JP4896776B2 - Reflow device - Google Patents

Description

  The present invention relates to a reflow apparatus used for soldering a printed wiring board and an electronic component.

  In a reflow apparatus used for soldering a printed wiring board (hereinafter referred to as “substrate”) and an electronic component, a reflow and heating furnace is usually used to solder the electronic component mounted on the substrate. Is provided, and a transfer conveyor for transferring a substrate to be soldered is disposed in the furnace.

  The furnace of the reflow apparatus further includes a preheating unit for preheating the substrate, a main heating unit for heating the substrate to a temperature higher than the melting point of the solder, and a cooling unit for cooling the substrate after soldering. Are provided in this order along the transport direction. The preheating unit and the main heating unit in the furnace are provided with heating means for reflow heating the substrate. Examples of such heating means include those using hot air, those using heat rays such as infrared rays, and those using these in combination.

  A reflow apparatus used for soldering a printed wiring board and an electronic component is disclosed in, for example, Patent Document 1. FIG. 4 is a schematic view showing a main part of the reflow furnace disclosed in Patent Document 1. As shown in FIG.

As shown in FIG. 4, the reflow furnace includes a transport conveyor 203 that transports the substrate 200 and a preheating unit 204 a that preheats the substrate 200 transported by the transport conveyor 203 when the components are soldered to the substrate 200. A furnace 202 in which a main heating unit 204b that heats the substrate 200 to a temperature equal to or higher than the melting point of the solder and a cooling unit 5 that cools the substrate 200 are provided in this order along the transport direction of the transport conveyor 203. And a control device for controlling the conveyance of the substrate 200 by the conveyance conveyor 203.
JP 2005-116575 A

  In the reflow apparatus described in Patent Document 1, it is said that the temperature distribution of the substrate can be made constant, and thereby soldering can be performed satisfactorily. However, for reasons of production processes, etc., depending on the type of substrate, it may be necessary to carry the solder in the reflow apparatus while the substrate is mounted on a jig. For example, when responding to demand-synchronized production, it is necessary to produce not in units of substrate sheets but in units of substrate pieces. As another example, a jig is used in the case of a substrate that needs to be held, such as a flexible substrate, or a substrate that warps greatly by heating.

  That is, in the conventional reflow apparatus as described in Patent Document 1, temperature control of the substrate is not always easy when the substrate is mounted on a jig, for example, heat is absorbed by the jig. As a result, there is a problem that good soldering cannot be performed.

  The present invention has been made in view of the circumstances as described above, and its purpose is to make the temperature distribution of the substrate constant without causing adverse effects such as damage to mounted components on the substrate, And it is providing the reflow apparatus which can perform soldering to a board | substrate satisfactorily, even if it is the state mounted in the jig | tool.

To solve the above problem,
Conveying means for conveying a substrate mounting jig including the substrate and a jig on which the substrate is mounted when soldering a component to the substrate;
One preheating unit for preheating the substrate mounting jig, and heating the substrate mounting jig to a temperature equal to or higher than the melting point of the solder on the downstream side in the transport direction by the transport unit 1 A furnace having therein one main heating section and one cooling section for cooling the substrate mounting jig downstream of the main heating section ;
Heating means comprising a hot plate that is installed on at least one of the top and bottom of the transport means in each of the preliminary heating section, the main heating section, and the cooling section in the furnace, and heats the substrate mounting jig. ;
Ascending / descending means capable of raising and lowering the heating means together with the substrate mounting jig, and stopping conveyance of the substrate mounting jig by raising;
Control means for controlling the transport of the substrate mounting jig by the transport means and the position of the ascending / descending means;
With at least,
The cooling unit is set at a temperature lower than that of the main heating unit by the heating unit, and the substrate is heated in the preliminary heating unit, the main heating unit, and the cooling unit without stopping the transport unit. Rukoto which have a cooling configurations,
The reflow apparatus characterized by this is provided.

  According to the reflow apparatus of the present invention having such a configuration, the temperature distribution of the substrate can be made constant without causing adverse effects such as damage of mounted components on the substrate. A heating means for heating the substrate mounting jig installed below, and a raising / lowering means capable of raising and lowering the heating means together with the substrate mounting jig and stopping the conveyance of the substrate mounting jig by the raising; Therefore, even if it is in a state of being mounted on a jig, it can be satisfactorily soldered to the substrate.

