JP4884936B2 - Ultrasonic vibration bonding equipment - Google Patents

Description

  The present invention relates to an ultrasonic vibration bonding apparatus.

  As one means for joining an electronic component such as an IC chip to an electric wiring board, a means using an ultrasonic vibration joining apparatus is known. This ultrasonic vibration bonding apparatus causes the electric wiring board to vibrate in parallel by ultrasonic vibration while pressing the electronic component against the electric wiring board. The electronic component is joined to the electric wiring board by friction generated between the electronic component and the electric wiring board by the parallel vibration.

  The ultrasonic vibration bonding apparatus has a horn that transmits vibration of a vibration element that is a generation source of ultrasonic vibration to an electronic component, holds the electronic component in the horn, and vibrates while pressing against an electric wiring board. It is configured.

  The horn is formed to have a length that is an integral multiple of a half wavelength of the vibration so as to resonate with the ultrasonic vibration and amplify the vibration. In order to efficiently transmit the vibration of the horn to the electronic component, a holding portion for holding the electronic component is provided at a position corresponding to the abdominal portion of the vibration where the vibration is the largest in the horn. Further, the horn is supported with respect to the main body of the ultrasonic vibration bonding apparatus at a position corresponding to the vibration node where vibration is minimized in the horn. Since the vibration amplitude of the node portion is small, the amount of relative movement with respect to the main body portion is small, and the horn can be reliably supported by supporting the horn with this node portion.

  By the way, it is generally known that by applying heat between the electronic component and the electric wiring board, the bonding time between the electronic component and the electric wiring board can be shortened and the bonding strength can be enhanced. Therefore, the horn may be provided with a heater for the purpose of heating between the electronic component and the electric wiring board.

  However, the vibration characteristics of the vibration element tend to vary as the temperature of the vibration element increases. Therefore, there is a problem that the vibration characteristics of the vibration element fluctuate because the heat of the heater provided in the horn conducts the horn and reaches the vibration element.

  In order to solve such a problem, a slit is formed in a portion between the ultrasonic transducer of the horn and the heater, and air is blown to the slit so that the amount of heat applied to the vibration element by the heater provided in the horn is increased. A configuration to reduce is disclosed in Patent Document 1. Patent Document 2 discloses a configuration in which the vibration element is cooled by covering the vibration element with a cooling mechanism that circulates cooling water or by blowing air to the vibration element.

Japanese Patent Laying-Open No. 2005-347507 (see FIG. 2 etc.) JP 2002-118152 A (see FIG. 4 etc.)

  However, if the slit is formed in the horn, there is a problem that the vibration output from the ultrasonic transducer propagating through the horn is attenuated at the slit portion or resonated at the slit portion. Further, as disclosed in Patent Document 2, when the vibration element is covered with a cooling mechanism, there is a problem that the ultrasonic vibration bonding apparatus is increased in size.

  Accordingly, the present invention provides a supercooling means that reduces the amount of heat conducted from the heater to the vibration element while preventing an increase in the size of the ultrasonic vibration bonding apparatus while preventing adverse effects on the vibration propagating to the horn. An object of the present invention is to provide a sonic vibration bonding apparatus.

In order to solve the above-described problem, an ultrasonic vibration bonding apparatus according to the present invention includes an ultrasonic mounting tool having a vibration element that generates ultrasonic vibration, a horn that resonates with the vibration of the vibration element, and a horn to be bonded. A holding part for holding an object, and a heater provided in the horn so as to heat a joining portion between the object to be joined and the object to be joined to join the object to be joined, In an ultrasonic vibration bonding apparatus for bonding an object to be bonded to an object to be bonded by applying ultrasonic vibration while pressing against the object, on the circumferential surface between the heater and the vibration element of the ultrasonic mounting tool The cooling means to be contacted is provided.

  By configuring the ultrasonic vibration bonding apparatus with such a configuration, it is possible to cool the ultrasonic mounting tool without hindering the propagation of vibrations propagating through the ultrasonic mounting tool.

Further, in the above-described invention, the portion where the cooling means of the ultrasonic mounting tool is provided is formed in a cylindrical shape, and the cooling means is provided with an annular body in which a hollow portion having an inner circumferential side as an opening is formed over the entire circumference. The coolant is allowed to flow through the hollow portion of the annular body in a state in which the peripheral edge portion of the opening of the annular body is brought into close contact with the periphery of the portion formed in the cylinder provided with the cooling means . By configuring the ultrasonic vibration bonding apparatus with such a configuration, the coolant directly contacts the ultrasonic mounting tool, so that the cooling efficiency can be increased.

According to another invention, in addition to the above-described invention, the portion formed in the column is formed in a vibrator including a vibration element. By configuring the ultrasonic vibration bonding apparatus in such a configuration, the shape of the horn can be made uniform as a whole as compared with the case where the cylindrical portion is formed on the horn. Therefore, it is possible to suppress the attenuation and disturbance of vibration transmitted through the horn.

  In another invention, in addition to the above-described invention, the annular body is formed of an elastic material. By configuring the ultrasonic vibration bonding apparatus in such a configuration, the annular body absorbs vibration of the ultrasonic mounting tool. Therefore, the annular body does not move due to the vibration of the ultrasonic mounting tool.

  In addition to the above-described invention, another invention includes an O-ring at the peripheral edge of the opening. By configuring the ultrasonic vibration bonding apparatus in such a configuration, the adhesion between the annular body and the cylindrical portion is improved, and leakage of the refrigerant passing through the hollow portion can be prevented.

  In another invention, in addition to the above-described invention, the refrigerant is a gas. By configuring the ultrasonic vibration bonding apparatus with such a configuration, even if the refrigerant leaks, the risk of damage to the ultrasonic vibration bonding apparatus or the like can be reduced.

In addition to the above-described invention, another invention is such that the length of the portion formed in the cylinder is longer than the width of the annular body. By setting the ultrasonic vibration bonding apparatus in such a configuration, the attachment position of the annular body to the ultrasonic mounting tool can be adjusted.

In another invention, in addition to the above-described invention, the ultrasonic mounting tool is configured to be separable at a portion formed in a cylinder . By setting the ultrasonic vibration bonding apparatus in such a configuration, the annular body can be easily attached to the ultrasonic mounting tool.

  According to the present invention, it is possible to reduce the amount of heat conducted from the heater to the vibration element while preventing an adverse effect on the vibration propagating to the horn and suppressing an increase in the size of the ultrasonic vibration bonding apparatus.

(First embodiment)
An ultrasonic vibration bonding apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

  FIG. 1 shows an overall configuration of an ultrasonic vibration bonding apparatus 1 and an outline of a process for bonding an IC chip 100 that is a bonding target to a flexible substrate 101 that is a bonding target using the ultrasonic vibration bonding apparatus 1. It is a figure for demonstrating. FIG. 2 is a diagram illustrating a configuration of a vibration device 2 described later provided in the ultrasonic vibration bonding device 1. FIG. 3 is a view showing a configuration of a cooling pipe 3 as a cooling means provided in the vibration device 2.

  The ultrasonic vibration bonding apparatus 1 receives the supply of the IC chip 100 from the supply apparatus 200 and bonds the supplied IC chip 100 to the flexible substrate 101.

  First, an outline of a supply process in which the ultrasonic vibration bonding apparatus 1 receives supply of the IC chip 100 from the supply apparatus 200 will be described with reference to FIG. In addition, the configuration of the supply device 200 will be described together.

  The configuration of the supply device 200 that supplies the IC chip 100 to the ultrasonic vibration bonding apparatus 1 is roughly as follows. The supply device 200 includes an IC chip mounting table 201 on which a plurality of IC chips 100 are mounted, and a supply mechanism that supplies the IC chip 100 mounted on the IC chip mounting table 201 to the ultrasonic vibration bonding apparatus 1. 202.

