JP4902155B2 - Substrate cutting method - Google Patents

Description

  The present invention relates to a substrate cutting method suitable for cutting a substrate to be cut by a scribe line formed on at least one surface thereof.

  2. Description of the Related Art Conventionally, there is known a substrate cutting method called a scribing method in which a substrate to be cut is cut by a scribe line formed on at least one surface thereof.

  For example, in the manufacture of a recent electro-optical panel such as a liquid crystal panel or an EL panel, a plurality of large-sized flat substrates (mother substrates) made of glass having a large area for multi-surface processing as a substrate to be divided are used. It is possible to reduce the manufacturing efficiency and reduce the manufacturing process by dividing the large-sized substrate into a part corresponding to each optical panel or the part corresponding to the optical panel. It is often used for reasons such as easy cost reduction.

  For this type of substrate to be cut, a scribe line, which is a line-shaped scratch of a predetermined pattern, is formed in advance along a planned cutting line on at least one surface of the substrate to be cut using a carbide chip, a diamond chip, a cutting wheel, or the like. After that, a pressing member called a squeegee, a break bar, a cutting head or the like is brought into contact with the opposite side of the substrate to be cut facing the scribe line (for example, see Patent Document 1).

  By the way, in recent years, not only linear shapes but also various shapes including various curved shapes such as an arc shape, a semi-elliptical shape, and an S shape have been demanded as a dividing shape of a substrate to be divided.

  For example, as shown in FIG. 8, an arc-shaped scribe line SLA that protrudes to the right is formed on a substrate to be divided 101 that is formed in a planar rectangular flat plate shape, and the substrate is cut along the arc-shaped scribe line SLA. It is required to obtain a cut product 102 used as a flat D-shaped product by cutting the cut substrate 101. Both ends of the scribe line SLA used for dividing the substrate to be divided 101 are connected to end surfaces 101a of the substrate to be divided 101 shown in the upper and lower parts of FIG. In addition, the site | part of the right side of the scribe line SLA shown on the right side of FIG. 9 is made into the surplus part 103 as a broken material generally discarded.

  For such a cut-off along the arc-shaped scribe line SLA of the substrate 101 to be cut, a part of the scribe line SLA from one end to the other end using a linear pressing member having a short length is used. A method of gradually dividing by applying sequential pressing force, a method of dividing by applying a pressing force to the entire scribe line SLA using a pressing member formed in the same shape as the shape of the scribe line SLA, etc. It is used.

JP 2001-235733 A

  However, in the conventional substrate cutting method, when the substrate to be divided 101 is divided along the curved scribe line SLA, the cracks that proceed from the scribe line SLA only progress in the thickness direction of the substrate to be divided 101. Instead, it also proceeds in an oblique direction, that is, a tangential direction of the scribe line SLA. Further, at both ends of the scribe line SLA in the line forming direction, the scribe line SLA is connected to the end surface 101a of the substrate to be divided 101, and the end surface 101a of the substrate to be divided 101 is connected to a free surface opened to the outside. As a result, the degree of freedom in the direction of crack propagation increases.

  That is, when both ends of the scribe line SLA connected to the end surface 101a formed in a straight shape of the substrate to be divided 101 are formed in a curved shape, the both ends of the scribe line SLA proceed from the scribe line SLA. Due to the large degree of freedom in the direction of crack propagation and the large degree of freedom in the direction of crack propagation, the direction of crack progression at both ends of the scribe line SLA is concentrated in the thickness direction of the substrate 101 to be divided. It has become difficult to restrain.

  As a result, at both end portions of the divided section 102a along the scribe line SLA in the divided product 102, for example, separation defects such as burrs (bulges) 104 exaggerated in FIG. There is a problem that a smooth and high-quality dividing section 102a cannot be obtained reliably.

  Such a division failure is caused by a configuration in which a pair of substrates are bonded together via a bonding member as a substrate to be divided, for example, a pair of substrates used in the manufacture of an electro-optical panel such as a liquid crystal panel or an EL panel. It is also generated when the substrate is bonded by a sealing material that also serves as a bonding member, and a curved scribe line is formed on at least one surface of the substrate to be divided.

  Therefore, there is a need for a substrate cutting method that can reliably obtain a smooth and high-quality section.

  This invention is made | formed in view of such a point, and it aims at providing the board | substrate cutting method which can obtain a smooth and high quality dividing surface reliably.

In order to achieve the above-described object, the substrate cutting method according to the present invention is characterized in that a substrate to be divided is formed by bonding a pair of substrates via a second bonding member, and the substrate is divided into at least one surface of the substrate to be divided. In the substrate cutting method in which a scribe line is formed outside the formation region of the second bonding member and the pressing member is pressed along the scribe line to divide the substrate to be divided, before the pair of substrates are bonded together And cracks at least at both ends of the scribe line forming position of the substrate to be cut so that the cracks proceeding from the scribe line when the substrate is divided by the pressing member proceed in the thickness direction of the substrate to be divided. Forming a first bonding member that restrains the traveling direction of the first bonding member so as to be positioned between the pair of substrates, bonding the pair of substrates, Line but is formed in a square shape from the second joint members so as to bridge the scribe line, the angular shaped first joint member having a smaller width than the width of the second joint members It is in the point of being in the shape . The curved substrate is rectangular, the scribe line is formed in a curved shape so as to connect opposing end faces of the divided substrate, and the curved second joining member disposed inside the scribe line It is preferable that the square-shaped first joining member is formed from each of the corner portions located at the connection points with the linear second joining members respectively disposed on the inner sides of the opposing end surfaces. Further, it the angular of the first bonding member and the second joint member from the same material, it is not preferable that the first joint member is formed extending from the second joint member. Furthermore, a pressing force receiver that receives a pressing force by the pressing member in cooperation with the second bonding member in a region outside the scribe line and in a region outside the formation position of the first bonding member. It is preferable that the part is formed. Further, it is preferable that the substrate to be divided is for forming an electro-optical panel.

