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JP4928840B2 - Manufacturing method of dustproof resin substrate - Google Patents
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JP4928840B2 - Manufacturing method of dustproof resin substrate - Google Patents

Manufacturing method of dustproof resin substrate Download PDF

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JP4928840B2
JP4928840B2 JP2006164475A JP2006164475A JP4928840B2 JP 4928840 B2 JP4928840 B2 JP 4928840B2 JP 2006164475 A JP2006164475 A JP 2006164475A JP 2006164475 A JP2006164475 A JP 2006164475A JP 4928840 B2 JP4928840 B2 JP 4928840B2
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Prior art keywords
slit
resin substrate
resin
wall surface
resin layer
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JP2007335563A (en
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清 吉田
主 松沢
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Eastern KK
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Eastern KK
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Priority to JP2006164475A priority Critical patent/JP4928840B2/en
Priority to TW095140118A priority patent/TW200803683A/en
Priority to KR1020060112270A priority patent/KR101256099B1/en
Publication of JP2007335563A publication Critical patent/JP2007335563A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

本発明は防塵樹脂基板及びその製造方法に関し、更に詳細には複数枚の配線基板が作り込まれた樹脂基板に、前記配線基板の各々が一本又は複数本の釣部によって繋がれるように、前記釣部を残して配線基板の各々を囲むスリットが形成されている防塵樹脂基板及びその製造方法に関する。   The present invention relates to a dust-proof resin substrate and a method for manufacturing the same, and more specifically, to a resin substrate in which a plurality of wiring substrates are built, so that each of the wiring substrates is connected by one or a plurality of fishing parts, The present invention relates to a dust-proof resin substrate in which a slit surrounding each wiring substrate is formed leaving the fishing portion, and a method for manufacturing the same.

半導体装置には、一面側に導体パターンを形成した配線基板が用いられている。かかる配線基板は、図３に示す様に、複数個の配線基板１２，１２・・が作り込まれている樹脂基板１０から切断されて得ることができる。
図３に示す樹脂基板１０には、配線基板１２，１２・・の各々が二本の釣部１４，１４によって繋がれるように、釣部１４，１４を残して配線基板１２，１２・・の各々を囲むスリット１６，１６・・が形成されている。
この釣部１４，１４は、配線基板１２，１２・・が完成した後、切断して配線基板１２を個片化する。この様にして得られた配線基板１２の端面には、樹脂基板１０から形成された絶縁層の端面が露出しており、埃発生の原因となることがある。
このため、例えば下記特許文献１に提案されている様に、得られた配線基板１２の端面を樹脂層で覆うことが行われている。
特開平５−１５２７２９号公報 In a semiconductor device, a wiring board having a conductor pattern formed on one side is used. Such a wiring board can be obtained by cutting from a resin substrate 10 in which a plurality of wiring boards 12, 12... Are formed as shown in FIG.
3, the wiring boards 12, 12,... Are left behind so that each of the wiring boards 12, 12... Is connected by the two fishing parts 14, 14. Slits 16, 16,... Surrounding each are formed.
The fishing parts 14 are cut into pieces after the wiring boards 12 are completed. The end face of the insulating layer formed from the resin substrate 10 is exposed on the end face of the wiring board 12 thus obtained, which may cause dust generation.
For this reason, for example, as proposed in Patent Document 1 below, the end surface of the obtained wiring board 12 is covered with a resin layer.
JP-A-5-152729

得られた配線基板１２の端面を樹脂層で覆うことによって、配線基板１２の端面からの埃発生を防止できる。
しかしながら、図３に示す樹脂基板１０のスリット１６，１６・・の内壁面からも埃が発生していることが判明した。
図３に示す樹脂基板１０のスリット１６，１６・・から発生する埃は、樹脂基板１０に作り込まれた配線基板１２，１２・・上に付着し、不良原因となるおそれがある。
そこで、本発明の課題は、複数枚の配線基板が作り込まれた樹脂基板に、配線基板の各々を繋ぐ釣部を残して形成されたスリットの内壁面からの埃発生を防止できる防塵樹脂基板の製造方法を提供することにある。 By covering the end face of the obtained wiring board 12 with a resin layer, dust generation from the end face of the wiring board 12 can be prevented.
However, it has been found that dust is also generated from the inner wall surfaces of the slits 16, 16... Of the resin substrate 10 shown in FIG.
.. Dust generated from the slits 16, 16... Of the resin substrate 10 shown in FIG. 3 may adhere to the wiring boards 12, 12.
Accordingly, an object of the present invention is to provide a dust-proof resin base that can prevent dust from being generated from the inner wall surface of a slit formed by leaving a fishing part connecting each of the wiring boards on a resin board on which a plurality of wiring boards are built. It is in providing the manufacturing method of a board .

