JP4941203B2 - Mounting structure, inspection method for mounting structure, and electro-optical device - Google Patents

Description

  The present invention relates to a mounting structure in which an electronic component such as an IC (Integrated Circuit) is mounted on a substrate, and a method for inspecting the mounting structure. The present invention also relates to an electro-optical device configured using the mounting structure.

  In a mounting structure that mounts electronic components such as ICs on a substrate, the electronic components are mounted on the substrate using a bonding member such as a so-called COG (Chip On Glass) method or COF (Chip On Film) method. is doing. As a method of mounting an electronic component on a substrate, a method of bonding the electronic component and the substrate using an ACF (Anisotropic Conductive Film) that is a bonding member is known. In this method, a protruding terminal (hereinafter referred to as a bump) serving as an input terminal or output terminal of an electronic component is formed on a substrate via conductive particles randomly arranged in the ACF. Conductive connection is made to the side terminal.

  As another method for mounting an electronic component on a substrate, a method of connecting the electronic component and the substrate using an NCF (Non Conductive Film) is known. In this method, bumps that can be elastically deformed are provided on an electronic component, and the electronic component is bonded to the substrate under an appropriate pressing force (hereinafter also referred to as pressure contact), thereby deforming the bumps so that the substrate side terminal Contact. In this way, the bump and the substrate side terminal are directly connected.

  Whether or not the mounting of the electronic component and the substrate is normal is greatly influenced by the contact state between the bump of the electronic component and the substrate-side terminal. For this reason, there is a case in which the contact state between the bumps of the electronic component and the board-side terminal is inspected by a human by visually confirming the contact portion using a microscope. In this case, confirmation is performed based on a judgment criterion prepared in advance. However, when confirming with human eyes, it is necessary for the operator to have skill. In particular, in the connection method using ACF, the number of conductive particles in the region of the substrate-side terminal, the distribution state, the collapsed shape, and the like are determined based on the determination criteria. is there.

  Therefore, conventionally, a mounting structure inspection apparatus including a camera or the like having an advanced function is known (see, for example, Patent Documents 1 to 5). The inspection apparatuses disclosed in these Patent Documents 1 to 5 include a camera, a differential interference microscope, a computer that controls them, and the like, and use them to determine the mounting state of the electronic component.

JP 2003-269934 A (pages 6-7, FIG. 4) JP 2007-53207 A (pages 5-6, FIG. 1) Japanese Patent Laying-Open No. 2005-227217 (5th page, FIG. 2) JP 2006-186179 A (6th page, FIG. 1) Japanese Patent Laying-Open No. 2006-266804 (pages 5-6, FIG. 1)

  However, the inspection apparatuses disclosed in Patent Documents 1 to 5 have very expensive components such as a camera, and if the inspection of the mounting state is performed using the inspection apparatus, the cost for the inspection increases. To do. If the inspection process using the inspection apparatus is incorporated in the manufacturing process of the mounting structure, there is a problem that the cost of the entire manufacturing process of the mounting structure increases.

  By the way, in the method of mounting the electronic component provided with the elastically deformable bump on the substrate using the NCF, whether the mounting state is good or bad is determined by the deformation of the bump of the electronic component in the state where the electronic component is mounted. It is possible to determine based on the quantity. For example, if the bump of the electronic component is elastically deformed by a predetermined deformation amount, the contact area between the bump and the board side terminal is sufficiently secured, and it is determined that the contact state is appropriate. be able to. A camera is required when inspecting a mounting structure manufactured by an adhesion method using ACF, but according to this determination method based on the deformation amount of bumps, an expensive apparatus such as a camera is not used. However, the contact state can be confirmed by human eyes. However, even in this case, a simple and clear determination criterion is necessary so as not to depend on the skill level of the operator.

  The present invention has been made in view of the above problems, and in a configuration in which the terminal of the electronic component is elastically deformed and the electronic component is mounted on the substrate, the contact between the terminal of the electronic component and the terminal of the substrate It is an object of the present invention to provide a mounting structure whose state can be easily confirmed visually, an inspection method for the mounting structure, and an electro-optical device including the mounting structure.

A mounting structure according to the present invention is a mounting structure having a light-transmitting substrate and an electronic component mounted on a mounting surface of the light-transmitting substrate via a bonding member, the light-transmitting substrate. A plurality of board-side terminals are provided on a surface on which the electronic component is mounted, and the electronic component includes a plurality of protruding terminals including an elastic protrusion on the surface on which the light-transmitting substrate is mounted. , Having at least one pair of first and second protrusions having elasticity, and each of the first and second protrusions comes into contact with the mounting surface of the translucent substrate and elastically deforms. The contact surface of the first protrusion has a long side in either the vertical direction or the horizontal direction, and the contact surface of the second protrusion corresponds to the vertical protrusion corresponding to the first protrusion. It has a width in the direction and the horizontal direction, and is different from the width in the vertical direction or the horizontal direction, which is the long side of the contact surface of the first protrusion. The direction or lateral width and long sides, or longitudinal and transverse width as long Satoshi the contact surface of the contact surface and the second projection of the first projection, through the transparent substrate Based on the difference in shape between the contact surface of the first protrusion and the contact surface of the second protrusion, the contact state between the plurality of protrusion-shaped terminals and the substrate-side terminal that individually contacts them can be observed. It can be inspected .

  The electronic component constituting the mounting structure is an electronic component having a so-called resin core bump, a bump formed by forming a conductive film on the surface of a protrusion that is a core formed of resin. In the electronic component of the present invention, the protrusion that is a constituent element of the protruding terminal may be formed in an individual island shape corresponding to one protruding terminal, or between the plurality of protruding terminals. In some cases, it is formed into a connected integral shape. Even when formed in a shape connected between a plurality of protruding terminals, a conductive film is formed in an island shape in a part of the protruding body to constitute one protruding terminal.

  In this electronic component, the conductive film provided on the elastic protrusion is extended and connected to, for example, an electrode conductively connected to the inside of the electronic component, so that the conductive film is connected to an electronic element or the like inside the electronic component. Conductive connection. That is, the inside of the electronic component and the substrate-side terminal of the translucent substrate on which the electronic component is mounted are conductively connected through the conductive film of the protruding terminal.

  An electronic component is mounted on a translucent board | substrate using a joining member in the state which the electrically conductive film and the board | substrate side terminal contacted directly. In the mounting structure using the electronic component having the above configuration, since the conductive film and the substrate-side terminal can be conductively connected without using conductive particles, the conductive film and the substrate-side terminal are adjacent to each other or between the adjacent substrate-side terminals. There is no intervening conductive particles, and therefore no short circuit occurs between these terminals. In addition, even if the conductive connection part is separated due to the usage environment after mounting the electronic component on the board, the protrusion is elastically deformed accordingly, so that the restoring force causes the conductive film on the protrusion and the board-side terminal. Contact failure is not caused and contact failure does not occur.

  In the mounting structure in which the electronic component having the above configuration is mounted on the mounting surface of the translucent substrate, the contact surface of the first protrusion has a long side in either the vertical direction or the horizontal direction, and the contact of the second protrusion The surface has a long side having a width in a direction different from the long side of the contact surface of the first protrusion, or has the same length in the vertical and horizontal directions. Specific embodiments of the contact surface in the mounting structure of the present invention are as follows (1) to (4). (1) The contact surface of the first protrusion has a long side in the vertical direction, and the contact surface of the second protrusion has a long side in the horizontal direction. (2) The contact surface of the first protrusion has a long side in the horizontal direction, and the contact surface of the second protrusion has a long side in the vertical direction. (3) The contact surface of the first protrusion has a long side in the vertical direction, and the contact surface of the second protrusion has the same length in the vertical direction and in the horizontal direction. (4) The contact surface of the first protrusion has a long side in the horizontal direction, and the contact surface of the second protrusion has the same length in the vertical direction and in the horizontal direction.

  In addition, as the shape of the contact surface having the above configuration, for example, a square shape, a rectangular shape, a shape having a pair of curved sides (so-called barrel shape), a circular shape, an elliptical shape, or the like can be considered. The width of the contact surface is a portion along the predetermined direction of the contact surface. For example, if the contact surface is square or rectangular, the sides in the vertical and horizontal directions are the width of the contact surface. If the contact surface is barrel-shaped, the width of the contact surface is a portion along the direction in which the curved side extends and a portion perpendicular to the direction in which the curved side extends. If the contact surface is circular or elliptical, the vertical and horizontal diameter portions are the width of the contact surface.

  According to the mounting structure according to the present invention, the first protrusion and the second protrusion are provided on the surface of the electronic component to be mounted on the light-transmitting substrate. It is possible to inspect the contact state between the protruding terminals and the board-side terminals that individually contact them. The first protrusion and the second protrusion are in contact with the translucent substrate to form a contact surface. The contact surface can be observed through the translucent substrate from the opposite side of the translucent substrate where the electronic component is mounted. If the contact surface observed at this time is the relationship shown in (1) to (4) of the specific modes of the contact surface, the contact state between the protruding terminal and the substrate-side terminal is appropriate. By observing the contact surface through the light-transmitting substrate in this way, it is possible to easily and clearly determine whether or not the contact state between the protruding terminal and the substrate-side terminal is good by human eyes. As a result, the cost required for the inspection can be remarkably reduced as compared with the case where the inspection is performed using an inspection apparatus equipped with an advanced camera or the like, and as a result, the cost of the entire process for mounting the electronic components can be kept low.

  Further, in the mounting structure according to the present invention, the first protrusion and the second protrusion include an elastic protrusion and an island-shaped metal film provided on the protrusion, and the contact surface The metal film of the first protrusion or the metal film of the second protrusion is formed on the surface of the metal film by contacting the light-transmitting substrate. In the electronic component constituting the mounting structure of the present invention, the first protrusion and the second protrusion each contact the mounting surface of the translucent substrate and elastically deform to form a contact surface. The amount of elastic deformation differs between the first protrusion and the second protrusion due to a change in pressure during mounting of the electronic component, and the contact length of the contact surface changes depending on the difference in the amount of deformation. The metal film of the first protrusion and the metal film of the second protrusion have a width in a direction perpendicular to the direction in which the contact length of the contact surface changes (for example, the vertical direction). Are preferably different from each other. If a metal film is provided on the protrusions of the first protrusion and the second protrusion, light can be reflected from these metal films. As a result, when the contact surface of each protrusion is visually observed with a human eye using, for example, a microscope, the contact surface appears to be a glossy surface, so the contact surface is clearly observed as compared with the case where there is no metal film. be able to.

  In the aspect of the present invention, the protrusions constituting the first protrusion and the second protrusion can have the same shape, the same size, and the same material as the protrusions forming the protrusion-like terminal. Then, the metal film formed on the protrusion is formed in an island shape like the conductive film provided on the protrusion of the protrusion terminal. However, at least one of the metal film of the first protrusion or the metal film of the second protrusion has a width in a direction perpendicular to the direction in which the length of the contact surface changes, unlike the conductive film of the protruding terminal. Yes. That is, the first protrusion and the second protrusion can have substantially the same configuration as the protruding terminals except for their widths. By doing so, the inspection can be performed in substantially the same state as the contact state between the conductive film of the protruding terminal, which is an actual conductive connection portion, and the counterpart, that is, the translucent substrate. Note that the protrusions of the protrusions can be formed separately from the protrusions of the protruding terminals, or can be formed as a part of the protrusions of the semiconductor terminals.

  Next, in the mounting structure according to the present invention, it is desirable that at least one of the first protrusion and the second protrusion constitute a terminal. In the aspect of the present invention, at least one metal film of the first protrusion and the second protrusion is formed using the same material as the conductive film of the protruding terminal, and further includes an electrode that is conductively connected inside the electronic component. Thus, it can be conductively connected to an electronic element or the like inside the electronic component. If it carries out like this, at least one of a 1st protrusion and a 2nd protrusion can have a function as an electrical terminal. That is, the first protrusion and the second protrusion can be used as a protruding terminal for driving an electronic component. The metal film of the first protrusion and the second protrusion can be formed in a state where the metal film is not conductively connected to an element or the like inside the electronic component, that is, the metal film is electrically independent. The first protrusion and the second protrusion of this configuration are exclusively used for inspecting the contact state between the protruding terminal and the counterpart.