  According to the present invention, the temperature distribution of the substrate can be made constant without causing adverse effects such as damage to the mounted components on the substrate, and even if the substrate is mounted on the jig, It is possible to provide a reflow apparatus that can perform soldering satisfactorily.

The reflow apparatus of the present invention
Conveying means for conveying a substrate mounting jig including the substrate and a jig on which the substrate is mounted when soldering a component to the substrate;
One preheating unit for preheating the substrate mounting jig, and heating the substrate mounting jig to a temperature equal to or higher than the melting point of the solder on the downstream side in the transport direction by the transport unit 1 A furnace having therein one main heating section and one cooling section for cooling the substrate mounting jig downstream of the main heating section ;
Heating means comprising a hot plate that is installed on at least one of the top and bottom of the transport means in each of the preliminary heating section, the main heating section, and the cooling section in the furnace, and heats the substrate mounting jig. ;
Ascending / descending means capable of raising and lowering the heating means together with the substrate mounting jig, and stopping conveyance of the substrate mounting jig by raising;
Control means for controlling the transport of the substrate mounting jig by the transport means and the position of the ascending / descending means;
With at least,
The cooling unit is set at a temperature lower than that of the main heating unit by the heating unit, and the substrate is heated in the preliminary heating unit, the main heating unit, and the cooling unit without stopping the transport unit. Rukoto of having a cooled configurations, characterized by.

  The heating means installed in at least one of the upper part and the lower part of the conveying means is installed in at least one of the preheating part and the main heating part, and is provided in both the preheating part and the main heating part. It is preferable to be installed. According to such a configuration, each heating unit (preheating unit and main heating unit) in the furnace can be set to a temperature required for each, and a temperature profile corresponding to the type of the substrate, etc. It becomes easy to form.

  The furnace may have a cooling unit for cooling the substrate mounting jig downstream of the main heating unit. In this case, the heating unit is further installed in the cooling unit as a cooling unit. May be used. According to such a configuration, the temperature of the substrate mounted on the jig can be controlled in detail, and an optimum temperature profile can be easily formed according to the type of the substrate.

  As the heating means as described above, it is preferable to use a plate-like heater (hot plate). According to such a configuration, the present invention can be realized more reliably. That is, if the heating means is installed on the lower side in the vertical direction of the transport means, the substrate mounting jig being transported is lifted from below by raising the heating means while operating the transport means. The conveyance of the substrate mounting jig can be stopped, and the substrate mounting jig can be returned to the conveying means by the lowering to resume the conveyance of the substrate mounting jig.

  Further, if the heating means is installed on the upper side in the vertical direction of the transport means, the substrate mounting jig being transported is lifted from below by raising the heating means while the transport means is operated. The conveyance of the jig can be stopped, the substrate mounting jig can be pressed against the heating means and heated, and the substrate mounting jig can be returned to the conveying means by descending. Can be resumed.

  The jig is made of aluminum, for example. In this case, black dyeing alumite treatment may be performed. According to such a configuration, there are merits that, for example, the infrared absorption rate of the jig is improved and the temperature is easily increased, and the wear resistance of the jig is improved.

  Each heating time in the preliminary heating unit and the main heating unit is set in advance in the control unit, and the transfer of the substrate mounting jig by the transfer unit is controlled based on the set heating time. Is preferred. According to such a configuration, the temperature of the substrate mounted on the jig can be controlled in more detail, and an optimal temperature profile can be more reliably formed according to the type of the substrate.

  The transport means may be a transport conveyor in which a belt body moves around by a servo motor. The belt body may be made of a material that is not denatured by heating (for example, a heat resistant resin or metal).

  However, the transport conveyor has at least two transport carriers (for example, belt bodies) so that the transport of the substrate mounting jig transported by the transport means can be stopped and raised / lowered. ). According to such a configuration, the substrate mounting jig can be transported and raised / lowered more reliably between the two belt bodies.

