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JP4897028B2 - Coupling electrode unit - Google Patents
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JP4897028B2 - Coupling electrode unit - Google Patents

Coupling electrode unit Download PDF

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JP4897028B2
JP4897028B2 JP2009241987A JP2009241987A JP4897028B2 JP 4897028 B2 JP4897028 B2 JP 4897028B2 JP 2009241987 A JP2009241987 A JP 2009241987A JP 2009241987 A JP2009241987 A JP 2009241987A JP 4897028 B2 JP4897028 B2 JP 4897028B2
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coupling electrode
printed wiring
wiring board
stub
insulating spacer
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JP2011091518A (en
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浩 藤川
泰生 岩本
健治 中澤
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SMK Corp
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SMK Corp
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Description

本発明は、静電界若しくは誘導電界を利用したUWB通信システムに用いられる高周波結合器の結合用電極ユニットに関し、更に詳しくは超近距離で通信相手側と電界結合する結合用電極を位置決め支持する結合用電極ユニットに関する。   The present invention relates to a coupling electrode unit of a high-frequency coupler used in a UWB communication system using an electrostatic field or an induced electric field, and more particularly, a coupling for positioning and supporting a coupling electrode that is coupled to a communication partner side at a very short distance. The present invention relates to an electrode unit.

静電界若しくは誘導電界を利用したUWB(ウルトラワイドバンド)通信は、3.1GHz−10.6GHzの高い周波数帯域を使用するもので、100Mbps程度の大容量の無線データ伝送を実現できる。また、距離に反比例して減衰するアンテナの放射電界に比べて、誘導電界は距離の二乗に反比例、静電界は、距離の3乗に反比例して減衰するので、他の機器への影響がなく、信号漏れによる情報漏れもないので、動画像や音楽のデータをパソコンなどの小型情報機器へ入出力する通信方式として着目されている。   UWB (ultra wide band) communication using an electrostatic field or an induction electric field uses a high frequency band of 3.1 GHz to 10.6 GHz, and can realize wireless data transmission with a large capacity of about 100 Mbps. Compared to the radiation field of an antenna that is attenuated in inverse proportion to the distance, the induction electric field is inversely proportional to the square of the distance, and the electrostatic field is attenuated in inverse proportion to the cube of the distance, so there is no effect on other devices. Since there is no information leakage due to signal leakage, it is attracting attention as a communication method for inputting and outputting moving image and music data to a small information device such as a personal computer.

更に、UWB通信は静電界若しくは誘導電界を利用するので、ケーブルレス通信としてUSBケーブルなどを介して接続する必要がなく、送信機側と受信機側の一対の高周波結合器間を接近させるだけで高速に大容量のデータを伝送できる通信システムとして知られている(特許文献1)。   Furthermore, since UWB communication uses an electrostatic field or an induction field, there is no need to connect via a USB cable or the like as cableless communication, and only a pair of high-frequency couplers on the transmitter side and the receiver side are brought close to each other. It is known as a communication system capable of transmitting a large amount of data at high speed (Patent Document 1).

このUWB通信は、UWBの伝送帯域の内、3.1乃至4.9GHzのUWBローバンドを伝送帯域とし、図6に示すように、送信機110の送信回路部111と、受信機120の受信回路部121とを、送信機側高周波結合器112と受信側高周波結合器122とで、非接触結合する構成としている。それぞれの高周波結合器112、122は、平板状の結合用電極113、123と、結合用電極113、123に直列に接続される直列インダクタ114、124と、並列に接続される並列インダクタ115、125とからなり、送信側と受信側において互いに対称に配置される。結合用電極113、123間を極近距離で互いに向かい合わせて配置すると、平行平板コンデンサとして作用し、高周波結合器112、122の全体でバンドパスフィルタのように動作するので、送信回路部111と受信回路部121の間で効率的に高周波信号が伝達される。   In this UWB communication, a UWB low band of 3.1 to 4.9 GHz is used as a transmission band in the UWB transmission band, and a transmission circuit unit 111 of a transmitter 110 and a reception circuit of a receiver 120 as shown in FIG. The unit 121 is configured to be non-contact coupled by the transmitter-side high-frequency coupler 112 and the reception-side high-frequency coupler 122. Each of the high-frequency couplers 112 and 122 includes plate-like coupling electrodes 113 and 123, series inductors 114 and 124 connected in series to the coupling electrodes 113 and 123, and parallel inductors 115 and 125 connected in parallel. Are arranged symmetrically with each other on the transmission side and the reception side. If the coupling electrodes 113 and 123 are arranged to face each other at a very short distance, they act as parallel plate capacitors and operate like a bandpass filter in the entire high frequency couplers 112 and 122. A high frequency signal is efficiently transmitted between the receiving circuit units 121.

ここで、平板状の結合用電極113、123間の距離は、3cm程度の極近距離であるが、伝送帯域である4GHzの周波数帯では約1/2波長に相当しインピーダンス不整合による伝送損失の影響は大きい。そこで、結合部における信号の反射を減じるために、送信回路部111から結合用電極113までの回路の特性インピーダンスと、結合用電極123から受信回路部121までの回路の特性インピーダンスのマッチングをとり、伝送効率を高めている。   Here, the distance between the plate-like coupling electrodes 113 and 123 is an extremely short distance of about 3 cm, but corresponds to about ½ wavelength in the 4 GHz frequency band, which is a transmission band, and transmission loss due to impedance mismatching. The impact of is great. Therefore, in order to reduce the reflection of the signal in the coupling unit, the characteristic impedance of the circuit from the transmission circuit unit 111 to the coupling electrode 113 and the characteristic impedance of the circuit from the coupling electrode 123 to the reception circuit unit 121 are matched, Increases transmission efficiency.

しかしながら図6に示す回路を集中定数回路としてみなされる回路素子で形成すると動作周波数帯域が狭いので、高周波結合器112、122を図7に示す分布定数回路に代え、より広帯域で動作する高周波結合器130を構成している。すなわち、裏面がグランド導体で覆われたプリント配線基板131の表面に直列インダクタ114、124と並列インダクタ115、125の代わりに分布定数回路としての導体パターンからなるスタブ132が印刷形成され、その一端が信号線パターン133を介して送信回路部111若しくは受信回路部121に接続している。また、スタブ132の他側は、スルーホール134を介して裏面のグランド導体に接続してショートされ、スタブ132の中央位置で導電性金属板からなる結合用電極135から下方に折り曲げた脚部135aを半田接続し、結合用電極135を接続している。   However, when the circuit shown in FIG. 6 is formed of circuit elements that are regarded as lumped constant circuits, the operating frequency band is narrow. Therefore, the high frequency couplers 112 and 122 are replaced with the distributed constant circuit shown in FIG. 130 is constituted. That is, a stub 132 made of a conductor pattern as a distributed constant circuit is printed on the surface of a printed wiring board 131 whose back surface is covered with a ground conductor, instead of the series inductors 114 and 124 and the parallel inductors 115 and 125, and one end of the stub 132 is formed. It is connected to the transmission circuit unit 111 or the reception circuit unit 121 via the signal line pattern 133. The other side of the stub 132 is connected to the ground conductor on the back surface through the through hole 134 and is short-circuited, and a leg portion 135a bent downward from the coupling electrode 135 made of a conductive metal plate at the center position of the stub 132. Are connected by soldering, and the coupling electrode 135 is connected.

