JP4893607B2 - Evaluation board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for evaluation, which excellently copes with many kinds and is excellent in usability. <P>SOLUTION: The substrate for evaluation is used for evaluation of the function of an electronic component mounter. In the substrate for evaluation, land groups 2-9 which are different in shape and size and used for mounting a plurality of kinds of electronic components including at least chip-type and package-type electronic components are formed, and of the land groups, a narrowly adjacent land group 5 in which micro-components are arranged with a narrow pitch is disposed on a center region R sandwiched by lands 2, 4, 8, 9 for performing mounting operation for evaluation targeting a plurality of package-type electronic components. Thus, micro-components requiring high measurement accuracy are mounted on the center of a substrate on which a measurement operation is easily performed, and the user-friendly substrate for evaluation is provided. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an evaluation substrate used for evaluating device functions such as mounting position accuracy in an electronic component mounting apparatus for mounting electronic components on a substrate.

  In an electronic component mounting device that holds electronic components by a mounting head and transfers and mounts them on a substrate, whether the component mounting mechanism for mounting the electronic components on the substrate is functioning normally, and how much mounting position accuracy is ensured An evaluation substrate is used for empirically confirming the device function. For example, during the final inspection performed at the factory of the device manufacturer at the time of shipment, the adjustment performed by the user, the confirmation inspection after repair, etc., actual electronic components or dedicated dummy components manufactured for inspection are used as evaluation boards. The device functions such as mounting position accuracy are evaluated by actually mounting and measuring the mounting position and mounting posture with a measuring device using image recognition, displacement detection by laser light, and the like (see Patent Documents 1 and 2).

In Patent Document 1, a jig work is mounted on a glass jig board on which a board-side mark is provided in advance by a component mounter, and the board-side mark and the jig work are imaged with a camera after mounting, so that the X direction and the Y direction are obtained. An example of measuring the amount of deviation in the Θ direction is shown. Further, Patent Document 2 shows an example of height measurement performed when the three-dimensional positional accuracy of a part is included as an item to be measured.
JP-A-2005-317806 JP 2003-247810 A

  By the way, electronic component mounting apparatuses have become increasingly versatile in recent years, and a wide variety of electronic components mounting apparatuses including a chip type and other package type large parts such as a QFP are targeted for mounting. For this reason, it is necessary to target many types of parts also in the evaluation of the above-described device function. In the conventional evaluation work, a method of sharing a glass substrate as shown in Patent Document 1 for various types of electronic components as an evaluation substrate, or a dedicated substrate manufactured for each single type of electronic component is conventionally used. Different methods were used for each product type.

  However, when a glass substrate or the like is shared by a variety of products, the position measurement work is complicated and the required evaluation target items are not sufficiently covered, and it is difficult to satisfy the evaluation accuracy required by the user. In addition, when using a dedicated board, it is necessary to prepare various types of evaluation boards, which requires management costs, and when performing the evaluation work, there is a troublesome replacement of the board according to the type of component. As described above, the board used for evaluation of the conventional apparatus function has difficulty in usability and component management, and an evaluation board that solves these problems has been demanded.

  Therefore, an object of the present invention is to provide an evaluation substrate that is excellent in compatibility with various products and ease of use.

An evaluation board of the present invention is an evaluation board used for evaluating the function of an electronic component mounting apparatus in which an electronic component is held by a mounting head and mounted on the board, and is a solder bonding terminal. A plurality of lands having different shapes and sizes for performing an evaluation mounting operation on a plurality of types of electronic components each including at least a chip-type electronic component having a package and a package-type electronic component having a solder joint lead A group of lands, in which the lands of minute parts having a land size smaller than the package type electronic component are arranged at a narrow pitch narrower than the pitch of the land of the package type electronic component. A group of narrow adjacent lands for performing an evaluation mounting operation for a narrow adjacent mounting pattern to be mounted is connected to a plurality of electronic components of the package type. It was placed in the central region between the land group for performing an evaluation mounting operation as.

