JP4933367B2 - Device for filling the head and ball - Google Patents

Description

  The present invention relates to a head that can be suitably used in an apparatus capable of filling a plurality of openings of a mask with conductive balls, and an apparatus including the head.

  In order to obtain electrical connection when mounting a semiconductor device or the like, conductive fine particles (conductive balls) such as solder balls may be arranged at predetermined positions of a work or a frame. Patent Document 1 discloses a microparticle arrangement device that includes a frame, a mask, and a squeegee, and arranges conductive microparticles at intended positions on the frame. The mask has a diameter that is less than twice the diameter of the conductive microparticles, and an opening for arranging the conductive microparticles. The mask is placed on the frame, and conductive fine particles are placed on top of it. The squeegee has a predetermined softness and moves on the mask to move the conductive fine particles on the mask. An example of a squeegee is a brush-like one in which conductive fibers having a diameter of 100 μm and a length of 1 mm are planted. This squeegee is formed, for example, by sticking a velvet cloth or the like to its tip.

In this microparticle array device, the squeegee is moved from one end to the other end on the mask with the tip thereof being in contact with the upper surface of the mask. As a result, the conductive microparticles are inserted into the apertures formed in the mask, and the conductive microparticles are arranged and adsorbed on the frame.
JP-A-9-148332

  When the squeegee is brought into contact with the mask, force is applied to the squeegee vertically upward from the mask. Therefore, when the squeegee as described above is used, when the squeegee is brought into contact with the mask, the conductive fibers are pushed by the mask, and the tip is likely to spread or be dispersed. When the tip of the conductive fiber spreads or becomes discrete, the fine particles are likely to leak backward from between the conductive fibers when the fine particles are pushed away.

  In the field of devices (microparticle array device, ball filling device) for filling fine particles (balls) into a plurality of openings (openings, apertures) in the mask, a squeegee that prevents the fine particles from leaking backward is used. There is a need for a head (dispenser) provided. Therefore, there is a demand for a head in which a portion of a member that pushes away a conductive ball such as a conductive fiber is difficult to spread or disperse.

  One embodiment of the present invention is a head including a support member and a sweep member including a plurality of linear members partially inserted into a lower portion (lower inside) of the support member. In this head, a part of a plurality of linear members comes into contact with the upper surface (surface) of a mask having a plurality of openings for arranging conductive balls (conductive fine particles) at predetermined positions on the workpiece, and supports them. As the member rotates about the axis perpendicular to the mask as a rotation axis, the sweep member moves the conductive ball on the mask in the direction of the center of rotation. In this head, portions of the plurality of linear members that appear from the lower surface facing the upper surface of the mask of the support member have an initial gradient with respect to the lower surface of the support member.

  According to this head, some of the plurality of linear members come into contact with the upper surface of the mask with an initial gradient. Therefore, even if the portions of the plurality of linear members that are in contact with the mask are pressed by the mask, the portions that are in contact are pressed in a uniform direction (rear in the rotation direction), and the portions that are in contact are difficult to spread and difficult to separate. Therefore, the conductive balls are less likely to leak from between the linear members, and the conductive balls are removed from the mask by the sweep member having the linear members by rotating the support member about the axis perpendicular to the mask. It can be moved well in the direction of the center of rotation.

  That is, when the plurality of linear members of the sweep member are brought into contact with the mask, force is applied to the plurality of linear members vertically upward from the mask. When the initial gradient of the plurality of linear members with respect to the lower surface of the support member is in the vertical direction (vertically downward), when the linear members are brought into contact with the mask, the tips of the linear members are pushed by the mask and the tips expand. It is easy to disperse. If the tip of the linear member is greatly spread or scattered, the tip of the linear member remains spread or scattered even when the head is rotated in contact with the upper surface (surface) of the mask, making it difficult to align in one direction. . When the conductive ball is moved (pushed away) by the linear member in such a state, the conductive ball easily leaks backward from between the linear members.

  According to this head, the portions of the plurality of linear members that appear from the lower surface facing the upper surface of the mask of the support member have an initial gradient with respect to the lower surface of the support member. Therefore, when the sweep member is brought into contact with the mask, the side portions (side surfaces) of the plurality of linear members come into contact with the mask. For this reason, even if a plurality of linear members of the sweep member are brought into contact with the mask and force is applied vertically upward from the mask to the plurality of linear members, the linear members are rearward with respect to the rotation direction toward the tip. It bends in a state where it is aligned in one direction so as to tilt, and its tip is difficult to spread or disperse.

  For this reason, by the rotation of the head, the sweep member can be moved on the mask while pushing away the conductive ball in the direction of the center of rotation with little or almost no backward leakage. For this reason, it can suppress that a conductive ball spreads freely on the upper surface of a mask, and can limit the range in which a conductive ball exists. That is, according to this head, a group of conductive balls can be held in a limited area (hereinafter referred to as a moving area) inside the head.

  Therefore, by moving the head, the conductive ball can be efficiently filled into the opening of the mask where the moving area passes. That is, this head is suitable for a device for filling a plurality of openings of a mask with conductive balls (ball filling device, ball mounting device). By using this head, a conductive ball to the openings of the mask is used. The incidence of filling mistakes can be reduced.

  One form of the head in which the plurality of linear members have an initial gradient is such that the plurality of linear members are processed (bent) so as to have a gradient and then inserted into the support member. When a plurality of linear members processed to have an initial gradient are used, the inserted portions may be substantially perpendicular to the lower surface of the support member.

  In another form of the head, the portions of the plurality of linear members inserted into the support members are inclined with respect to the lower surface of the support members. That is, one form of this head is such that the portion into which the plurality of linear members are inserted is inserted into the support member so as to be inclined with respect to the lower surface of the support member. It is possible to omit the processing for having the.

  In this head, it is preferable that a plurality of sweep members are inserted below the support member. By rotating a head having a plurality of sweep members, a force can be applied more efficiently in the direction of the moving area to the conductive balls around the moving area. Furthermore, by arranging multiple sweep members in the direction of their movement, that is, the direction of movement due to the rotation of the head, it is possible to catch the conductive balls leaked from other squeegees and ensure that they are in the direction of the moving area. Can be recovered.

  In this case, it is preferable that the plurality of sweep members are inserted into the lower portion of the support so that the portions of the plurality of linear members that come into contact with the mask become radial. In addition, when the part which contacts the mask of several linear members becomes radial, it means the state where the part which contacts the mask of several linear members is located so that it may spread in all directions. This does not mean that when the part of the member that contacts the mask is extended, the line (extension line) always intersects at one point. The radial line also means a line extending from an arbitrary point in the central portion to the outer peripheral direction where the lines do not intersect each other.

  The sweep member is formed by bundling at least one end of a plurality of linear members, and is preferably inserted into the support member so that at least one bundled end is inclined with respect to the lower surface of the support member. Since the bundled linear members have substantially the same initial gradient, the portions of the multiple linear members that are in contact with the mask are more difficult to be separated. Further, by bundling, the plurality of linear members can be easily attached to the support member.