  In the following description, a surface parallel to the surface on which the IC chip 100 is placed is defined as a horizontal plane, and a direction perpendicular to the surface is defined as a vertical direction. 1 is the front side (front), the back side is the rear side (rear), the right hand side is the right side (right side) and the left hand side is the left side (left side) from the front side toward the rear side. Will be described. That is, in FIG. 1, the X direction is the vertical direction and the Y direction is the horizontal direction.

  The IC chip 100 is mounted on the IC chip mounting table 201 while being accommodated in the container P. A plurality of IC chips 100 are accommodated in the container P, and the supply device 202 supplies the IC chips 100 from the container P to the ultrasonic vibration bonding apparatus 1 one by one. In addition, a plurality of IC chips 100 may be formed as diced wafers and placed on the IC chip placement table 200 in the wafer state. Alternatively, the IC chip 100 is intermittently transported on the IC chip mounting table 201 while being repeatedly moved and stopped from the front to the rear by a transport mechanism such as a belt conveyor (not shown). The chips 100 may be supplied to the ultrasonic vibration bonding apparatus 1 one by one by the supply mechanism 202.

  The supply mechanism 202 includes an arm 203, a rotation mechanism 203A that rotates the arm 203, and a vertical drive unit 204 that moves the arm 203 up and down. The arm 203 is attached to an arm support rod 205 extending downward from the vertical drive unit 204 via a rotation mechanism 203A. In the arm drive unit 204, a motor (or an air cylinder or a hydraulic cylinder) (not shown) that drives the arm support rod 205 in the vertical direction is provided. Then, the arm 203 is moved in the vertical direction by the arm support rod 205 being displaced in the vertical direction by this motor (not shown).

  The rotation mechanism 203A includes a motor (not shown) fixed to the arm support rod 205 and a pair of bevel gears (not shown) whose rotation axes are orthogonal to each other. Of the pair of bevel gears (not shown), one bevel gear (not shown) is supported on the output shaft of a motor (not shown), and the other bevel gear (not shown) supports the arm 203. . When a motor (not shown) of the rotating mechanism 203A is driven, the arm 203 is rotated in a horizontal plane around the arm support rod 205 by a pair of bevel gears (not shown), and the arm 203 itself is horizontally It rotates around the axis in the direction along the direction.

  A pickup 206 that picks up the IC chip 100 placed on the IC chip mounting table 201 by sucking air is provided at the tip of the arm 203. A suction hole (not shown) through which air is sucked in by an air suction device (not shown) is formed in the lower surface portion 206A of the pickup 206 facing the IC chip mounting table 201. The IC chip 100 is picked up from the IC chip mounting table 201 by the air suction force by the suction holes (not shown).

  The supply apparatus 200 configured as described above supplies the IC chip 100 to the ultrasonic vibration bonding apparatus 1 as follows.

  First, the IC chip 100 on the IC chip mounting table 201 is sucked into the lower surface portion 206 </ b> A of the pickup 206. In other words, the arm support rod 205 is displaced downward by the arm driving unit 204, and the lower surface portion 206A of the pickup 206 is brought close to and opposed to the IC chip 100. Then, the IC chip 100 is adsorbed by the air suction force of a suction hole (not shown) formed in the lower surface portion 206A of the pickup 206.

  Subsequently, the arm support rod 205 is displaced upward by the arm driving unit 204 while the IC chip 100 is attracted to the pickup 206. At the same time, the arm 203 is rotated in the horizontal direction around the arm support rod 205 by the rotation mechanism 203A, and the pickup 206 is moved to the ultrasonic vibration bonding apparatus 1 side. At the same time, the arm 203 rotates about an axis in the horizontal direction, the pickup 206 that sucks the IC chip 100 is turned upside down, and the lower surface portion 206A that sucks the IC chip 100 faces upward.

  In the present embodiment, supply device 200 is arranged to be located on the left front side with respect to ultrasonic vibration joining device 1. Accordingly, from the position where the pickup 206 sucks the IC chip 100, the arm 203 is rotated about 90 degrees in the horizontal direction around the arm support rod 205 toward the ultrasonic vibration bonding apparatus 1, and the arm 203 is moved in the horizontal direction. The IC chip 100 faces the welding tool part 4 as a holding part described later by rotating the pickup 206 up and down by rotating 180 degrees around the axis in the direction along the axis.

  The IC chip mounting table 201 is configured to move back and forth and right and left by a driving mechanism (not shown) so that the IC chips 100 housed in the container P are sequentially sucked by the pickup 206 one by one. ing.

  As will be described later, a suction hole 4 </ b> A (see FIG. 2) that is an air suction hole is formed in the joining tool portion 4, as with the pickup 206. In the suction hole 4A, air is sucked by an air suction device (not shown), and the IC chip 100 is sucked by sucking the air. In addition, the joining tool part 4 may have a configuration in which the IC chip 100 is attracted by air suction, a configuration in which the IC chip 100 is gripped by a chuck mechanism, or a configuration in which the IC chip 100 is magnetized by a magnetic force.

  In a state where the IC chip 100 sucked by the pickup 206 is opposed to the welding tool portion 4 in the proximity or contact, the suction force for sucking the IC chip 100 of the pickup 206 is weakened. Then, the IC chip 100 is attracted from the pickup 206 to the joining tool part 4 side by the suction force of the joining tool part 4.

  By the way, the IC chip 100 is placed on the IC chip mounting table 201 with the side to be joined to the flexible circuit board 101 facing upward. Therefore, when the pickup 206 is turned upside down by the rotation mechanism 203A, the IC chip 100 attracted to the pickup 206 is directed downward on the side bonded to the flexible circuit board 101. When the IC chip 100 is attracted to the joining tool portion 4 in this direction, the side to be joined to the flexible circuit board 101 is directed to the flexible circuit board 101 side.

  As described above, the IC chip 100 is supplied from the supply device 200 to the ultrasonic vibration bonding apparatus 1.

  Next, the configuration of the ultrasonic vibration bonding apparatus 1 will be briefly described.

  As shown in FIG. 1, the ultrasonic vibration bonding apparatus 1 includes a flexible circuit board mounting table (hereinafter referred to as “FPC mounting table”) 5 on which a flexible circuit board 101 is mounted, and an IC chip 100. A pressing vibration device 6 for pressing and vibrating the flexible circuit board 101 is provided. Both the FPC mounting table 5 and the pressing vibration device 6 are attached to the gantry 7. The pressing vibration device 6 is attached to the gantry 7 by a support column (not shown).

  The FPC mounting table 5 passes through the rear side of the supply device 200 and the flexible circuit board 101 having a strip shape supplied to the upper surface of the FPC mounting table 5 is repeatedly moved and stopped from the left to the right. A conveyance device (not shown) that conveys intermittently is provided.

  The flexible circuit board 101 mounted on the FPC mounting table 5 is a copper foil on a tape for a so-called COF (Chip On Film or Chip On Flexible Circuit Board) which is made of a flexible thin resin film such as a polyimide. Wiring, electrode terminals, etc. are formed by the above. Specifically, as shown in FIG. 4, it has a strip shape in which a plurality of identical unit substrates 102 are continuously formed. Each unit substrate 102 has a predetermined wiring pattern 102a and electrode terminals 102b formed in advance on the surface thereof. In addition, on both sides of the flexible circuit board 101, a perforation 101a that engages with a feed gear provided in a transport device (not shown) is formed.

  When the IC chip 100 is stacked on the unit substrate 102, the electrode terminal 102b and the IC chip 100 are arranged such that the electrode terminal 102b of the unit substrate 102 and the electrode terminal (not shown) on the IC chip 100 side are in contact with each other and overlap. A side electrode terminal (not shown) is provided. Then, in a state where the electrode terminals (not shown) of the IC chip 100 overlap the electrode terminals 102b of the unit substrate 102, the IC chip 100 is vibrated while being pressed against the unit substrate 102, as will be described later. The electrode terminal 102b of the unit substrate 102 and the electrode terminal (not shown) of the IC chip 100 are joined to each other. That is, the IC chip 100 is bonded to the flexible circuit board 101 to form a COF.

