to the top. On the other hand, a sensing unit 70 is installed on the upper electrode 59.

FIG. 2 is an enlarged view showing the sensing unit 70 of FIG .

  The sensing unit 70 includes a housing 72, a sensor 74 and a fastener 78. The sensor 74 is mounted inside the housing 72, the lower end contacts the upper surface of the injection plate 54, and the upper end is connected to a separate controller (not shown) by a wire 74a. The sensor 74 senses the temperature of the ejection plate 54, and the controller controls the temperature of the ejection plate 54 according to the sensing result of the sensor 74. The sensor 74 includes a resistance temperature detector (RTD) sensor that provides a stable output over a wide temperature range and can accurately measure the temperature over a small temperature range. A resistance temperature detector utilizes a phenomenon in which the electrical resistance of a metal conductor changes with temperature changes.

  The housing 72 includes a flange portion 72a disposed around the sensor 74, and a plurality of fastening holes 72b are formed on the flange portion 72a. The fastener 78 passes through the fastening hole 72b and is fixed to the upper electrode 59, and the fastener 78 having a larger diameter than the fastening hole 72b protrudes outside the flange portion 72a. The fastener 78 has the flange portion 72 a fixedly installed on the upper electrode 59, and the flange portion 72 a can be moved up and down along the fastener 78. Similar to the lower end of the sensor 74, the lower end of the housing 74 contacts the upper surface of the injection plate 54. The sensor 74 is in contact with the upper surface of the ejection plate 54 by the housing 72 while being mounted on the housing 72.

An elastic member 79 is installed on the fastener 78. One end of the elastic member 79 is in contact with the pressure surface of the fastening hole 72 b parallel to the upper surface of the upper electrode 59, and the other end of the elastic member 79 is in contact with the head of the fastener 78. The elastic member 79 is a compression spring, to provide an elastic force (F) downwardly relative to the pressure surface. Therefore, the lower end of the housing 72 can always maintain the state in contact with the upper surface of the injection plate 54. Similarly, the lower end of the sensor 74 always maintains the state in contact with the upper surface of the injection plate 54. can do.

  The upper electrode 59 has a fixing surface 59b facing the flange portion 72a, and a sealing pad 76 for maintaining airtightness is provided between the fixing surface 59b and the flange portion 72a. A sealing surface 59c positioned lower than the fixing surface 59b is provided inside the fixing surface 59b, and an O-ring 77 for maintaining airtightness is also provided between the sealing surface 59c and the sealing pad 76.

  As described above, the sensor 74 can be brought into close contact with the upper surface of the ejection plate 54 to be measured using the elastic force of the elastic member 79, and the contact state can be always maintained. Therefore, the temperature of the injection plate 54 can be accurately measured, and the temperature in the chamber 10 can be accurately controlled.

  Although the present invention has been described in detail on the basis of preferred embodiments, other embodiments may be possible. Therefore, the technical idea and scope of the claims are not limited to the preferred embodiments.

It is the figure which showed schematically the substrate processing apparatus which concerns on this invention. It is the enlarged view which showed the sensing unit of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 10 Chamber 20 Support plate 30 Lifting member 50 Shower head 60 Exhaust unit 70 Sensing unit 72 Housing 74 Sensor 76 Sealing pad 77 O-ring 78 Fastener 79 Elastic member

Claims (5)

A chamber providing a process space in which a process is performed on the substrate;
A support plate provided within the chamber and on which the substrate is placed;
Wherein a main body lower portion is opened is provided in the upper portion of the support plate, wherein the injection plate supplying a source gas into the upper portion of the support plate is connected to the lower portion of the main body, is provided on top of the injection plate wherein the support A shower head having a plate and an upper electrode for generating plasma using the source gas supplied from the shower head;
A sensor whose one end is in contact with the upper surface of the injection plate, a housing in which the sensor is mounted, a fastener for installing the housing on the upper electrode, and an elasticity in a direction toward the injection plate with respect to the housing A sensing unit having an elastic member for providing a force, and a sealing pad provided between the housing and the upper electrode to maintain airtightness ;
A substrate processing apparatus comprising: The housing has a fastening hole through which the fastener is passed,
2. The elastic member according to claim 1 , wherein one end of the elastic member is in contact with a pressure surface of the fastening hole, and the other end of the elastic member is connected to a head of the fastener having a larger diameter than the fastening hole. The substrate processing apparatus as described. The housing has a flange portion disposed around the sensor and having a fastening hole through which the fastener is passed,
The upper electrode has a fixing surface to which the flange portion is fixed;
It said sealing pad, a substrate processing apparatus according to claim 1 or claim 2, characterized in that that will be provided between said flange portion and the fixing plane. The upper electrode further has a sealing surface positioned lower than the fixing surface inside the fixing surface;
The substrate processing apparatus of claim 3 , wherein the sensing unit further includes a sealing member provided between the sealing pad and the sealing surface to maintain airtightness. The shower head is
A diffusion plate provided between the upper electrode and the spray plate;
The substrate according to any one of claims 1 to 4, further comprising: a cooling plate provided between the diffusion plate and the spray plate to adjust a temperature of the spray plate. Processing equipment.