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JP4911026B2 - Optical transmission assembly - Google Patents
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JP4911026B2 - Optical transmission assembly - Google Patents

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JP4911026B2
JP4911026B2 JP2007340395A JP2007340395A JP4911026B2 JP 4911026 B2 JP4911026 B2 JP 4911026B2 JP 2007340395 A JP2007340395 A JP 2007340395A JP 2007340395 A JP2007340395 A JP 2007340395A JP 4911026 B2 JP4911026 B2 JP 4911026B2
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wiring board
optical wiring
optical
core
light emitting
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JP2009162883A (en
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昭浩 蛭田
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Hitachi Cable Ltd
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Description

本発明は、送受信間の電磁ノイズを軽減する光伝送アセンブリに関する。   The present invention relates to an optical transmission assembly that reduces electromagnetic noise between transmission and reception.

クラッド中にコアが配線された光配線基板の上面又は下面に発光素子や受光素子が面実装されて光伝送アセンブリが構成される。コアの一部に反射面を形成することにより、発光素子や受光素子とコア長手方向の光軸を光学的に結合できる。   A light-emitting element and a light-receiving element are surface-mounted on an upper surface or a lower surface of an optical wiring substrate in which a core is wired in a clad to constitute an optical transmission assembly. By forming a reflecting surface on a part of the core, the light emitting element or the light receiving element and the optical axis in the longitudinal direction of the core can be optically coupled.

従来のこの種の光伝送アセンブリは、入出力ポートにつながる共通のコアに送信光信号と受信光信号を合波して伝送するようになっている。例えば、図5、図6に示した光伝送アセンブリ51は、クラッド52の上面に発光素子53と受光素子54が面実装され、クラッド52中には発光素子53と受光素子54のそれぞれの下を通るコア55が配線されている。反射面56は、例えば、クラッド52の下面からコア55にかけて逆V字状に溝を形成することにより、溝の斜面を介してコア55とコア55より屈折率が小さい部材(ここでは空気)が接するようになっている。   A conventional optical transmission assembly of this type is designed to multiplex and transmit a transmission optical signal and a reception optical signal to a common core connected to an input / output port. For example, in the optical transmission assembly 51 shown in FIGS. 5 and 6, the light emitting element 53 and the light receiving element 54 are surface-mounted on the upper surface of the clad 52. A passing core 55 is wired. The reflection surface 56 is formed by forming a groove in an inverted V shape from the lower surface of the clad 52 to the core 55, so that the core 55 and a member having a lower refractive index than the core 55 (air in this case) are interposed via the groove slope. It comes to touch.

発光素子53側のコア55と受光素子54側のコア55は上面視で所定の角度で交差しており、その交差点にクラッド52の上面からコア55にかけて上面視でコア55に対して所定の角度で交差させてダイシングによる角溝57が形成され、角溝57内に波長フィルタ58が挿入されている。各コア55と波長フィルタ58とのなす角度により、送信光信号と受信光信号を合波(分離)できる。図示しない反対側の光伝送アセンブリも同様の構造になっており、両光伝送アセンブリで波長フィルタ58の態様だけが異ならせてある。   The core 55 on the light emitting element 53 side and the core 55 on the light receiving element 54 side intersect with each other at a predetermined angle when viewed from above, and the intersection extends from the upper surface of the cladding 52 to the core 55 at a predetermined angle with respect to the core 55 when viewed from above. A square groove 57 is formed by dicing so that the wavelength filter 58 is inserted into the square groove 57. The transmission optical signal and the reception optical signal can be combined (separated) according to the angle formed by each core 55 and the wavelength filter 58. The opposite optical transmission assembly (not shown) has the same structure, and only the mode of the wavelength filter 58 is different in both optical transmission assemblies.

例えば、図示した片側の光伝送アセンブリ51では、波長1.5μmの光を送信して波長1.3μmの光を受信するべく、波長1.3μmの光を反射して波長1.5μmの光を透過する波長フィルタ58が設置され、図示しない反対側の光伝送アセンブリでは、波長1.3μmの光を送信して1.5μmの光を受信するべく、波長1.5μmの光を反射して1.3μmの光を透過する波長フィルタが設置される。これにより、両側の光伝送アセンブリにおいて、自身が送信する光信号は自身に設けられた波長フィルタを透過して相手に伝送され、相手が送信して伝送されてきた光信号は自身に設けられた波長フィルタで反射されて分岐され、受信することができる。このようにして、共通の入出力ポートにて双方向の送受信ができる。   For example, in the illustrated one-side optical transmission assembly 51, in order to transmit light having a wavelength of 1.5 μm and receive light having a wavelength of 1.3 μm, the light having a wavelength of 1.3 μm is reflected and light having a wavelength of 1.5 μm is reflected. A transmitting wavelength filter 58 is installed, and an optical transmission assembly on the opposite side (not shown) reflects light having a wavelength of 1.5 μm to transmit light having a wavelength of 1.3 μm and receives light having a wavelength of 1.5 μm. A wavelength filter that transmits light of 3 μm is installed. Thereby, in the optical transmission assemblies on both sides, the optical signal transmitted by itself is transmitted to the other party through the wavelength filter provided on itself, and the optical signal transmitted by the other party is provided on itself. The light is reflected by the wavelength filter, branched, and received. In this way, bidirectional transmission / reception can be performed at a common input / output port.

特開2005−91460号公報JP 2005-91460 A 特開2003−139979号公報JP 2003-139799 A

ところで、図5の光伝送アセンブリ51は、発光素子53と受光素子54が共にクラッド52上面に面実装されている。発光素子53を駆動するドライバ58と受光素子54の受光信号を増幅するプリアンプ59もクラッド上面に面実装されている。   Incidentally, in the optical transmission assembly 51 of FIG. 5, both the light emitting element 53 and the light receiving element 54 are surface-mounted on the upper surface of the clad 52. A driver 58 for driving the light emitting element 53 and a preamplifier 59 for amplifying the light reception signal of the light receiving element 54 are also surface-mounted on the upper surface of the clad.

発光素子53の駆動電流が数十mA程度であるのに対し、受光素子54の受信信号は数μA程度であり、受光信号は駆動電流に比べて3桁ほど電流が小さい。このためドライバ58からの電磁ノイズがプリアンプ59の動作に悪影響する。すなわち、プリアンプ59において微弱な受信信号を数百〜数万倍の利得で増幅しようとすると、電磁ノイズの成分が同じように増幅され、信号雑音比を悪化させてしまう。   While the drive current of the light emitting element 53 is about several tens of mA, the reception signal of the light receiving element 54 is about several μA, and the light reception signal has a current that is three orders of magnitude smaller than the drive current. For this reason, electromagnetic noise from the driver 58 adversely affects the operation of the preamplifier 59. That is, if a pre-amplifier 59 attempts to amplify a weak received signal with a gain of several hundred to several tens of thousands, the electromagnetic noise component is amplified in the same manner, and the signal-to-noise ratio is deteriorated.

