JP4958188B2 - Substrate transfer method - Google Patents

Description

  The present invention relates to a substrate transport method, and more particularly to a substrate transport method for transporting a substrate placed on a tray.

  A tray on which a glass substrate is placed may be used when the substrate is carried in and out of the heat treatment apparatus. In this case, the high-temperature glass substrate placed on the tray is carried out of the processing apparatus.

  For example, according to Japanese Patent Application Laid-Open No. 2008-130596 (Patent Document 1), a heat-resistant support plate on which a glass substrate is placed is disclosed. Moreover, what has a stopper for preventing the horizontal shift | offset | difference of a glass substrate as this heat-resistant support plate is disclosed.

JP 2008-130596 A

  If the above-mentioned stopper is provided on the heat-resistant support plate (tray), the structure of the tray becomes complicated, resulting in a problem that the cost of the tray increases. In addition, there is a problem that the effective area of the tray is reduced because the substrate cannot be placed in the region where the stopper is provided on the tray.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate transport method capable of suppressing the displacement of the substrate on the tray when the tray having a simple structure on which the substrate is placed is transported.

  The substrate transport method of the present invention is a substrate transport method for transporting a substrate placed on a tray so as to cover a part of the tray and expose the other part of the tray, and includes the following steps.

  The tray located at the first location is supported by the hand, and the other part of the tray is sandwiched by a pair of first chucks separated from each other in one direction. By moving the hand and the pair of first chucks together, the tray is moved to the second location. After the tray is moved to the second location, a portion of the tray and the substrate are positioned by the pair of second chucks located between the pair of first chucks in one direction and separated from each other in one direction. Is sandwiched together. After the tray is moved to the second location, the pair of first chucks are released. After a portion of the tray and the substrate are sandwiched and the pair of first chucks are released, the tray is moved to a third location by moving the hand and the pair of second chucks together.

  According to the substrate carrying method of the present invention, when the tray is moved to the third place, the second chuck sandwiches both the tray and the substrate, thereby suppressing the displacement of the substrate on the tray. Further, when the tray is moved to the third position, the first chuck is opened, so that the tray can be deformed more freely. Therefore, the tray can be deformed along the shape of the substrate as compared with the case where the first chuck is not opened. As a result, the stress exerted on the substrate by the tray is reduced, so that the substrate can be prevented from cracking due to the stress.

  Preferably, the substrate is heated before the other part of the tray is sandwiched. Thereby, the heated substrate can be transported.

  Preferably, the first location is inside a first container that houses substrates placed on a tray. Thereby, a tray can be carried out from a 1st container.

  Preferably, the hand and the pair of second chucks are rotated together as the tray is moved to the third location. Thereby, the tray can be rotated while suppressing the positional deviation between the tray and the substrate.

  Preferably, in the plan view, the portion of the tray that is sandwiched between the pair of first chucks protrudes from the portion of the tray that is sandwiched between the pair of second chucks. As a result, even when the chuck is difficult to approach the position of the tray, the first chuck can sandwich the tray more easily.

  Preferably, the substrate is a glass substrate. Thereby, the glass substrate which is a board | substrate which is easy to break can be conveyed, preventing a board | substrate crack.

  Preferably, after a part of the tray and the substrate are sandwiched together, the pair of first chucks are opened. Thereby, the positional deviation of the tray and the substrate when the pair of first chucks are opened can be suppressed.

  Preferably, the pair of first chucks is opened before the tray and the substrate are sandwiched together. Thus, since the first chuck is already opened when the tray and the substrate are sandwiched together, the substrate can be more reliably prevented from cracking.

  Preferably, the pair of first chucks are opened at the same time that a portion of the tray and the substrate are sandwiched together. Accordingly, since the tray and the substrate are both sandwiched when the pair of first chucks are opened, the positional deviation between the tray and the substrate can be suppressed. Further, since the first chuck is opened when the tray and the substrate are sandwiched together, the substrate can be more reliably prevented from cracking.

Preferably, the substrate transport method further includes the following steps.
After the tray is moved to the third location, the other part of the tray is sandwiched again by the pair of first chucks. After the tray is moved to the third location, the pair of second chucks are released. After the other part of the tray is pinched again and the pair of second chucks are opened, the tray is moved to the fourth location by moving the hand and the pair of first chucks together.

