JP4897008B2 - Stage apparatus, semiconductor inspection apparatus, and semiconductor exposure apparatus - Google Patents

Description

  The present invention relates to a stage apparatus, and a semiconductor inspection apparatus and semiconductor exposure apparatus including the stage apparatus.

  As a conventional stage device, a device including a moving body that moves on a surface plate, a shaft motor that drives the moving body, and a support portion that supports the moving body on the surface plate is known (for example, , See Patent Document 1). Such a stage apparatus has a shaft motor arranged on the side of the support portion.

JP 2005-347310 A

  Here, in the stage apparatus as described above, it is desired to reduce its footprint (installation area of the stage apparatus), and further miniaturization is required.

  Therefore, an object of the present invention is to provide a stage apparatus that can be further reduced in size.

  In order to solve the above problems, a stage apparatus according to the present invention includes a moving body that moves on a surface plate, a shaft motor that drives the moving body, and a support unit that supports the moving body on the surface plate, The shaft motor has a shaft portion fixed to the surface plate so that a space is formed between the surface plate and a movable portion fixed to the moving body and movable along the shaft portion. The part is characterized in that at least a part of the part enters the space.

  In this stage apparatus, at least a part of the support means enters a space between the shaft portion fixed to the surface plate and the surface plate. Therefore, for example, the footprint of the stage apparatus can be reduced compared to the case where the shaft motor is disposed on the side of the support means, and further miniaturization is possible.

  Further, the support means may be an air pad that supports the moving body without contact with the surface plate. Furthermore, the support means may be a rolling guide that guides the movement of the moving body.

  The moving body is a Y-axis moving body that is supported by the surface plate and moves in the Y-axis direction, and the Y-axis moving body guides the movement of the X-axis moving body that is supported by the surface plate and moves in the X-axis direction. It is preferable that it is comprised. As described above, in the case of a stage apparatus (so-called surface type stage apparatus) in which both the X-axis moving body and the Y-axis moving body are supported by the surface plate, and the movement of the X-axis moving body is guided by the Y-axis moving body. Because of its structure, the footprint is large and it is easy to increase the size in the horizontal direction. Therefore, in this case, the above-described effect of realizing a further reduction in size by reducing the footprint of the stage device is particularly effective.

  In addition, a semiconductor inspection apparatus according to the present invention includes the above-described stage apparatus. Furthermore, a semiconductor exposure apparatus according to the present invention includes the above-described stage apparatus. Also in these semiconductor inspection apparatuses and semiconductor exposure apparatuses, the above-described effect of further miniaturizing the stage apparatus is achieved.

  According to the present invention, the stage device can be further reduced in size.

It is a perspective view which shows the XY stage apparatus which concerns on one Embodiment of this invention. It is a side view which shows the XY stage apparatus of FIG. It is sectional drawing along the III-III line of FIG. It is sectional drawing along the IV-IV line of FIG. It is a perspective view which shows the surface plate side of the Y-axis moving body of FIG. FIG. 3 is an enlarged schematic cross-sectional view along the line III-III in FIG. 1 for showing the rolling guide in FIG. 1. FIG. 3 is an enlarged schematic cross-sectional view along the line III-III in FIG. 1 for showing the Y-axis lift air pad in FIG. 1.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  1 is a perspective view showing an XY stage apparatus according to an embodiment of the present invention, FIG. 2 is a side view showing the XY stage apparatus of FIG. 1, and FIG. 3 is a sectional view taken along line III-III of FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1, and FIG. 5 is a perspective view showing the surface plate side of the Y-axis moving body in FIG.

  As shown in FIGS. 1-3, the XY stage apparatus (stage apparatus) 1 of this embodiment is used for the semiconductor inspection apparatus for inspecting a semiconductor, or the semiconductor exposure apparatus for exposing a semiconductor. . The stage apparatus 1 includes a surface plate 2, an X-axis moving body 3, and a Y-axis moving body (moving body) 4. Both the X-axis moving body 3 and the Y-axis moving body 4 are supported by the surface plate 2. This is a so-called surface type stage that moves on the surface plate 2.