According to the substrate cutting method according to the present invention, before the pair of substrates are bonded together, at least both ends of the scribe line formation position of the substrate to be cut, the cracks proceed from the scribe line when the substrate to be cut is divided by the pressing member. Forming a first joining member that restrains the direction of crack propagation so as to advance in the thickness direction of the substrate to be divided so as to be positioned between the pair of substrates, joining the pair of substrates, The member is formed in a square shape from the second joining member so as to straddle the scribe line, and the square first joining member is a linear shape having a width dimension smaller than the width of the second joining member. because it is the body, the first joint members, the traveling direction of the freedom of cracks proceeding from the scribe line upon cutting the object to be separated substrate by the pressing member, the pressing member with respect to the cutting board It is possible to restrain along imparting direction of the pressing force to focus the thickness direction of the cutting board, to be able to obtain a partial cross-section of high quality easily and reliably smooth, the horned 1 Since the joining member is a linear body having a width dimension smaller than the width of the second joining member, the first joining member can be surely and easily divided at the scribe line as a boundary. Excellent effects such as being able to cut the substrate without inverting it are obtained . Further, according to the substrate cutting method according to the present invention, the substrate to be divided is a plane rectangle, the scribe line is formed in a curved shape so as to connect the opposing end surfaces of the substrate to be divided, and is arranged inside the scribe line. From the corners located at the connection points of the curved second joining members and the linear second joining members respectively arranged on the inner sides of the end faces facing each other, the angular first joining members are provided. Since it is formed, when both ends of the line forming direction of the scribe line formed in a curved shape are connected to the end surface formed in a straight shape of the substrate to be divided, by the first bonding member, The degree of freedom in the direction of crack propagation at both ends of the curved scribe line can be easily and reliably reduced, and the crack progression direction is constrained to be concentrated in the thickness direction of the substrate to be divided. Since it is possible to easily and reliably, an excellent effect, such as high quality can be obtained partial cross-section of easily and reliably both end portions of the curved scribe line burrs or without chipping smooth. Furthermore, according to the substrate cutting method according to the present invention, the square first joining member and the second joining member are made of the same material, and the first joining member is extended from the second joining member. Therefore, the rectangular first bonding member can be easily and efficiently formed on the substrate to be divided, and the first bonding member is dropped from the substrate to be divided as compared with the case where the first bonding member is formed alone. There are excellent effects such as reduction of establishment . Also further, according to the substrate cutting method according to the present invention, in the outer region of the scribe line, and outside the region of the formation position of the first joint member, the second joining member the pressing force by the pressing member Since the pressing force receiving portion received in cooperation with the second pressing member is pressed, the pressing force by the pressing member can be received from both sides by the cooperation of the second joining member and the pressing force receiving portion. As a result, the pressing force can be reliably exerted in the thickness direction of the substrate to be cut, so that an excellent effect such as obtaining a smoother and higher quality sectional surface is obtained. Further, according to the substrate cutting method according to the present invention, since the substrate to be cut is for forming an electro-optical panel, an electro-optical panel, in particular, an electro-optical panel having a curve can be easily manufactured. Has an excellent effect.

  The present invention will be described below with reference to embodiments shown in the drawings.

1 to 3 show a substrate to be cut used in a first embodiment (reference form) of a substrate cutting method according to the present invention. FIG. 1 is a schematic plan view showing a configuration of a main part, and FIG. FIG. 3 is a bottom view, and FIG. 3 is an enlarged cross-sectional view exaggeratingly showing the vicinity of the crack traveling direction restraining means in a divided state. FIG. 4 is a schematic plan view showing a state after the substrate to be divided is divided.

  As shown in FIG. 1 to FIG. 3, the substrate 1 to be divided according to the present embodiment is formed in a planar rectangular flat plate shape. The material of the substrate 1 to be divided may be any material that can be divided by a conventional scribing method, and can be selected from various materials such as glass, semiconductor wafers, ceramics, and resins.

  On the right side of one surface of the substrate 1 to be divided, a curved scribe line SL is formed so as to connect the upper and lower end surfaces 1a of the substrate 1 to be divided, and in this embodiment, the center portion is convex to the right in FIG. Is formed. And the area | region of the left side inside the scribe line SL of the to-be-divided board | substrate 1 is divided | segmented goods 2 used as a product as shown in FIG. 4, after dividing the to-be-divided board | substrate 1 by the scribe line SL. It is said that. Further, the right region outside the scribe line SL of the substrate 1 to be divided is a surplus portion 3 that is not used after being divided by the scribe line SL, as shown in FIG. This surplus portion 3 is generally discarded.