電磁ノイズを回避する最も簡単で知られた方法はドライバとプリアンプ間の距離を大きくすることである。しかし、光伝送アセンブリの小型化・集積化を目指す上で、発光素子と受光素子間の距離を大きくすることは避けたい。   The simplest and known method for avoiding electromagnetic noise is to increase the distance between the driver and the preamplifier. However, when aiming at miniaturization and integration of the optical transmission assembly, it is desirable to avoid increasing the distance between the light emitting element and the light receiving element.

そこで、本発明の目的は、上記課題を解決し、送受信間の電磁ノイズを軽減する光伝送アセンブリを提供することにある。   Accordingly, an object of the present invention is to provide an optical transmission assembly that solves the above-described problems and reduces electromagnetic noise between transmission and reception.

上記目的を達成するために本発明は、クラッド中にコアが配線された第1光配線基板が形成され、他のクラッド中にコアが配線された第2光配線基板が形成され、第1光配線基板の上面に第2光配線基板が重ねられて少なくとも一部が接着固定され、 第1光配線基板のコア長手方向両端部に、第2光配線基板のコア長手方向両端部よりコア長手方向に突き出した突出部が形成され、第1光配線基板の片端の突出部上面に第1受光素子が実装され、第1光配線基板の片端には、第1受光素子の直下に、第1光配線基板のコアを伝送されてきた光信号を反射して第1受光素子に入射させるための第1反射面が形成され、第1光配線基板の反対端の突出部上面に第1発光素子が実装され、第1光配線基板の反対端には、第1発光素子の直下に、第1発光素子の発光面から出射された光信号を反射して第1光配線基板のコアの片端方向に入射させるための第2反射面が形成され、第2光配線基板の片端上面に第2発光素子が実装され、第2光配線基板の片端には、第2発光素子の直下に、第2発光素子の発光面から出射された光信号を反射して第2光配線基板のコアの反対端方向に入射させるための第3反射面が形成され、第2光配線基板の反対端上面に第2受光素子が実装され、第2光配線基板の反対端には、第2受光素子の直下に、第2光配線基板のコアを伝送されてきた光信号を反射して第2受光素子に入射させるための第4反射面が形成され、第1受光素子と第1発光素子が充填材で覆われると共に、上記充填材に電磁遮蔽板が設けられたものである。 In order to achieve the above object, according to the present invention, a first optical wiring board having a core wired in a clad is formed, and a second optical wiring board having a core wired in another cladding is formed. The second optical wiring board is overlapped on the upper surface of the wiring board and at least a part thereof is bonded and fixed, and the core longitudinal direction of both ends of the first optical wiring board in the core longitudinal direction from both ends of the core longitudinal direction of the second optical wiring board The first light receiving element is mounted on the upper surface of the protruding part at one end of the first optical wiring board, and the first light is provided at one end of the first optical wiring board directly below the first light receiving element. A first reflecting surface for reflecting an optical signal transmitted through the core of the wiring board to be incident on the first light receiving element is formed, and the first light emitting element is formed on the upper surface of the protruding portion on the opposite end of the first optical wiring board. Mounted on the opposite end of the first optical wiring board, directly below the first light emitting element, the first A second reflecting surface is formed to reflect an optical signal emitted from the light emitting surface of the light emitting element and enter the one end direction of the core of the first optical wiring board, and the second light emission is formed on the upper surface of one end of the second optical wiring board. An element is mounted, and at one end of the second optical wiring board, an optical signal emitted from the light emitting surface of the second light emitting element is reflected immediately below the second light emitting element to oppose the core of the second optical wiring board. A third reflecting surface is formed for incidence in a direction, a second light receiving element is mounted on the upper surface of the second optical wiring board opposite to the second optical wiring board, and the second light receiving element is disposed immediately below the second light receiving element on the opposite end of the second optical wiring board. A fourth reflecting surface is formed for reflecting the optical signal transmitted through the core of the second optical wiring board and entering the second light receiving element, and the first light receiving element and the first light emitting element are covered with a filler. In addition, the filler is provided with an electromagnetic shielding plate .

第1光配線基板及び第2光配線基板の両方又はいずれか一方に、コア長手方向に延び、コアによる光伝送路と並列に電気伝送路を構成する電気配線が設けられてもよい。 An electric wiring that extends in the longitudinal direction of the core and forms an electric transmission path in parallel with the optical transmission path by the core may be provided on either or either one of the first optical wiring board and the second optical wiring board.

また、本発明は、クラッド中にコアが配線された第1光配線基板が形成され、他のクラッド中にコアが配線された第2光配線基板が形成され、第1光配線基板の上面に第2光配線基板が重ねられて少なくとも一部が接着固定され、第1光配線基板のコア長手方向片端部に、第2光配線基板のコア長手方向片端部よりコア長手方向に突き出した突出部が形成され、第1光配線基板の片端の突出部上面に第1受光素子(又は第1発光素子)が実装され、第1光配線基板の片端には、上記第1受光素子(又は上記第1発光素子)の直下に、第1光配線基板のコアを伝送されてきた光信号を反射して上記第1受光素子に入射させるための(又は、上記第1発光素子の発光面から出射された光信号を反射して第1光配線基板のコアの反対端方向に入射させるための)第1反射面が形成され、第2光配線基板の片端上面に第2発光素子(又は第2受光素子)が実装され、第2光配線基板の片端には、上記第2発光素子(又は上記第2受光素子)の直下に、上記第2発光素子の発光面から出射された光信号を反射して第2光配線基板のコアの反対端方向に入射させるための(又は、第2光配線基板のコアを伝送されてきた光信号を反射して上記第2受光素子に入射させるための)第2反射面が形成され、第1光配線基板及び第2光配線基板の反対端にテープ光ファイバコネクタと嵌合可能なコネクタが取り付けられ、上記第1受光素子(又は上記第1発光素子)が充填材で覆われると共に、上記充填材に電磁遮蔽板が設けられたものである。

According to the present invention, a first optical wiring board having a core wired in a clad is formed, a second optical wiring board having a core wired in another cladding is formed, and an upper surface of the first optical wiring board is formed. The second optical wiring board is overlapped and at least a part thereof is bonded and fixed, and the protruding portion that protrudes in the core longitudinal direction from the core longitudinal direction one end portion of the second optical wiring board in the core longitudinal direction one end portion of the first optical wiring board There is formed, is the first light receiving element (or the first light emitting element) is mounted on the protrusion upper surface of one end of the first optical wiring board, the one end of the first optical wiring substrate, the first light receiving element (or the first The light signal transmitted through the core of the first optical wiring board is reflected immediately below ( one light emitting element) and is incident on the first light receiving element (or emitted from the light emitting surface of the first light emitting element). The reflected optical signal is reflected and incident on the opposite end of the core of the first optical wiring board. Because of) the first reflecting surface is formed, is a second light emitting element (or the second light receiving element) is mounted at one end on surfaces of the second optical wiring board, the one end of the second optical wiring board, said first The light signal emitted from the light emitting surface of the second light emitting element is reflected directly below the two light emitting elements (or the second light receiving element) and is incident on the opposite end direction of the core of the second optical wiring board ( Alternatively, a second reflection surface (for reflecting an optical signal transmitted through the core of the second optical wiring board and entering the second light receiving element) is formed, and the first optical wiring board and the second optical wiring board are formed. A connector that can be fitted with a tape optical fiber connector is attached to the opposite end of the first light receiving element, the first light receiving element (or the first light emitting element) is covered with a filler, and an electromagnetic shielding plate is provided on the filler. Is.