  Further, the reflow apparatus of the present invention is based on a detection sensor that detects a substrate mounting jig transported to the preheating unit by the transport means, and a detection result of the detection sensor based on a detection result of the detection sensor. It is preferable to further include a stopper that stops the substrate mounting jig by contacting the substrate mounting jig transported by the transporting means. According to such a structure, the said board | substrate mounting jig conveyed by the said conveyance means can be slid with the said conveyance means, and the said board | substrate to a reflow apparatus is stopped, without stopping operation | movement of the said conveyance means. The supply / stop of the mounting jig can be controlled.

  And the reflow apparatus of this invention is based on the detection sensor which detects the said substrate mounting jig in the stop position in the furnace of the said substrate mounting jig conveyed by the said conveyance means, and the detection result of the said detection sensor. The conveyance of the substrate mounting jig is preferably stopped by the ascending / descending means.

  Furthermore, it is preferable to have a stopper that stops the substrate mounting jig in contact with the substrate mounting jig transported by the transporting means at a stop position of the substrate mounting jig in the furnace. The stopper at the in-furnace stop position may be integrated with the ascending / descending means.

  Here, a preferred embodiment of the reflow apparatus of the present invention will be specifically described with reference to the drawings. FIG. 1 is a longitudinal sectional view for explaining the overall configuration of an embodiment of the reflow apparatus of the present invention, and FIG. 2 is an operation in a part of the main part of the reflow apparatus 1 shown in FIG. It is a figure for demonstrating.

  The reflow apparatus 1 according to the present embodiment is used for soldering a printed circuit board, which is a printed circuit board, and an electronic component. As shown in FIG. 1, a substrate to be soldered and a jig on which the board is mounted. A preheating section 2a for preheating the substrate mounting jig 100 including the tool, a main heating section 2b for main heating the substrate mounting jig 100, and a cooling section 2c for cooling the substrate mounting jig 100. 2 In addition, inside the furnace 2, there is provided a transfer conveyor (the whole is not shown) including two belt bodies 3 that run in parallel as a transfer means for transferring the substrate mounting jig 100.

  The belt body 3 of the transport conveyor is wound around, for example, a plurality of rollers (not shown) and moves around, and the substrate mounting jig 100 is moved from the carry-in port provided in the furnace 2 to the carry-out port. It is installed so that it can be transported in a horizontal state.

  One of the plurality of rollers is connected so that power is transmitted by, for example, a servo motor (not shown), and the roller is rotationally driven by the servo motor. Thereby, the belt body 3 moves around all the rollers. The servo motor is configured to be controlled by a control device (not shown). By the control of the servo motor by the control device, the conveyance speed of the substrate mounting jig 100 by the belt body 3 and the conveyance of the belt body 3 are increased. Control of stopping and restarting is controlled.

  Inside the furnace 2, a preheating unit 2a, a main heating unit 2b, and a cooling unit 2c are arranged in order from the upstream side to the downstream side in the conveyance direction of the substrate mounting jig 100 conveyed by the belt body 3 of the conveyance conveyor. ing. Honeycomb bodies 12a, 12b, and 12c are provided in the preheating unit 2a, the main heating unit 2b, and the cooling unit 2c, respectively, above the conveyance region of the substrate mounting jig 100.

  Further, above the honeycomb bodies 12a, 12b and 12c, fans 8a, 8b and 8c connected to the agitation motors 7a, 7b and 7c, respectively, are provided. Heaters 4a and 4b are provided between the honeycomb bodies 12a and 12b and the fans 8a and 8b, respectively.

  The honeycomb bodies 12a and 12b, the heaters 4a and 4b, the fans 8a and 8b, and the agitation motors 7a and 7b constitute a hot air supply device, which allows the substrate mounting jig 100 to be conveyed. The structure is such that hot air is supplied to heat the substrate. Further, the honeycomb body 12c, the fan 8c, and the stirring motor 7c constitute a cold air supply device, so that the cold air is supplied to the substrate mounting jig 100 to be conveyed to cool the substrate. It has a configuration.

  Of the hot air supply devices, the honeycomb bodies 12a, 12b and 12c serve as temperature uniformizing means for uniformizing the temperature distribution of the substrate mounting jig 100 (particularly the substrate) to be conveyed. More specifically, each of the honeycomb bodies 12a, 12b, and 12c has a configuration in which a plurality of cylindrical hollow portions 12a1, 12b1, and 12c1 that are penetrated are arranged in a plate-like body to rectify hot air. To supply to the substrate mounting jig 100.

