JP4947864B2 - High temperature-substrate coating method and apparatus by sputtering - Google Patents

Description

[0001]
The present invention relates to a high temperature-substrate coating method by sputtering. In this method, heating is performed after the substrate is attached to the substrate holder that is arranged so as to be movable in the case, and sputtering is performed using the target device while moving the substrate holder.
[0002]
Such a method is known from German Offenlegungsschrift 410 4592 A1. In order to carry out this known method, an apparatus including a substrate holder formed as a turntable in a case is used. Below the turntable is a device for heating the substrate, which is mounted on the turntable before coating. On the opposite side of the substrate having the side to be coated is a target that performs sputtering after the substrate is fully heated. In this case, sputtering is performed while rotating the rotating disk to achieve a uniform layer, because the target is adjusted so that it is outside the play gap of the central axis of the rotating disk, and relative to the substrate. This is because they are arranged to run diagonally. In known methods or known devices, the substrate is only coated on one side. If the other side of the substrate is also to be coated, a second sputtering step must be performed with the substrate placed on the turntable in the reverse direction.
[0003]
It is an object of the present invention to further improve this method so that it is possible to more economically coat both sides of the substrate with a single sputtering process using the method of the type mentioned at the beginning.
[0004]
To solve this problem, according to the present invention, the method of the type mentioned at the beginning allows free access to both sides of the substrate, and when the substrate holder is moved, the opposite sides of the case that surrounds the substrate holder on these sides. At least one substrate is attached to the substrate holder so that the substrate passes by the part. Heating is performed by radiant heating from the case, and sputtering is performed using a target device that is composed of two targets and exists in front of the opening outside the case. In this case, the substrate means not only a single wafer coated on both sides in a single work process, for example, but two wafers should be coated on only one side in a single work process, for example. Means a composite substrate composed of two wafers.
[0005]
The main advantage of the method according to the invention is that it is possible to coat both sides of the substrate in a single process, so that the coating can be carried out significantly more economically than known methods. In that case, generally only a target device consisting of two targets is used, so that the additional cost is considerably reduced. Yet another major advantage is that if only one sputtering step is required, the quality of the layers on both sides will be the same if the same type of target is used.
[0006]
In the method according to the invention, the substrate holder can be moved in various ways. It is advantageous if the substrate holder with at least one substrate passes by the opening with translational vibration. In this embodiment of the method according to the invention, if the target used allows a fairly elongated opening in the case, any of the plurality of substrates on the substrate holder can be coated on both sides simultaneously.
[0007]
The method according to the invention achieves particularly good results when the substrate holder passes at a frequency such that the substrate temperature remains unchanged while passing by the case opening.
[0008]
In another advantageous embodiment of the method according to the invention, the substrate holder with at least one substrate passes by the opening by a rotational movement. The advantage of this embodiment of the method according to the invention is in particular that the devices required for the method can be formed relatively easily.
[0009]
In the above-described embodiments of the method according to the invention, it is advantageous if the substrate holder is rotated at a speed such that the substrate temperature is kept unchanged while passing by the case opening.
[0010]
In the method according to the invention, radiant heating can be generated in various ways. Use of an electric heating device for radiation heating is considered particularly advantageous in terms of cost and controllability.
[0011]
From the above-mentioned German Patent Publication No. 4104592 A1, an apparatus for high temperature-substrate coating using sputtering having a substrate heating, a case with a substrate holder kept in a movable state in the case and a target device Is also known.
[0012]
Yet another object of the present invention is to improve such an apparatus so that it can be coated on both sides of the substrate in a single sputtering process.
[0013]
According to the present invention, in order to solve this problem, the substrate holder includes a substrate holding device having a configuration in which the substrate is held in a form that allows free access to both sides of the substrate. On both side surfaces of the case facing the substrate holder, there are openings at positions where the substrate passes by the opening when the substrate holder is moved. The target device is composed of two targets each outside the case and in front of the opening, and the substrate is heated by radiant heating of the case. The device according to the invention is particularly advantageous in that it allows a relatively simple coating of the substrate on both sides of the substrate in a single step.
[0014]
In the device according to the invention, the substrate holder can be formed in various ways. It is considered advantageous if the substrate holder is a carriage that moves in the case.
[0015]
With regard to the costs for manufacturing the device according to the invention, at least one region outside the central axis is located such that the substrate holder is a turntable and the substrate passes by the opening when the substrate holder rotates. It is particularly preferable to have a substrate holding device.
[0016]
The device according to the invention can be formed in various ways for radiant heating, for example, this heating being ensured by externally heating the case in any way. However, for the reason of manufacturing at a low cost, and in order to achieve proper temperature control, it is particularly advantageous that the radiant heater is composed of one heating mat inside each side having the opening of the case. It is done.
[0017]
In the device according to the invention, the openings can be arranged in various ways on opposite sides of the case, for example the openings can be directly facing each other. In that case, it is particularly advantageous if the openings face each other diagonally. This is because, in this way, equalization of the thermal load on the substrate is achieved by thermal radiation through the two openings.
[0018]
The present invention will be described in more detail with reference to the drawings.
[0019]
As can be seen in FIG. 1, the illustrated device 1 has a case 2 in which a substrate 3 reciprocates on a carriage 4 while reciprocally oscillating in the direction of a double arrow 5. Can do. The drive for the substrate holder is not shown for the sake of simplicity.
[0020]
1 also shows that the case 2 has one opening 8 and 9 on its opposite sides 6 and 7 respectively, and the substrate holder 4 vibrates in translation along with the substrate 3 beside these openings. Pass while moving. In front of the openings 8 and 9 there are also targets 10 to 11 which are also schematically indicated.
[0021]
There are one heating mats 14 to 15 on the inner wall 12 of the case side surface 6 and the inner wall 13 of the case side surface 7, respectively. These mats are not shown, but are equipped with electrical terminals, indicating that they are electric heaters. ing. Thermal radiation is emitted from these heating mats 14 and 15, whereby the substrate 3 is heated to the required temperature each time.
[0022]
When the substrate 3 is sufficiently heated, the targets 10 and 11 are activated and the original sputtering process is started. In this case, the substrate 3 reciprocates on the carriage together with the substrate holder 4. However, the substrate 3 is vibrated so that no significant cooling occurs every time the substrate 3 passes by the openings 8 and 9, that is, the temperature is maintained. A number is selected.
[0023]
As can be clearly seen from FIG. 2, the openings 8 and 9 in the side surfaces 6 and 7 of the case 2 form a vertically long rectangle, and there are targets 10 to 11 formed in a shape corresponding to this rectangle. If the substrate is considerably smaller than the openings 8 to 9, a plurality of substrates can be passed by the openings 8 and 9 in parallel with the carriage.
[0024]
The apparatus according to FIGS. 3 and 4 differs from the apparatus according to FIGS. 1 and 2 in that the substrate holder is formed as a turntable 20. 23 and 24 are supported in a freely accessible manner. In particular, as shown in FIG. 3, the turntable 20 is supported on a shaft 25.
[0025]
The substrate accommodating portion 21 having the substrate 22 is disposed on the turntable 20 so that the substrate passes by the openings 26 to 27 in the case walls 28 and 29 during the rotational movement. In front of these openings 26 and 27 are targets 30 and 31, which are used to coat the side surfaces 23 and 24 of the substrate 22.
[0026]
FIG. 4 shows that in this embodiment the openings 26 and 27 are circular corresponding to the dimensions of the substrate 22.
[Brief description of the drawings]
1 is a cross-sectional view of one embodiment of an apparatus for carrying out the method of the present invention.
FIG. 2 is a plan view of the embodiment according to FIG.
FIG. 3 is a cross-sectional view of another embodiment of an apparatus for carrying out the method according to the invention.
FIG. 4 is a plan view of this embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Whole apparatus 2 Case 3 Board | substrate 4 Carriage 8 Opening 9 Opening 10 Target 11 Target 14 Heating mat 15 Heating mat 20 Turntable 21 Substrate accommodating part 22 Substrate 25 Axis 26 Opening 27 Opening 30 Target 31 Target

