JP4953366B2 - Thin section manufacturing apparatus and thin section manufacturing method - Google Patents

Description

  The present invention relates to a thin-slice preparation device and a method for preparing a thin slice by cutting an embedded block in which a biological sample taken out of a human body, a laboratory animal, or the like is embedded.

  Conventionally, as one method for inspecting and observing a biological sample taken from a human body or a laboratory animal, a thin section is prepared from an embedding block in which the biological sample is embedded with an embedding agent, and then a staining process is performed. A method for observing a biological sample is known. In order to enable observation at the cellular level, thin slices prepared from such embedded blocks are cut uniformly in a thickness of about 3 to 5 μm so as not to damage the embedded biological sample. There is a need to. For this reason, conventionally, the operation of producing a thin section from such an embedding block has been entrusted to a manual operation by a skilled worker using a thin blade cutter kept in a sharp state. On the other hand, for example, in a preclinical test, several hundred embedded blocks are prepared per test, and several thin sections are prepared per embedded block. For this reason, since it is necessary for an operator to produce an enormous number of thin sections, in recent years, automation of a series of processes for producing thin sections is desired.

  To automate the preparation of such thin sections, a sample stage that supports the embedding block and is movable in the direction perpendicular to the cutting surface of the embedding block, and the sample stage is moved in the vertical direction. Proposed cutting device equipped with piezoelectric actuator, position detector that detects the vertical position of the cutting surface of the embedded block that appears sequentially by cutting, and a cutter that can cut the embedded block at a predetermined position by the operating mechanism (For example, refer to Patent Document 1). In such a cutting device, the position detector detects the position of the embedded block cutting surface in the vertical direction, thereby feeding back the difference between the cutter position and the cutting surface position automatically and accurately. It can be cut.

In addition, the embedded block is automatically sent to the position where the cutter is placed via the feed base, and the feed base is sent in the direction of the surface sensor via the power drive unit. A method has been proposed in which the position of the power driving device is detected by contact, and compared with the position of the cutter, and based on this comparison, alignment is performed by the power driving device (see, for example, Patent Document 2).
JP-A-10-104131 Special Table 2002-539424

  However, in the apparatus according to Patent Document 1 and the method according to Patent Document 2, when the deterioration occurs, the cutter is replaced with a new one, or the cutter is replaced according to the purpose such as roughing or main cutting, so that the dimensional accuracy of the cutter Due to the mounting accuracy, the position of the cutter is displaced. For this reason, there is a problem that if the continuous cutting is performed, the thickness of the thin slice to be produced cannot be made uniform due to the displacement of the position of the cutter. The thickness of the thin section affects the staining state in the subsequent process of staining the biological sample, and becomes a major factor that degrades the quality of the thin section specimen. On the other hand, in order to adjust the position of the cutter, the embedded block is cut once to form an embedded block cutting surface, and if this cutting surface is measured with a position detector, a thin slice with a uniform thickness is obtained again. However, it is not possible to confirm whether or not the cut cutting surface is uniformly formed on the entire embedding block. For this reason, it is necessary to cut the embedding block to a certain thickness in order to form a cutting surface uniformly on the entire embedding block. When replacing the cutter, the embedding block is unnecessary. There was a problem of cutting. Furthermore, in the method according to Patent Document 2, since it is necessary to bring the embedding block into contact with the surface sensor, there is a possibility that the embedding block may be damaged when the embedding block is brought into contact with the surface sensor.

  The present invention has been made in view of the above-described circumstances, and when replacing the cutter, it is possible to produce a thin slice by adjusting the position without unnecessarily cutting the embedded block. A thin-slice manufacturing apparatus and a method for manufacturing a thin-slice are provided.

In order to solve the above problems, the present invention proposes the following means.
The thin-section preparation apparatus of the present invention includes a sample stage for fixing an embedding block, and a feeding means for moving the cutter relative to the embedding block by a predetermined amount of movement in the thickness direction of the thin section to be manufactured. And a cutting means for reciprocating the cutter relative to the embedding block in a cutting direction, and the embedding block is cut along with the reciprocation of the cutter by the cutting means. Cutting surface detecting means for detecting the state of the cutting surface and outputting the detected data as detection data , wherein the cutting surface detecting means is provided on one of the cutter and the sample stage, and the cutter of the cutting means A cutting force detection unit that detects a cutting force generated when the embedded block is cut by the cutting force and outputs the cutting force data, and a relative relationship in the cutting direction between the cutter and the embedded block A cutter position detection unit that detects a position and outputs the position as cutter position data, and the detection data includes the cutting force data and the cutter position data, and the cutting surface detection unit detects the cutting surface. Based on the detection data, the amount of movement of the feeding means, the rough cutting amount when the cutting surface is not formed on the entire embedding block, and the cutting surface is formed on the entire embedding block. It is characterized by comprising a control unit for setting either the thickness of the thin section at this time or the corresponding main cutting amount .

In addition, the method for producing a thin section of the present invention includes a preparation step in which a cutter is arranged with a gap in the thickness direction of the thin section to be produced with respect to the embedding block fixed to the sample stage, and the embedding block. A cutting step of moving the cutter relatively in the thickness direction by a predetermined amount of movement, and then reciprocating the cutter in the cutting direction relative to the embedded block; Based on the cutting surface detection step of detecting the state of the cutting surface formed by cutting the embedded block in the cutting step and outputting it as detection data, and the detection data output in the cutting surface detection step, and an evaluation step of evaluating the state of the cutting surface, said cutting surface detection process detects a cutting force generated upon cutting the embedded block by the cutter in the cutting process, the cutting force data And detecting the relative position of the cutter in the cutting direction with respect to the embedding block, and outputting the detected position as cutter position data. The detection data is configured by the cutting force data and the cutter position data. The cutting step includes moving the cutter relative to the embedding block relative to the embedding block by moving the cutter relative to the embedding block, and moving the cutter relative to the embedding block. A main cutting step of moving as a moving amount by a main cutting amount corresponding to the thickness of the thin section, the cutting surface detection step and the evaluation step are performed after the rough cutting step, the evaluation step, When it is determined that the cutting surface is not formed on the entire embedding block based on the detection data, the rough cutting process is performed again, Kezumen is when it is determined to have been formed on the entirety of the embedded block is characterized in that the process proceeds to the main cutting step.