The sweep member is a bundle of both ends of a plurality of linear members. When using a member that bundles the ends, sweep member is such that the U-shaped on the lower side of the support member, attached taken up support member. Each of the bundled ends is inclined with respect to the lower surface of the support member, and each of the plurality of linear members is a head attached to the support member so as to be U-shaped on the lower side.

In this head, a plurality of insertion holes for inserting the bundled ends of the plurality of sweep members are provided in the lower part of the support member. In this case, the plurality of insertion holes are provided so as to extend in a direction inclined with respect to the lower surface of the support member. The initial gradient can be obtained by simply inserting the bundled ends of the sweep member into the insertion hole.

In a head in which a plurality of sweep members are inserted into the support member so that the bundled both ends are inclined with respect to the lower surface of the support member, the bundled ends of the plurality of sweep members are respectively disposed below the support member. A plurality of inner insertion holes and a plurality of outer insertion holes for insertion are provided . A plurality of inner insertion hole, and the plurality of outer insertion holes, provided so that their open ends are arranged concentrically around the rotation axis. The plurality of inner insertion holes and the plurality of outer insertion holes are provided so as to extend in a direction inclined with respect to the lower surface of the support member. The distance between the opening end of the inner insertion hole and the corresponding opening end of the outer insertion hole is shorter than that of the sweep member, so that each of the bundled ends of the sweep member corresponds to the inner insertion hole and the corresponding one. When the insertion member is inserted into the outer insertion hole, the sweep member is attached to the lower side of the support member in a U shape so as to be inclined with respect to the lower surface of the support member.

  In this case, the center of the opening end of the inner insertion hole and the center of the opening end of the corresponding outer insertion hole are respectively tangent to the virtual circle inside the opening end center of the inner insertion hole. It is preferable that it is located on. It is preferable that the inner insertion hole and the outer insertion hole corresponding to the inner insertion hole are inclined with respect to the lower surface of the support member in a direction perpendicular to the tangent line.

  By the way, if the pressure applied to the mask and the conductive ball by the sweep member (the force that the elastic force of the sweep member applies to the mask and the conductive ball) is too large, the conductive ball is compressed more than necessary or the opening of the mask is filled. There is a risk of scraping the conductive balls formed. According to this head, since the plurality of linear members have an initial gradient, the pressure applied to the mask and the conductive ball by the sweep member due to the initial gradient (the elastic force of the sweep member applies to the mask and the conductive ball) Force) can be adjusted.

  When the initial gradient of the sweep member relative to the lower surface of the support member exceeds 80 °, the sweep member easily damages the conductive ball or scrapes the conductive ball filled in the opening of the mask. On the other hand, if the initial gradient of the sweep member relative to the lower surface of the support member is too small, the force by which the sweep member presses the mask and the conductive ball becomes too small, and there is a possibility that the conductive ball leaks. When the initial gradient of the sweep member relative to the lower surface of the support member is less than 10 °, the conductive balls are likely to leak.

  Therefore, in this head, the initial gradient of the sweep member with respect to the lower surface of the support member is 10 ° to 80 ° (10 ° to 80 ° with respect to the vertical direction (perpendicular to the lower surface of the support member, rotation axis)). preferable. By doing so, it is difficult to damage the conductive balls or scrape out the conductive balls filled in the openings of the mask, and a head with less leakage of the conductive balls can be obtained. The initial gradient of the sweep member relative to the lower surface of the support member is more preferably 40 ° to 70 ° (20 ° to 50 ° with respect to the vertical direction (a perpendicular to the lower surface of the support member, the rotation axis)).

  Since the sweep member is often a consumable item, in this head, the sweep member is preferably detachably inserted into the support member. Sweep members can be easily replaced. Further, the sweep member can be changed depending on the size of the conductive ball used. In such a case, the head can be circulated with the sweep member removed.

A head having a support member into which a part of a sweep member including a plurality of linear members is detachably inserted in a lower part (lower inside) is formed by inserting the sweep member into the support member. The contact member is in contact with the upper surface of the mask having a plurality of openings for disposing the conductive balls at predetermined positions of the workpiece, and the support member rotates about the axis perpendicular to the mask as a rotation axis. Moves the conductive ball in the direction of the center of rotation on the mask. In this head, an insertion hole for inserting a part of the sweep member is provided below the support member. The insertion hole extends in a direction inclined with respect to the lower surface of the support member.

  These heads are devices that can fill a plurality of openings with a conductive ball (ball filling) with a mask having a plurality of openings for placing the conductive balls at predetermined positions on the work set on the work. Device, ball mounting device). That is, still another aspect of the present invention is a ball filling apparatus including the head as described above, means for rotating the support member of the head, and head moving means for moving the head. The ball filling apparatus only needs to include at least one head. That is, the number of heads may be one or plural.

A device capable of filling a plurality of openings with conductive balls in a state in which a mask having a plurality of openings for placing the conductive balls at predetermined positions on the work is set on the work, and a support member; an apparatus for chromatic and sweep member including a plurality of linear members which is partially inserted into the lower portion of the support member, a part of the plurality of linear members are arranged the conductive balls at a predetermined position of the work The contact member is in contact with the upper surface of the mask having a plurality of openings, and the support member rotates about the axis perpendicular to the mask as a rotation axis, so that the sweep member moves the conductive ball on the mask in the direction of the rotation center. A head to be rotated, a means for rotating the support member of the head, and a head moving means for moving the head, wherein the inserted portions of the plurality of linear members are a plurality of The portions of the plurality of linear members that appear from the lower surface facing the upper surface of the mask of the support member are in front of the vertical line of the upper surface of the mask so that they are in front of the rotation direction with respect to the portion that contacts the mask of the You can have inclined Te.

In addition, a device capable of filling a plurality of openings with conductive balls in a state where a mask having a plurality of openings for placing the conductive balls at predetermined positions on the work is set on the work, In a device having a support member into which a part of a sweep member including a plurality of linear members is detachably inserted, by inserting the sweep member into the support member, a part of the plurality of linear members can be electrically conductive balls. The sweep member is electrically conductive on the mask by contacting the upper surface of the mask having a plurality of openings for positioning at a predetermined position of the workpiece, and the support member rotating about an axis perpendicular to the mask as a rotation axis. A head for moving the ball in the direction of the rotation center, a means for rotating the support member of the head, and a head moving means for moving the head Has, in the lower portion of the support member, and the insertion hole provided for inserting a portion of the sweep member, the insertion hole may extend in a direction inclined with respect to the normal of the upper surface of the mask.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an example of a ball mounting device (mounting device, ball mounting system, ball mounter). The ball mounting device 1 is a device for mounting a conductive ball at a predetermined position on a workpiece (workpiece, object, substrate) 100. The ball mounting apparatus 1 of this example is a nominal 8 inch or 12 inch circular semiconductor wafer (hereinafter simply referred to as a wafer) provided with a plurality of land-shaped (convex) electrodes (lands) 101 in a predetermined pattern. A plurality of conductive balls B are mounted in a predetermined pattern on the plurality of electrodes 101 of the wafer 100. The wafer 100 of this example has an insulating coating film 102 formed on the surface thereof, but the insulating coating film 102 corresponding to the plurality of electrodes 101 has been removed, and the plurality of electrodes 101 are exposed ( (See FIG. 9). The plurality of electrodes 101 of the wafer 100 are provided, for example, in a two-dimensional matrix. In the ball mounting apparatus 1 of this example, a plurality of conductive balls B are two-dimensionally arranged on the plurality of electrodes 101 of the wafer 100.