本発明は次の如き優れた効果を発揮する。   The present invention exhibits the following excellent effects.

(1)送受信間の電磁ノイズを軽減することができる。   (1) Electromagnetic noise between transmission and reception can be reduced.

以下、本発明の一実施形態を添付図面に基づいて詳述する。   Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

図1に示されるように、本発明に係る光伝送アセンブリ1は、第1光配線基板4と第2光配線基板7を有する。第1光配線基板4はクラッド2中にコア3が配線されたものである。同様に、第2光配線基板7は、第1光配線基板4とは別のクラッド5中にコア6が配線されたものである。第1光配線基板4の上面に第2光配線基板7が重ねられ、接着剤を用いて貼り付け固定される。   As shown in FIG. 1, the optical transmission assembly 1 according to the present invention includes a first optical wiring board 4 and a second optical wiring board 7. The first optical wiring substrate 4 has a core 3 wired in a clad 2. Similarly, the second optical wiring board 7 has a core 6 wired in a clad 5 different from the first optical wiring board 4. The second optical wiring board 7 is overlaid on the upper surface of the first optical wiring board 4 and is fixed by using an adhesive.

ここで、第1光配線基板4は第2光配線基板7よりもコア長手方向の長さが長いものである。これにより、第1光配線基板4のコア長手方向片端部(図示左端)には、第2光配線基板7のコア長手方向片端部よりコア長手方向に突き出した突出部8aが形成される。また、第1光配線基板4のコア長手方向反対端部(図示右端)には、第2光配線基板7のコア長手方向反対端部よりコア長手方向に突き出した突出部8aが形成される。   Here, the first optical wiring board 4 has a longer length in the core longitudinal direction than the second optical wiring board 7. As a result, a protruding portion 8 a protruding in the core longitudinal direction from the core longitudinal direction one end portion of the second optical wiring substrate 7 is formed at one end portion (left end in the drawing) of the first optical wiring substrate 4. Further, a protruding portion 8 a that protrudes in the core longitudinal direction from the opposite end portion of the second optical wiring substrate 7 in the core longitudinal direction is formed at the opposite end portion (right end in the drawing) of the first optical wiring substrate 4.

第1光配線基板4においては、第1光配線基板4の片端の突出部8a上面に第1受光素子9が実装され、第1光配線基板4の反対端の突出部8b上面に第1発光素子10が実装される。   In the first optical wiring substrate 4, the first light receiving element 9 is mounted on the upper surface of the protruding portion 8 a at one end of the first optical wiring substrate 4, and the first light emission is performed on the upper surface of the protruding portion 8 b at the opposite end of the first optical wiring substrate 4. Element 10 is mounted.

一方、第2光配線基板7においては、第2光配線基板7の片端の上面に第2発光素子11が実装され、第2光配線基板7の反対端の上面に第2受光素子12が実装される。   On the other hand, in the second optical wiring substrate 7, the second light emitting element 11 is mounted on the upper surface of one end of the second optical wiring substrate 7, and the second light receiving element 12 is mounted on the upper surface of the opposite end of the second optical wiring substrate 7. Is done.

第1、第2受光素子9,12は、例えば、フォトダイオードであり、第1、第2発光素子10,11は、例えば、VCSEL(面発光型)レーザダイオード(LD)である。これらの受光素子9,12及び発光素子10,11は、受光面又は発光面が素子パッケージの下面に形成されると共に、電気端子が下面に設けられたもので、光配線基板4,7に面実装される。   The first and second light receiving elements 9 and 12 are, for example, photodiodes, and the first and second light emitting elements 10 and 11 are, for example, VCSEL (surface emitting type) laser diodes (LD). The light receiving elements 9 and 12 and the light emitting elements 10 and 11 have a light receiving surface or a light emitting surface formed on the lower surface of the element package and electrical terminals provided on the lower surface. Implemented.

図示のように、第1光配線基板4の片端の突出部8a上面に実装された第1受光素子9と、第1光配線基板4の反対端の突出部8b上面に実装された第1発光素子10とが、コア3を介して光信号をやり取りする。同様に、第2光配線基板7の片端上面に実装された第2発光素子11と、第2光配線基板7の反対端上面に実装された第2受光素子12とが、コア6を介して光信号をやり取りする。   As shown in the figure, the first light receiving element 9 mounted on the upper surface of the protruding portion 8 a at one end of the first optical wiring board 4 and the first light emission mounted on the upper surface of the protruding portion 8 b of the opposite end of the first optical wiring substrate 4. The optical signal is exchanged with the element 10 via the core 3. Similarly, the second light emitting element 11 mounted on the upper surface of one end of the second optical wiring substrate 7 and the second light receiving element 12 mounted on the upper surface of the opposite end of the second optical wiring substrate 7 are connected via the core 6. Exchange optical signals.

各光配線基板4,7のコア3,6中には反射面13a,13b,13c,13dが形成されている。すなわち、第1光配線基板4では、第1光配線基板4の反対端の突出部8b上面に実装された第1発光素子10の直下に、第1発光素子10の発光面から出射された光信号を反射してコア3の片端方向に入射させるための反射面13aが形成される。   Reflective surfaces 13a, 13b, 13c, and 13d are formed in the cores 3 and 6 of the optical wiring boards 4 and 7, respectively. That is, in the first optical wiring board 4, the light emitted from the light emitting surface of the first light emitting element 10 immediately below the first light emitting element 10 mounted on the upper surface of the protruding portion 8 b at the opposite end of the first optical wiring board 4. A reflection surface 13a is formed for reflecting the signal to enter the one end direction of the core 3.

また、第1光配線基板4の片端の突出部8a上面に実装された第1受光素子9の直下に、コア3を伝送されてきた光信号を反射して第1受光素子9に入射させるための反射面13bが形成される。   In addition, an optical signal transmitted through the core 3 is reflected and incident on the first light receiving element 9 immediately below the first light receiving element 9 mounted on the upper surface of the protruding portion 8 a at one end of the first optical wiring board 4. The reflection surface 13b is formed.

また、第2光配線基板7では、第2光配線基板7の片端上面に実装された第2発光素子11の直下に、第2発光素子11の発光面から出射された光信号を反射してコア6の反対端方向に入射させるための反射面13cが形成される。   Further, the second optical wiring board 7 reflects the optical signal emitted from the light emitting surface of the second light emitting element 11 directly below the second light emitting element 11 mounted on the upper surface of one end of the second optical wiring board 7. A reflective surface 13c for entering in the opposite end direction of the core 6 is formed.

