JP4952201B2 - Component joining apparatus and ultrasonic horn - Google Patents

Description

  The present invention relates to a component bonding apparatus and an ultrasonic horn that apply ultrasonic vibration to an ultrasonic horn while pressing the component against a surface to be bonded by a bonding operation portion of the ultrasonic horn and bond the component to the surface to be bonded.

  2. Description of the Related Art As a component bonding apparatus for bonding a component (electronic component) such as a semiconductor chip to a bonded surface of a substrate, an apparatus using ultrasonic vibration is known. This component joining apparatus fixes a ultrasonic horn, which is a horizontally long rod-like member, to a vertically movable elevating member so that the longitudinal direction and the width direction are horizontal, and is a joining action portion protruding downward from the lower surface of the ultrasonic horn. Ultrasonic vibration is applied to the ultrasonic horn while pressing the part against the surface to be joined, and the part is vibrated minutely to adhere to the surface to be joined.

In this ultrasonic horn, a plurality of fixing portions provided on both side surfaces in the width direction are fixed to the elevating member. These fixing portions sandwich the joining action portion in the longitudinal direction of the ultrasonic horn, and the ultrasonic horn. Because it is provided at the position of the node of the standing wave that is generated inside (the combined wave of the longitudinal vibration and the reflected wave that travels in the longitudinal direction in the ultrasonic horn), the joint action part located at the antinode of the standing wave is It vibrates (oscillates) in the longitudinal direction with a large amplitude, and the parts are joined efficiently (Patent Document 1).
JP 2005-347505 A

  By the way, in recent years, parts to be joined have been increased in size, and accordingly, the vibration amplitude given to the parts has to be made larger than before. In order to increase the amplitude of vibration applied to the parts, the power supplied to the vibrator should be increased to increase the vibration amplitude of the entire ultrasonic horn. To increase the vibration amplitude of the entire ultrasonic horn, However, it is necessary to reinforce each part of the component joining apparatus, and there is a problem that the entire apparatus becomes large.

  Then, an object of this invention is to provide the components joining apparatus and ultrasonic horn which can join a large sized component more efficiently than before.

  The component joining apparatus according to claim 1 includes a lifting member that can be moved up and down, and an ultrasonic horn fixed to the lifting member, and a component that is provided at a bonding action portion that protrudes downward from the lower surface of the ultrasonic horn. A component joining apparatus for joining a component to a surface to be joined by applying vibration to the ultrasonic horn while pressing the surface to the surface to be joined. Is fixed at a position that opposes the width direction and that sandwiches the bonding action portion in the longitudinal direction of the ultrasonic horn, and that is close to the bonding action portion with the bonding action portion sandwiched in the longitudinal direction. Between the portions, a pair of grooves extending in the width direction is provided with the base of the joining action portion sandwiched in the longitudinal direction.

The ultrasonic horn according to claim 2 is fixed to a lifting member that can freely move up and down in the component bonding apparatus, and is given from the component bonding apparatus while pressing the component against the surface to be bonded by a bonding operation portion that protrudes downward on the lower surface. The ultrasonic horn that joins the component to the surface to be joined in response to the generated vibration, and a plurality of fixing portions that are provided on both sides in the width direction of the ultrasonic horn and are fixed to the elevating member are opposed to the width direction. And the joining action part is disposed at a position sandwiching the longitudinal direction of the ultrasonic horn, and the joining action part is interposed between the fixing parts closest to the joining action part with the joining action part sandwiched in the longitudinal direction. A pair of grooves extending in the width direction is provided with a root sandwiched in the longitudinal direction.

  In the present invention, a groove is provided at the base of the joining action portion of the ultrasonic horn, and this increases the substantial height of the joining action portion, so that the vibration (swing) amplitude of the joining action portion is increased. And large parts can be joined efficiently. Moreover, it is not necessary to reinforce each part of a component joining apparatus, and cost reduction is achieved.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a component joining apparatus according to an embodiment of the present invention, FIG. 2 is a partial sectional front view of an ultrasonic horn according to an embodiment of the present invention, and FIG. FIG. 4 is a plan view of an ultrasonic horn according to an embodiment of the present invention.

  In FIG. 1, a component bonding apparatus 1 includes a positioning table 3 having a substrate holding portion 2 on the upper surface and a bonding mechanism 4 provided above the positioning table 3. An elevating member 6 that can be raised and lowered, and an ultrasonic horn 7 attached to the lower part of the elevating member 6 are provided. The ultrasonic horn 7 is a horizontally long rod-like member, and is fixed to the elevating member 6 so that the longitudinal direction (left-right direction parallel to the paper surface of FIG. 1) and the width direction (direction perpendicular to the paper surface of FIG. 1) are horizontal. Has been. A bonding member 8 is attached to the lower part of the ultrasonic horn 7.