  Further, inside the preliminary heating unit 2a, the main heating unit 2b, and the cooling unit 2c, heating or cooling means that is a feature of the present invention, that is, a hot plate 6a, 6b and 6c are arranged.

  Air cylinders 9a, 9b, and 9c are disposed below the hot plates 6a, 6b, and 6c, respectively. These air cylinders 9a, 9b, and 9c are used to mount the hot plates 6a, 6b, and 6c on a substrate mounting jig. The ascending / descending means that can be raised and lowered together with 100 and stops the conveyance of the substrate mounting jig 100 by raising is constituted.

  FIG. 2 shows that the substrate mounting jig 100 carried on the belt body 3 is lifted from the belt body 3 by raising the hot plate 6b in the main heating section 2b of the furnace 2, It is a figure which shows a mode that conveyance is stopped and the board | substrate mounting jig | tool 100 is heated directly on the hotplate 6b. As described above, since the substrate mounting jig 100 is directly heated by the hot plate 6b, the substrate mounted on the jig can be more reliably heated without taking heat away from the jig.

  Here, the mechanism of the hot plate 6b that is the first heating unit included in the main heating unit 2b has been described as a representative, but the hot plate 6a that is the second heating unit included in the preliminary heating unit 2a and The hot plate 6c, which is a cooling means included in the cooling unit 2c, also operates with the same mechanism.

  In the preliminary heating unit 2a, the main heating unit 2b, and the cooling unit 2c, the substrate mounting jig 100 is heated or cooled by the hot plates 6a, 6b, and 6c together with the hot air supply device as described above. In particular, in the preheating unit 2a, the substrate of the substrate mounting jig 100 conveyed into the furnace 2 is preheated to a predetermined temperature that does not reach the melting point of the solder by the heater 4a and the hot plate 6a. In the main heating unit 2b, the substrate of the substrate mounting jig 100 is heated to a temperature equal to or higher than the melting point of the solder by the heater 2b and the hot plate 6b.

  Since the temperature of the cooling unit 2c is lower than the temperatures of the preheating unit 2a and the main heating unit 2b, the substrate is cooled. Although FIG. 1 shows a configuration in which the cooling unit 2c is also provided with a hot plate similar to the preheating unit 2a and the main heating unit 2b, the hot plate 6c may be omitted. Moreover, you may provide the further cold wind supply apparatus instead of the hot plate 6c.

  Although not shown in the drawing, in this embodiment, two pieces are provided at predetermined intervals so that the conveyance of the substrate mounting jig 100 is stopped by the hot plates 6a, 6b and 6c and the substrate mounting jig 100 is heated. The belt bodies 3 are installed so as to run in parallel, and the substrate mounting jig 100 is placed on the two belt bodies 3 and conveyed. Therefore, the hot plates 6a, 6b and 6c are raised and lowered between the two belt bodies 3 by the air cylinders 9a, 9b and 9c.

  Therefore, the width of the substrate mounting jig, the interval between the two belt bodies, and the width of the hot plates 6a, 6b and 6c are transported by placing the substrate mounting jig 100 on the two belt bodies 3, And the board | substrate mounting jig | tool 100 currently conveyed is set so that it may be lifted by the hot plates 6a, 6b, and 6c from the bottom.

Specifically, a surface substantially parallel to the surface formed by the two belt bodies 3 (that is, a surface substantially parallel to the main surfaces of the substrate mounting jig 100 and the hot plates 6a, 6b and 6c to be conveyed) 3 The width in the direction perpendicular to the conveying direction of the substrate mounting jig 100 is larger than the distance between the two belt bodies 3. Further, in the surface 3 ′ substantially parallel to the surface formed by the two belt bodies 3, the width in the direction perpendicular to the conveying direction of the hot plates 6 a, 6 b and 6 c is larger than the interval between the two belt bodies 3. small. That is, the relational expression:
(Width of substrate mounting jig)> (Distance between two belt bodies)> (Width of hot plate)
Holds.

  In FIG. 1, the furnace 2 is provided with one preheating unit 2a, one main heating unit 2b, and one cooling unit 2c, but the number of the preheating unit 2a, the main heating unit 2b, and the cooling unit 2c is as follows. The size can be appropriately selected according to the size of the substrate mounting jig 100, the size of the substrate, the size and number of components mounted on the substrate, the amount and properties of solder, and the like. The temperature of the preheating unit 2a and the main heating unit 2b is controlled by a control means (not shown).