  According to the present invention, by forming a land group having different shapes and sizes for mounting a plurality of types of electronic components on the evaluation substrate, multi-product compatibility is ensured. Narrow adjacent land groups arranged at a narrow pitch are arranged in a central region sandwiched between land groups for performing an evaluation mounting operation for a plurality of the package-type electronic components, so that a minute part requiring high measurement accuracy Can be mounted in the center of the board where measurement work is easy to perform, and an evaluation board with excellent usability can be realized.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of an evaluation board according to an embodiment of the present invention, FIG. 2 is an explanatory view of an evaluation mounting operation on the evaluation board according to an embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram of land adjacent arrangement patterns on an evaluation substrate according to an embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. 6 is an explanatory diagram of land arrangement and height reference mark arrangement for package type components on the evaluation board of the embodiment of the present invention.

  First, the overall configuration of the evaluation substrate 1 will be described with reference to FIG. The evaluation substrate 1 is made of resin, and in an electronic component mounting apparatus in which electronic components are held by a mounting head and mounted on the substrate, functions of the apparatus, such as mounting position accuracy and mounting operation tact time, are actually mounted. This is a dedicated board used to evaluate items for which results are obtained by executing work operations. The evaluation substrate 1 is formed with a plurality of land groups for joining components having different shapes and sizes in order to cover as wide as possible the types of electronic components to be mounted in a normal mounting substrate manufacturing process. . The present embodiment includes at least a highly versatile type such as a chip-type electronic component having a solder bonding terminal and a package-type electronic component having a solder bonding lead among these component types. A plurality of land groups are formed for performing an evaluation mounting operation for each of a plurality of types of electronic components.

  The evaluation substrate 1 is divided into a first quadrant [1], a second quadrant [2], a third quadrant [3], and a fourth quadrant [4] by XY coordinates with the center point as the origin O. A land group described below is formed in the quadrant. In the first quadrant [1], a cross mount land group 2, a deformed component land group 3, a multi-pin QFP land group 4, and a narrow adjacent land group 5 are arranged. The narrow adjacent land group 5 is formed across the fourth quadrant [4].

  The cross mount land group 2 has a cross-shaped configuration in which a plurality of component-specific land groups 2a in which land rows corresponding to leads of package-type electronic components are arranged in a rectangular shape are arranged adjacent to each other. The land row of each component land group 2a is configured by arranging a plurality of lands 21 in rows in accordance with the lead arrangement pitch of electronic components. In the mounting operation for evaluation, one package-type electronic component is test-mounted with respect to each component land group 2a.

  The odd-shaped component land group 3 includes a plurality of pairs of lands 31 that are paired, and an evaluation mounting operation for deformed components such as connectors is performed on each pair of lands 31. Height reference marks 32 for height measurement are provided at diagonal positions in a rectangular area that encloses each pair of lands 31, and the three-dimensional mounting accuracy of electronic components mounted on the deformed component land group 3 When performing the measurement, the height reference mark 32 is used as a reference height position indicating the height of the upper surface of the substrate in the substrate region.

  The multi-pin QFP land group 4 is intended for a large package component such as a multi-pin type QFP. The multi-pin QFP land group 4 includes a land row 4a arranged in a rectangular shape corresponding to each lead row, and each land row 4a has a plurality of lands 41 arranged in accordance with the lead arrangement pitch of the electronic component. Composed. Furthermore, the multi-pin QFP land group 4 includes recognition marks 42 for position recognition arranged at diagonal positions.

  In the narrow adjacent land group 5, the micro component land 51 for the evaluation mounting operation targeting the micro component and the narrow adjacent land 52 for the narrow adjacent mounting are arranged in one area as an arrangement close to each other. Arranged. In the example shown in the present embodiment, the narrow adjacent land group 5 is arranged in the central region of the evaluation substrate 1.

  In the second quadrant [2], a small chip component land group 6, a chip component land group 7, a bump-equipped component land group 8, and a QFP component land group 9 are arranged. The chip component land group 6 and the chip component land group 7 include a plurality of pairs of lands 61 and 71, respectively, and evaluation of chip-type electronic components such as capacitors and resistors for each pair of lands 61 and 71. Implementation operation is performed. The bump-attached component land group 8 is intended for a bump-attached component in which a bonding bump is provided on the lower surface (see the bump-equipped component 84 shown in FIG. 6), and for bump bonding provided in a frame-like arrangement. A plurality of lands 81, a recognition mark 82 for position recognition, and a height reference mark 83 for height measurement are provided. The QFP component land group 9 is intended for a large package component such as QFP as in the multi-pin QFP land group 4. The QFP component land group 9 includes a land row 9 a arranged in a rectangular shape corresponding to each lead row, and each land row 9 a includes a plurality of lands 91.

