JP4965341B2 - Probe unit and circuit board inspection device - Google Patents

Description

The present invention provides a probe including a main body having a pair of support portions in which insertion holes are formed and a probe pin supported by the main body in a state where the distal end side and the base end side are respectively inserted into the pair of insertion holes. unit, to a circuit board inspection apparatus including the probe unit to the parallel beauty.

  As this type of probe unit, a vertically operated probe guard (hereinafter also simply referred to as “probe guard”) disclosed in Japanese Patent Laid-Open No. 2000-292439 is known. The probe guard includes a plurality of probes having a buckled portion at the center, a substrate on which a wiring pattern that contacts the probes is formed, and an upper support substrate and a lower support substrate on which a plurality of through holes are formed. And a probe support member provided. In this case, in this probe guard, each probe is fixed to the upper support substrate with an adhesive in a state of being passed through the through hole of the upper support substrate and the through hole of the lower support substrate. For this reason, this probe guard has a problem that the probe removal work and attachment work when replacing the probe are complicated.

In order to solve this problem, as shown in FIG. 7, the applicant applies a coating process that also serves as an insulation from other adjacent probe pins 111 to the central portion 123 of the probe pin 111. The probe unit 102 is developed in which 123 is configured to have a larger diameter than the insertion hole 131a of the first support portion 131. In this probe unit 102, the tip of the central portion 123 (more specifically, the end surface of the coating material) formed to have a larger diameter than the insertion hole 131 a is brought into contact with the edge of the insertion hole 131 a in the first support portion 131. The movement of the probe pin 111 to the protruding side of the portion 121 is restricted, and the protruding length of the distal end portion 121 to the outside of the first support portion 131 (downward in the figure) is adjusted.
Japanese Unexamined Patent Publication No. 2000-292439 (page 3, FIG. 1)

  However, the probe unit 102 developed by the applicant has the following problems to be improved. That is, in this probe unit 102, the movement of the probe pin 111 to the protruding side is restricted by bringing the end portion of the central portion 123 formed with a large diameter into contact with the edge portion of the insertion hole 131 a in the first support portion 131. Thus, the protruding length of the tip 121 is adjusted. That is, in this probe unit 102, the protruding length of the tip 121 is fixed to one length by the length of the center 123 in the probe pin 111 (the position of the end on the tip 121 side in the center 123). On the other hand, in this type of probe unit 102, it is necessary to vary the protruding length of the tip 121 in accordance with the type of inspection object.

  Specifically, for example, when inspecting an inspection object having a variation in the height of a solder bump as a contact object, the variation in the height is absorbed by deformation of the tip portion 121 and the like. In order to make 121 contact reliably, it is necessary to prescribe | regulate the protrusion length of the front-end | tip part 121 long. On the contrary, when inspecting an inspection object having a small solder bump height variation and a short distance (pitch) between the solder bumps, in order to prevent displacement of the contact position due to the deformation of the tip 121, It is necessary to define the protruding length of the tip 121 short. However, since the protruding length of the tip 121 of the probe pin 111 is fixed to one length, when manufacturing a plurality of types of probe units 102 having different protruding lengths of the tip 121, the type of the probe unit 102 is different. Different types of probe pins 111 need to be prepared for each, making it difficult to share the probe pins 111. Accordingly, it is difficult to reduce the manufacturing cost of the probe unit 102, and improvement of this point is desired.

The present invention, according solved in view of the problems to be has been made to provide an probe unit Contact and circuit board inspection apparatus capable of reducing production cost as the main purpose.

In order to achieve the above object, the probe unit according to claim 1 is arranged so as to be opposed to the plate-like first support portion formed with the first insertion hole and the first support portion, and to form the second insertion hole. A main body portion having a plate-like second support portion, and a distal end portion and a base end portion are inserted into the first insertion hole and the second insertion hole, respectively, and the outer surface is made non-conductive. A probe unit that is supported by the body portion in a state where the center portion is curved, wherein the probe pin has a large-diameter portion that is larger in diameter than the center portion. The second insertion hole is larger in diameter than the central portion and smaller in diameter than the large diameter portion and located on the first support portion side, and Larger than the large-diameter portion and communicating with the small-diameter hole Is composed of a hole, the second support portion, said a first support plate the small-diameter hole is formed, is constituted by a second supporting plate which the large-diameter hole is formed, the first support One of the plate and the second support plate has a first position where the central axes of the small-diameter hole and the large-diameter hole are coaxial and a second position where the central axes are offset from each other. It is configured to be slidable with respect to either one of the two support plates between the positions .

