JP4887879B2 - Electronic component mounting structure and manufacturing method thereof - Google Patents

Description

  The present invention relates to a mounting structure of an electronic component and a method for manufacturing the same, and more particularly to an electronic component that collectively performs resin sealing of an electronic component and connection between electrodes using a resin composition containing a conductive filler. The present invention relates to a mounting method and a mounting structure of an electronic component manufactured thereby.

  With the rapid development of electronic devices, semiconductor devices are required to have higher functionality than ever. As the number of multifunctional semiconductor elements increases, the number of input / output terminals of the semiconductor elements increases, and the wiring length for operating the semiconductor elements at high speed is required to be shortened. As a connection method developed to realize such a requirement, there is a flip chip connection. Flip chip connection is suitable for increasing the number of pins because connection pads can be provided in the form of areas on the wiring surface of a semiconductor element. In addition, compared with other semiconductor element connection methods such as wire bonding and tape automated bonding (TAB), the lead length is not required, so that the wiring length can be shortened.

For the reasons described above, the number of semiconductor devices used in electronic devices using flip chip connection is increasing.
Au, solder, or the like is used as a material for the bump electrode used in the flip chip. Examples of the solder material include Sn-Pb eutectic solder, but are not limited to Sn-Pb eutectic solder. For example, Sn-Pb (excluding eutectic), Sn-Ag, Sn-Cu, Sn-Sb. , Sn—Zn, Sn—Bi, and materials obtained by further adding a specific additive element to the above-described materials can be used as appropriate (for example, see Patent Document 1).
Examples of other bump electrode materials include those using a conductive resin (for example, see Patent Document 2) and those using a metal nano paste (for example, see Patent Document 3).

On the other hand, many of the semiconductor elements to be flip-chip connected have a difference in the coefficient of thermal expansion between the semiconductor element and the wiring board, and it is necessary to mitigate this. The connection reliability is ensured by injecting and curing the agent. Materials used for resin sealing include epoxy resin, silicone resin, phenolic resin, diallyl phthalate resin, polyimide resin, acrylic resin, urethane resin, etc., but heat resistance, moisture resistance, chemical resistance, adhesion, cost, etc. Epoxy resin, which is superior in terms of the above, is widely used.
As a general method for sealing the gap between the semiconductor element and the wiring board with epoxy resin, there is underfill filling in which the gap between the semiconductor element and the wiring board is filled using a capillary phenomenon. It is one of the most widely used technologies as a stopping method.
In recent years, for the purpose of improving productivity by reducing the underfill resin filling process, before mounting a semiconductor element, an epoxy resin is applied to the semiconductor element mounting area of the wiring board, and then the semiconductor element is mounted. The tip resin construction method in which connection between electrodes and resin filling are simultaneously performed is being utilized.
The problem of the prior resin construction method is to reliably bond the electrodes of the semiconductor element and the electrodes of the wiring board through the resin applied in advance, and there are various means.
Among the prior resin methods, there is a method of using a conductive resin. According to this method, unlike the method of applying the conductive resin only to the electrode portion as described in Patent Documents 2 and 3, the semiconductor element mounting Despite uniformly applying the conductive resin to the entire surface, only the intended electrode portion can be conductive. An outline of two typical examples of this method is given below.

First, a first example is a method in which epoxy resin is filled with conductive particles, and electrical connection is made only at intended portions of the bump electrode of the semiconductor element and the electrode of the wiring substrate through the particle.
First, a semiconductor element having a bump formed on a predetermined electrode pad is prepared. The material of the bump is generally gold, and the bump formation method includes a stud bump formed using a bump bonder, a plated bump formed by plating, or the like. The electrode pads of the wiring board have nickel plating on the surface of the copper wiring, and further gold plating is formed thereon. Regarding the mounting process, first, an epoxy resin to which conductive particles are added is applied onto the wiring board. Although there are a wide variety of conductive particles, metal particles such as copper, silver, nickel, etc. and metal particles such as nickel, gold, etc. are generally provided around resin particles. Next, the semiconductor element is aligned and mounted on the wiring board with a predetermined load and temperature. At this time, conduction is obtained through conductive particles sandwiched between the bumps of the semiconductor element and the pads of the wiring board, and particles remain around the electrodes, but the short circuit between the adjacent electrodes does not occur. It is possible to obtain conduction only between the bumps of the semiconductor element and the pads of the wiring board. Furthermore, it is possible to maintain the connection between the electrodes by simultaneously heating and applying the predetermined load to cure the epoxy resin.

