JP4893651B2 - Component mounting apparatus and mounting method - Google Patents

Description

  The present invention provides a resin from a belt-shaped component assembly in which at least one of a plurality of IC chips, a package thereof and a wiring pattern including bonding electrodes, or a wiring pattern including bonding electrodes is disposed on a band-shaped resin sheet at a predetermined interval. The present invention relates to a component mounting apparatus and a mounting method for cutting out a component in which an IC chip and its package are disposed on a sheet, or a component in which a wiring pattern including a bonding electrode is disposed and mounting it on various substrates.

  As a component 4 in which a wiring pattern including an IC chip, its package and a bonding electrode is disposed on the resin sheet, a resin sheet 7 as shown in a COF (Chip On Film) component 4A shown in FIG. An IC chip 10 is mounted on a wiring pattern 8 having a bonding electrode 9 disposed on at least one surface, and the bonding electrode 9 and the IC chip 10 are mounted on one surface, as shown in FIG. Like the TCP (Tape Carried Package) component 4B and the TAB (Tape Automated Bonding) component, the IC chip 10 and its surface on the surface opposite to the surface on which the wiring pattern 8 having the bonding electrode 9 of the resin sheet 7 is provided. Some packages are arranged. Further, as a component in which a wiring pattern including a bonding electrode is provided on a resin sheet, a flexible substrate such as an FPC (Flexible Printed Circuit) substrate shown in FIG. 18C is provided on at least one surface of the resin sheet 7. Some are provided with a wiring pattern 8 including a bonding electrode 9.

  In a conventional component mounting apparatus that mounts these components on a board, the strip-shaped component assembly is pitch-fed at the interval between the components, and the resin sheet is cut together with the wiring pattern by a punching device at a predetermined component cutting position. Each part is cut out, transferred to the delivery position, the part at the delivery position is held by the mounting head, and the held part is different from the substrate positioned at the predetermined position by the mounting head in advance. Bonding electrodes of components by temporarily pressing and mounting at a predetermined mounting position where an anisotropic conductive material is affixed, and then heat-pressing the bonding portion of the component at a temperature and pressure higher than those of the temporary pressing And the bonding electrode of the substrate are bonded, and the component is mounted on the substrate (for example, see Patent Document 1).

  In the process of cutting out each part from the strip-shaped part assembly, conventionally, the punched part is composed of an upper die and a lower die, the punched part is lifted with a knockout pin (punch), and then transferred with a transfer nozzle. Although it was designed to be picked up and transferred to the delivery position, there was a problem that the parts were displaced when picked up by the knockout pin, and there was a problem that the picking up by the transfer nozzle might not be performed properly. In the component mounting apparatus of 1, the punching die is punched with a lower die having a through hole and a punch, and the punched component is picked up by a transfer nozzle from below and received and transferred to a delivery position. I have to.

  In addition, in the manufacturing process of the TAB tape for manufacturing the TAB component, the sprocket holes on both sides in the width direction of the tape in which copper foil is laminated on both sides of the polyimide are used as the laser applied in relation to the manufacturing of the above component. The sprocket hole in the middle in the width direction is punched with a mold, and the back surface is shaped like an outer moat along the outer shape of the sprocket hole with a UV-YAG laser from one side, similar to the formation of the via hole that connects the copper foils on the front and back sides. Form a groove with the copper foil on the side left, then etch the copper foil from the opposite surface to remove the bottom surface of the outer moat-shaped groove, and drop off the inner part of the outer moat-shaped groove A technique is known (for example, refer to Patent Document 2).

In addition, in a manufacturing process of a TAB tape for BGA (Ball Grid Array), it is known that a through hole is formed in a resin sheet (polyimide film) with a galvano CO2 laser (for example, see Patent Document 3).
Japanese Patent No. 3024457 Japanese Patent No. 3965553 JP-A-11-135575

  By the way, in the method of punching out a resin sheet made of polyimide or the like having a metal wiring pattern such as copper foil with a mold as in the above-mentioned Patent Document 1, burrs or the like are generated and the fragments are Therefore, it is necessary to clean the mold in a relatively short time, which is a cause of lowering productivity. In particular, since the resin sheet and the wiring pattern formed thereon have been made thinner in recent years, it is necessary to set the clearance of the shearing part between the upper die or the punch and the lower die to a very small dimension. As a result, there has been a problem that the mold needs to be cleaned more frequently and the productivity is lowered.