  Next, in the mounting structure according to the present invention in which at least one of the first protrusion and the second protrusion is a terminal, at least one of the first protrusion and the second protrusion formed as a terminal is transparent. It is desirable to be connected to a substrate-side terminal formed of a light material. In the aspect of the present invention, the substrate-side terminal of the translucent substrate is formed using a translucent member. And at least one of the 1st protrusion and the 2nd protrusion contacts the board | substrate side terminal which consists of the translucent member, and forms a contact surface. In this way, if each protrusion is brought into contact with the board-side terminal formed using the translucent member, it is actually compared to the case where each protrusion is brought into contact with the other part of the translucent substrate. Inspection can be performed in a state closer to the contact state between the protruding terminal, which is the conductive connection portion, and the substrate-side terminal. The translucent member constituting the substrate side terminal can be formed using, for example, ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) which is a conductive material. .

The translucent member that contacts the first and second protrusions is functionally a terminal (that is, a member that is used for electrical connection) even if the shape thereof is the same as that of the board-side terminal. ), It can also be provided as a so-called dummy terminal. In this case, the translucent member can be formed using, for example, SiO ₂ or SiN which is a non-conductive material. In this case, the translucent member has the same shape as the substrate-side terminal and is exclusively used for inspecting the contact state between the conductive film and the substrate-side terminal.

  According to the aspect of the present invention, at least one of the first protrusion and the second protrusion is in contact with the translucent member to form a contact surface. The contact surface can be observed through the translucent substrate and the translucent member from the opposite side of the translucent substrate on which the electronic component is mounted. Therefore, by inspecting the contact state between the conductive film and the substrate-side terminal based on the relative shape difference between the contact surface of the first protrusion and the contact surface of the second protrusion, the conductive film and the substrate side Whether the contact state with the terminal is good or bad can be easily and clearly determined by human eyes.

  Next, in the mounting structure according to the present invention, the plurality of protruding terminals are arranged in a line along one side of the active surface which is a surface mounted on the light-transmitting substrate, and the first It is desirable that the protrusion and the second protrusion are provided adjacent to each other in a row formed by the plurality of protruding terminals. The electronic component according to the aspect of the present invention has a configuration in which one terminal row is provided along the edge of the active surface. In the electronic component having this configuration, one terminal row can be provided on each of two sides facing each other. If it carries out like this, one terminal row | line | column can be used as the input terminal of an electronic component, and the other terminal row | line | column can be used as the output terminal of an electronic component.

  In the aspect of the present invention, the first protrusion and the second protrusion having different widths are arranged adjacent to each other. In this way, for example, when the first protrusion and the second protrusion are observed with a microscope, the inspection protrusions can be accommodated in a region that fits in one field of view of the microscope. The relative relationship between the portion and the second protrusion can be observed within one and the same field of view. Further, by providing the first protrusion and the second protrusion adjacent to each other in the row formed by the plurality of protruding terminals, the conductive film and the substrate with respect to the plurality of protruding terminals provided in the row. The contact state with the side terminal can be inspected indirectly.

  Next, in the electronic component according to the present invention, the plurality of protruding terminals are arranged in parallel to each other along one side of the active surface, and the first protrusion includes the plurality of protruding terminals. Arranged in one row to be formed, the second protrusion is arranged in another row formed by the plurality of protruding terminals, and the first protrusion and the second protrusion are arranged adjacent to each other. It is desirable that

  The electronic component according to the aspect of the present invention has a configuration in which a plurality of terminal rows are provided along one end side of the active surface. In the electronic component having this configuration, a plurality of terminal rows can be provided on each of two opposite sides. In this way, the terminal row along one side can be used as an input terminal for the electronic component, and the terminal row along the other side can be used as an output terminal for the electronic component. Further, if a plurality of terminal rows are provided along one side of the active surface, the area of the active surface is not changed as compared with a case where one row of terminal rows is provided along one side of the active surface ( That is, the number of protruding terminals can be increased without increasing the size of the electronic component. By increasing the number of protruding terminals, it is possible to increase the number of counterpart terminals on which electronic components are mounted. As a result, the number of wires extending from a plurality of counterpart terminals can be increased. Thereby, for example, when an electronic component is used as a driving IC for a liquid crystal display device or the like, it can contribute to high definition of the display of the liquid crystal display device or the like. In addition, when the number of wirings increases, the distance (so-called wiring pitch) between those wirings becomes narrow.

  In the aspect of the present invention, the first protrusion and the second protrusion having different widths are arranged adjacent to each other. In this way, for example, the first protrusion and the second protrusion having different widths can be accommodated in a region that fits within one field of view of the microscope when observed with a microscope during inspection. The relative relationship between the portion and the second protrusion can be observed within one and the same field of view. Further, the first protrusion is provided in one row formed by the plurality of protruding terminals, and the second protrusion is provided in the other row. Thereby, it can test | inspect indirectly about the contact state of a electrically conductive film and a board | substrate side terminal regarding the some protruding terminal provided in those several rows | lines. In addition, since the distance between one terminal row and the other terminal row is generally wider than the distance between the terminals in one terminal row, the first protrusion and the second protrusion are adjacent in the same row. As compared with the above, it is possible to widen the interval between adjacent inspection projections. Therefore, it becomes easy to see the relative relationship when visually inspecting the inspection projection.

  Next, in the mounting structure according to the present invention, the active surface of the electronic component is rectangular, and the first protrusion and the second protrusion are adjacent to each other in the vicinity of at least two corners of the active surface. It is desirable to be provided. If it carries out like this, since one set of protrusions including the 1st protrusion and the 2nd protrusion can be provided in a plurality of places on an active surface, the contact surface of the 1st protrusion and the 2nd protrusion in those multiple places The contact surface can be observed. Therefore, the accuracy of the inspection is improved as compared with the case where the first protrusion and the second protrusion are provided at one place on the active surface. Further, a pair of inspection protrusions including the first protrusion and the second protrusion is provided in the vicinity of at least two corners of the active surface. In this way, the contact surface can be observed at a pair of protrusions located at positions apart from each other on the active surface, so the deformation state of the plurality of protruding terminals provided between them is indirectly inspected. be able to.

  Next, in the mounting structure according to the present invention, the cross section of the protrusion along the direction (for example, the vertical direction) in which the contact length of the contact surface changes is in a state where the protrusion is not elastically deformed. The electronic component can have a shape in which the width gradually decreases from the bottom portion which is the active surface side portion to the top portion which is the translucent substrate side portion. Thereby, when the 1st protrusion and the 2nd protrusion are pushed planarly, the state of changing the contact length of the contact surface formed in the surface of those protrusions corresponding to the strength of pressing force Can be realized. As such a cross-sectional shape, for example, a semicircular shape having a curve from the bottom to the top, a semi-elliptical shape, a semi-elliptical shape, or a polygonal shape having a linear inclination can be considered. As for the 1st protrusion and the 2nd protrusion which have the projection body in which the cross-sectional shape was formed in either of these shapes, the shape of the contact surface is a square shape or a rectangular shape (hereinafter referred to as a rectangular shape) in plan view. Is). The square shape or the rectangular shape of the contact surface here includes a shape close to a square shape or a rectangular shape. For example, a case where a square or rectangular corner is rounded, a part of a square or rectangular edge is missing, or the edge is slightly bent is included.

Next, a mounting structure inspection method according to the present invention includes a translucent substrate and an electronic component mounted on the mounting surface of the translucent substrate via a bonding member. A plurality of board-side terminals are provided on a surface of the translucent substrate on which the electronic component is mounted, and the electronic component has an elastic protrusion on the surface on which the translucent substrate is mounted. A plurality of projecting terminals including a body and at least one pair of first and second protrusions having elasticity, each of the first and second protrusions being the translucent substrate A contact surface is formed in contact with the mounting surface, the contact surface changes in contact length due to a change in pressure during mounting of the electronic component, the first protrusion and the second protrusion, are different width perpendicular to each other with respect to the direction in which the contact length is changed, the first through the transmissive substrate By observing the contact surface of the second projection and the contact surface parts, based on the difference in shape of the contact surface of the contact surface and the second projection of the first projection, wherein the plurality of projecting terminal And inspecting the contact state with the board-side terminals that individually contact them.

  According to the mounting structure inspection method of the present invention, the first protrusion and the second protrusion are provided on the surface of the electronic component that is to be mounted on the light-transmitting substrate. Can be used to inspect the contact state between the plurality of protruding terminals and the board-side terminals that individually contact them. The first protrusion and the second protrusion are in contact with the translucent substrate to form a contact surface. The contact surface can be observed through the translucent substrate from the opposite side of the translucent substrate where the electronic component is mounted. Since the first protrusion and the second protrusion have mutually different widths in the direction perpendicular to the direction in which the contact length of the contact surface changes, the shape of the contact surface is different between the protrusions. Based on the difference in relative shape between the contact surface of the first protrusion and the contact surface of the second protrusion, the contact state between the protrusion terminal and the substrate side terminal is inspected, thereby Whether the contact state with the terminal is good or bad can be easily and clearly determined by human eyes. As a result, the cost required for the inspection can be significantly reduced as compared with the case where the inspection is performed using an inspection apparatus equipped with an advanced camera or the like, and as a result, the cost of the entire mounting process can be kept low.

  Next, in the inspection method of the mounting structure according to the present invention, the contact surfaces of the first protrusion and the second protrusion have corresponding vertical and horizontal widths, respectively, and the contact of the first protrusion The surface is a contact surface having a longer side in either the vertical direction or the horizontal direction, and the contact surface of the second protrusion is a vertical or horizontal width that is the long side of the first protrusion. It is desirable to inspect based on whether the contact surface has a longitudinal or lateral width different from that of the contact surface having the longer side, or the contact surface having the same length in the longitudinal and lateral directions.

  According to the inspection method of the mounting structure according to the present invention, the contact surface observed through the translucent substrate from the side opposite to the side where the electronic component is mounted in the translucent substrate is the above-described contact surface. If it is the relationship shown to (1)-(4) of the specific aspect of this, the contact state of a protruding terminal and a board | substrate side terminal can be determined to be appropriate. By observing the contact surface through the light-transmitting substrate in this way, it is possible to easily and clearly determine whether or not the contact state between the protruding terminal and the substrate-side terminal is good by human eyes. As a result, the cost required for the inspection can be remarkably reduced as compared with the case where the inspection is performed using an inspection apparatus equipped with an advanced camera or the like, and as a result, the cost of the entire process for mounting the electronic components can be kept low.

  Moreover, in the mounting structure inspection method according to the present invention, the board-side terminal can be formed using a translucent member, and the first protrusion and the second can be brought into contact with the translucent member. By doing so, the inspection is performed in a state closer to the contact state between the conductive film which is the actual conductive connection portion and the substrate-side terminal, as compared with the case where the first protrusion and the second protrusion are brought into contact with the translucent substrate. be able to.

  Next, in the inspection method for each mounting structure according to the present invention, the contact surface has a square shape or a rectangular shape in plan view, and a direction perpendicular to a direction in which the contact length changes (for example, a vertical direction) ( For example, the width of the first protrusion in the lateral direction is set to the minimum allowable length of the contact length, and the width of the second protrusion in the direction perpendicular to the direction in which the contact length changes is The plurality of protrusions are set based on the relative relationship among the width of the first protrusion, the width of the second protrusion, and the contact length. It is desirable to inspect the contact state between the terminals and the board-side terminals that are individually in contact with them. In the following description, the width of the first protrusion in the direction perpendicular to the direction in which the contact length changes may be simply referred to as the width of the first protrusion. On the other hand, the width of the second protrusion perpendicular to the direction in which the contact length changes may be simply referred to as the width of the second protrusion.