  According to this substrate transfer method, the tray can be moved to the fourth location with the second chuck opened.

  Preferably, the fourth place is inside the second container for containing the substrate placed on the tray. As a result, the tray can be stored in the second container with the second chuck opened.

  Preferably, the pair of second chucks are opened after the other part of the tray is sandwiched again. Thereby, the deviation of the tray on the hand can be suppressed.

  Preferably, the pair of second chucks are opened before the other part of the tray is sandwiched again. Accordingly, since the second chuck is already opened when the other part of the tray is sandwiched, the substrate can be more reliably prevented from cracking.

  Preferably, the pair of second chucks are opened simultaneously with the other part of the tray being sandwiched again. Thereby, since the other part of the tray is sandwiched when the pair of second chucks are opened, it is possible to suppress the displacement of the tray on the hand. Further, since the second chuck is opened when the other part of the tray is sandwiched, it is possible to more reliably prevent the substrate from cracking.

  As described above, according to the present invention, the displacement of the substrate on the tray can be suppressed, and the substrate can be prevented from cracking.

It is a top view which shows roughly the 1st process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a schematic front view of FIG. It is a top view which shows roughly the 2nd process of the board | substrate conveyance method in Embodiment 1 of this invention. It is sectional drawing which shows schematically the 3rd process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position along line IV-IV of FIG. It is sectional drawing which shows schematically the 4th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position in alignment with line IV-IV of FIG. It is sectional drawing which shows schematically the 5th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position in alignment with line IV-IV of FIG. It is a top view which shows roughly the 6th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a top view which shows roughly the 7th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a schematic sectional drawing in alignment with line IX-IX of FIG. It is sectional drawing which shows schematically the 8th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position in alignment with line IV-IV of FIG. It is sectional drawing which shows schematically the 9th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position in alignment with line IV-IV of FIG. It is a top view which shows roughly the 10th and 11th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a top view which shows roughly the 12th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is sectional drawing which shows schematically the 13th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position which follows the line XIV-XIV of FIG. It is sectional drawing which shows schematically the 14th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position which follows the line XIV-XIV of FIG. It is a top view which shows roughly the 15th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a schematic sectional drawing which follows the line XVII-XVII of FIG. It is sectional drawing which shows schematically the 16th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position which follows the line XVII-XVII of FIG. It is sectional drawing which shows schematically the 17th process of the board | substrate conveyance method in Embodiment 1 of this invention, and is sectional drawing corresponding to the position which follows the line XVII-XVII of FIG. It is a top view which shows roughly the 18th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a top view which shows roughly the 19th process of the board | substrate conveyance method in Embodiment 1 of this invention. It is a top view which shows roughly the mode of the board | substrate crack in a comparative example. It is sectional drawing which shows schematically the 1st process of the board | substrate conveyance method in Embodiment 2 of this invention. It is sectional drawing which shows schematically the 2nd process of the board | substrate conveyance method in Embodiment 2 of this invention. It is sectional drawing which shows roughly the 1st process of the board | substrate conveyance method in Embodiment 3 of this invention. It is sectional drawing which shows schematically the 2nd process of the board | substrate conveyance method in Embodiment 3 of this invention. It is sectional drawing which shows roughly 1 process of the board | substrate conveyance method in Embodiment 4 of this invention. It is sectional drawing which shows roughly 1 process of the board | substrate conveyance method in Embodiment 5 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
In the substrate transfer method of the present embodiment, as shown in FIGS. 1 to 21, the substrate 52 placed on the tray 51 is transferred to the hand 50, the pair of first chucks 61a and 61b, and the pair of first chucks. This is a method of transporting from the first container 41 to the second container 42 using two chucks 62a and 62b.

  The tray 51 (FIG. 1) is for placing the substrate 52 thereon. The substrate 52 may be placed so as to cover a part of the tray 51 and to expose the other part of the tray 51 (exposed part in FIG. 1). In addition, the tray 51 is rigid so that the substrate 52 can be reliably carried, is made of a relatively light material, and is made of an inexpensive material in consideration of productivity. Specifically, the tray 51 is a plate-like member made of, for example, aluminum.