  According to the thin-slice manufacturing apparatus and the thin-slice manufacturing method according to the present invention, as a preparation process, the cutter is arranged with a gap in the thickness direction with respect to the embedding block. Next, as a cutting step, the cutter is moved by a predetermined amount of movement in the thickness direction with respect to the embedding block by the feeding means. Then, the cutter is reciprocated relative to the embedding block in the cutting direction by the cutting means. And as a cutting surface detection process, the cutting surface detection means can detect the state of the cutting surface formed by cutting an embedding block at a cutting process, and can output it as detection data. Therefore, as an evaluation process, the state of the cutting surface is evaluated based on the detection data output by the cutting surface detection means, and the relative position in the thickness direction of the cutter with respect to the embedding block is grasped from the state of the cutting surface. can do.

Further , in the cutting surface detection step, the cutting force generated when the embedded block is cut with the cutter can be detected and output as cutting force data by the cutting force detector of the cutting surface detection means. Correspondingly, the cutter position detector can detect the relative position of the embedding block and the cutter in the cutting direction and output the detected position as cutter position data. For this reason, as an evaluation process, based on the detection data constituted by these, the cutting surface is analyzed by analyzing whether the cutting force is detected when the relative position in the cutting direction of the cutter with respect to the embedding block is the position. Can be evaluated.
Further, among the cutting steps, as a rough cutting step, the control unit first sets the movement amount to the rough cutting amount, moves the cutter in the thickness direction with respect to the embedding block by the feeding means, and turns the embedding block to the embedding block by the cutting means. On the other hand, the cutter is reciprocated relatively in the cutting direction. Then, as an evaluation process, if it is determined from the detection data output in the cutting surface detection process that the cutting surface is not formed on the entire embedding block, the moving amount of the feeding means is again used as the roughing amount, and the roughing step Then, a cutting surface detection step and an evaluation step are performed. On the other hand, when it is determined from the detection data that the cutting surface is formed on the entire embedding block, the process proceeds to the main cutting process. That is, the control unit resets the moving amount of the feeding means to the main cutting amount, and moves the cutter relative to the embedding block only in the thickness direction relative to the embedding block. Then, by reciprocating the cutter in the cutting direction relative to the embedding block by the cutting means, the embedding block can be cut to a predetermined thickness, and a thin slice can be produced. In this way, by repeating the rough cutting process and performing the main cutting process based on the judgment by the evaluation process, the embedded block is automatically and minimally cut regardless of the positional relationship between the cutter and the embedded block. A cutting surface can be formed on the entire surface, and a sliced piece can be produced based on this.

  In the thin-section manufacturing apparatus, the sample stage is fixed to be slidable in the cutting direction, and the cutting force detection unit of the cutting surface detection unit is connected to the cutting direction of the cutting unit by the cutting unit. It is more preferable to have a force sensor that abuts against and a pressing portion that faces the force sensor and presses the sample stage.

  According to the thin-slice manufacturing apparatus according to the present invention, the cutting force generated when cutting by the cutting means is performed because the force sensor of the cutting force detecting unit is in contact with the sample table so as to face the cutting direction by the cutting means. Detected by transmitting from the sample stage to the force sensor. At this time, while the sample stage is slidable in the cutting direction, it is in a state of being pressed by the pressing portion provided opposite to the force sensor, so that the cutting force generated by cutting the embedded block can be efficiently obtained. And it can be reliably transmitted to the force sensor.

  In the thin-section manufacturing apparatus, the cutting surface detection unit includes an illumination system that illuminates the cutting surface, and an imaging optical system that photographs the cutting surface illuminated by the illumination system, and the detection data May be image data photographed by the photographing optical system.

  According to the thin-section manufacturing apparatus according to the present invention, image data can be acquired as detection data by photographing the cutting surface illuminated by the illumination system with the photographing optical system. For this reason, the state of a cutting surface can be evaluated based on the area and shape of the part in which the cutting surface was formed among image data.

  In the thin-section manufacturing apparatus, the illumination system of the cutting surface detection unit reflects a light source capable of irradiating parallel light and the parallel light irradiated from the light source so as to be substantially orthogonal to the cutting surface. More preferably, the imaging optical system is provided behind the half mirror so as to be able to receive reflected light that is reflected by the cutting surface and transmitted through the half mirror. Has been.

  In the thin-section manufacturing method, the cutting surface detection step includes reflecting parallel light irradiated from a light source by a half mirror to irradiate the cutting surface substantially orthogonally, and behind the half mirror. The cutting surface may be photographed by receiving reflected light that is reflected by the cutting surface and transmitted through the half mirror, and image data is acquired as the detection data.

  According to the thin-slice manufacturing apparatus and thin-slice manufacturing method according to the present invention, in the cutting surface detection step, the parallel light emitted from the light source of the illumination system is reflected by the half mirror so as to be substantially orthogonal to the cutting surface. It is illuminated as so-called epi-illumination. Since the photographing optical system is provided behind the half mirror, it is possible to photograph the cutting surface by receiving the reflected light from the epi-illumination. For this reason, the image data captured and acquired by the imaging optical system is an image in which the contrast between the smooth portion where the cutting surface is formed and the portion where the cutting surface is not formed is remarkable, and the state of the cutting surface more clearly Can be detected.

  Further, in the above-described thin-slice manufacturing apparatus, the control unit has preset reference data representing a state of the cutting surface when the cutting surface is formed on the entire embedding block, and the reference It is more preferable to compare the data and the detection data to determine whether or not the cutting surface is formed on the entire embedding block.

  Furthermore, in the method for producing a thin slice, reference data representing a state of the cutting surface when the cutting surface is formed on the entire embedding block is acquired in advance, and the evaluation step includes the reference data And the detection data are more preferably determined whether or not the cutting surface is formed on the entire embedding block.

  According to the thin-slice manufacturing device and the method for manufacturing a thin slice according to the present invention, in the evaluation process, by comparing the reference data preset in the control unit and the detection data output in the cutting surface detection process, It can be accurately determined whether or not the cutting surface is formed on the entire embedding block.

  In the thin-section manufacturing apparatus, the rough cutting amount is composed of a first rough cutting amount and a second rough cutting amount smaller than the first rough cutting amount, and the control unit includes: If the cutting surface is not detected even when the cutter is reciprocated in the cutting direction, the first rough cutting amount is set as the moving amount of the feeding means, and the embedding block is provided with at least a part of the first rough cutting amount. When a cutting surface is detected, it is more preferable to reset the movement amount of the feeding means to the second rough cutting amount.