  The surface plate 2 has a rectangular parallelepiped shape, and is formed of, for example, a stone material. The surface 2a of the surface plate 2 is flattened to increase its flatness.

  The X-axis moving body 3 has a plate shape with a rectangular annular cross section and moves on the surface plate 2 in the X-axis direction which is one horizontal direction. As shown in FIG. 5, the X-axis moving body 3 is supported by the X-axis lift air pad 5 attached to the lower surface thereof in a non-contact manner in the Z-axis direction, which is the vertical direction, on the panel surface 2a. It can slide without contact.

  As shown in FIG. 4, the X-axis moving body 3 is extrapolated to a guide beam 9 (described later) of the Y-axis moving body 4, and both side surfaces of the guide beam 9 by yaw air pads 6 provided on the inner surface side thereof. It is comprised so that 9c and 9c may be inserted | pinched by non-contact. As a result, the X-axis moving body 3 can move along the guide beam 9 and can move along the X-axis direction.

  The X-axis lift air pad 5 functions as a static gas bearing that ejects gas toward the surface plate 2, and as shown in FIG. 5, in a static state to increase the stability of the X-axis moving body 3. Three are provided for support. This X-axis lift air pad 5 is capable of preload adjustment. Specifically, vacuum suction can be performed with a desired suction force on the board surface 2 a by a suction hole (not shown) formed in the lower surface of the pad portion 7 of the X-axis lift air pad 5. Thereby, as for the X-axis moving body 3, the displacement of the Z-axis direction is suppressed.

  The yaw air pad 6 functions as a gas static pressure bearing that ejects gas toward the guide beam 9, and two pairs (a total of 4 pairs) are provided at positions facing the guide beam 9 on the inner surface side of the X-axis moving body 3. One) is provided.

  Returning to FIG. 1, the Y-axis moving body 4 moves on the surface plate 2 in the Y-axis direction that is orthogonal to the X-axis direction in the horizontal direction, and guides the movement of the X-axis moving body 3 in the X-axis direction. Is. The Y-axis moving body 4 includes a columnar guide beam 9 extending in the X-axis direction, and a pair of stays 10 provided at both ends of the guide beam 9 in the X-axis direction.

  The guide beam 9 has a rectangular cross section and is inserted into the X-axis moving body 3. The guide beam 9 guides the movement of the X-axis moving body 3 along the X-axis direction.

  One end (left end in the figure) of the Y-axis moving body 4 is supported by the rolling guide (supporting means) 11 in contact with the board surface 2a in the Z-axis direction, and the movement in the Y-axis direction is guided. ing. Further, the other end portion in the X-axis direction (right end portion in the figure) of the Y-axis moving body 4 is placed on the board surface 2a by the Y-axis lift air pad (air pad, support means) 12 in the Z-axis direction as shown in FIGS. It is supported without contact and can slide on the board surface 2a without contact.

  In addition, as shown in FIG. 1, the XY stage apparatus 1 includes a pair of X-axis shaft motors 13A and 13B, a pair of Y-axis shaft motors (shaft motors) 14A and 14B, an X-axis linear scale 15, and a pair of Y-axis linear. Scales 16A and 16B and a controller 17 are provided.

  The X-axis shaft motors 13A and 13B are for driving the X-axis moving body 3 in the X-axis direction and are spaced apart from each other in the Y-axis direction. The X-axis shaft motors 13A and 13B include X-axis shaft portions 18A and 18B as stators and a pair of X-axis coil portions 19A and 19B as movers, respectively. The X-axis shaft portions 18A and 18B have magnets therein, and extend along the X-axis direction at positions outside the X-axis moving body 3 in the Y-axis direction. These X-axis shaft portions 18 </ b> A and 18 </ b> B are fixed to the fixed block 20 provided on the stay 10 of the Y-axis moving body 4, and are fixed to the Y-axis moving body 4.