  In the aspect of the present invention, the width of the first protrusion is set to the allowable minimum length of the contact length, and the width of the second protrusion is set to the allowable maximum length of the contact length. And the quality determination of the contact state of a electrically conductive film and a board | substrate side terminal can be performed based on the relative relationship between the width | variety of a 1st protrusion, the width | variety of a 2nd protrusion, and the contact length of a contact surface. .

  As described above, in the mounting structure inspection method, the width of the first protrusion is set to the minimum length of the contact length, and the width of the second protrusion is set to the maximum length of the contact length. As typical determination criteria, the following aspects (a) to (e) may be considered.

(A) When the width of the first protrusion is W1, the width of the second protrusion is W2, and the contact length of the contact surface is L,
L> W1
And
L ≦ W2
Therefore, it is possible to determine that the mounting state of the electronic component is normal.

(B) When the width of the first protrusion is W1, the width of the second protrusion is W2, and the contact length of the contact surface is L,
L ≧ W1
And
L <W2
Therefore, it is possible to determine that the mounting state of the electronic component is normal.

  (C) When the direction of the long side of the contact surface of the first protrusion is different from the direction of the long side of the contact surface of the second protrusion, the mounting state of the electronic component can be determined to be normal.

  (D) When the direction of the long side of the contact surface of the first protrusion is the same as the direction of the long side of the contact surface of the second protrusion, the mounting state of the electronic component can be determined to be defective.

  (E) When one of the contact surface of the first protrusion and the contact surface of the second protrusion is a square, the electronic component mounting state can be determined to be normal. That is, when the contact length of the contact surface is the minimum allowable length or the maximum allowable length, the electronic component mounting state is determined to be normal. Can do.

  Even when any of the above criteria (a) to (e) is used, the difference in relative shape between the contact surface of the first protrusion and the contact surface of the second protrusion is visually observed by human eyes. By simply performing the observation, it is possible to easily and clearly determine whether or not the contact state between the conductive film and the substrate-side terminal is good.

  Next, an electro-optical device according to the invention includes the mounting structure having the above-described configuration. According to the mounting structure according to the present invention, the first protrusion and the second protrusion are provided on the surface of the electronic component that is to be mounted on the light-transmitting substrate, and these protrusions are formed at the time of mounting. Based on the difference in the relative shape of the contact surface, the quality of the contact state between the protruding terminal and the board-side terminal can be determined easily and clearly by human eyes. As a result, the cost required for the inspection can be significantly reduced as compared with the case where the inspection is performed using an inspection apparatus equipped with an advanced camera or the like, and as a result, the cost of the entire mounting process can be kept low. Therefore, the electro-optical device according to the present invention having the mounting structure can be produced at a low cost with few defective products.

(First Embodiment of Mounting Structure)
Hereinafter, a mounting structure according to the present invention will be described based on embodiments. Of course, the present invention is not limited to this embodiment. In the following description, the drawings will be referred to as necessary, but in this drawing, in order to show the important components of the structure composed of a plurality of components in an easy-to-understand manner, May be indicated by dimensions.

  FIG. 1 is a plan view showing an embodiment of a mounting structure according to the present invention. FIG. 2A shows an enlarged cross-sectional structure of the mounting structure according to the line AA in FIG. FIG. 2B shows a planar structure of the mounting structure viewed from the side opposite to the side on which the semiconductor device as the electronic component is mounted (the arrow C side in FIG. 2A). 1 shows a structure on an active surface of a semiconductor device viewed through a conductive substrate. 3A is a perspective view of the semiconductor device constituting the mounting structure of FIG. 1 as viewed from the active surface side (the side indicated by the arrow C in FIG. 2A) provided with terminals and the like. FIG. 3B shows an enlarged cross-sectional structure of one bump according to the line DD in the partially enlarged view of FIG.

  In FIG. 1, a mounting structure 1 includes a semiconductor device 2 as an electronic component and a translucent substrate 3 on which the semiconductor device 2 is mounted. The semiconductor device 2 and the translucent substrate 3 are bonded to each other by an NCF (Non Conductive Film) 4 as a bonding member. The translucent substrate 3 is formed by forming the wiring 23, the input terminal 21 and the output terminal 22 on a base material made of a translucent material, for example, translucent glass or translucent resin. Has been. Terminals 21 and 22 are tip portions of the wiring 23. Other elements such as a protective film are formed on the translucent substrate 3 as necessary. The input terminal 21 and the output terminal 22 are board side terminals.

  As shown in FIG. 3A, the semiconductor device 2 includes a base material 11, a plurality of bumps 12 that are protruding terminals formed on the active surface 11a of the base material 11, and the active surface 11a. The inspection bump pair 20 is a set of protrusions formed. An active surface is a surface on which a semiconductor element is formed and a terminal (sometimes referred to as a pad) connected to an internal circuit including the semiconductor element is exposed to the outside. The base material 11 is formed in a substantially rectangular parallelepiped shape using a material such as silicon (Si). The semiconductor device 2 is used in a driving IC that drives pixels of an electro-optical device such as a liquid crystal display device. Under the active surface of the semiconductor device 2, although not shown, a plurality of electronic elements such as thin film transistors and wirings connecting the electronic elements are formed.

  A plurality of the bumps 12 are arranged at regular intervals along the two long sides 11b and 11c of the active surface 11a facing each other. Each bump 12 is constituted by an electrode pad 13, a protrusion 14, and a conductive film 15 as shown in an enlarged manner by an arrow F. The electrode pad 13 is formed using a conductive metal material such as Al (aluminum). The electrode pad 13 is an electrode connected to the electronic element or the like in the semiconductor device 2 described above. Accordingly, the conductive film 15 is conductively connected to an electronic element or the like inside the semiconductor device 2 through the electrode pad 13. Note that a passivation film 16 made of, for example, SiN is formed over the entire active surface 11a of the semiconductor device 2 as shown in FIG. 3B. An opening 16a is formed in the passivation film 16 at a position corresponding to each electrode pad 13, and the electrode pad 13 faces the surface of the active surface 11a from the opening 16a.

  As shown in FIG. 3A, the protrusion 14 extends linearly along the long sides 11b and 11c of the active surface 11a. As shown in FIG. 3 (b), the protrusion 14 has a semicircular cross section (cross section taken along line DD in FIG. 3 (a)) in a direction perpendicular to the extending direction. It has become. Note that the cross-sectional shape of the protrusion is not limited to a semicircular shape, and may be any shape that gradually narrows from the bottom to the top. For example, it can be formed in a semi-elliptical shape, a semi-ellipse shape, a triangular shape, or the like. The protrusions 14 are made of an elastic resin such as an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a silicon resin, or the like.

  The conductive film 15 is formed from the surface of the electrode pad 13 to the surface of the protrusion 14. The conductive film 15 has a single layer structure using a conductive metal material such as Au (gold), TiW (titanium tungsten), Cu (copper), Ni (nickel), Al (aluminum), Cr (chromium), or the like. Alternatively, it can be formed in a multilayer structure. In the present embodiment, a two-layer structure in which an Au layer 15b is stacked on a TiW layer 15a is employed. Thus, by laminating the Au layer 15b on the TiW layer 15a, the electrical resistance of the conductive film 15 can be reduced. A plurality of the conductive films 15 are formed on the surface of the protrusion 14 so as to be arranged at equal intervals in an island shape, thereby forming one bump row 17 including a plurality of bumps 12 as shown in FIG.

  The inspection bump pair 20 is provided at both ends of the bump row 17, that is, at a position closest to the corner of the active surface 11 a in the bump row 17. The inspection bump pair 20 includes a first inspection bump 18 as a first protrusion and a second inspection bump 19 as a second protrusion. The first inspection bump 18 and the second inspection bump 19 are arranged adjacent to each other. The first inspection bump 18 and the second inspection bump 19 are enlarged as indicated by an arrow F, and like the signal transmission bump 12, the conductive film 15 as a metal film is formed on the surface of the protrusion 14. Is formed. However, the electrode pad 13 is not provided in the substrate 11 with respect to the first inspection bump 18 and the second inspection bump 19. Accordingly, the first inspection bump 18 and the second inspection bump 19 are electrically insulated without being electrically connected to the electronic elements or the like inside the semiconductor device 2. The inspection bump pair 20 will be described in detail later.

  The bump 12, the first inspection bump 18 and the second inspection bump 19 having the above-described configuration can be formed by the following method. First, a photosensitive resin, which is a material of the protrusions 14, is formed on the surface of the passivation film 16 in a state where the opening 16a of FIG. Next, the formed photosensitive resin is patterned into a straight line along the long sides 11b and 11c of FIG. Thereafter, a heat treatment (so-called curing) is performed on the resin to form a cross section of the protrusion 14 in a semicircular shape.

  Thereafter, a TiW layer and an Au layer are sequentially formed on the entire active surface 11a by sputtering. Next, a resist is formed in a predetermined pattern on the Au layer, and the Au layer is patterned by an etching process. After removing the resist, the TiW layer is patterned using the Au layer as a mask to form the conductive film 15 composed of the TiW layer 15a and the Au layer 15b in FIG. At this time, the conductive film 15 constituting the bump 12 is patterned into a shape that can overlap the opening 16a when seen in a plan view. On the other hand, the conductive film 15 constituting the first inspection bump 18 (see FIG. 3A) and the conductive film 15 constituting the second inspection bump 19 are patterned into a shape that does not overlap the opening 16a. No opening is formed in advance in the conductive film 15 constituting the inspection bumps 18 and 19. Thus, the bump 12, the first inspection bump 18 and the second inspection bump 19 are formed.

Returning to FIG. 1, a on the surface S ₁ on the side of mounting the semiconductor device 2 of the light transmitting substrate 3 (front side in FIG. 1), at positions corresponding to the bumps 12 of the semiconductor device 2 A plurality of input terminals 21 that are board-side terminals and a plurality of output terminals 22 that are also board-side terminals are provided. Further, the wiring 23 is formed on the substrate 3 by patterning so as to extend from the individual input terminals 21 and the individual output terminals 22.

Each input terminal 21 receives an electrical signal from the outside through a wiring board (not shown) such as an FPC (Flexible Printed Circuit) board and the wiring 23 as indicated by an arrow E _1. Is done. On the other hand, an electrical signal from the semiconductor device 2 is output to each output terminal 22, and the output signal is transmitted through the wiring 23 in the direction indicated by the arrow E ₂ . The electrical signal output through each output terminal 22 is used for processing by, for example, a signal processing circuit (not shown). The input terminal 21, the output terminal 22, and the wiring 23 are formed of a conductive metal material such as Al, Mo (molybdenum), W (tungsten), or the like. In the following description, the input terminal 21 and the output terminal 22 may be simply referred to as board side terminals.

Next, a method for mounting the semiconductor device 2 on the translucent substrate 3 will be described.
4 shows a portion indicated by an arrow Z1 in FIG. 1, that is, an inspection bump pair 20 provided in the vicinity of a corner of the active surface 11a of the semiconductor device 2, and one bump 12 adjacent to the inspection bump pair 20. Is shown enlarged. 4 shows a state in which the inspection bump pair 20 and the like are viewed from the side opposite to the surface S1 side (the back side of the paper surface) on which the semiconductor device 2 of the translucent substrate 3 is mounted in FIG. Moreover, in FIG. 4, the translucent base material of the translucent board | substrate 3 in the near side is shown with the chain line for convenience, and the element in the back | inner side of the said translucent base material is shown with the continuous line. In FIG. 1, the inspection bump pairs 20 are provided at four locations. In the present embodiment, these are all the same configuration, and therefore, in the following description, only one of the portions enlarged by the arrow Z1 is given. I will explain.