  Preferably, the tray 51 has one end in a direction (vertical direction in FIG. 1) intersecting the one direction at each of both ends in one direction (horizontal direction in FIG. 1) in plan view (field of view in FIG. 1). It has a portion protruding to the side (lower side in FIG. 1).

  The substrate 52 (FIG. 1) is a substrate that is easily broken by receiving stress, and is, for example, a glass substrate.

  The first container 41 (FIG. 1) is a load lock chamber of an apparatus for performing CVD (Chemical Vapor Deposition) with heat treatment, for example. The first container 41 has rollers 71 a and 71 b (FIG. 2) that support both ends of the tray 51.

  The second container 42 (FIG. 16) is a rack for temporarily storing the substrate 52, for example. The second container 42 includes rollers 72a and 72b (FIG. 19) that support the both ends of the tray 51 from below.

  The hand 50 is the tip of the arm of the transfer robot. Thereby, the hand 50 can support and move the tray 51 from below.

  The pair of first chucks 61a and 61b (FIG. 3) is for sandwiching the exposed portion of the tray 51, and is provided apart from each other in one direction (lateral direction in FIG. 3). The pair of first chucks 61 a and 61 b are configured to be able to move together with the hand 50.

  Preferably, the pair of first chucks 61a and 61b are provided so as to sandwich the protruding portion of the tray 51 (FIG. 1) described above.

  The first chuck 61 a (FIG. 4) has finger portions above and below the tray 51. Further, when the first chuck 61a is driven, the pair of finger portions sandwich the tray 51 (FIG. 6), and when the first chuck 61a is opened, the interval between the pair of finger portions is widened to release the restraint of the tray 51 (FIG. 11). ) Is configured as follows.

The configuration of the first chuck 61b is the same as the configuration of the first chuck 61a.
The pair of second chucks 62a and 62b (FIG. 8) is for sandwiching the substrate 52 and the portion of the tray 51 covered with the substrate 52 together. The pair of second chucks 62a and 62b is provided so as to be positioned between the pair of first chucks 61a and 61b in one direction (lateral direction in FIG. 8). They are provided apart from each other. Further, the pair of second chucks 62 a and 62 b are configured to be able to move together with the hand 50.

  The second chuck 62 a (FIG. 9) has finger portions above and below the stacked body of the tray 51 and the substrate 52. Further, when the second chuck 62a is driven, the pair of finger portions sandwich the tray 51 and the substrate 52 together (FIG. 10), and when released, the interval between the pair of finger portions is widened to increase the tray 51 and the substrate 52. This constraint is released (FIG. 15).

The configuration of the second chuck 62b is the same as the configuration of the second chuck 62a.
Below, the board | substrate conveyance method of this Embodiment is demonstrated in order of a process.

  With reference to FIGS. 1 and 2, the substrate 52 is placed on the tray 51 and carried into the first container 41. Specifically, for example, it is carried into a load lock chamber of a CVD apparatus and supported by rollers 71a and 71b.

  Next, the substrate 52 is transferred to a heat treatment chamber, where the substrate 52 is heat treated. Specifically, for example, film formation by the CVD method is performed on the substrate 52 while the substrate 52 is heated. Next, the substrate 52 is returned to the first container 41. Immediately after the heat treatment, the tray 51 and the substrate 52 are bent downward and convex due to the temperature distribution and the own weight. Further, since the tray 51 is more easily bent than the substrate 52, a gap is generated between the tray 51 and the substrate 52.

Separate and independent containers may be provided for loading and unloading the substrate 52.
Referring to FIG. 3, the tip of hand 50 is inserted from the outside of first container 41 to the lower side of tray 51 inside first container 41 (arrow I1). Further, the pair of first chucks 61 a and 61 b is moved to a position where the tray 51 can be sandwiched.

  Referring to FIG. 4, when hand 50 is raised (arrow U), tray 51 is lifted from rollers 71a and 71b (FIG. 2). In other words, the tray 51 located inside the first container 41 (first place) is supported by the hand 50.

  Referring to FIG. 5, the lower surface of tray 51 is rapidly cooled by contact with hand 50. As a result, the lower side of the tray 51 has a lower temperature than the upper side, so that the tray 51 is bent upward (arrow CL).