As a second example, by using low melting metal particles such as solder as conductive particles, wetting between metal particles is utilized, and a fusion aggregate of metal particles is formed on the electrode portion to establish a connection. The method of performing is mentioned. If this method is used, bumps are not formed on semiconductor elements or wiring board electrodes, so both the bump electrode formation process and the underfill resin filling process can be reduced, which is extremely advantageous in terms of productivity and cost. It is. First, an alloy such as Sn, Zn, In, or Bi is used as the solder material. In this case, an acid having a flux action for removing the oxide film on the surface of the solder particles is added to the epoxy resin as the adhesive. Regarding the mounting process, first, an epoxy resin to which conductive particles, a fluxing agent, and the like are added is applied onto a wiring board, and the semiconductor element is aligned and mounted. By heating to a temperature at which the conductive particles are melted from this state, connection is performed by utilizing the wetness of the metal particles and forming a molten aggregate of the conductive particles at the electrode portion (for example, Patent Document 4). reference).
JP 2004-153141 A JP 2000-244090 A JP 2004-327908 A Japanese Patent No. 2807940

In the case of the first conventional example described above, since the conductive particles are uniformly dispersed, a predetermined amount is obtained when the conductive particles are surely sandwiched between all the electrodes to obtain stable conduction. However, considering the ratio of the area of the electrode part to the other area, the ratio of the other area is higher, so it is not involved in conduction, that is, the conductivity scattered between the electrodes. There are more sex particles. This not only leads to an increase in cost due to excessive addition of conductive particles, but also increases the possibility of insulation failure due to the influence of particles scattered between the electrodes when the fine pitch is further advanced.
In the case of the second conventional example described above, the conductive particles in the vicinity of the electrode pad wet and collect on the electrode pad as intended, but the conductive particles away from the electrode pad may be integrated and enlarged with the particles in the vicinity. It does not integrate with the particles connected to the electrode part, and remains between the electrodes. Therefore, when all the electrodes are to be connected securely, it is necessary to add extra conductive particles in anticipation of the residual particles not involved in the connection, which not only increases the cost of the material, but also the conductive particles If the amount of the additive added is large, the amount of conductive particles remaining between the electrodes increases, resulting in a problem of short-circuiting between the electrodes. In addition, if the amount of conductive particles is small, the amount of conductive material such as solder that is formed by wetting the electrodes also decreases, so it is not possible to secure a sufficient amount of conductive material to connect between the semiconductor element and the wiring board. I can not. That is, there is a problem that it is difficult to obtain a connection without a short circuit between electrodes while securing a stable connection between the electrodes.

As described above, regarding the pre-resin method using a resin to which conductive particles are added, regardless of whether the added conductive particles melt or not, the uniformly dispersed conductive particles are selectively collected in the electrode part. Is an important issue, and there is no disclosure in the prior art regarding structures, methods, etc. in consideration of this point.
The object of the present invention is to solve the above-mentioned problems of the prior art, and its purpose is to select uniformly dispersed conductive particles as an electrode part in a prior resin method using a resin to which conductive particles are added. It is to provide a mounting structure of electronic parts and a method for manufacturing the same, which can be collected in an integrated manner.

To achieve the above object, according to the present invention, in an electronic component mounting structure in which an electrode of an electronic component and a pad of the wiring substrate are connected using a conductive paste containing conductive particles and a resin, the wiring substrate The entire periphery of the pad is surrounded by a solder resist, and the cross-sectional shape of the solder resist is substantially trapezoidal between adjacent pads, and the length a of the base of the trapezoid is three times the length b of the upper side. Provided is a mounting structure for an electronic component, wherein (a ≧ 3b) and the electronic component is sealed with the resin filled in a gap between the wiring board and the electronic component Is done.
The electronic component mounted in the present invention includes a bare chip, a flip chip having a bump, a BGA (ball grid array), a CSP (chip scale package), and the like.
Preferably, a gap between the electronic component and the wiring board is filled with resin. Preferably, the side surface of the solder resist surrounding the pad of the wiring board has a mortar shape.