  The shape of the scribe line SL is not limited to the circular arc shape, and can be selected from various shapes formed by curves such as a semi-elliptical shape and an S shape, or a composite line obtained by combining a straight line and a curved line. In addition, as the positions of both ends of the scribe line SL, one end is connected to the upper end face 1a and the other end is connected to the right end face 1a, or one end is connected to the lower end face 1a and the other end is connected to the right end face 1a. It is good also as a structure connected to the end surface 1a. Note that the scribe line SL is formed using a carbide tip, a diamond tip, a cutting wheel, or the like, as in the conventional case. Further, scribe lines SL may be provided on both surfaces of the substrate 1 to be divided.

As shown in FIGS. 1 to 3, the scribe line SL is formed on the substrate 1 to be cut, and is opposed to the scribe line SL on the surface opposite to the surface on which the scribe line SL is formed. At the position where the cut substrate 1 is cut by a pressing member (not shown), the crack C (see FIG. 3) is arranged so that the progress direction of the crack that advances from the scribe line SL is concentrated in the thickness direction of the cut substrate 1. Direction of cracking, that is, the crack traveling direction as a first joining member for restraining the traveling direction of the crack C so that the crack C traveling from the scribe line SL proceeds in the thickness direction of the substrate 1 to be divided Restraining means 4 is formed.

  The crack progress direction restraining means 4 of the present embodiment is configured such that the scribe line is positioned at a position facing both ends in the line formation direction of the scribe line SL on the surface opposite to the surface on which the scribe line SL is formed. It is formed in a short line shape extending in parallel with the end face 1a to which the SL is connected. Further, the crack direction restraining means 4 of the present embodiment is configured so that both ends of the scribe line SL on the surface opposite to the surface on which the scribe line SL is formed of the substrate 1 to be divided are bonded by the bonding member bonded to the substrate 1 to be divided. It is formed so as to connect both sides of the scribe line SL at a position facing the portion. That is, the crack advancing direction restraining means 4 is disposed so as to straddle the scribe line SL.

  As a material of the bonding member, a material having bonding property (adhesiveness) to the substrate 1 to be divided, for example, a resin such as an epoxy resin or a methacrylic resin, an adhesive tape, or the like can be used alone or in combination. . And when using resin as a raw material of a joining member, it can select and use from a thermosetting type, a thermoplastic type, an ultraviolet curing type, etc. Furthermore, the joining member made of such a material can be formed in a predetermined pattern at a preset position by using a photolithography method, a dispenser method, a screen printing method, or the like.

  Note that the crack advancing direction restricting means 4 may be formed at least at both ends of the position where the scribe line SL is formed, and may be formed on the scribe line SL in the same shape as the scribe line SL. Alternatively, it may be divided into a plurality along the scribe line SL.

  Further, the shape of the crack advancing direction restraining means 4 and the size such as the width, the length and the thickness can be set according to the specifications, the design concept and the like.

More specifically, as the shape of the crack progress direction restraining means 4, various shapes such as a straight line, a rectangle, a polygon, a circle, and an ellipse can be selected and used .

  And as a size of the length direction along the length direction which crosses the scribe line SL of the crack progress direction restraint means 4, it is as short as possible, for example, in the case of the linear structure which uses resin as a raw material, it is 1 mm or less Specifically, about 0.3 mm is preferable in the sense that the crack progress direction restraining means 4 can be reliably and easily divided with the scribe line SL as the substrate 1 is divided. .

  Further, the size in the width direction orthogonal to the length direction crossing the scribe line SL of the crack traveling direction restraining means 4 is as small as possible, for example, 1 mm in the case of a linear configuration made of resin. Hereinafter, specifically about 0.3 mm means that the crack progress direction restraining means 4 can be reliably and easily divided at the scribe line SL as the substrate 1 to be divided is divided. preferable.

  Further, the thickness of the crack traveling direction restraining means 4 is as thin as possible. For example, when the resin is used as the material, the thickness of the substrate 1 to be divided is set to 1.0 mm or less, specifically about 0.1 mm. At the time of the division, it is preferable in the sense that the crack traveling direction restraining means 4 can be reliably and easily divided with the scribe line SL as a boundary in accordance with the division of the substrate 1 to be divided.

  That is, the size of the crack traveling direction restraining means 4 can be set so that it can be surely and easily divided with the scribe line SL as a boundary, so that productivity can be easily improved and costs can be reduced. This is preferable.

  In addition, the to-be-divided board | substrate 1 may be formed separately, or may be divided | segmented and formed from the mother board | substrate which has a large area for multi-surface drawing.

  When one of the divided substrates 1 is formed individually, the crack advancing direction restraining means 4 can be provided so as to be connected to the end face 1a of the divided substrate 1. Further, the crack traveling direction restraining means 4 may be formed either before or after the scribe line SL is formed.

  When the other substrate to be divided 1 is formed separately from a mother substrate having a large area for multi-sided cutting, generally, a substrate region for obtaining a plurality of substrates to be divided 1 is formed in a matrix, for example, in a matrix shape. After the linear scribe lines SL are provided outside the substrate region in a grid pattern, for example, the mother substrate is divided into strips by the linear scribe lines SL formed in the vertical direction, and then The rectangular substrate 1 is obtained by dividing the strip-like material with a linear scribe line SL formed in the lateral direction.