  On the other hand, in recent years, bonding electrodes are arranged in a portion called a “frame portion” of one or a plurality of side edge portions of the display portion in the case of a mounting portion on a substrate on which a component is mounted (in the case of a display panel substrate). ), That is, the width dimension of the mounting portion, which is the longitudinal direction of each terminal of the bonding electrode, and the progress of thinning and narrowing of the wiring pattern and bonding electrode is remarkable. There is a need for improved dimensional accuracy. For this reason, it has been difficult to find other suitable cutting methods that can improve productivity other than punching with a mold.

  For example, it is conceivable to cut out a part with a YAG laser, a UV-YAG laser described in Patent Document 2, or a CO2 laser described in Patent Document 3, but a cutting part for cutting out the part is Since the copper foil bonding electrodes are intermittently arranged on one side of the resin sheet, there is a problem that both the resin sheet and the bonding electrode cannot be cut with high accuracy. That is, since the bonding electrode is thinned and narrowed as described above, the vicinity of the cutting portion of the bonding electrode is greatly melted, distorted, warped, and proper bonding becomes impossible, There is a problem that the vicinity of the cut portion of the resin sheet is greatly melted or blackened, or conversely, either the bonding electrode or the resin sheet is not cut. In general, a fundamental wave YAG laser (wavelength: 1064 nm) is suitable for cutting a metal-based material, but a resin sheet cannot be cut, and a CO2 laser (wavelength: 10600 nm) is mainly thermal processing. Therefore, it is suitable for cutting a resin-based material, but there is a problem that the bonding electrode burns out and cannot be cut accurately. In addition, Patent Document 2 to which a UV-YAG laser (wavelength: 355 nm) mainly used for chemical processing is applied is a continuous surface by irradiating laser light from the surface of a polyimide copper foil whose entire surfaces are covered with copper foil. The copper foil and polyimide are processed into a groove shape, but when applied to the cutting of a resin sheet having a joining electrode intermittently on the surface, it is impossible to cut reliably or an abnormality occurs in the joining electrode and the proper There was a problem that it was impossible to cut to ensure the joining.

  In view of the above-described conventional problems, the present invention can cut out a component in which an IC chip and its package are arranged on a resin sheet from the band-shaped component assembly with high productivity and accuracy and mount it on a substrate. An object is to provide a component mounting apparatus and a mounting method.

  The component mounting apparatus according to the present invention has a large number of components in which at least one of an IC chip, a wiring pattern including a package thereof and a bonding electrode, or a wiring pattern including a bonding electrode is disposed on a resin sheet. A component feeding section for intermittently feeding the belt-shaped component assembly arranged on the surface, and a laser having a wavelength of 780 nm or less from the surface opposite to the wiring pattern placement side of the resin sheet, A laser cutting unit that cuts the outer periphery of the component including the part and cuts out the component, and a mounting unit that aligns the bonding electrode of the cut-out component with the bonding electrode of the substrate and mounts the component on the substrate.

  According to this configuration, each component can be cut out from the belt-like component assembly by laser irradiation and mounted on the substrate, and there is no need to frequently clean the die as in the case of punching out with a die. Therefore, high-productivity component mounting can be realized, and when cutting out by laser irradiation, a short wavelength laser mainly for chemical processing of 780 nm or less is irradiated from the surface of the resin sheet opposite to the wiring pattern arrangement side. As a result, the resin sheet is largely melted or burnt while the bonding electrode of the wiring pattern cannot be cut because it is not a cutting process mainly performed by a laser having a long wavelength such as a CO2 laser (wavelength: 10600 nm). By irradiating the laser from the surface side of the resin sheet that is not continuous, The resin sheet can be continuously and accurately cut, and the laser is irradiated to the joining electrode made of a metal foil intermittently existing on the back side of the resin sheet before the laser cutting. The joint electrode made of metal foil that is intermittently present from the part is irradiated with laser while the heat is transferred to the joint electrode. It can cut reliably and accurately without causing such melting damage, distortion, and warping. By the way, when the laser is irradiated at an output and moving speed that can be appropriately cut at the part of the resin sheet alone when the laser is irradiated from the side where the bonding electrode is disposed, the laser is irradiated on the surface of the bonding electrode arrangement part made of metal foil. If the laser beam is irradiated with an output and moving speed that can be reliably cut off the arrangement part of the bonding electrode, the resin sheet alone may be greatly melted or burnt. Therefore, it is impossible to perform cutting with high dimensional accuracy.