本発明者等は前記課題を達成すべく検討を重ねたた結果、スリットの内壁面を樹脂で覆うことによって埃の発生を防止できることを見出し、本発明に到達した。
すなわち、本発明は、複数枚の配線基板が作り込まれた樹脂基板に、前記配線基板の各々が一本又は複数本の釣部によって繋がれるように、前記釣部を残して配線基板の各々を囲むスリットを形成した後、当該スリットの内壁面を含む樹脂基板の全面に、感光性樹脂から成る樹脂層を形成し、前記スリットの孔径より小さいスリットが形成されたマスク板を被着した後、当該マスク板のスリットを介して前記樹脂基板のスリットの内壁面全面に露光して当該内壁面を覆う樹脂層を感光させて現像液に対して不溶化し、前記マスク板を取り外して現像液による現像によって前記樹脂基板の樹脂層を除去することで当該樹脂基板のスリットの内壁面のみを樹脂層にて覆うことを特徴する。
かかる本発明において、樹脂基板として、繊維補強され、スリットの内壁面に前記繊維の端面が露出する樹脂基板を好適に用いることができる。
尚、スリットは、樹脂基板にルータ加工を施すことによって容易に形成できる。 As a result of repeated studies to achieve the above-mentioned problems, the present inventors have found that dust generation can be prevented by covering the inner wall surface of the slit with resin, and the present invention has been achieved.
That is, the present invention provides each of the wiring boards except for the fishing part so that each of the wiring boards is connected to one or more fishing parts by a resin board on which a plurality of wiring boards are built. After forming a slit surrounding the slit, a resin layer made of a photosensitive resin is formed on the entire surface of the resin substrate including the inner wall surface of the slit, and a mask plate on which a slit smaller than the diameter of the slit is formed is attached The entire inner wall surface of the slit of the resin substrate is exposed through the slit of the mask plate to expose the resin layer covering the inner wall surface to insolubilize with the developer, and the mask plate is removed by the developer. By removing the resin layer of the resin substrate by development, only the inner wall surface of the slit of the resin substrate is covered with the resin layer .
In the present invention, a resin substrate in which fibers are reinforced and the end surfaces of the fibers are exposed on the inner wall surface of the slit can be suitably used as the resin substrate .
The slit can be easily formed by performing router processing on the resin substrate.

図３に示す樹脂基板１０にスリット１６を形成する際には、通常、ルータ加工等の機械的手段によって形成する。このため、スリット１６の形成時に発生した微細な埃等が内壁面に付着している。
更に、樹脂基板１０として、繊維補強された樹脂基板１０が用いられた場合、図４に示す如く、スリット１６の内壁面に補強繊維１８，１８・・の端部が露出し、スリット１６の形成時に発生して内壁面に付着している微細な埃等と補強繊維１８，１８・・の端部とが相俟って埃発生の原因ともなる。
この点、本発明に係る防塵樹脂基板では、配線基板が一本又は複数本の釣部によって樹脂基板に繋がれるように作り込まれ、且つこの釣部を残して配線基板の各々を囲むスリットの内壁面を樹脂層によって覆っている。
このため、内壁面に付着している微細な埃等と補強繊維１８，１８・・の端部とを樹脂層内に閉じ込めることができ、スリットの内壁面からの埃等の発生を防止できる。
その結果、スリットの内壁面からの埃等が配線基板の配線基板上に付着することに因る不良原因の解消を図ることができ、個片化した配線基板の信頼性の向上を図ることができる。 When forming the slit 16 in the resin substrate 10 shown in FIG. 3, it is usually formed by mechanical means such as router processing. For this reason, fine dust or the like generated when the slit 16 is formed is attached to the inner wall surface.
Further, when the fiber-reinforced resin substrate 10 is used as the resin substrate 10, the ends of the reinforcing fibers 18, 18,... Are exposed on the inner wall surface of the slit 16 as shown in FIG. The fine dust or the like that sometimes occurs and adheres to the inner wall surface and the ends of the reinforcing fibers 18, 18,... Cause dust generation.
In this respect, in the dust-proof resin substrate according to the present invention, the wiring substrate is formed so as to be connected to the resin substrate by one or a plurality of fishing portions, and the slits surrounding each of the wiring substrates are left leaving this fishing portion. The inner wall surface is covered with a resin layer.
For this reason, the fine dust etc. adhering to the inner wall surface and the ends of the reinforcing fibers 18, 18,... Can be confined in the resin layer, and the generation of dust etc. from the inner wall surface of the slit can be prevented.
As a result, it is possible to eliminate the cause of defects caused by dust or the like from the inner wall surface of the slit adhering to the wiring board of the wiring board, and to improve the reliability of the separated wiring board. it can.