  In the thin slice manufacturing method, the roughing step includes a first roughing step in which the roughing amount is a first roughing amount, and a second roughing amount that is smaller than the first roughing amount. And a second roughing step corresponding to the first roughing step, and a second evaluation corresponding to the second roughing step. The first evaluation step evaluates the state of the cutting surface based on the detection data output in the cutting surface detection step after the first rough cutting step, and the cutting surface is embedded in the embedded surface. When it is determined that the block is not detected, the first roughing step is performed again. When it is determined that the cutting surface is detected in at least a part of the embedded block, the second roughing step is performed. And the second The evaluation step evaluates the state of the cutting surface based on the detection data output in the cutting surface detection step after the second rough cutting step, and the cutting surface is not detected in the entire embedding block. If it is determined, the second rough cutting step is performed again, and if it is determined that the cutting surface is formed on the entire embedding block, it is more preferable to proceed to the main cutting step. .

  According to the thin-slice manufacturing apparatus and thin-slice manufacturing method according to the present invention, first, as the first roughing step in the roughing step, the moving amount of the feeding means is set to the first roughing amount and embedded. The cutter is moved relative to the block in the thickness direction. Then, the cutter is reciprocated in the cutting direction relative to the embedding block by the cutting means. Next, the state of the cutting surface is detected in the cutting surface detection step, and the state of the cutting surface is evaluated in the first evaluation step. These steps are repeated until it is determined in the first evaluation step that a cutting surface has been detected in at least a part of the embedded block. At this time, the roughing step is efficiently performed until the cutting surface is formed on at least a part of the embedding block by setting the moving amount of the feeding means to the first roughing amount larger than the second roughing amount. Can do. On the other hand, when a cutting surface is formed on at least a part of the embedding block in the first evaluation step, the process proceeds to the second roughing step, and the moving amount of the feeding means is smaller than the first roughing amount. By setting the second rough cutting amount, the cutting surface detection process and the second evaluation process can detect the state in which the cutting surface is formed on the entire embedding block with high accuracy and minimum cutting amount. Can be transferred to the main cutting process.

  Further, in the above-described thin slice manufacturing apparatus, the thin section manufacturing apparatus includes a height sensor that measures a position in the thickness direction of the cutting surface of the embedded block, and the control unit moves the cutter with respect to the embedded block. When moving relatively in the thickness direction, it is more preferable to move the main cutting amount by the feeding means based on the measurement result of the height sensor.

  Further, in the above method for producing a thin section, the main cutting step measures a position in the thickness direction of the cutting surface of the embedding block by a height sensor, and based on a measurement result of the height sensor. It is more preferable to move the cutter relative to the embedding block in the thickness direction by the main cutting amount.

  According to the thin-slice manufacturing apparatus and the thin-slice manufacturing method according to the present invention, in the main cutting process, the position in the thickness direction of the cutting surface can be measured by the height sensor. For this reason, even if the embedding block expands and contracts due to temperature changes, etc., and the position in the thickness direction differs between the cutting surface and the cutter, it is based on the thickness direction position of the cutting surface measured by the height sensor. The main cutting amount by the feeding means can be adjusted and moved.

  Further, in the method for producing a thin section, in the roughing step, a roughing cutter is used as the cutter for cutting the embedded block, and in the main cutting step, a book different from the roughing cutter is used as the cutter. It is more preferable to use a shaving cutter.

  According to the method for producing a thin section according to the present invention, in the roughing step and the main cutting step, by using a different type of cutter from the roughing cutter and the main cutting cutter, in the roughing step, wear resistance is improved. It is possible to select what can be efficiently cut and also, in the main cutting process, select what can cut the embedded block with a better cutting surface.

  According to the thin-section manufacturing apparatus of the present invention, the cutting surface detection unit is provided, and the state of the cutting surface is evaluated based on the detection data of the cutting surface detection unit to grasp the relative position of the cutter with respect to the embedding block. Can do. Further, according to the method for producing a thin slice of the present invention, in the cutting surface detection step, the state of the cutting surface is detected, and in the evaluation step, the state of the cutting surface is evaluated and the thickness direction of the cutter with respect to the embedded block is determined. The relative position can be grasped. That is, according to the thin-slice manufacturing device and the thin-slice manufacturing method of the present invention, the relative position in the thickness direction of the cutter with respect to the embedding block is grasped based on the detected state of the cutting surface. Thin sections can be made as a reference. For this reason, even if the cutter is changed according to the purpose or according to the purpose, the thin section can be produced by adjusting the position without unnecessarily cutting the embedded block.

(First embodiment)
1 to 6 show a first embodiment according to the present invention. The thin-section preparation apparatus 1 shown in FIGS. 1 and 2 prepares an ultrathin thin section having a thickness of about 3 to 5 μm from an embedding block B in which a biological sample S is embedded, and the biological sample included in the thin section In the process of inspecting and observing S, the embedded block B is automatically cut and a thin section is produced from the embedded block B. The biological sample S is, for example, a sample excised from a tissue such as an organ taken out of a human body or a laboratory animal, and is appropriately selected in the medical field, pharmaceutical field, food field, biological field, and the like. The embedding block B is obtained by embedding the biological sample S as described above with the embedding agent B1, that is, covering and solidifying the periphery. In more detail, such an embedding block B is produced as follows. First, the mass of the biological sample S is immersed in formalin, and the protein constituting the biological sample S is fixed. And after making a structure | tissue solid, it cut | disconnects to a suitable magnitude | size. Finally, it is produced by embedding and solidifying a material obtained by replacing the moisture in the cut biological sample S with the embedding agent B1. Here, the embedding agent B1 is a material that can be easily liquefied and cooled and solidified as described above, and is dissolved by being immersed in an organic solvent, such as a resin or paraffin. Hereinafter, the configuration of the thin-slice manufacturing apparatus 1 will be described.

  As shown in FIGS. 1 and 2, the thin-section preparation apparatus 1 positions the embedding cassette C fixing the embedding block B in an exchangeable manner, and cuts the embedding block B with the sample stage 2 to be fixed. And a cutting means 3 for performing. The cutting means 3 includes a cutter 4, a fixing base 5 that fixes the cutter 4 with a holder 5 a, a guide part 6 that allows the fixing base 5 to slide in the cutting direction X, and a fixing part 5 that is fixed on the guide part 6 in the cutting direction X. And a drive unit 7 for moving the table 5. The sample stage 2 is fixed by a guide rail 9 so as to be slidable in the cutting direction X on the Y stage 8 that can move the embedding block B by a predetermined movement amount in the thickness direction Y of the thin slice to be produced. .