スタブ132の長さは、高周波信号の1/2波長とし、信号線パターン133とスタブ132は、裏面がグランド導体で覆われたプリント配線基板4上に配線されることによりマイクロストリップ線路として形成される。従って、グランド導体に接続する先端でショートするスタブ132に発生する定在波の電圧振幅は、結合用電極135が接続する中央位置で最大となり、伝搬効率の良い高周波結合器130が形成される。   The length of the stub 132 is ½ wavelength of the high-frequency signal, and the signal line pattern 133 and the stub 132 are formed as a microstrip line by wiring on the printed wiring board 4 whose back surface is covered with a ground conductor. The Therefore, the voltage amplitude of the standing wave generated in the stub 132 that is short-circuited at the tip connected to the ground conductor is maximized at the center position where the coupling electrode 135 is connected, and the high-frequency coupler 130 with good propagation efficiency is formed.

また結合用電極135の脚部135aは、結合用電極135をプリント配線基板131へ投影させた投影形状の中心位置から下方に折り曲げて形成され、これにより高周波伝送線路が接続する給電点と結合用電極135の中心との間で結合用電極135の平面に沿って不均一な電流が流れることがなく、アンテナとして不要な電波を放射することがない。   Further, the leg portion 135a of the coupling electrode 135 is formed by bending downward from the center position of the projected shape obtained by projecting the coupling electrode 135 onto the printed wiring board 131, thereby connecting the feeding point to which the high-frequency transmission line is connected. A non-uniform current does not flow along the plane of the coupling electrode 135 between the center of the electrode 135 and an unnecessary radio wave as an antenna is not radiated.

このように構成される結合用電極135は、導電性金属板をプレス加工などで打ち抜いた後、折り曲げ加工するだけの簡単な加工工程で得られるが、図7に示すように、スペーサを用いて支持するものではないので、プリント配線基板4への自動実装が困難で、基板4へ接続後に外力を受けて変形しやすく、伝送特性が変化してしまう。   The coupling electrode 135 configured as described above can be obtained by a simple processing step in which a conductive metal plate is punched out by pressing or the like and then bent. However, as shown in FIG. Since it is not supported, automatic mounting on the printed circuit board 4 is difficult, and after connection to the board 4, it is easily deformed by receiving external force, and transmission characteristics change.

そこで、図8に示すように、絶縁体からなる直方体状のスペーサ141の表面に導体パターンを蒸着、若しくは印刷して結合用電極142を形成するとともに、裏面に折り畳み状に蛇行するスタブ143を蒸着などで形成し、スタブ143の配線方向に沿った中央位置と結合用電極142の中心とをスペーサ141を貫通するスルーホール144で接続して結合用電極142を一体に支持する結合用電極ユニット140も提案されている。   Therefore, as shown in FIG. 8, a conductor pattern is vapor-deposited or printed on the surface of a rectangular parallelepiped spacer 141 made of an insulator to form a coupling electrode 142, and a stub 143 meandering in a folded manner is vapor-deposited on the back surface. The coupling electrode unit 140 that integrally supports the coupling electrode 142 by connecting the center position of the stub 143 along the wiring direction of the stub 143 and the center of the coupling electrode 142 with a through hole 144 that penetrates the spacer 141. Has also been proposed.

このように構成した結合用電極ユニット140は、スタブ143の一側がプリント配線基板145の信号線パターン146の一端に、スタブ143の他側がプリント配線基板145の裏面のグランド導体147に接続する接地ランドパターン148に対向して接続するようにプリント配線基板145上に表面実装し、高周波結合器を構成している。   In the coupling electrode unit 140 configured in this way, one side of the stub 143 is connected to one end of the signal line pattern 146 of the printed wiring board 145, and the other side of the stub 143 is connected to the ground conductor 147 on the back surface of the printed wiring board 145. Surface mounting is performed on the printed wiring board 145 so as to be opposed to the pattern 148, thereby forming a high-frequency coupler.

特開2008−154198号公報JP 2008-154198 A

しかしながら、図7に示す高周波結合器130は、上述の通り結合用電極135が不安定な状態で支持されるので、予期しない外力を受けて変形しやすく、またプリント配線基板への自動実装が困難であるので、量産に適しない。   However, since the coupling electrode 135 is supported in an unstable state as described above, the high-frequency coupler 130 shown in FIG. 7 is easily deformed by an unexpected external force and difficult to be automatically mounted on a printed wiring board. Therefore, it is not suitable for mass production.

これを改善した図8に示す結合用電極ユニット140は、結合用電極142とスタブ143をスペーサ141と一体としているので、自動実装が可能であるが、結合用電極142の図形中心でスタブ143に接続する必要があるので、その中心から下方に向けてスペーサ141を貫通してスタブ143に導通させるスルーホール144を形成するものであるが、結合用電極142は縦10mm横13mm程度の大きさであり、スルーホール144を形成して両者を電気接続することは極めて困難で実用性に欠けるものであった。   In the coupling electrode unit 140 shown in FIG. 8 that has been improved, the coupling electrode 142 and the stub 143 are integrated with the spacer 141, so that automatic mounting is possible. Since it is necessary to make a connection, a through hole 144 is formed through the spacer 141 downward from the center thereof to conduct to the stub 143. The coupling electrode 142 has a size of about 10 mm in length and 13 mm in width. In other words, it is extremely difficult to form the through-hole 144 and to electrically connect them, which is not practical.

また、結合用電極142やスタブ143を絶縁体からなるスペーサ141の表裏面に蒸着若しくは印刷で形成するには、高い精度が要求され、コストが上昇する。一方、導電性板材からなる結合用電極を形成しておき、スペーサの成型の際に一体成形する製造方法も考えられるが、結合用電極が微小板であり、同様に一体成型に高い精度が求められ、更に薄肉の結合用電極側の厚みにも公差があるので、金型との間から樹脂が漏れて表面を覆い、性能が劣化する恐れがある。   Further, in order to form the coupling electrode 142 and the stub 143 on the front and back surfaces of the spacer 141 made of an insulator by vapor deposition or printing, high accuracy is required, and the cost increases. On the other hand, a manufacturing method in which a coupling electrode made of a conductive plate material is formed and integrally molded when the spacer is molded is also conceivable. However, the coupling electrode is a microplate, and similarly high accuracy is required for integral molding. In addition, since there is a tolerance in the thickness on the side of the thin coupling electrode, the resin may leak from between the mold and cover the surface, which may deteriorate the performance.