  Referring to FIG. 6, tray 51 is sandwiched between a pair of first chucks 61a and 61b (arrow A1). As a result, the tray 51 has a substantially flat shape in the vicinity of the pair of first chucks 61a and 61b, and remains bent convexly as described above at a position far from the pair of first chucks 61a and 61b. .

  Referring to FIG. 7, the hand 50 and the pair of first chucks 61a and 61b are moved together toward the outside of the first container 41 (arrow O). During this movement, the deviation of the tray 51 on the hand 50 is suppressed by the pair of first chucks 61a and 61b.

  With reference to FIGS. 8 and 9, the tray 51 is moved to a place (second place) straddling the inside and the outside of the first container 41 by the above movement.

  Referring to FIG. 10, both tray 51 and substrate 52 are sandwiched by a pair of second chucks 62a and 62b (arrow A2). As a result, both the pair of first chucks 61a and 61b and the pair of second chucks 62a and 62b are operated. As a result, the stress that the tray 51 exerts on the substrate 52 increases.

  Specifically, the substrate 52 is sandwiched between only a pair of second chucks 62a and 62b, so that the central portion is deformed so as to be convex upward, and both end portions (the left and right end portions in FIG. 10) are formed on the tray 51. Strongly pressed against both ends. As a result, stress is applied to the substrate 52 from the second chucks 62a and 62b at the position indicated by the arrow S (FIG. 10).

  Referring to FIG. 11, after the operation of the pair of second chucks 62a and 62b, the pair of first chucks 61a and 61b are opened as soon as possible (arrow B1).

  Referring to FIG. 12, the hand 50, the pair of first chucks 61a and 61b, and the pair of second chucks 62a and 62b are both translated (arrow T). As a result, the tray 51 is completely removed from the first container 41 (FIG. 8).

  Next, the hand 50, the pair of first chucks 61a and 61b, and the pair of second chucks 62a and 62b are rotated together. As a result, the tray 51 is rotated (arrow R).

  During the above movement (arrows T and R in FIG. 12), the positional deviation between the tray 51 and the substrate 52 is suppressed by the pair of second chucks 62a and 62b (FIG. 11). This positional deviation is particularly likely to occur during rotational movement, and is effectively suppressed by the pair of second chucks 62a and 62b.

  Referring to FIG. 13, the hand 50, the pair of first chucks 61a and 61b, and the pair of second chucks 62a and 62b are both translated (arrow J1). Thereby, the tray 51 is moved to a place (third place) straddling the inside and the outside of the second container 42.

  Referring to FIG. 14, the tray 51 is sandwiched again by the pair of first chucks 61a and 61b (arrow A1).

  Referring to FIG. 15, after the operation of the pair of first chucks 61a and 61b, the pair of second chucks 62a and 62b are opened as soon as possible (arrow B2).

  Referring to FIGS. 16 and 17, the tray 51 is moved to the inside (fourth place) of the second container 42 by moving the hand 50 and the pair of first chucks 61 a and 61 b together.

Referring to FIG. 18, the pair of first chucks 61a and 61b are opened (arrow B1).
Referring to FIG. 19, when hand 50 is lowered, tray 51 is placed on rollers 72a and 72b.

  Referring to FIG. 20, the hand 50 and the pair of first chucks 61a and 61b are pulled out from the inside of the second container 42 (arrow P1).

  Referring to FIG. 21, the substrate 52 placed on the tray 51 is transferred from the first container 41 (FIG. 1) to the second container 42 as described above.

Next, a comparative example will be described.
In this comparative example, first, the same method as in the present embodiment is performed up to the step of FIG. Next, unlike the present embodiment (FIG. 11), the pair of first chucks 61a and 61b are not opened, and the place straddling the inside and the outside of the second container 42 (the tray 51 in FIG. The tray 51 is transported to the place where it is located. Thereafter, steps similar to those in the present embodiment (FIGS. 15 to 21) are performed.

  According to this comparative example, during translation and rotation (arrows T and R in FIG. 12), as shown in FIG. 10, the pair of first chucks 61a and 61b and the pair of second chucks 62a and 62b are operated simultaneously. For this reason, in the arrow S (FIGS. 10, 14, and 22), a strong stress is continuously applied to the substrate 52 from the second chucks 62a and 62b for a long time. As a result, as shown in FIG. 22, the substrate 52 is likely to be cracked CR.