  Further, the thin-section manufacturing apparatus 1 detects the state of the cutting surface B2 formed by cutting the embedded block B, and outputs a cutting surface detection unit 10 that outputs the detection data D to the control unit 14, and the cutting surface B2. And a height sensor 11 that measures the position H in the thickness direction Y and outputs the height data Dh. The height sensor 11 includes a laser light source 11a that irradiates the cutting surface B2 with laser light and a light receiving element 11b that is provided at a predetermined distance from the laser light source 11a. Further, the cutting surface detection means 10 detects the position Q of the cutter 4 moving on the guide unit 6 and outputs the cutter position data Dq, and when the embedded block B is cut by the cutter 4 The cutting force detection part 13 which detects the cutting force P which arises in this, and outputs the cutting force data Dp is provided, and the detection data D are comprised by the cutting force data Dp and the cutter position data Dq. The cutter position detector 12 can select various known position sensors such as an optical sensor and a magnetic sensor. Further, the cutting force detector 13 is provided on the Y stage 8 and is provided on the Y stage 8 and is opposed to the force sensor 13a. And a plunger 13b that is a pressing portion that presses the sample stage 2 with a constant force.

  The control unit 14 includes a sampling circuit 15, a computer 16, and a stage controller 17. The sampling circuit 15 receives cutting force data Dp output from the force sensor 13 a, cutter position data Dq output from the cutter position detector 12, and height data Dh output from the height sensor 11. Memorized. The computer 16 is connected to an input unit 18 capable of inputting various data externally. More specifically, in the present embodiment, the input unit 18 inputs, as reference data, the position coordinates in the cutting direction X of the cutting start point B3 and the cutting end point B4 in the embedded block B fixed to the sample stage 2. Is possible. The position coordinates input by the input unit 18 are stored in the computer 16. Then, the computer 16 detects the detection data D composed of the cutting force data Dp and the cutter position data Dq input to the sampling circuit 15, the height data Dh, and the cutting start point B3 of the embedded portion record B and Based on the position coordinates of the cutting end point B4, the cutter 4 can be reciprocated at a predetermined speed by the drive unit 7 through the stage controller 17 as a cutting process, and the Y stage 8 can be moved by a predetermined movement amount. is there. Here, the cutting process is divided into a rough cutting process and a main cutting process, as will be described later. In the computer 16, as the amount of movement of the Y stage 8 per time, a rough cutting amount in the rough cutting step and a main cutting amount N in the main cutting step are determined in advance. The roughing process includes a first roughing process S2 and a second roughing process S5. The roughing amount includes the first roughing amount M1 and the second roughing in the first roughing process S2. The second rough cutting amount M2 in step S5. In the present embodiment, the first rough cutting amount M1 is set to 100 μm. Further, the second rough cutting amount M2 is set to a value smaller than the first rough cutting amount M1, and is set to 20 μm in the present embodiment. Further, the main cutting amount N corresponds to the thickness of the thin slice, and is set to 3 μm in this embodiment. These specific numerical values can be changed in a timely manner based on various conditions. In addition, a display 19 is connected to the computer 16 of the control unit 14, and the progress of each process shown below, the detection result by the cutting surface detection means 10, and the like can be displayed.

  Next, the operation of the thin-slice manufacturing apparatus 1 and a method for manufacturing a thin section using the thin-slice manufacturing apparatus 1 will be described. As shown in FIG. 1, first, the embedding block B fixed to the embedding cassette C is placed on the sample stage 2. Then, as shown in FIGS. 1 and 3, as the preparation step S <b> 1, the computer 16 of the control unit 14 drives the drive unit 7 by the stage controller 17, so that the cutter 4 is in the cutting direction X with respect to the embedding block B. Evacuate (step S1a). Further, the computer 16 drives the Y stage 8 by the stage controller 17 and arranges the cutter 4 and the embedding block B with the gap Y1 in the thickness direction Y (step S1b). Considering the thickness of the embedding block B fixed to the sample stage 2, the mounting position of the cutter 4 in the thickness direction Y, and these errors, the gap Y1 is formed between the cutter 4 and the embedding block B. A value that does not interfere with the thickness direction Y reliably.

  Next, as shown in FIG. 3, a first roughing step S2 is performed. That is, the Y stage 8 is driven by the stage controller 17 under the control of the computer 16 of the control unit 14, and the embedded block B is moved in the thickness direction Y toward the cutter 4 by the first rough cutting amount M1 (100 μm). (Step S2a). Further, the drive unit 7 is driven by the stage controller 17 to reciprocate the cutter 4 in the cutting direction X at a predetermined moving speed (step S2b). At this time, if the cutter 4 and the embedding block B still have a certain gap in the thickness direction Y, the cutter 4 simply reciprocates. In addition, if the embedded block B is moved by the first rough cutting amount M1 in the thickness direction Y so that the cutter 4 and the embedded block B have a positional relationship that interferes in the thickness direction Y, the cutter 4 At least a part of the embedding block B is cut to form a cut surface.

  Further, as the cutter 4 is reciprocated, the state of the cutting surface B2 is detected as a cutting surface detection step S3. That is, as the cutter 4 reciprocates, the cutter position detector 12 detects the position Q of the cutter 4 with respect to the embedding block B and outputs it as cutter position data Dq. The cutting force P generated by cutting is detected by the force sensor 13a of the cutting force detector 13 and output as cutting force data Dp. At this time, for example, in the first rough cutting step S2 for the first time, a gap is still formed between the cutter 4 and the embedded block B, and the embedded block B is not cut by the cutter 4, It is assumed that the cutting surface B2 is not formed. FIG. 4 shows the relationship between the position Q of the cutter 4 and the cutting force P when the cutting surface B2 is not formed. That is, as the cutter 4 reciprocates, the position Q of the cutter 4 increases, but the cutting force P does not change while showing the initial value P1. The initial value P1 is a value detected by the plunger 13b pressing the sample stage 2 and detected by the force sensor 13a.