  In FIG. 2, a through hole 7a extending in the thickness direction of the ultrasonic horn 7 (the vertical direction in the drawing in FIG. 2) is provided in the central portion of the ultrasonic horn 7 in the longitudinal direction (FIG. 2 ( a)) The joining member 8 is inserted into the through-hole 7a from below and is fixed in the through-hole 7a by a screw member 9 attached to the through-hole 7a from above the ultrasonic horn 7 (FIG. 2). (B)).

  The through hole 7a extends downward and opens to the lower surface 7b and the upper surface 7c of the ultrasonic horn 7, and the inner surface of the through hole 7a is a conical tapered surface 7d. The bonding member 8 includes a bonding portion 8b having a bonding surface 8a on the lower surface, and an extending portion 8c extending upward from the bonding portion 8b. The bonding portion 8b is formed on the upper portion of the bonding portion 8b and the upper portion of the extending portion 8c. Are respectively formed with tapered surfaces 8d and 8e. The bonding member 8 is positioned with respect to the through hole 7a by bringing the tapered surfaces 8d and 8e into contact with the tapered surface 7d of the through hole 7a from below. When the screw member 9 is screwed into a screw hole 8 f provided in the upper portion of the extending portion 8 c of the bonding member 8, and the bonding member 8 is attached to the ultrasonic horn 7 by the screw member 9, the bonding member 8 is in a state of protruding downward from the lower surface 7 b of the ultrasonic horn 7.

  In FIG. 3, a first suction pipe 7 e is provided inside the ultrasonic horn 7. One end of the first suction pipe 7e is connected to an opening (upper surface opening 7f) of the upper surface 7c of the ultrasonic horn 7, and the other end is an intermediate portion between the two tapered surfaces 8d and 8e of the bonding member 8. It is connected to a pipe relay space 7g formed by being surrounded by (the root portion of the extending portion 8c) and the tapered surface 7d of the ultrasonic horn 7. In addition, the other end of the second suction pipe 8g that extends through the joining action member 8 and has one end opened to the joining action surface 8a communicates with the duct relay space 7g. The second suction pipe 8g is in a state of being connected to each other via the pipe relay space 7g. Furthermore, since the upper surface opening 7f of the ultrasonic horn 7 is connected to the vacuum suction source 12 via an external conduit 11 extending outside the ultrasonic horn 7 (see FIG. 1), the vacuum suction source 12 is activated. If air is sucked in this way, the semiconductor chip 14 brought into contact with the bonding action surface 8a can be adsorbed and held on the bonding action surface 8a.

1 and 3, a vibrator 10 for applying ultrasonic vibration to the ultrasonic horn 7 is attached to one end side in the longitudinal direction of the ultrasonic horn 7 (right side of the drawing in FIGS. 1 and 3). The vibrator 10 is driven in response to a command from a vibrator driving unit (not shown) provided outside the ultrasonic horn 7 and applies longitudinal vibration in the longitudinal direction of the ultrasonic horn 7.

  In FIG. 4, on both side surfaces 7h in the width direction of the ultrasonic horn 7, four fixing portions 7k attached to the elevating member 6 are provided extending outward. These four fixing portions 7k are arranged at positions facing the width direction of the ultrasonic horn 7 and sandwiching the bonding action member 8 (the bonding action portion 8b) in the longitudinal direction. Each fixing portion 7k is provided with a bolt hole 7m penetrating in the height direction of the ultrasonic horn 7 (vertical direction of the component joining apparatus 1), and a bolt (not shown) provided through the bolt hole 7m. ), The ultrasonic horn 7 is fixed to the elevating member 6.

  Here, in order to minimize the attenuation of vibration caused by fixing (restraining) the ultrasonic horn 7 to the elevating member 6, the two fixing portions 7 k facing the longitudinal direction of the ultrasonic horn 7 are provided in the ultrasonic horn 7. Are located at adjacent nodes at a distance of half the wavelength of the standing wave. Therefore, by providing the ultrasonic horn 7 with ultrasonic vibration having an appropriate frequency capable of creating a longitudinal vibration resonance state in the longitudinal direction of the ultrasonic horn 7, the ultrasonic horn 7 is positioned at the antinode of the standing wave of the ultrasonic vibration. The joining portion 8b can be vibrated (oscillated) with a large amplitude in the longitudinal direction of the ultrasonic horn 7.

  3 and FIG. 4, the base of the bonding action portion 8 b is located between the fixed portions 7 k sandwiching the bonding action portion 8 b in the longitudinal direction of the ultrasonic horn 7 and between the fixing portions 7 k. A pair of grooves 7p extending in the width direction of the ultrasonic horn 7 are provided in the longitudinal direction. The pair of grooves 7p extending in the width direction of the ultrasonic horn 7 is for increasing the substantial height of the bonding operation portion 8b. That is, in this ultrasonic horn 7, the height of the bonding action portion 8b from the lower surface 7b of the ultrasonic horn 7 is h, but the height of the bonding action portion 8b from the bottom of the groove 7p, that is, a substantial height. This is H larger than h (FIG. 3).