  First, as shown in FIG. 2A, the semiconductor device 2 is placed in a state in which the relative positions of the bumps 12 and the input terminals 21 and the relative positions of the bumps 12 and the output terminals 22 are matched. 3. Place on top. At this time, as shown in FIG. 1, the inspection bump pair 20 is located on the surface of the translucent substrate 3 so as to face the region where the terminals 21 and 22 are not provided. 2A, the semiconductor device 2 is bonded to the mounting surface of the translucent substrate 3 with NCF 4 in a state where a predetermined pressure is applied to the semiconductor device 2 from the arrow B direction and the arrow C direction. At this time, the protrusions 14 of the bumps 12 are elastically deformed into a collapsed state by the pressure at the time of adhesion, and the conductive film 15 on the surface thereof is deformed so as to be flat according to the deformation. As a result, the conductive film 15 and the substrate-side terminals 21 and 22 come into contact with each other in a planar shape. At this time, the contact surface between the conductive film 15 of the bump 12 and the substrate-side terminals 21 and 22 has a rectangular shape as seen in plan view as indicated by reference numeral 24 in FIG. The contact surface 24 may be square depending on its width W3. Since the cross-sectional shape of the protrusion 14 is a semicircular shape, that is, a shape in which the bottom portion becomes narrower toward the top portion, the length L of the contact surface 24 perpendicular to the extending direction of the protrusion 14 (hereinafter referred to as the contact length). ) Changes to become longer or shorter according to the strength of the pressing force.

  On the other hand, the conductive film 15 of the inspection bump pair 20 contacts the surface of the translucent substrate of the translucent substrate 3 in a planar shape. The first inspection bump 18 and the second inspection bump 19 are elastically deformed so that the protrusions 14 thereof are crushed by the pressure at the time of bonding, and the conductive film 15 on the surface thereof becomes flat according to the deformation. Transforms into As a result, the conductive film 15 and the translucent substrate 3 come into contact with each other in a planar shape. The contact surfaces of the conductive film 15 and the translucent substrate 3 of the first inspection bump 18 and the second inspection bump 19 at this time are viewed in plan as indicated by reference numerals 25 and 26 in FIG. It becomes a rectangular shape.

  In the mounting structure of this embodiment, the conductive film 15 of the bump 12 and the substrate-side terminal are confirmed by checking the contact state between the conductive film 15 of the inspection bump pair 20 and the translucent substrate of the translucent substrate 3. The contact state with 21 and 22 is indirectly inspected, and the mounting state of the semiconductor device 2 is inspected from the result. Hereinafter, the configuration of the inspection bump pair 20 (first inspection bump 18 and second inspection bump 19) of the semiconductor device 2 for inspecting the mounting state will be described in detail.

  In FIG. 1, a total of four inspection bump pairs 20 are provided in the vicinity of the four corners of the active surface 11a. As shown in FIG. 4, the first inspection bump 18 and the second inspection bump 19 constituting the inspection bump pair 20 are different in size of the conductive film 15. Specifically, the width W1 of the first inspection bump 18 and the width W2 of the second inspection bump 19 with respect to the direction along the center line X0 in the extending direction of the protrusion 14 (that is, the horizontal direction in the drawing) Are different from each other. That is, the lateral widths of the contact surfaces 25 and 26 are different from each other.

  The width W1 of the first inspection bump 18 is set to an allowable minimum length of the contact length L of the contact surface 24 between the conductive film 15 and the substrate-side terminals 21 and 22 in FIG. The allowable minimum length means that the conductive film 15 of the bump 12 and the substrate-side terminals 21 and 22 are normally connected in a state where the semiconductor device 2 is mounted on the translucent substrate 3 as shown in FIG. It is the minimum length of the contact length L that can be determined to be present. In the present embodiment, the width W1 shown in FIG. 4 is set to 10 μm.

  On the other hand, the width W2 of the second inspection bump 19 is set to the allowable maximum length of the contact length L of the contact surface 24 between the conductive film 15 and the substrate side terminals 21 and 22 in FIG. The allowable maximum length means that the conductive film 15 of the bump 12 and the substrate-side terminals 21 and 22 are normally connected in a state where the semiconductor device 2 is mounted on the translucent substrate 3 as shown in FIG. This is the maximum length of the contact length L that can be determined to be present. In the present embodiment, the width W2 shown in FIG. 4 is set to 25 μm. In the present embodiment, the width W1 of the first inspection bump 18 and the width W2 of the second inspection bump 19 are all different from the width W3 of the signal transmission bump 12.

  The contact lengths of the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 change due to a change in pressing force when the semiconductor device 2 is mounted on the translucent substrate 3. This contact length is the length of the vertical width of the contact surfaces 25 and 26, and as indicated by the symbol L in FIG. 4, the direction perpendicular to the center line X0 of the protrusion 14 (the vertical direction in the figure). ) Of the contact surfaces 25, 26. This contact length L is longer when the deformation amount of the protrusion 14 is large (that is, when the pressing force during mounting of the semiconductor device 2 is large), and conversely, the deformation amount of the protrusion 14 is small (that is, the semiconductor It becomes shorter when the pressing force when mounting the device 2 is small). In the present embodiment, the first inspection bump 18 and the second inspection bump 19 are disposed adjacent to each other. Therefore, when the semiconductor device 2 is mounted, the first inspection bump 18 and the second inspection bump 19 are pressed by substantially the same pressing force. Accordingly, the contact length L of the contact surface 25 and the contact length L of the contact surface 26 are substantially the same length.

  The mounting structure 1 of the present embodiment is a state in which the semiconductor device 2 is properly mounted on the mounting surface S1 of the translucent substrate 3, and the contact surface 25 of the first inspection bump 18 has a long vertical width. The contact surface 26 of the second inspection bump 19 has a width in a direction different from the long side of the contact surface 25 of the first inspection bump 18, that is, the lateral width is the long side.

  According to the mounting structure of the present embodiment, a set of inspections composed of the first inspection bumps 18 and the second inspection bumps 19 on the surface 11a of the semiconductor device 2 to be mounted on the translucent substrate 3. A bump pair 20 was provided. By using the inspection bump pair 20, it is possible to inspect the contact state between the plurality of bumps 12 and the substrate-side terminals 21 and 22 that individually contact them. The first inspection bump 18 and the second inspection bump 19 are in contact with the translucent substrate 3 to form contact surfaces 25 and 26, respectively. The contact surfaces 25 and 16 can be observed through the translucent substrate 3 from the opposite side of the translucent substrate 3 on which the semiconductor device 2 is mounted. If the contact surfaces 25 and 26 observed at this time are in the form shown in FIG. 4, the contact state between the bump 12 and the substrate-side terminals 21 and 22 is appropriate. By observing the contact surfaces 25 and 26 through the translucent substrate 3 as described above, it is possible to easily and clearly determine whether or not the contact state between the bumps 12 and the substrate-side terminals 21 and 22 is good or not by human eyes. As a result, compared with the case of inspecting using an inspection apparatus equipped with an advanced camera or the like, the cost required for the inspection can be remarkably reduced, and as a result, the cost of the entire process for mounting the semiconductor device can be kept low.

(Modification 1)
Next, another aspect of the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 in the mounting structure according to the present invention will be described with reference to FIG. FIG. 5A shows a state in which the contact portion between the inspection bump pair 20 and the translucent substrate of the translucent substrate 3 is viewed from the side (in the direction of arrow H in FIG. 1). FIG. 5B shows a state in which the contact portion between the inspection bump pair 20 and the translucent substrate of the translucent substrate 3 is viewed through the translucent substrate from the direction of arrow C in FIG. Show. FIG. 5B shows a state in which the semiconductor device 2 is mounted, particularly a state in which the pressing force during mounting is different from that in FIG. Moreover, in FIG.5 (b), in order to show an important part easily, the translucent base material of the translucent board | substrate 3 in a near side is shown with a chain line, and it is for the test | inspection in the back side of the said translucent base material. The bump pair 20 and the protrusions 14 included therein are indicated by solid lines.

  In the embodiment shown in FIG. 5B, the vertical width of the contact surface 25 of the first inspection bump 18 as the first protrusion is the long side, and the second inspection bump 19 as the second protrusion. The vertical width and the horizontal width of the contact surface 26 are the same length, that is, the contact surface 26 is square. If the contact surfaces 25 and 26 are in the form shown in FIG. 5B, the contact state between the bump 12 and the substrate-side terminals 21 and 22 is appropriate.

(Modification 2)
Next, still another aspect of the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 in the mounting structure according to the present invention will be described. FIG. 5C shows a state in which the contact portion between the inspection bump pair 20 and the translucent substrate of the translucent substrate 3 is viewed through the translucent substrate from the direction of arrow C in FIG. Show. FIG. 5C shows a state in which the semiconductor device 2 is mounted, particularly a state in which the pressing force at the time of mounting is different from that in FIGS. 4 and 5B. Also, in FIG. 5C, in order to show the main part in an easy-to-see manner, the translucent substrate of the translucent substrate 3 on the near side is indicated by a chain line, and for inspection on the back side of the translucent substrate. The bump pair 20 and the protrusions 14 included therein are indicated by solid lines.

  In the embodiment shown in FIGS. 4 and 5B, the first inspection bump 18 corresponds to the first protrusion, and the second inspection bump 19 corresponds to the second protrusion. On the other hand, in the present embodiment shown in FIG. 5C, the first inspection bump 18 corresponds to the second protrusion, contrary to the case of FIG. 4 and FIG. The bump 19 corresponds to the second protrusion.

  In the embodiment shown in FIG. 5C, the vertical width and the horizontal width of the contact surface 25 of the first inspection bump 18 are the same length (that is, the contact surface 26 is square). The lateral width of the contact surface 26 of the second inspection bump 19 is a long side. If the contact surfaces 25 and 26 are in the form shown in FIG. 5C, the contact state between the bump 12 and the substrate-side terminals 21 and 22 is appropriate.

(Second Embodiment of Mounting Structure)
Next, another embodiment of the mounting structure according to the present invention will be described. FIG. 6 is a plan view showing the overall configuration of the mounting structure according to the present embodiment. The cross-sectional structure according to the AA line of FIG. 6 can be the same as that of the first embodiment shown in FIG. Moreover, the part shown by the arrow Z1 of FIG. 6 can be made the same as 1st Embodiment shown in FIG. 4 except the structure of the terminal on a translucent board | substrate. In the first embodiment shown in FIG. 1, the first inspection bump 18 and the second inspection bump 19 are in direct contact with the translucent substrate of the translucent substrate 3. On the other hand, in the present embodiment, the first inspection bump 18 and the second inspection bump 19 are in contact with a translucent member provided on the translucent substrate 3. Hereinafter, the present embodiment will be described in detail with a focus on differences from the previous embodiment.

  In FIG. 6, the first inspection bump 18 and the second inspection bump 19 provided in the vicinity of the four corners of the semiconductor device 2 are conductively connected to an electronic element or the like inside the semiconductor device 2, as with many other bumps 12. is doing. That is, in the semiconductor device 2 of the present embodiment, the electrode pads 13 of the bumps 12 which are enlarged by arrows F in FIG. 3 are also provided on the first inspection bumps 18 and the second inspection bumps 19. Then, wirings 23 are connected to the positions corresponding to the first inspection bumps 18 and the second inspection bumps 19 provided at the four corners of the semiconductor device 2 as shown by an arrow G in FIG. The input terminal 31 or the output terminal 32 as the translucent member is provided. These terminals 31 and 32 are conductively connected to a conductive film 15 as a metal film, which is a component of the inspection bump pair 20 provided at the four corners of the active surface 11a.

  The input terminal 31 and the output terminal 32 are formed in the same shape as the substrate-side terminals 21 and 22 that are conductively connected to the plurality of bumps 12. The terminals 31 and 32 are formed using a light-transmitting conductive material such as ITO or IZO. In the present embodiment, the substrate-side terminals 21 and 22 and the wiring 23 can also be formed using a light-transmitting conductive film such as ITO or IZO. In this way, the board-side terminals 21 and 22, the wiring 23, and the terminals 31 and 32 can be simultaneously formed using the same material.