  Therefore, since the end surface 1a of the substrate 1 to be divided is a divided section of the mother substrate (a position where a linear scribe line is formed), the crack advancing direction restraining means 4 is provided in each substrate region at the stage of the mother substrate. When forming, it is preferable to form in the position away from the end surface 1a of the to-be-divided board | substrate 1 like this embodiment so that it may not overlap on the scribe line for mother boards. Further, the crack traveling direction restraining means 4 can be formed at the stage of the mother substrate. In this case, the order of formation of the crack advancing direction restraining means 4 and the scribe line SL may be either first. The planar shape of the mother substrate can be selected from rectangular, circular, etc.

  Next, the operation of the present embodiment having the above-described configuration will be described together with the embodiment of the substrate cutting method of the present invention.

  The substrate cutting method according to this embodiment is carried out using the above-described substrate to be cut 1 according to this embodiment and a cutting apparatus including a conventionally known pressing member (not shown).

  That is, in the substrate cutting method according to the present embodiment, before the substrate to be cut 1 is cut by the scribe line SL, the scribe line SL formed in the curved shape of the substrate to be cut 1 is formed as shown in FIGS. The crack advancing direction restraining means 4 is formed at at least both ends of the position.

  Next, as shown in FIG. 3, the substrate to be cut 1 on which the crack traveling direction restraining means 4 is formed is placed on the table T of the substrate cutting device with the scribe line SL facing downward. Then, as shown in FIG. 3, a load (pressing force) is applied as shown by a thick arrow in FIG. 3 by a pressing member (not shown) toward the scribe line SL from the surface facing the formation surface of the scribe line SL. To do. Then, when the crack C advances from the scribe line SL in the thickness direction of the substrate 1 to be divided as indicated by the upward arrow in FIG. 3, and the crack C reaches the surface opposite to the surface on which the scribe line SL is formed, FIG. It is divided into the divided product 2 and the surplus portion 3 shown in FIG.

  At this time, the crack C traveling from the scribe line SL at the formation position of the crack traveling direction restraining means 4 and in the vicinity thereof travels in the traveling direction so as to travel in the thickness direction of the substrate 1 to be divided by the crack traveling direction restraining means 4. The degree of freedom is restricted.

  That is, since both sides of the scribe line SL on the surface opposite to the surface on which the scribe line SL is formed are connected by the crack progression direction restraining means 4, the scribe line SL is separated from the boundary of the substrate 1 to be divided. Thus, the force generated to open the substrate 1 to be divided can be suppressed. Thereby, since the freedom degree of the advancing direction of the crack C can be restrained so that it may concentrate on the thickness direction of the to-be-divided board | substrate 1 along the provision direction of the pressing force by the pressing member with respect to the to-be-divided board | substrate 1 It is possible to reliably obtain a smooth and high-quality curved segmented section 2a free from burrs (see reference numeral 104 in FIG. 9) or chips at both ends of the curved scribe line SL in the product 2. That is, when both end portions in the line forming direction of the scribe line SL formed in a curved shape are connected to the end surface 1a formed in a straight shape of the substrate 1 to be divided, the crack progress direction restraining means 4 is provided. Thus, unlike the conventional substrate cutting method, it is possible to easily and reliably reduce the degree of freedom in the direction of travel of the crack C at both ends of the curved scribe line SL, and the direction of travel of the crack C is divided. It is possible to easily and reliably restrain the substrate 1 to be concentrated in the thickness direction.

  This is because no burrs are generated in the division of the substrate 1 having the crack traveling direction restraining means 4 of the present embodiment, or extremely small burrs of 0.1 mm or less that are substantially negligible are generated. In the conventional cutting of the substrate to be cut 101, it was confirmed by an experimental result that a burr 104 requiring post-processing such as chamfering is generated in a subsequent process of 0.5 to 1.0 mm.

  As described above, according to the method for dividing the substrate to be divided 1 according to the present embodiment, before dividing the substrate to be divided 1, the crack traveling direction restraining means is provided at least at both ends of the scribe line SL formation position of the substrate to be divided 1. 4, the cracks proceeding from the scribe line SL at both ends of the curved scribe line SL by the crack advancing direction restraining means 4 when the substrate 1 to be divided is divided by the scribe line SL. Since the advancing direction of the crack C can be constrained so that C advances in the thickness direction of the substrate 1 to be divided, burrs or burrs referred to as poorly divided portions are formed on the dividing surface 2a at both end portions of the curved scribe line SL. It is possible to prevent chipping and the like from occurring.

  That is, according to the method for dividing the substrate 1 to be divided according to the present embodiment, it is possible to easily and surely obtain the divided product 2 having the smooth divided section 2a, and to prevent the yield from being reduced due to the occurrence of the division failure. Can do.

  Therefore, according to the method for dividing the substrate 1 to be divided according to the present embodiment, it is possible to easily and surely obtain a low-quality divided product 2 having high quality and excellent productivity.

  In addition, according to the substrate cutting method of the present embodiment, the crack progress direction restraining means 4 is formed by the joining member that joins to the substrate 1 to be cut, so that the crack progress direction restraining means 4 can be easily attached to the substrate 1 to be cut. Can be formed.