  As shown in FIG. 4, the X-axis coil portions 19A and 19B are movable along the X-axis shaft portions 18A and 18B, respectively, and each has a coil surrounding the X-axis shaft portions 18A and 18B. ing. The X-axis coil portions 19A and 19B are extrapolated to the X-axis shaft portions 18A and 18B, respectively, and are fixed to the side surfaces 3b and 3b along the X-axis direction of the X-axis moving body 3, respectively. As a result, in the X-axis shaft motors 13A and 13B, when a predetermined current is applied to the X-axis coil portions 19A and 19B, the X-axis coil portions 19A and 19B are moved in the X-axis direction by electromagnetic interaction. The X-axis moving body 3 is moved in the X-axis direction.

  As shown in FIG. 1, the Y-axis shaft motors 14A and 14B are for driving the Y-axis moving body 4 in the Y-axis direction, and are spaced apart from each other in the X-axis direction. The Y-axis shaft motors 14A and 14B include Y-axis shaft portions (shaft portions) 21A and 21B as stators and Y-axis coil portions (movable portions) 22A and 22B as movers, respectively. Yes. The Y-axis shaft portions 21A and 21B have magnets therein, and spaces A1 and A2 are formed between the surface 2a of the surface plate 2 at both ends in the X-axis direction on the surface plate 2, respectively. Thus, each extends along the Y-axis direction. These Y-axis shaft portions 21 </ b> A and 21 </ b> B are respectively fixed to fixing blocks 23 provided at the four corners of the surface plate 2 and directly fixed to the surface plate 2.

  As shown in FIG. 3, the Y-axis coil portions 22A and 22B are movable along the Y-axis shaft portions 21A and 21B, respectively, and each has a coil surrounding the Y-axis shaft portions 21A and 21B. ing. The Y-axis coil portions 22A and 22B are extrapolated to the Y-axis shaft portions 21A and 21B, respectively, and are fixed to the stays 10 and 10 of the Y-axis moving body 4, respectively. As a result, in the Y-axis shaft motors 14A and 14B, when a predetermined current is applied to the Y-axis coil portions 22A and 22B, the Y-axis coil portions 22A and 22B are moved in the Y-axis direction by electromagnetic interaction. The Y-axis moving body 4 is moved in the Y-axis direction. When a predetermined current is applied to the Y-axis coil portions 22A and 22B so that the Y-axis shaft motors 14A and 14B cooperate with each other, the Y-axis coil portions 22A and 22B are moved in different directions in the Y-axis direction, As a result, the Y-axis moving body 4 is rotated in the yawing direction.

  The X-axis linear scale 15 has a scale 24 and a scale head 25. The scale 24 is attached along the X-axis direction on the side surface 9c side of the guide beam 9, and has an optical scale. The scale head 25 is attached to the position corresponding to the scale 24 in the X-axis moving body 3. For example, the scale head 25 receives the reflected light of the laser beam irradiated on the optical scale of the scale 24 and has a positional relationship with the scale 24. Acquire the corresponding signal. As a result, the X-axis linear scale 15 detects the position of the X-axis moving body 3 in the X-axis direction based on this signal.

  As shown in FIG. 3, the Y-axis linear scales 16A and 16B are arranged to be separated from each other in the X-axis direction, and like the X-axis linear scale 15, the scales 26A and 26B and the scale heads 27A and 27B are arranged. Each has. The scales 26A and 26B are respectively attached along the Y-axis direction at both ends in the X direction of the surface plate 2, and are engraved with optical scales. The scale heads 27A and 27B are respectively attached to the positions corresponding to the scales 26A and 26B in the respective stays 10 of the Y-axis moving body 4, and for example, receive the reflected light of the laser light applied to the scales 26A and 26B, respectively. A signal corresponding to the positional relationship with the scales 26A and 26B is acquired.

  As a result, in the Y-axis linear scales 16A and 16B, the X-axis direction position of the X-axis moving body 3 is detected based on the signal, and the Y-axis moving body 4 is based on the detected position difference of the Y-axis moving body 4. The yawing angle (yaw error, rotation error) is detected.