  In the present embodiment, the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 are either of the forms shown in FIGS. 4, 5 (b) and 5 (c). Since it is the same, the description is abbreviate | omitted. In the present embodiment, the terminals 31 and 32 that are in contact with the inspection bump pair 20 are translucent. Accordingly, the contact surfaces 25 and 26 of the inspection bump pair 20 are connected to the translucent substrate 3 and the terminal from the side opposite to the surface on which the semiconductor device 2 of the translucent substrate 3 is mounted (the back side in FIG. 6). 31 and 32 can be observed.

  The inspection bump pair 20 of the present embodiment is conductively connected to the translucent terminals 31 and 32 and can be used to drive the semiconductor device 2 in the same manner as the bump 12. In this case, unlike the case where the inspection bump pair 20 is used only for inspection, a dedicated space for providing the inspection bump pair 20 in the semiconductor device 2 is not necessary. As a result, the semiconductor device 2 can be reduced in size. In addition, since it is not necessary to provide a region for contacting the inspection bump pair 20 in the translucent substrate 3, it is possible to contribute to the miniaturization of the translucent substrate 3, and consequently to the overall miniaturization of the mounting structure 1. Can contribute.

  Further, the first inspection bump 18 and the second inspection bump 19 are different in width W1 and W2 from the width W3 of the bump 12, but the other external appearance is the same as the bump 12. The translucent terminals 31 and 32 are the same as the board-side terminals 21 and 22 in appearance. Therefore, the state in which the test bump pair 20 and the translucent terminals 31 and 32 are in contact with each other to form the contact surfaces 25 and 26 is a plurality of other bumps 12 and substrate-side terminals that are in contact with the bumps 12 individually. This is substantially the same as the state in which 21 and 22 come into contact with each other to form the contact surface 24. Since the terminals 31 and 32 having the same contact state are directly inspected, the inspection can be performed in a state closer to the contact state between the other plurality of bumps 12 and the board-side terminals 21 and 22, and mounting. A state check can be performed more reliably.

(Third embodiment of mounting structure)
Next, still another embodiment of the mounting structure according to the present invention will be described. FIG. 7 is a plan view showing the overall configuration of the mounting structure of the present embodiment. FIG. 8 is a perspective view of the semiconductor device 42 constituting the mounting structure of FIG. 7 as viewed from the active surface side (the back side of the paper surface of FIG. 7). FIG. 9 is an enlarged view of the portion indicated by the arrow Z2 in FIG. 7, that is, the vicinity of the corner of the active surface 11a of the semiconductor device 2. In FIG. 9, the active surface of the substrate 3 is shown from the side opposite to the surface S1 on which the semiconductor device 42 of the translucent substrate 3 is mounted in FIG. Moreover, in FIG. 9, in order to show the main configuration in an easy-to-understand manner, the translucent substrate of the translucent substrate 3 on the near side is shown by a chain line, and the elements on the back side of the translucent substrate are shown by a solid line. Show. This embodiment shown in FIG. 7 differs from the first embodiment shown in FIG. 1 in the arrangement of the bumps of the semiconductor device and the substrate-side terminals of the translucent substrate. Hereinafter, the present embodiment will be described in detail with a focus on differences from the first embodiment.

  In FIG. 8, the semiconductor device 42 includes a base material 11, a plurality of bumps 12 provided on the active surface of the base material 11, and an inspection bump pair 20 provided in the vicinity of four corners of the base material 11. And have. Each inspection bump pair 20 includes a first inspection bump 18 and a second inspection bump 19. Plural bumps 12 are arranged in two rows along one long side 11b of the active surface 11a. A plurality of bumps 12 are arranged in two rows along the other long side 11c. That is, two bump rows 17a and 17b are provided along one long side 11b, and two bump rows 17a and 17b are provided along the other long side 11c. The configuration of each bump 12 is the same as that of the first embodiment shown in FIG. That is, the protrusions 14 extend linearly along the long sides 11b and 11c, and a plurality of island-shaped conductive films 15 are formed on the protrusions 14 at regular intervals.

  Next, in FIG. 7, the substrate-side terminals 21 and 22 formed on the surface S <b> 1 on the side where the semiconductor device 42 of the translucent substrate 3 is mounted (the front side in FIG. 7) are the corresponding individual bumps 12. It is arranged according to. That is, the input terminals 21 are arranged in two rows corresponding to the bump rows 17a and 17b arranged in two rows along one long side 11b of the active surface 11a. On the other hand, the output terminals 22 are arranged in two rows corresponding to the bump rows 17a and 17b arranged in two rows along the other long side 11c of the active surface 11a. A wiring 23 is formed on the substrate 3 so as to extend from the individual terminals 21 and 22.

  In FIG. 8, the second inspection bump 19 of the inspection bump pair 20 is located at the position closest to the corner of the active surface 11a, that is, at both ends of the bump row 17a closer to the long side 11b and the long side 11c. They are arranged at both ends of the closer bump row 17a. On the other hand, the first inspection bump 18 includes both end portions of the bump row 17b adjacent to the bump row 17a closer to the long side 11b and both end portions of the bump row 17b adjacent to the bump row 17a closer to the long side 11c. Respectively. The first inspection bump 18 and the second inspection bump 19 are adjacent to each other along the short side 11d and the short side 11e of the active surface 11a.

  The configuration of the individual first inspection bumps 18 and the configuration of the individual second inspection bumps 19 are the same as those of the first embodiment shown in FIG. That is, as shown by an enlarged arrow F in FIG. 8, the island-shaped conductive film 15 is formed on the surface of the protrusion 14. In the present embodiment, the electrode pad 13 is not provided for the first inspection bump 18 and the second inspection bump 19. Accordingly, the first inspection bump 18 and the second inspection bump 19 are electrically insulated without being electrically connected to the electronic elements or the like inside the semiconductor device 2.

  The first inspection bump 18 provided in one bump row 17b and the second inspection bump 19 provided in the other bump row 17a are different in size of the conductive film 15. Specifically, in FIG. 9, the width W1 of the first inspection bump 18 and the width W2 of the second inspection bump 19 with respect to the direction along the center line X0 of the protrusion 14 (that is, the horizontal direction in the figure). Are different from each other. Furthermore, the width W2 of the second inspection bump 19 is wider than the width W1 of the first inspection bump 18. The contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 have different shapes under the same pressing force. In this embodiment, the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 are arranged so that the first inspection bump 18 and the second inspection bump 19 are arranged in different bump rows. Since it is the same as the aspect shown in FIG.4, FIG.5 (b) and FIG.5 (c) except being provided, the description is abbreviate | omitted.

  In the semiconductor device 42 of the present embodiment, as shown in FIG. 8, two rows of bumps 17a and 17b are provided on each of two opposite sides 11b and 11c of the active surface 11a. In this way, the bump 12 can be formed without changing the area of the active surface 11a (that is, without increasing the size of the semiconductor device 42) as compared with the case where one terminal row is provided along one side of the active surface 11a. The number of can be increased. As the number of bumps 12 increases, the number of substrate-side terminals 21 and 22 of the translucent substrate 3 on which the semiconductor device 42 is mounted can also be increased. As a result, the number of wirings 23 extending from the plurality of substrate side terminals 21 and 22 can be increased. Thereby, for example, when the semiconductor device 42 is used as a driving IC for a liquid crystal display device or the like, it can contribute to high definition of the display of the liquid crystal display device or the like. In addition, when the number of the wirings 23 increases, the distance (what is called wiring pitch) between those wirings 23 and 23 becomes narrow.

  In the semiconductor device 42 of the present embodiment, the first inspection bump 18 is provided in one bump row 17b, and the second inspection bump 19 is provided in the other bump row 17a. The first inspection bump 18 and the second inspection bump 19 are adjacent to each other. With these configurations, the contact state between the conductive film 15 and the substrate-side terminals 21 and 22 with respect to the plurality of bumps 12 provided in each of the two bump rows 17a and 17b is changed to the first inspection bump 18 and the second inspection. The inspection can be performed indirectly through the bumps 19. In addition, since the distance between the bump row 17a and the bump row 17b is generally wider than the distance between terminals in one bump row, the first inspection bump 18 and the second inspection bump 19 are within the same bump row. Compared to the case of being adjacent, the distance between the adjacent first inspection bump 18 and the second inspection bump 19 can be increased. Therefore, when the inspection bump pair 20 is visually observed, it becomes easy to see the relative relationship between them.

(Fourth Embodiment of Mounting Structure)
Next, still another embodiment of the mounting structure according to the present invention will be described. FIG. 10 is a plan view showing the overall configuration of the mounting structure according to the present embodiment. A portion indicated by an arrow Z2 in FIG. 10 can be the same as that of the third embodiment shown in FIG. 7 except for the configuration of the board-side terminal. In the third embodiment shown in FIG. 7, the first inspection bump 18 and the second inspection bump 19 are in direct contact with the translucent substrate of the translucent substrate 3 to form a contact surface. On the other hand, in the present embodiment, the first inspection bump 18 and the second inspection bump 19 are in contact with the translucent member provided on the translucent substrate of the translucent substrate 3. Hereinafter, the present embodiment will be described in detail with a focus on differences from the previous embodiment.

  In the present embodiment, as shown in FIG. 10, an inspection bump pair 20 including a first inspection bump 18 and a second inspection bump 19 is provided in the vicinity of the four corners of the semiconductor device 42. The first inspection bump 18 and the second inspection bump 19 are conductively connected to an electronic element or the like in the semiconductor device 2 in the same manner as many other bumps 12. That is, in the semiconductor device 42 of the present embodiment, the electrode pads 13 of the bumps 12 which are enlarged by the arrow F in FIG. 8 are also provided for the first inspection bumps 18 and the second inspection bumps 19. Yes. As shown in FIG. 10, wirings 23 are respectively provided on the translucent substrate 3 at positions corresponding to the first inspection bumps 18 and the second inspection bumps 19 provided at the four corners of the semiconductor device 42. An input terminal 31 and an output terminal 32 serving as a translucent member connected to each other are disposed, and these terminals 31 and 32 are in surface contact with the conductive film 15 that is a component of the inspection bump pair 20 at the four corners. Are electrically connected.

  The input terminal 31 and the output terminal 32 are formed in the same shape as the terminals 21 and 22 that are conductively connected to the plurality of bumps 12. The terminals 31 and 32 are formed using a light-transmitting conductive material such as ITO or IZO.

  In this embodiment, the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 are arranged so that the first inspection bump 18 and the second inspection bump 19 are arranged in different bump rows. Since it is the same as the aspect shown in FIG.4, FIG.5 (b) and FIG.5 (c) except being provided, the description is abbreviate | omitted. In the present embodiment, the terminals 31 and 32 that are in contact with the inspection bump pair 20 are translucent. Accordingly, the contact surfaces 25 and 26 of the inspection bump pair 20 are transmitted from the side opposite to the surface on which the semiconductor device 2 of the translucent substrate 3 is mounted (the back side of the paper surface in FIG. 10) of the translucent substrate 3. It can be observed through the optical substrate and the terminals 31 and 32.

  The inspection bump pair 20 of the present embodiment is conductively connected to the translucent terminals 31 and 32 and can be used for driving the semiconductor device 2 like the bump 12. In this case, unlike the case where the inspection bump pair 20 is used only for inspection, a dedicated space for providing the inspection bump pair 20 in the semiconductor device 42 is not necessary. As a result, the semiconductor device 42 can be reduced in size. Further, since it is not necessary to provide a region for contacting the inspection bump pair 20 on the translucent substrate 3, it is possible to contribute to the miniaturization of the translucent substrate 3, and consequently to the overall miniaturization of the mounting structure 1. Can contribute.

  The first inspection bump 18 and the second inspection bump 19 are different in width W1 and W2 from the width W3 of the conductive connection bump 12, but the other external shapes are the same as those of the bump 12. The same. The translucent terminals 31 and 32 are the same as the board-side terminals 21 and 22 in appearance. Therefore, the state in which the test bump pair 20 and the translucent terminals 31 and 32 are in contact with each other to form the contact surfaces 25 and 26 is a plurality of other bumps 12 and substrate-side terminals that are in contact with the bumps 12 individually. This is substantially the same as the state in which 21 and 22 come into contact with each other to form the contact surface 24. Since the inspection bump pair 20 and the terminals 31 and 32 having the same contact state are directly inspected, the inspection is performed in a state closer to the contact state between the other plurality of bumps 12 and the substrate-side terminals 21 and 22. It is possible to perform the inspection of the mounting state more reliably.