  5 and 6 show a substrate to be cut used in the second embodiment of the substrate cutting method according to the present invention. FIG. 5 is a schematic partial plan view showing the configuration of the main part, and FIG. It is an expanded sectional view which exaggerates and shows the vicinity of the crack advancing direction restraint means in a state. FIG. 7 is a schematic plan view showing a state after the substrate to be divided is divided.

  The substrate 1 to be cut used in the substrate cutting method according to the present embodiment exemplifies a substrate used for manufacturing an electro-optical panel such as a liquid crystal panel or an EL panel.

As shown in FIGS. 5 and 6, the substrate to be divided 1 </ b> A according to the present embodiment is a pair of substrates 1 </ b> AA formed in a planar rectangular flat plate disposed so as to be opposed to each other substantially in parallel. have. A sealing material 5 as a second bonding member for adhering and integrating the two substrates 1AA is disposed in a substantially D-shaped frame as a whole around the space between the opposing surfaces of the pair of substrates 1AA. Yes. That is, the pair of substrates 1AA are bonded together by the sealing material 5 that also serves as a bonding member that bonds to the divided substrate 1A. In a region surrounded by the sealing material 5, a display region in which pixels used for displaying information when the parted substrate 1 </ b> A is used as, for example, an electro-optical panel is provided.

  The both sides of the substrate to be divided 1A, that is, the outer surface of each substrate 1AA are curved so as to connect the upper and lower end surfaces 1Aa of the substrate to be divided 1A, and in this embodiment, the central portion is convex to the right in FIG. Arc-shaped scribe lines SL are respectively formed. These scribe lines SL are formed along the curved portion 5 a of the sealing material 5 outside the region where the sealing material 5 is formed. And the left area inside the scribe line SL of the parted substrate 1A is a part that becomes a parted product 2A used as a product as shown in FIG. 7 after the parted substrate 1A is divided by the scribe line SL. It is said that. Moreover, after dividing | segmenting the to-be-divided board | substrate 1A with the scribe line SL, as shown in FIG. 7, the right area | region which is outside the scribe line SL of the to-be-divided board | substrate 1A is made into the surplus part 3A which is not used, This surplus portion 3A is generally discarded.

  The shape of the scribe line SL is not limited to an arc shape, but can be selected from various shapes formed by curves such as a semi-elliptical shape and an S-shape, and a composite line composed of a straight line and a curved line. It is preferable to employ the present invention when a straight line and a curve intersect at a place where both ends of the scribe line SL intersect with the end surface 1Aa of the substrate 1A to be divided. Further, as the positions of both ends of the scribe line SL, one end is connected to the upper end surface 1Aa, and the other end is connected to the right end surface 1Aa, or one end is connected to the lower end surface 1Aa and the other end is connected to the right end surface 1Aa. It is good also as a structure connected to end surface 1Aa. Note that, as described above, the scribe line SL is formed using a carbide chip, a diamond chip, a cutting wheel, or the like.

  The shape of the scribe line SL is preferably set so as to be substantially similar to the shape of the curved portion 5 a of the sealing material 5.

As shown in FIGS. 5 and 6, the seal material 5 is formed at the position where the scribe line SL of the substrate to be divided 1 </ b> A is formed and opposite to the surface where the scribe line SL of each substrate 1 </ b> AA is formed. In each of the positions of the surface facing the scribe line SL, when the substrate 1A to be divided is divided by a pressing member (not shown), the advancing direction of the crack C that proceeds from the scribe line SL is concentrated in the thickness direction of the substrate 1A to be divided. In order to restrain the traveling direction of the crack C (see FIG. 6), that is, to restrain the traveling direction of the crack C so that the crack C traveling from the scribe line SL proceeds in the thickness direction of the substrate 1A to be divided. A crack advancing direction restraining means 4A as a first joining member is formed. These crack advancing direction restraining means 4A are formed as short lines parallel to the adjacent end face 1Aa at both ends of the scribe line SL in the line forming direction.

  The crack advancing direction restraining means 4A of the present embodiment is formed so as to straddle the scribe line SL simultaneously with the formation of the seal material 5 by the same material as the seal material 5, in other words, connecting both sides across the scribe line SL. Thus, the scribe line SL is formed in a short line extending in parallel with the end face 1Aa to which the scribe line SL is connected.

  That is, the crack traveling direction restraining means 4A of the present embodiment is a joining member that joins the substrate to be divided 1A, and a pair of sealing materials 5 that also have a function as an adhesive for bonding the pair of substrates 1AA. Before bonding the substrate 1AA with the sealing material 5, the scribe lines SL at positions opposite to both ends of the scribe line SL on the surface on which the sealing material 5 is formed opposite to the surface on which the scribe line SL is formed are formed. It is formed in a short line shape extending in parallel with the end face 1Aa to which the scribe line SL is connected so as to connect both sides sandwiched. Like the sealing material 5, the crack traveling direction restraining means 4A of the present embodiment is disposed so as to connect the opposing surfaces of the pair of substrates 1AA, and at a position away from the end surface 1Aa of the divided substrate 1A. Is formed. Further, the crack advancing direction restraining means 4A of the present embodiment is formed to extend from the right end of the linear portion 5b that is long in the left-right direction shown in the vertical direction of FIG. That is, the base end portion of the crack traveling direction restraining means 4A is connected to the seal material 5, and the tip end portion is disposed in a region outside the scribe line SL (on the right side in FIG. 5) beyond the scribe line SL. ing.