本発明に係る防塵配線基板を製造する際には、図３に示す樹脂基板１０を用いる。この樹脂基板１０は、図４に示す様に、補強繊維１８，１８・・で補強された複数枚の樹脂板１０ａ，１０ａ・・が積層されて形成されている。
更に、樹脂基板１０には、配線基板１２，１２・・の各々が二本の釣部１４，１４によって繋がれるように、釣部１４，１４を残して配線基板１２，１２・・の各々を囲むスリット１６，１６・・が形成されている。このスリット１６，１６・・はルータ加工によって形成した。
図３に示す樹脂基板１０には、図１（ａ）に示す様に、スリット１６，１６・・の内壁面を含む表面の全面に感光性樹脂から成る樹脂層２０を形成する。この樹脂層２０は、感光性樹脂を樹脂基板１０の表面及び裏面に向けてスプレーで噴霧することによって形成できる。 When manufacturing the dust-proof wiring board according to the present invention, the resin substrate 10 shown in FIG. 3 is used. As shown in FIG. 4, the resin substrate 10 is formed by laminating a plurality of resin plates 10 a, 10 a, reinforced with reinforcing fibers 18, 18,.
Further, each of the wiring boards 12, 12... Is left on the resin substrate 10 so that each of the wiring boards 12, 12... Is connected by two fishing parts 14, 14. Surrounding slits 16 are formed. The slits 16, 16,... Were formed by router processing.
On the resin substrate 10 shown in FIG. 3, a resin layer 20 made of a photosensitive resin is formed on the entire surface including the inner wall surfaces of the slits 16, 16,... As shown in FIG. This resin layer 20 can be formed by spraying a photosensitive resin toward the front and back surfaces of the resin substrate 10 by spraying.

次いで、図１（ｂ）に示す様に、スリット１６，１６・・の内壁面を含む表面の全面が感光性樹脂から成る樹脂層２０によって覆われた樹脂基板１０の両面側に、スリット２２ａ，２２ａが形成されたマスク板２２を被着する。この様に樹脂基板１０に被着したマスク板２２のスリット２２ａ，２２ａからは、樹脂層２０のスリット１６の内壁面を覆う部分とスリット１６の開口縁近傍の部分とが露出する。
更に、マスク板２２のスリット２２ａ，２２ａから露出している、樹脂層２０のスリット１６の内壁面を覆う部分とスリット１６の開口縁近傍の部分とに対して露光を施す。かかる露光が施された樹脂層２０のスリット１６の内壁面を覆う部分とスリット１６の開口縁近傍の部分とは、現像液に対して不溶化される。
その後、マスク板２２，２２を取り去った樹脂基板１０を現像液に浸漬し、マスク板２２によって覆われて遮光されていた樹脂層２０の部分を除去する。この現像の際に、樹脂層２０のスリット１６の内壁面を覆う部分とスリット１６の開口縁近傍の部分とは、図１（ｃ）に示す様に、現像液に対して不溶化された樹脂層２４として残留する。
スリット１６の内壁面を覆う樹脂層２４によって、ルータ加工によるスリット１６の形成の際に発生して内壁面に付着している微細な埃等と補強繊維１８，１８・・の端部とを樹脂層２４内に閉じ込めることができ、スリット１６の内壁面からの埃等の発生を防止できる。 Next, as shown in FIG. 1B, slits 22a, 22 are formed on both sides of the resin substrate 10 in which the entire surface including the inner wall surfaces of the slits 16, 16,. A mask plate 22 on which 22a is formed is deposited. Thus, from the slits 22 a and 22 a of the mask plate 22 attached to the resin substrate 10, a portion covering the inner wall surface of the slit 16 of the resin layer 20 and a portion near the opening edge of the slit 16 are exposed.
Further, the portion of the resin layer 20 that covers the inner wall surface of the slit 16 and the portion near the opening edge of the slit 16 that are exposed from the slits 22 a and 22 a of the mask plate 22 are exposed. The portion covering the inner wall surface of the slit 16 of the exposed resin layer 20 and the portion near the opening edge of the slit 16 are insolubilized in the developer.
Thereafter, the resin substrate 10 from which the mask plates 22 and 22 have been removed is immersed in a developer, and the portion of the resin layer 20 that is covered with the mask plate 22 and shielded from light is removed. In this development, the resin layer 20 that covers the inner wall surface of the slit 16 and the portion near the opening edge of the slit 16 are insolubilized in the developer as shown in FIG. 24 remains.
By the resin layer 24 covering the inner wall surface of the slit 16, fine dust and the like adhering to the inner wall surface that are generated when the slit 16 is formed by router processing and the ends of the reinforcing fibers 18, 18,. It can be confined in the layer 24, and generation of dust and the like from the inner wall surface of the slit 16 can be prevented.