また、結合用電極142とスタブ143間のスペーサ141は、誘電率の高い絶縁体からなるので、プリント配線基板145の裏面のグランド導体147との間で電界結合しやすく、通信帯域が狭くなったり、結合用電極142で送受信する電力がグランド導体147に伝達され、通信特性が悪化するという問題があった。   Further, since the spacer 141 between the coupling electrode 142 and the stub 143 is made of an insulator having a high dielectric constant, electric field coupling with the ground conductor 147 on the back surface of the printed wiring board 145 is facilitated, and the communication band is narrowed. There is a problem in that power transmitted and received by the coupling electrode 142 is transmitted to the ground conductor 147 and communication characteristics deteriorate.

本発明は、このような従来の問題点を考慮してなされたものであり、結合用電極を簡単な組立で確実に位置決め保持し、プリント配線基板上に自動実装可能とした結合用電極ユニットを提供することを目的とする。   The present invention has been made in consideration of such conventional problems, and a coupling electrode unit that can be positioned and held securely by simple assembly and can be automatically mounted on a printed wiring board is provided. The purpose is to provide.

また、低背化しても、結合用電極で送受信する電力がプリント配線基板の裏面のグランド導体に漏れることがない結合用電極ユニットを提供することを目的とする。   It is another object of the present invention to provide a coupling electrode unit in which power transmitted and received by the coupling electrode does not leak to the ground conductor on the back surface of the printed wiring board even when the height is lowered.

上述の目的を達成するため、請求項1に記載の結合用電極ユニットは、表面にインダクタを形成するスタブが配線されたプリント配線基板上に、スタブの配線方向に沿った中央位置に電気接続する結合用電極を、スタブと所定間隔を隔てて配置する結合用電極ユニットであって、導電性金属からなる平板状の結合用電極と、結合用電極裏面の中心から垂設される給電ピンと、結合用電極の周囲が係合する枠状に形成され、結合用電極をプリント配線基板の表面と所定間隔を隔てて平行に位置決め支持してプリント配線基板の表面に実装される絶縁スペーサとを備え、絶縁スペーサは、一対のコの字状腕部が対向し結合用電極の周囲を囲う一部が開口する枠状に形成され、各腕部の内壁面の上方に臨む係合段部と下方に臨む係合突起との間で結合用電極の周囲を挟持し、結合用電極を位置決め支持する絶縁スペーサをスタブを囲うプリント配線基板の表面に実装した状態で、結合用電極から垂設される給電ピンの下端部をスタブの中央に電気接続することを特徴とする。 In order to achieve the above object, the coupling electrode unit according to claim 1 is electrically connected to a central position along the wiring direction of the stub on the printed wiring board on which the stub forming the inductor is wired on the surface. A coupling electrode unit in which a coupling electrode is arranged at a predetermined distance from a stub, and is composed of a flat plate-shaped coupling electrode made of a conductive metal, a power supply pin suspended from the center of the back surface of the coupling electrode, and a coupling An insulating spacer that is mounted on the surface of the printed wiring board by positioning and supporting the coupling electrode in parallel with the surface of the printed wiring board at a predetermined interval; The insulating spacer is formed in a frame shape in which a pair of U-shaped arm portions face each other and a part surrounding the coupling electrode is opened, and an engagement step portion facing above the inner wall surface of each arm portion and below Between the engaging projections Around the use electrodes sandwiching an insulating spacer for positioning and supporting the coupling electrode in a state of being mounted on the surface of the printed circuit board surrounding the stub, the lower end of the feed pin being vertically from the coupling electrode in the center of the stub It is characterized by electrical connection.

結合用電極は、その周囲が絶縁スペーサに係合して位置決めされるので、外力を受けても変形しにくく、伝送特性が変化しない。   Since the coupling electrode is positioned with its periphery engaged with the insulating spacer, it is not easily deformed even when an external force is applied, and the transmission characteristics do not change.

絶縁スペーサは枠状に形成されているので、プリント配線基板の表面に実装した状態で、結合用電極とプリント配線基板の表面との間に絶縁体に比べて誘電率が低い空間が形成され、結合用電極とプリント配線基板の裏面のグランド導体とは電界結合しにくい。   Since the insulating spacer is formed in a frame shape, a space having a lower dielectric constant than the insulator is formed between the coupling electrode and the surface of the printed wiring board in a state of being mounted on the surface of the printed wiring board. The coupling electrode and the ground conductor on the back surface of the printed wiring board are hardly electrically coupled.

また絶縁スペーサが、一対のコの字状腕部が対向し結合用電極の周囲を囲う一部が開口する枠状に形成され、各腕部の内壁面の上方に臨む係合段部と下方に臨む係合突起との間で結合用電極の周囲を挟持し、結合用電極を位置決め支持することを特徴とする。 Further , the insulating spacer is formed in a frame shape in which a pair of U-shaped arm portions face each other and a part surrounding the coupling electrode is opened, and an engagement step portion facing above the inner wall surface of each arm portion; It is characterized in that the periphery of the coupling electrode is sandwiched between the engaging projection facing downward and the coupling electrode is positioned and supported.

絶縁スペーサが、結合用電極の周囲を囲う一部が開口する枠状に形成されるので、対向する一対のコの字状腕部間が弾性変形し、一対のコの字状腕部間に結合用電極を収容し、係合段部と係合突起との間に容易に挟持することができる。結合用電極を位置決め支持した絶縁スペーサをプリント配線基板の表面に実装することにより、一対のコの字状腕部は、プリント配線基板に固定されるので、その間が開いて結合用電極が脱落することがない。   Since the insulating spacer is formed in a frame shape in which a part surrounding the coupling electrode is opened, the pair of opposing U-shaped arm portions is elastically deformed, and the pair of U-shaped arm portions is elastically deformed. The coupling electrode is accommodated and can be easily sandwiched between the engaging step portion and the engaging protrusion. By mounting an insulating spacer that positions and supports the coupling electrode on the surface of the printed wiring board, the pair of U-shaped arms are fixed to the printed wiring board, so that the gap between them opens and the coupling electrode falls off. There is nothing.

また、請求項に記載の結合用電極ユニットは、プリント配線基板の取付孔に挿入されるスペーサ枠部の脚部が、先端部より上方の基端部の外径が大径の二段に分けて形成され、基端部が遊嵌する第1取付孔が形成されたプリント配線基板へ絶縁スペーサを実装する際には、第1長さの給電ピンで結合用電極とスタブを電気接続し、先端部が遊嵌し、基端部の外径より小径の第2取付孔が形成されたプリント配線基板へ絶縁スペーサを実装する際には、第1長さより長い第2長さの給電ピンで結合用電極とスタブを電気接続することを特徴とする。 Further, in the coupling electrode unit according to claim 2 , the leg portion of the spacer frame portion inserted into the mounting hole of the printed wiring board has two steps with the outer diameter of the base end portion above the tip portion being large. When an insulating spacer is mounted on a printed wiring board formed separately and having a first mounting hole in which the base end part is loosely fitted, the coupling electrode and the stub are electrically connected by the first-length power supply pin. When the insulating spacer is mounted on the printed wiring board in which the distal end is loosely fitted and the second mounting hole having a smaller diameter than the outer diameter of the proximal end is formed, the power supply pin having the second length longer than the first length And the coupling electrode and the stub are electrically connected.