  As shown in FIG. 1, the controller 17 is composed of, for example, a CPU, a ROM, a RAM, and the like. The controller 17 is for controlling the operation of the XY stage apparatus 1 and drives the X-axis shaft motors 13A and 13B based on the X-axis direction position of the X-axis moving body 3 detected by the X-axis linear scale 15. Control. At the same time, the driving of the Y-axis shaft motors 14A and 14B is controlled based on the Y-axis direction position and the yawing angle of the Y-axis moving body 4 detected by the Y-axis linear scales 16A and 16B (details will be described later).

  Here, the rolling guide 11 and the Y-axis lift air pad 12 described above will be described in detail below.

  6 is an enlarged schematic cross-sectional view taken along the line III-III of FIG. 1 to show the rolling guide of FIG. 1, and FIG. 7 is a view of III-III of FIG. 1 to show the Y-axis lift air pad of FIG. It is an expansion schematic sectional drawing along a line.

  As shown in FIG. 6, the rolling guide 11 is a contact type that supports and guides one end of the Y-axis moving body 4 in the X-axis direction so as to contact the surface plate 2, and includes a guide rail 28 and a runner block. 29.

  The guide rail 28 extends along the Y-axis direction at one end of the surface 2a of the surface plate 2 in the X-axis direction. Specifically, the guide rail 28 is positioned closer to the surface plate 2 than the Y-axis shaft portion 21A of the Y-axis shaft motor 14A, that is, a space A1 between the Y-axis shaft portion 21A and the surface plate 2. It extends between the fixed part blocks 23 and 23 on the surface plate 2 so that it may enter (refer FIG. 1). In other words, the Y-axis shaft portion 21 </ b> A is disposed on the guide rail 28.

  The runner block 29 has a U-shaped section that opens downward, and is positioned on the surface plate 2 side of the Y-axis shaft portion 21A of the Y-axis shaft motor 14A, that is, the Y-axis shaft portion 21A and the surface plate. Two are arranged in parallel along the Y-axis direction on the lower surface 10b of the stay 10 so as to enter the space A1 between the two (see FIG. 5). In other words, the Y-axis shaft portion 21 </ b> A is disposed on the runner block 29.

  The runner block 29 is provided with a roller or a ball (not shown) for sliding on the guide rail 28 and is slidably engaged with the guide rail 28. As a result, the rolling guide 11 guides one end of the Y-axis moving body 4 in the X-axis direction in the Y-axis direction while constraining in the X-axis and Z-axis directions.

  In the rolling guide 11, the cross-sectional area, length, material, and the like of the guide rail 28 and the runner block 29 are appropriately selected, and the rigidity in the yawing direction is appropriately set. Thus, a predetermined elastic force of the Y-axis moving body 4 in the yawing direction can be obtained in order to suitably control the yawing angle of the Y-axis moving body 4.

  As shown in FIG. 7, the Y-axis lift air pad 12 functions as a static gas bearing that ejects gas toward the surface plate 2, and one Y-axis lift air pad 12 is provided at the other end in the X-axis direction of the Y-axis moving body 4. Is provided. The Y-axis lift air pad 12 has a pad portion 30 and a support portion 31.

  The pad portion 30 is provided so that a part thereof is located closer to the surface plate 2 than the Y-axis shaft portion 21B of the Y-axis shaft motor 14B. That is, the Y-axis lift air pad 12 is provided so that at least a part thereof enters the space A2 between the Y-axis shaft portion 21B and the surface plate 2. In other words, the Y-axis shaft portion 21 </ b> B is disposed on the pad portion 30.

  The support portion 31 is a shaft body whose axial direction is the Z-axis direction, and connects the Y-axis moving body 4 and the pad portion 30 to each other. In this support portion 31, the tip end portion 31a on the Y-axis moving body 4 side is connected to the Y-axis moving body 4 by, for example, screw connection. Thereby, in the Y-axis lift air pad 12, the lift amount (support height) can be adjusted.

  On the other hand, the tip portion 31b on the pad portion 30 side in the support portion 31 is connected to the pad portion 30 by, for example, spherical support coupling. Specifically, the tip 31b has a rotating sphere, and the rotating sphere is slidably fitted to a spherical seat 32 that is recessed in a conical shape. Thereby, the Y-axis moving body 4 is spherically supported by the Y-axis lift air pad 12.