図１（ｂ）では、樹脂基板１０に被着したマスク板２２，２２に形成したスリット２２ａ，２２ａは、樹脂基板１０に形成したスリット１６よりも若干幅広に形成している。このため、スリット２２ａ，２２ａからは、樹脂層２０のスリット１６の内壁面を覆う部分とスリット１６の開口縁近傍の部分とが露出する。
この点、図２（ａ）に示す様に、樹脂基板１０に被着したマスク板２２，２２に形成したスリット２２ａ，２２ａを、樹脂基板１０に形成したスリット１６よりも若干幅狭に形成すると、樹脂層２０のスリット１６の内壁面を覆う部分のみを露光できる。
次いで、現像液による現像によって、図２（ｂ）に示す様に、スリット１６の内壁面のみを、現像液に対して不溶の樹脂層２４によって覆うことができる。
尚、マスク板２２，２２に形成するスリット２２ａ，２２ａの寸法は、樹脂基板１０に形成したスリットの内壁面の全面に露光できように、予め字実験的に求めておくことが好ましい。 In FIG. 1B, the slits 22 a and 22 a formed in the mask plates 22 and 22 attached to the resin substrate 10 are formed slightly wider than the slits 16 formed in the resin substrate 10. For this reason, from the slits 22a and 22a, a portion of the resin layer 20 covering the inner wall surface of the slit 16 and a portion near the opening edge of the slit 16 are exposed.
In this regard, as shown in FIG. 2A, when the slits 22a and 22a formed in the mask plates 22 and 22 attached to the resin substrate 10 are formed slightly narrower than the slits 16 formed in the resin substrate 10. Only the portion of the resin layer 20 covering the inner wall surface of the slit 16 can be exposed.
Next, as shown in FIG. 2B, only the inner wall surface of the slit 16 can be covered with a resin layer 24 that is insoluble in the developer by developing with the developer.
It should be noted that the dimensions of the slits 22a and 22a formed in the mask plates 22 and 22 are preferably obtained in advance by a character experiment so that the entire inner wall surface of the slit formed in the resin substrate 10 can be exposed.

図１（ｃ）及び図２（ｂ）の様に、スリット１６の内壁面が不溶性の樹脂層２４によって覆われた樹脂基板１０には、スリット１６を横切る釣部１４，１４により配線基板１２が繋がれている。
かかる配線基板１２は、樹脂基板１０に釣部１４，１４に繋がれた状態で作業が施され、配線基板１２が完成したとき、釣部１４，１４が切り離されて個片化される。
かかる作業の間、図１（ｃ）及び図２（ｂ）の様に、スリット１６の内壁面が不溶性の樹脂層２４によって覆われており、スリット１６の内壁面からの埃等の発生を防止できる。その結果、個片化された配線基板１２の信頼性の向上を図ることができる。
以上の説明は、樹脂基板として、補強繊維１８，１８・・で補強された複数枚の樹脂板１０ａ，１０ａ・・が積層されて形成されている樹脂基板１０を用いているが、補強繊維１８，１８・・で補強されていない複数枚の樹脂板を積層した樹脂基板１０であっても用いることができる。
また、樹脂基板１０は、複数枚の樹脂板１０ａ，１０ａ・・が積層されているが、一枚の樹脂板であってもよい。 As shown in FIGS. 1C and 2B, the wiring substrate 12 is formed on the resin substrate 10 in which the inner wall surface of the slit 16 is covered with the insoluble resin layer 24 by the fishing portions 14 and 14 that cross the slit 16. It is connected.
The wiring board 12 is operated in a state where it is connected to the fishing parts 14, 14 on the resin substrate 10, and when the wiring board 12 is completed, the fishing parts 14, 14 are separated and separated into pieces.
During this work, as shown in FIGS. 1C and 2B, the inner wall surface of the slit 16 is covered with the insoluble resin layer 24, and the generation of dust and the like from the inner wall surface of the slit 16 is prevented. it can. As a result, the reliability of the separated wiring board 12 can be improved.
In the above description, the resin substrate 10 formed by laminating a plurality of resin plates 10a, 10a,... Reinforced with the reinforcement fibers 18, 18,. , 18... Can be used even if the resin substrate 10 is formed by laminating a plurality of resin plates that are not reinforced.
In addition, the resin substrate 10 is formed by laminating a plurality of resin plates 10a, 10a,... But may be a single resin plate.

