JP4954968B2 - Adhesive chuck and substrate bonding apparatus having the same - Google Patents

Description

The present invention relates to an adhesive chuck and a substrate bonding apparatus having the same, and more particularly to an adhesive chuck for attaching a substrate using an adhesive force and a substrate bonding apparatus having the same.

With the development of the information society, the demand for display devices has increased in various forms. Recently, LCD (Liquid Crystal Display), PDP (Plasma Display Panel), ELD (Electro Luminescent Display), VFD (Vacuum Fluorescent)
Various flat panel displays have been studied, and some of them are already widely used in real life.

Of these, LCDs have superior image quality compared to CRTs (Cathode Ray Tubes), and are widely used in mobile image display devices due to their advantages of light weight, thinness, and low power consumption.

Such an LCD is formed by injecting liquid crystal between a TFT (Thin Film Transistor) substrate on which electrodes are formed and a CF (Color filter) substrate coated with a phosphor. Sealing material (Sealer) is provided on the outer peripheral surfaces of both substrates to prevent leakage of the liquid crystal substance, and spacers (Spacer) are arranged between the two substrates to maintain the distance between the two substrates at a predetermined interval. .

Therefore, when manufacturing an LCD, it is essential to manufacture a TFT substrate and a CF substrate, and then attach the two substrates and inject a liquid crystal material into the space between them. The attaching process is one of the important processes for determining the quality of the LCD.

Generally, the substrate bonding process is performed by a substrate bonding apparatus including an upper chamber and a lower chamber that can be formed in a vacuum state, and the prior art for such a substrate bonding apparatus is ( International publication number “WO 2004/097509” filed by Fujitsu Ltd., “bonded substrate manufacturing apparatus”, international publication number “WO 2003/091970” filed by Shin-Etsu Engineering Co., Ltd., “bonding substrates for flat panels” The apparatus "etc. are disclosed.

On the other hand, the above-described prior art and the bonding of the substrates according to the patent are performed by pressing the array substrate and the color filter substrate to each other using pressure. For this purpose, the substrate bonding apparatus is provided with two electrostatic chucks (ESCs) which are arranged vertically opposite to each other, and bonds the substrate to the electrostatic chuck. In addition, the two substrates are bonded together after maintaining the parallelism of both electrostatic chucks precisely and close to each other.

In most cases, such a substrate bonding apparatus is constructed in a vacuum atmosphere and proceeds with a process when bonding substrates. Therefore, when the substrate is first carried in, the inside of the substrate bonding apparatus is in an atmospheric pressure state. Then, the substrate is bonded using an electrostatic chuck. That is, the substrate is supported using two different physical forces. Prior art for such a substrate bonding apparatus includes an international publication number “WO 2004/097509” filed by Fujitsu Ltd., a “bonded board manufacturing apparatus”, and an international publication number “Shin-Etsu Engineering Co., Ltd.”. WO 2003/091970 ”,“ Flat panel substrate bonding apparatus ”and the like.
International Publication Number WO 2004/097509 International Publication Number WO 2003/091970

An electrostatic chuck used in a substrate bonding apparatus is manufactured in a form in which a metal pattern is formed on polyimide, but has a problem that the manufacturing cost is expensive. In addition, when the substrate is broken during the process, the polyimide film applied to the surface of the electrostatic chuck may be damaged by particles on the substrate.

The present invention is for solving the above-mentioned problems, and the object of the present invention is to reduce the manufacturing cost because the substrate can be attached at a low cost by using an adhesive rubber that exhibits adhesive strength. An adhesive chuck and a substrate bonding apparatus having the same are provided.

Another object of the present invention is to provide an adhesive chuck that can be easily maintained and repaired using an adhesive rubber having a simple structure, and a substrate bonding apparatus having the same.

In order to achieve the above object, a substrate bonding apparatus according to the present invention includes a first chamber including a first surface plate on which a first substrate is seated; spaced apart from the first chamber; A second chamber including a second surface plate on which a second substrate to be bonded to the substrate is attached; a plurality of adhesive rubbers provided on the first surface plate to adhere the first substrate An adhesion module provided with a lifting member for raising and lowering at least one of the adhesion modules.