  The thickness of the resin sheet of the component is preferably 50 μm or less, and the thickness of the metal foil forming the wiring pattern including the bonding electrode is preferably 10 μm or less. That is, in recent years, the thickness of the resin sheet is 50 μm or less and the thickness of the metal foil is 10 μm or less, and the above-mentioned effects are more effectively exhibited by laser irradiation with a wavelength of 780 nm or less. Thus, cutting with high productivity and high accuracy can be realized stably.

  The laser cutting unit also includes a stage that supports a part portion to be cut out of the band-shaped component assembly, laser irradiation means disposed on the upper part of the stage, and a position mark provided on the part through the light transmitting part of the stage. If the cutting position by the laser irradiation unit is controlled based on the detection result of the component position detecting unit, the component can be cut out with high positional accuracy and the dimensional accuracy of the bonding electrode can be increased. Even if the width dimension of the portion where the substrate-side bonding electrode is disposed is small, the bonding can be reliably performed with high reliability.

  The cut-out shape of the outer periphery of the component by the laser cutting unit is a square shape, and the laser cutting unit is provided with first and second laser irradiation means in the moving direction of the band-shaped component assembly, and the first laser The irradiation means cuts both side edges in the longitudinal direction of the belt-like component assembly of the component, and the second laser irradiation means cuts the bonding electrode portion on both side edges orthogonal to the longitudinal direction of the belt-like component assembly of the parts. By cutting the two parallel sides of the four circumferences separately with the laser irradiation means, the component can be cut out in a shorter time.

  Further, the component mounting method of the present invention includes a belt-shaped resin sheet in which a resin sheet is provided with at least one of a wiring pattern including an IC chip, a package thereof and a bonding electrode, or a wiring pattern including a bonding electrode. Irradiating a laser having a wavelength of 780 nm or less from the surface opposite to the wiring pattern placement side of the resin sheet, the component feeding step of intermittently feeding the strip-shaped component assembly continuously disposed on It has a component cutting-out process for cutting out the outer periphery of the component including the bonding electrode portion and cutting out the component, and a mounting process for aligning the bonding electrode of the cut-out component with the bonding electrode of the substrate and mounting the component on the substrate .

  According to this configuration, as described above, each component is cut out from the belt-shaped component assembly by laser irradiation and mounted on the substrate, so that, for example, burrs when punching with a die are cut out as compared with the case where the component is cut out with a die Can be mounted with good productivity, and the part is cut out by irradiating a laser with a short wavelength of 780 nm or less from the surface of the resin sheet opposite to the wiring pattern arrangement side. The resin sheet can be continuously and accurately cut by laser irradiation from the front surface side of the continuous resin sheet, and continuously on the bonding electrode made of a metal foil present intermittently on the back surface side. Heat at the time of laser processing of the resin sheet is transferred, and the bonding electrode is cut by laser irradiation in this state, so that the resin sheet can be cut reliably and accurately.

  In addition, when the thickness of the resin sheet of the component is 50 μm or less and the thickness of the metal foil forming the wiring pattern including the bonding electrode is 10 μm or less, the above-described effects are more effectively exhibited and the productivity is high. Accurate cutting can be realized stably.

  In addition, the part part to be cut out of the belt-like part assembly is supported on the stage, the position mark provided on the part is recognized through the light transmitting part of the stage, the part position is detected, and the laser is based on the detected part position. When cutting by controlling the irradiation position, the position of the part at the time of recognition and the position of the part at the time of laser processing by laser irradiation can be made the same, so the part can be cut out with high positional accuracy. Since the dimensional accuracy is high, even if the width dimension of the portion where the bonding electrode on the substrate side is disposed is small, the bonding can be reliably performed with high reliability.

  Further, the cut-out shape of the outer periphery of the component by the laser irradiation means by the laser irradiation is a square shape, the first and second laser irradiation means are arranged in the moving direction of the band-shaped component assembly, and the band-shaped component assembly of the component When both side edges in the longitudinal direction are cut by the first laser irradiating means, and the joining electrode portions on both side edges orthogonal to the longitudinal direction of the band-like component assembly of the parts are cut by the second laser irradiating means, By cutting the two parallel sides of the four circumferences separately with the laser irradiation means, the component can be cut out in a shorter time.

  According to the component mounting apparatus and the mounting method of the present invention, since each component is cut out from the strip-shaped component assembly by laser irradiation and mounted on the substrate, frequent cleaning is unnecessary as in the case of punching with a mold. High-precision component mounting is possible, and by irradiating a short-wavelength laser of 780 nm or less from the surface side of the resin sheet that is continuously continuous, the resin sheet can be cut continuously and accurately, and the back surface side Since the joining electrode that is intermittently present is irradiated with laser in a state where the joining electrode is heated via the resin sheet, the joining electrode is cut, so that the resin sheet and the joining electrode can be cut reliably and accurately.