また、第2光配線基板7の反対端上面に実装された第2受光素子12の直下に、コア6を伝送されてきた光信号を反射して第2受光素子12に入射させるための反射面13dが形成される。各反射面13a,13b,13c,13dは、逆V字状の溝をダイシング又はドリルなどによって形成される。   Further, a reflection surface for reflecting an optical signal transmitted through the core 6 and making it incident on the second light receiving element 12 immediately below the second light receiving element 12 mounted on the upper surface of the opposite end of the second optical wiring board 7. 13d is formed. Each reflective surface 13a, 13b, 13c, 13d is formed by dicing or drilling an inverted V-shaped groove.

このように、本発明の光伝送アセンブリ1は、光伝送路を二層配線にして、下層の第1光配線基板4が提供する光伝送路は反対端から片端への光伝送専用とし、上層の第2光配線基板7が提供する光伝送路は片端から反対端への光伝送専用とするものである。   Thus, in the optical transmission assembly 1 of the present invention, the optical transmission path is a two-layer wiring, and the optical transmission path provided by the lower first optical wiring board 4 is dedicated to the optical transmission from the opposite end to the upper end. The optical transmission line provided by the second optical wiring board 7 is dedicated to optical transmission from one end to the opposite end.

ここで、片端に示した破線円内に着目すると、図2に示されるように、第2光配線基板7のコア長手方向片端よりも第1光配線基板4のコア長手方向片端が突き出して突出部8aが形成されている。突出部8aの上面には、第1受光素子9とその第1受光素子9の受光信号を増幅するプリアンプ14とで1組となり、2組が実装されている。第1光配線基板4に実装される第1受光素子9、プリアンプ14の個数は、1個、あるいは複数個である。さらに、第2光配線基板7の片端上面には、第2発光素子11とその第2発光素子11を駆動するドライバ15が実装されている。第2光配線基板7に実装される第2発光素子11、ドライバ15の個数は、1個、あるいは複数個である。   Here, focusing on the broken circle shown at one end, as shown in FIG. 2, the one end of the first optical wiring board 4 in the core longitudinal direction protrudes beyond the one end of the second optical wiring board 7 in the core longitudinal direction. A portion 8a is formed. On the upper surface of the protruding portion 8a, one set is composed of the first light receiving element 9 and the preamplifier 14 that amplifies the light reception signal of the first light receiving element 9, and two sets are mounted. The number of first light receiving elements 9 and preamplifiers 14 mounted on the first optical wiring board 4 is one or more. Furthermore, a second light emitting element 11 and a driver 15 for driving the second light emitting element 11 are mounted on the upper surface of one end of the second optical wiring board 7. The number of the second light emitting elements 11 and the drivers 15 mounted on the second optical wiring board 7 is one or a plurality.

第1光配線基板4の上面及び第2光配線基板7の上面には電気配線16が設けられる。電気配線16は、図示しない上位通信装置とプリアンプ14及びドライバ15との間の電気通信信号を伝送する信号ライン、第1受光素子9とプリアンプ14間の信号ライン、ドライバ15と第2発光素子11間の信号ライン、電源・接地ラインなどである。また、電気配線16は、光伝送アセンブリ1の片端と反対端との間にわたる信号ラインや電源・接地ラインであってもよい。   Electrical wirings 16 are provided on the upper surface of the first optical wiring substrate 4 and the upper surface of the second optical wiring substrate 7. The electrical wiring 16 is a signal line for transmitting electrical communication signals between a host communication device (not shown) and the preamplifier 14 and the driver 15, a signal line between the first light receiving element 9 and the preamplifier 14, and the driver 15 and the second light emitting element 11. Signal lines between them, power / ground lines, etc. The electrical wiring 16 may be a signal line or a power / ground line extending between one end and the opposite end of the optical transmission assembly 1.

本実施形態では、第1受光素子9の上部及び第1発光素子10の上部に、第2光配線基板7の上面と同じかそれより低い高さに電磁遮蔽板17がそれぞれ設けられている。ここで電磁遮蔽板17は、金属板で構成される。   In the present embodiment, electromagnetic shielding plates 17 are provided above the first light receiving element 9 and the first light emitting element 10 at a height equal to or lower than the upper surface of the second optical wiring board 7. Here, the electromagnetic shielding plate 17 is formed of a metal plate.

さらに本実施形態では、突出部8a,8b上の空間に充填材18が充填されている。すなわち、充填材18は、第1受光素子9及び第1発光素子10を覆い、第2光配線基板7の上面と同じかそれより低い高さまで充填される。そして、充填材18の上に電磁遮蔽板17が接着剤によって接着固定される。   Furthermore, in this embodiment, the filler 18 is filled in the space above the protrusions 8a and 8b. That is, the filler 18 covers the first light receiving element 9 and the first light emitting element 10 and is filled up to a height equal to or lower than the upper surface of the second optical wiring board 7. Then, the electromagnetic shielding plate 17 is bonded and fixed on the filler 18 with an adhesive.

次に、光伝送アセンブリ1の動作を説明する。   Next, the operation of the optical transmission assembly 1 will be described.

図1に示されるように、第1光配線基板4の反対端(図示右端)の突出部8b上面に実装された第1発光素子10から出射された光信号は、クラッド2の厚さ方向(下向き)に伝送され、反射面13aで反射されてコア3を片端方向に伝送される。第1光配線基板4の片端(図示左端)では、反対端からコア3を伝送されてきた光信号が反射面13bで反射されてクラッド2の厚さ方向(上向き)に伝送され、第1受光素子9に入射する。   As shown in FIG. 1, the optical signal emitted from the first light emitting element 10 mounted on the upper surface of the protruding portion 8b at the opposite end (right end in the figure) of the first optical wiring board 4 is the thickness direction of the cladding 2 ( Downward), reflected by the reflecting surface 13a, and transmitted through the core 3 in one direction. At one end (the left end in the figure) of the first optical wiring board 4, the optical signal transmitted through the core 3 from the opposite end is reflected by the reflecting surface 13b and transmitted in the thickness direction (upward) of the clad 2, and the first light receiving Incident on the element 9.

一方、第2光配線基板7の片端(図示左端)上面に実装された第2発光素子11から出射された光信号は、クラッド5の厚さ方向(下向き)に伝送され、反射面13cで反射されてコア6を反対端方向に伝送される。第2光配線基板7の反対端(図示右端)では、片端からコア6を伝送されてきた光信号が反射面13dで反射されてクラッド5の厚さ方向(上向き)に伝送され、第2受光素子12に入射する。   On the other hand, the optical signal emitted from the second light emitting element 11 mounted on the upper surface of one end (the left end in the drawing) of the second optical wiring board 7 is transmitted in the thickness direction (downward) of the cladding 5 and reflected by the reflecting surface 13c. And transmitted through the core 6 in the opposite end direction. At the opposite end (right end in the figure) of the second optical wiring board 7, the optical signal transmitted through the core 6 from one end is reflected by the reflecting surface 13d and transmitted in the thickness direction (upward) of the clad 5, and the second light receiving Incident on the element 12.