  The probe unit according to claim 2 is the probe unit according to claim 1, wherein the large-diameter portion is formed by coating a part of the base end portion with a coating material.

According to a third aspect of the present invention, there is provided a circuit board inspection apparatus according to the first or second aspect , a moving mechanism for moving the probe unit, and an electrical signal input via the probe unit. And an inspection unit for performing an electrical inspection on.

According to the probe unit of claim 1, the probe pin is configured by having a large-diameter portion larger in diameter than the central portion as a part of the base end portion, and is larger in diameter than the central portion and larger than the large-diameter portion. Since the second insertion hole is constituted by a small diameter hole having a small diameter and located on the first support part side and a large diameter hole having a larger diameter than the large diameter part and communicating with the small diameter hole, the second support part By moving the end of the large-diameter portion into contact with the edge of the small-diameter hole, the movement of the probe pin to the protruding side can be restricted and the protruding length of the tip can be adjusted. For this reason, by adjusting the tip of the central part coated with the coating material to the edge of the insertion hole in the first support part, the movement of the probe pin to the protruding side is regulated to adjust the protruding length of the tip. Unlike the conventional structure which changes, the protrusion length of a front-end | tip part can be changed arbitrarily by changing the distance between a 1st support part and a 2nd support part. Therefore, according to this probe unit, a plurality of types of probe units having different protruding lengths at the tip can be manufactured using the same probe pin (that is, the probe pin can be shared). The manufacturing cost of the circuit board and thus the manufacturing cost of the circuit board inspection apparatus can be sufficiently reduced. Further, according to this probe unit, the inspection was repeated in order to bring the end of the large-diameter portion provided on the base end side having a relatively small amount of curvature into contact with the edge of the small-diameter hole in the second support portion. However, since the large-diameter portion and the edge portion of the small-diameter hole are not greatly separated from each other, it is possible to sufficiently suppress an impact when the both abut. Therefore, the damage of the contact portion can be suppressed to a low level, and as a result, the probe pin replacement frequency can be sufficiently reduced. In addition, the first support plate having the small-diameter hole and the second support plate having the large-diameter hole are provided to configure the second support portion, thereby reducing the straight-shaped small-diameter hole and the large-diameter hole to the first shape. Since the 2nd support part can be produced by forming in 1 support plate and 2nd support plate separately, for example, the insertion hole of the same shape as the stepped hole in the state where the small diameter hole and the large diameter hole were connected Compared to forming the second support portion by forming the second support portion on a single plate member, the second support portion can be manufactured with high accuracy and ease. Further, either one of the first support plate and the second support plate is in a state where the center axis of each of the small-diameter hole and the large-diameter hole is in a coaxial state and the respective center axes are shifted from each other. Since it is configured to be slidable with respect to either one of the two support plates between the second position, the probe pin is inserted into the first insertion hole in a state where either one of the support plates is slid to the first position. After inserting the small diameter hole and the large diameter hole, the center portion of the probe pin can be bent in a predetermined direction reliably and easily by simply sliding the support plate to the second position.

  Further, according to the probe unit of the second aspect, since the large diameter portion is formed by coating a part of the base end portion of the probe pin with the coating material, for example, the base end portion of the probe pin is cut. As compared with the configuration in which the large diameter portion is integrally formed with the base end portion, the probe pin can be configured at a sufficiently low cost, and accordingly, the probe unit can be configured at a low cost.

Further, according to the circuit board inspection apparatus of the third aspect, by providing the probe unit, it is possible to realize the same effect as the effect of each of the probe units.

  Hereinafter, the best mode of a probe unit and a circuit board inspection apparatus according to the present invention will be described with reference to the drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 is an example of a circuit board inspection apparatus according to the present invention. For example, a predetermined electrical inspection is performed on a circuit board 100 (an example of an inspection object in the present invention). It is configured to be possible. Specifically, as shown in the figure, the circuit board inspection apparatus 1 includes a probe unit (pin block) 2, a moving mechanism 3, a substrate support unit 4, an inspection unit 5, and a control unit 6. .