  Then, as the first evaluation step S4, the computer 16 of the control unit 14 determines whether or not the cutting surface B2 is formed in at least a part of the embedded block B based on the detection data D input to the sampling circuit 15. To do. More specifically, when the cutting surface B2 is formed, the cutting force P is generated when the embedded block B is cut, so that the cutting force P has changed from the initial value P1 based on the cutting force data Dp. Check whether or not. As shown in FIG. 4, in the first rough cutting step S <b> 2 for the first time, the embedded block B could not be cut by the cutter 4, and therefore no change in the cutting force P was observed. Thereby, the computer 16 of the control unit 14 determines that there is still a gap in the thickness direction Y between the cutter 4 and the embedding block B, and performs the first roughing step S2 again. Instruct. By repeating the first roughing step S2, the embedded block B sequentially moves toward the cutter 4 by the first roughing amount M1 (100 μm), and finally the cutter 4 cuts a part of the embedded block B. Will do. When the embedding block B is cut by the cutter 4, a cutting force P is generated between the cutter 4 and the embedding block B and is transmitted to the force sensor 13 a of the cutting force detector 13 via the sample table 2. . At this time, the sample stage 2 is slidable in the cutting direction X by the guide rail 9 while being pressed with a constant force by the plunger 13b provided facing the force sensor 13a. For this reason, the cutting force P generated by cutting the embedded block B can be efficiently and reliably transmitted to the force sensor 13a, and the cutting force P can be accurately detected. Next, as shown in FIG. 3, in the first evaluation step S <b> 4, the computer 16 of the control unit 14 can confirm that the cutting force P has changed. Thereby, the computer 16 of the control unit 14 has a cutting surface B2 formed on at least a part of the embedding block B, that is, the positional relationship in which the cutter 4 and the embedding block B interfere with each other in the thickness direction Y. Judging, it is made to transfer to 2nd roughing process S5.

  First, the computer 16 of the control unit 14 resets the amount of movement of the Y stage 8 per operation from the first roughing amount M1 (100 μm) to the second roughing amount M2 (20 μm). Then, under the control of the computer 16 of the control unit 14, the stage controller 17 drives the Y stage 8 to move the embedded block B toward the cutter 4 by the second rough cutting amount M2 (20 μm) in the thickness direction Y. (Step S5a). Next, the drive unit 7 is driven by the stage controller 17 to reciprocate the cutter 4 in the cutting direction X at a predetermined moving speed (step S5b). Further, as the cutter 4 is reciprocated, the state of the cutting surface B2 is detected as a cutting surface detection step S6. That is, as the cutter 4 reciprocates, the position Q of the cutter 4 is similarly detected and output as the cutter position data Dq, and the cutting force P is detected and output as the cutting force data Dp. At this time, for example, it is assumed that only a part of the embedding block B can still be cut by the cutter 4 in the first second rough cutting step S5. For this reason, as shown in FIG. 5, the detected cutting force P is partially in the range from the cutting start point B3 to the cutting end point B4, which is the range in which the cutter 4 and the embedding block B interfere in the cutting direction X. Only changes.

  Next, as the second evaluation step S7, the computer 16 of the control unit 14 evaluates the state of the cutting surface B2 based on the detection data D input to the sampling circuit 15. As described above, in the first second rough cutting step S5, only a part of the embedded block B can be cut, and the cutting force P is detected only in a part thereof. For this reason, the computer 16 of the control unit 14 determines that the cutting surface B2 is not formed on the entire embedding block B based on the cutting force data Dp, and performs the second rough cutting step S5 again. Instruct. Then, by repeating the second rough cutting step S5, the embedded block B sequentially moves by the second rough cutting amount M2 (20 μm), and finally the entire embedded block B is cut by the cutter 4. . That is, as shown in FIG. 6, the cutting force P detected in the cutting surface detection step S <b> 6 is from the cutting start point B <b> 3 of the embedded block B that is a range where the cutter 4 and the embedded block B interfere with the cutting direction X. The value is substantially equal to the cutting end point B4. For this reason, the computer 16 of the control unit 14 cuts the entire embedded block B based on the comparison of the detection data D with the position coordinates in the cutting direction X of the cutting start point B3 and the cutting end point B4 set as reference data. Judge that it was done. That is, in this state, by cutting the entire embedding block B, the thin slice collection surface B5, which is a cutting surface B2 capable of collecting a thin slice, is exposed, and further this thin slice collection surface B5. And the cutter 4 coincide with each other in the thickness direction Y.

  Finally, as the main cutting step S8, the embedding block B is cut to the thickness of the thin slice to produce the thin slice. First, as step S8a, the position H in the thickness direction Y of the thin slice collection surface B5 is measured by the height sensor 11, and the measurement result is output as height data Dh. Further, the computer 16 of the control unit 14 resets the movement amount of the Y stage 8 to the main cutting amount N (3 μm). Then, under the control of the computer 16 of the control unit 14, the stage controller 17 drives the Y stage 8 to move the embedding block B toward the cutter 4 in the thickness direction Y by the main cutting amount N (3 μm). Let At this time, the height sensor 11 measures the position H in the thickness direction of the thin slice sampling surface B5 at any time, and the computer 16 of the control unit 14 determines the thin slice based on the height data Dh input to the sample circuit 15. The position H in the thickness direction Y of the sampling surface B5 is monitored. Even if the movement amount of the Y stage 8 does not reach the main cutting amount N, if it is calculated that the movement is made by the main cutting amount N based on the height data Dh of the height sensor 11, the Y stage 8 is stopped. On the other hand, even if the movement amount of the Y stage 8 reaches the main cutting amount N, the main cutting amount N is calculated based on the height data Dh of the height sensor 11 if it is calculated that it has not moved by the main cutting amount N. The Y stage 8 is further driven until it is calculated that it has moved by the cutting amount N. If the embedded block B expands and contracts due to a temperature change or the like and the positional relationship in the thickness direction Y between the cutting surface B2 and the cutter 4 changes, even if the Y stage 8 is moved by a predetermined movement amount, Accordingly, it becomes impossible to produce a corresponding thin slice having a predetermined thickness. However, even if it is affected by temperature change or the like by adjusting the actual cutting amount N by the Y stage 8 based on the position H in the thickness direction Y of the cutting surface B2 measured by the height sensor 11, it can be accurately Can be moved by a predetermined amount. Finally, as step S8b, the drive unit 7 is driven by the stage controller 17, and the cutter 4 is reciprocated in the cutting direction X at a predetermined moving speed, whereby a thin slice having a thickness of 3 μm can be produced.

  As described above, the state of the cutting surface is detected by the cutting surface detection means in the cutting surface detection step, and the state of the cutting surface B2 is evaluated by the control unit 14 based on the detection data D of the cutting surface detection means 10 in the evaluation step. And the position of the thickness direction Y of the cutter 4 with respect to the embedding block B can be grasped | ascertained. For this reason, the cutting surface B2 is automatically formed on the entire embedding block B with the minimum cutting amount regardless of the positional relationship between the cutter 4 and the embedding block B based on the detected state of the cutting surface B2. Then, a thin slice can be prepared based on this. That is, even if the cutter 4 is replaced according to the purpose or according to the purpose, the embedded block B is not unnecessarily cut, and the position is automatically adjusted to produce a thin slice. I can.