  Further, the Y-axis lift air pad 12 can be adjusted for preload similarly to the X-axis lift air pad 5. Specifically, as shown in FIG. 5, a suction hole (not shown) formed in the lower surface of the pad portion 30 enables vacuum suction to the board surface 2a with a desired suction force, and the Y axis In the moving body 4, the displacement in the Z-axis direction is suppressed.

  In the XY stage apparatus 1 configured as described above, when the X-axis moving body 3 is moved to a predetermined position in the X-axis direction, the X-axis direction position of the X-axis moving body 3 is detected by the X-axis linear scale 15. . Based on the detected value, the controller 17 controls the drive current applied to the X-axis coil portions 19A and 19B of the X-axis shaft motors 13A and 13B. As a result, the X-axis moving body 3 supported in a non-contact manner on the board surface 2a by the X-axis lift air pad 5 is guided in a non-contact manner with respect to the guide beam 9 by the yaw air pad 6 and slides on the board surface 2a. Moved in the direction.

  When the Y-axis moving body 4 is moved to a predetermined position in the Y-axis direction, the Y-axis moving position of the Y-axis moving body 4 is detected by the Y-axis linear scales 16A and 16B. Based on this detection value, the controller 17 controls the drive current applied to the Y-axis coil portions 22A and 22B of the Y-axis shaft motors 14A and 14B. Accordingly, in the Y-axis moving body 4 whose one end in the X-axis direction is contact-supported by the rolling guide 11 and whose other end in the X-axis direction is non-contact-supported by the Y-axis lift air pad 12, one end in the X-axis direction is provided. The portion is contact-guided by the rolling guide 11 and is moved in the Y-axis direction so as to slide on the board surface 2a.

  Here, in the XY stage apparatus 1, the Y-axis shaft motors 14A and 14B cooperate with each other on the basis of the yawing angles detected by the Y-axis linear scales 16A and 16B, and the Y-axis moving body 4 rotates in the rotation direction around the Z axis ( (Hereinafter referred to as “yaw direction”). Specifically, a drive current is applied to each of the Y-axis coil portions 22A and 22B so that the detected yawing angle becomes 0 (so as to cancel the yawing error), and there is a difference between the thrusts of the Y-axis coil portions 22A and 22B. Is added, and the Y-axis moving body 4 is rotated in the yawing direction. As a result, the Y-axis moving body 4 does not fluctuate when the yawing angle is 0 even when the X-axis moving body 3 is moved in the X-axis direction or when the Y-axis moving body 4 is moved in the Y-axis direction. Will be retained.

  As described above, in this embodiment, the rolling guide 11 and a part of the Y-axis lift air pad 12 are in the spaces A1 and A2 between the Y-axis shaft portions 21A and 21B and the surface plate 2 in the Y-axis shaft motors 14A and 14B. Each has entered. For this reason, the space configuration by providing the Y-axis shaft motors 14A and 14B is suitable. For example, the Y-axis shaft motors 14A and 14B can be arranged on the side surface of the surface plate 2 as compared with the conventional stage apparatus. Prints can be made smaller. As a result, further miniaturization is possible.

  In the XY stage apparatus 1 of the present embodiment, as described above, both the X-axis moving body 3 and the Y-axis moving body 4 are supported by the surface plate 2, and the movement of the X-axis moving body 3 is the Y-axis movement. This is a surface type stage apparatus guided by a body 4. Therefore, the structure of the XY stage apparatus 1 is clearly different from that of a stage apparatus (so-called stack type stage apparatus) in which the X axis moving body 3 is supported and moved on the Y axis moving body 4, Due to such a structure, the footprint is large and it is easy to increase the size in the horizontal direction. Therefore, the above-described effect of realizing a further reduction in size by reducing the footprint is particularly effective for a surface type stage apparatus such as the XY stage apparatus 1.

  Moreover, in this embodiment, the following effects are also show | played. That is, as described above, the Y-axis shaft motors 14A and 14B that drive the Y-axis moving body 4 in the Y-axis direction are cooperatively controlled by the controller 17 based on the detected yawing angle. Therefore, the Y-axis shaft motors 14A and 14B can cooperate with each other according to the detected yawing angle, and the yawing angle of the Y-axis moving body 4 can be controlled as desired. That is, yawing control can be performed and yawing accuracy can be improved.