本発明に係る防塵樹脂基板の製造方法の一例を説明する部分断面頭である。It is a partial section head explaining an example of the manufacturing method of the dustproof resin substrate concerning the present invention. 本発明に係る防塵樹脂基板の他の製造方法を説明する部分断面頭である。It is a partial section head explaining other manufacturing methods of a dustproof resin substrate concerning the present invention. 樹脂基板の形状等を説明する説明図である。It is explanatory drawing explaining the shape etc. of a resin substrate. 図４に示すスリット部分及びその近傍の状態を説明する説明図である。It is explanatory drawing explaining the state of the slit part shown in FIG. 4, and its vicinity.

符号の説明Explanation of symbols

１０ 樹脂基板
１０ａ 樹脂板
１２ 配線基板
１４ 釣部
１６ スリット
１８ 補強繊維
２２ マスク板
２２ａ マスク板２２のスリット
２４ 樹脂層 DESCRIPTION OF SYMBOLS 10 Resin board 10a Resin board 12 Wiring board 14 Fishing part 16 Slit 18 Reinforcing fiber 22 Mask board 22a Slit 24 of the mask board 22 Resin layer

Claims (3)

複数枚の配線基板が作り込まれた樹脂基板に、前記配線基板の各々が一本又は複数本の釣部によって繋がれるように、前記釣部を残して配線基板の各々を囲むスリットを形成した後、当該スリットの内壁面を含む樹脂基板の全面に、感光性樹脂から成る樹脂層を形成し、前記スリットの孔径より小さいスリットが形成されたマスク板を被着した後、当該マスク板のスリットを介して前記樹脂基板のスリットの内壁面全面に露光して当該内壁面を覆う樹脂層を感光させて現像液に対して不溶化し、前記マスク板を取り外して現像液による現像によって前記樹脂基板の樹脂層を除去することで当該樹脂基板のスリットの内壁面のみを樹脂層にて覆うことを特徴する防塵樹脂基板の製造方法。 A slit that surrounds each of the wiring boards is formed on the resin board on which a plurality of wiring boards are built, so that each of the wiring boards is connected by one or more fishing parts. Thereafter, a resin layer made of a photosensitive resin is formed on the entire surface of the resin substrate including the inner wall surface of the slit, and a mask plate in which a slit smaller than the diameter of the slit is formed is attached, and then the slit of the mask plate The entire inner wall surface of the slit of the resin substrate is exposed through the photosensitive resin layer, the resin layer covering the inner wall surface is exposed and insolubilized in the developer, the mask plate is removed, and the development of the resin substrate is performed by developing with the developer. A method for producing a dust-proof resin substrate, wherein only the inner wall surface of the slit of the resin substrate is covered with the resin layer by removing the resin layer . 前記樹脂基板として、繊維補強され、スリットの内壁面に前記繊維の端面が露出する樹脂基板を用いる請求項１記載の防塵樹脂基板の製造方法。2. The method for producing a dust-proof resin substrate according to claim 1, wherein a resin substrate that is fiber reinforced and has an end face of the fiber exposed on the inner wall surface of the slit is used as the resin substrate. 前記スリットを、樹脂基板にルータ加工を施して形成する請求項１又は２記載の防塵樹脂基板の製造方法。The method for producing a dust-proof resin substrate according to claim 1, wherein the slit is formed by performing router processing on the resin substrate.
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TW095140118A TW200803683A (en) 2006-06-14 2006-10-31 Dust-proof resin substrate and method of producing the same
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CN107248958A (en) * 2017-07-31 2017-10-13 安徽意诚智能科技有限公司 A kind of dust-proof router of wall-hanging

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