このとき、図2に示されるように、第2発光素子11はドライバ15からの駆動電流によって駆動され、第1受光素子9の受光電流はプリアンプ14によって増幅される。第1受光素子9とプリアンプ14が第1光配線基板4の突出部8aの上面に実装され、第2発光素子11とドライバ15が第1光配線基板4の突出部8aの上面より第2光配線基板7の厚み分だけ上である第2光配線基板7の上面に実装されているため、ドライバ15から放射される電磁ノイズによって第1受光素子9やプリアンプ14は影響されにくい。   At this time, as shown in FIG. 2, the second light emitting element 11 is driven by the driving current from the driver 15, and the light receiving current of the first light receiving element 9 is amplified by the preamplifier 14. The first light receiving element 9 and the preamplifier 14 are mounted on the upper surface of the protruding portion 8a of the first optical wiring board 4, and the second light emitting element 11 and the driver 15 are connected to the second light from the upper surface of the protruding portion 8a of the first optical wiring board 4. The first light receiving element 9 and the preamplifier 14 are not easily affected by the electromagnetic noise radiated from the driver 15 because it is mounted on the upper surface of the second optical wiring board 7 that is higher than the thickness of the wiring board 7.

従来は、ドライバからの電磁ノイズがプリアンプの動作に悪影響を及ぼすので、ドライバとプリアンプ間の距離を縮めて光伝送アセンブリの小型化・集積化を図ることが困難であった。しかし、本発明によれば、ドライバ15は第2光配線基板7の上面に実装され、プリアンプ14は第1光配線基板4の突出部8aの上面に実装されるため、上下方向(高さ方向)に分離配置される。この構造により、同一平面に並べるのに比べてドライバ15とプリアンプ14間の距離が長くなり、電磁ノイズの影響が軽減される。よって、電磁ノイズの影響を増大させることなく、ドライバ15とプリアンプ14間の平面上の距離を縮めて光伝送アセンブリの小型化・集積化を図ることが可能となる。   Conventionally, electromagnetic noise from the driver has an adverse effect on the operation of the preamplifier, so it has been difficult to reduce the distance between the driver and the preamplifier and reduce the size and integration of the optical transmission assembly. However, according to the present invention, since the driver 15 is mounted on the upper surface of the second optical wiring board 7 and the preamplifier 14 is mounted on the upper surface of the protruding portion 8a of the first optical wiring board 4, the vertical direction (height direction) ). With this structure, the distance between the driver 15 and the preamplifier 14 is longer than when they are arranged on the same plane, and the influence of electromagnetic noise is reduced. Therefore, the optical transmission assembly can be reduced in size and integrated by reducing the distance on the plane between the driver 15 and the preamplifier 14 without increasing the influence of electromagnetic noise.

さらに、電磁遮蔽板17が設けられた場合、この電磁遮蔽板17がドライバ15が放射する電磁ノイズをプリアンプ14に対して遮蔽するので、送受信間の電磁ノイズをいっそう軽減することができる。   Further, when the electromagnetic shielding plate 17 is provided, the electromagnetic shielding plate 17 shields the electromagnetic noise radiated by the driver 15 from the preamplifier 14, so that the electromagnetic noise between transmission and reception can be further reduced.

また、従来は1本のコアで光波長の異なる光信号を伝送する際には、光信号を合分波するのに波長フィルタが必要となる。しかし、本発明では、光伝送路としてコア3,6をそれぞれ上下2層に分離したので、従来のように波長フィルタは設ける必要がなく、従って波長フィルタを挿入するための溝をダイシングにより形成する必要もなくなる。   Conventionally, when transmitting optical signals having different optical wavelengths with a single core, a wavelength filter is required to multiplex / demultiplex the optical signals. However, in the present invention, since the cores 3 and 6 are separated into two upper and lower layers as optical transmission lines, there is no need to provide a wavelength filter as in the prior art, and therefore a groove for inserting the wavelength filter is formed by dicing. There is no need.

次に、本発明の光伝送アセンブリ1の製造方法を説明する。   Next, a method for manufacturing the optical transmission assembly 1 of the present invention will be described.

第1光配線基板4の下部クラッドとなる基材の上面にコア膜をスピンコートなどにより形成する。このコア膜に光回路のパターン(コアパターン)を転写することにより、コア3を形成する。あるいは、コア膜に光回路のパターンのフォトマスクをかけてコア膜を感光させ、フォトマスクでマスクされたコア以外のコア膜を溶剤などにより除去することにより、コア3が形成される。その後、上部クラッドを塗布することにより、クラッド2内にコア3が形成される。下部クラッド側からダイシングにより溝を形成して溝の表面を反射面13とする。なお、反射面13を形成するプロセスはこれに限らない。これにより、第1光配線基板4が製造される。第1光配線基板4に電気配線14を形成する方法は従来通りでよい。また、面実装のための導体パターンを形成する方法も従来通りでよい。   A core film is formed by spin coating or the like on the upper surface of the base material that becomes the lower clad of the first optical wiring board 4. The core 3 is formed by transferring the optical circuit pattern (core pattern) onto the core film. Alternatively, the core film is exposed to a photomask having an optical circuit pattern on the core film, the core film is exposed, and the core film other than the core masked with the photomask is removed with a solvent or the like, thereby forming the core 3. Thereafter, the core 3 is formed in the clad 2 by applying an upper clad. A groove is formed by dicing from the lower clad side, and the surface of the groove is used as the reflecting surface 13. The process for forming the reflecting surface 13 is not limited to this. Thereby, the 1st optical wiring board 4 is manufactured. The method for forming the electrical wiring 14 on the first optical wiring board 4 may be the same as that of the prior art. In addition, a conventional method for forming a conductor pattern for surface mounting may be used.

第2光配線基板7も第1光配線基板4と同様にして製造する。   The second optical wiring board 7 is manufactured in the same manner as the first optical wiring board 4.

次に、第1光配線基板4と第2光配線基板7を接着剤により接着する。なお、第1光配線基板4と第2光配線基板7は全面接着されるが、それぞれ一部を接着するだけでもよい。それぞれ一部を接着する場合、可撓性に優れるため、配線しやすくなる。このとき、第2光配線基板7のコア長手方向長さよりも第1光配線基板4のコア長手方向長さを長くすることで、第2光配線基板7のコア長手方向両端部より第1光配線基板4のコア長手方向両端部がコア長手方向に突き出して、突出部8a,8bが形成される。   Next, the first optical wiring board 4 and the second optical wiring board 7 are bonded with an adhesive. The first optical wiring board 4 and the second optical wiring board 7 are bonded on the entire surface, but each may be bonded only partially. When a part of each is bonded, wiring is easy because of excellent flexibility. At this time, the length of the core in the core longitudinal direction of the first optical wiring board 4 is made longer than the length of the core of the second optical wiring board 7 in the core longitudinal direction. Both ends of the wiring board 4 in the core longitudinal direction protrude in the core longitudinal direction, and the protruding portions 8a and 8b are formed.

次に、本発明の他の実施形態を説明する。   Next, another embodiment of the present invention will be described.