In order to achieve the above object, according to the present invention, the cross-sectional shape of the solder resist surrounding the entire periphery of the pad between the adjacent pads on the wiring board is substantially trapezoidal, and the bottom of the trapezoid is A step of forming the length a so that it is at least three times the length b of the upper side (a ≧ 3b) , a step of supplying a conductive paste containing a resin and conductive particles onto the pad, and an electronic component Aligning the electrode of the electronic component on the pad of the wiring board and mounting the electrode on the wiring board; and curing the resin of the conductive paste to form the electrode of the electronic component and the wiring board There is provided a method for mounting an electronic component, the method including electrically connecting a pad and sealing the electronic component with the resin.
Preferably, after supplying a conductive paste on the wiring board, a vibration is applied to the wiring board in a plane direction of the board prior to the step of mounting the electronic component on the wiring board. Desirably, vibration is applied while heating the wiring board. More preferably, the frequency of vibration is 1 Hz or more.

  In flip chip mounting using a resin-added resin-added resin chip method, the solder resist formed around the pads on the wiring board has a mortar shape, and the cross-sectional shape of the solder resist formed between the pads Is an approximate triangle (including the case where the apex angle is rounded) or an approximate trapezoid. In the case of a trapezoid, the length a of the base of the trapezoid is at least three times the length b of the upper side (a ≧ 3b). When the solder resist is formed in such a shape, the conductive particles precipitated due to the difference in specific gravity between the conductive particles and the resin can easily reach the slope of the solder resist (the mortar-shaped side surface), and along the slope of the solder resist. As a result of sliding down, they gather on or near the pads of the wiring board on the bottom of the mortar shape. As a mounting method that further enhances the effect, after applying a resin added with conductive particles on the wiring board, it is vibrated in the plane direction of the board, so that only a few conductive particles remain on the flat part of the solder resist corresponding to the upper side of the trapezoid. Can be forcibly dropped into the mortar-shaped part and collected in the pad part. As a result, flip chip mounting using conductive particles can be stably connected, quality can be improved, and only the minimum necessary conductive particles need be added, so that material costs can be reduced. In addition, since the number of conductive particles remaining on the portion other than the pad portion is very small, the insulating property of the sealing resin can be maintained high.

Next, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a partial sectional view in the order of steps showing a first embodiment of the present invention. The present embodiment relates to the case where bumps are formed on the electrodes of the semiconductor chip and the conductive particles added to the resin do not melt.
First, a solder resist 3 exposing the pads 2 is formed on the wiring substrate 1 on which the pads 2 are formed at predetermined positions. As an example of the pad 2 of the wiring board 1, nickel plating is formed on the surface of the copper wiring, and further gold plating is applied thereon.
There are various types of solder resists 3 such as a thermosetting type, a UV curable type, and a developing type, and it is not necessary to particularly limit the material and the manufacturing method. It must be shaped like a mortar (inverted truncated pyramid shape or inverted truncated cone shape). The mortar-shaped surface shape may be a taper surface having a constant angle, a constant curved surface, a free-form surface, or a surface obtained by combining these (in this embodiment, a taper surface having a constant angle).
2A and 2B are views showing a state in which the solder resist 3 is formed on the wiring board, in which FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG. The upper surface portion 3a of the solder resist 3 is formed in a lattice shape, and the side surface portion 3b forms an inclined surface. As shown in FIG. 2B, the cross-sectional shape of the solder resist 3 between the pads 2 is a trapezoid. When the cross-sectional shape here is a trapezoid, in the present invention, the length a of the base of the trapezoid is at least three times the length b of the upper side (a ≧ 3b). The cross-sectional shape of the solder resist between the pads is not necessarily a trapezoid, and may be a triangle or a triangle with a rounded apex. Thus, by making the shape of the periphery of the pad 2 on the wiring board side into a mortar shape, the conductive particles precipitated in this portion are inevitably collected in the pad portion due to the effect of the inclination of this portion and the influence of gravity. . Therefore, it is desirable that the upper end portion of the solder resist between the pads 2 does not have a flat surface, that is, that the cross-sectional shape is a triangle or a triangle whose apex angle is rounded, in order to collect the conductive particles on the pad portion. . In the case of such a shape, since there is no flat portion where conductive particles remain, almost all particles can be collected in the pad 2. When there is a flat portion, that is, when the cross-sectional shape is a trapezoid, when the above relationship (a ≧ 3b) is satisfied, assuming that the pad size is about half of the pitch, by satisfying this relationship, The total of the area of the pad portion and the area of the mortar-like portion occupies about 80%, and most particles can be collected on the electrode pad. Thus, according to the present invention. The connectivity between the electrode and the pad (conductivity) can be improved, and the insulation between the pads (short-circuit prevention effect) can be greatly enhanced. The method for forming the solder resist shape into such a shape varies depending on various types of solder resists. For example, a thermosetting solder resist is used, and the solder resist applied to the substrate surface is semi-cured. In this state, it can be formed by pressing a mold having a desired shape and carrying out main curing. Alternatively, a method may be used in which exposure is performed using a photosensitive material and a mask in which the light transmittance in the region where the inclined portion is to be formed changes according to the thickness of the solder resist to be formed. The method is not limited to these.