  In addition, as described above, one end of the Y-axis moving body 4 in the X-axis direction is supported by the rolling guide 11 and the other end is supported by the Y-axis lift air pad 12. Therefore, since one side of the Y-axis moving body 4 is not completely restrained in the X-axis direction (becomes free), it is possible to release and suppress (allow) deformation such as distortion and warpage caused by thermal stress, for example. It becomes possible. Therefore, in this embodiment, a structure for escape by thermal expansion can be realized, and deformation of the Y-axis moving body 4 due to thermal expansion can be reduced. As a result, the deformation of the guide beam 9 of the Y-axis moving body 3 is suppressed, and the running accuracy of the X-axis moving body 3 guided by the guide beam 9, that is, the straightness and angle during movement of the X-axis moving body 3 are suppressed. Etc. can be improved.

  In the present embodiment, as described above, the yawing angle of the Y-axis moving body 4 is detected using the pair of Y-axis linear scales 16A and 16B that are provided apart from each other in the X-axis direction. Therefore, the Y-axis direction position of the Y-axis moving body 4 can be detected, and the yawing angle can be detected based on the difference between the detection values. Furthermore, it is possible to easily detect the position and yawing angle of the Y-axis moving body 4 without providing a separate device for detecting the yawing angle.

  In particular, when a pair of Y-axis linear scales 16A and 16B is used, the intermediate Y-axis moving body 4 position between them (that is, the center position of the Y-axis moving body 4) can be detected with high accuracy. If the XY stage apparatus 1 is used for a semiconductor inspection apparatus or a semiconductor exposure apparatus as in the present embodiment, such an effect becomes remarkable. This is because, in a semiconductor inspection apparatus or semiconductor exposure apparatus, an optical system for inspection or exposure is usually disposed on the center position of the Y-axis moving body 4.

  Further, in the Y-axis lift air pad 12 of the present embodiment, the support height can be adjusted as described above. Therefore, the height of the Y-axis moving body 4 on the Y-axis lift air pad 12 side (the other end) can be easily adjusted with respect to the rolling guide 11 side (one end) of the Y-axis moving body 4. . As a result, the horizontal state of the Y-axis moving body 4 can be easily adjusted and held.

  In the present embodiment, as described above, the Y-axis lift air pad 12 is configured to support the Y-axis moving body 4 on the spherical surface, and the Y-axis lift air pad 12 and the Y-axis moving body 4 can rotate with each other. It has become. Therefore, distortion, warpage, and the like generated in the Y-axis moving body 4 can be further released, the running accuracy of the X-axis moving body 3 can be further increased, and the Y-axis lift air pad 12 can be connected to the Y-axis moving body 4. Can be easily assembled and adjusted.

  Further, in the rolling guide 11 of the present embodiment, as described above, the rigidity in the yawing direction is appropriately set so as to obtain the predetermined elastic force of the Y-axis moving body 4 in the yawing direction. The yawing angle can be suitably controlled. Therefore, the rolling guide 11 having an appropriate rigidity is selected, and the yawing accuracy can be improved. If the rigidity of the rolling guide 11 in the yawing direction becomes too high, the thrust of the Y-axis shaft motors 14A and 14B cannot overcome this rigidity and it becomes difficult to control the yawing angle. Is an important factor for yawing control.

  Further, in the present embodiment, the support of the Y-axis moving body 4 to the surface plate 2 is a three-point support of two runner blocks 29 and one Y-axis lift air pad 12, and is in a static state. The stability of the Y-axis moving body 4 is increased.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment.

  For example, although the above embodiment is the XY stage apparatus 1 including the X-axis moving body 3 and the Y-axis moving body 4, any stage apparatus including a moving body that moves in one horizontal direction may be used. Furthermore, an XYZ stage apparatus further including a Z-axis moving body that is provided on the X-axis moving body 3 and moves in the Z-axis direction may be provided, and provided on the X-axis moving body 3 in a rotational direction (θz) around the Z axis. An XYθ stage apparatus further including a rotating θ-axis moving body may be used, or an XYZθ stage apparatus further including the Z-axis moving body and the θ-axis moving body.