図3に示されるように、光伝送アセンブリ31は、第1光配線基板34と第2光配線基板37を有する。第1光配線基板34はクラッド32中にコア33が配線されたものである。第2光配線基板7は第1光配線基板34とは別のクラッド35中にコア36が配線されたものである。第1光配線基板34の上面に第2光配線基板37が重ねられる。   As shown in FIG. 3, the optical transmission assembly 31 includes a first optical wiring board 34 and a second optical wiring board 37. The first optical wiring board 34 has a core 33 wired in a clad 32. The second optical wiring board 7 has a core 36 wired in a clad 35 different from the first optical wiring board 34. A second optical wiring board 37 is overlaid on the upper surface of the first optical wiring board 34.

ここで、第1光配線基板34は第2光配線基板37よりもコア長手方向の長さが長いものである。これにより、第1光配線基板34のコア長手方向片端部(図示左端)には、第2光配線基板37のコア長手方向片端部よりコア長手方向に突き出した突出部38が形成される。一方、第1光配線基板34のコア長手方向反対端部(図示右端)は、第2光配線基板37のコア長手方向反対端部と揃っている。   Here, the first optical wiring board 34 has a longer length in the core longitudinal direction than the second optical wiring board 37. Thus, a protruding portion 38 that protrudes in the core longitudinal direction from the one core longitudinal direction end of the second optical wiring substrate 37 is formed at one end (left end in the drawing) of the first optical wiring substrate 34. On the other hand, the end portion (the right end in the figure) of the first optical wiring board 34 is aligned with the end portion of the second optical wiring board 37 opposite to the core length direction.

第1光配線基板34の片端である突出部38の上面には受光素子39が実装される。第2光配線基板37の片端上面には発光素子40が実装される。一方、第1光配線基板34及び第2光配線基板37の反対端にはテープ光ファイバコネクタ41aと嵌合可能なコネクタ42が取り付けられる。   A light receiving element 39 is mounted on the upper surface of the protruding portion 38 that is one end of the first optical wiring board 34. The light emitting element 40 is mounted on the upper surface of one end of the second optical wiring board 37. On the other hand, a connector 42 that can be fitted to the tape optical fiber connector 41 a is attached to opposite ends of the first optical wiring board 34 and the second optical wiring board 37.

光伝送アセンブリ31の構成は、図1で説明した光伝送アセンブリ1を長手方向の途中で切って片端側のみとしたかのようなイメージで捉えることができる。つまり、図4に示されるように、第2光配線基板37のコア長手方向片端(図4左端)よりも第1光配線基板34のコア長手方向片端(図4左端)が突き出ているため、第1光配線基板34に突出部38が形成されている。この突出部38の上面には、受光素子39とその受光素子39の受光信号を増幅するプリアンプ43が実装されている。第2光配線基板37の片端上面には、発光素子40とその発光素子40を駆動するドライバ44が実装されている。   The configuration of the optical transmission assembly 31 can be grasped as an image as if the optical transmission assembly 1 described with reference to FIG. That is, as shown in FIG. 4, the core longitudinal direction one end (left end in FIG. 4) of the first optical wiring board 34 protrudes from the core longitudinal direction one end (left end in FIG. 4) of the second optical wiring substrate 37. A protrusion 38 is formed on the first optical wiring board 34. A light receiving element 39 and a preamplifier 43 that amplifies the light reception signal of the light receiving element 39 are mounted on the upper surface of the protruding portion 38. A light emitting element 40 and a driver 44 for driving the light emitting element 40 are mounted on the upper surface of one end of the second optical wiring board 37.

第1光配線基板34及び第2光配線基板37の反対端には、コア33,36の断面が表れている。コア33の断面を入力ポート、コア36の断面を出力ポートと考えることができる。これら入出力ポートを有する第1、第2光配線基板34,37の反対端にコネクタ42を取り付けることで光伝送アセンブリ31が構成される。   Cross sections of the cores 33 and 36 appear at opposite ends of the first optical wiring board 34 and the second optical wiring board 37. The cross section of the core 33 can be considered as an input port, and the cross section of the core 36 can be considered as an output port. An optical transmission assembly 31 is configured by attaching a connector 42 to opposite ends of the first and second optical wiring boards 34 and 37 having these input / output ports.

図3に示されるように、コネクタ42は、第1光配線基板34及び第2光配線基板37の反対端に取り付けることが可能な二層基板差し込み口と、テープ光ファイバコネクタ41と嵌合可能なコネクタ嵌合口(又は突部)を有する。これに対し、テープ光ファイバコネクタ41は、コネクタ42と嵌合可能なコネクタ嵌合突部(又は口)と、テープ光ファイバ45を二層に重ねて挿入可能なテープ光ファイバ差し込み口を有する。テープ光ファイバ45は、第1光配線基板34及び第2光配線基板37のクラッド厚さとクラッド径が同じ複数本の光ファイバを平行に並べたものである。第1光配線基板34及び第2光配線基板37における複数のコア33,36のコア幅方向配置ピッチは、テープ光ファイバ45における光ファイバ配置ピッチと同じであるため、各コア33,36にそれぞれテープ光ファイバ45の光ファイバのコアを光結合させることができる。   As shown in FIG. 3, the connector 42 can be fitted to the double-layer board insertion port that can be attached to the opposite ends of the first optical wiring board 34 and the second optical wiring board 37, and the tape optical fiber connector 41. Connector fitting opening (or projection). On the other hand, the tape optical fiber connector 41 has a connector fitting protrusion (or port) that can be fitted to the connector 42 and a tape optical fiber insertion port in which the tape optical fiber 45 can be inserted in two layers. The tape optical fiber 45 is a parallel arrangement of a plurality of optical fibers having the same clad thickness and clad diameter of the first optical wiring board 34 and the second optical wiring board 37. Since the core width direction arrangement pitch of the plurality of cores 33 and 36 in the first optical wiring board 34 and the second optical wiring board 37 is the same as the optical fiber arrangement pitch in the tape optical fiber 45, The optical fiber core of the tape optical fiber 45 can be optically coupled.

テープ光ファイバ45は、片端に光伝送アセンブリ31のコネクタ42と嵌合されるテープ光ファイバコネクタ41aが取り付けられると共に、反対端にもテープ光ファイバコネクタ41bが取り付けられる。   The tape optical fiber 45 has a tape optical fiber connector 41a fitted to the connector 42 of the optical transmission assembly 31 at one end and a tape optical fiber connector 41b attached to the opposite end.