(Embodiment of inspection method of mounting structure)
Next, a mounting structure inspection method according to this embodiment will be described. In the present embodiment, a method for inspecting the mounting state of the mounting structure having the configuration shown in FIGS.
As shown in FIG. 2A, the mounting structure inspection method of this embodiment is a transparent substrate from the direction of arrow C with respect to the mounting structure in a state where the semiconductor device 2 is mounted on the transparent substrate 3. 3 through the eyes using a microscope. In particular, this is performed on the inspection bump pairs 20 provided at the four corners of the substrate 11 in FIG. Specifically, paying attention to the four places where the inspection bump pairs 20 are provided in FIG. 1, the conductive film 15 (see FIG. 3A), which is a component of the first inspection bump 18, and the light transmission. The state of the contact surface 25 (see FIG. 4) with the conductive substrate 3 and the state of the contact surface 26 (see FIG. 4) between the conductive film 15 and the translucent substrate 3 which are constituent elements of the second inspection bump 19 are shown. inspect. Based on the relative shapes of the contact surface 25 and the contact surface 26 at this time, the contact state between the plurality of bumps 12 and the terminals 21 and 22 that are in contact with each of the bumps 12, respectively, that is, the light transmission of the semiconductor device 2 The quality of the mounting state on the conductive substrate 3 can be determined.

  In FIG. 1, the plurality of conductive connection bumps 12 are in contact with the surface of the substrate-side terminal 21 or the substrate-side terminal 22 formed on the translucent substrate 3. In contrast, the inspection bump pair 20 is in direct contact with the surface of the translucent substrate of the translucent substrate 3. Therefore, it is conceivable that the contact state between the substrate-side terminals 21 and 22 and the bumps 12 does not necessarily match the contact state between the translucent substrate 3 and the inspection bump pair 20. However, the film thickness of the conductive film constituting the substrate-side terminals 21 and 22 is very thin and affects the relationship between the amount of elastic deformation of the bump 12 and the amount of elastic deformation of the inspection bump pair 20. Is not. Therefore, there is no practical problem in determining whether the contact state between the bump 12 and the substrate-side terminals 21 and 22 is good or bad with the contact state between the inspection bump pair 20 and the translucent substrate 3.

  If the board-side terminals 21 and 22 have such a thickness that affects the inspection, it is desirable to compensate for the difference in deformation between the bump 12 and the inspection bumps 18 and 19. For example, in FIG. 4, the difference in deformation amount between the bump 12 and the inspection bumps 18 and 19 can be compensated by appropriately changing the width W1 of the first inspection pattern 18 and the width W2 of the second inspection pattern 19.

  In the mounting structure inspection method according to the present embodiment, in order to determine whether or not the contact state between the plurality of bumps 12 and the terminals 21 and 22 contacting them is good, the shape of the contact surface 25 of the first inspection bump 18 and The shape of the contact surface 26 of the second inspection bump 19 is compared. Specifically, the shape of the contact surface 25 and the shape of the contact surface 26 are visually observed through the translucent substrate 3, and the quality is determined from the difference between the shapes. The pass / fail judgment is made, for example, by the difference in the extending direction of the long side of the rectangular shape between the contact surface 25 and the contact surface 26, the difference between the rectangular shape or the square shape, and the relationship between the width and the contact length. It can be determined based on the above. Specific determination criteria (determination criterion 1) to (determination criterion 5) will be described below.

(Criteria 1)
The relationship between the width W1 of the first inspection bump 18, the width W2 of the second inspection bump 19, and the contact length L of the contact surfaces 25 and 26 is as follows.
L> W1
And
L ≦ W2
When it is, it determines with the mounting state of the semiconductor device 2 being normal. FIG. 4 shows a state of L> W1, L <W2, and L = W2 is when the contact surface 26 of the second inspection bump 19 is square.
(Criteria 2)
The relationship between the width W1 of the first inspection bump 18, the width W2 of the second inspection bump 19, and the contact length L of the contact surfaces 25 and 26 is as follows.
L ≧ W1
And
L <W2
When it is, it determines with the mounting state of the semiconductor device 2 being normal. FIG. 4 shows a state of L> W1, L <W2, and L = W1 is when the contact surface 25 of the first inspection bump 18 is square.

(Criteria 3)
As shown in FIG. 4, the extending direction of the long side of the contact surface 25 of the first inspection bump 18 (vertical direction in FIG. 4) and the extending direction of the long side of the contact surface 26 of the second inspection bump 19 ( When it is different from the left-right direction in FIG.
(Criteria 4)
When the extending direction of the long side of the contact surface 25 of the first inspection bump 18 and the extending direction of the long side of the contact surface 26 of the second inspection bump 19 are the same, the mounting state of the semiconductor device 2 is determined to be defective. To do.
(Criteria 5)
When one of the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 is square, the mounting state of the semiconductor device 2 is determined to be normal.

  In the mounting structure inspection method of this embodiment, as shown in FIG. 4, the shapes of the contact surfaces 25 of the first inspection bumps 18 and the contact surfaces 26 of the second inspection bumps 19 are visually observed through the translucent substrate 3. The contact state of each bump 12 and the corresponding board-side terminals 21 and 22 is very easy by making a determination using any one of the above (determination criteria 1) to (determination criteria 5). Can be determined. Then, it is possible to determine that the mounting state of the semiconductor device 2 is normal by determining that the contact state is normal in all of the four inspection bump pairs 20 illustrated in FIG. If it is determined that the contact state of the inspection bump pair 20 is poor even at one of the four locations, the semiconductor device 2 may be displaced in plan from a predetermined position on the translucent substrate 3. Since the semiconductor device 2 may be inclined with respect to the mounting surface of the substrate 3, the mounting state of the semiconductor device 2 can be determined to be defective. In this case, the semiconductor device 2 and the NCF 4 can be peeled off from the light-transmitting substrate 3 and re-positioning can be performed after so-called rework.

Hereinafter, a specific determination example of the quality determination of the mounting state performed using the above (determination criterion 1) to (determination criterion 5) will be described with reference to FIGS. 4, 5, and 11.
4, FIG. 5 (b) and FIG. 5 (c) are contact surfaces of the first inspection bump 18 when the contact state between the bump 12 and the substrate side terminals 21 and 22 in FIG. 1 is normal. 25 and the state of the contact surface 26 of the second inspection bump 19 are shown.

  First, the first determination example will be described. In FIG. 5A, the first inspection bump 18 and the second inspection bump 19 are in contact with the translucent substrate 3 particularly in a state where the protrusions 14 are deformed. When this is viewed through the translucent substrate 3 from the direction of the arrow C, as shown in FIG. 4, the contact surface 25 of the first inspection bump 18 is in the extending direction of the protrusions 14 indicated by the chain line X0 (left and right in the figure). The rectangular shape has a side 25a along the direction) as a short side. On the other hand, the contact surface 26 of the second inspection bump 19 has a rectangular shape having a side 26a along the extending direction of the protrusion 14 indicated by a chain line X0 as a long side. That is, the longitudinal width of the contact surface 25 is a long side, and the contact surface 26 is a direction different from the contact surface 25, that is, the lateral width is a long side. In this case, since it matches the above-mentioned (determination criterion 3), it can be determined that the contact state between the bump 12 and the substrate side terminals 21 and 22 in FIG. 1 is normal.

Further, the relationship between the width W1 of the first inspection bump 18 and the contact length L of the contact surface 25 in FIG.
L> W1
It has become. That is, the contact length L of the contact surface 25 is longer than the allowable minimum length of the contact length L. On the other hand, the relationship between the width W2 of the second inspection bump 19 and the contact length L of the contact surface 26 is:
L <W2
It has become. That is, the contact length L of the contact surface 26 is shorter than the allowable maximum length of the contact length L. In this case, since it conforms to the aforementioned (determination criterion 1), it can be determined that the contact state between the bump 12 and the substrate-side terminals 21 and 22 is normal.

  Next, a second determination example will be described with reference to FIG. FIG. 5B illustrates a case where the pressing force when mounting the semiconductor device 2 is stronger than in the case of FIG. The contact surface 25 of the first inspection bump 18 has a rectangular shape in which the side 25a is a short side (that is, the vertical width is a long side). On the other hand, the contact surface 26 of the second inspection bump 19 has a square shape (that is, the length in the vertical direction is the same as the width in the horizontal direction). In this case, since it conforms to the aforementioned (determination criterion 5), it can be determined that the contact state between the bump 12 and the substrate side terminals 21 and 22 in FIG. 1 is normal.

Also, the relationship between the width W1 of the first inspection bump 18 and the contact length L of the contact surface 25 in FIG.
L> W1
It has become. That is, the contact length L of the contact surface 25 is longer than the allowable minimum length of the contact length L. On the other hand, the relationship between the width W2 of the second inspection bump 19 and the contact length L of the contact surface 26 is:
L = W2
It has become. This is because the contact length L of the contact surface 26 matches the allowable maximum length of the contact length L. In this case, since it conforms to the aforementioned (determination criterion 1), it can be determined that the contact state between the bump 12 and the substrate-side terminals 21 and 22 is normal.

  Next, a third determination example will be described with reference to FIG. FIG. 5C illustrates a case where the pressing force at the time of mounting the semiconductor device 2 is weaker than in the case of FIG. The contact surface 25 of the first inspection bump 18 has a square shape (that is, the length in the vertical direction is the same as the width in the horizontal direction). On the other hand, the contact surface 26 of the second inspection bump 19 has a rectangular shape in which the side 26a along the extending direction of the protrusion 14 indicated by the chain line X0 is a long side (that is, the vertical width is the long side). It has become. In this case, since it conforms to the aforementioned (determination criterion 5), it can be determined that the contact state between the bump 12 and the substrate side terminals 21 and 22 in FIG. 1 is normal.

Further, the relationship between the width W1 of the first inspection bump 18 and the contact length L of the contact surface 25 in FIG.
L = W1
It has become. That is, the contact length L of the contact surface 25 is equal to the allowable minimum length of the contact length L. On the other hand, the relationship between the width W2 of the second inspection bump 19 and the contact length L of the contact surface 26 is:
L <W2
It has become. That is, the contact length L of the contact surface 26 is shorter than the allowable maximum length of the contact length L. In this case, since it conforms to the above-mentioned (determination criterion 2), it can be determined that the contact state between the bump 12 and the substrate-side terminals 21 and 22 is normal.

  Next, FIG. 11A and FIG. 11B show the contact portion between the inspection bump pair 20 and the translucent substrate of the translucent substrate 3 from the direction of arrow C in FIG. The state seen through the light base material is shown. FIG. 11A and FIG. 11B show states in which the mounting state of the semiconductor device 2 in FIG. 5A is different. Further, in FIGS. 11A and 11B, the transparent substrate 3 on the near side is indicated by a chain line in order to show the main part in an easy-to-see manner, and for inspection on the back side of the transparent substrate 3. The bump pair 20 and the protrusions 14 included therein are indicated by solid lines.

  First, the fourth determination example will be described with reference to FIG. The contact surface 25 of the first inspection bump 18 has a rectangular shape with a side 25a along the extending direction (left-right direction in the drawing) of the protrusion 14 indicated by a chain line X0 as a short side. On the other hand, the contact surface 26 of the second inspection bump 19 has a rectangular shape having a side 26a along the extending direction of the protrusion 14 indicated by a chain line X0 as a short side. That is, the contact surface 25 and the contact surface 26 have the same direction of the long side of the rectangle. In this case, since it matches the above-mentioned (determination criterion 4), it can be determined that the contact state between the bump 12 and the substrate-side terminals 21 and 22 in FIG.