  In order to bond the semiconductor chip 14 to the bonded surface 13 a on the upper surface of the substrate 13, the substrate 13 is held on the upper surface of the substrate holding unit 2, and the semiconductor chip 14 is sucked and held on the bonding action surface 8 a of the ultrasonic horn 7. Let Then, the elevating member 6 (that is, the ultrasonic horn 7) is lowered by the elevating and pressing mechanism 5, and the solder bump 14 a formed on the lower surface of the semiconductor chip 14 is pressed against the bonded surface 13 a of the substrate 13. In this state, the ultrasonic horn 7 is heated by a heater (not shown), the temperature of the semiconductor chip 14 and the substrate 13 adsorbed and held by the ultrasonic horn 7 is increased, and the solder bump 14a is melted to drive the vibrator 10. When ultrasonic vibration is applied to the ultrasonic horn 7, the bonding portion 8 b of the ultrasonic horn 7 vibrates (oscillates) in the longitudinal direction of the ultrasonic horn 7 while adsorbing the semiconductor chip 14. The load and the vibration act simultaneously, and the semiconductor chip 14 is bonded to the bonded surface 13a of the substrate 13 by the melted solder bump 14a.

  Here, in the component joining apparatus 1 according to the present embodiment, the groove 7p is provided at the base of the joining action portion 8b of the ultrasonic horn 7, and thereby the substantial height of the joining action portion 8b is increased. Therefore, for the same vibration amplitude of the ultrasonic horn 7, the vibration (swinging) amplitude of the bonding action portion 8 b is larger than that of the conventional one having no groove 7 p. That is, in the component bonding apparatus 1 according to the present embodiment, the vibration (swinging) amplitude of the bonding operation portion 8b can be increased without significantly increasing the power supplied to the vibrator 10, and thus a large semiconductor chip. 14 (components) can be joined efficiently. Further, in the component bonding apparatus 1 according to the present embodiment, since the large semiconductor chip 14 can be bonded without significantly increasing the power supplied to the vibrator 10, each part of the component bonding apparatus 1 is reinforced. There is no need, and cost reduction can be realized.

Instead of providing the groove 7p at the base as in the ultrasonic horn 7 in the present embodiment, a method of increasing the vibration amplitude by increasing the height of the bonding portion 8b itself is also conceivable. Since the action part 8b extends downward, the weight of the ultrasonic horn 7 increases. In this respect, in the component joining apparatus 1 according to the present embodiment, the joining action portion 8b does not extend and the weight of the groove 7p is reduced, so that the ultrasonic horn 7 can be made lighter than before. .

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the bonding operation portion 8 b is configured to be detachable from the ultrasonic horn 7 as a part of the bonding operation member 8, but the bonding operation portion 8 b is the lower surface 7 b of the ultrasonic horn 7. It suffices to have a function of projecting downward from the semiconductor chip 14 and pressing the semiconductor chip 14 (component) against the bonded surface 13 a, and is not necessarily detachable from the ultrasonic horn 7.

  Larger parts than before can be joined efficiently.

The front view of the component joining apparatus in one embodiment of this invention The partial cross section front view of the ultrasonic horn in one embodiment of the present invention The partial cross section front view of the ultrasonic horn in one embodiment of the present invention The top view of the ultrasonic horn in one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component joining apparatus 6 Elevating member 7 Ultrasonic horn 7b Lower surface 7h Side surface 7k Fixed part 7p Groove 8b Joining action part 13a Joined surface 14 Semiconductor chip (component)

Claims (2)

The ultrasonic horn has an elevating member that can freely move up and down, and an ultrasonic horn fixed to the elevating member. A component joining apparatus for joining a component to a surface to be joined by applying vibration,
A plurality of fixing portions provided on both side surfaces of the ultrasonic horn in the width direction and fixed to the elevating member are disposed at positions facing the width direction and sandwiching the bonding operation portion in the longitudinal direction of the ultrasonic horn. And a pair of grooves extending in the width direction with the base of the joining action portion sandwiched in the longitudinal direction is provided between the fixing portions that are closest to the joining action portion with the joining action portion sandwiched in the longitudinal direction. A component joining apparatus characterized by comprising: The component joining device is fixed to a liftable member that can be raised and lowered, and receives a vibration from the component joining device while pressing the component against the surface to be joined by a joint acting portion that protrudes downward on the lower surface. An ultrasonic horn for joining,
A plurality of fixing portions provided on both side surfaces of the ultrasonic horn in the width direction and fixed to the elevating member are disposed at positions facing the width direction and sandwiching the bonding operation portion in the longitudinal direction of the ultrasonic horn. And a pair of grooves extending in the width direction with the base of the joining action portion sandwiched in the longitudinal direction is provided between the fixing portions that are closest to the joining action portion with the joining action portion sandwiched in the longitudinal direction. An ultrasonic horn characterized by having

Images