2 and 3, the probe unit 2 includes a plurality of probe pins 11, a main body portion 12, and an electrode plate 13. Probe pins 11 is an example of a probe pin definitive to the present invention, as shown in FIG. 4, the configured needles (circular columnar) shape as a whole, each tip of the distal portion 21 and proximal portion 22 It is sharply formed. The probe pin 11 is configured such that the probe main body 20 can be elastically deformed by a conductive metal material (for example, beryllium copper alloy, SKH (high speed tool steel), tungsten steel, etc.). In addition, the center portion 23 of the probe pin 11 is subjected to a coating process using an insulating coating material (for example, a fluorine resin such as Teflon (registered trademark), polyurethane, polyester, polyimide, or the like). . For this reason, the central portion 23 is formed to have a slightly larger diameter than the probe main body 20 (the distal end portion 21 and the proximal end portion 22 excluding the large diameter portion 24 described later). The base end portion 22 is formed with a large-diameter portion 24 that is slightly larger in diameter than the central portion 23 by being subjected to the coating process using the above-described coating material.

  As shown in FIG. 2, the main body portion 12 includes a first support portion 31, a second support portion 32, and a connecting portion 33. The 1st support part 31 is formed in plate shape with the resin material etc. which have nonelectroconductivity. Further, as shown in FIG. 3, the first support portion 31 is formed with a plurality of first insertion holes 31 a for inserting the tip portion 21 of the probe pin 11. In this case, in the probe unit 2 according to the present invention, as described later, the large diameter portion 24 restricts the movement of the probe pin 11 toward the distal end portion 21 side. For this reason, in this probe unit 2, the end portion of the central portion 123 coated with the coating material (specifically, the end surface of the coating material) comes into contact with the edge portion of the insertion hole 131 a in the first support portion 131 and the probe pin 111. Unlike the conventional configuration that restricts movement, by defining the inner diameter of the first insertion hole 31a to be slightly larger than the central part 23, both the tip part 21 and the central part 23 are inserted into the first insertion hole 31a. It is possible to make it.

  As shown in FIG. 3, the second support portion 32 includes a first support plate 41 positioned on the first support portion 31 side, and an electrode plate 13 side (a surface facing the first support portion 31 on the first support plate 41. The second support plate 42 located on the back surface side) is configured. The 1st support plate 41 is formed in plate shape with the resin material etc. which have nonelectroconductivity. Further, the first support plate 41 (that is, the second support portion 32) is disposed so as to be parallel (substantially parallel) to the first support portion 31, and as shown in FIG. The first support portion 31 is connected to the first support portion 31. Further, as shown in FIG. 3, the first support plate 41 is formed with a plurality of small diameter holes 41a. In this case, the small diameter hole 41a is slightly larger in diameter than the central portion 23 of the probe pin 11 and slightly smaller in diameter than the large diameter portion 24 of the probe pin 11, that is, the central portion 23 of the probe pin 11 can be inserted and large. The inner diameter is defined such that the diameter portion 24 cannot be inserted.

  Further, as shown in FIG. 3, insertion holes 41 c and 41 d into which the fixing pins 43 can be inserted are formed in the first support plate 41. In this case, as shown in FIG. 5, when the probe unit 2 is assembled, the insertion hole 41c is inserted into the first insertion hole 31a, the small diameter hole 41a, and the large diameter hole 42a described later. It is used when the first support plate 41 and the second support plate 42 are aligned to a position (first position) where the central axes of the hole 31a, each small diameter hole 41a, and each large diameter hole 42a are coaxial. . Further, as shown in FIG. 6, the insertion hole 41d has the first support plate 41 and the second support plate 41 at a position (second position) where the central axes of the small diameter hole 41a and the large diameter hole 42a are shifted from each other. It is used when the support plate 42 is positioned and the probe pin 11 inserted through the first insertion hole 31a, the small diameter hole 41a and the large diameter hole 42a is bent (elastically deformed).