Further, the relationship between the width W1 of the first inspection bump 18 and the contact length L of the contact surface 25 in FIG.
L> W1
It has become. That is, the contact length L of the contact surface 25 is longer than the allowable minimum length of the contact length L. On the other hand, the relationship between the width W2 of the second inspection bump 19 and the contact length L of the contact surface 26 is:
L> W2
It has become. That is, the contact length L of the contact surface 26 is longer than the allowable maximum length of the contact length L. In this case, since neither of the (judgment criterion 1) and the (judgment criterion 2) is met, it can be determined that the contact state between the bump 12 and the board-side terminals 21 and 22 is defective.

  Next, a fifth determination example will be described with reference to FIG. The contact surface 25 of the first inspection bump 18 has a rectangular shape with a side 25a along the extending direction (left and right direction in the figure) of the protrusion 14 indicated by a chain line X0 as a long side. On the other hand, the contact surface 26 of the second inspection bump 19 has a rectangular shape having a side 26a along the extending direction of the protrusion 14 indicated by a chain line as a long side. That is, the contact surface 25 and the contact surface 26 have the same direction of the long side of the rectangle. In this case, since it matches the above-mentioned (determination criterion 4), it can be determined that the contact state between the bump 12 and the substrate-side terminals 21 and 22 in FIG.

Further, the relationship between the width W1 of the first inspection bump 18 and the contact length L of the contact surface 25 in FIG.
L <W1
It has become. That is, the contact length L of the contact surface 25 is shorter than the allowable minimum length of the contact length L. On the other hand, the relationship between the width W2 of the second inspection bump 19 and the contact length L of the contact surface 26 is:
L <W2
It has become. That is, the contact length L of the contact surface 26 is shorter than the allowable maximum length of the contact length L. In this case, since neither of the (judgment criterion 1) and the (judgment criterion 2) is met, it can be determined that the contact state between the bump 12 and the board-side terminals 21 and 22 is defective.

  As described above, in the first to fifth determination examples, the difference in shape between the contact surface 25 of the first inspection bump 18 and the contact surface 26 of the second inspection bump 19 is observed by human eyes. Then, it is determined which of the determination criteria (determination criterion 1) to (determination criterion 5) is applicable. This determination makes it possible to easily and clearly determine the quality of the contact state between the bump 12 and the substrate-side terminals 21 and 22.

  By the way, in the conventional inspection method of the mounting structure, an inspection device for confirming the contact state between the bump and the board side terminal is used by using a camera having a high function, a differential interference microscope, a computer for controlling them, and the like. And the mounting state of the semiconductor device is determined using the inspection apparatus. However, a camera or the like constituting such an inspection apparatus is expensive, and an inspection apparatus having the camera is also expensive. Therefore, when a conventional mounting structure inspection method using a camera is introduced into a semiconductor device mounting method, there is a problem that the overall cost of the semiconductor device mounting method increases.

  On the other hand, in this embodiment, as shown in FIG. 1, the first inspection bump 18 and the second inspection bump are formed on the active surface 11a which is the surface of the semiconductor device 2 on the side facing the translucent substrate 3. A pair of inspection bumps 20 in which the bumps 19 were paired with each other was provided. The inspection bump pair 20 is used to inspect the contact state between the plurality of bumps 12 and the substrate-side terminals 21 and 22 that individually contact them. The first inspection bump 18 is in contact with the translucent substrate of the translucent substrate 3 to form the contact surface 25. On the other hand, the second inspection bump 19 is in contact with the translucent substrate of the translucent substrate 3 to form the contact surface 26. The contact surfaces 25 and 26 are observed through the translucent substrate 3 from the side of the translucent substrate 3 opposite to the side on which the semiconductor device 2 is mounted (that is, the back side in FIG. 1). Can do. In FIG. 4, since the width W1 of the first inspection bump 18 and the width W2 of the second inspection bump 19 are different from each other, the shapes of the contact surface 25 and the contact surface 26 are different. By checking the relative shape difference between the contact surface 25 and the contact surface 26 with human eyes, it is possible to easily and clearly determine whether or not the contact state between the conductive film 15 and the substrate-side terminals 21 and 22 is good. be able to. As a result, the cost required for the inspection can be significantly reduced as compared with the case where the inspection is performed using an inspection apparatus equipped with an advanced camera or the like, and as a result, the cost of the entire mounting process can be kept low.

(Other embodiment of mounting structure and its inspection method)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
For example, in each of the above-described embodiments, the conductive film 15 is provided as a metal film on the first inspection bump 18 and the second inspection bump 19 in the same manner as the normal conductive connection bump 12. However, the metal film is not necessarily provided on the first inspection bump 18 and the second inspection bump 19. However, when the metal film 15 is not provided, the amount of deformation between the bump 12 and the first inspection bump 18 and between the bump 12 and the second inspection bump 19 is equal to the thickness of the metal film 15. There may be a difference in Therefore, it is necessary to compensate for the difference in the deformation amount of the bump. For example, with respect to the embodiment of FIG. 4 in which the metal film 15 is provided, the difference in deformation can be compensated by changing the width W1 of the first inspection bump 18 and the width W2 of the second inspection bump 19.

  Further, in each of the above embodiments, as shown in FIG. 1, the inspection bump pair 20 is disposed at a position closest to the four corners of the active surface 11 a of the semiconductor device 2. However, the inspection bump pair 20 may be disposed at least at one place in the plane of the active surface 11a. Moreover, when providing in two or more places, two diagonal positions of the active surface 11a of the semiconductor device 2 may be sufficient, for example, the position nearest to the four corners of the active surface 11a and the long side 11b of the active surface 11a, You may provide in six places combining the two places of the center of 11c.

(Embodiment of electro-optical device)
Next, an embodiment of the electro-optical device according to the invention will be described. In addition, this embodiment shows an example of this invention and this invention is not limited to this embodiment. FIG. 12 is a plan view schematically showing a liquid crystal device 100 which is an embodiment of the electro-optical device according to the invention. The liquid crystal device 100 of the present embodiment is a liquid crystal device including an active matrix type liquid crystal panel capable of color display that is transmissive. As the switching element, an amorphous silicon TFT (Thin Film Transistor) element is used.

  The liquid crystal device 100 includes a liquid crystal panel 101 as an electro-optical panel, and an illumination device (not shown) provided on the side opposite to the display surface side of the liquid crystal panel 101. The liquid crystal panel 101 includes a device substrate 102 as a translucent substrate disposed on the back side of the paper and a color filter substrate 103 disposed on the front side of the paper so as to face the device substrate 102 around the frame. Are formed by sticking together with a sealing material 104 in the form of a plate. In a region between the element substrate 102 and the color filter substrate 103 and surrounded by the sealing material 104, for example, a liquid crystal layer such as a TN (Twisted Nematic) mode is sealed to form a liquid crystal layer.

  In this embodiment, the color filter substrate 103 is disposed on the observation side (front side of the paper), and the element substrate 102 is disposed on the back side (back side of the paper surface) as viewed from the observation side. Accordingly, the lighting device is disposed on the back side of the drawing in FIG. In FIG. 12, a part of the color filter substrate 103 on the front side is shown in a cutaway manner so that the internal structure of the element substrate 102 on the back side can be easily seen.

  First, the configuration of the element substrate 102 will be described. The element substrate 102 includes a first light-transmitting substrate 102a having a rectangular shape or a square shape when viewed in plan from the observation side. The first translucent substrate 102a is formed of translucent glass, translucent plastic, or the like, for example. An optical element (not shown) such as a polarizing layer is provided on the outer surface (that is, the back side of the paper) of the first light-transmitting substrate 102a as necessary. A plurality of source lines 111, gate lines 112, TFT elements 113, pixel electrodes 114, and the like are mainly formed on the inner (liquid crystal layer side) surface of the first translucent substrate 102a.

  Each source line 111 extends in the column direction Y (that is, the vertical direction in FIG. 12). Each gate line 112 extends in the row direction X (that is, the left-right direction in FIG. 12). A TFT element 113 which is an active element functioning as a switching element is formed connected to the source line 111 and the gate line 112. The source line 111, the gate line 112, and the pixel electrode 114 are connected to the source, gate, and drain of the TFT element 113, respectively. The source line 111 functions as a data line that transmits a data signal to the TFT element 113. On the other hand, the gate line 112 functions as a scanning line for transmitting a scanning signal to the TFT element 113.

  On the other hand, the color filter substrate 103 opposed to the element substrate 102 has a second light-transmitting substrate 103a having a rectangular or square shape when viewed in plan from the observation side. The second translucent base material 103a is formed of, for example, translucent glass, translucent plastic, or the like. An optical element (not shown) such as a polarizing layer is provided on the outer surface (that is, the front side of the paper) of the second translucent substrate 103a as necessary. On the inner side (liquid crystal layer side) surface of the second translucent substrate 103a, for example, a lattice-shaped light shielding layer (not shown), a colored layer 125, and a common electrode 126 are provided.

  Each of the colored layers 125 is set to an optical characteristic that allows one of R (red), G (green), and B (blue) to pass therethrough, and the colored layers 125 of R, G, and B are predetermined in plan view. These are arranged in a stripe arrangement in this embodiment. The light shielding layer is formed by overlapping colored layers 125 of different colors or by using a predetermined material (for example, Cr).

  The common electrode 126 is provided over substantially the entire surface of the color filter substrate 103. On the other hand, the plurality of pixel electrodes 114 provided on the element substrate 102 are arranged in a matrix along the row direction X and the column direction Y as viewed in plan. These pixel electrodes 114 and the common electrode 126 provided on the color filter substrate 103 overlap with each other in a plurality of dot-like (that is, island-like) regions when seen in a plan view. The overlapping region forms a sub-pixel P that is a unit region for display. A plurality of sub-pixels P are arranged in a matrix in the row direction X and the column direction Y, thereby forming a rectangular or square effective display region V. In this effective display region V, characters, numbers, figures, etc. An image is displayed. Since the effective display area V has substantially the same area as the common electrode 126, it is indicated by the same line as the common electrode 126 in the figure.

  The first translucent base material 102 a constituting the element substrate 102 has an overhanging portion 105 that projects to the outside of the substrate 103. A wiring 118 is formed on the surface of the overhang portion 105 by, for example, a photoetching process. A plurality of wirings 118 are formed, and the plurality of the wirings 118 are arranged along the row direction X at intervals. In addition, a plurality of wirings 119 are formed in the vicinity of the side edge of the overhang portion 105 so as to be arranged along the row direction X at intervals. One end on the outer side of these wirings 119 is disposed on the side end of the overhanging portion 105, and an external board side terminal 115 to which a wiring terminal on an FPC (Flexible Printed Circuit) board 122 is conductively connected. Function as. The other end on the inner side of the wiring 119 is disposed at a position corresponding to a bump of a driving IC 120 described later, and functions as an input terminal 116 as a board side terminal.

  The plurality of wirings 118 are formed so as to extend in the column direction Y from the overhanging portion 105 into the region surrounded by the sealing material 104. A part of these wirings 118 is directly connected to the source line 111 on the base material 102a in a region surrounded by the sealing material 104 and functions as a data line. In addition, another part of the plurality of wirings 118 is formed so as to extend in the column direction Y along the side edge of the substrate 102a in the region surrounded by the sealant 104, and further bent and extends in the row direction X. It is formed as a pattern. The wiring 118 of this pattern is directly connected to the gate line 112 on the base material 102a and functions as a scanning line. On the other hand, the end of the wiring 118 located on the overhanging portion 105 is disposed at a position corresponding to a bump of a driving IC 120 described later, and functions as an output terminal 117 as a substrate side terminal.

  A driving IC 120 as a semiconductor device is mounted on the surface of the overhang portion 105 using an NCF 121. The driving IC 120 transmits a data signal to the source line 111 and transmits a scanning signal to the gate line 112. The plurality of TFT elements 113 that are a switching element group in which the source line 111 and the gate line 112 are connected are driven using the driving IC 120. That is, the plurality of subpixels P provided with the TFT element 113 are driven by the driving IC 120.