  A flat stopper 10 for controlling supply / stop of the substrate mounting jig 100 is provided at the entrance (inlet) of the preheating unit 2a of the furnace 2 into which the substrate mounting jig 100 is carried. The stopper 10 is moved up and down by an air cylinder 11 in a vertical state.

  In a state where the stopper 10 is raised, the substrate mounting jig 100 is supplied from the carry-in port into the preheating unit 2a of the furnace 2. On the other hand, in the state where the stopper 10 is lowered, the substrate mounting jig 100 stays in place while sliding with the belt body 3 in spite of the belt body 3 moving around, and into the preheating unit 2a. The supply of the substrate mounting jig 100 is stopped.

  A detection sensor 12 serving as a detection means for detecting the substrate mounting jig 100 on the belt body 3 is provided at a position adjacent to the upstream side in the conveyance direction of the belt body 3 with respect to the position where the stopper 10 is installed. ing. The detection sensor 12 detects that the substrate mounting jig 100 passes through a predetermined position in the conveyance region of the belt body 3 by an optical method using infrared rays or the like. When the detection sensor 12 detects the passage of the substrate mounting jig 100, the air cylinder 11 is operated and the stopper 10 is lowered. The air cylinder 11 is controlled by a control device (not shown) based on the detection result of the detection sensor 12.

  The detection means for detecting the substrate mounting jig 100 is not limited to the optical detection sensor 12 as described above, and may have any configuration as long as the substrate mounting jig 100 can be detected. For example, a sensor based on a gravitational detection method such as detecting a change in load when the substrate mounting jig 100 passes can be used.

  And the reflow apparatus of this invention is based on the detection sensor which detects the said substrate mounting jig in the stop position in the furnace of the said substrate mounting jig conveyed by the said conveyance means, and the detection result of the said detection sensor. By stopping the conveyance of the substrate mounting jig by the ascending / descending means, the substrate mounting jig can be surely stopped at a predetermined position.

  In addition, if the substrate mounting jig has a stopper that stops the substrate mounting jig by contacting the substrate mounting jig transported by the transport means at the stop position of the substrate mounting jig in the furnace, it is more reliable. The effect is obtained. The stopper at the in-furnace stop position can be easily added by integrating with the ascending / descending means.

  In addition, although not shown, the reflow apparatus of the present embodiment is also provided with an operation unit for setting conditions such as the temperature in the preheating unit 2a, the main heating unit 2b and the cooling unit 2c, and the stop time of the belt body 3. It has been. The operation unit is provided with an operation panel on which a switch for controlling the driving of the belt body 3 by the servo motor, a switch for controlling the driving of each component in the furnace 2 such as the main heating unit 2b, and the like are arranged. ing.

  Further, the operation unit is provided with an operation screen, and the operator can easily operate the reflow apparatus 1 by operating a switch on the operation panel while viewing the operation screen. A conventionally well-known thing can be used for these operation parts, an operation panel, and an operation screen.

  Next, a heating method of the substrate mounting jig 100 using the reflow apparatus 1 of the present embodiment having the above-described configuration will be described based on the processing flow shown in FIG. FIG. 3 is a flowchart for explaining an example of a heating method of the substrate mounting jig 100 using the reflow apparatus 1 of the present embodiment.

  First, in Step 1, a substrate mounting jig 100 on which a substrate on which an electronic component is mounted is loaded from the entrance of the furnace 2 onto the belt body 3 of the conveyor, and the servo motor is driven to drive the belt. The substrate mounting jig 100 on the belt body 3 is carried into the furnace 2 by the movement of the body 3.

  Then, when the substrate mounting jig 100 is confirmed by the detection sensor 12 provided between the carry-in port of the furnace 2 and the preheating unit 2a (step 2), the stopper 10 is lowered by the air cylinder 11 ( Step 3). As a result, the substrate mounting jig 100 conveyed by the belt body 3 comes into contact with the lowered stopper 10 and the conveyance of the substrate mounting jig 100 is stopped even though the belt body 3 is moving. .