  The pressing vibration device 6 includes the vibration device 2 and a lifting device 8.

  The vibration device 2 includes an ultrasonic mounting tool 60 and the like. The ultrasonic mounting tool 60 includes a vibrator 10A including a vibration element 9 that oscillates ultrasonic vibration and a horn 10B. The vibration element 9 is configured to oscillate ultrasonic vibration by a piezoelectric effect when a DC voltage is applied to a piezoelectric element such as piezoelectric ceramics. Note that the vibration element 9 may be configured to oscillate ultrasonic vibration by the magnetostrictive effect.

  The ultrasonic mounting tool 60 has a rectangular column that is long in the left-right direction as a whole, and is formed from a material such as an iron alloy, a silver alloy, a copper alloy, a titanium alloy, or an aluminum alloy in a dense but not porous manner. The length of the horn 10B in the longitudinal direction is set to 1.0 times the wavelength when the vibration input from the vibration element 9 propagates through the horn 10B. The vibrator 10A is also densely formed from a material such as an iron alloy, a silver alloy, a copper alloy, a titanium alloy, or an aluminum alloy. The length in the longitudinal direction of the vibrator 10 </ b> A is set to 0.5 times the vibration oscillated from the vibration element 9. That is, the ultrasonic mounting tool 60 is configured to be 1.5 times as long as the vibration oscillated from the vibration element 9 as a whole.

  By forming the vibrator 10 </ b> A and the horn 10 </ b> B to be dense rather than porous, vibration attenuation can be suppressed and vibration can be transmitted to the horn 10 </ b> B. In addition, by setting the length of the horn 10B to an integral multiple of half the wavelength of the vibration propagating through the ultrasonic mounting tool 60, the vibration input to the horn 10B resonates within the horn 10B, so that the vibration is generated. Amplified. Note that the horn 10B is not limited to a rectangular column, and may be a cylindrical body or a hexagonal column.

  In the present embodiment, as described above, the horn 10B is set to have a length that is 1.0 times the wavelength of vibration of the vibration element 9, but is not limited thereto, and is 0.5 times or 1.5 times longer. , 2.0 times, etc.

  The ultrasonic mounting tool 60 is supported by the ultrasonic vibration joining device 1 by attaching the horn 10B to the vibration device support rod 11 extending downward from the lifting device 6 via the horn support arm 12. Yes. That is, the horn support arm 12 serves as a support member that supports the ultrasonic mounting tool 60 with respect to the ultrasonic vibration bonding apparatus 1. The horn support arm 12 is fixed to the vibration device support rod 11 at the lower end of the vibration device support rod 11.

  The horn support arm 12 has a substantially U-shape having two support columns 12A and 12B extending in the vertical direction, and an attachment rod 12C connecting the two support columns 12A and 12B. The horn support arm 12 is attached to the vibration device support rod 11 by an attachment rod 12C. The horn 10B is attached to the support columns 12A and 12B.

  A joining tool portion 4 that holds the IC chip 100 supplied from the supply device 200 is provided on the lower surface of the horn 10B. The support pillars 12A and 12B are attached to the horn 10B on both sides in the left-right direction of the welding tool portion 4.

  Two heaters 13A and 13B are provided between the joining tool portion 4 and the support columns 12A and 12B. The heaters 13A and 13B have a cylindrical body (see FIG. 2B) extending in the front-rear direction. The heaters 13A and 13B are arranged so as to penetrate the horn 10B in the front-rear direction. The heaters 13A and 13B penetrating the horn 10B in the front-rear direction are supported by the heater support arm 14. The heater support arm 14 is attached to the lower surface of the attachment rod 12C of the horn support arm 12.

  The ultrasonic mounting tool 60 is provided with the cooling pipe 3. The cooling pipe 3 is disposed between the heater 13A on the vibration element 9 side and the vibration element 9 among the heaters 13A and 13B provided in the horn 10B.

  The lifting device 8 is attached to the vibration device support rod 11 via the horn support arm 12 by moving the vibration device support rod 11 up and down by a motor (or an air cylinder or a hydraulic cylinder) (not shown). The ultrasonic mounting tool 60 is configured to move up and down. As described above, the ultrasonic mounting tool 60 includes the vibrator 10A, the horn 10B, the heaters 13A and 13B, the heater support arm 14 that supports the heaters 13A and 13B, and the like, and the vibration device 2 is configured. Therefore, moving the vibration device support rod 11 up and down moves the vibration device 2 up and down.

  Next, an outline of the process of bonding the IC chip 100 to the flexible substrate 101 by the ultrasonic vibration bonding apparatus 1 configured as described above will be described.

  First, in a state where the ultrasonic mounting tool 60 (vibration device 2) is moved upward by the lifting device 8, the supply of the IC chip 100 is received from the supply device 200 to the joining tool portion 4. Then, the supplied IC chip 100 is sucked by sucking air through the suction holes 4 </ b> A and held in the joining tool portion 4. Subsequently, the vibration device support rod 11 of the elevating device 8 is lowered, the ultrasonic mounting tool 60 (vibration device 2) is moved downward, and the unit substrate of the flexible circuit board 101 placed on the FPC placement table 5 An electrode portion (not shown) of the IC chip 100 is brought into contact with the electrode 102b of the 102. In the flexible circuit board 101, when the ultrasonic mounting tool 60 (vibration device 2) is moved downward, the electrode terminal 102b of the unit board 102 is brought into contact with the electrode portion (not shown) of the IC chip 100. In addition, the arrangement position is set. Instead of pressing the IC chip 100 against the unit substrate 102 by the lifting device 7, a pressing mechanism that presses the IC chip 100 against the unit substrate 102 may be provided separately from the lifting device 7. . The pressing mechanism is composed of, for example, an air cylinder.

  In a state where the electrode part (not shown) of the IC chip 100 and the electrode terminal 102b of the unit substrate 102 are in contact with each other, the lifting device 8 lightly presses the IC chip 100 against the unit substrate 102, A pressing force is applied to the substrate 102. Then, the ultrasonic mounting tool 60 is vibrated by the vibration element 9, and the IC chip 100 is reciprocally oscillated in the left-right direction with respect to the unit substrate 102. As described above, the IC chip 100 is reciprocated in the left-right direction with respect to the unit substrate 102 in a state where a pressing force is applied between the electrode portion (not shown) of the IC chip 100 and the electrode terminal 102 b of the unit substrate 102. By vibrating, friction is generated between the electrode part (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side. Due to this friction, the electrode portion (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side are solid-phase bonded.

  In addition to friction between the above-described electrode portion (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side, the friction portion is heated by the heaters 13A and 13B. The speed at which the electrode portion (not shown) and the electrode terminal 102b on the unit substrate 102 side are joined is increased, and the joining strength is improved.

  Then, after the bonding of the IC chip 100 to the unit substrate 102 is completed, the suction of the IC chip 100 to the bonding tool portion 4 is stopped, the atmosphere is leaked, and the lifting device 8 is driven to drive the ultrasonic mounting tool 60 ( The vibration device 2) is moved upward. Since the IC chip 100 is bonded to the unit substrate 102, it remains on the unit substrate 102 side. That is, the bonding of the IC chip 100 to the unit substrate 102 is completed.

  Next, the flexible circuit board 101 is transported to the right side by the length 102L of the unit board 102. By this conveyance, the unit substrate 102 that is adjacent to the left of the unit substrate 102 to which the IC chip 100 has been bonded is disposed at a position directly below the bonding tool unit 4. Thereafter, the above-described process of bonding the IC chip 100 to the flexible substrate 101 is repeated, and the IC chips 100 are sequentially bonded onto the unit substrate 102 of the flexible circuit substrate 101. In this way, the unit substrate 102 is cut out from the flexible circuit board 101 in which the IC chip 100 is bonded to each unit substrate 102. Each of the cut unit substrates 102 is used as a circuit component such as one electric product. The length of the unit substrate 102 is set to 2 to 8 times as an integer multiple of the distance between the perforations 101a, as shown in FIG.