The liquid crystal panel 101 having the above configuration performs the following operation when driven.
When a scanning signal (ON signal) is sequentially transmitted to the gate line 112 as a scanning line and a data signal is transmitted to an appropriate source line (data line) 111 in the scanning line, the corresponding TFT element 113 is turned ON. In this state, writing to the liquid crystal in the corresponding sub-pixel P is performed. Further, when the TFT element 113 is subsequently turned off, the written state is maintained. The alignment of the liquid crystal molecules is controlled by this series of writing operation and holding operation. When the light emitted from the illumination device enters the liquid crystal layer, the polarized light passing through the liquid crystal layer is modulated according to the above-described alignment control, and the progress of the modulated polarized light is adjusted by the polarizing layer, thereby performing a desired display. Is called.

  In the liquid crystal device 100 having the above configuration, the mounting structure 1 in FIG. 1 can be applied as a mounting structure in which the driving IC 120 is mounted on the first light-transmitting substrate 102a. That is, the driving IC 120 in FIG. 12 has a plurality of bumps 12, first inspection bumps 18, and second inspection bumps 19, similar to the semiconductor device 2 in FIG. 1.

  In a state where the driving IC 120 is mounted on the first translucent substrate 102a, a plurality of bumps 12 provided along one side 120a of the driving IC 120 are a plurality of inputs of the first translucent substrate 102a. The plurality of bumps 12 provided along the other side 120 b are pressed and contacted with the plurality of output terminals 117. A bump located closest to the four corners of the base material, which is a component of the driving IC 120, is the first inspection bump 18, and a bump adjacent to the first inspection bump 18 is the second inspection bump 19. These first inspection bumps 18 and second inspection bumps 19 come into surface contact with the surface of the substrate 102a to form contact surfaces, as can be understood from FIG.

  Also in the liquid crystal device 100 of the present embodiment, the contact surface between the inspection bump 18 and the inspection pattern 30 or the like is taken as a microscopic image from the side opposite to the side where the driving IC 120 of the overhang portion 105 is mounted (the back side of the paper). By observing and making a determination based on the above-mentioned (determination criteria 1) to (determination criteria 5), the contact state between the bump 12 and the input terminal 116 and the contact state between the bump 12 and the output terminal 117 It is possible to easily determine whether the quality is good or bad by human eyes. Thereby, the quality of the mounting state with respect to the base material 102a of the drive IC 120 can be easily determined.

(First application example to electronic equipment)
The electro-optical device according to the invention can be applied to various electronic apparatuses. FIG. 13 shows an example of the application. The electronic device shown here includes a liquid crystal device 201 and a control circuit 202 that controls the liquid crystal device 201. The liquid crystal device 201 includes a liquid crystal panel 203 and a drive circuit 204. The control circuit 202 includes a display information output source 205, a display information processing circuit 206, a power supply circuit 207, and a timing generator 208.

  The display information output source 205 includes a memory such as a RAM (Random Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and various clock signals generated by the timing generator 208. The display information processing circuit 206 is supplied with display information such as an image signal in a predetermined format.

  The display information processing circuit 206 includes a number of well-known circuits such as an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like. The display information processing circuit 206 executes processing of input display information and converts an image signal into a clock signal CLK. At the same time, it is supplied to the drive circuit 204. Here, the drive circuit 204 is a general term for an inspection circuit and the like together with a scanning line drive circuit and a data line drive circuit. The power supply circuit 207 supplies a predetermined power supply voltage to each of the above components.

  The liquid crystal device 201 is configured using, for example, the liquid crystal device 100 shown in FIG. According to the liquid crystal device 100, since the first inspection bump 18 and the second inspection bump 19 are provided on the driving IC 120, the side opposite to the side where the driving IC 120 is mounted on the overhanging portion 105 (the back side of the drawing). , By observing the contact surface of the first inspection bump 18 and the contact surface of the second inspection bump 19, the contact state between the signal transmission bump 12 and the input terminal 116, and the bump 12 and output It is possible to easily determine whether the contact state with the terminal 117 is good or not by human eyes. Thereby, the quality of the mounting state of the driving IC 120 can be determined inexpensively and accurately. Therefore, the electronic apparatus of FIG. 13 using the liquid crystal device 100 is less likely to be defective in the display portion and can be manufactured at low cost.

(Second application example to electronic equipment)
FIG. 14 shows a mobile phone which is another example of application of the electro-optical device according to the present invention to an electronic apparatus. A cellular phone 210 shown here includes a main body 211 and a display body 212 provided so as to be openable and closable with respect to the main body 211. The display unit 212 is provided with a display device 213 and a receiver 214. Various displays relating to telephone communication are displayed on the display screen 215 of the display device 213. A control unit for controlling the operation of the display device 213 is stored in the main body unit 211 or the display body unit 212 as a part of the control unit that controls the entire mobile phone or separately from the control unit. The The main body 211 is provided with an operation button 216 and a transmitter 217.

  The display device 213 is configured using, for example, the liquid crystal device 100 shown in FIG. According to the liquid crystal device 100, since the first inspection bump 18 and the second inspection bump 19 are provided on the driving IC 120, the side opposite to the side where the driving IC 120 is mounted on the overhanging portion 105 (the back side of the drawing). By observing the contact surface of the first inspection bump 18 and the contact surface of the second inspection bump 19, the contact state between the bump 12 and the input terminal 116 and the contact state between the bump 12 and the output terminal 117 are determined. The determination can be easily performed by human eyes. Thereby, the quality of the mounting state of the driving IC 120 can be determined inexpensively and accurately. Therefore, the electronic device of FIG. 14 using the liquid crystal device 100 is less likely to be defective in the display portion and can be manufactured at low cost.

  The electro-optical device according to the present invention is not limited to a mobile phone, but is a personal computer, a liquid crystal television, a viewfinder type or a monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation. It can be applied to various electronic devices such as a video phone device, a POS terminal, a digital still camera, and an electronic book.

It is a top view which shows one Embodiment of the mounting structure which concerns on this invention. (A) is sectional drawing of the mounting structure according to the AA line of FIG. 1, (b) is the top view seen from the arrow C side of (a). It is a figure which shows the semiconductor device used with the mounting structure of FIG. 1, (a) is the whole perspective view which looked at the semiconductor device from the active surface side, (b) is the cross section according to the DD line of (a). FIG. It is a top view which shows the bump pair for a test | inspection which is the principal part of FIG. It is a top view which shows the other aspect of the contact surface of the test bump pair of FIG. It is a top view which shows other embodiment of the mounting structure which concerns on this invention. It is a top view which shows other embodiment of the mounting structure which concerns on this invention. It is a whole perspective view which shows the semiconductor device used with the mounting structure of FIG. 7 from the active surface side. FIG. 8 is a plan view illustrating a pair of inspection bumps, which is a main part of FIG. It is a top view which shows other embodiment of the mounting structure which concerns on this invention. It is a top view which shows the example of determination in the inspection method of the mounting structure which concerns on this invention. FIG. 3 is a plan view showing a part of an embodiment of the electro-optical device according to the invention. FIG. 10 is a circuit block diagram illustrating an application example of the electro-optical device according to the invention. FIG. 10 is a perspective view showing a mobile phone as another application example of the electro-optical device according to the invention.

Explanation of symbols

1. Mounting structure 2,42. 2. semiconductor device; Translucent substrate,
4,121. NCF (adhesive), 11. Substrate, 11a. Active surface,
12 12. Bump (protruding terminal), Electrode pads, 14. Protrusions, 15. Conductive film, 16. A passivation film, 16a. Openings, 17, 17a, 17b. Bump train, 18. First inspection bump (first protrusion),
19. 20. Second inspection bump (second protrusion), Bump pair for inspection,
21. 21. Input terminal (board side terminal) Output terminal (board side terminal), 23. Wiring, 24, 25, 26. Contact surface, 25a, 26a. The side of the contact surface,
31, 32. Translucent terminal (translucent member), 100. Liquid crystal device (electro-optical device),
101. Liquid crystal panel, 102. Element substrate (translucent substrate),
102a. First light-transmitting substrate, 103. Color filter substrate,
103a. Second translucent substrate, 104. Sealing material, 105. Overhang,
111. Source line, 112. Gate line, 113. TFT element, 114. Pixel electrodes,
115. 116. External substrate side terminal Input terminal (board side terminal),
117. Output terminals (board side terminals) 118,119. wiring,
120. Driving IC (semiconductor device), 120a, 120b. Sides of the driving IC,
122. FPC board, 125. 126 colored layer; Common electrode, 201. Liquid crystal device,
202. Control circuit, 203. Liquid crystal panel, 204. Drive circuit,
210. Mobile phone (electronic device), W1. The width of the first inspection bump,
W2. Width of second inspection bump, W3. Bump width, L. Contact length, P.I. Sub-pixel,
V. Indicated Area

Claims (6)

A mounting structure having a light-transmitting substrate and an electronic component mounted on a mounting surface of the light-transmitting substrate via a bonding member,
A plurality of board-side terminals are provided on the surface on which the electronic component of the translucent board is mounted,
The electronic component includes a plurality of protruding terminals including protrusions having elasticity on a surface on which the light-transmitting substrate is mounted, and at least a pair of first protrusions and second protrusions having elasticity. Have
Each of the first protrusion and the second protrusion forms a contact surface that is elastically deformed in contact with the mounting surface of the translucent substrate, and the contact surface of the first protrusion is in a vertical direction or a horizontal direction. And the contact surface of the second protrusion has vertical and horizontal widths corresponding to the first protrusion, and the long side of the contact surface of the first protrusion. vertical to the long side width of the different longitudinal or transverse direction to the direction or lateral width or the vertical and horizontal width equal length becomes,
The contact surface of the first protrusion and the contact surface of the second protrusion can be observed through the translucent substrate,
Based on the difference in shape between the contact surface of the first protrusion and the contact surface of the second protrusion, the contact state between the plurality of protruding terminals and the board-side terminal that individually contacts them can be inspected. A mounting structure characterized in that it can . The mounting structure according to claim 1,
At least one of the first protrusion and the second protrusion constitutes a terminal. The mounting structure according to claim 2,
At least one terminal of said 1st protrusion and said 2nd protrusion is connected to the board | substrate side terminal formed with the translucent material, The mounting structure characterized by the above-mentioned. A method for inspecting a mounting structure having a light-transmitting substrate and an electronic component mounted on a mounting surface of the light-transmitting substrate via a bonding member,
A plurality of board-side terminals are provided on the surface on which the electronic component of the translucent board is mounted,
The electronic component has a plurality of projecting terminals including a projecting body having elasticity on a surface on which the translucent substrate is mounted, and at least one pair of first projecting section and second projecting section having elasticity. And
Each of the first protrusion and the second protrusion is in contact with the mounting surface of the translucent substrate to form a contact surface,
The contact surface changes in contact length due to a change in pressure when the electronic component is mounted,
The first protrusion and the second protrusion have different widths in a direction perpendicular to the direction in which the contact length changes,
By observing the contact surface of the first protrusion and the contact surface of the second protrusion through the translucent substrate , the difference in shape between the contact surface of the first protrusion and the contact surface of the second protrusion Based on the above, the inspection method of the mounting structure is characterized by inspecting the contact state between the plurality of protruding terminals and the board-side terminals that individually contact them. In the mounting structure inspection method according to claim 4,
The contact surfaces of the first and second protrusions have corresponding vertical and horizontal widths, respectively.
The contact surface of the first protrusion is a contact surface having a long side in either the vertical direction or the horizontal direction,
The contact surface of the second protrusion is a contact surface having a longitudinal side or a lateral width different from the longitudinal or lateral width which is the long side of the first projection, or a longitudinal side. A method for inspecting a mounting structure, wherein inspection is performed based on whether the contact surface has the same length in the horizontal direction and in the horizontal direction.   An electro-optical device comprising the mounting structure according to claim 1.

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