  Further, the roughing step is composed of a first roughing step S2 and a second roughing step S5, and the first roughing step S2 has a first moving amount of the Y stage 8 larger than the second roughing amount M2. By using the rough cutting amount M1, the rough cutting step can be efficiently performed until the cutting surface B2 is formed on at least a part of the embedded block. Furthermore, by making the movement amount of the Y stage 8 in the second rough cutting step S5 a second rough cutting amount M2 smaller than the first rough cutting amount M1, the cutting surface detection step S6 and the second evaluation step S7, The state in which the cutting surface B2 is formed on the entire embedding block B can be detected with high accuracy and with a minimum cutting amount, and the process can proceed to the main cutting step S8.

  FIG. 7 shows, as a first modification in this embodiment, a roughing cutter is used as the cutter 4 for cutting the embedded block B in the roughing step (first roughing step S2 and second roughing step S5). At the same time, in the main cutting step S8, a flow chart in the case of using a main cutting cutter different from the rough cutting cutter as the cutter 4 is shown. As shown in FIG. 7, in this case, in the second evaluation step S7, it is determined that the cutting surface B2 has been formed on the entire embedding block B, and the main cutting preparation step before proceeding to the main cutting step S8. S9 is performed. That is, first, the roughing cutter fixed to the fixed base 5 is replaced with a main cutting cutter (step S9a). Next, the computer 16 of the control unit 14 moves the Y stage 8 by the main cutting amount N by the stage controller 17 based on the measurement result by the height sensor 11 (step S9b). Then, the driving unit 7 is further driven to reciprocate the main cutting cutter in the cutting direction X (step S9c). Then, the cutting force P is detected by the force sensor 13a of the cutting force detector 13, and the cutting force data Dp is output (step S9d). When the cutting force P is not detected based on the cutting force data Dp, the computer 16 of the control unit 14 slightly shifts the position of the main cutting cutter when the cutting unit P is replaced with the main cutting cutter. It is determined that it has stopped, and the process is repeated again from step S9b. When the cutting force P is detected, it is determined that the main cutting cutter is at a position where the embedded block B can be cut, and the process proceeds to the main cutting step. In the main cutting step S8, a thin slice having a predetermined thickness can be produced using the main cutting cutter. As described above, in the roughing process and the main cutting process, by using different types of cutters from the roughing cutter and the main cutting cutter, the roughing process has wear resistance and efficiently. While selecting what can be cut | disconnected, in this cutting process, what can cut an embedding block with a better cutting surface can be selected.

  In the present embodiment and its modifications, the force sensor 13a for detecting the cutting force P in the cutting force detector 13 is provided on the sample stage 2, but the present invention is not limited to this. Since the cutting force P generated along with the cutting is generated in both the cutter 4 and the sample table 2, the cutting force P can be detected regardless of the cutting force P.

  Further, the detection data D composed of the cutting force data Dp and the cutter position data Dq is the reference data input in advance by the input unit 18 in the cutting direction X of the cutting start point B3 of the embedded block B and the cutting end point B4. Although it is to be compared with the position coordinates, it is not limited to this. For example, the length of the embedding block B in the cutting direction X may be input as reference data by the input unit 18. FIG. 8 shows the relationship between the position Q of the cutter 4 and the cutting force P in the second modification of this embodiment. That is, as shown in FIG. 8, in the second evaluation step S <b> 7, the cutting direction X in which the cutting force P is detected based on the length of the embedding block B as the reference data in the cutting direction X and the detection data D. Similarly, it is possible to determine whether or not the entire embedding block B has been cut, even if it is determined whether or not the length L is substantially equal.

  Further, the cutting force P2 detected when the entire embedded block B is cut as reference data is input by the input unit 18, and the input cutting force P2 and the actually output cutting force P are input. And may be compared. The cutting force P indicates the cutting force P2 as a maximum value when the embedded block B is cut in the entire direction orthogonal to the cutting direction X. That is, the cutting force P2 is input and the cutting force P is also monitored. Then, as shown in FIG. 8, for example, when the detected cutting force P3 is smaller than the cutting force P2 input in advance based on the detection data D, the entire embedded block B is not cut. Judge. By doing in this way, although the whole embedding block B is cut in the cutting direction X, when not cutting in the direction orthogonal to the cutting direction X, the whole embedding block B is cut. Therefore, it is possible to prevent the shift to the main cutting step S8.

  In the above description, the reference data to be compared with the detection data D is input in advance by the input unit 18, but the present invention is not limited to this. An imaging unit may be provided above the sample stage 2 to image the embedded block B, and the position and length of the embedded block B may be detected based on the captured image data as reference data. Further, when repeatedly cutting the same size and type of embedded block B, the position or length in the cutting direction X of the embedded block B when the entire embedded block B was previously cut, The cutting force P may be recorded and used as reference data when the next embedded block B is cut. Alternatively, when the waveform itself indicating the relationship between the position Q of the cutter 4 and the cutting force P when the entire embedded block B was cut last time is recorded and this is used as reference data, the next embedded block B is cut The waveform may be compared directly with pattern matching or the like.

  In the present embodiment, the cutter 4 is fixed so that the cutting edge is substantially orthogonal to the cutting direction X, but the present invention is not limited to this, and a pulling angle θ may be provided. FIG. 9 is a schematic diagram showing a planar positional relationship between the cutter 4 and the embedding block B when the pulling angle θ is provided, as a third modification of this embodiment. b) shows the relationship between the position Q of the cutter 4 and the cutting force P when the pulling angle θ is provided. In FIG. 9B, as shown by the solid line S, when the entire embedded block B is cut, the cutting force P gradually increases from the position Q1, and the maximum cutting force P4 is shown at the position Q2. Until the position Q3, the cutting force P shows a constant value at the maximum cutting force P4. Then, the cutting force P decreases after the position Q3, and becomes the initial value P1 at the position Q4. On the other hand, when the entire embedding block B is not cut, as shown by a dotted line T in FIG. 9B, the detected maximum cutting force P5 is the value when the entire embedding block B is cut. It becomes smaller than the maximum cutting force P4. Also, the position and range where the cutting force P is detected are different. For this reason, even when the pulling angle θ is provided, the cutting force P is similarly compared, and the position and range of the cutting direction X where the cutting force is detected based on the size of the embedding block B are compared. Similarly, it is possible to detect whether or not the entire embedding block B has been cut.