第1取付孔と第2取付孔のいずれかが形成される2種類のプリント配線基板と、第1長さと第2長さの2種類の給電ピンを用意するだけで、共通する絶縁スペーサと結合用電極を用いてプリント配線基板の表面から結合用電極までの高さが異なる2種類の結合用電極ユニットが得られる。   By combining two types of printed wiring boards in which either the first mounting hole or the second mounting hole is formed and two types of power supply pins of the first length and the second length, the common insulating spacer can be coupled. Two types of coupling electrode units having different heights from the surface of the printed wiring board to the coupling electrode are obtained using the coupling electrodes.

請求項1の発明によれば、結合用電極が金属板をプレス加工するだけの簡単な加工で得られ、その結合用電極は、絶縁スペーサに係合させて簡単にがたつきなく一体に組み立てることができ、プリント配線基板への自動実装が可能となる。   According to the first aspect of the present invention, the coupling electrode can be obtained by a simple process of pressing a metal plate, and the coupling electrode is easily assembled integrally without rattling by engaging the insulating spacer. Can be automatically mounted on a printed circuit board.

また、結合用電極は、その周囲が絶縁スペーサに係合して位置決めされるので、外力を受けても変形しにくく、伝送特性が変化しない。   In addition, since the coupling electrode is positioned by engaging the insulating spacer, the coupling electrode is not easily deformed even when an external force is applied, and the transmission characteristics do not change.

また、結合用電極とプリント配線基板の表面との間に絶縁体に比べて誘電率が低い空間が形成されるので、低背化させて結合用電極とプリント配線基板を接近させても、結合用電極で送受信する電力がプリント配線基板の裏面のグランド導体に漏れることがない。   In addition, since a space with a lower dielectric constant than the insulator is formed between the coupling electrode and the surface of the printed wiring board, even if the coupling electrode and the printed wiring board are brought close to each other, the coupling can be achieved. The power transmitted / received by the electrode for use does not leak to the ground conductor on the back surface of the printed wiring board.

また、一対のコの字状腕部間が弾性変形するので、軽押圧力で結合用電極の周囲を絶縁スペーサに係合させるスナップインで組み立てることができ、絶縁スペーサを強制変形させて破損させることがない。しかも、結合用電極を位置決め支持した後は、絶縁スペーサがプリント配線基板の表面に実装され、一対のコの字状腕部がプリント配線基板に固定されるので、結合用電極は絶縁スペーサが脱落することがない。 In addition, since the pair of U-shaped arms are elastically deformed, it can be assembled with a snap-in that engages the insulating spacer around the coupling electrode with a light pressing force, and the insulating spacer is forcedly deformed and damaged. There is nothing. Moreover, after positioning and supporting the coupling electrode, the insulating spacer is mounted on the surface of the printed wiring board, and the pair of U-shaped arms are fixed to the printed wiring board. There is nothing to do.

また、一対のコの字状腕部間で枠状の一部が開口するので、その開口を通して給電ピンの下端部とスタブの電気接続状態を視認することができ、製造工程中に結合用電極とスタ部間の接続不良を発見できる。   In addition, since a part of the frame shape opens between the pair of U-shaped arms, the electrical connection state of the lower end of the power supply pin and the stub can be visually confirmed through the opening, and the coupling electrode is formed during the manufacturing process. And poor connection between the star section.

請求項の発明によれば、共通する絶縁スペーサと結合用電極を用いて、低背化が要求される結合用電極ユニットとグランド導体から結合用電極までの間隔を確保して性能向上を図る結合用電極のいずれも製造することができる。 According to the invention of claim 2 , by using the common insulating spacer and the coupling electrode, the gap between the coupling electrode unit and the ground conductor, which are required to be reduced in height, from the ground conductor to the coupling electrode is secured to improve performance. Any of the coupling electrodes can be manufactured.

図1は、プリント配線基板10へ実装する本発明の一実施の形態に係る結合用電極ユニット1の分解斜視図である。FIG. 1 is an exploded perspective view of a coupling electrode unit 1 according to an embodiment of the present invention mounted on a printed wiring board 10. 図2はプリント配線基板10へ実装した結合用電極ユニット1の平面図である。FIG. 2 is a plan view of the coupling electrode unit 1 mounted on the printed wiring board 10. 図3は、図2のA−A線の位置で図1を切断した分解断面図である。FIG. 3 is an exploded cross-sectional view of FIG. 1 taken along the line AA in FIG. 図4は、小径の第2取付孔12が穿設されたプリント配線基板10へ結合用電極ユニット1を実装した状態を示す縦断面図である。FIG. 4 is a longitudinal sectional view showing a state in which the coupling electrode unit 1 is mounted on the printed wiring board 10 in which the small-diameter second mounting holes 12 are formed. 図5は、大径の第1取付孔11が穿設されたプリント配線基板10へ結合用電極ユニット1を実装した状態を示す縦断面図である。FIG. 5 is a longitudinal sectional view showing a state in which the coupling electrode unit 1 is mounted on the printed wiring board 10 in which the large-diameter first attachment holes 11 are formed. 図6は、高周波結合器112、122の回路図である。FIG. 6 is a circuit diagram of the high frequency couplers 112 and 122. 図7は、従来の高周波結合器130を示す斜視図である。FIG. 7 is a perspective view showing a conventional high-frequency coupler 130. 図8は、従来の結合用電極ユニット140を示す斜視図である。FIG. 8 is a perspective view showing a conventional coupling electrode unit 140.

以下、本発明の一実施の形態に係る結合用電極ユニット1を、図1乃至図6を用いて説明する。この結合用電極ユニット1は、伝送帯域の内、3.1乃至4.9GHzのUWBローバンドを伝送帯域とする静電界若しくは誘導電界を利用したUWB通信において、図6に示す高周波結合器112、122の集中定数回路を分布定数回路として、結合用電極113、123に相当する結合用電極2を、位置決め支持するものである。   Hereinafter, a coupling electrode unit 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6. The coupling electrode unit 1 is used in UWB communication using an electrostatic field or an induction field having a UWB low band of 3.1 to 4.9 GHz in the transmission band, and high frequency couplers 112 and 122 shown in FIG. The lumped constant circuit is a distributed constant circuit, and the coupling electrode 2 corresponding to the coupling electrodes 113 and 123 is positioned and supported.

上述したように、送信機110の送信回路部111と受信機120の受信回路部121間相互のUWB通信では、送信機側高周波結合器112と受信側高周波結合器122の結合用電極113、123を3cm程度の極近距離で対向配置し、両者で平行平板コンデンサを構成させる。結合用電極113、123と送信回路部111若しくは受信回路部121との間には、直列インダクタ114、124が直列に、並列インダクタ115、12が並列にそれぞれ接続されるので、高周波結合器112、122の全体でバンドパスフィルタのように動作し、送信回路部111と受信回路部121の間で効率的に高周波信号が伝達される。   As described above, in the UWB communication between the transmission circuit unit 111 of the transmitter 110 and the reception circuit unit 121 of the receiver 120, the coupling electrodes 113 and 123 of the transmitter-side high-frequency coupler 112 and the reception-side high-frequency coupler 122 are used. Are opposed to each other at an extremely short distance of about 3 cm, and a parallel plate capacitor is formed by both. Since the series inductors 114 and 124 are connected in series and the parallel inductors 115 and 12 are connected in parallel between the coupling electrodes 113 and 123 and the transmission circuit unit 111 or the reception circuit unit 121, the high-frequency coupler 112, The whole 122 operates like a bandpass filter, and a high-frequency signal is efficiently transmitted between the transmission circuit unit 111 and the reception circuit unit 121.