  In addition, the workpiece | work 100 which mounts the conductive ball B is not limited above. As the workpiece 100 on which the conductive ball B is mounted, for example, an electronic circuit board such as a printed wiring board may be used. The printed wiring board is also called a printed wiring board, a printed circuit board, a printed circuit board, a circuit board, or a printed board, and includes a semiconductor mounting board on which a semiconductor is mounted, a build-up board, a multilayer board, and the like.

  The conductive ball B mounted on the electrode 101 of the wafer 100 functions to obtain an electrical connection, and the diameter thereof is, for example, 1 mm or less, specifically, about 10 to 500 μm. . Such a conductive ball B is sometimes called a micro ball (micro ball, micro particle). The conductive ball B includes solder balls (balls containing silver (Ag), copper (Cu), etc., the main component of which is tin (Sn)), metal balls such as gold or silver, and ceramics. This includes balls or plastic balls that have been subjected to a treatment such as conductive plating. In this example, a solder ball having a diameter of about 90 μm is used as the conductive ball B.

  The ball mounting apparatus 1 performs a rough alignment (prealignment) of the wafer 100 with a loader / unloader apparatus 2 for loading (supplying) and unloading (accommodating) the wafer 100, a transfer apparatus 3 for transferring the wafer 100, and the like. The aligner 4, the correction device 5 that corrects the warpage of the wafer 100, and a flux application device that applies a material (flux) for bonding the wafer 100 and the conductive balls B onto the plurality of electrodes 101 of the wafer 100. And a ball filling device 10 for mounting (arranging) a plurality of conductive balls B on a plurality of electrodes 101 of a wafer 100 via a mask 110. The correction device 5, the flux application device 6, and the ball filling device 10 are arranged side by side in the X direction.

  The loader / unloader apparatus 2 includes a first package 2 a for loading (supplying) the wafer 100 and a second package 2 b for unloading (accommodating) the wafer 100. The wafer 100 is carried in and transferred from the loader / unloader apparatus 2. Note that the loader / unloader device 2 may include one package. The transfer device 3 includes an XYZθ moving stage (transfer stage) 3a and a transfer robot 3b. The moving stage 3a includes an X-axis table, a Y-axis table, a Z-axis table, and a θ table. The moving stage 3a holds the wafer 100 on its upper surface (XY plane in this example) in a state where the warpage of the wafer 100 is corrected by a method such as vacuum suction. The moving stage 3 a moves the wafer 100 to an arbitrary position among the correction device 5, the flux application device 6, and the ball filling device 10. Further, the moving stage 3a can adjust the position of the wafer 100 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction. An example of a method of holding the wafer 100 on the moving stage 3a is vacuum suction, but the method of holding the wafer 100 on the moving stage 3a is not limited to vacuum suction, but is an electrostatic chuck. They may be present, or they may be used in combination. The transfer robot 3b loads the wafer 100 from the first package 2a of the loader / unloader apparatus 2 onto the aligner 4, transfers the wafer 100 from the aligner 4 to the moving stage 3a, and transfers the wafer 100 from the moving stage 3a to the loader / unloader 3a. It is carried out to the second package 2b of the unloader device 2.

  The ball filling apparatus 10 is configured so that a mask 110 having a plurality of openings (openings, apertures) 111 for placing the conductive balls B on the wafer 100 is set (overlapped) on the wafer 100. The conductive balls B are filled in the plurality of openings 111 of 110. The plurality of openings 111 of the mask 110 are for arranging the conductive balls B at predetermined positions on the wafer 100, and the diameter of each opening 111 corresponds to the size of the conductive balls B.

  FIG. 2 schematically shows an example of the ball filling apparatus 10. The ball filling device 10 includes a ball holding device (ball dispenser, dispenser) 30, a head moving device (head moving means) 40 that moves the ball holding device 30, and a ball replenishing device (ball supply device) that replenishes the conductive balls B. 50). The ball holding device 30 includes first and second heads 20a and 20b, and these two heads 20a and 20b have two independent heads on the surface of the mask 110 (for example, the upper surface 110a (in this example, the XY plane)). A part (hereinafter referred to as a moving area A1 and A2) is formed. The head moving device 40 moves the ball holding device 30, moves the two heads 20a and 20b, and moves the two moving areas A1 and A2. The ball replenishing device 50 replenishes the conductive balls B inside the two heads 20a and 20b (in the two moving areas A1 and A2), respectively. Note that the number of heads provided in the ball filling apparatus 10 is not limited to two, and may be one or three or more.

  In this example, the ball holding device 30 includes two heads 20a and 20b. The heads 20a and 20b are supported by a support device 60, and the support device 60 is movably supported by the moving device 40. Accordingly, the two heads 20 a and 20 b of the ball holding device 30 are moved in parallel by the moving device 40. The support device 60 includes two motors 61a and 61b for rotating the head corresponding to the two heads 20a and 20b, respectively, and two motors 61a and 61b and two heads extending in the Z direction for connecting the heads 20a and 20b, respectively. Shafts (shafts, rotating shafts) 62a and 62b are provided. The heads 20a and 20b are detachably attached to the tip portions of the shafts 62a and 62b, respectively.

  The support device 60 further includes a base 60a, a pair of rails 63 that are provided on the base 60a and that slide-support the second head 20b so that the distance from the first head 20a changes, and the second head 20b. And a stopper 64 for fixing the slide to the base 60a. The first head 20a is detachably attached to the shaft 62a, and the motor 61a, the shaft 62a, and the like are fixed to the base 60a via a support member 65a. The second head 20b is detachably attached to the shaft 62b, and the motor 61b, the shaft 62b, and the like are supported by the base 60a via the support member 65b and the rail 63 so as to be slidable in the X direction. Yes.

  The stopper 64 includes two screw holes 66a and 66b provided in the base 60a, and a screw (bolt) 67 for fixing the support member 65b to the base 60a. The position of the second head 20b with respect to the base 60a is fixed by screwing the screw 67 into the screw hole 66a or 66b with the support member 65b interposed therebetween. In this example, the distance (X direction) between the first head 20a and the second head 20b is maintained at 4 inches by screwing the screw 67 into the first screw hole 66a. By screwing the screw 67 into the second screw hole 66b, the distance (X direction) between the first head 20a and the second head 20b is maintained at 6 inches. In this example, the number of screw holes is two and the settable intervals are two. However, the number of settable intervals can be increased by increasing the number of screw holes.

  The support device 60 can support the two heads 20a and 20b, and can rotate the two heads 20a and 20b around the shafts 62a and 62b, respectively. That is, in this example, the central axes of the shafts 62a and 62b are the rotation axes of the heads 20a and 20b (the axes perpendicular to the mask 110), respectively, and the heads 20a and 20b are respectively centered on the rotation axes. Rotate (rotate) counterclockwise when viewed from above (clockwise when viewed from below). In the figure, symbol Dr is the rotation direction of the heads 20a and 20b.