(Second reference form)
10 to 13 show a second reference embodiment according to the present invention. In this reference embodiment, members common to those used in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIGS. 10 and 11, the thin-section manufacturing apparatus 20 according to this reference embodiment includes, as a cutting surface detection unit 21, an illumination system 22 that illuminates the cutting surface B <b> 2 and a cutting surface B <b> 2 that is illuminated by the illumination system 22. An imaging optical system 23 for imaging is provided, and it is possible to acquire and output image data Di of the cutting surface B2 as detection data. The illumination system 22 includes a surface light source 22a that is a light source that can irradiate the parallel light L, and a half mirror 22b that reflects the parallel light L emitted from the surface light source 22a. The parallel light L emitted from the surface light source 22a is reflected by the reflecting surface 22c of the half mirror 22b, and is irradiated substantially orthogonally to the cutting surface B2. And the position of the half mirror 22b is set. The photographing optical system 23 is a camera provided behind the half mirror 22 b and is connected to the image acquisition circuit 25 of the control unit 24. That is, the parallel light L irradiated to the cutting surface B2 of the embedding block B by the illumination system 22 is reflected by the cutting surface B2, and part of it is transmitted through the half mirror 22b and received by the photographing optical system 23. The For this reason, the photographing optical system 23 can photograph the cutting surface B2 of the embedding block B by epi-illumination, and input the image data Di to the image acquisition circuit 25 of the control unit 24. The computer 26 of the control unit 24 records image data obtained by photographing the cutting surface in a state where the cutting surface is formed on the entire embedding block B as reference data. As in the first embodiment, the reference data may be externally input from the input unit 18 or may be image data captured by the imaging optical system 23.

  According to such a sliced piece manufacturing apparatus 20, in the cutting surface detection step S3 ′, in the smooth portion where the cutting surface B2 is formed in the image data Di acquired by the imaging optical system 23, the irradiated parallel is obtained. Since the light L is regularly reflected, it is projected brightly, and in the portion where the cutting surface B2 is not formed, the irradiated parallel light L is irregularly reflected, so that it is projected darkly. At this time, the computer 26 of the control unit 24 recognizes the portion where the cutting surface B2 is formed more clearly by performing binarization processing based on the luminance information of the input image data Di. It becomes possible. And the computer 26 of the control part 24 can recognize the part reflected brightly as the cutting surface B2, and can perform 1st evaluation process S4 'and 2nd evaluation process S7'. That is, as shown in FIG. 13A, in the first rough cutting step S2, since the cutting surface B2 is not formed at first, only the dark portion A1 is displayed in the data Di in the acquired image. In the first evaluation step S4 ′, when only the dark portion A1 is displayed in the image data Di acquired in the cutting surface detection step S3 ′, the first rough cutting step S2 is repeatedly performed. On the other hand, as shown in FIG. 13B, when the cutting surface B2 is formed in a part of the embedded block B by repeating the first rough cutting step S2, the cutting surface is included in a part of the image data Di. A bright part A2 which is B2 is projected. Then, when the bright portion A2 is confirmed, the computer 26 of the control unit 24 determines that the cutting surface B2 has been formed, and shifts to the second roughing process.

  Further, by repeating the second rough cutting step S5, the range in which the embedded block B is gradually cut increases, that is, the bright portion A2 of the image data Di acquired in the cutting surface detection step S6 ′ gradually increases. Become. At this time, the computer 26 calculates the area of the portion where the cutting surface B2 which is the bright portion A2 is formed. Then, from the image data stored as the reference data, the area when the cutting surface B2 is formed on the entire embedding block B is calculated and compared to determine whether the areas are substantially equal. And as shown in FIG.13 (c), when the area of the bright part A2 becomes substantially equal to the area when the cutting surface B2 is formed in the whole embedding block B, it will be in the whole embedding block B. It is determined that the cutting surface B2 has been formed, that is, the thin slice sampling surface B5 has been formed, and the process proceeds to the main cutting step S8.

  The method is not limited to the method of calculating the area of the bright portion A2 from the image data Di acquired as described above. For example, the outer edge portion of the portion where the cutting surface B2 is formed is recognized, and the package stored as reference data is stored. Similarly, the state of the cutting surface B2 can be evaluated even when pattern matching is performed with the shape of the outer edge when the cutting surface B2 is formed on the entire buried block B. In the cutting surface detection means 21, the light source of the illumination system 22 is the surface light source 22a. For example, the light from the point light source is converted into parallel light through a pinhole and a collimator lens. It is also good. Furthermore, the illumination of the illumination system 22 is not limited to the parallel light L, and may be scattered light. However, although it is possible to confirm the cutting surface B2 even when the illumination by the illumination system 22 is scattered light, the contrast is remarkably increased by irradiating the parallel light L substantially orthogonal to the cutting surface B2. The state of the cutting surface B2 can be detected more clearly as an image.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

  In the cutting means 3, the sample table 2 is fixed, and the cutter 4 is moved in the cutting direction X to cut the embedded block B. However, the cutter 4 is fixed and the sample table 2 is moved in the cutting direction. It is good also as a structure moved to X. Further, although the embedded block B is moved by the predetermined amount of movement in the thickness direction Y with respect to the cutter 4 by the Y stage 8 as the feeding means, the cutter 4 may be moved in the thickness direction Y. .

1 is an overall view of a thin-slice manufacturing apparatus according to a first embodiment of the present invention. It is a block diagram of the thin section production apparatus of the 1st Embodiment of this invention. It is a flow figure of thin section preparation of a 1st embodiment of this invention. It is explanatory drawing which shows the relationship between the cutter position and cutting force in thin slice preparation of 1st Embodiment of this invention. It is explanatory drawing which shows the relationship between the cutter position and cutting force in thin slice preparation of 1st Embodiment of this invention. It is explanatory drawing which shows the relationship between the cutter position and cutting force in thin slice preparation of 1st Embodiment of this invention. It is a flowchart of thin section preparation of the 1st modification of 1st Embodiment of this invention. It is explanatory drawing which shows the relationship between the cutter position and cutting force in the thin slice preparation of the 2nd modification of 1st Embodiment of this invention. It is explanatory drawing which shows the relationship between the cutter position and cutting force in the thin slice preparation of the 3rd modification of 1st Embodiment of this invention. It is a whole figure of the thin slice production apparatus of the 2nd reference form of this invention. It is a block diagram of the thin slice production apparatus of the 2nd reference form of this invention. It is a flowchart of thin section preparation of the 2nd reference form of this invention. It is explanatory drawing of thin slice preparation of the 2nd reference form of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,20 Thin section production apparatus 2 Sample stand 3 Cutting means 4 Cutter 8 Y stage (feed means)
DESCRIPTION OF SYMBOLS 10, 21 Cutting surface detection means 11 Height sensor 12 Cutter position detector 13 Cutting force detection part 13a Force sensor 13b Plunger (pressing part)
14, 24 Control unit 22 Illumination system 22a Surface emission source 22b Half mirror 23 Imaging optical system B Embedded block B2 Cutting surface D Detection data Dp Cutting force data Dq Cutter position data Dh Height data Di Image data H Thickness of cutting surface Directional position L Parallel light P Cutting force Q Cutter position X Cutting direction Y Thickness direction S1 Preparation step S2 First roughing step S3, S3 ′ Cutting surface detection step S4, S4 ′ First evaluation step S5 Second Roughing step S6, S6 ′ Cutting surface detection step S7, S7 ′ Second evaluation step S8 Main cutting step