ここで、高周波結合器112、122を図6に示す集中定数回路とした各回路素子で構成すると動作周波数帯域が狭いので、広帯域で動作するように分布定数回路で考え、図1に示す結合用電極ユニット1とプリント配線基板10の表面に形成されるスタブ15とで構成している。   Here, if the high-frequency couplers 112 and 122 are constituted by circuit elements having the lumped constant circuit shown in FIG. 6, the operating frequency band is narrow. Therefore, the distributed constant circuit is considered to operate in a wide band, and the coupling shown in FIG. The electrode unit 1 and the stub 15 formed on the surface of the printed wiring board 10 are configured.

結合用電極ユニット1は、板金状の結合用電極2と、結合用電極2の周囲と係合し、結合用電極2を水平に位置決め支持する絶縁スペーサ3と、結合用電極2の背面側図形中心から一体に垂設される給電ピン4とからなっている。   The coupling electrode unit 1 includes a sheet metal coupling electrode 2, an insulating spacer 3 that engages with the periphery of the coupling electrode 2, and horizontally positions and supports the coupling electrode 2, and a back side figure of the coupling electrode 2. It consists of a feed pin 4 that is vertically suspended from the center.

結合用電極2は、バネ性と導電性を有する燐青銅などの金属板を、長手方向に突出する帯状片とともに、ここでは縦10mm、横13mmの略長方形状に打ち抜き、その後、帯状片をそれぞれ下方へ断面L字状に折り曲げて、一対の係合片2a、2aを一体に連設している。結合用電極2の厚さは、0.15mmと薄肉であり、従って、後述するように係合片2aが絶縁スペーサ3の後述する係合突起34に当接すると、長手方向に沿って全体が湾曲する。また、ほぼ長方形状の図形中心となる位置には、表面から裏面に向かうバーリング加工により、給電ピン4を挿通させる円筒孔6が形成されている。   The coupling electrode 2 is made by punching a metal plate such as phosphor bronze having springiness and conductivity into a substantially rectangular shape having a length of 10 mm and a width of 13 mm together with a strip-like piece projecting in the longitudinal direction. The pair of engaging pieces 2a and 2a are integrally connected continuously by bending downward in an L-shaped cross section. The thickness of the coupling electrode 2 is as thin as 0.15 mm. Therefore, as will be described later, when the engagement piece 2a comes into contact with an engagement protrusion 34 (to be described later) of the insulating spacer 3, the entire length along the longitudinal direction is reduced. Bend. In addition, a cylindrical hole 6 through which the power supply pin 4 is inserted is formed by burring processing from the front surface to the back surface at a position that becomes a substantially rectangular figure center.

給電ピン4は、図3に示すように、円柱形の導電性金属ロッドを下方に向かって緩やかに先細りとなる裁頭円錐状に切削加工したもので、結合用電極2の円筒孔6の内径と比較して上部の外径が大きく下部が小さくなっている。これにより、給電ピン4の下端部4aを円筒孔6の上方から挿通させて、給電ピン4を円筒孔6内に圧入可能となり、図4に示すように、上部が円筒孔6内に達した位置で結合用電極2に吊り下げられた状態で固定される。   As shown in FIG. 3, the power feed pin 4 is a cylindrical conductive metal rod cut into a truncated cone shape that gradually tapers downward, and the inner diameter of the cylindrical hole 6 of the coupling electrode 2. The outer diameter of the upper part is larger than that of the lower part, and the lower part is smaller. As a result, the lower end portion 4a of the power supply pin 4 is inserted from above the cylindrical hole 6 so that the power supply pin 4 can be press-fitted into the cylindrical hole 6, and the upper part reaches the cylindrical hole 6 as shown in FIG. It is fixed in a state suspended from the coupling electrode 2 at the position.

絶縁スペーサ3は、耐熱性液晶ポリマー(CCP)等の耐熱性かつ絶縁性の合成樹脂により、図1に示すように、略長方形状の結合用電極2の周囲を囲う長方形枠状に成形したもので、長手方向で対向する一対のコの字状腕部31、32の一端が長手方向に沿った連結部33により一体に連結されている。これにより、長方形枠状の絶縁スペーサ3は、コの字状腕部31、32の他端で開口し、一対のコの字状腕部31、32は連結部33回りで弾性変形自在となっている。   The insulating spacer 3 is formed of a heat-resistant and insulating synthetic resin such as a heat-resistant liquid crystal polymer (CCP) into a rectangular frame shape surrounding the substantially rectangular coupling electrode 2 as shown in FIG. Thus, one end of a pair of U-shaped arm portions 31 and 32 opposed in the longitudinal direction is integrally connected by a connecting portion 33 along the longitudinal direction. As a result, the rectangular frame-shaped insulating spacer 3 opens at the other end of the U-shaped arm portions 31, 32, and the pair of U-shaped arm portions 31, 32 are elastically deformable around the connecting portion 33. ing.

一対のコの字状腕部31、32の対向する内壁面には、それぞれ結合用電極2の係合片2a、2aが係合する係合突起34が下方を開口させて形成され、また、係合突起34の部位を除き、長方形枠状の絶縁スペーサ3の内壁面には、内壁面の上縁に沿って、係合段部35が上向きに形成されている。係合段部35の内壁上縁までの高さは、結合用電極2の厚さ(0.15mm)に相当し、これにより結合用電極2の周囲を絶縁スペーサ3でがたつきなく位置決め支持する。   Engaging protrusions 34 that engage with the engaging pieces 2a and 2a of the coupling electrode 2 are formed on the opposing inner wall surfaces of the pair of U-shaped arm portions 31 and 32, respectively, with the lower part opened, and Except for the portion of the engagement protrusion 34, an engagement step portion 35 is formed upward on the inner wall surface of the rectangular frame-shaped insulating spacer 3 along the upper edge of the inner wall surface. The height of the engagement step 35 to the upper edge of the inner wall corresponds to the thickness (0.15 mm) of the coupling electrode 2, thereby positioning and supporting the periphery of the coupling electrode 2 without rattling with the insulating spacer 3. To do.