  On the other hand, according to the present embodiment, during the translational movement and the rotational movement (arrows T and R in FIG. 12), the pair of first chucks 61a and 61b are opened as shown in FIG. As a result, the tray 51 can be more freely deformed. Therefore, the tray 51 can be deformed along the shape of the substrate 52 as compared with the comparative example. As a result, the stress exerted on the substrate 52 by the tray 51 is reduced, so that the occurrence of crack CR (FIG. 22) can be suppressed.

  Further, during translation and rotation (arrows T and R in FIG. 12), a pair of second chucks 62a and 62b sandwich both tray 51 and substrate 52 as shown in FIG. The deviation of the substrate 52 on the substrate 51 is suppressed. Further, the displacement of the tray 51 on the hand 50 is suppressed.

  Further, when the tray 51 is completely accommodated in the first container 41 or the second container 42 (FIGS. 3 and 16), the structure of the first container 41 or the second container 42 is hindered. The pair of first chucks 61 a and 61 b are difficult to approach the position of the tray 51. However, since the tray 51 has a protruding portion, the pair of first chucks 61 a and 61 b can easily move to a position where the tray 51 can be sandwiched.

(Embodiment 2)
First, the steps of FIGS. 1 to 9 are performed in the same manner as in the first embodiment.

  Referring to FIG. 23, next, the pair of first chucks 61a and 61b are opened (arrow B1).

  Referring to FIG. 24, both tray 51 and substrate 52 are sandwiched by a pair of second chucks 62a and 62b (arrow A2). Thereafter, the steps of FIGS. 12 to 21 are performed in the same manner as in the first embodiment.

  According to the present embodiment, the pair of first chucks 61a and 61b are opened as shown in FIG. 23 before the tray 51 and the substrate 52 are sandwiched together as shown in FIG. As a result, when the tray 51 and the substrate 52 are sandwiched together, the pair of first chucks 61a and 61b has already been opened, so that strong stress is generated in the arrow S (FIGS. 10, 14 and 22) described above. Can be prevented. Therefore, crack CR (FIG. 22) of the board | substrate 52 can be prevented more reliably.

(Embodiment 3)
First, the steps of FIGS. 1 to 13 are performed in the same manner as in the first embodiment.

  Referring to FIG. 25, the pair of second chucks 62a and 62b is then opened (arrow B2).

  Referring to FIG. 26, the tray 51 is sandwiched between the pair of first chucks 61a and 61b (arrow A1). Thereafter, the steps of FIGS. 16 to 21 are performed in the same manner as in the first embodiment.

  According to the present embodiment, before the tray 51 is sandwiched as shown in FIG. 26, the pair of second chucks 62a and 62b are opened as shown in FIG. As a result, when the pair of first chucks 61a and 61b is operated (FIG. 26), the pair of second chucks 62a and 62b has already been opened (FIG. 25). 14 and FIG. 22) can be prevented from generating strong stress. Therefore, crack CR (FIG. 22) of the board | substrate 52 can be prevented more reliably.

(Embodiment 4)
First, the steps of FIGS. 1 to 9 are performed in the same manner as in the first embodiment.

  Referring to FIG. 27, the tray 51 and the substrate 52 are then sandwiched by the pair of second chucks 62a and 62b (arrow A2). At the same time, the pair of first chucks 61a and 61b are opened (arrow B1). Thereafter, the steps of FIGS. 12 to 21 are performed in the same manner as in the first embodiment.

  According to the present embodiment, as shown in FIG. 27, since the tray 51 and the substrate 52 are sandwiched when the pair of first chucks 61a and 61b are opened, the tray 51 and the substrate 52 Misalignment can be suppressed. Further, since the pair of first chucks 61a and 61b are opened when the tray 51 and the substrate 52 are sandwiched together, the generation of strong stress in the arrow S (FIGS. 10, 14 and 22) described above is prevented. can do. Therefore, crack CR (FIG. 22) of the board | substrate 52 can be prevented more reliably.