  After the solder resist 3 is formed on the wiring board, a conductive paste 6 obtained by adding conductive particles 5 to the resin 4 is supplied onto the pads 2 of the wiring board. The material of the resin 4 serving as a base material of the conductive paste is not particularly limited, and is an acrylic resin, melamine resin, epoxy resin, polyolefin resin, polyurethane resin, polycarbonate resin, polystyrene resin, polyether resin, polyamide resin, Various materials such as a polyimide resin, a fluorine resin, a polyester resin, a phenol resin, a fluorene resin, a benzocyclobutene resin, and a silicone resin can be used, but these may be used alone or in combination of two or more. However, an epoxy resin excellent in terms of viscosity, cost, heat resistance, etc. is advantageously used. The resin is desirably liquid at room temperature of 25 ° C. An inorganic filler such as silica may be added to the resin for the purpose of obtaining resin properties necessary for ensuring connection reliability.

  A wide variety of conductive particles 5 added to the resin 4 can be used, and metal particles such as copper, silver and nickel, and metal plating such as nickel and gold around the resin particles. It may be. What is suitable as the conductive particles used in the present invention has a specific gravity greater than that of the resin 4, and when the conductive paste is applied to the surface of the wiring substrate 1, it is desirable that the conductive particles precipitate. Considering this point, the conductive particles are desirably metal particles. The particle size varies depending on the electrode pitch of the semiconductor element to be mounted and cannot be generally specified, but is generally about 3 to 5 μm. The conductive particles may partially include nanoparticles.

  As a method for applying the conductive paste, a dispenser may be used, or the conductive paste may be supplied to a predetermined location by a printing method such as screen printing, and the method is not particularly limited. At the beginning of application of the conductive paste 6, the conductive particles 5 are evenly dispersed in the resin 4. However, since the conductive particles 5 have a higher specific gravity than the resin 4, the conductive particles 5 settle out due to the influence of gravity, and eventually in FIG. As shown, the conductive particles 5 are deposited on the pad 2 and on the flat portion of the solder resist 3. In this case, a vertical vibration may be applied to the wiring board 1 in order to promote the sedimentation of the conductive particles 5. Further, in order to drop the conductive particles remaining on the flat portion of the solder resist 3 onto the pad 2, vibration is applied to the wiring substrate in the direction of the substrate plane (FIG. 1B). As a condition at this time, it is desirable that the amplitude is not less than the flat portion length b of the solder resist 3 and the frequency is not less than 1 Hz. At this time, since the ease of sedimentation and sliding of the conductive particles depends on the viscosity of the resin 4, it is more effective to vibrate after the substrate is heated to lower the viscosity of the resin 4. The conductive particles remaining on the flat portion of the solder resist 3 due to the horizontal vibration fall into the mortar-shaped portion of the solder resist 3, and the majority of the conductive particles 5 gather on or near the pad 2 [FIG. 1 (c)]. .

  Next, the semiconductor chip 7 on which the bumps 9 having a predetermined height are formed on the electrodes 8 is aligned and mounted at a predetermined position on the wiring board 1 using a flip chip mounter or the like. The material of the bump 9 is generally gold, and the bump forming method includes a stud bump formed using a bump bonder and a plated bump formed by plating, but the bump material and the forming method are not limited thereto. . After the semiconductor chip 7 is mounted, the resin is cured by applying predetermined heat while applying a load [FIG. 1 (d)]. Due to the load applied here, the conductive particles 5 are sandwiched between the bumps 9 on the semiconductor chip side and the pads 2 on the wiring board side and contact with each other, and conduction between the semiconductor chip and the wiring board is obtained. The heating temperature and the heating time are set according to the curing characteristics of the resin 4, and heating and a load are continuously applied until the resin is cured. When the curing of the resin is completed, the resin 4 holds the contact of the conductive particles 5 gathered at the electrode portion, thereby ensuring connection reliability. Further, the cured resin 4 between the wiring board and the semiconductor chip functions as an underfill.