絶縁スペーサ3の長方形枠状の各4隅には、プリント配線基板10の第1取付孔11若しくは第2取付孔12に挿入し、プリント配線基板10の表面に結合用電極ユニット1を位置決めする脚部36、36・・が一体に垂設されている。各脚部36は、先端部36aの外径が第2取付孔12の内径より小さく、基端部36bの外径が第2取付孔12の内径より大きい2段の円柱形となっている。プリント配線基板10の第1取付孔11は、基端部36bを遊嵌する内径となっていて、従って、プリント配線基板10の取付孔が、第1取付孔11である場合には、図5に示すように、脚部36の基端部36bまで挿入され、第2取付孔12である場合には、図4に示すように、先端部36aが挿入され、基端部36bがプリント配線基板10の表面に当接する。   Legs for positioning the coupling electrode unit 1 on the surface of the printed wiring board 10 are inserted into the first mounting holes 11 or the second mounting holes 12 of the printed wiring board 10 at the four corners of the rectangular frame shape of the insulating spacer 3. The parts 36, 36,. Each leg portion 36 has a two-stage cylindrical shape in which the outer diameter of the distal end portion 36 a is smaller than the inner diameter of the second mounting hole 12 and the outer diameter of the base end portion 36 b is larger than the inner diameter of the second mounting hole 12. The first mounting hole 11 of the printed wiring board 10 has an inner diameter for loosely fitting the base end portion 36b. Therefore, when the mounting hole of the printed wiring board 10 is the first mounting hole 11, FIG. As shown in FIG. 4, when the base end portion 36b of the leg portion 36 is inserted into the second mounting hole 12, the tip end portion 36a is inserted and the base end portion 36b is connected to the printed wiring board as shown in FIG. 10 abuts against the surface.

結合用電極ユニット1を実装するプリント配線基板10は、裏面がグランド導体16で覆われている。これは、電子機器内でプリント配線基板10の裏面側に配置される他の回路素子やパターンからスタブ15や結合用電極2に流れる高周波信号を完全に遮断するためである。   The printed wiring board 10 on which the coupling electrode unit 1 is mounted has its back surface covered with a ground conductor 16. This is to completely block high-frequency signals flowing to the stub 15 and the coupling electrode 2 from other circuit elements and patterns arranged on the back side of the printed wiring board 10 in the electronic device.

プリント配線基板10の表面側に印刷形成されるスタブ15の長さは、伝送帯域である4GHzの周波数帯の約1/2波長に相当する4cmとするが、上方が縦10mm、横13mmの略長方形状の結合用電極2で覆われるように、図1に示すように蛇行させ、蛇行させた配線方向に沿った長さがほぼ1/2波長となるようにスタブ15を形成している。   The length of the stub 15 printed and formed on the surface side of the printed wiring board 10 is 4 cm, which corresponds to about 1/2 wavelength of the 4 GHz frequency band which is a transmission band, but the upper part is approximately 10 mm long and 13 mm wide. As shown in FIG. 1, the stub 15 is formed so that the length along the meandering wiring direction is approximately ½ wavelength so as to be covered with the rectangular coupling electrode 2.

スタブ15の先端側は、プリント配線基板10に形成されたスルーホール17を介して裏面のグランド導体16に接続し、接地されている。スタブ15の基端側からは、信号パターン15aが引き出され、その両側に所定の絶縁間隔を隔ててスルーホール18でグランド導体16に接続するグランドパターン16aが配線されている。信号パターン15aとグランドパターン16aには、それぞれ図示しない同軸コネクタの信号端子と接地端子が半田接続されるもので、同軸コネクタに接続する同軸ケーブルを介して信号パターン15aは、図6の送信回路部111若しくは受信回路部121に接続している。   The front end side of the stub 15 is connected to the ground conductor 16 on the back surface through a through hole 17 formed in the printed wiring board 10 and is grounded. A signal pattern 15a is drawn out from the base end side of the stub 15, and ground patterns 16a connected to the ground conductor 16 through the through holes 18 are wired on both sides of the signal pattern 15a with a predetermined insulation interval. A signal terminal and a ground terminal of a coaxial connector (not shown) are solder-connected to the signal pattern 15a and the ground pattern 16a, respectively, and the signal pattern 15a is connected to the coaxial circuit connected to the coaxial connector by the transmission circuit unit shown in FIG. 111 or the receiving circuit unit 121.

裏面がグランド導体16で覆われたプリント配線基板10の表面に上述のスタブ15が形成されることにより、同軸コネクタに接続する同軸ケーブルの特性インピーダンスにマッチングするマイクロストリップ線路が形成される。従って、スタブ15との結合部やスタブ15の先端部において反射することがなく、スタブ15の配線方向に沿ってその中央位置で最大の電圧振幅となる定在波が発生する。   By forming the stub 15 on the surface of the printed wiring board 10 whose back surface is covered with the ground conductor 16, a microstrip line that matches the characteristic impedance of the coaxial cable connected to the coaxial connector is formed. Accordingly, a standing wave having a maximum voltage amplitude is generated at the central position along the wiring direction of the stub 15 without being reflected at the coupling portion with the stub 15 or the tip of the stub 15.

結合用電極2から吊り下げられた給電ピン4は、絶縁スペーサ3の脚部36、36・・をプリント配線基板10の第1取付孔11若しくは第2取付孔12に挿入して結合用電極ユニット1が位置決めされた状態で、下端部4aがスタブ15の上記中央位置に近接する長さとなっている。   The feeding pin 4 suspended from the coupling electrode 2 is inserted into the first mounting hole 11 or the second mounting hole 12 of the printed wiring board 10 by inserting the leg portions 36, 36,. In a state where 1 is positioned, the lower end portion 4a is close to the center position of the stub 15.

高周波結合器は、上述構成の結合用電極ユニット1をスタブ15が形成されたプリント配線基板10の表面に実装することにより形成される。以下、この高周波結合器を形成する方法を説明する。始めに、長方形板金状の結合用電極2の長手方向に突出する一対の係合片2a、2aを上方から絶縁スペーサ3の係合突起34に当接させて、全体を下方へ押圧する。これにより、一対のコの字状腕部31、32は連結部33回りでわずかに弾性変形し、一対の係合突起34、34間が拡開するとともに、結合用電極2も長手方向で湾曲し、一対の係合片2a、2aは、係合突起34を乗り越えて、結合用電極2の周囲が係合段部35上に当接する。その結果、結合用電極2は、絶縁スペーサ3に対してスナップインで取り付けられ、取り付けられた状態で、水平方向に対しては、コの字状腕部31、32と連結部33の内壁面によりがたつきなく位置決めされ、上下方向に対しては、周囲と係合片2aが係合段部35の表面と係合突起24の裏面に挟まれ、位置決め固定される。   The high-frequency coupler is formed by mounting the coupling electrode unit 1 having the above-described configuration on the surface of the printed wiring board 10 on which the stub 15 is formed. Hereinafter, a method of forming this high frequency coupler will be described. First, a pair of engaging pieces 2a and 2a projecting in the longitudinal direction of the coupling electrode 2 in the shape of a rectangular sheet metal are brought into contact with the engaging protrusions 34 of the insulating spacer 3 from above and pressed downward. As a result, the pair of U-shaped arm portions 31 and 32 are slightly elastically deformed around the connecting portion 33, the space between the pair of engaging projections 34 and 34 is expanded, and the coupling electrode 2 is also curved in the longitudinal direction. The pair of engaging pieces 2 a and 2 a get over the engaging protrusion 34, and the periphery of the coupling electrode 2 abuts on the engaging step portion 35. As a result, the coupling electrode 2 is attached to the insulating spacer 3 by snap-in, and in the attached state, the inner wall surfaces of the U-shaped arm portions 31 and 32 and the connecting portion 33 in the horizontal direction. In the vertical direction, the periphery and the engagement piece 2a are sandwiched between the front surface of the engagement step portion 35 and the back surface of the engagement protrusion 24, and are positioned and fixed.