  In the above embodiment, the pair of Y-axis linear scales 16A and 16B are used as the detection means. However, any other detection means may be used as long as the yawing angle of the Y-axis moving body 4 can be detected. Further, although the pair of Y-axis shaft motors 14A and 14B is used as the drive means, the present invention is not limited to this, and a pair of drives that are provided apart from each other in the X-axis direction and drive the Y-axis moving body 4 in the Y-axis direction. Any means may be used.

  In the above embodiment, the rolling guide 11 and a part of the Y-axis lift air pad 12 enter the spaces A1 and A2, respectively. However, at least a part of either the rolling guide 11 or the Y-axis lift air pad 12 is a space. What is necessary is just to enter A1 and A2, respectively. Further, although the rolling guide 11 has entered completely into the space A1 between the Y-axis shaft portion 21A and the surface plate 2, it is sufficient that at least a part of it enters.

  In the above embodiment, one end of the Y-axis moving body 4 in the X-axis direction is supported by the rolling guide 11 and the other end is supported by the Y-axis lift air pad 12. Both ends in the direction may be supported by the rolling guide 11, or both may be supported by the Y-axis lift air pad 12.

  The XY stage apparatus of the present invention can be applied not only to the semiconductor inspection apparatus or semiconductor exposure apparatus described above but also to various apparatuses.

DESCRIPTION OF SYMBOLS 1 ... XY stage apparatus (stage apparatus), 2 ... Surface plate, 3 ... X-axis moving body, 4 ... Y-axis moving body (moving body), 11 ... Rolling guide (support means), 12 ... Y-axis lift air pad (air pad) , Support means), 14A, 14B ... Y-axis shaft motor (shaft motor), 21A, 21B ... Y-axis shaft portion (shaft portion), 22A, 22B ... Y-axis coil portion (movable portion), A1, A2 ... space.

Claims (5)

An X-axis moving body that is supported by a surface plate and moves in the X-axis direction;
A Y-axis moving body that is supported by the surface plate and moves in the Y-axis direction, and is configured to guide movement of the X-axis moving body in the X-axis direction ;
A pair of shaft motors that are spaced apart from each other in the X-axis direction and drive the Y-axis moving body;
Supporting means for supporting the Y-axis moving body on the surface plate,
Each of the pair of shaft motors includes a shaft portion fixed to the surface plate so that a space is formed between the surface plate and a shaft portion fixed to the Y-axis moving body and movable along the shaft portion. A movable part,
The support means supports the one end of the Y-axis moving body in the X-axis direction in a non-contact manner with respect to the surface plate, and supports the other end of the Y-axis moving body in the X-axis direction. A rolling guide for guiding the movement of the Y-axis moving body in the Y-axis direction,
At least a part of the air pad enters the space between the shaft portion and the surface plate in one shaft motor of the pair of shaft motors,
The rolling guide is
A guide rail extending along the Y-axis direction and entering the space between the shaft portion and the surface plate of the other shaft motor of the pair of shaft motors;
A runner block provided on the Y-axis moving body and slidably engaged with the guide rail and entering the space between the shaft portion and the surface plate of the other shaft motor. A stage apparatus characterized by comprising: The Y-axis moving body is
A guide beam extending in the X-axis direction and guiding the movement of the X-axis moving body in the X-axis direction;
A stay provided at an end portion of the guide beam in the X-axis direction and fixed to the movable portion and the runner block;
The stage apparatus according to claim 1, wherein a part of the stay of the Y-axis moving body enters the space between the shaft portion and the surface plate of the other shaft motor. 3. The stage apparatus according to claim 1, wherein the Y-axis moving body is supported at three points by two runner blocks and one air pad. Semiconductor inspection device characterized by comprising a stage apparatus according to any one of claims 1-3. The semiconductor exposure apparatus comprising the stage apparatus according to any one of claims 1-3.

Images