[Second Embodiment]
Next, as a second embodiment of the present invention, the semiconductor chip is not formed with bumps, and an example in which the conductive particles added to the resin are melted is a partial cross-sectional view in the order of steps. This will be described in detail with reference to FIG.
First, a solder resist 3 exposing the pads 2 is formed on the wiring substrate 1 on which the pads 2 are formed at predetermined positions. As an example of the pad 2 of the wiring board 1, nickel plating is formed on the surface of the copper wiring, and further gold plating is applied thereon. The formation method and pattern of the solder resist 3 are the same as those in the first embodiment, and the state in which the solder resist is formed is as shown in FIG.

  After the solder resist 3 is formed on the wiring board, a conductive paste 6 obtained by adding conductive particles 5 to the resin 4 is supplied onto the pads 2 of the wiring board. The resin material used as the base material of the conductive paste is the same as that in the first embodiment. Furthermore, a flux agent (for example, an organic acid) that imparts an oxide film removing action can be added to the resin 4. By using an agent that exhibits an oxide film removal action during the resin curing reaction, it is possible to remove the solder oxide film and connect the conductive particles to each other without poor wetting, and Cu electrodes and Cu pads that are particularly prone to oxidation Even when using the electrode, the electrode / pad and the conductive particles can be connected without poor wetting. In addition, the curing characteristics of the resin 4 must maintain a viscosity that does not prevent an excessive increase in viscosity for a predetermined time even at a temperature at which the conductive particles 5 melt, and does not prevent wetting of the conductive particles.

The conductive particles 5 added to the resin 4 use an alloy such as Sn, Zn, In, Bi, or Ag. The amount of the conductive particles added is preferably 50 to 85% by weight. Although the particle diameter varies depending on the electrode pitch of the target semiconductor element, it is desirable to use particles of 30 μm or less, and particles of various diameters such as fine particles including nanoparticles may be mixed. . Moreover, you may mix the electroconductive particle which consists of single metals, such as Cu, Ag, and Ni.
At the beginning of application of the conductive paste 6, the conductive particles 5 are evenly dispersed in the resin 4. However, since the conductive particles 5 have a higher specific gravity than the resin 4, the conductive particles 5 settle out due to the influence of gravity. Deposit on top and on the flat part of the solder resist 3. In this state, in order to drop the conductive particles remaining on the flat portion of the solder resist 3 onto the pad 2, vibration is applied to the wiring board in the direction of the substrate plane (FIG. 3A). The conditions at this time are the same as those in the first embodiment described above. As a result, the conductive particles remaining on the flat portion of the solder resist 3 fall into the mortar-shaped portion of the solder resist 3, and the majority of the conductive particles 5 gather on or near the pad 2 [FIG. 3 (b)].

  Next, the semiconductor chip 7 having the electrodes 8 is positioned and mounted on the wiring board 1 using a flip chip mounter or the like [FIG. 3 (c)]. The material of the electrode 8 is generally a copper or nickel surface coated with gold, but is not limited thereto. However, the material must be excellent in solder wettability. Thereafter, by heating to a temperature at which the conductive particles 5 melt, the conductive particles 5 are wetted by the pads 2 and the conductive particles to become large particles, and finally the pads 2 on the wiring board side and the electrodes 8 on the semiconductor chip side are formed. By forming a single conductor to be connected, bumps 10 for electrically connecting the semiconductor chip 7 and the wiring substrate 1 are formed [FIG. 3D]. As a heating method at this time, a heater of a mounter used when mounting the semiconductor chip 7 may be used, or heating may be performed in a reflow furnace set to a predetermined temperature profile. The resin 4 is cured by electrically connecting the semiconductor chip 7 and the wiring board 1 and then curing in an oven or the like adjusted to a predetermined temperature.

[Third Embodiment]
FIG. 4 is a partial cross-sectional view in the order of steps showing a third embodiment of the present invention. This embodiment relates to an example in which a semiconductor device such as a BGA or a CSP having solder balls as external connection terminals is mounted on a wiring board.
First, a solder resist 3 exposing the pads 2 is formed on the wiring substrate 1 on which the pads 2 are formed at predetermined positions. The state in which the solder resist 3 is formed is shown in FIG. FIG. 4 is a diagram showing a process in a cross section taken along line BB in FIG. In the example shown in FIG. 2, the space surrounding the solder resist pad has an inverted truncated pyramid shape, but in the case of the present embodiment, it has a shape closer to a truncated cone. However, in the trapezoidal shape of the solder resist 3 taken along the line B-B, the length a of the base of the trapezoid is not less than three times the length b of the upper side (a ≧ 3b).