Claims (7)

Hot by sputtering - for substrate coating, have rows heating after attaching the substrate (3) on to case (2) the substrate is placed in a movable fashion in a holder (4), said substrate holder (4) cormorant rows sputtering using a target (10, 11) in the movement of a high temperature by sputtering - the substrate coating process,
At least one of said substrate (3), on both sides (3a, 3b) form free access to the said substrate (3), and these sides (3a, 3b) together with the substrate holder (4) in the form of passes by the opening provided in mutually facing walls (6,7) of the case surrounding the (2) (8,9), Replacing the substrate holder (4),
There line heating by radiant heat from the casing (2),
The substrate holder (4) having the at least one substrate (3) is passed along the opening (8, 9) while being translated in translation along with the progress in the case (2). upon passing beside the opening (8,9), two targets were arranged a outer side and at a position facing the opening (8,9) of the case (2) (10, 11 ) I by the target device having the features a row intends <br/> be sputtered to the surface of the substrate (3), the high temperature by sputtering - a substrate coating process. The frequency of vibration of the substrate holder (4), a substrate temperature of the substrate (3) in past the said opening (8, 9) is set to the number of vibration as left unchanged <br A high temperature-substrate coating method by sputtering according to claim 1 characterized by the above-mentioned. The radiation pressure heat hot due to sputtering of claim 1, wherein that you use an electric heater - substrate coating process. Hot by sputtering - a substrate for the substrate is coated, a case (2), a substrate heater provided in the inner case (2), supported movably form the substrate (3) within said case a holder (4), and a data Ge' preparative (10, 11), a high temperature by sputtering - the substrate coating apparatus,
Said substrate holder (4) has the sides (3a, 3b) board accommodating portion for supporting in a state freely accessible to the substrate (3) the substrate (3),
The two walls of the case facing the said substrate holder (4) (6,7), openings (8,9) is in a position such that the side the substrate holder (4) to pass through when moving Provided,
It said target (10, 11) is a target placed at a position facing the a outer side and the openings (8,9) of the case (2),
The substrate heater (14, 15) comprises a radiant heater (14, 15) that applies radiant overheating in the case ( 2 ) .
The substrate holder (4) passes through the opening (8, 9) while moving in the case (2) while being translated in translation, and the case (2) is passed along the case (2). Sputtering is performed on the surface of the substrate (23) by a target device including two targets (10, 11) arranged outside the (2) and facing the openings (8, 9). A high temperature-substrate coating apparatus by sputtering , characterized in that it is set to be applied . It said substrate holder (4) is a high temperature by sputtering according to claim 4, characterized in that the carriage for moving the inner case (2) - a substrate coating apparatus. But the radiant heater, comprising a wall heating mat provided inside (12, 13) of (6,7) (14,15) of said case (2) having the opening (8, 9) 6. The sputtering high temperature-substrate coating apparatus according to claim 4 or 5 . The opening (8,9), diagonally across the trajectory of progression of the substrate holder (4) (or in a staggered manner) opposite case Migihitsuji, one surface opposite to that of said case (2) to other high temperature by sputtering according to one of claims 4 6, characterized in that they are respectively disposed on the one face - the substrate coating apparatus.

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