  The support device 60 includes two head Z-axis tables 68a and 68b corresponding to the two heads 20a and 20b, respectively. Each of the head Z-axis tables 68a and 68b includes a motor (not shown). Accordingly, the two heads 20a and 20b are arranged in the X direction at a predetermined interval (4 inches or 6 inches in this example), and the respective heads 20a and 20b have their respective heights along the Z direction (vertical direction in this example). You can adjust the height.

  A moving device 40 for moving the ball holding device 30 including the heads 20a and 20b has an X-axis table 41 and a pair of Y-axis tables 42a and 42b. The X-axis table 41 includes a motor 43, and the pair of Y-axis tables 42a and 42b includes motors 44a and 44b, respectively. The X-axis table 41 is disposed so as to straddle the Y-axis tables 42a and 42b. The support device 60 is moved in the X direction by the X-axis table 41, and the X-axis table 41 is moved in the Y direction by the pair of Y-axis tables 42a and 42b, so that the heads 20a and 20b have a predetermined distance ( In this example, the surface (upper surface) 110a of the mask 110 is moved in an arbitrary two-dimensional direction via the support device 60 while maintaining a spacing of 4 inches or 6 inches.

  The replenishing device 50 is for replenishing the conductive balls B in the two heads 20a and 20b, that is, in the moving areas A1 and A2. In this example, the insides of the shafts 62a and 62b are hollow, and ball tanks 51a and 51b are provided at the upper ends of the respective shafts 62a and 62b, and the ball tanks are interposed via the flexible tubes 52a and 52b. The inside of 51a and 51b and the inside of shaft 62a and 62b are connected. The flexible tubes 52a and 52b and the shafts 62a and 62b are used to supply the ball B from the ball tanks 51a and 51b to the inside of the heads 20a and 20b (the moving areas A1 and A2 defined by the heads 20a and 20b). A path (ball supply path) 53 is configured. That is, the shafts 62a and 62b function as the rotation axes of the heads 20a and 20b, respectively, and form part of the ball supply path 53. The replenishing device 50 including the ball tanks 51a and 51b and the ball supply path 53 is moved by the moving device 40 via the support device 60 together with the ball holding device 30 (heads 20a and 20b).

  In the ball filling apparatus 10, the ball B is mounted on the wafer 100 as follows. First, the mask 110 is set (overlaid) on the wafer 100. Two heads 20 a and 20 b are set on the mask 110. The vertical distance between the mask 110 and the heads 20a and 20b can be adjusted by the head Z-axis tables 68a and 68b, and the distance between the heads 20a and 20b can be adjusted by sliding the base 60a by the rail 63. A plurality of conductive balls B are held inside the two heads 20a and 20b, respectively. With the distance between the two heads 20a and 20b kept at a predetermined distance, the heads 20a and 20b are moved by the moving device 40. More specifically, the heads 20a and 20b are moved by a predetermined route so that the moving areas A1 and A2 cover the entire region of the upper surface 110a of the mask 110 where the conductive balls B are filled (predetermined route). To have a trajectory). By these processes, when the moving areas A1 and A2 formed by the heads 20a and 20b pass through the opening 111 of the mask 110, the conductive balls B are filled in the opening 111 of the mask 110, and the electrode 101 of the wafer 100 is formed. Mounted on top.

  Since the conductive balls B are consumed by filling the openings 111 of the mask 110, the heads 20a and 20b are moved through the heads 20a and 20b (through the openings 21a of the support member 21 described later). The conductive balls B are replenished from the replenishing device 50 into the moving areas A1 and A2, respectively. The supply of the conductive balls B to the moving areas A1 and A2 is performed based on the amount of balls consumed by filling. For example, by supplying the conductive balls B at predetermined time intervals based on the amount of balls consumed per hour, an appropriate amount of the conductive balls B is always present in the moving areas A1 and A2. be able to.

  Next, the heads 20a and 20b will be described. The head 20a and the head 20b employed in the filling apparatus 10 of this example and mechanisms for rotating them (the shaft 62a and the shaft 62b, the motor 61a and the motor 61b, etc.) have the same shape. Therefore, hereinafter, including the drawings, the head is referred to as the head 20, the moving area as the moving area A, the head rotating motor as the head rotating motor 61, and the shaft as the shaft 62.

  FIG. 3 is a diagram of the head 20 according to the first embodiment as viewed obliquely from above. FIG. 4 shows the head 20 in a side view. FIG. 5 shows the head 20 in a bottom view. FIG. 6 schematically shows the sweep member attached to the head 20 in a state where it is detached from the head 20. FIG. 7 is a bottom view of the support member included in the head 20. 8 is a cross-sectional view taken along line VIII-VIII in FIG. FIG. 9 schematically shows the usage state of the head 20.

  The head 20 of this example includes a support member 21, 12 sets of sweep members (squeegee, squeegee member) 22 protruding downward from the lower surface 21 b of the support member 21 toward the upper surface 110 a of the mask 110, and a disk-like shape. It has a first fixing bracket 23a and a ring-shaped second fixing bracket 23b. Each sweep member 22 includes a plurality of linear members 28 protruding toward the upper surface 110 a of the mask 110. The support member 21 has a disk shape, and an opening 21a is provided in the center. On the upper portion of the support member 21, a fixture 29 for detachably attaching the head 20 to the shaft 62 is provided. An opening 29 a is provided at the center of the fixture 29 so as to be continuous with the opening 21 a of the support member 21. Therefore, by attaching the head 20 to the shaft 62, the inside of the head 20 (region surrounded by the plurality of sweep members 22, the moving area A) and the inside of the shaft 62 communicate with each other. Further, by attaching the head 20 to the shaft 62, the lower surface 21b of the support member 21 faces the upper surface 110a of the mask 110, and the distance between the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110 is Z-axis table 68a for the head. (68b).

  The sweep members 22 are bundled by a method in which both ends of a plurality of linear members (wires) 28 are caulked with a metal ring, a method in which both ends are fixed with a bonding material such as resin or solder, and the like. As the linear member 28, a stainless steel linear member, a resin having a function of suppressing electrification (the resin itself is a conductive resin, a resin containing a conductive material such as carbon or metal, or the surface is coated with Cu or the like. In view of the size and material of the conductive ball B to be used, the material of the mask 110, and the like, such as a linear member made of resin), a linear member containing amorphous, etc., it can be selected from various linear members. . In this example, 600 stainless steel wires having a diameter of 50 μm are used as the linear member 28, and both ends thereof are bundled by caulking with metallic members 25a and 25b to form a sweep member 22 having a diameter of about 3 mm. . Since the linear member 28 has elasticity, the sweep member 22 can be bent in a substantially U shape at the center portion. However, as shown in FIG. A straight shape including the caulking portions 25a and 25b is a basic shape. The sweep member 22 may be mounted by inserting the sweep member 22 into insertion holes 71 and 72 (see FIG. 7) provided in the support member 21 in a state where the sweep member 22 is bundled with a string or the like.