The adhesive module descends to adhere the first substrate together with the installation plate, the first adhesive rubber provided on the installation plate, and the first adhesive rubber, and removes the first substrate. Therefore, the second adhesive rubber is raised by the elevating member so as to rise, and the second adhesive rubber has a larger contact area with the first substrate than the first adhesive rubber.

On the other hand, an adhesive chuck according to the present invention for achieving the above object includes a surface plate on which a substrate is seated; an adhesive module provided on the surface plate and provided with a plurality of adhesive rubbers to adhere the substrate; An elevating member for elevating at least one of the adhesive modules is provided.

The adhesive module is lowered to adhere the substrate together with the installation plate, the first adhesive rubber provided on the installation plate, and the first adhesive rubber, and is raised to release the substrate. The second adhesive rubber includes a second adhesive rubber that rises by the elevating member, and the second adhesive rubber has a larger contact area with the substrate than the first adhesive rubber.

In addition, at least one of the first adhesive rubber and the second adhesive rubber may form a curve around the cross section, or at least one of the first adhesive rubber and the second adhesive rubber. One is to form a polygon around the cross section.

Further, at least one of the first adhesive rubber and the second adhesive rubber forms a polygon around the cross section, and the other one forms a curve around the cross section.

According to the pressure-sensitive adhesive chuck and the substrate bonding apparatus having the same according to the present invention, the substrate can be attached at a low cost by using a pressure-sensitive adhesive rubber, so that the manufacturing cost can be reduced.

In addition, there is an effect of using an adhesive rubber having a simple structure and an adhesive chuck that can be easily maintained and repaired and a substrate bonding apparatus having the same.

Hereinafter, embodiments of an adhesive chuck and a substrate bonding apparatus having the same according to the present invention will be described in more detail with reference to the drawings. The same reference numerals shown in the drawings indicate the same members having the same functions.

FIG. 1 is a schematic view showing a substrate bonding apparatus according to an embodiment of the present invention.
The substrate bonding apparatus includes a first chamber (100) in which a first substrate (S1) and a second substrate (S2) are seated, and a second chamber (200). The second chamber (200) is fixed to the base, and the first chamber (100) is moved up and down by the lift unit (300).

The first chamber (100) is provided with an adhesive chuck (110) capable of fixing the first substrate (S1), and the second chamber (200) is provided with a second substrate (S2). A substrate chuck (210) is provided that can be applied. The adhesive chuck (110) and the substrate chuck (210) are respectively a first surface plate (101) provided in the first chamber (100) and a second surface plate provided in the second chamber (200). (201).

The substrate chuck (210) may be an electrostatic static chuck (ESC) that is attracted by electrostatic force in order to secure the second substrate (S2), and the substrate chuck (210) includes a second chuck. A large number of lift pins (220, Lift Pin) appearing through the surface plate are positioned.

The lift pins (220) are lifted when the second substrate (S2) positioned on the substrate chuck (210) is carried in, and lowered after receiving the second substrate (S2) to be positioned on the substrate chuck (210). When the bonding process is completed and the upper first substrate (S1) and the lower second substrate (S2) are bonded to form a panel, the bonded panel is brought out to the outside. It plays a role of raising to carry out.

In addition, the alignment mark (Align mark) displayed on the first substrate (S1) and the second substrate (S2) is photographed in the first chamber (100), and the substrate is positioned at an accurate attachment branch. A camera (130) is provided so that it can be confirmed whether or not. The camera 130 photographs the alignment mark through a photographing hole that penetrates the first chamber 100. At this time, the illumination device 230 is provided below the second chamber 200 to provide illumination to the camera 130 so that the camera 130 can capture the alignment mark.

Although not shown, when a process space is formed in the first chamber (100) and the second chamber (200) by close contact, a high-vacuum molecular pump (for forming the inside in a vacuum state) A turbo molecular pump (TMP) and a dry pump are connected.

Meanwhile, the adhesive chuck 110 includes a plurality of unit adhesive modules 124 and a lifting member 131 as shown in FIGS. The adhesive module (124) is arranged in a matrix on the first surface plate (101). The reason for arranging in such a large number of matrix forms is to increase the convenience of maintenance and repair.

The unit adhesive module (124) is provided with a plurality of adhesive rubbers to which the first substrate (S1) is attached by an adhesive force. Here, a configuration in which two adhesive rubbers are provided will be described as one example. The two adhesive rubbers are a first adhesive rubber (126) and a second adhesive rubber (127).