  After the solder resist 3 is formed on the wiring board, a conductive paste 6 obtained by adding conductive particles 5 to the resin 4 is supplied onto the pads 2 of the wiring board. The conductive particles 5 contained in the conductive paste are the same as in the first embodiment, but the resin 4 is made of a material that cures at a temperature lower than the melting temperature of the solder balls of the semiconductor device. . After supplying the conductive paste 6, by applying vertical and horizontal vibrations to the wiring substrate 1 while heating, most of the conductive particles 5 gather on or near the pad 2 [FIG. 4 (a)].

  Next, the semiconductor device 11 having the solder balls 13 attached on the electrodes 12 is mounted in alignment with a predetermined position of the wiring board 1 (FIG. 4B). Then, the resin is cured by heating at a temperature not higher than the melting temperature of the solder balls 13 while applying a load [FIG. 4 (c)]. Due to the load applied here, the conductive particles 5 are sandwiched between the bumps 9 on the semiconductor chip side and the pads 2 on the wiring board side to come into contact with each other, and are partially sunk into the solder balls. Conductivity is obtained.

Sectional drawing of the order of the process which shows the 1st Embodiment of this invention. The top view and sectional drawing which show the state by which the soldering resist was formed on the wiring board in the manufacturing process of 1st Embodiment. Sectional drawing of the order of the process which shows the 2nd Embodiment of this invention. Sectional drawing of the order of the process which shows the 3rd Embodiment of this invention. The top view which shows the state by which the soldering resist was formed on the wiring board in the manufacturing process of 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2 Pad 3 Solder resist 3a Upper surface part 3b Side surface part 4 Resin 5 Conductive particle 6 Conductive paste 7 Semiconductor chip 8, 12 Electrode 9, 10 Bump 11 Semiconductor device 13 Solder ball

Claims (11)

In the mounting structure of the electronic component in which the electrode of the electronic component and the pad of the wiring board are connected using a conductive paste containing conductive particles and resin, the entire periphery of the pad of the wiring board is surrounded by a solder resist, The cross-sectional shape of the solder resist between adjacent pads is substantially trapezoidal, the length a of the base of the trapezoid is not less than three times the length b of the upper side (a ≧ 3b), and the electronic component Is sealed with the resin filled in a gap between the wiring board and the electronic component. 2. The electronic component mounting structure according to claim 1, wherein a side surface of the solder resist surrounding the pad has a mortar shape. Wherein and bump or metal balls on the electronic component of the electrodes are formed, to claim 1 or 2, the bumps or metal balls, characterized in that it is connected via a pad and conductive particles on the circuit board Mounting structure of the electronic component described. Between adjacent pads on the wiring board, the cross-sectional shape of the solder resist that surrounds the entire periphery of the pad is roughly trapezoidal, and the length a of the base of the trapezoid is at least three times the length b of the upper side (a ≧ 3b), a step of forming, a step of supplying a conductive paste containing resin and conductive particles onto the pad, an electronic component, and an electrode of the electronic component positioned on the pad of the wiring board In addition, the step of mounting on the wiring board, the resin of the conductive paste is cured to electrically connect the electrode of the electronic component and the pad of the wiring board, and the electronic component to the resin And mounting the electronic component. The electronic component mounting according to claim 4 , wherein after the conductive paste is supplied onto the wiring substrate, vibration is applied to the wiring substrate prior to the step of mounting the electronic component on the wiring substrate. Method. 5. The method according to claim 4 , wherein after supplying the conductive paste on the wiring board, the wiring board is vibrated in a substrate plane direction prior to the step of mounting the electronic component on the wiring board. Electronic component mounting method. Electronic part mounting method according to claim 5 or 6, characterized in that applying vibration while heating the wiring board. Between pads adjacent on the wiring board, the than the length b of the trapezoidal upper side is a cross-sectional shape of the solder resist, it to claim 6 or 7, wherein the amplitude when vibrating the wiring board is large The electronic component mounting method described. Electronic part mounting method according to any of claims 6 8, frequency of the vibration is equal to or not less than 1 Hz. Bumps or metal balls are formed in advance on the electrodes of the electronic component, and the bumps or metal balls are connected to pads of the wiring board through conductive particles of the conductive paste. Item 10. The electronic component mounting method according to any one of Items 4 to 9 . The conductive particles are formed of a low-temperature molten metal material, and in the step of curing the conductive paste, the conductive particles are melted to form bumps between the pads of the wiring board and the electrodes of the electronic component. electronic part mounting method according to any one of claims 4 9, characterized in Rukoto.

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