  In this head 20, twelve sets of the sweep members 22 are detachably inserted into the lower portion of the support member 21 so that the bundled ends 25 a and 25 b are detachable, whereby the head 20 having the sweep members is formed. In this head 20, twelve sets of sweep members 22 are attached to the lower side of the support member 21 in a U shape. For this reason, the center part (belly part) 26a of the sweep member 22 is in contact with the mask 110 by appropriately setting the distance between the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110.

  Further, in the head 20, the portion 26 that appears from the lower surface 21 b of the support member 21 of the plurality of linear members 28 has an initial gradient α with respect to the lower surface 21 b of the support member 21. More specifically, in this example, the base portions 26 b of the plurality of linear members 28 have an initial gradient α with respect to the lower surface 21 b of the support member 21. In the head 20, the caulking portions (bundled ends) 25 a and 25 b become portions into which the plurality of linear members 28 are inserted, and the caulking portions 25 a and 25 b are initially inclined with respect to the lower surface 21 b of the support member 21. It is inserted into the support member 21 so as to be inclined by α.

  This head 20 is provided with a plurality of insertion holes 71 and 72 in the lower part of the support member 21 in order to insert 12 sets of sweep members 22 so that the caulking portions 25a and 25b are inclined with respect to the lower part of the support member 21. It has been. The twelve inner insertion holes 71 are for inserting the bundled one ends 25a of the 12 sets of the sweep members 22, respectively. The twelve outer insertion holes 72 are for inserting the other bundled ends 25b of the 12 sets of the sweep members 22, respectively. These insertion holes 71 and 72 are formed in a direction of 60 ° with respect to the lower surface 21 b of the support member 21. Therefore, by inserting both ends 25a and 25b of the respective linear members 28 into the insertion holes 71 and 72, the base portions 26b of the portions 26 that appear from the lower surfaces 21b of the support members 21 of the plurality of linear members 28 are supported by the support members 21. It has an initial gradient of 60 ° with respect to the lower surface 21b.

  The inner insertion hole 71 and the outer insertion hole 72 can be formed by cutting using a drill or the like, for example. In the cutting using a drill or the like, the shape of the bottom 71a and / or 72a of the hole 71 and / or 72 may be tapered (pointed shape) as shown in FIG. The shape of the bottom 71a and / or 72a of the and / or 72 is arbitrary and may be flat.

  As shown in FIG. 7 and the like, the twelve inner insertion holes 71 and the twelve outer insertion holes 72 for inserting the bundled ends 25a and 25b of the twelve pairs of the sweep members 22 are respectively the support member 21. These open ends 71b and / or 72b are provided concentrically around the rotation axis. The twelve inner insertion holes 71 are provided at equal pitches (every 30 °) along the virtual inner circle 73. The twelve outer insertion holes 72 correspond to the inner insertion holes 71 and are provided at equal pitches (every 30 °) along the virtual outer circle 74. The plurality of inner insertion holes 71 and the plurality of outer insertion holes 72 each extend in a direction inclined in the direction of 60 ° with respect to the lower surface 21 b of the support member 21.

  More specifically, the center of the opening end 71 b of the inner insertion hole 71 and the center of the opening end 72 b of the outer insertion hole 72 corresponding to the center are respectively from the center of the opening end 71 b of the inner insertion hole 71. Also, the positions of the inner insertion hole 71 and the corresponding outer insertion hole 72 are determined so as to be positioned on the tangent 76 of the inner virtual circle 75. The inner insertion hole 71 and the outer insertion hole 72 corresponding to the inner insertion hole 71 are formed so as to be inclined by 60 ° with respect to the lower surface 21 b of the support member 21 in a direction perpendicular to the tangent line 76.

  Further, in the head 20 of this example, the support member 21 rotates about the axis 62 perpendicular to the mask 110 as a rotation axis, so that a part of the plurality of linear members 28 of the sweep member 22 becomes the upper surface 110a of the mask 110. The sweep member 22 is used to move the conductive ball B on the mask 110 in the direction of the center of rotation. Therefore, in order for the sweep member 22 to smoothly rotate while contacting the surface 110 a of the mask 110, the sweep member 22 may be arranged so that the portion 26 a of the sweep member 22 that contacts the mask 110 is pulled by the support member 21. desirable. Therefore, the portion (base portion) 26 b where the plurality of linear members 28 are attached to the support member 21 and the portions 25 a and 25 b into which the plurality of linear members 28 are inserted contact the mask 110 of the plurality of linear members 28. It is necessary to have an initial gradient α with respect to the lower surface 21b of the support member 21 so as to be ahead of the portion 26a in the rotational direction.

  Therefore, the inner insertion hole 71 and the outer insertion hole 72 formed in the lower part of the support member 21 are respectively configured such that the bottom portions 71a and 72a are in the rotational direction, that is, forward in the rotational direction with respect to the open ends 71b and 72b. It is a hole located at. In this example, the rotation direction of the head 20 is counterclockwise when viewed from above (clockwise when viewed from below). Therefore, when viewed from below, the bottom portions 71a and 72a are more than the opening ends 71b and 72b. The plurality of inner insertion holes 71 and the plurality of outer insertion holes 72 are each inclined in a direction of 60 ° with respect to the lower surface 21b of the support member 21 so as to be located in the clockwise direction, that is, forward. It extends to.

  Further, the distance between the opening end 71b of the inner insertion hole 71 and the corresponding opening end 72b of the outer insertion hole 72 is set to be shorter than that of the sweep member 22, and the caulking portion 25a of the sweep member 22 and Each of the plurality of sweep members 22 is formed in a U shape on the lower side of the support member 21 and on the lower surface 21b of the support member 21 by inserting each of 25b into the inner insertion hole 71 and the corresponding outer insertion hole 72. It is mounted with an inclination. Further, since the inner insertion holes 71 and the outer insertion holes 72 are perforated at an equal pitch as described above, the plurality of sweep members 22 are formed on the mask 110 of the plurality of linear members 28 as a whole. It is attached to the lower part of the support member 21 at an equal pitch so that the contacting parts are radial.

  When the head 20 is attached to the filling device 10, the insertion holes 71 and 72 extend in a direction inclined with respect to the normal L of the upper surface 110 a of the mask 110. For this reason, the portion 26a of the plurality of linear members 28 that contacts the mask 110 is rearward with respect to the rotational direction than the portions (crimped portions) 25a and 25b into which the plurality of linear members 28 are inserted. Portions 26 appearing from the lower surface 21 b of the support member 21 of the plurality of linear members 28 are inclined with respect to the normal L of the upper surface 110 a of the mask 110.