  Next, the configuration of the vibration device 2 and the configuration of the cooling pipe 3 provided in the ultrasonic mounting tool 60 will be described in more detail with reference to FIGS. 2 and 3.

  FIG. 2A is a front view of the vibration device 2 viewed from the front, and FIG. 2B is a bottom view of the vibration device 2 viewed from below. FIG. 2C is a diagram showing the relationship between the position of the ultrasonic mounting tool 60 in the left-right direction and the amplitude with respect to the vibration propagating through the transducer 10A and the horn 10B, that is, the ultrasonic mounting tool 60. The horizontal axis in FIG. 2C corresponds to the position in the left-right direction of the ultrasonic mounting tool 60, and the vertical axis indicates the amplitude at each position. FIG. 3 is a diagram showing a configuration of the cooling pipe 3 provided in the ultrasonic mounting tool 60, and the cooling pipe 3 is a cross-sectional view cut along a plane in the left-right and up-down directions.

  The vibration oscillated from the vibration element 9 is input to the horn 10B and propagates through the horn 10B as a longitudinal wave that vibrates in the left-right direction of the horn 10B. In FIG. 2C, the amplitude is shown in a direction orthogonal to the horizontal axis (position) direction, and this amplitude corresponds to the amount of displacement (amplitude) in the left-right direction at each position of the horn 10B. Therefore, the displacement amount in the left-right direction is large at the position of the horn 10B corresponding to the position having a large amplitude, and the displacement amount in the left-right direction is small at the position of the horn 10B corresponding to the position having a small amplitude. The position of the horn 10B corresponding to the portion where the amplitude is maximum, that is, the abdominal portion M which is the top and valley of the waveform of FIG. Conversely, the position of the horn 10B corresponding to the node portion S where the amplitude is 0, that is, the portion where the waveform of FIG. 2C intersects the horizontal axis, has the smallest amount of displacement in the left-right direction.

  Horn 10B shown in the present embodiment is set to a length that is 1.0 times the wavelength of vibration propagating through horn 10B. For example, when the vibration element 9 oscillates ultrasonic vibration of 40 kHz and the horn 10B is formed of an iron alloy (acoustic wave transmission speed of about 5000 m / s), the length of the horn 10B in the left-right direction is approximately 120 mm. Thus, by setting the length of the horn 10B to an integral multiple of the half wavelength of the vibration propagating through the horn 10B, the vibration propagating through the horn 10B resonates and the vibration is amplified. The thickness of the horn 10B is set to a thickness of 10 to 50 mm square so that the horn 10B does not become too thick, that is, the size of the vibration device 2 is suppressed, and the vibration propagation efficiency is suppressed. Can be made good. In this embodiment, it is set to 16 mm square.

  In the present embodiment, the vibration element 9 is disposed in a range of a quarter wavelength from the left end of the vibrator 10A. The vibration oscillated from the vibration element 9 is transmitted to the horn 10B through the vibrator 10A, resonates in the horn 10B, and propagates through the horn 10B as the vibration having the amplitude shown in FIG.

  The joining tool part 4 is arrange | positioned in the position of the distance of 0.5 wavelength from the left end of the horn 10B. The joining tool portion 4 includes a pedestal portion 4B that protrudes downward, and a suction hole 4A that passes vertically through the horn 10B through the pedestal portion 4B. The lower surface part of the base part 4B is formed in the plane part 4C parallel to the horizontal plane.

  The suction hole 4A is connected to an air suction device (not shown), and suction is performed so that air is sucked upward from below. Therefore, when the IC chip 100 is supplied from the supply device 200 to the joining tool part 4, the supplied IC chip 100 is attracted and held on the flat surface part 4C of the base part 4B by the air suction force of the suction hole 4A. .

  The horn 10B is attached to the support columns 12A and 12B of the horn support arm 12 by screws 15A and 15B at positions of the quarter wavelength and the quarter wavelength from the left end. The screws 15A and 15B are passed through screw insertion holes 16A and 16B penetrating the horn 10B in the vertical direction, and a part of the tip end side protrudes from the upper surface of the horn 10B. The horn 10B is attached to the horn support arm 12 by screwing the support pillars 12A and 12B to parts of the distal ends of the screws 15A and 15B protruding from the upper surface of the horn 10B. That is, the ultrasonic mounting tool 60 is attached to the horn support arm 12.

  The positions of the 1/4 wavelength and 3/4 wavelength from the left end of the horn 10B, where the support columns 12A, 12B of the horn support arm 12 are attached to the horn 10B, are positions corresponding to the vibration node S. As described above, this node is a position where the amplitude in the left-right direction is minimized, and the displacement amount of the position of the horn 10B corresponding to this node S is a position (abdomen M and abdomen M not corresponding to the other nodes S). And between the joint S). Therefore, the horn support arm 12 supports the horn 10B at the position corresponding to the node S, so that the amount of vibration of the horn 10B transmitted to the horn support arm 12 side can be reduced.

  On the other hand, for example, when the horn support arm 12 supports the horn 10B at a portion corresponding to the abdomen M, the horn support arm 12 vibrates with the vibration of the abdomen M in the left-right direction. For this reason, the vibration of the horn 10B is transmitted to the ultrasonic vibration bonding apparatus 1 side, causing a problem that the entire ultrasonic vibration bonding apparatus 1 vibrates. Accordingly, by supporting the horn 10B with the horn support arm 12 at a position corresponding to the node portion S, occurrence of such a problem can be suppressed.

  Between the suction hole 4A and the screw insertion hole 16A, and between the suction hole 4A and the screw insertion hole 16B, the heater insertion holes 17A that penetrate the horn 10B in the front-rear direction and the heaters 13A and 13B, respectively. 17B is formed. The heater insertion hole 17A is formed approximately at the center between the screw insertion hole 16A and the suction hole 4A, and the heater insertion hole 17B is also formed approximately at the center between the screw insertion hole 16B and the suction hole 4A.

  The heaters 13A and 13B are respectively passed through the heater insertion holes 17A and 17B and supported by the heater support arm 14. The heaters 13A and 13B include, for example, a ceramic heater in which a heating element (not shown) such as a nichrome wire that is energized and heated by conductive wires 18A and 18B connected to a power supply unit (not shown) is embedded in ceramics. To do. The heaters 13A and 13B are sheathed heaters, cartridge heaters, or heating elements (not shown) in which a heating element such as a nichrome wire is disposed in a metal sheath (pipe) and the periphery thereof is solidified with an insulator (magnesium oxide or the like). ) May be used as a silicon heater having a structure in which the periphery of the substrate is covered with silicon rubber.

  The heater support arm 14 includes an attachment rod 14A for fixing the heater support arm 14 to the horn support arm 12, and heater support plates 14B and 14C provided on the left and right sides of the attachment rod 14A. The heater support plates 14B and 14C are provided as a pair of front and rear, two on each side of the mounting rod 14A. The heater support plates 14B and 14C have lower tips positioned in front of and behind the horn 10B, respectively.

  A heater support hole 14D is formed at a position facing the heater insertion hole 17A formed in the horn 10B in the heater support column 14B disposed before and after the horn 10B. Similarly, a heater support hole 14E is formed at a position facing the heater insertion hole 17B formed in the horn 10B in the heater support column 14C which is also disposed in front of and behind the horn 10B.