  In the third quadrant [3] and the fourth quadrant [4], land groups similar to the first quadrant [1] and the second quadrant [2] are formed, respectively. That is, in the third quadrant [3], the cross-mount land group 2, the deformed component land group 3, the multi-pin QFP land group 4 and the narrow adjacent land group 5 are in the first quadrant [1] with respect to the origin O. It is arranged in point symmetry with the group. Similarly, in the fourth quadrant [4], the chip component land group 6, the chip component land group 7, the bump-equipped component land group 8, and the QFP component land group 9 are in the second quadrant [2] with respect to the origin O. It is arranged in point symmetry with the group.

  That is, a plurality of land groups having the same configuration and shape are formed on the evaluation substrate 1 two by point with respect to the origin O. As a result, it is possible to easily and easily evaluate the rotational position accuracy of the component mounting mechanism that involves the rotational operation of the nozzle that sucks and holds the electronic component. For example, the same type of electronic component (for example, an electronic component mounted on the multi-pin QFP land group 4 in the first quadrant [1] and the third quadrant [3]) using the evaluation substrate 1 shown in the present embodiment. When the test mounting is performed for the evaluation, the evaluation mounting operation as shown in FIG. 2 is performed.

  In this case, electronic components are mounted on two mounting points P1 (x1, y1) and P2 (-x1, -y1) that are point-symmetrical positions in the first quadrant [1] and the third quadrant [3]. To do. First, the electronic component is mounted in a specified mounting direction (arrow a direction) with the mounting point P1 (x1, y1) as a target. Next, the electronic component is mounted in a specified mounting direction (arrow a direction) with the mounting point P2 (-x1, -y1) as a target.

In these two mounting operations for evaluation, the mounting head moving mechanism is controlled using two data x1 and y1 for plane position control, and the mounting direction (arrow a) at the mounting point P1 is changed to the mounting point P2. In order to reverse the mounting direction (arrow b), the nozzle rotation mechanism is commanded to rotate 180 °. As a result, a mounting position accuracy evaluation result in the case of 180 ° rotation in which the largest rotation error is likely to occur in the nozzle rotation operation can be obtained. That is, in this case, the rotational position accuracy can be easily and easily evaluated only by observing how much the angle error occurs with respect to the orthogonal axis (XY axis) in the mounting direction of the electronic component after mounting. Is possible.

  Next, with reference to FIG. 3, the arrangement | positioning form of the narrow adjacent land group 5 in the board | substrate 1 for evaluation is demonstrated. As shown in FIG. 3A, the narrow adjacent land group 5 is arranged in the central region R set including the center point of the evaluation substrate 1. In the present embodiment, a mounting operation for evaluation is performed for package-type electronic components such as the cross mount land group 2, the multi-pin QFP land group 4, the bump-equipped component land group 8, the QFP component land group 9, and the like. The land group is arranged so as to avoid the vicinity of the central portion of the evaluation substrate 1. That is, the central region R corresponds to a position sandwiched between lands for performing an evaluation mounting operation for such a package-type electronic component, and the central region R thus set includes Narrow adjacent land groups for performing an evaluation mounting operation for a narrow adjacent mounting pattern in which minute parts are arranged and mounted at a narrow pitch are arranged.