  Thus, after the substrate mounting jig 100 is confirmed by the detection sensor 12 and the conveyance of the substrate mounting jig 100 is stopped by the stopper 10, the stopper 10 is raised by the air cylinder 11 at a predetermined timing. The substrate mounting jig 100 is conveyed to the preheating unit 2a at a predetermined timing.

  Thereafter, when the leading substrate mounting jig 100 reaches the stop position of the preheating unit 2a, it is raised by the air cylinder 9a. Thereby, the board | substrate mounting jig 100 stops at the predetermined position in the preheating part 2a, and is preheated over the preset predetermined time, without stopping the belt body 3 of a conveyance conveyor.

  When the leading substrate 100 is preheated for a predetermined time set in advance in the preheating unit 2a (step 7), the leading substrate mounting jig 100 is lowered by the air cylinder 9a. Is then transferred to the main heating unit 2b (step 8). In the reflow apparatus 1 of the present invention, a plurality of preheating units 2a may be provided.

  After the preliminary heating, the substrate mounting jig 100 is conveyed to the main heating unit 4b (step 8). When the head substrate mounting jig 100 is conveyed to a predetermined position in the main heating unit 2b, the substrate mounting jig 100 is transferred. Is raised by the air cylinder 9b and stopped at a predetermined position in the main heating section 2b (step 9).

  Thereafter, the substrate mounting jig 100 is heated for a predetermined time set in advance. At this time, each substrate mounting jig 100 transported following the top substrate mounting jig 100 is transported to the preheating unit 2a, and preheating is performed for a predetermined time set in the preheating unit 2a. Will be.

  When the main heating of the substrate mounting jig 100 for a predetermined time is completed, the top substrate mounting jig 100 is transported to the cooling unit 2c, raised by the air cylinder 9c, and cooled for a predetermined time, and then the air cylinder 9c. And is carried out from the carry-out port of the furnace 2 (step 11). Thereby, the soldering process of the electronic component with respect to the board | substrate mounted in the head board | substrate mounting jig | tool 100 is complete | finished. When the hot plate 6c is omitted, the substrate mounting jig 100 is cooled while passing through the cooling unit 2c.

  Thus, in the processing method using the reflow apparatus 1 of the present embodiment, the substrate mounting jig 100 introduced into the furnace 2 from the carry-in port is preheated without stopping the belt body 3 of the transfer conveyor. It is sequentially conveyed to the part 2a, the main heating part 2b and the cooling part 2c, and is heated or cooled at a preset temperature and time in the preliminary heating part 2a, the main heating part 2b and the cooling part 2c, respectively.

  The temperature and heating time set in advance in the preliminary heating unit 2a and the main heating unit 2b are set based on the reflow temperature profile derived for each substrate to be processed. For example, the heating time can be freely controlled by changing the stop time in the preheating unit 2a, the main heating unit 2b, and the cooling unit 2c.

  In the reflow device 1 of the present invention, such control is possible because it is not necessary to stop the belt body 3 of the conveyor. In addition, in cases other than (heating time in the preheating unit 2a) ≧ (heating time in the main heating unit 2b) ≧ (cooling time in the cooling unit 2c), at least the maximum time of each heating time and cooling time Only the stopper 10 is lowered and the next substrate mounting jig 100 is put on standby.

  According to the present embodiment as described above, the temperature distribution of the substrate can be made constant without causing adverse effects such as damage to the mounted components on the substrate. A heating means (hot plate) that is installed and heats the substrate mounting jig, and a raising / lowering means that can raise and lower the heating means together with the substrate mounting jig and stop the conveyance of the substrate mounting jig by the rising (Air cylinder), it is possible to perform good soldering on the substrate even when mounted on a jig.

  Although typical embodiments of the reflow apparatus of the present invention have been described above, the present invention is not limited to these, and various design changes are possible. For example, various apparatus configurations disclosed in JP-A-2005-116575 can be applied to the reflow apparatus of the present invention. It is also possible to provide a hot plate at the top of the conveyor.

  For example, in the above embodiment, the aspect in which the furnace has the preheating unit, the main heating unit, and the cooling unit has been described. However, the reflow apparatus of the present invention only needs to have at least the preheating unit and the main heating unit. A plurality of preheating units and main heating units may be provided. Moreover, the cooling part may be provided or omitted, and a plurality of cooling parts may be provided.