  Hereinafter, an embodiment in which the present invention is applied to a component mounting apparatus that mounts components on a side edge portion of a glass substrate of a liquid crystal display panel will be described with reference to FIGS.

  1 to 7, the component mounting apparatus according to the present embodiment includes a substrate carry-in device 2 that carries a substrate 1 such as a glass substrate, and the movement and positioning associated with the component mounting operation by receiving the substrate 1 from the substrate carry-in device 2. The moving device 3 to be performed, the mounting device 5 for mounting the component 4 on the side edge portion of the substrate 1 positioned by the moving device 3, and the substrate unloading device for receiving and unloading the substrate 1 mounted with the component from the moving device 3 6 is provided.

  As shown in FIGS. 5 and 6, the component 4 in this embodiment is a COF (Chip On) in which a wiring pattern 8 having bonding electrodes 9 is formed on at least one surface of a resin sheet 7 and an IC chip 10 is mounted. The bonding electrode 9 and the IC chip 10 are disposed on one side of the resin sheet 7. A large number of these parts 4 are manufactured in the form of a strip-shaped component assembly 11 continuously disposed at a predetermined pitch interval on a strip-shaped resin sheet 12 having long strips and sprocket holes 12a for feeding on both sides. When 4 is cut out, the resin sheet 7 is cut from the belt-shaped resin sheet 12. The strip-shaped component assembly 11 is supplied by being wound around a reel 13 (see FIG. 1), and as shown in FIG. 6, along a cutting line 14 (data of a cutting position for control) surrounding the outer periphery of the component 4. Each component 4 is cut out by cutting.

  Of the four cutting lines 14, the pair of cutting lines 14 a along the longitudinal direction of the strip-shaped resin sheet 12 cuts at least the resin sheet 7, and the width direction of the strip-shaped resin sheet 12 (direction orthogonal to the longitudinal direction). ) Along the pair of cutting lines 14b cut the resin sheet 7 and the joining electrodes 9 that are intermittently present on one side thereof. Further, the joining electrode 9 cut at one of the pair of cutting lines 14b is an output-side joining electrode 9a joined to the joining electrode of the substrate 1, and the joining electrode 9 cut at the other is the circuit board 15 (FIG. 17), the input-side joining electrode 9b to be joined to the joining electrode.

  As shown in FIG. 17A, the substrate 1 of the liquid crystal display panel of the present embodiment is provided with a circuit board 15 for driving and controlling the source side and the gate side of the liquid crystal display panel corresponding to two adjacent sides. The bonding electrode 9a on the output side of the component 4 is bonded to the bonding electrode disposed on the two adjacent side edges of the substrate 1, and the bonding electrode 9b on the input side of each component 4 is connected to the circuit. Bonded to the bonding electrode of the substrate 15. As shown in FIG. 17B, the bonding electrode 9a of the component 4 and the bonding electrode (mounting part) 1a of the substrate 1, and the bonding electrode 9b of the component 4 and the bonding electrode 15a of the circuit board 15 are anisotropic. It is joined so as to be electrically connected and mechanically fixed through the conductive material (ACF) 16.

  Further, as shown in FIG. 7, the resin sheet 7 of the component 4 is made of polyimide having a thickness T of 50 μm or less, specifically 38 μm, and the wiring pattern 8 and the bonding electrode 9 constituting the wiring pattern are thick. The thickness t is 10 μm or less, and a specific example is made of 8 μm copper foil. The arrangement pitch P of the bonding electrodes 9 is 100 μm or less for the output-side bonding electrodes 9a, specifically 70 μm pitch, and about 300 to 500 μm for the output-side bonding electrodes 9b.

  As shown in FIGS. 1 and 2, the mounting apparatus 5 that cuts out each component 4 from the strip-shaped component assembly 11 and mounts it on the substrate 1 intermittently sends the strip-shaped component assembly 11 from the reel 13 as shown in FIGS. 1 and 2. A feeding part 21 to be fed, a laser cutting part 22 that cuts the outer periphery of the part 4 including the bonding electrode 9 along a cutting line 14 that is cutting position data for control, and cuts out the part 4; The bonding electrode 9a is aligned with the bonding electrode 1a of the substrate 1 and a mounting portion 23 for mounting the component 4 on the substrate 1 is provided.