Claims (10)

A sample stage for fixing the embedding block;
A feeding means for moving the cutter relative to the embedded block by a predetermined amount of movement in the thickness direction of the thin slice to be produced;
Cutting means for reciprocating the cutter relative to the embedding block in a cutting direction;
A cutting surface detecting means for detecting a state of a cutting surface formed by cutting the embedded block as the cutter is reciprocated by the cutting means, and outputting as detection data ;
The cutting surface detecting means includes
A cutting force detection unit that is provided on any one of the cutter and the sample stage, detects a cutting force generated when the embedded block is cut by the cutter of the cutting means, and outputs the cutting force data;
A cutter position detector for detecting a relative position of the cutter and the embedding block in the cutting direction and outputting the position as cutter position data;
With
The detection data is composed of the cutting force data and the cutter position data,
Based on the detection data of the cutting surface by the cutting surface detection means, the amount of movement of the feeding means, the rough cutting amount when the cutting surface is not formed on the entire embedding block, and the cutting surface A thin section manufacturing apparatus comprising: a control unit configured to set either the thickness of the thin section when formed in the entire embedding block or a corresponding main cutting amount . In the thin-slice preparation device according to claim 1 ,
The sample stage is slidably fixed in the cutting direction,
The cutting force detection unit of the cutting surface detection means includes a force sensor that contacts the sample table in opposition to the cutting direction of the cutting means,
A thin-slice manufacturing apparatus having a pressing portion that presses the sample stage so as to face the force sensor. In the thin-slice preparation device according to claim 1 or 2 ,
The control unit has preset reference data representing a state of the cutting surface when the cutting surface is formed on the entire embedding block, and compares the reference data with the detection data. A thin-slice manufacturing apparatus that determines whether or not the cutting surface is formed on the entire embedding block. In the thin slice preparation apparatus according to any one of claims 1 to 3 ,
The rough cutting amount is composed of a first rough cutting amount and a second rough cutting amount smaller than the first rough cutting amount,
When the cutting surface is not detected even when the cutter of the cutting means is reciprocated in the cutting direction, the control unit sets the first rough cutting amount as the movement amount of the feeding unit, and The thin-section manufacturing apparatus, wherein when the cutting surface is detected in at least a part of the embedding block, the movement amount of the feeding means is reset to the second rough cutting amount. In the thin slice preparation apparatus according to any one of claims 1 to 4 ,
A height sensor for measuring the position of the cutting surface of the embedding block in the thickness direction;
When the control unit moves the cutter relative to the embedding block by the main cutting amount in the thickness direction, the control unit moves the cutter based on the measurement result of the height sensor. A thin-slice manufacturing apparatus characterized by the above. A preparatory step for placing the cutter against the embedding block fixed on the sample stage with a gap in the thickness direction of the thin slice to be produced, and
Cutting that moves the cutter relative to the embedding block by a predetermined amount of movement in the thickness direction and then reciprocates the cutter relative to the embedding block in the cutting direction. Process,
A cutting surface detection step of detecting a state of a cutting surface formed by cutting the embedded block in the cutting step and outputting as detection data;
An evaluation step for evaluating the state of the cutting surface based on the detection data output in the cutting surface detection step ,
The cutting surface detection step detects a cutting force generated when the embedded block is cut by the cutter in the cutting step, outputs the cutting force data, and the cutting direction of the cutter with respect to the embedded block. Is detected and output as cutter position data, and the detection data is configured with the cutting force data and the cutter position data,
The cutting process includes
A rough cutting step of moving the cutter relative to the embedding block by a predetermined rough cutting amount as the moving amount;
A main cutting step of moving the cutter with respect to the embedding block by a main cutting amount corresponding to the thickness of the thin section as the movement amount;
Have
The cutting surface detection step and the evaluation step are performed after the rough cutting step,
When the evaluation step determines that the cutting surface is not formed on the entire embedded block based on the detection data, the roughing step is performed again, and the cutting surface is When it is determined that the thin section is formed entirely, the method proceeds to the main cutting step . The method for producing a thin section according to claim 6 ,
Reference data representing the state of the cutting surface when the cutting surface is formed on the entire embedding block is obtained in advance.
The evaluation step compares the reference data and the detection data, and determines whether or not the cutting surface is formed on the entire embedding block. In the method for producing a thin section according to claim 6 or 7 ,
The roughing step includes a first roughing step in which the roughing amount is a first roughing amount and a second roughing step in which the roughing amount is a second roughing amount smaller than the first roughing amount. Composed,
The evaluation step includes a first evaluation step corresponding to the first roughing step, and a second evaluation step corresponding to the second roughing step,
The first evaluation step evaluates the state of the cutting surface based on the detection data output in the cutting surface detection step after the first rough cutting step, and the cutting surface is formed on the embedded block. If it is determined that it is not, perform the first roughing process again, and if it is determined that the cutting surface is formed in at least a part of the embedded block, the process proceeds to the second roughing process,
The second evaluation step evaluates the state of the cutting surface based on the detection data output in the cutting surface detection step after the second rough cutting step, and the cutting surface is formed on the entire embedding block. If it is determined that it is not, the second roughing process is performed again, and if it is determined that the cutting surface is formed on the entire embedding block, the process proceeds to the main cutting process. A method for producing thin sections. In the method for producing a thin section according to any one of claims 6 to 8 ,
In the main cutting step, the height sensor measures the position in the thickness direction of the cutting surface of the embedded block, and the cutter is applied to the embedded block based on the measurement result of the height sensor. A method for producing a thin slice, characterized by moving relative to the main cutting amount in the thickness direction. In the method for producing a thin section according to any one of claims 6 to 9 ,
In the roughing step, a roughing cutter is used as the cutter for cutting the embedded block, and in the main cutting step, a main cutting cutter different from the roughing cutter is used as the cutter. Thin section preparation method.

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