テープ光ファイバ45の反対端のテープ光ファイバコネクタ41bには、図示しない相手側の光伝送アセンブリのコネクタが嵌合される。相手側の光伝送アセンブリは、図3、図4の光伝送アセンブリ31とは相補的に、第1光配線基板の片端上面に発光素子が実装され、第2光配線基板の片端上面に受光素子が実装されたもので、図1の光伝送アセンブリ1を長手方向の途中で切った反対端側に相当する。このように光伝送アセンブリ31と相手側の光伝送アセンブリとをテープ光ファイバ45を介して接続することにより、図1の光伝送アセンブリ1を用いた場合と同様に、光伝送路を二層配線にして、下層の第1光配線基板4が提供する光伝送路は反対端から片端への光伝送専用とし、上層の第2光配線基板7が提供する光伝送路は片端から反対端への光伝送専用とすることができる。なお、テープ光ファイバ45を介さずに、光伝送アセンブリ31と相手側の光伝送アセンブリとをコネクタで接続してもよい。   A connector of the other optical transmission assembly (not shown) is fitted into the tape optical fiber connector 41b at the opposite end of the tape optical fiber 45. The counterpart optical transmission assembly has a light emitting element mounted on the upper surface of one end of the first optical wiring board and a light receiving element on the upper surface of one end of the second optical wiring board in a complementary manner to the optical transmission assembly 31 of FIGS. 1 corresponds to the opposite end side of the optical transmission assembly 1 of FIG. 1 cut in the middle of the longitudinal direction. By connecting the optical transmission assembly 31 and the counterpart optical transmission assembly via the tape optical fiber 45 in this manner, the optical transmission path is formed in a two-layer wiring, as in the case of using the optical transmission assembly 1 of FIG. Thus, the optical transmission path provided by the lower first optical wiring board 4 is dedicated to optical transmission from the opposite end to one end, and the optical transmission path provided by the upper second optical wiring board 7 is provided from one end to the opposite end. It can be dedicated to optical transmission. The optical transmission assembly 31 and the counterpart optical transmission assembly may be connected by a connector without using the tape optical fiber 45.

光伝送アセンブリ31によれば、ドライバ44は第2光配線基板47の上面に実装され、プリアンプ43は第1光配線基板44の突出部8の上面に実装されるため、ドライバ44とプリアンプ43は上下方向(高さ方向)に分離配置される。よって、同一平面に並べるのに比べてドライバ44とプリアンプ43間の距離が長くなり、電磁ノイズの影響が軽減される。よって、電磁ノイズの影響を増大させることなく、ドライバ44とプリアンプ43間の平面上の距離を縮めて光伝送アセンブリの小型化・集積化を図ることが可能となる。   According to the optical transmission assembly 31, the driver 44 is mounted on the upper surface of the second optical wiring board 47 and the preamplifier 43 is mounted on the upper surface of the protruding portion 8 of the first optical wiring board 44. Separately arranged in the vertical direction (height direction). Therefore, the distance between the driver 44 and the preamplifier 43 is longer than when they are arranged on the same plane, and the influence of electromagnetic noise is reduced. Therefore, the optical transmission assembly can be reduced in size and integrated by reducing the planar distance between the driver 44 and the preamplifier 43 without increasing the influence of electromagnetic noise.

光伝送アセンブリ31においても、充填材46、電磁遮蔽板47を設けて電磁ノイズをいっそう軽減することができる。   Also in the optical transmission assembly 31, the electromagnetic noise can be further reduced by providing the filler 46 and the electromagnetic shielding plate 47.

光伝送アセンブリ31によれば、相手側の光伝送アセンブリと組み合わせることにより、図1の光伝送アセンブリ1の途中にテープ光ファイバ45が挿入されたのと同等な構成とすることが可能であるため、テープ光ファイバ45の長さを調節することで伝送距離を自由に設定することができる。   According to the optical transmission assembly 31, by combining with the counterpart optical transmission assembly, it is possible to obtain a configuration equivalent to that in which the tape optical fiber 45 is inserted in the middle of the optical transmission assembly 1 of FIG. The transmission distance can be freely set by adjusting the length of the tape optical fiber 45.

本発明の光伝送アセンブリ1,31は、上位の通信機器と他の通信機器との間に設置して、両通信機器間の通信信号の光伝送に供することができる。また、本発明の光伝送アセンブリ1,31は、電子機器内に設置して、ある電子回路と他の電子回路間の通信信号の光伝送に供することができる。例えば、一方の電子回路基板に光伝送アセンブリ31を実装し、他方の電子回路基板に相手側の光伝送アセンブリを実装し、光伝送アセンブリ31と相手側の光伝送アセンブリとをテープ光ファイバ45を介して接続する。これにより、電子回路基板間の光通信が可能となる。   The optical transmission assemblies 1 and 31 of the present invention can be installed between a higher-level communication device and another communication device, and can be used for optical transmission of communication signals between the two communication devices. Further, the optical transmission assemblies 1 and 31 of the present invention can be installed in an electronic device and used for optical transmission of communication signals between a certain electronic circuit and another electronic circuit. For example, the optical transmission assembly 31 is mounted on one electronic circuit board, the mating optical transmission assembly is mounted on the other electronic circuit board, and the optical fiber assembly 45 and the mating optical transmission assembly are connected to the tape optical fiber 45. Connect through. Thereby, optical communication between electronic circuit boards becomes possible.

また、光伝送アセンブリ1,31に、コア長手方向に延びた電気配線を設けてコアによる光伝送路と並列に電気伝送路を構成してもよく、電気配線は低速信号伝送や電源供給に用い、光伝送路を高速信号伝送に用いるとよい。   Further, the optical transmission assemblies 1 and 31 may be provided with electrical wiring extending in the longitudinal direction of the core so that the electrical transmission path is configured in parallel with the optical transmission path by the core. The electrical wiring is used for low-speed signal transmission and power supply. The optical transmission line is preferably used for high-speed signal transmission.

本発明の一実施形態を示す光伝送アセンブリの長手方向断面図である。1 is a longitudinal cross-sectional view of an optical transmission assembly illustrating one embodiment of the present invention. 図1の光伝送アセンブリの斜視図である。FIG. 2 is a perspective view of the optical transmission assembly of FIG. 1. 本発明の他の実施形態を示す光伝送アセンブリの長手方向断面図である。FIG. 6 is a longitudinal cross-sectional view of an optical transmission assembly showing another embodiment of the present invention. 図3の光伝送アセンブリの斜視図である。FIG. 4 is a perspective view of the optical transmission assembly of FIG. 3. 従来の光伝送アセンブリの斜視図である。It is a perspective view of the conventional optical transmission assembly. 従来の光伝送アセンブリの長手方向断面図である。1 is a longitudinal sectional view of a conventional optical transmission assembly.