(Embodiment 5)
First, the steps of FIGS. 1 to 13 are performed in the same manner as in the first embodiment.

  Referring to FIG. 28, the tray 51 is sandwiched between the pair of first chucks 61a and 61b (arrow A1). At the same time, the pair of second chucks 62a and 62b is opened (arrow B2). Thereafter, the steps of FIGS. 16 to 21 are performed in the same manner as in the first embodiment.

  According to the present embodiment, as shown in FIG. 28, since the tray 51 is sandwiched when the pair of second chucks 62a and 62b is opened, the displacement of the tray 51 on the hand 50 is suppressed. be able to. In addition, since the pair of second chucks 62a and 62b is opened when the tray 51 is sandwiched between the pair of first chucks 61a and 61b, the strongness in the above-described arrow S (FIGS. 10, 14 and 22). Generation of stress can be prevented. Therefore, crack CR (FIG. 22) of the board | substrate 52 can be prevented more reliably.

  In the drawings corresponding to the above embodiments, the deformation of the tray 51 and the substrate 52 is exaggerated in order to make the drawings easy to see. Accordingly, differences in the height positions of the first chucks 61a and 61b and the second chucks 62a and 62b are also exaggerated.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be particularly advantageously applied to a substrate transport method for transporting a substrate placed on a tray.

  41 First container, 42 Second container, 50 hands, 51 Tray, 52 Substrate, 61a, 61b First chuck, 62a, 62b Second chuck, 71a, 71b, 72a, 72b Roller.

Claims (14)

A substrate transport method for transporting a substrate placed on the tray so as to cover a part of the tray and expose the other part of the tray,
Supporting the tray located at the first location by a hand and sandwiching the other part of the tray by a pair of first chucks separated from each other in one direction;
Moving the tray to a second location by moving the hand and the pair of first chucks together;
After the step of moving the tray to the second location, the pair of second chucks positioned between the pair of first chucks in the one direction and spaced apart from each other in the one direction; Sandwiching a part of the tray and the substrate together;
Opening the pair of first chucks after moving the tray to the second location;
After the step of sandwiching a part of the tray and the substrate and the step of opening the pair of first chucks, the hand and the pair of second chucks are moved together to move the tray to a third position. A substrate transfer method comprising the step of moving to a place.   The substrate transfer method according to claim 1, further comprising a step of heating the substrate before the step of sandwiching the other part of the tray.   3. The substrate transfer method according to claim 1, wherein the first place is inside a first container that stores the substrate placed on the tray. 4.   The substrate transfer method according to claim 1, wherein the step of moving the tray to the third place includes a step of rotating both the hand and the pair of second chucks.   5. The tray according to claim 1, wherein a portion of the tray that is sandwiched between the pair of first chucks protrudes in comparison with a portion of the tray that is sandwiched between the pair of second chucks. Substrate transport method.   The substrate transport method according to claim 1, wherein the substrate is a glass substrate.   The substrate transfer method according to claim 1, wherein the step of opening the pair of first chucks is performed after the step of sandwiching a part of the tray and the substrate together.   The substrate transport method according to claim 1, wherein the step of opening the pair of first chucks is performed before the step of sandwiching a part of the tray and the substrate together.   The substrate transport method according to claim 1, wherein the step of opening the pair of first chucks is performed simultaneously with the step of sandwiching a part of the tray and the substrate together. After the step of moving the tray to the third location, sandwiching the other part of the tray again by the pair of first chucks;
Opening the pair of second chucks after moving the tray to the third location;
Moving the tray to a fourth location by moving the hand and the pair of first chucks together after the step of sandwiching the other part of the tray and the step of opening the pair of second chucks; The substrate transfer method according to claim 1, further comprising:   The substrate transfer method according to claim 10, wherein the fourth place is an inside of a second container that stores the substrate placed on the tray.   12. The substrate transfer method according to claim 10, wherein the step of opening the pair of second chucks is performed after the step of sandwiching the other part of the tray again.   12. The substrate transfer method according to claim 10, wherein the step of opening the pair of second chucks is performed before the step of sandwiching the other part of the tray again.   12. The substrate transfer method according to claim 10, wherein the step of opening the pair of second chucks is performed simultaneously with the step of sandwiching the other part of the tray again.

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