  Therefore, the crack advancing direction restraining means 4A of the present embodiment is such that the straight portion 5b of the sealing material 5 is respectively connected from the upper right corner and the lower right corner located at the connection point between the straight portion 5b and the curved portion 5a of the sealing material 5. It is formed to extend linearly so as to form a square shape on the extended line.

  Note that the crack advancing direction restraining means 4A may be provided independently from the sealing material 5. In this case, the crack advancing direction restraining means 4A can be formed of a material different from the sealing material 5. However, it is important to form the bonding member to be bonded to the substrate to be divided 1A. Further, when the crack traveling direction restraining means 4A is provided independently from the sealing material 5, it may not be arranged so as to connect the opposing surfaces of the pair of substrates 1AA. That is, the crack traveling direction restraining means 4A can be individually provided on each of the opposing surfaces of the pair of substrates 1AA.

  The crack progression direction restraining means 4A is only required to be formed at at least both ends of the scribe line SL formation position of the substrate to be divided 1A, similarly to the crack progression direction restraining means 4 of the first embodiment described above. It may be formed on the SL in the same shape as the scribe line SL, or may be divided into a plurality along the scribe line SL.

  Further, the shape, width, length, and thickness of the crack traveling direction restraining means 4A can be set according to the specifications, design concept, etc., as with the crack traveling direction restraining means 4 of the first embodiment described above. Can be set. For example, when the size in the width direction of the straight portion 5b and the curved portion 5a of the sealing material 5 is about 1.2 mm, the size in the width direction of the crack progress direction restraining means 4A is preferably about 0.24 mm. However, when dividing the substrate 1A to be divided, it is important to set the crack progress direction restraining means 4A so that it can be reliably and easily divided with the scribe line SL as the substrate 1A is divided. is there.

  The substrate to be divided 1A is illustrated in a region outside the scribe line SL of the substrate to be divided 1A, that is, a region that becomes the surplus portion 3A after dividing, and a region outside the formation position of the crack traveling direction restraining means 4A. A pressing force receiving portion 6 that receives the pressing force by the pressing member that does not cooperate in cooperation with the sealing material 5 is formed.

  The pressing force receiving portion 6 of the present embodiment is formed simultaneously with the formation of the sealing material 5 using the same material as the sealing material 5. That is, the pressing force receiving portion 6 of the present embodiment is a bonding member that is bonded to the substrate 1A to be divided and is formed by the sealing material 5 that also has a function as an adhesive for bonding the pair of substrates 1AA. . And the pressing force receiving part 6 is arrange | positioned so that the opposing surfaces of a pair of board | substrate 1AA may be connected similarly to the sealing material 5. FIG. Further, the pressing force receiving portion 6 of the present embodiment is formed so as to divide an arc having substantially the same width as the sealing material 5 and substantially similar to the sealing material 5 into four along the length direction, The curved portion 5a of the sealing material 5 as a whole, that is, is formed so as to face the curved portion 5a of the sealing material 5 so as to be substantially similar to the scribe line SL.

  In the present embodiment, the distance between the adjacent pressing force receiving portions 6 is made shorter than the length of the pressing member (not shown) so that the pressing force by the pressing member cooperates with the curved portion 5 a of the sealing material 5. It is preferable in the sense that it works and can be received equally on both sides of the scribe line SL. Of course, the pressing force receiving portion 6 may be formed in a single line, or both end portions of the pressing force receiving portion 6 in the arrangement direction may be connected to the tip end portion of the crack traveling direction restraining means 4A. Also good.

  Further, the pressing force receiving portion 6 can be formed of a material different from the sealing material 5. However, it is important to form the bonding member to be bonded to the divided substrate 1A and to arrange the facing surfaces of the pair of substrates 1AA to be connected.

  The divided substrate 1 </ b> A may be formed individually or may be formed from a mother substrate in which a large-sized substrate having a large area for multi-sided bonding is bonded with a sealing material 5.

  When one of the divided substrates 1A is formed individually, the crack traveling direction restraining means 4A can be provided so as to be connected to the end face 1Aa of the divided substrate 1A.

  When the other substrate to be divided 1A is formed separately from a mother substrate having a large area for multi-cavity, generally, a substrate region for obtaining a plurality of substrates to be divided 1A is formed in, for example, a matrix. After the linear scribe lines SL are provided outside the substrate region in a grid pattern, for example, the mother substrate is divided into strips by the linear scribe lines SL formed in the vertical direction, and then A rectangular substrate 1A is obtained by dividing a strip-like one by a linear scribe line SL formed in the horizontal direction.

  Therefore, since the end surface 1Aa of the substrate to be divided 1A is a divided section of the mother substrate (a formation position of a linear scribe line), the crack progress direction restraining means 4A is provided in each substrate region at the stage of the mother substrate. Therefore, it is preferable to form the crack traveling direction restraining means 4A at a position away from the end face 1Aa of the substrate to be divided 1A so as not to overlap the scribe line for the mother substrate.

  Since other configurations such as the shape and size of the crack traveling direction restraining means 4A are the same as those of the substrate 1 to be divided in the first embodiment described above, detailed description thereof will be omitted.

  Next, the operation of the present embodiment having the above-described configuration will be described together with the embodiment of the substrate cutting method of the present invention.