  The heater 13A is inserted into the heater insertion hole 17A with the front and rear portions being inserted into the heater support hole 14D and supported by the heater support column 14B. The heater 13B is also inserted into the heater insertion hole 17B with the front and rear portions being inserted into the heater support hole 14E and supported by the heater support column 14C. The heater 13A is fixed to the heater support hole 14D with a heat resistant adhesive or the like so that the heater 13A does not fall out of the heater support hole 14D. The heater 13B is also fixed to the heater support hole 14E with a heat-resistant adhesive or the like so that the heater 13B does not fall out of the heater support hole 14E. Note that the heater support holes 14D and 14E that support the heaters 13A and 13B do not have to be fixed with a heat-resistant adhesive or the like and do not have to be through-holes as long as the heaters 13A and 13B do not fall out.

  The heater insertion holes 17A and 17B formed in the horn 10B are formed in such a size that a gap is formed with respect to the heaters 13A and 13B inserted therein. The size of the gap is larger than the magnitude of the vibration in the left-right direction of the horn 10B at the position where the heater insertion holes 17A and 17B are formed, that is, the amount of displacement.

  The heater support arm 14 that supports the heaters 13 </ b> A and 13 </ b> B is fixed to the horn support arm 12 that is fixed to the ultrasonic vibration bonding apparatus 1. Therefore, the heaters 13A and 13B are fixed to the ultrasonic vibration bonding apparatus 1. On the other hand, the position where the heater insertion holes 17A and 17B are formed is not the node S of the horn 10B, and thus vibrates in the left-right direction with respect to the ultrasonic vibration bonding apparatus 1.

  Therefore, when there is no gap between the heaters 13A and 13B and the heater insertion holes 17A and 17B, a force that pushes and bends left and right between the horn 10B and the heater support arm 14 acts on the heaters 13A and 13B. As a result, the heaters 13A and 13B may be damaged.

  Therefore, as described above, by providing a gap between the heaters 13A and 13B and the heater insertion holes 17A and 17B, the heaters 13A and 13B are pushed against the heaters 13A and 13B even when the horn 10B vibrates in the left-right direction. It is possible to prevent the bending force from acting.

  As described above, the gap between the heater insertion holes 17A and 17B and the heaters 13A and 13B inserted therein is formed to be larger than the horizontal displacement of the horn 10 at the heater insertion holes 17A and 17B. Thus, the vibrating horn 10B does not collide with the heaters 13A and 13B. Therefore, the stress that the horn 10B pushes and bends the heaters 13A and 13B can be completely eliminated.

  On the other hand, if the stress that pushes and bends the heaters 13A and 13B acting between the horn 10B and the heater support arm 14 is such that the heaters 13A and 13B are not damaged, the heater insertion holes 17A and 17B and the heaters 13A and 13B May be less than the amount of displacement of the horn 10B in the horizontal direction of the heater insertion holes 17A and 17B, and the horn 10B may slightly collide with the heaters 13A and 13B. When no gap is provided between the heaters 13A and 13B and the heater insertion holes 17A and 17B, the vibration of the horn 10B reaches the heaters 13A and 13B as it is, and a stress that greatly pushes and bends the heaters 13A and 13B. Although acting, this push bending stress can be reduced by forming a gap.

  A portion on the right side (horn 10B side) of the vibrator 10A is formed as a cooling pipe mounting portion 10C to which the cooling pipe 3 is mounted. The cooling pipe 3 is attached to the cooling pipe attachment portion 10C. Therefore, the ultrasonic mounting tool 60 is provided with the cooling pipe 3 between the heater 13A on the vibration element 9 side of the two heaters 13A and 13B and the vibration element 9. The cooling pipe 3 is a donut-shaped annular body 3A, and a hollow part 20 having an opening 19 is formed over the entire circumference on the cooling pipe mounting part 10C side which is the inner peripheral side thereof. That is, the annular body 3A has the shape of a tire as a whole, the inside is a hollow portion 20 that extends over the entire circumference, and the inner peripheral side is an opening 19 of the hollow portion 20 over the entire circumference.

  The left and right peripheral edge portions 19A of the opening 19 of the annular body 3A are provided with O-rings 21 over the entire circumference so as to contact the cooling pipe mounting portion 10C. The annular body 3A including the O-ring 21 is formed of a rubber material. Therefore, the cooling pipe 3 has elasticity as a whole. In addition, you may form from the raw material which has elasticity, such as a urethane resin and a silicone rubber other than a rubber material.

  The inner peripheral side of the O-ring 21 of the cooling pipe 3 is formed as a circular hole portion 22 that extends in the left-right direction, and a cooling pipe mounting portion 10C is passed through the hole portion 22 as will be described later. It is attached to the mounting tool 60.

  The vibrator 10 </ b> A has a cylindrical shape whose longitudinal direction is the left-right direction. The vibrator 10A is accommodated in a cover 10A 'that has a substantially rectangular parallelepiped for the 1/4 wavelength portion from the left end, and is exposed from the cover 10A' between the 1/4 wavelength and 2/4 wavelength (right end) from the left end. This portion is formed as a cooling pipe mounting portion 10C. The vibration element 9 is a laminated body of disks.

  A screw portion 10D is formed at the end portion 10Ct of the cooling pipe mounting portion 10C, and a screw hole 10E into which the screw portion 10D is screwed is formed at the left end portion 10Bt of the horn 10B. Therefore, the ultrasonic mounting tool 60 can be separated into the vibrator 10A and the horn 10B at the screw portion 10D and the screw hole 10E. Further, the separated vibrator 10A and horn 10B are integrated with each other by being screw-coupled at the screw portion 10D and the screw hole 10E.

  The cooling pipe 3 is attached to the ultrasonic mounting tool 60 through the cooling pipe mounting part 10 </ b> C in the hole 22. Therefore, when the cooling pipe 3 is attached to the vibrator 10A, the hole 22 of the cooling pipe 3 is passed through the cooling pipe attachment part 10C with the vibrator 10A removed from the horn 10B. And the vibrator | oscillator 10A which let the cooling pipe 3 pass to the cooling pipe attachment part 10C is integrated with the horn 10B by the screw connection by the screw part 10D and the screw hole 10E.

  The outer diameter of the cooling pipe mounting portion 10C and the inner diameter of the hole portion 22 are formed so that the latter (inner diameter of the hole portion 22) is slightly smaller than the former (outer diameter of the cooling pipe mounting portion 10C). The cooling pipe 3 is formed of a rubber material including the O-ring 21. Therefore, adhesion between the inner peripheral edge of the O-ring 21 and the outer peripheral surface of the cooling pipe mounting portion 10C is ensured by forming the inner diameter of the hole 22 slightly smaller than the outer diameter of the cooling pipe mounting portion 10C. become. Therefore, as will be described later, when the refrigerant flows through the cooling pipe 3, the leakage of the refrigerant is prevented.

  By the way, until the cooling pipe 3 is attached to the cooling pipe mounting portion 10C, the opening 19 is formed on the inner peripheral side, so that the cooling pipe 3 is not a tubular body, but is attached to the cooling pipe mounting portion 10C. As a result, the opening 19 is closed by the peripheral surface of the cooling pipe mounting portion 10C, and thus functions as a tubular body.

  Above and below the cooling pipe mounting portion 10 </ b> C on the left side of the cooling pipe 3, an intake inflow pipe 23 that allows air as a refrigerant to flow into the cooling pipe 3 and an air discharge pipe that discharges air inside the cooling pipe 3. 24 is attached.

  The air sent from the intake inflow pipe 23 to the cooling pipe 3 flows in the hollow portion 20 along the outer periphery of the cooling pipe mounting portion 10 </ b> C, and is discharged from the air discharge pipe 24. That is, air flows in the cooling pipe 3, that is, in the hollow portion 20 from the air inflow pipe 23 side toward the air discharge pipe 24 side. Therefore, the heat conducted from the heaters 13A and 13B to the horn 10B and the cooling pipe mounting portion 10C is cooled by the air flowing through the cooling pipe 3. That is, the temperature of the heat that reaches the vibration element 9 through the horn 10B from the heaters 13A and 13B can be lowered. Therefore, the temperature of the vibration element 9 is stabilized and the characteristics can be stabilized.