  The component feeding unit 21 passes the belt-shaped component assembly 11 pulled out from the reel 13 through the guide roller 24 and the tension mechanism unit 25 so that a predetermined tension is applied to the guide roller 26 and the guide member 27. The belt-shaped resin sheet 12 after the component 4 is cut out by the laser cutting unit 22 is fed to the component 4 by the feed roller 28 having feed teeth that engage with the sprocket holes 12a. According to the arrangement pitch, the paper is intermittently sent out and discarded into the disposal box 30 via the guide roller 29a and the discharge roller 29b. The tension mechanism unit 25 is movably supported and is urged to move in one direction by gravity, a spring, or the like, and is spaced apart from the opposite side of the tension roller 25a. The belt-shaped component assembly 11 is wound approximately 180 ° around the tension roller 25a between the pair of guide rollers 25b, and the belt-shaped component assembly 11 is reduced by about a biasing force. Half tension is applied.

  As shown in detail in FIGS. 3 and 4, the laser cutting unit 22 is a resin sheet that is continuous with the intermittent wiring pattern 8 on the side opposite to the side where the wiring pattern 8 of the resin sheet 7 is provided. A laser irradiation means 31 is disposed on the upper side so as to irradiate a laser having a wavelength of 780 nm or less, specifically a green laser having a wavelength of 532 nm, from above toward the surface. A stage 32 that supports the band-shaped component assembly 11 is disposed so as to face the lower portion of the laser irradiation means 31. The stage 32 is composed of a transparent quartz plate or the like, and a recognition camera 33 as a part position recognition unit is disposed below the stage 32, and a position mark (not shown) provided on the part 4 is marked with the stage 32. The position of the component 4 is detected with high accuracy through image recognition. Since the position mark (not shown) may be recognized through the stage 32, the stage 32 may not necessarily be transparent, but may be provided with an opening at a position mark (not shown). An illumination means 34 for recognizing an image is disposed at the upper part around the stage 32.

  The laser irradiation means 31 is configured to scan the laser 35 based on the position detection result of the component 4 obtained from the image data obtained by the recognition camera 33. As a result, as shown in FIG. 6, the laser 35 is scanned along the intended cutting line 14 with high positional accuracy, and the bonding electrodes 9a and 9b are cut with high dimensional accuracy. As shown in FIG. Is cut out. As a result, as shown in FIG. 17B, the width dimension of the side edge portion (sometimes referred to as “frame portion”) where the bonding electrode (mounting portion) 1a of the substrate 1 is disposed is small, and the substrate Even if the gap d between the rising side edge 1b on the display unit 1 side and the opposing side edge of the component 4 is set to a small dimension such as 0.3 mm, it can be stably and reliably joined. it can. Further, when cutting by the laser 35, by providing means (not shown) for blowing and sucking air to the cutting site, soot that may be generated during cutting adheres to the component 4. Can be prevented. Further, since the laser 35 is a green laser, various data such as the history can be printed on each component 4 at the time of cutting so that the history of the component 4 mounted on the substrate 1 can be traced.

  Next, an operation until the component 4 cut out from the strip-shaped component assembly 11 of the mounting apparatus 5 shown in FIGS. 1 and 2 is mounted on the substrate 1 will be described. The mounting unit 23 of the mounting apparatus 5 includes a transfer means 37 that holds the component 4 cut out by the laser cutting unit 22 and transfers it to the temporary placement table 36 at the delivery position, and a component transferred to the temporary placement table 36. 4, a mounting head 38 that is mounted on the side edge of the substrate 1 where the bonding electrode 1 a is disposed, and a cradle 39 that supports the side edge of the substrate 1 from below. The mounting head 38 is mounted on a movable body 41 that can reciprocate between a temporary table 36 and a receiving table 39 on a moving table 40, and mounting means 42 that can move up and down and a recognition camera 43 are mounted. The position of the upper part 4 is recognized and held by the mounting means 42, and is passed through the cradle 39 by a recognition camera (not shown) provided at the lower part of the cradle 39 which is at least partially made of a transparent body. By recognizing the position of the bonding electrode 1a of the substrate 1 and the position of the component 4 and mounting the component 4, it is configured to be mounted with high positional accuracy.

  In this embodiment, the source-side component 4 bonded to one side edge of the substrate 1 and the gate-side component 4 bonded to the other adjacent side edge of the substrate 1 can be sequentially mounted. In addition, a pair of component supply units 21 and 21 for feeding the respective components 4 are arranged in parallel so as to be position-switchable.