  The substrate cutting method according to the present embodiment is carried out by using a cutting apparatus including the substrate to be cut 1A according to the present embodiment described above and a conventionally known pressing member (not shown).

  That is, in the substrate cutting method according to the present embodiment, before the pair of substrates 1AA are bonded, the crack progressing direction restraining means 4A and the pressing force receiving portion 6 are screen printed at the same time as the seal material 5 is formed on one substrate 1AA. To form. At this time, it is important to form the crack advancing direction restraining means 4A at positions that are both ends of the scribe line SL forming position.

  Next, the substrate 1A to be divided is formed by bonding the one substrate 1AA on which the sealing material 5, the crack progression direction restraining means 4A and the pressing force receiving portion 6 are formed and the other substrate 1AA. In addition, as described above, the substrate 1A to be divided may be a substrate divided from the mother substrate. In this case, before the pair of large substrates are bonded to each other with each sealing material 5, the sealing material 5, the crack progress direction restraining means 4A and the pressing force receiving portion 6 may be formed on one large substrate.

  Next, arc-shaped scribe lines SL are formed on both surfaces of the substrate to be divided 1A. In addition, when using what divided | segmented the to-be-divided board | substrate 1A from the mother board | substrate, circular arc-shaped scribe line SL can also be formed in the stage of a mother board | substrate.

  Next, as shown in FIG. 6, the substrate to be divided 1A is placed on the table T of the substrate cutting apparatus with the scribe line SL of one substrate 1AA facing downward. Then, as shown in FIG. 6, a load (pressing force) is applied to the scribe line SL of the other substrate 1AA or a pressing member (not shown) toward both sides thereof as shown by a thick arrow in FIG. Then, a crack C progresses from the scribe line SL of the substrate 1AA in contact with the table T in the thickness direction of the substrate to be divided 1A indicated by the upward arrow in FIG. 6, and at least the substrate 1AA in contact with the table T is divided. The

  At this time, the crack C traveling from the scribe line SL at the formation position of the crack traveling direction restraining means 4A and in the vicinity thereof travels in the traveling direction so as to travel in the thickness direction of the substrate 1A to be divided by the crack traveling direction restraining means 4A. The degree of freedom is restricted.

  That is, since both sides of the scribe line SL on the surface opposite to the surface on which the scribe line SL is formed are connected by the crack progression direction restraining means 4A, the scribe line SL is separated from the boundary of the substrate 1A to be divided. Thus, the force generated to open the substrate to be divided 1A can be suppressed. Thereby, since the freedom degree of the advancing direction of the crack C can be constrained so that it may concentrate on the thickness direction of the to-be-divided board | substrate 1A along the provision direction of the pressing force by the pressing member with respect to the to-be-divided board | substrate 1A. A smooth and high-quality curved segmented section 2Aa free from burrs (see reference numeral 104 in FIG. 9) or chips at both ends of the curved scribe line SL in the product 2A can be reliably obtained. That is, when both end portions in the line forming direction of the scribe line SL formed in a curved shape are connected to the end surface 1Aa formed in a straight shape of the substrate 1A to be divided, the crack progress direction restraining means 4A is provided. Thus, unlike the conventional substrate cutting method, it is possible to easily and reliably reduce the degree of freedom in the direction of travel of the crack C at both ends of the curved scribe line SL, and the direction of travel of the crack C is divided. It is possible to easily and reliably restrain the substrate 1 to be concentrated in the thickness direction.

  This is because no burrs are generated in the division of the substrate to be divided 1A having the crack propagation direction restraining means 4A of the present embodiment, or extremely small burrs of 0.1 mm or less are generated. In the conventional cutting of the substrate to be cut 101, it was confirmed by an experimental result that a burr 104 requiring post-processing such as chamfering is generated in a subsequent process of 0.5 to 1.0 mm.

  Further, since the pressing force by the pressing member can be received from both sides by the cooperation of the sealing material 5 and the pressing force receiving portion 6, the pressing force can be reliably applied in the thickness direction of the substrate 1AA. Thereby, it is possible to obtain a smoother and higher quality dividing surface 2Aa.

  Subsequently, the upper and lower surfaces of the substrate to be divided 1A are reversed and the other substrate 1AA is divided to be divided into the divided product 2A and the surplus portion 3A shown in FIG.

  When the crack traveling direction restraining means 4A is formed in a linear shape, the crack C is transmitted from the lower substrate 1AA in FIG. 6 to the upper substrate 1AA via the crack traveling direction restraining means 4A. The upper and lower surfaces of 1A can be divided into the divided product 2A and the surplus portion 3A without being inverted.

  As described above, according to the method for dividing the cut substrate 1A of the present embodiment, the same effects as those of the substrate cutting method of the first embodiment described above can be obtained.

  That is, according to the method for dividing the substrate to be divided 1A of this embodiment, before the pair of substrates 1AA are bonded together, the crack advancing direction restraining means 4A is provided at least at both ends of the scribe line SL formation position of the substrate to be divided 1A. Thus, when the substrate 1A to be divided is divided by the scribe line SL, the cracks C traveling from the scribe line SL at both ends of the curved scribe line SL are caused by the crack progression direction restraining means 4A. Since the traveling direction of the crack C can be constrained so as to proceed in the thickness direction, it is possible to prevent the occurrence of a chipping or the like referred to as a defective cutting in the divided section 2Aa at both ends of the curved scribe line SL. be able to.