  Since air directly contacts the cooling pipe mounting portion 10C, the cooling pipe mounting portion 10C can be cooled with high cooling efficiency. Further, since no hole for cooling is formed in the vibrator 10A or the horn 10B, vibration from the vibration element 9 does not interfere with propagation through the vibrator 10A and the horn 10B. In addition, since the cooling pipe 3 is configured to cool the cooling pipe mounting portion 10C which is a part of the vibrator 10A, it is possible to suppress an increase in the size of the ultrasonic vibration bonding apparatus 1.

  In addition, about the refrigerant | coolant which flows into the cooling pipe 3, 10 C of cooling pipe attaching parts can be cooled more effectively by flowing gas with higher heat conductivity than air, such as hydrogen and helium other than air. In addition to the gas, water, liquid nitrogen, or liquid helium can be flowed to cool the cooling pipe mounting portion 10C more efficiently. Considering a case where an accident in which the refrigerant leaks occurs between the cooling pipe mounting portion 10C and the O-ring 21 or the like, the refrigerant is more gas than the liquid. The impact is small. However, for those that are easily vaporized, such as liquid nitrogen and liquid helium, high cooling efficiency can be expected, and the influence on the ultrasonic vibration bonding apparatus 1 and the like due to leakage is small.

  In addition, 10 C of cooling pipe attachment parts can be cooled more by cooling previously refrigerant | coolants, such as air sent into the cooling pipe 3 from the intake inflow pipe 23 to low temperature with a cooling device etc. FIG.

  The entire cooling pipe 3 including the O-ring 21 is made of a rubber material. Therefore, since the cooling pipe 3 has elasticity by a rubber material, the vibration of the cooling pipe mounting portion 10C is absorbed. Therefore, it is possible to prevent the cooling pipe 3 from moving in the left-right direction due to the vibration of the cooling pipe mounting portion 10C.

  The cooling pipe 3 may be made of a rubber material only for the O-ring 21, and the other part may be made of a material having lower elasticity than a rubber material such as a polycarbonate material or a polyethylene resin material. Even in such a configuration, the vibration is absorbed by the rubber O-ring 21, so that the movement of the cooling pipe 3 in the left-right direction due to the vibration of the cooling pipe mounting portion 10 </ b> C can be suppressed. By forming the entire cooling pipe 3 including the O-ring 21 from a rubber material, vibration can be absorbed more effectively than using only the O-ring 21 as a rubber material.

  The horizontal width W of the cooling pipe 3 is set to be shorter than the horizontal length of the cooling pipe mounting portion 10C. In the present embodiment, the length in the left-right direction of the cooling pipe mounting portion 10C is set to ¼ wavelength as described above. By setting the horizontal width W of the cooling pipe 3 to be shorter than the horizontal length of the cooling pipe mounting part 10C, the cooling pipe 3 can be moved in the horizontal direction within the range of the length of the cooling pipe mounting part 10C. it can. Thus, by being able to move in the left-right direction of the cooling pipe 3, the vibration balance of the ultrasonic mounting tool 60 can be adjusted.

(Second Embodiment)
5 and 6 show an ultrasonic vibration bonding apparatus 30 according to the second embodiment of the present invention.

  While the horn 10B of the ultrasonic vibration bonding apparatus 1 according to the first embodiment is set to a length that is 1.0 times the wavelength of vibration propagating through the horn 10B, the second embodiment is used. The horn 31B of the ultrasonic vibration bonding apparatus 30 according to the above is set to a length of 0.5 times the wavelength.

  5 and 6, members and configurations similar to those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  FIG. 5 is a diagram showing an outline of a process of bonding the IC chip 100 that is the bonding target to the flexible substrate 101 that is the bonding target object using the ultrasonic vibration bonding apparatus 30. FIG. 6 is a diagram illustrating a configuration of the vibration device 32 provided in the ultrasonic vibration bonding device 30. FIG. 6A is a front view of the vibration device 32 as viewed from the front, and FIG. 6B is a bottom view of the vibration device 32 as viewed from below. FIG. 6C is a diagram showing the relationship between the position of the ultrasonic mounting tool 61 in the left-right direction and the amplitude with respect to the vibration propagating through the transducer 31A and the horn 31B, that is, the ultrasonic mounting tool 61. The horizontal axis in FIG. 6C corresponds to the horizontal position of the ultrasonic mounting tool 61, and the vertical axis indicates the amplitude at each position.

  As described above, in the ultrasonic vibration bonding apparatus 30, the length in the left-right direction of the horn 31B is set to 0.5 times the wavelength of vibration propagating through the horn 31B. That is, since the horn 31B is formed of an iron alloy and the vibration element 9 oscillates ultrasonic vibration of 40 kHz, the length of the horn 31B is set to approximately 62 mm. The thickness of the horn 31B is set to about 16 mm square. The ultrasonic mounting tool 61 includes a vibrator 31A including the vibration element 9 and a horn 31B.

  The ultrasonic mounting tool 60 in the ultrasonic vibration welding apparatus 1 according to the first embodiment is configured so that the horn 10B sandwiches the bonding tool part 4 and the left and right sides of the ultrasonic mounting tool 60 with respect to the ultrasonic vibration bonding apparatus 1 by the horn support arms 12. It was supported. The ultrasonic mounting tool 61 is light in weight because the horn 31B is shorter in the left-right direction than the horn 10B of the first embodiment. Therefore, the ultrasonic mounting tool 61 is directly supported with respect to the vibration device support rod 11 only at one portion of the node S located at a quarter wavelength from the left end of the horn 31B. In addition, the joining tool part 4 is arrange | positioned by the position of the abdominal part M in the position of the left end of the horn 31B.

  The horn 31 </ b> B is attached to the vibration device support rod 11 with a screw 33 at a position supported by the vibration device support rod 11. The screw 33 is passed through a screw insertion hole 34 that penetrates the horn 31B in the vertical direction, and a part of the tip side protrudes from the upper surface of the horn 31B. The ultrasonic mounting tool 61 is attached to the vibration device support rod 11 by a part of the tip side of the screw 33 protruding from the upper surface of the horn 31 </ b> B being screw-coupled to the vibration device support rod 11. In addition, in the site | part corresponding to the node part S of horn 31B, the quantity which the vibration of horn 31B is transmitted to the vibration device support rod 1 side becomes small by supporting the ultrasonic mounting tool 61 with respect to the vibration device support rod 11. .

  The heater support arm 14 that supports the heaters 13A and 13B is directly attached to the vibration device support rod 11 on the right side end face of the attachment rod 14A.

Also in the ultrasonic vibration bonding apparatus 30 according to the second embodiment, the vibrator 31A has a cylindrical shape whose longitudinal direction is the left-right direction. The cooling pipe 3 is attached to a cooling pipe attachment portion 31C formed on the right side (horn 31B side) of the vibrator 31A. That is, the portion of the vibrator 31A in a range slightly shorter than a quarter wavelength from the left end is accommodated in the cover 31A ′, and the portion to the heater insertion hole 17A exposed on the right side of the cover 31A ′ is the cooling pipe attachment portion 31C. Is formed. The length of the cooling pipe attachment portion 31C, that is, the length from the portion corresponding to the right end of the cover 31A ′ to the heater insertion hole 17A is formed to be about three times the lateral width W of the cooling pipe 3. ing. In the second embodiment, the cooling pipe 3 is attached to the cooling pipe attachment portion 31C at the node S.

  A screw hole 31D is formed in the right end portion 31Ct of the cooling pipe mounting portion 31C, and a screw portion 31E that is screw-coupled to the screw hole 31D is formed in the end portion 31Bt of the horn 31B. Therefore, the vibrator 31A and the horn 31B can be separated at the screw hole 31D and the screw 31E, and are integrally formed by screw connection at the screw hole 31D and the screw part 31E.