  A disc-shaped (ring-shaped) second fixing fitting 23 b is attached to the lower surface 21 b of the support member 21 along the outer edge. A disc-shaped (ring-shaped) first fixing fitting 23a is also attached to the inside of the lower surface 21b. The first and second fixing brackets 23a and 23b are for preventing the sweep member 22 having both ends inserted into the insertion holes 71 and 72 from being inadvertently dropped from the support member 21. The first and second fixing fittings 23a and 23b are cut out at portions 23c and 23d corresponding to the inner insertion hole 71 and the outer insertion hole 72, respectively. Both ends (caulking portions) 25a and 25b of the 12 sets of the sweep members 22 are inserted into the insertion holes 71 and 72 through the notches 23c and 23d of the first and second fixing fittings 23a and 23b, respectively. Thereafter, the first and second fixing brackets 23 a and 23 b are slightly rotated, and the first and second fixing brackets 23 a and 23 b are fixed by the fixing screw 90. As a result, one end (caulking portion) 25a of the sweep member 22 is sandwiched between the notch portion 23c of the first fixing bracket 23a and the edge (opening end) 71b of the insertion hole 71, and is difficult to drop off. Become. Similarly, the other end (caulking portion) 25b of the sweep member 22 is sandwiched between the notch portion 23d of the second fixing bracket 23b and the edge (opening end) 72b of the insertion hole 72, and is difficult to fall off. Become.

  In the figure, reference numeral 90 denotes a screw for attaching the fixing brackets 23a and 23b, and reference numeral 91 denotes a screw hole. In order to prevent the sweep member 22 from falling off, ring-shaped seal members inserted into the insertion holes 71 and 72 may be used in place of the fixtures 23a and 23b or together with the fixtures 23a and 23b. In the insertion holes 71 and 72, both ends (caulking portions) 25a and 25b of the sweep member 22 are sandwiched between the seal members, so that it is difficult to drop off. Further, the linear member 28 constituting the sweep member 22 has elasticity, and both ends 25a and 25b are inserted into the insertion holes 71 and 72 so that the linear member 28 is distorted in a substantially U shape. Therefore, both ends 25a and 25b are strongly pressed against the hole side walls of the insertion holes 71 and 72 by the elastic force of the linear member 28 and the U-shaped shape. For this reason, even if both ends 25a and 25b are inserted into the insertion holes 71 and 72, a sufficient drop-off preventing effect can be obtained.

  The sweep member 22 only needs to be in contact with the upper surface 110a of the mask 110 relatively softly and can sweep up the conductive balls B on the upper surface 110a of the mask 110. Preferably, the sweep member 22 is provided with elasticity that does not scrape the conductive ball B once filled (inserted) into the opening 111 of the mask 110. In the sweep member 22 using the linear member 28, the force that the sweep member 22 applies to the mask 110 includes the elasticity of the linear member 28, the distance between the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110, and the initial gradient. It depends on factors such as α.

  In general, if the distance between the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110 is too wide, the force (pressure) by which the sweep member 22 presses the mask 110 is small, and the grounding (contact) area between the sweep member 22 and the mask 110 Is also not preferable. On the other hand, when the distance between the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110 is reduced, the grounding (contact) area between the sweep member 22 and the mask 110 is increased, which is preferable for collecting the conductive balls B. However, since the force (pressure) for pressing the mask 110 by the sweep member 22 becomes too large, there is a possibility that the distortion of the mask 110 becomes too large, or the conductive balls B once stored in the opening 111 of the mask 110 may be discharged. . By providing the sweep member 22 with the initial gradient α, the contact area of the sweep member 22 can be made sufficiently large, and further, the force (pressure) for pressing the mask 110 by the sweep member 22 can be prevented from becoming too large.

  When the initial gradient α of the sweep member 22 relative to the lower surface 21b of the support member 21 exceeds 80 °, the sweep member 22 damages the conductive ball B or scrapes the conductive ball B filled in the opening 111 of the mask 110. It becomes easy. On the other hand, when the initial gradient α of the sweep member 22 with respect to the lower surface 21b of the support member 21 is less than 10 °, the force by which the sweep member 22 pushes the mask 110 and the conductive ball B becomes too small. Becomes easy to leak.

  Accordingly, the initial gradient α of the sweep member 22 with respect to the lower surface 21b of the support member 21, that is, the inclination angle of the root portions 26b (appearing portions 26) of the plurality of linear members 28 with respect to the lower surface 21b of the support member 21 is 10 ° to 80 °. It is preferable that the angle is 10 ° to 80 ° with respect to the vertical direction (perpendicular to the lower surface 21b of the support member 21 and the rotation axis). More preferably, the inclination angle of the base portions 26b of the plurality of linear members 28 with respect to the lower surface 21b of the support member 21 is 40 ° to 70 ° (perpendicular (perpendicular to the lower surface 21b of the support member 21, the rotation axis). 20 ° to 50 °). In this example, the initial gradient α of the sweep member 22 with respect to the lower surface 21b of the support member 21 (the smaller inclination angle of the root portions 26b of the plurality of linear members 28 with respect to the lower surface 21b of the support member 21) is set to 60 °. ing.

  Furthermore, the initial gradient α prevents the portion 26a of the linear member 28 that contacts the mask 110 from spreading or becoming discrete. That is, according to the head 20, when the sweep member 22 is brought into contact with the mask 110, the contact portion 26a is in contact with the mask 110 in a state inclined at least at the initial gradient α. The side portion (side surface) of the linear member 28 contacts the mask 110. For this reason, even if the plurality of linear members 28 of the sweep member 22 are brought into contact with the mask 110 and a force is applied to the plurality of linear members 28 from the mask 110 in a vertically upward direction, the linear members 28 move toward the tip. It bends in a state where it is aligned in one direction so as to incline backward with respect to the rotation direction, and its tip is not easily spread or scattered.

  The plurality of linear members can avoid the tips from spreading or becoming discrete by bundling the tip sides (portions in contact with the mask). However, the portion of the linear member that is in contact with the mask is bundled by some means including a ring, an adhesive, and the like. For this reason, the means for bundling interferes with the mask and a gap is formed between the mask and the linear member, the flexibility of the portion where the linear member is bundled decreases, or the linear member spreads extremely. In other words, the conductive ball may be easily leaked backward due to being restrained.

  By setting the initial gradient α, the head 20 can prevent the portion (tip) 26a where the linear member 28 is in contact with the mask 110 from autonomously spreading or separating. This means becomes unnecessary. Therefore, at least the portion 26a where the linear member 28 and the mask 110 are in contact with each other is not bundled. For example, only both ends 25a and 25b of the linear member 28 may be caulked or bundled using an adhesive or the like. In the sweep member 22 using the linear member 28, leakage of the conductive ball B can be suppressed. In order to further suppress the spread of the distal end portion 26a of the linear member 28, the root portion 26b (the portion 26 appearing from the support member) of the linear member 28 may be constrained by an appropriate method.

  When each of the sweep members 22 is in contact with the upper surface 110a of the mask 110 and the support member 21 is rotated counterclockwise as viewed from above, the conductive balls B in the traveling direction (rotation direction) of the sweep member 22 are obtained. , Respectively, are pushed away in the direction of the center of rotation, that is, toward the inside of a virtual circle (moving area) A. In the head 20, a plurality of sweep members 22 are arranged in multiple in the rotating direction (traveling direction). For this reason, as the head 20 moves, the conductive balls B that protrude around the moving area A are successively collected in the direction of the moving area A that is the moving destination. Accordingly, the group Bg of conductive balls B made up of a plurality of conductive balls B can be held in the moving area A. That is, by using this head 20, the group Bg of conductive balls B can be held on a part of the upper surface 110 a of the mask 110.