続いて、結合用電極2が取り付けられた絶縁スペーサ3を、予めスタブ15の中央位置、信号パターン15a及びグランドパターン16a上にクリーム半田を印刷形成してたプリント配線基板10の表面に取り付ける。ここでは、プリント配線基板10に第2取付孔12が形成されているものとして、各脚部36の先端部36aを第2取付孔12へ挿入して絶縁スペーサ3をプリント配線基板10の表面に位置決めする。   Subsequently, the insulating spacer 3 to which the coupling electrode 2 is attached is attached to the surface of the printed wiring board 10 in which cream solder is printed in advance on the center position of the stub 15, the signal pattern 15a, and the ground pattern 16a. Here, assuming that the second mounting hole 12 is formed in the printed wiring board 10, the distal end portion 36 a of each leg portion 36 is inserted into the second mounting hole 12, and the insulating spacer 3 is formed on the surface of the printed wiring board 10. Position.

その後、給電ピン4の下端部4aを結合用電極2の円筒孔6へ上方から挿通させて圧入する。第2取付孔12が形成されたプリント配線基板10へ絶縁スペーサ3を取り付けた場合には、図4に示すように、スタブ15から結合用電極2までの高さH1が、図5に示す高さH2に比べて高いので、比較的長い給電ピン4を用い、その下端部4aがスタブ15に印刷されたクリーム半田へ達するまで圧入する。   Thereafter, the lower end 4 a of the power supply pin 4 is inserted into the cylindrical hole 6 of the coupling electrode 2 from above and press-fitted. When the insulating spacer 3 is attached to the printed wiring board 10 in which the second attachment holes 12 are formed, as shown in FIG. 4, the height H1 from the stub 15 to the coupling electrode 2 is high as shown in FIG. Since it is higher than the height H2, the relatively long power supply pin 4 is used and press-fitted until the lower end portion 4a reaches the cream solder printed on the stub 15.

この工程と前後して、信号パターン15aとグランドパターン16aに信号端子と接地端子が接するように同軸コネクタを配置し、結合用電極ユニット1と同軸コネクタが搭載されたプリント配線基板10の全体をリフロー炉に通し、結合用電極ユニット1を表面実装する。リフロー工程後の結合用電極ユニット1は、一対のコの字状腕部31、32間の開口から給電ピン4の下端部4aとスタブ15間の半田付け部を視認でき、半田接続不良を防止できる。また、絶縁スペーサ3の各脚部36を第2取付孔12に挿入してプリント配線基板10の表面に実装されるので、実装後は一対のコの字状腕部31、32間が開いて結合用電極2が脱落する恐れがない。   Before and after this step, a coaxial connector is arranged so that the signal terminal and the ground terminal are in contact with the signal pattern 15a and the ground pattern 16a, and the entire printed wiring board 10 on which the coupling electrode unit 1 and the coaxial connector are mounted is reflowed. The coupling electrode unit 1 is surface-mounted through a furnace. After the reflow process, the coupling electrode unit 1 can visually recognize the soldered portion between the lower end portion 4a of the power feed pin 4 and the stub 15 from the opening between the pair of U-shaped arm portions 31 and 32, and prevents poor solder connection. it can. In addition, since each leg portion 36 of the insulating spacer 3 is inserted into the second mounting hole 12 and mounted on the surface of the printed wiring board 10, the gap between the pair of U-shaped arm portions 31 and 32 is opened after mounting. There is no fear of the coupling electrode 2 dropping off.

このリフロー工程により、結合用電極2は、その図形中心が給電ピン4を介してスタブ15の中央位置に電気接続し、同軸ケーブルを介して送信回路部111若しくは受信回路部121に接続する高周波結合器が形成される。   By this reflow process, the coupling electrode 2 has a graphic center electrically connected to the center position of the stub 15 via the feed pin 4 and connected to the transmission circuit unit 111 or the reception circuit unit 121 via the coaxial cable. A vessel is formed.

本実施の形態に係る結合用電極ユニット1によれば、板金状の結合用電極2の周囲が絶縁スペーサ3に位置決め支持されるので、自動実装が可能となり、また不用意な外力を受けても変形することがない。   According to the coupling electrode unit 1 according to the present embodiment, the periphery of the sheet-metal coupling electrode 2 is positioned and supported by the insulating spacer 3, so that automatic mounting is possible, and even if an inadvertent external force is applied. There is no deformation.

また、結合用電極2の図形中心において、高周波伝送線路であるスタブ15と電気接続するので、給電点と結合用電極2の中心との間で結合用電極2の平面に沿って不均一な電流が流れることがなく、アンテナとして不要な電波を放射することがない。   In addition, since the electrical connection is made with the stub 15 which is a high-frequency transmission line at the center of the figure of the coupling electrode 2, non-uniform current along the plane of the coupling electrode 2 between the feeding point and the center of the coupling electrode 2. Does not flow and does not radiate unnecessary radio waves as an antenna.

本実施の形態では、図4に示すプリント配線基板10の表面からの高さH1が2.6mmで、プリント配線基板10の厚さが0.6mmとなっているので、結合用電極2とプリント配線基板10の裏面側のグランド導体16間は3.2mmと充分な間隔が確保される。更に、結合用電極2とスタブ15が配線されたプリント配線基板10間は、合成樹脂などの絶縁体に比べて誘電率が低い空間となっているので、結合用電極2とグランド導体16間が電界結合しにくく、結合用電極2に流れる高周波信号がグランド導体16に漏れることがない。   In the present embodiment, the height H1 from the surface of the printed wiring board 10 shown in FIG. 4 is 2.6 mm, and the thickness of the printed wiring board 10 is 0.6 mm. A sufficient distance of 3.2 mm is secured between the ground conductors 16 on the back side of the wiring board 10. Further, since the space between the printed wiring board 10 on which the coupling electrode 2 and the stub 15 are wired is a space having a lower dielectric constant than an insulator such as a synthetic resin, the space between the coupling electrode 2 and the ground conductor 16 is between. Electric field coupling is difficult, and a high-frequency signal flowing through the coupling electrode 2 does not leak to the ground conductor 16.