  Narrow adjacent mounting patterns in which minute parts are arranged with a narrow pitch are mounted, so it is difficult to perform observation work for evaluating positional accuracy after mounting. However, as shown in the present embodiment, by selecting the central region R in the vicinity of the center of the evaluation substrate 1 as the arrangement region of such narrow adjacent land groups 5, the workability of the evaluation work after mounting is improved. It is possible to improve. In addition, as a standard of the range of the center area | region R in the evaluation board | substrate 1 appropriate for such a purpose, the long side dimension A and the short side dimension of the rectangular-shaped evaluation board | substrate 1 shown in FIG.3 (b) are shown. The ratio of a and b of the rectangular central region R to B is preferably set to a range of 0.1 to 0.9, and more preferably 0.7 to 0.85 for a / A. . Further, b / B is preferably set to 0.05 or more and 0.5 or less, and more preferably 0.1 to 0.2 or less. In addition, these numerical ranges are a standard of a suitable range, Comprising: It is not necessarily limited to these numerical ranges.

  Next, the configuration of the cross mount land group 2 on the evaluation substrate 1 and the evaluation mounting operation executed for the cross mount land group 2 will be described with reference to FIGS. The cross-mount land group 2 includes package-type electronic components such as QFP-type components having connecting leads extending outward from each side of a resin mold having a rectangular outer shape in plan view at a predetermined arrangement pitch. This is a group of lands dedicated to the target mounting evaluation operation.

  In the present embodiment, the land layout pattern of the cross-mount land group 2 is a land layout in which a mounting evaluation operation can be performed using a mounting pattern in which the above-described five electronic components are arranged adjacently in a cross shape. It has become. The mounting pattern shown here is a mounting pattern in which one electronic component located at the center and four electronic components adjacent to each side of the electronic component are adjacent to each other. The land arrangement pattern in the cross mount land group 2 is an adjacent arrangement pattern in which land groups of individual parts are adjacent to each other in correspondence with such a mounting pattern.

The configuration of the cross mount land group 2 will be described. In FIG. 4, the component-specific land group 2 a constituting the cross mount land group 2 indicates a land group provided corresponding to one electronic component, and the component-specific land group 2 a extends from each side of the electronic component. The land rows 2b provided in a row corresponding to the leads to be read are arranged in a rectangular shape. In the cross mount land group 2, the land row 2b * of the component-specific land group 2a * located in the center of the cross arrangement is provided with the land row 2b of the adjacent component-specific land group 2a overlapping in the same area. . By overlapping the land row 2b * and the land row 2b in the same area, an overlapping arrangement land row 2c in which the two land rows are arranged in an overlapping manner is formed. In the overlappingly arranged land row 2c, the land 21 * belonging to the component-specific land group 2a * is located in the middle of the arrangement pitch p of the lands 21 belonging to the adjacent component-specific land group 2a, that is, at the midpoint p / 2.

  That is, in the state where the electronic component is test-mounted on the cross mount land group 2, as shown in FIG. 5, the electronic component 22 * mounted on the component-specific land group 2a * is paired with the electronic component as shown in FIG. 22 is mounted on the adjacent land group 2a. The paired electronic component 22 *, two land rows 2b * and land rows 2b corresponding to a plurality of leads 23 * and 23 respectively extending from two opposite sides of the electronic component 22 with a predetermined arrangement pitch p. Form the overlapping arrangement land row 2c overlapping the same area as described above. In the overlapping arrangement land row 2c, the lead 23 * of one electronic component 22 * is arranged in the middle of the arrangement pitch of the leads 23 of the other electronic component 22, and is overlapped in the same area. .

  That is, the adjacent arrangement pattern shown by the cross-mount land group 2 in the present embodiment has a plurality of extended patterns respectively extending from two opposite sides of the paired electronic components at a predetermined arrangement pitch, as shown in FIG. The two land rows arranged in a row corresponding to the leads are the same, with the land corresponding to the lead of one electronic component positioned in the middle of the arrangement pitch of the lands corresponding to the leads of the other electronic component. It has the form which has the overlapping arrangement | positioning land row | line | column provided in the area overlappingly.

  The overlap-arranged land row 2c includes four other electronic components adjacent to each other in four directions with the four sides of the component-specific land group 2a * located at the center, that is, one electronic component 22 * located at the center of the cross array. 22 are provided respectively. Of these four overlappingly arranged land rows 2c, two adjacent overlappingly arranged land rows 2c are arranged orthogonal to each other as shown in FIG.