The first and second adhesive rubbers (126) and (127) are composed of an organopolysiloxane (10 to 75 parts by weight), an organohydrogenpolysiloxane (5 to 30 parts by weight) containing an alkenyl group bonded to a small amount of silicon atoms. And an addition reaction curable silicone rubber composition containing an addition reaction catalyst as a main component.

In such a case, the adhesive rubber (126) (127) can be produced by directly forming the outer shape of the adhesive rubber (126) (127) by compression molding, injection molding, injection molding or the like. Since the manufacturing method of such an adhesive rubber (126) (127) is a well-known technique, detailed description is abbreviate | omitted.

The first adhesive rubber (126) and the second adhesive rubber (127) form a unit adhesive module (124) in a form provided on the installation plate (129).

The first adhesive rubber (126) is fixed to the installation plate (129), and the second adhesive rubber (127) is provided so as to move up and down with respect to the installation plate (129). Such raising and lowering of the second adhesive rubber (127) is performed by the raising and lowering member (131).

The second adhesive rubber (127) is moved up and down by dropping the first substrate (S1) to the opposing second substrate (S2) side during the bonding process. Because.

When the first substrate (S1) first enters the chamber, the first adhesive rubber (126) and the second adhesive rubber (127) are located on the same line with the first substrate (S1). ) Is attached and supported.

The first substrate (S1) is aligned on the second substrate (S2) side in a state where the process conditions for bonding with the second substrate (S2) have been made, and then the second substrate is lowered. The state is close to (S2).

In the state of being close to the second substrate (S2), the second adhesive rubber (127) is raised by the elevating member (131), and the first substrate (S1) is moved to the second adhesive rubber (127). After that, the remaining first adhesive rubber (126) is also detached and dropped to the second substrate (S2) side to be attached. In order to make this possible, the contact area of the second adhesive rubber (127) with respect to the first substrate (S1) is made larger than that of the first adhesive rubber (126). That is, the adhesive force to which the first substrate (S1) is attached becomes weak and the first substrate (S1) falls.

At least one of the first adhesive rubber (126) and the second adhesive rubber (127) can be manufactured so as to form a curve around the cross section, and the first adhesive rubber (126) or the second adhesive rubber (126) At least one of the adhesive rubbers (127) may be manufactured so that a polygon is formed around the cross section.

Further, by mixing the above manufacturing method, at least one of the first adhesive rubber (126) and the second adhesive rubber (127) is formed to form a polygon around the cross section, The other can use a method in which a curve is formed around the cross section. Examples of such a method are shown in FIGS. 5a to 5d, and can be variously manufactured and used in a form not shown.

In addition, as shown in the figure, the lifting member 131 that lifts and lowers the second adhesive member 127 is used so that a large number of the second adhesive members 127 can be lifted and lowered. Although not shown, the second adhesive rubber (127) can be used in such a manner that the second adhesive rubber (127) operates independently with respect to a certain portion of the substrate using a plurality of lifting members (131). Can do.

On the other hand, the adhesive chuck (110) according to the present invention will not be described in the description of the components included in the above-described substrate bonding apparatus because it is the same as the above-described content. The adhesive chuck (110) can be used in the form included in the substrate bonding apparatus having the above-described contents, and can also be used as an independent unit.

Hereinafter, the operation state of the substrate bonding apparatus according to the present invention configured as described above will be described.

When the first substrate (S1) is first loaded into the space where the first chamber (100) and the second chamber (200) are separated from each other by a robot (not shown), the first chamber ( The vacuum chuck (120) provided in 100) descends and adsorbs and ascends the first substrate (S1).

The first substrate (S1) raised while being attracted by the vacuum chuck (120) adheres to the first and second adhesive rubbers (126) and (127) provided on the first surface plate (101). Is done.

Further, when the second substrate (S2) is carried in by the robot, the lift pins (220) rise to support the second substrate (S2) for receiving the second substrate (S2). Get out. Thereafter, the lift pins 220 are lowered to place the second substrate S2 on the second surface plate 201, and are attached to the substrate chuck 210 by electrostatic force.

Thereafter, the first chamber 100 is lowered by the elevating unit 300 and is brought into close contact with the second chamber 200 to form a process space. When the process space is formed, a vacuum state is formed by a dry pump and a high vacuum molecular pump, and at this time, the first surface plate (101) is lowered and the first substrate (S1) is roughly formed. ) And the second substrate (S2) are aligned.