  Then, by moving the head 20 by the moving device 40, the moving area A moves on the mask 110, and accordingly, the group of conductive balls B held in the moving area A also moves. The conductive balls B held in the moving area A are sequentially filled into the opening 111 when the moving area A passes through the opening 111.

  Further, when the head 20 is moved while collecting the conductive balls B in the moving area A by the rotation of the head 20, the region E1 where the conductive balls exist and the conductive balls do not exist in the moving area A. An area E2 exists. Furthermore, a portion (a portion where there is one conductive ball) E is formed at the boundary between the region E1 where the conductive ball exists and the region E2 where the conductive ball does not exist (see FIG. 9). In the portion E where the conductive balls become one layer, the conductive balls B are not necessarily spread all over the layer, and the conductive balls B may exist in a sparse and dense manner. Most of them do not overlap in multiple layers, and they are not stacked.

  The moving area A moves on the mask 110 together with the head 20 in a state where the conductive balls B are unevenly distributed. When the portion E where the conductive ball B becomes one layer passes through the opening 111 of the mask 110, the conductive ball B is most efficiently filled into the opening 111 of the mask 110. Then, the portion where the conductive ball B is consumed by filling is easily replenished with the ball B from the portion where the conductive ball B exists in a multilayered or laminated state. Since the head 20 of this example can form the portion E where the conductive ball B becomes one layer, the conductive ball B can be efficiently filled into the opening 111 of the mask 110.

  As described above, according to the head 20 of this embodiment and the ball filling apparatus 10 including the head 20, a part of the plurality of linear members 28 is brought into contact with the upper surface 110a of the mask 110, and the support member 21 is moved. By rotating the shaft 62 perpendicular to the mask 110 as the rotation axis, the conductive ball B can be moved on the mask 110 in the direction of the rotation center by the sweep member 22. Moreover, the plurality of linear members are arranged such that the portions 25a and 25b into which the plurality of linear members 28 are inserted are more forward than the portion 26a of the plurality of linear members 28 contacting the mask 110 in the rotational direction. The portion 26 (the root portion 26 b in this example) that appears from the lower surface 21 b of the 28 support members 21 has an initial gradient α with respect to the lower surface 21 b of the support member 21.

  In this example, the lower surface 21b of the support member 21 is a flat surface, and the lower surface 21b of the support member 21 and the upper surface 110a of the mask 110 face each other substantially in parallel. The portions 25a and 25b into which the plurality of linear members 28 are inserted are ahead of the portion 26a in contact with the mask 110 of the plurality of linear members 28 with respect to the rotation direction. A portion 26 that appears from the lower surface 21 b of the support member 21 is inclined with respect to the normal L of the upper surface 110 a of the mask 110. Therefore, when the sweep member 22 is brought into contact with the mask 110, the side portions (side surfaces) of the plurality of linear members 28 come into contact with the mask 110. For this reason, even if the plurality of linear members 28 of the sweep member 22 are brought into contact with the mask 110 and force is applied to the plurality of linear members 28 from the mask 110 in the vertically upward direction, the linear members 28 remain at the tip (this example). Then, as it goes to the central part (the part that contacts the mask 110, the part of the stomach) 26a), it bends in one direction so as to incline backward with respect to the rotation direction, and its tip is spread or scattered. hard.

  According to the head 20 of the present embodiment, and the ball filling apparatus 10 and the ball mounting apparatus 1 including the head 20, a plurality of support members 21 are arranged with a shaft (shaft) 62 perpendicular to the mask 110 as a rotation axis. By rotating the portion 26a of the linear member 28 in contact with the mask 110 so that the portion 25a and 25b into which the plurality of linear members 28 are inserted is located rearward with respect to the rotation direction, the sweep member 22 is moved to the mask 110. The conductive ball B can be moved while being pushed away in the direction of the center of rotation with little or almost no backward leakage. For this reason, it is possible to suppress the conductive balls B from freely spreading on the upper surface 110a of the mask 110, and it is possible to hold the group Bg of the conductive balls B in a limited region (moving area) A inside the head 20. Therefore, by moving the head 20 in a state where the group of the conductive balls B is held in the moving area A, the conductive balls B can be efficiently formed with respect to the opening 111 of the mask 110 where the moving area A passes. Can be filled.

  In this example, a plurality of sweep members 22 are inserted in the lower portion of the support member 21 so as to be radially arranged in a multiple manner. By rotating the head 20 having a plurality of sweep members 22, a force can be efficiently applied in the direction of the moving area A to the conductive balls B around the entire moving area A. The moving speed of the area A can be improved. Further, in this example, the end of the sweep member 22 is caulked, and the caulked portions 25a and 25b are inserted into the lower portion of the support member 21, so that the sweep member 22 can be easily attached to the support member 21. Further, the sweep member 22 is detachable from the support member 21 and can be easily replaced. Furthermore, since the fixing brackets 23a and 23b are attached to the support member 21, the sweep member 22 is unlikely to fall off carelessly. Further, since the fixing brackets 23 a and 23 b are screwed to the support member 21, it is possible to easily shift to a state where the sweep member 22 can be released. Therefore, also in this respect, the above-described head 20 is easy to replace the sweep member 22.

  In this example, a plurality of insertion holes 71 and 72 for inserting the bundled ends 25 a and 25 b of the plurality of sweep members 22 into the lower portion of the support member 21 are inclined with respect to the lower surface 21 b of the support member 21. It is opened so as to extend in the opposite direction. Therefore, the desired initial gradient α can be obtained with respect to the lower surface 21b of the support member 21 of the sweep member 22 simply by inserting the bundled ends 25a and 25b of the sweep member 22 into the insertion holes 71 and 72.

  A plurality of inner insertion holes 71 and a plurality of outer insertion holes 72 for inserting the bundled ends 25a and 25b of the plurality of sweep members 22, respectively, extend in a direction inclined with respect to the lower surface 21b of the support member 21, And the opening end is arrange | positioned concentrically around the rotating shaft. In this example, the sweep member 22 longer than the distance between the opening end 71b of the inner insertion hole 71 and the corresponding opening end 72b of the outer insertion hole 72 is employed. In this way, the sweep member 22 can be moved under the support member 21 only by inserting each of the bundled ends 25a and 25b of the sweep member 22 into the inner insertion hole 71 and the corresponding outer insertion hole 72. The U-shaped side is attached to the lower surface 21b of the support member 21 while being inclined.

  In this way, in the head 20 attached to the support member 21 so as to be U-shaped on the lower side of the support member 21 using the sweep member 22 in which both ends are bundled, the central portion (belly portion) 26a is a mask. The conductive ball B is pushed away by contact with 110. The bundled ends 25 a and 25 b are inclined with respect to the lower surface 21 b of the support member 21, and a plurality of sweep members 22 are inserted into the support member 21 so as to be U-shaped below the support member 21. The head 20 is a preferred example of the present invention. The head 20 is not limited to this example. The number of the sweep members 22 is arbitrary and is not limited to 12 sets.