  According to this embodiment, each component 4 is cut out from the strip-shaped component assembly 11 by irradiation of the laser 35 at the laser cutting unit 22 and mounted on the substrate 1 at the mounting unit 23. Thus, it is not necessary to frequently clean the mold as in the case of punching out and cutting out the components, and the productivity of mounting the components 4 on the substrate 1 can be improved. Further, when cutting out the component 4, a short wavelength green laser mainly used for chemical processing from the surface of the resin sheet 7 on the side opposite to the side where the wiring pattern 8 made of a metal foil is present intermittently. (The wavelength of 532 nm, which is half the wavelength of the YAG laser) is irradiated, so that the resin sheet 7 is greatly melted or damaged because it is not cut by thermal processing with a long wavelength laser like a general CO2 laser. While being burnt, there is no case where the bonding electrode 9 of the wiring pattern 8 cannot be cut. Moreover, by irradiating the laser 35 from the surface side of the resin sheet 7 which is continuous in a plane, the resin sheet 7 can be continuously and accurately cut, and the opposite side of the surface of the resin sheet 7 in the meantime. The heat at the time of laser processing of the resin sheet 7 continuous prior to laser cutting is transferred to the connection electrode 9 made of a metal foil that is intermittently present on the back surface side, and is heated in advance, By irradiating the connection electrode 9 with the laser 35, the connection electrode 9 can be reliably and accurately cut without causing melting, distortion, or warping, which cannot be cut or adversely affect bonding. In particular, the thickness of the resin sheet 7 of the component 4 is 38 μm which is 50 μm or less, and the thickness of the metal foil which forms the wiring pattern 8 including the bonding electrode 9 is 8 μm which is 10 μm or less. The above-described effects are more effectively exhibited by the irradiation of the laser 35, and high productivity and accurate cutting can be stably realized.

  Further, in the laser cutting unit 22, the position of the component 4 is detected by the recognition camera 33 as the component position detecting means, and the cutting position by the laser irradiation means 31 is controlled based on the detection result. 4 can be cut out with high dimensional accuracy, and the dimensional accuracy of the bonding electrode 9 of the component 4 is high. Therefore, as shown in FIG. 17B, the portion of the bonding electrode 1a on the substrate 1 side is disposed. Even if the width dimension (the width dimension of the frame portion of the substrate 1) is small, it can be reliably bonded with high reliability.

  Next, specific examples will be described. Applying laser irradiation means 31 for irradiating a green laser with an output of 6 W and a wavelength of 532 nm from the surface side of the resin sheet 7 that is continuous in plane, with an output of 85% and a laser scanning speed of 65 mm / s In one scan, the component 4 was cut out from the strip-shaped component assembly 11 in which the wiring pattern 8 of the copper foil having a thickness of 8 μm was laminated on the back surface opposite to the front surface side of the polyimide sheet having a thickness of 38 μm. As shown in FIG. 8, the cut state of the component 4 at the bonding electrode 9 is a back surface side opposite to the surface of the resin sheet 7 on which the bonding electrode 9 is disposed, and a polyimide as illustrated in FIG. 9. Both of the surface sides made of the resin sheet 7 made of a sheet are cut with high accuracy, and the state of the bonding electrodes 9 (9a, 9b) hardly causes melting, distortion or warpage, and exhibits properties suitable for high-precision bonding. ing.

  On the other hand, as a laser irradiation means, a CO2 laser having an output of 30 W and a wavelength of 10600 nm is applied, the output is 80%, and the scanning speed of the laser is 137 mm / s. When the component 4 is cut out from the band-shaped component assembly 11 by scanning once from the surface side of the resin sheet 7, as shown in FIG. 10, the cut portion of the resin sheet 7 is greatly burned and the end of the bonding electrode 9. The parts were scattered and cutting with high precision was not possible. Further, at this time, the input-side joining electrode 9b could not be cut due to the pitch interval and the width dimension being about 3 to 5 times larger than the joining electrode 9a having an output-side arrangement pitch of 100 μm or less. On the other hand, when the processing speed was increased, the resin sheet 7 could be cut, but the bonding electrodes 9 (9a, 9b) could not be cut.