  Next, referring to FIG. 5, the evaluation mounting operation executed for the cross mount land group 2 will be described. In this evaluation mounting operation, first, the electronic component 22 * is test-mounted on the component-specific land group 2a * shown in FIG. 4 with the mounting point MP * as the target position. Next, the electronic component 22 (1) is test-mounted on the component-specific land group 2a adjacent to the right side of the component-specific land group 2a * with the mounting point MP1 as a target position. At this time, the mounting point MP1 is set to be offset in the Y direction by Δy equal to p / 2 of the arrangement pitch p of the leads 23 with respect to the mounting point MP *, and the mounting position accuracy in the test mounting is good. The lead 23 of the electronic component 22 (1) is correctly positioned in the middle of the lead 23 * of the electronic component 22 *. On the other hand, if the mounting position accuracy is poor for some reason, the lead 23 of the electronic component 22 (1) is not positioned correctly in the middle of the lead 23 * of the electronic component 22 *, and the defective state is easily observed by visual observation. Can be confirmed.

  Thereafter, the electronic component 22 (2) is test-mounted on the component-specific land group 2a * adjacent to the component-specific land group 2a * with the mounting point MP2 as a target position. Here, a nozzle Θ-axis rotation operation for rotating the suction nozzle holding the electronic component 22 (2) by 90 ° is executed. At this time, the mounting point MP2 is set with respect to the mounting point MP * by being offset in the X direction by Δx equal to p / 2 of the arrangement pitch p of the leads 23, and the mounting position accuracy in the test mounting is the nozzle Θ-axis. If the rotational positioning accuracy is satisfactory, the lead 23 of the electronic component 22 (2) is correctly positioned in the middle of the lead 23 * of the electronic component 22 *. On the other hand, if the mounting position accuracy is poor for some reason, the lead 23 of the electronic component 22 (2) is not positioned correctly in the middle of the lead 23 * of the electronic component 22 *, and the defective state is easily observed by visual observation. Can be confirmed.

In the above embodiment, five electronic components are arranged in a cross shape, and are formed by an electronic component 23 * located at the center and four electronic components 23 adjacent to each side of the electronic component 23 *.
Although an example is shown in which mounting patterns having a pair of adjacent relations and land adjacent arrangement patterns corresponding to these adjacent relations are provided, the present invention is not limited to such mounting patterns. That is, a mounting pattern in which only one pair of electronic components is combined may be used as long as the mounting pattern can perform an evaluation mounting operation in which the leads 23 separated by a narrow arrangement pitch p are alternately aligned. A mounting pattern in which a plurality of pairs of electronic components are adjacent to each other in a form other than a cross arrangement may be used. At this time, the rotation positioning accuracy of the nozzle Θ-axis is evaluated as described above by adopting a mounting pattern in which two adjacent overlapping arrangement land rows 2c out of the plurality of overlapping arrangement land rows 2c are orthogonal to each other. It can be done easily.

  Next, the configuration and function of the bump-equipped component land group 8 in the evaluation substrate 1 will be described with reference to FIG. In FIG. 6, a bump-equipped land land group 8 for bumped components includes a plurality of bump bonding lands 81 provided in a frame-like arrangement, a recognition mark 82 for detecting the position of the bump-equipped component land group 8, and A height reference mark 83 for height measurement is provided separately from the recognition mark 82. On the bump-equipped component land group 8, a bump-equipped component 84 having a lower surface provided with a bump 84a is test-mounted.

  A reference reference line 85 is provided at a position offset outward by a predetermined dimension from the outline of the bumped component 84 in a state where it is mounted at the correct position. The reference reference line 85 visually observes whether or not the bumped component 84 is in a correct position in a state where the bumped component 84 is test-mounted on the bumped component land group 8 and the upper side of the land 81 is covered. It is provided for reference. If the bump-equipped component 84 that has been test-mounted is positioned at a uniform interval with respect to the reference reference line 85, it is determined that the component is mounted at the correct position.