上記実施の形態に対し、各脚部36の基端部36bまでが遊嵌する第1取付孔11が形成されたプリント配線基板10と、より短い給電ピン4を用意するだけで、共通の結合用電極2と絶縁スペーサ3を用いて、図5に示すように結合用電極ユニット1を更に低背化させることができる。第1取付孔11へ各脚部36の基端部36bまで遊嵌させた結合用電極ユニット1のプリント配線基板10の表面からの高さH2は、2.0mmであり、プリント配線基板10の厚さが0.6mmを加えた結合用電極2とグランド導体16間の距離は2.6mmであるが、結合用電極2とプリント配線基板10間が誘電率が低い空間となっているので、結合用電極2に流れる高周波信号はグランド導体16に漏れにくい。   In contrast to the above-described embodiment, a common coupling can be achieved by simply preparing the printed wiring board 10 in which the first mounting holes 11 into which the base ends 36b of the respective leg portions 36 are loosely fitted and the shorter power supply pins 4 are prepared. By using the electrode 2 and the insulating spacer 3, the coupling electrode unit 1 can be further reduced in height as shown in FIG. The height H2 from the surface of the printed wiring board 10 of the coupling electrode unit 1 loosely fitted to the base end portion 36b of each leg portion 36 in the first mounting hole 11 is 2.0 mm. The distance between the coupling electrode 2 with a thickness of 0.6 mm and the ground conductor 16 is 2.6 mm, but the space between the coupling electrode 2 and the printed wiring board 10 is a low dielectric constant. A high frequency signal flowing through the coupling electrode 2 is unlikely to leak into the ground conductor 16.

上記実施の形態では、絶縁スペーサ3をプリント配線基板10の表面に配置した後、給電ピン4を結合用電極2へ圧入して取り付けたが、結合用電極2を取り付けた絶縁スペーサ3に給電ピン4を圧入して取り付け、一体に組み立てた結合用電極ユニット1をプリント配線基板10の表面に実装しても良い。   In the above embodiment, the insulating spacer 3 is disposed on the surface of the printed wiring board 10 and then the power supply pin 4 is press-fitted and attached to the coupling electrode 2. However, the power supply pin is attached to the insulating spacer 3 to which the coupling electrode 2 is attached. 4 may be press-fitted and attached, and the coupling electrode unit 1 assembled integrally may be mounted on the surface of the printed wiring board 10.

また、上記実施の形態では、給電ピン4を挽物加工で結合用電極2と別に形成したが、導電性金属板を絞り加工する等の工程で、給電ピン4と結合用電極2とを一体で形成してもよい。   Further, in the above embodiment, the power feed pin 4 is formed separately from the coupling electrode 2 by grinding, but the power feed pin 4 and the coupling electrode 2 are integrated in a process such as drawing a conductive metal plate. It may be formed.

静電界若しくは誘導電界を利用したUWB通信システムに用いられる高周波結合器に適している。   It is suitable for a high-frequency coupler used in a UWB communication system that uses an electrostatic field or an induction field.

1 結合用電極ユニット
2 結合用電極
2a 係合片
3 絶縁スペーサ
4 給電ピン
4a 下端部
5 係合段部
6 円筒孔
10 プリント配線基板
11 第1取付孔
12 第2取付孔
15 スタブ
15a 信号パターン
16 グランド導体
17 スルーホール
31 コの字状腕部
32 コの字状腕部
33 連結部
34 係合突起
35 係合段部
36 脚部
36a 先端部
36b 基端部
DESCRIPTION OF SYMBOLS 1 Coupling electrode unit 2 Coupling electrode 2a Engagement piece 3 Insulating spacer 4 Feeding pin 4a Lower end part 5 Engagement step part 6 Cylindrical hole 10 Printed wiring board 11 1st attachment hole 12 2nd attachment hole 15 Stub 15a Signal pattern 16 Ground conductor 17 Through hole 31 U-shaped arm portion 32 U-shaped arm portion 33 Connecting portion 34 Engaging projection 35 Engaging step portion 36 Leg portion 36a Tip portion 36b Base end portion

Claims (2)

表面にインダクタを形成するスタブが配線されたプリント配線基板上に、スタブの配線方向に沿った中央位置に電気接続する結合用電極を、スタブと所定間隔を隔てて配置する結合用電極ユニットであって、
導電性金属からなる平板状の結合用電極と、
結合用電極裏面の中心から垂設される給電ピンと、
結合用電極の周囲が係合する枠状に形成され、結合用電極をプリント配線基板の表面と所定間隔を隔てて平行に位置決め支持してプリント配線基板の表面に実装される絶縁スペーサとを備え、
絶縁スペーサは、一対のコの字状腕部が対向し結合用電極の周囲を囲う一部が開口する枠状に形成され、
各腕部の内壁面の上方に臨む係合段部と下方に臨む係合突起との間で結合用電極の周囲を挟持し、結合用電極を位置決め支持する絶縁スペーサを、スタブを囲うプリント配線基板の表面に実装した状態で、結合用電極から垂設される給電ピンの下端部をスタブの中央に電気接続することを特徴とする結合用電極ユニット。
This is a coupling electrode unit in which a coupling electrode that is electrically connected to a central position in the wiring direction of the stub is arranged at a predetermined distance from the stub on a printed wiring board on which a stub forming an inductor is formed on the surface. And
A flat coupling electrode made of a conductive metal;
A feed pin suspended from the center of the back surface of the coupling electrode;
An insulating spacer formed on the surface of the printed wiring board is formed in a frame shape that engages the periphery of the coupling electrode, and is positioned and supported in parallel with the surface of the printed wiring board at a predetermined interval. ,
The insulating spacer is formed in a frame shape in which a pair of U-shaped arms face each other and a part surrounding the coupling electrode is opened,
Printed wiring that surrounds the stub with an insulating spacer that positions and supports the coupling electrode by sandwiching the periphery of the coupling electrode between the engagement step portion facing above the inner wall surface of each arm and the engagement protrusion facing downward A coupling electrode unit, wherein a lower end portion of a power supply pin suspended from a coupling electrode is electrically connected to a center of a stub in a state of being mounted on a surface of a substrate.
プリント配線基板の取付孔に挿入されるスペーサ枠部の脚部は、先端部より上方の基端部の外径が大径の二段に分けて形成され、
基端部が遊嵌する第1取付孔が形成されたプリント配線基板へ絶縁スペーサを実装する際には、第1長さの給電ピンで結合用電極とスタブを電気接続し、
先端部が遊嵌し、基端部の外径より小径の第2取付孔が形成されたプリント配線基板へ絶縁スペーサを実装する際には、第1長さより長い第2長さの給電ピンで結合用電極とスタブを電気接続することを特徴とする請求項に記載の結合用電極ユニット。
The leg portion of the spacer frame portion to be inserted into the mounting hole of the printed wiring board is formed in two steps with the outer diameter of the base end portion above the tip portion being large,
When mounting the insulating spacer on the printed wiring board in which the first mounting hole in which the base end part is loosely fitted is formed, the coupling electrode and the stub are electrically connected by the first length of the power supply pin,
When mounting the insulating spacer on the printed wiring board in which the distal end portion is loosely fitted and the second mounting hole having a diameter smaller than the outer diameter of the proximal end portion is formed, a power supply pin having a second length longer than the first length is used. The coupling electrode unit according to claim 1 , wherein the coupling electrode and the stub are electrically connected.
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