  Further, from the side where the wiring pattern 8 and the joining electrode 9 made of a metal foil intermittently present on the back surface opposite to the surface of the belt-shaped resin sheet 12 in the belt-shaped component assembly 11 are disposed, In this way, the laser irradiation means 31 that irradiates a green laser having an output of 6 W and a wavelength of 532 nm is applied, and the processing speed as the laser scanning speed is in a range of 10 to 150 mm / s at one output at an output of 80%. Then, the part 4 was cut out. When the processing speed was 10 mm / s, the bonding electrode 9 was hardly cut as shown in FIG. Further, when the processing speed was 25 mm / s, as shown in FIG. 12, the charring occurred at the end of the bonding electrode 9, and the cutting with high accuracy could not be realized. Further, when the processing speed was 55 mm / s, the bonding electrode 9 was not cut as shown in FIG. Further, when the processing speed is 150 mm / s and it is cut by scanning three times, as shown in FIG. 14, the bonding electrode 9 is partially cut, but the end of the cut bonding electrode 9 is charred. Occurred. Further, in the example in which the processing speed was 100 mm / s and the sample was scanned and cut twice, as shown in FIG. 15, the input-side joining electrode 9b could not be cut.

  In the above description, the example in which the single laser irradiation means 31 cuts along the cutting lines 14 around the four sides of the component 4 has been shown. However, as another configuration example, as shown in FIG. First and second laser irradiation means 51 and 52 are disposed in the cutting portion 22 in the moving direction of the band-shaped component assembly 11, and the first laser irradiation means 51 makes the length of the band-shaped component assembly 11 of the component 4 long. The cutting line 14a along both side edges in the direction is cut, and the portion of the bonding electrode 9 is cut along the cutting lines 14b along the both side edges perpendicular to the longitudinal direction of the band-like component assembly 11 of the component 4 by the second laser irradiation means 52. You may make it cut | disconnect. Here, the recognition camera 33 and the illumination means 34 are arranged corresponding to the second laser irradiation means 52, and the cutting position by the second laser irradiation means 52 is controlled based on the detection position of the component 4. Is preferred.

  In this way, the parts 4 can be cut out in a shorter time by cutting the two parallel sides 14a and 14b of the cutting line 14 on the four sides of the part 42 separately by the laser irradiation means 51 and 52, respectively. Productivity can be improved, and a recognition camera 33 is provided as a part position detection unit corresponding to the second laser irradiation unit 52, and the cutting position by the second laser irradiation unit 52 is based on the detection result. In particular, the dimensional accuracy of the bonding electrode 9a to be bonded to the bonding electrode of the substrate 1 can be increased as described above, and the width dimension of the portion where the bonding electrode on the substrate 1 side is disposed (the substrate 1). Even if the width dimension of the frame portion is small, it is possible to reliably bond with high reliability.

  According to the component mounting apparatus and the mounting method of the present invention, since each component is cut out from the strip-shaped component assembly by laser irradiation and mounted on the substrate, frequent cleaning is unnecessary as in the case of punching with a mold. High-precision component mounting, and by irradiating a short-wavelength laser of 780 nm or less from the surface side of the continuous resin sheet, the resin sheet can be cut continuously and with high accuracy. The bonding electrode made of a metal foil that is intermittently present on the back side, which is the opposite side of the front surface, is a state in which the heat at the time of laser processing of the resin sheet in which the surface is continuous is heated through this resin sheet Since the bonding electrode is cut by irradiating with the laser, the resin sheet and the connection electrode can be cut reliably and accurately, and as a result, the IC chip and its package and the bonding electrode are formed on the resin sheet. A component at least one of the wiring pattern is provided comprising a wiring pattern or the bonding electrode comprises can be suitably used in the component mounting apparatus to be mounted on various substrates.

The front view which shows the whole schematic structure of one Embodiment of the component mounting apparatus of this invention. The top view which shows the whole schematic structure of the embodiment. The front view which shows the structure of the laser cutting part of the embodiment. The expanded side view which shows the structure of the laser cutting part of the embodiment. The perspective view which shows the strip | belt-shaped component assembly in the same embodiment, and the cutting-out state of components. The perspective view which shows the cutting state which cuts out components in the same embodiment. Explanatory drawing of the dimensional relationship in the joining electrode part of the components in the embodiment. The photograph which shows the cutting state of the surface by the side of the joining electrode arrangement | positioning side of the back surface side which is the other side of the resin sheet of the components in a specific Example. The photograph which shows the cutting state of the surface at the side of the resin sheet of the components in a specific Example. The photograph which shows the cutting state of the joining electrode part of the example cut | disconnected by CO2 laser. The photograph which shows the cutting state of the joining electrode part in the example irradiated with the scanning speed of 10 mm / s from the joining electrode arrangement | positioning surface side. The photograph which shows the cutting state of the joining electrode part in the example irradiated with the scanning speed of 25 mm / s from the joining electrode arrangement | positioning surface side. The photograph which shows the cutting state of the joining electrode part in the example irradiated with the scanning speed of 55 mm / s from the joining electrode arrangement | positioning surface side. The photograph which shows the cutting | disconnection state of the joining electrode part in the example irradiated 3 times with the scanning speed of 150 mm / s from the joining electrode arrangement | positioning surface side. The photograph which shows the cutting state of the joining electrode part in the example irradiated twice with the scanning speed of 100 mm / s from the joining electrode arrangement | positioning surface side. The perspective view which shows the other structural example of the laser cutting part in the embodiment. The joining state of a board | substrate, components, and a circuit board is shown, (a) is a perspective view, (b) is a longitudinal cross-sectional view. FIG. 3A is a perspective view of a COF, FIG. 2B is a perspective view of a TCP, and FIG. 3C is a perspective view of an FPC.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 4 Component 5 Mounting apparatus 7 Resin sheet 8 Wiring pattern 9 (9a, 9b) Joining electrode 10 IC chip 11 Band-shaped component assembly 14 Cutting line 21 Component feeding part 22 Laser cutting part 23 Mounting part 31 Laser irradiation means 32 Stage 33 Recognition camera (part position recognition means)
35 Laser 51 First laser irradiation means 52 Second laser irradiation means