  The height reference mark 83 is used as a height reference mark on the upper surface of the evaluation substrate 1 in the vicinity of the bump-equipped component land group 8, and a wiring such as a copper foil attached to the upper surface of the evaluation substrate 1 is used. In the patterning process of forming the lands 81 and the recognition marks 82 by etching the film 1a, the wiring film 1a is partially left together with these lands. Therefore, the upper surface of the height reference mark 83 can be used as a height reference surface associated with the height of the surface of the land 81 to which the bump is bonded. That is, at least a part of the land group on the evaluation substrate 1 is provided with a height reference mark 83 having a height reference surface associated with the height of the surface of the land 81 constituting the land group. .

  In the evaluation mounting operation in which the bump-equipped component 84 is test-mounted on the bump-equipped component land group 8, the height of the bump-equipped component 84 with respect to the upper surface of the height reference mark 83 is measured together with the three-dimensional shape measurement (arrow c). Measurement (arrow d) is also performed. As a result, the three-dimensional shape of the bumped component 84 can be obtained as the relative height h with respect to the upper surface of the height reference mark 83 as the height reference surface of the evaluation substrate 1. As a result, even when the target evaluation substrate 1 has a flexible characteristic such as a thin resin substrate, and the evaluation substrate 1 is warped, the three-dimensional component mounting accuracy is high. It is possible to measure with. The height reference mark 32 in the odd-shaped part land group 3 has a similar function.

  As described above, in the present embodiment, the shape and size for performing the evaluation mounting operation for each of a plurality of types of electronic components including at least a chip-type electronic component and a package-type electronic component on the evaluation substrate. By forming a plurality of land groups having different sizes, it is possible to realize an evaluation substrate excellent in multi-product compatibility.

Also, as a land arrangement pattern for mounting package-type electronic components, by providing overlapping arrangement land rows in which lands corresponding to leads provided on opposite sides of adjacent electronic components are overlapped in the same area In addition, it is possible to visually confirm the mounting position accuracy, and among the land groups, a narrow adjacent land group in which minute parts are arranged at a narrow pitch is subjected to an evaluation mounting operation for a plurality of package type electronic components. By disposing in the center region sandwiched between the lands for the purpose, it is possible to mount a micro component requiring high measurement accuracy on the center of the substrate that is easy to perform measurement work, and to realize an evaluation substrate with excellent usability.

  The evaluation substrate of the present invention has the advantages of being compatible with various products and being excellent in usability, and can be used in the field of manufacturing a mounting substrate by mounting electronic components on the substrate.

The top view which shows the whole structure of the board | substrate for evaluation of one embodiment of this invention Explanatory drawing of the mounting operation | movement for evaluation in the board | substrate for evaluation of one embodiment of this invention Explanatory drawing of land arrangement | positioning in the board | substrate for evaluation of one embodiment of this invention Explanatory drawing of the adjacent arrangement pattern of the land in the board | substrate for evaluation of one embodiment of this invention Explanatory drawing of the evaluation component mounting operation | movement in the evaluation board | substrate of one embodiment of this invention Explanatory drawing of land arrangement | positioning and height reference mark arrangement | positioning for package type components in the board | substrate for evaluation of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Evaluation board | substrate 2 Cross mount land group 2a Land group according to parts 2b Land row 2c Overlapping arrangement land row 3 Deformed part land group 4 Multi-pin QFP land group 5 Narrowly adjacent land group 6, 7 Chip part land group 8 Bumped part land Group 9 QFP component land group 21, 31, 41, 51, 61, 71, 81, 91 Land 22, 22 * Electronic component 23, 23 * Lead 32, 83 Height reference mark 42, 82 Recognition mark

Claims (1)

In an electronic component mounting apparatus in which an electronic component is held by a mounting head and mounted on a board, an evaluation board used for evaluating the function of the apparatus,
Shapes and sizes for performing evaluation mounting operations for multiple types of electronic components, including at least chip-type electronic components with solder bonding terminals and package-type electronic components with solder bonding leads A plurality of land groups with different
A narrow adjacent mounting pattern in which lands of minute parts having a land size smaller than that of the package type electronic component in the land group are arranged with a narrow pitch narrower than the pitch of the land of the package type electronic component are mounted. A narrow adjacent land group for performing an evaluation mounting operation as a target is arranged in a central region sandwiched between a plurality of land groups for performing an evaluation mounting operation for the plurality of package-type electronic components. Evaluation board.

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