  FIG. 10 schematically shows a usage state of the head 20 according to the second embodiment. In the head 20, the bundled ends (caulked portions) 25 a and 25 b (only the end 25 a are shown in FIG. 10) are bent to a desired angle and the support member 21 can be vertically opened. Ends 25a and 25b that are folded and bundled are inserted into the insertion holes 71 and 72 (only the hole 71 is shown in FIG. 10). Even with such a configuration, the portion 26 that emerges from the lower surface 21 b of the support member 21 of the sweep member 22, more specifically, the root portion 26 b can be inclined with respect to the lower surface 21 b of the support member 21. A gradient α can be obtained. Since other configurations are the same, overlapping description is omitted by attaching the same reference numerals to the drawings.

  FIG. 11 is a side view showing the head 20 according to the third embodiment. FIG. 12 shows the head 20 of FIG. 11 in a bottom view. FIG. 13 shows a support member 21 included in the head 20 of FIG. 11 in a bottom view. FIG. 14 is shown cut along line XIV-XIV in FIG.

  The head 20 includes six sets of sweep members 22. This is suitable for realizing a relatively small head (a head having a narrow moving area A). In addition, since the other structure is the same, the overlapping description attaches | subjects the same code | symbol to drawing and abbreviate | omits it.

  FIG. 15 is a bottom view of the head 20 according to the fourth embodiment. FIG. 16 schematically shows a usage state of the head 20 of FIG.

  The head 20 employs a sweep member 22 in which one end 25 of a plurality of linear members 28 is bundled into a brush shape. The head 20 includes six sets of brush-like sweep members 22. In the support member 21, elongated insertion holes 80 extending in a direction inclined with respect to the lower surface 21 b of the support member 21 are formed radially. The bundled one end 25 of the linear member 28 becomes an insertion portion of the sweep member 22 and is inserted into the radial insertion hole 80 of the support member 21, and the sweep member 22 is radially attached to the lower surface 21 b of the support member 21. An O-ring-shaped seal member 81 is inserted into the insertion hole 80. When the insertion portion 25 is inserted into the insertion hole 80, a seal member 81 is provided between the insertion hole 80 and the insertion portion 25. The sweep member 22 is not inadvertently dropped from the support member 21. In addition, since the other structure is the same, the overlapping description attaches | subjects the same code | symbol to drawing and abbreviate | omits it.

  Although several examples of the head 20 have been described above, the structure and shape of the head 20 are not limited to these. For example, the support member 21 is not limited to a disk-shaped member. The support member 21 may be a polygonal member. Further, the upper surface and the lower surface of the support member 21 are not necessarily flat. By tilting at least a part of the lower surface 21b of the support member 21 and inserting the sweep member 22 so as to be orthogonal to the surface of the inclined portion, the support member 21 is not inserted into the support member 21 so as to be inclined with respect to the lower surface 21b. However, the portion 26 that appears from the lower surface 21 b of the support member 21 of the plurality of linear members 28 can be inclined with respect to the normal L of the upper surface 110 a of the mask 110.

  When the sweep member 22 is brought into contact with the mask 110 by inclining the portions 26 appearing from the lower surface 21b of the support member 21 of the plurality of linear members 28 with respect to the normal L of the upper surface 110a of the mask 110, a plurality of The side portion (side surface) of the linear member 28 can be brought into contact with the mask 110. In this case, even if a force is applied vertically upward from the mask 110 to the plurality of linear members 28, the linear members 28 are inclined so as to incline backward with respect to the rotation direction toward the tip (mask 110 side). Since the tip is difficult to spread or scatter in a state where it is aligned in the direction, the conductive ball B is placed on the mask 110 with little or almost no leakage to the rear, It can be moved while pushing away in the direction.

The top view which shows an example of a ball mounting apparatus. The figure which shows an example of a hole filling apparatus typically. The figure which looked at the head concerning a 1st embodiment from the slanting upper part. The side view which shows the head of FIG. FIG. 4 is a bottom view showing the head of FIG. 3. The figure which shows typically the sweep member applicable to the head of FIG. The bottom view of the support member which the head of FIG. 3 has. Sectional drawing cut | disconnected and shown along the VIII-VIII line in FIG. The figure which shows the use condition of the head of FIG. 3 typically. The figure which shows typically the use condition of the head concerning 2nd Embodiment. The side view which shows the head concerning 3rd Embodiment. The bottom view which shows the head of FIG. The bottom view of the support member which the head of FIG. 11 has. Sectional drawing cut | disconnected and shown along the XIV-XIV line | wire in FIG. The bottom view which shows the head concerning 4th Embodiment. The figure which shows the use condition of the head of FIG. 15 typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ball filling apparatus 20,20a, 20b Head 21 Support member, 21b Lower surface of support member, 22 Sweep member 25, 25a, 25b Inserted part (bundled end)
26 part appearing, 26a part contacting the mask 40 moving device (head moving means)
71 Inside insertion hole, 71b Inside insertion hole opening end 72 Outside insertion hole, 72b Outside insertion hole opening end 75 Virtual circle, 76 Tangent

Claims (6)

A support member, and a plurality of sweep members partially inserted into the lower portion of the support member,
Each of the plurality of sweep members is formed by bundling both ends of a plurality of linear members, and a plurality of openings for arranging a part of the plurality of linear members at a predetermined position of the workpiece. And the support member rotates about an axis perpendicular to the mask as a rotation axis, so that the sweep member moves the conductive ball in the direction of the rotation center on the mask. A head to be
A plurality of insertion holes for respectively inserting the bundled ends of the plurality of sweep members are provided in the lower part of the support member, and the plurality of insertion holes are inclined with respect to the lower surface of the support member The distance between the opening end of the inner insertion hole and the corresponding opening end of the outer insertion hole is shorter than that of the sweep member, and each of the bundled ends of the sweep member is connected to the inner end of the sweep member. When the insertion hole and the corresponding outer insertion hole are inserted, the parts including the bundled both ends of the sweep member are respectively inserted into the support member so as to be inclined with respect to the lower surface of the support member, and the sweep member is mounted inclined with respect to the lower surface of the support member in a U-shape on the lower side of the support member, the plurality of linear members, said support Portions emerging from the lower surface facing the upper surface of the mask bets member has an initial slope to the lower surface of the support member, the head. In claim 1, the center of the open end of the inner insertion hole, and the center of the open end of the outer insertion holes corresponding thereto, respectively, the virtual inner than the center of the open end of the inner insertion hole Located on the tangent of the circle,
The inner insertion hole and the outer insertion hole corresponding to the inner insertion hole are inclined with respect to the lower surface of the support member in a direction perpendicular to the tangent. In claim 1, a plurality of linear members of the plurality of sweep member, said the both ends bundled, parts in contact with the mask of the plurality of linear members so as to radially of said support member The head that is inserted at the bottom. In any one of claims 1 to 3, the initial slope with respect to the lower surface of the support member of the sweep member is 10 ° to 80 °, the head. In any one of claims 1 to 4, wherein the sweep member is inserted into the detachable to the support member, the head. A device that fills the plurality of openings with conductive balls in a state where a mask having a plurality of openings for disposing the conductive balls at predetermined positions of the work is set on the work,
A head according to any one of claims 1 to 5 ;
Means for rotating the support member of the head;
And a head moving means for moving the head.

Images