  In addition, as the temperature uniformizing means for uniformizing the temperature distribution of the substrate among the substrate mounting jigs to be transported, the honeycomb body has been described. However, if the hot air can be efficiently supplied toward the substrate mounting jigs. It is not limited to this. For example, a hot air spray plate having a plurality of spray holes may be used.

  The reflow apparatus of the present invention can make the temperature distribution of the substrate constant without causing adverse effects such as damage to the mounted components on the substrate, and even if the substrate is mounted on a jig, In order to meet the demand-synchronized production, the board is produced in individual units, to hold the flexible board, to suppress the warpage of the board due to heating, etc. This is useful when set on a jig for production.

It is a longitudinal cross-sectional view for demonstrating the whole structure of one Embodiment of the reflow apparatus of this invention. It is a figure for demonstrating the operation | movement in the principal part of the reflow apparatus 1 shown in FIG. It is a flowchart for demonstrating an example of the heating method of the board | substrate mounting jig | tool 100 using the reflow apparatus 1 of embodiment of this invention. It is the schematic which shows the principal part of the conventional reflow furnace.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Reflow apparatus, 2 ... Furnace, 2a ... Preheating part, 2b ... This heating part, 2c ... Cooling part, 3 ... Belt body, 4a, 4b, 4c ... Heater, 6a, 6b, 6c ... Hot plate, 7a, 7b and 7c ... Stirrer motor, 8a, 8b and 8c ... Fan, 9a, 9b, 9c ... Air cylinder, 10 ... Stopper, 11 ... Air cylinder, 12 ... Detection sensor, 12a, 12b, 12c ... Honeycomb body, 12a1, 12b1, 12c1 ... Cylindrical hollow part, 100a, 100b ... Substrate, 100c ..Jig, 100d ... screw.

Claims (8)

Conveying means for conveying a substrate mounting jig including the substrate and a jig on which the substrate is mounted when soldering a component to the substrate;
One preheating unit for preheating the substrate mounting jig, and heating the substrate mounting jig to a temperature equal to or higher than the melting point of the solder on the downstream side in the transport direction by the transport unit 1 A furnace having therein one main heating section and one cooling section for cooling the substrate mounting jig downstream of the main heating section ;
Heating means comprising a hot plate that is installed on at least one of the top and bottom of the transport means in each of the preliminary heating section, the main heating section, and the cooling section in the furnace, and heats the substrate mounting jig. ;
Ascending / descending means capable of raising and lowering the heating means together with the substrate mounting jig, and stopping conveyance of the substrate mounting jig by raising;
Control means for controlling the transport of the substrate mounting jig by the transport means and the position of the ascending / descending means;
With at least,
The cooling unit is set at a temperature lower than that of the main heating unit by the heating unit, and the substrate is heated in the preliminary heating unit, the main heating unit, and the cooling unit without stopping the transport unit. Rukoto which have a cooling configurations,
Reflow device characterized by this. The reflow apparatus according to claim 1, wherein the jig is made of aluminum. Each heating time in the preliminary heating unit and the main heating unit is set in advance in the control unit, and the transport of the base mounting jig by the transport unit is controlled based on the set heating time. Item 3. The reflow device according to Item 1 or 2 . The reflow device according to any one of claims 1 to 3 , wherein the transport means is a transport conveyor in which a belt body moves around by a servo motor. A detection sensor that detects the substrate mounting jig that is transported to the preheating unit by the transporting means, and a detection sensor that detects the substrate mounting jig that is transported by the transporting means. contact with the reflow apparatus according to any one of claims 1 to 4, further comprising a, a stopper for stopping the substrate mounting jig. A detection sensor for detecting the substrate mounting jig at a stop position in the furnace of the substrate mounting jig transferred by the transfer means, and the substrate by the raising / lowering means based on a detection result of the detection sensor. The reflow apparatus according to any one of claims 1 to 5 , wherein conveyance of the mounting jig is stopped. In the furnace the stop position of the substrate mounting jig is conveyed by said conveying means further comprises a stopper for stopping the substrate mounting jig abuts on the substrate mounting jig, claim 1-6 The reflow apparatus described in 1. The reflow apparatus according to any one of claims 5 to 7 , wherein a stopper at the in-furnace stop position is integrated with the ascending / descending means.

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