符号の説明Explanation of symbols

1 光伝送アセンブリ
2 クラッド
3 コア
4 第1光配線基板
5 クラッド
6 コア
7 第2光配線基板
8a,8b 突出部
9 第1受光素子
10 第1発光素子
11 第2発光素子
12 第2受光素子
13a,13b,13c,13d 反射面
14 プリアンプ
15 ドライバ
16 電気配線
17 電磁遮蔽板
18 充填材
DESCRIPTION OF SYMBOLS 1 Optical transmission assembly 2 Clad 3 Core 4 1st optical wiring board 5 Clad 6 Core 7 2nd optical wiring board 8a, 8b Protrusion part 9 1st light receiving element 10 1st light emitting element 11 2nd light emitting element 12 2nd light receiving element 13a , 13b, 13c, 13d Reflecting surface 14 Preamplifier 15 Driver 16 Electrical wiring 17 Electromagnetic shielding plate 18 Filler

Claims (3)

クラッド中にコアが配線された第1光配線基板が形成され、
他のクラッド中にコアが配線された第2光配線基板が形成され、
第1光配線基板の上面に第2光配線基板が重ねられて少なくとも一部が接着固定され、第1光配線基板のコア長手方向両端部に、第2光配線基板のコア長手方向両端部よりコア長手方向に突き出した突出部が形成され、
第1光配線基板の片端の突出部上面に第1受光素子が実装され、
第1光配線基板の片端には、第1受光素子の直下に、第1光配線基板のコアを伝送されてきた光信号を反射して第1受光素子に入射させるための第1反射面が形成され、
第1光配線基板の反対端の突出部上面に第1発光素子が実装され、
第1光配線基板の反対端には、第1発光素子の直下に、第1発光素子の発光面から出射された光信号を反射して第1光配線基板のコアの片端方向に入射させるための第2反射面が形成され、
第2光配線基板の片端上面に第2発光素子が実装され、
第2光配線基板の片端には、第2発光素子の直下に、第2発光素子の発光面から出射された光信号を反射して第2光配線基板のコアの反対端方向に入射させるための第3反射面が形成され、
第2光配線基板の反対端上面に第2受光素子が実装され、
第2光配線基板の反対端には、第2受光素子の直下に、第2光配線基板のコアを伝送されてきた光信号を反射して第2受光素子に入射させるための第4反射面が形成され、
第1受光素子と第1発光素子が充填材で覆われると共に、上記充填材に電磁遮蔽板が設けられたことを特徴とする光伝送アセンブリ。
A first optical wiring board having a core wired in the cladding is formed;
A second optical wiring substrate having a core wired in another cladding is formed,
The second optical wiring board is overlapped on the upper surface of the first optical wiring board and at least a part thereof is bonded and fixed, and the both ends of the first optical wiring board in the longitudinal direction of the core are connected to both ends of the second optical wiring board in the longitudinal direction of the core. A protrusion protruding in the longitudinal direction of the core is formed,
A first light receiving element is mounted on the upper surface of the protruding portion at one end of the first optical wiring board,
A first reflecting surface for reflecting an optical signal transmitted through the core of the first optical wiring board and making it incident on the first light receiving element is provided at one end of the first optical wiring board immediately below the first light receiving element. Formed,
The first light emitting element is mounted on the upper surface of the protruding portion at the opposite end of the first optical wiring board,
An optical signal emitted from the light emitting surface of the first light emitting element is reflected at the opposite end of the first optical wiring board and incident on one end of the core of the first optical wiring board just below the first light emitting element. A second reflecting surface is formed,
A second light emitting element is mounted on the upper surface of one end of the second optical wiring board;
An optical signal emitted from the light emitting surface of the second light emitting element is reflected at one end of the second optical wiring board directly below the second light emitting element and is incident on the opposite end of the core of the second optical wiring board. A third reflecting surface is formed,
A second light receiving element is mounted on the upper surface of the opposite end of the second optical wiring board;
At the opposite end of the second optical wiring board, a fourth reflecting surface for reflecting an optical signal transmitted through the core of the second optical wiring board and making it incident on the second light receiving element immediately below the second light receiving element. Formed,
An optical transmission assembly, wherein the first light receiving element and the first light emitting element are covered with a filler, and an electromagnetic shielding plate is provided on the filler.
第1光配線基板及び第2光配線基板の両方又はいずれか一方に、コア長手方向に延び、コアによる光伝送路と並列に電気伝送路を構成する電気配線が設けられたことを特徴とする請求項1記載の光伝送アセンブリ。   The first optical wiring board and / or the second optical wiring board is provided with an electrical wiring that extends in the longitudinal direction of the core and configures the electrical transmission path in parallel with the optical transmission path by the core. The optical transmission assembly of claim 1. クラッド中にコアが配線された第1光配線基板が形成され、
他のクラッド中にコアが配線された第2光配線基板が形成され、
第1光配線基板の上面に第2光配線基板が重ねられて少なくとも一部が接着固定され、第1光配線基板のコア長手方向片端部に、第2光配線基板のコア長手方向片端部よりコア長手方向に突き出した突出部が形成され、
第1光配線基板の片端の突出部上面に第1受光素子(又は第1発光素子)が実装され、
第1光配線基板の片端には、上記第1受光素子(又は上記第1発光素子)の直下に、第1光配線基板のコアを伝送されてきた光信号を反射して上記第1受光素子に入射させるための(又は、上記第1発光素子の発光面から出射された光信号を反射して第1光配線基板のコアの反対端方向に入射させるための)第1反射面が形成され、
第2光配線基板の片端上面に第2発光素子(又は第2受光素子)が実装され、
第2光配線基板の片端には、上記第2発光素子(又は上記第2受光素子)の直下に、上記第2発光素子の発光面から出射された光信号を反射して第2光配線基板のコアの反対端方向に入射させるための(又は、第2光配線基板のコアを伝送されてきた光信号を反射して上記第2受光素子に入射させるための)第2反射面が形成され、
第1光配線基板及び第2光配線基板の反対端にテープ光ファイバコネクタと嵌合可能なコネクタが取り付けられ、
上記第1受光素子(又は上記第1発光素子)が充填材で覆われると共に、上記充填材に電磁遮蔽板が設けられたことを特徴とする光伝送アセンブリ。
A first optical wiring board having a core wired in the cladding is formed;
A second optical wiring substrate having a core wired in another cladding is formed,
The second optical wiring board is overlaid on the upper surface of the first optical wiring board, and at least a part thereof is bonded and fixed. From one end of the first optical wiring board in the core longitudinal direction, A protrusion protruding in the longitudinal direction of the core is formed,
A first light receiving element (or a first light emitting element) is mounted on the upper surface of the protruding portion at one end of the first optical wiring board,
The one end of the first optical wiring board, the right under the first light receiving element (or the first light emitting element), the reflected light signal transmitted the core of the first optical wiring substrate and the first light receiving element A first reflection surface is formed (or for reflecting an optical signal emitted from the light emitting surface of the first light emitting element and making it incident in the direction opposite to the core of the first optical wiring board). ,
The second light emitting element (or the second light receiving element) is mounted on one end on surfaces of the second optical wiring board,
The one end of the second optical wiring board, the right under the second light emitting element (or the second light receiving element), the second optical wiring board to reflect light emitted signals from the light emitting surface of the second light emitting element A second reflection surface is formed for making it incident in the opposite end direction of the core (or for reflecting the optical signal transmitted through the core of the second optical wiring board and making it incident on the second light receiving element). ,
A connector that can be fitted with a tape optical fiber connector is attached to opposite ends of the first optical wiring board and the second optical wiring board,
An optical transmission assembly, wherein the first light receiving element (or the first light emitting element) is covered with a filler, and an electromagnetic shielding plate is provided on the filler.
JP2007340395A 2007-12-28 2007-12-28 Optical transmission assembly Expired - Fee Related JP4911026B2 (en)

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