Claims (8)

  A strip-shaped component in which at least one of a wiring pattern including an IC chip or a package thereof and a bonding electrode or a wiring pattern including a bonding electrode is disposed on a resin sheet, and the strip-shaped resin sheet is continuously disposed. Irradiate a laser with a wavelength of 780 nm or less from the surface of the part opposite to the wiring pattern placement side of the resin sheet, and cut the outer periphery of the part including the bonding electrode part. A component mounting apparatus comprising: a laser cutting unit that cuts out a component; and a mounting unit that aligns the bonding electrode of the cut-out component with the bonding electrode of the substrate and mounts the component on the substrate.   2. The component mounting apparatus according to claim 1, wherein the thickness of the resin sheet of the component is 50 [mu] m or less, and the thickness of the metal foil forming the wiring pattern including the bonding electrode is 10 [mu] m or less.   The laser cutting part recognizes a position mark provided on the part through a stage that supports a part part to be cut out of the belt-like part assembly, a laser irradiation means disposed on the upper part of the stage, and a light transmitting part of the stage. The component mounting apparatus according to claim 1, further comprising: a component position detecting unit, wherein the cutting position by the laser irradiation unit is controlled based on a detection result of the component position detecting unit.   The cut-out shape of the outer periphery of the component by the laser cutting portion is a square shape, and the laser cutting portion is provided with first and second laser irradiation means in the moving direction of the strip-shaped component assembly, and the first laser irradiation means. Is characterized in that both side edges in the longitudinal direction of the band-shaped part assembly of the parts are cut, and the second laser irradiation means cuts the joining electrode portions on both side edges orthogonal to the longitudinal direction of the band-like part assembly of the parts. The component mounting apparatus as described in any one of Claims 1-3.   A strip-shaped component in which at least one of a wiring pattern including an IC chip or a package thereof and a bonding electrode or a wiring pattern including a bonding electrode is disposed on a resin sheet, and the strip-shaped resin sheet is continuously disposed. A component feeding process for intermittently feeding the assembly, and a laser having a wavelength of 780 nm or less is irradiated from the surface of the resin sheet opposite to the wiring pattern arrangement side, and the outer periphery of the component including the bonding electrode portion is cut. A component mounting method comprising: a component cutting step for cutting out a component, and a mounting step for aligning the bonding electrode of the cut component with the bonding electrode of the substrate and mounting the component on the substrate . 6. The component mounting method according to claim 5 , wherein the thickness of the resin sheet of the component is 50 [mu] m or less, and the thickness of the metal foil forming the wiring pattern including the bonding electrode is 10 [mu] m or less. The part part to be cut out of the band-like part assembly is supported on the stage, the position mark provided on the part is recognized through the light transmitting part of the stage, the part position is detected, and the laser irradiation position based on the detected part position 7. The component mounting method according to claim 5 or 6, wherein the cutting is performed by controlling. The cutting shape of the outer periphery of the component in the component cutting step by laser irradiation is a square shape. In this component cutting step, the first and second laser irradiation means are arranged in the moving direction of the band-shaped component assembly, Both side edges in the longitudinal direction of the strip-shaped component assembly are cut by the first laser irradiation means, and the joining electrode portions on both side edges orthogonal to the longitudinal direction of the strip-shaped component assembly are cut by the second laser irradiation means. component mounting method according to any one of claims 5-7, characterized in that.