  The cooling pipe 3 is attached to the horn 31 by passing the cooling pipe attachment part 31C through the hole 22 of the cooling pipe 3 with the vibrator 31A removed from the horn 31B. Then, the vibrator 31A is integrated with the horn 31B by screw connection using the screw hole 31D and the screw portion 31E.

  About the structure and effect | action of the cooling pipe 3, it is the same as that of the content demonstrated in the above-mentioned 1st Embodiment.

  By the way, the cooling pipe 3 in the ultrasonic vibration bonding apparatuses 1 and 30 described above has an annular body in which the hollow portion 20 is formed over the entire circumference, and an opening 19 is formed on the inner circumferential side. On the other hand, by winding a hose-like tube (tubular body) along the periphery of the cooling pipe mounting portion 10C or the cooling pipe mounting portion 31C and flowing a refrigerant such as air or liquid nitrogen into the tube, The horn 10 or the horn 31 may be cooled.

(Modification)
FIG. 7 shows a modification example of the vibration device 2 in the ultrasonic vibration bonding apparatus 1 according to the first embodiment of the present invention as the vibration device 40. In FIG. 7, members and configurations similar to those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The vibration device 40 is an elastic support tube, whereas the vibration device 2 according to the first embodiment is attached to the support columns 12A and 12B of the horn support arm 12 by screws 15A and 15B. The ultrasonic bonding tool 62 is attached to the horn support arm 12 via 41A and 41B.

  The support tube 41A is disposed between the heater 13A and the vibration element 9, and the structure thereof is the same as that of the cooling tube 3 described above. Accordingly, the support tube 41A serves to support the ultrasonic bonding tool 62 with respect to the support column 12A of the horn support arm 12, and cools heat conducted from the heaters 13A and 13B to the vibration element 9 via the horn 42B. It plays the role of The support pipe 41B has the same configuration as the support pipe 41A except that the support pipe 41B does not have the air inflow pipe 23 and the air discharge pipe 24. Since the refrigerant does not flow through the support tube 41B, it does not serve to cool the horn 42B. 7 illustrates the structure in which the support tubes 41A and 41B are arranged at the point M which is the vibration antinode, but other than the antinode may be used as long as it can be structurally arranged, and at the point S which is a vibration node. It is better to arrange. Further, the holes of the support tubes 41A and 41B into which the ultrasonic vibration mounting tool 62 is inserted may be circular or rectangular, including the hole 22 of the cooling tube 3 of FIG.

  As described above, the ultrasonic bonding tool 62 is supported by the elastic support tubes 41 </ b> A and 41 </ b> B, so that the ultrasonic bonding tool 62 is supported even if the ultrasonic bonding tool 62 is supported by a portion other than the node portion S. Is absorbed by the support tubes 41A and 41B. Therefore, it is possible to suppress the vibration of the ultrasonic bonding tool 62 from being transmitted to the horn support arm 12 side. In addition to this, the horn 42 can be cooled with respect to the support tube 41 </ b> A because the air flows in the same manner as the cooling tube 3.

  In this modification, the ultrasonic welding tool 62 is supported by the support tubes 41 </ b> A and 41 </ b> B in the abdominal part M located on the left and right sides of the welding tool part 4. That is, the support positions are spaced apart from each other as compared with the support at the node S on the left and right sides of the joining tool portion 4. Thus, by widening the interval at which the horn 42 is supported by the support 12, the support of the ultrasonic bonding tool 62 with respect to the horn support arm 12 can be stabilized.

  The ultrasonic mounting tool 62 includes a vibrator 42A including the vibration element 9 and a horn 42B. The left part of the vibrator 42A is covered with a cover 42C.

  A screw portion 42D is formed at the right end portion 42At of the vibrator 42A, and a screw hole 42E into which the screw portion 42D is screwed is formed at the left end portion 42Bt of the horn 42B. Therefore, the ultrasonic bonding tool 62 can be separated into the vibrator 42A and the horn 42B at the screw portion 42D and the screw hole 42E, and is integrally formed by coupling at the screw portion 42D and the screw hole 42E. Is done. Cylindrical portions 42F and 42G are formed on the left and right sides of the horn 42B in accordance with the inner diameters of the support tubes 41A and 41B. The support tubes 41A and 41B support the horn 42B at the cylindrical portions 42F and 42G.

(Modification)
FIG. 8 shows a modification of the vibration device 32 in the ultrasonic vibration bonding device 30 according to the second embodiment of the present invention as the vibration device 50. In FIG. 8, members and configurations similar to those of the second embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The vibration device 50 differs from the vibration device 32 mainly in the structure for supporting the ultrasonic mounting tool 63 on the vibration device support rod 11 and the insertion position of the heater 51 into the horn 31B.

  The ultrasonic mounting tool 63 includes a vibrator 31A including the vibration element 9 and a horn 31B. The ultrasonic mounting tool 63 is supported with respect to the vibration device support rod 11 by a horn support arm 52 and a support screw 53 as support members. The horn support arm 52 is fixed at the lower end of the vibration device support rod 11 and extends to the right side of the vibration device support rod 11.

  In the horn 31B, a screw hole 54 to which the support screw 53 is screwed is formed at the position of the node portion S that is a position of a quarter wavelength from the left end of the horn 31B. A screw insertion hole 55 through which the support screw 53 is inserted is formed at a position facing the screw hole 54 of the horn 31B at a substantially central portion of the horn support arm 52. Accordingly, by passing the support screw 53 through the screw hole 55 from the upper side of the horn support arm 52 to the horn 31B side and screwing the support screw 53 to the screw 54, the ultrasonic mounting tool 63 is connected to the support screw 53 and the horn. The vibration device support rod 11 is supported via the support arm 52.

  A protrusion 56 is formed on the upper surface of the horn 31 </ b> B opposite to the welding tool part 4 at a position facing the welding tool part 4. The upper surface of the protrusion 56 is formed in a rectangular plane. The front-rear width of the upper surface of the protrusion 56 is the same as the front-rear width of the horn 31B. That is, the front-rear width of the upper surface of the protrusion 56 is formed to be full of the front-rear width of the horn 31B.

  A bearing member 57 is disposed between the protrusion 56 and the horn support arm 52. The bearing member 57 is fixed to the horn support arm 52 and is not fixed to the protrusion 56. The ultrasonic mounting tool 63 is supported by the support screw 53 with respect to the horn support arm 52 in a state where the bearing member 57 is sandwiched between the protrusion 56 and the horn support arm 52.

  Since the protrusion 56 and the bearing member 57 are not fixed as described above, when the horn 31B vibrates in the left-right direction due to the vibration generated by the vibration element 9, the horn 31B It slides with respect to the member 57.

  In the vibration device 50, the joining tool part 4 is provided with a pedestal part 4E having a rectangular flat part 4D that is long in the front-rear direction, and the IC chip 100 is held on the flat part 4D of the pedestal part 4E. Since the flat portion 4D is long in the front-rear direction, it is suitable for holding the IC chip 100 that is long in the front-rear direction.

  The suction hole 4 </ b> A vertically penetrates the bearing member 57 and the horn support arm 52, passes through the vibration device support rod 11, and penetrates the side surface of the vibration device support rod 11. An air suction device (not shown) is connected to the suction hole 4 </ b> A that has escaped to the side surface.

  A heater insertion hole 58 is formed in the horn 31B on the opposite side of the suction hole 4A with the screw hole 54 interposed therebetween. The horn support arm 52 is provided with a heater support plate 59. The heater support plate 59 is provided on the horn support arm 52 so as to be positioned in front of and behind the horn 31B. The heater 51 is passed through the heater support hole 59 </ b> A formed in the heater support plate 59 while being inserted into the heater insertion hole 58, and is supported by the heater support plate 59. The heater 51 and the heater support plate 59 fix the space between the heater 51 and the heater support hole 59A with a heat resistant adhesive or the like.