  That is, according to the method for dividing the substrate to be divided 1A of the present embodiment, a divided product 2A having a smooth divided cross section 2Aa can be obtained easily and reliably, and a reduction in yield due to occurrence of a division failure is prevented. Can do.

  Therefore, according to the method for dividing the cut substrate 1A of the present embodiment, it is possible to easily and surely obtain a low-quality cut product 2 having high quality and excellent productivity.

  Further, according to the substrate cutting method of the present embodiment, the crack traveling direction restraining means 4A is formed of the same material as the bonding member that bonds the pair of substrates 1AA, so that the crack traveling direction restraining means is attached to the substrate to be cut 1A. 4A can be formed more easily and efficiently.

Furthermore, according to the substrate cutting method of the present embodiment, since the crack traveling direction restraint means 4A is formed extending from the sealing material 5 as the second bonding member, compared to the case where it is formed alone, The probability of dropping from the substrate 1AA can be reduced.

  In addition, according to the substrate cutting method of the present embodiment, since the size in the width direction of the crack traveling direction restraining means 4A is formed smaller than the size in the width direction of the sealing material 5 as the joining member, the crack traveling direction restraint. The means 4A can be reliably and easily divided at the scribe line SL.

  Furthermore, according to the substrate cutting method of the present embodiment, the pressing force by the pressing member is used as a bonding member in the region outside the scribe line SL and in the region outside the formation position of the crack traveling direction restraining means 4A. Since the pressing force receiving portion 6 received in cooperation with the sealing material 5 is formed, the pressing force by the pressing member can be received from both sides by the cooperation of the sealing material 5 and the pressing force receiving portion 6. As a result, the pressing force can be reliably applied in the thickness direction of the substrate 1AA, so that a more smooth and high-quality divided section 2Aa can be obtained.

  Further, according to the substrate cutting method of the present embodiment, since the substrate to be cut 1A is for forming an electro-optical panel, an electro-optical panel having a curve can be easily manufactured.

  The present invention can be used for dividing various substrates to be divided such as electro-optical panels and semiconductor substrates.

  Further, the present invention is not limited to the above-described embodiments, and various modifications can be made as necessary.

The schematic plan view which shows the structure of the principal part of the to-be-divided substrate used for 1st Embodiment of the board | substrate cutting method which concerns on this invention. 1 is a schematic bottom view of FIG. The expanded sectional view which exaggerates and shows the vicinity of the crack advancing direction restraint means in the division state of the to-be-divided substrate of FIG. FIG. 1 is a schematic plan view showing a state after dividing the substrate to be divided of FIG. Schematic partially cut plan view showing the configuration of the main part of the substrate to be cut used in the second embodiment of the substrate cutting method according to the present invention. The expanded sectional view which exaggerates and shows the vicinity of the crack progressing direction restraint means in the division | segmentation state of the to-be-divided substrate of FIG. FIG. 5 is a schematic plan view showing a state after the cut substrate of FIG. 5 is cut. Schematic plan view showing the configuration of the main part of the substrate to be cut used in the conventional substrate cutting method FIG. 8 is a schematic plan view showing a state after the cut substrate of FIG. 8 is cut. An enlarged view for explaining a burr that is a cutting defect formed on a cut surface of a cut product of a cut substrate divided by a conventional substrate cutting method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A, Substrate to be cut 1a, 1Aa End face 1AA Substrate 2, 2A Divided product 2a, 2Aa Cross section 3, 3A Surplus part 4, 4A Crack progress direction restraint means 5 Sealing material 5a Curved part 5b Linear part 6 SL scribe line C crack

Claims (5)

A pair of substrates are bonded to each other via a second bonding member to form a substrate to be divided, a scribe line is formed outside a region for forming the second bonding member on at least one surface of the substrate to be divided, and the scriber is formed. In the substrate cutting method of cutting the substrate to be divided by pressing the pressing member along the line,
Prior to bonding the pair of substrates, cracks that progress from the scribe line when the substrate is divided by the pressing member at least at both ends of the scribe line formation position of the substrate to be divided are formed on the substrate to be divided. Forming a first joining member that restrains the traveling direction of the crack so as to proceed in the thickness direction so as to be positioned between the pair of substrates;
Bonding the pair of substrates,
The first joining member is formed in a square shape from the second joining member so as to straddle the scribe line, and the angular first joining member is larger than the width of the second joining member. A substrate cutting method, which is a linear body having a small width dimension .   The cut substrate is a plane rectangle, the scribe line is formed in a curved shape so as to connect opposing end faces of the divided substrate, and the curved second joint disposed inside the scribe line. 2. The angular first joining member is formed from each of corner portions located at connection points between a member and a linear second joining member respectively disposed on the inner side of the opposing end surface. The substrate cutting method according to 1.   The square-shaped first joining member and the second joining member are made of the same material, and the first joining member is formed to extend from the second joining member. Substrate cutting method. A pressing force receiving portion that receives the pressing force by the pressing member in cooperation with the second bonding member is formed in the outer region of the scribe line and in the outer region of the formation position of the first bonding member. The substrate cutting method according to any one of claims 1 to 3 . The substrate cutting method according to any one of 4 to the cutting board claims 1 is for forming an electro-optical panel.