After the rough alignment is performed, fine alignment between the substrates (S1) and (S2) is performed to finish the alignment.

When the alignment is completed, the chambers 100 and 200 are in a vacuum state for the process, and the first substrate S1 and the second substrate S2 are close to each other as shown in FIG. It becomes.

In this state, the elevating member 131 is operated to raise the second adhesive rubber 127 so that it is separated from the first substrate S1. In this case, the first substrate (S1) depends on the first adhesive rubber (126) so that the adhesive force of the second adhesive rubber (127) supporting the first substrate (S1) disappears. As a result, the attached state cannot be maintained. Along with this, the first substrate (S1) is dropped and bonded to the second substrate (S2) side as shown in FIG.

When the first substrate (S1) and the second substrate (S2) are bonded, the interior of the chamber (100) (200) is evacuated to enter a standby state. Then, N2 gas is supplied on the first chamber (100) side so that the first substrate (S1) and the second substrate (S2) are more firmly bonded.

When the above process is completed, the first chamber 100 and the second chamber 200 are separated from each other, and the lift pin 220 of the second chamber 200 is raised, The bonding process is completed through the process of unloading the bonded substrate after the robot enters.

An unexplained symbol “133” is a lifting bar that connects the second adhesive rubber (127) so as to be lifted and lowered by the operation of the lifting member (131).

1 is a schematic view illustrating a substrate bonding apparatus according to an embodiment of the present invention. It is the top view which showed the adhesion chuck | zipper in the board | substrate bonding apparatus by one Example of this invention. 1 is a perspective view of an adhesive chuck provided in a substrate bonding apparatus according to an embodiment of the present invention. 1 is a rear perspective view of an adhesive chuck provided in a substrate bonding apparatus according to an embodiment of the present invention. It is the schematic which showed the adhesion chuck | zipper of the other Example of this invention. It is the schematic which showed the adhesion chuck | zipper of the other Example of this invention. It is the schematic which showed the adhesion chuck | zipper of the other Example of this invention. It is the schematic which showed the adhesion chuck | zipper of the other Example of this invention. 1 is an operational state diagram of an adhesive chuck and a substrate bonding apparatus having the same according to an embodiment of the present invention. 1 is an operational state diagram of an adhesive chuck and a substrate bonding apparatus having the same according to an embodiment of the present invention.

Explanation of symbols

100 First chamber 101 First surface plate 124 Adhesive module 126 First adhesive rubber 127 Second adhesive rubber 129 Installation plate 131 Lifting member 210 Substrate chuck 501 Adhesive chuck

Claims (7)

A first chamber comprising a first surface plate on which a first substrate is seated;
A second chamber comprising a second surface plate spaced from the first chamber and on which a second substrate to be bonded to the first substrate is seated;
The installation plate, the first adhesive rubber provided on the installation plate, and the first adhesive rubber are lowered to adhere the first substrate together with the first adhesive rubber, and are raised to release the first substrate. lifting member may be provided for raising and lowering said second adhesive rubber respect and the first pressure-sensitive rubber; wherein 2 of an adhesive rubber, the adhesive module is provided to the first platen A substrate bonding apparatus. In claim 1 ,
The substrate bonding apparatus, wherein the second adhesive rubber has a larger contact area with the first substrate than the first adhesive rubber. A surface plate on which the substrate is seated;
An installation plate, a first adhesive rubber provided on the installation plate, a second adhesive rubber that descends to adhere the substrate together with the first adhesive rubber, and rises to release the substrate; adhesive chuck, characterized in that the lifting member for lifting the second adhesive rubber respect and the first adhesive rubber is provided; hints, adhesive module is provided on the surface plate. In claim 3 ,
The adhesive chuck, wherein the second adhesive rubber has a larger contact area with the substrate than the first adhesive rubber. In claim 3 or claim 4 ,
At least one of the first adhesive rubber and the second adhesive rubber forms a curve around the cross section. In claim 3 or claim 4 ,
At least one of the first adhesive rubber and the second adhesive rubber has a polygonal shape around the cross section. In claim 3 or claim 4 ,
At least one of the first adhesive rubber and the second adhesive rubber forms a polygon around the cross section, and the other one forms a curve around the cross section. .