  A portion between the ¼ wavelength and ¼ wavelength (right end of the vibrator 31A) from the left end of the vibrator 31A is formed as a cooling pipe attachment portion 31C, and the cooling pipe 3 is attached to the cooling pipe attachment portion 31C. ing. A screw hole 31D is formed in the right end portion 31Ct of the cooling pipe mounting portion 31C, and a screw portion 31E that is screw-coupled to the screw hole 31D is formed in the end portion 31Bt of the horn 31B. Therefore, the vibrator 31A having the cooling pipe attachment portion 31C and the horn 31B can be separated at the screw hole 31D and the screw 31E, and are integrally configured by screwing at the screw hole 31D and the screw portion 31E. Is done.

  Therefore, when the cooling pipe 3 is attached to the cooling pipe attachment part 31C, the hole 22 of the cooling pipe 3 is passed through the cooling pipe attachment part 31C with the vibrator 31A removed from the horn 31B. And the vibrator | oscillator 31A which let the cooling pipe 3 pass to the cooling pipe attachment part 31C is integrated with the horn 31B by the screw connection by the screw part 31D and the screw hole 31E.

  By the way, in each of the above-described embodiments, the cooling pipe mounting part 10C of the vibrator 10A, the cooling pipe mounting part 31C of the vibrator 31A, and the cylindrical parts 42F and 42G of the horn 41B have a cylindrical shape. However, it is good also as attaching the cooling pipe 3 (41A) by making parts other than these into the shape of a cylinder. For example, a cylindrical portion may be formed in the horn 10B, the horn 31B, and the vibrator 42A, and the cooling pipe 3 may be attached to the cylindrical portion.

  In addition, the cooling tube mounting portion 10C of the vibrator 10A, the cooling pipe mounting portion 31C of the vibrator 31A, and the cylindrical portions 42F and 42G of the horn 42B can be elliptical if the adhesion to the cooling tubes 3 and 41A can be secured. In addition to pillars, triangular pillars, quadrangular pillars, or more polygonal pillars may be used.

  Further, as the cooling means, an electronic cooling element such as a Peltier element may be used in addition to the cooling pipe 3 through which the refrigerant flows.

  In addition, the ultrasonic mounting tools 60, 61, 62, and 63 are configured to be separable on one end side (right side) of the respective cooling pipe mounting portions 10C, 31C, and 41C, but also on the other side. It is good also as a structure which forms the screw part and screw hole which are screw-coupled, and is separable in the both sides of cooling pipe attachment part 10C, 31A, 41A. In this case, the ultrasonic mounting tools 61, 62, 63, and 64 are divided into three parts, that is, the cooling pipe attachment parts 10C, 31C, and 41C and their both side parts.

  In each embodiment, the bonding target is the IC chip 100, but the bonding target is not limited to the IC chip, and may be a resistance element other than the IC chip, or an electronic component such as light emission. Moreover, although the to-be-joined target object was made into the flexible substrate 101 to which the IC chip 100 is joined and becomes COF, the flexible substrate 101 is not limited to that constituting the COF. In addition to the flexible substrate 101, a printed circuit board made of epoxy resin or the like may be used as an object to be joined. Further, as described above, the joining object and the object to be joined are not limited to the electronic component and the flexible substrate or the printed wiring board, but may be metal parts or plastic parts, for example.

1 shows an entire ultrasonic vibration bonding apparatus according to a first embodiment of the present invention and a supply apparatus that supplies an IC chip to the ultrasonic vibration bonding apparatus, and is an object to be bonded using the ultrasonic vibration bonding apparatus. It is a figure for demonstrating the outline of the process of joining an IC chip to a flexible substrate. It is a figure which shows the structure of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 1 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus. (C) is a figure which shows the relationship between the position in an ultrasonic mounting tool, and the amplitude of the vibration which propagates an ultrasonic mounting tool. It is a figure which shows the structure of the cooling pipe with which the ultrasonic mounting tool of the ultrasonic vibration joining apparatus shown in FIG. 1 is equipped, About the cooling pipe, it is sectional drawing cut | disconnected by the plane of the left-right up-down direction. It is a figure which shows the structure of the flexible circuit board with which an IC chip is joined by the ultrasonic vibration joining apparatus shown in FIG. The ultrasonic vibration joining apparatus concerning the 2nd Embodiment of this invention and the supply apparatus which supplies an IC chip to this ultrasonic vibration joining apparatus are shown whole, and it is a joining target object using an ultrasonic vibration joining apparatus. It is a figure for demonstrating the outline of the process of joining an IC chip to a flexible substrate. It is a figure which shows the structure of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 5 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus. (C) is a figure which shows the relationship between the position in an ultrasonic mounting tool, and the amplitude of the vibration which propagates an ultrasonic mounting tool. It is a figure which shows the modification of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 1 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus. (C) is a figure which shows the relationship between the position in an ultrasonic mounting tool, and the amplitude of the vibration which propagates an ultrasonic mounting tool. It is a figure which shows the modification of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 5 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus. (C) is a figure which shows the relationship between the position in an ultrasonic mounting tool, and the amplitude of the vibration which propagates an ultrasonic mounting tool.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ultrasonic vibration bonding apparatus 3 ... Cooling pipe (cooling means)
3A ... annular body 4 ... joining tool part (holding part)
4B ... Suction hole 9 ... Vibrating elements 10A, 31A, 42A ... Vibrators 10B, 31B, 42B ... Horns 10C, 31C, 42C ... Cooling tube mounting portions 13A, 13B ... Heater 14 ... Horn support arm (support member)
15A, 15B ... Screw (mounting member)
16A, 16B ... Screw insertion hole (mounting member insertion hole)
17A, 17B ... Heater insertion hole 19 ... Openings 19A, 19B ... Peripheral part 20 ... Hollow part 21 ... O-ring 60, 61, 62, 63 ... Ultrasonic mounting tool 100 ... IC chip (joining object)
101 ... Flexible circuit board (object to be joined)

Claims (7)

An ultrasonic mounting tool having a vibration element that generates ultrasonic vibration and a horn that resonates with the vibration of the vibration element;
A holding unit that is provided in the horn and holds an object to be joined;
A heater provided in the horn so as to heat a joining portion between the joining object and a joining object for joining the joining object,
In the ultrasonic vibration bonding apparatus for bonding the bonding target object to the bonding target object by applying ultrasonic vibration while pressing the bonding target object against the bonding target object,
E Bei cooling means to be contacted with the peripheral surface between the heater and the vibrating element of the ultrasonic mounting tool,
The portion of the ultrasonic mounting tool provided with the cooling means is formed in a cylinder,
The cooling means includes an annular body in which a hollow portion is formed with an inner circumferential side serving as an opening over the entire circumference,
Flowing the coolant through the hollow portion of the annular body in a state in which the peripheral portion of the opening of the annular body is closely attached to the periphery of the portion formed in the column provided with the cooling means;
An ultrasonic vibration bonding apparatus characterized by that. The ultrasonic vibration bonding apparatus according to claim 1 , wherein the portion formed in the column is formed in a vibrator including the vibration element. The ultrasonic vibration bonding apparatus according to claim 1 , wherein the annular body is formed of an elastic material. The ultrasonic vibration bonding apparatus according to claim 1 , wherein an O-ring is provided on the peripheral edge of the opening. The ultrasonic vibration bonding apparatus according to claim 1 , wherein the refrigerant is a gas. 6. The ultrasonic vibration bonding apparatus according to claim 1 , wherein a length of a portion formed in the column is longer than a width of the annular body. The ultrasonic vibration bonding apparatus according to claim 1 , wherein the ultrasonic mounting tool is configured to be separable at a portion formed on the column .