  As shown in FIG. 3, the second support plate 42 is formed in a plate shape with a non-conductive resin material or the like, and the first support plate 41 is between the first position and the second position. The first support plate 41 is slidably disposed on the outer side (upper side in the figure). The second support plate 42 is formed with a plurality of large-diameter holes 42a as shown in FIG. In this case, the inner diameter of the large-diameter hole 42 a is defined to be slightly larger than the large-diameter portion 24 of the probe pin 11, that is, the size that allows the large-diameter portion 24 to be inserted. Further, the formation position of the large-diameter hole 42a is defined so as to communicate with the small-diameter hole 41a located on the first support portion 31 side and be located on the electrode plate 13 side (the back surface side of the first support plate 41). ing. As shown in the figure, the small diameter hole 41a and the large diameter hole 42a constitute a second insertion hole 32a in the present invention, and this second insertion hole 32a (formed by the small diameter hole 41a and the large diameter hole 42a). The large-diameter portion 24 and the base end portion 22 of the probe pin 11 described above are accommodated in the space).

  Further, as shown in FIG. 3, the second support plate 42 is formed with insertion holes 42c and 42d into which the fixing pins 43 can be inserted. In this case, as shown in FIG. 5, the insertion hole 42c has a central axis thereof and a central axis of the insertion hole 41c in a state where the second support plate 42 is positioned (slid) at the first position described above. Is defined such that is in a coaxial state. Further, as shown in FIG. 6, the insertion hole 42d is arranged so that the central axis thereof is coaxial with the central axis of the insertion hole 41d when the second support plate 42 is positioned at the second position described above. The formation position is defined in FIG.

Here, the outer diameter of each of the distal end portion 21, the proximal end portion 22, the central portion 23, and the large diameter portion 24 of the probe pin 11, and the first insertion hole 31a, the small diameter hole 41a, and the large diameter hole 42a. The relationship between the inner diameters is expressed by the following relational expression.
E1 = E2 <E3 <I1 ≦ I2 <E4 <I3 (1)
E1: Outer diameter of the distal end portion E2: Outer diameter of the base end portion E3: Outer diameter of the central portion 23 E4: Outer diameter of the large diameter portion 24 I1: Inner diameter of the first insertion hole 31a I2: Inner diameter of the small diameter hole 41a I3: inner diameter of the large-diameter hole 42a

  As shown in FIG. 3, the electrode plate 13 is formed in a plate shape by a non-conductive resin material or the like, and is outside the second support portion 32 (second support plate 42) of the main body portion 12 (in the same figure). It is fixed to the mounting plate (not shown) of the moving mechanism 3 together with the main body 12 while being in contact with the upper side. Further, as shown in the figure, conductive terminals 13a are fitted into the contact portions of the electrode plates 13 with the respective base end portions 22 of the respective probe pins 11, and the probe terminals 11a are fitted with probe terminals. Cables 13b for electrically connecting the pins 11 and the inspection unit 5 are respectively connected.

  The moving mechanism 3 is configured to be able to fix the probe unit 2, and moves the probe unit 2 in a direction in which the probe unit 2 comes in contact with and separates from the substrate support unit 4 under the control of the control unit 6. The substrate support unit 4 is configured to be able to hold the circuit board 100. The inspection unit 5 performs a predetermined electrical inspection such as a disconnection inspection or a short circuit inspection on the circuit board 100 based on an electric signal input via the probe pin 11 of the probe unit 2 according to the control of the control unit 6. . The control unit 6 moves the probe unit 2 fixed to the moving mechanism 3 by controlling the moving mechanism 3. In addition, the control unit 6 controls the inspection unit 5 to execute a predetermined electrical inspection on the circuit board 100.

  Next, a method for assembling the probe unit 2 will be described with reference to the drawings.

  First, as shown in FIG. 5, the central axis of the first insertion hole 31 a in the first support portion 31, the central axis of the small diameter hole 41 a in the first support plate 41, and the center of the large diameter hole 42 a in the second support plate 42. The second support plate 42 is slid to the first position where the axes are coaxial with each other. At this time, the central axis of the insertion hole 42 c in the second support plate 42 and the central axis of the insertion hole 41 c in the first support plate 41 are in a coaxial state. Next, the fixing pin 43 is inserted into the insertion holes 42c and 41c. Thereby, the 1st support plate 41 and the 2nd support plate 42 are maintained in the state aligned with the 1st position.

  Subsequently, as shown in FIG. 5, the distal end portion 21 of the probe pin 11 is inserted into each large-diameter hole 42 a and the probe pin 11 is pushed toward the first support portion 31. In this case, in the probe unit 2, the outer diameter of each of the distal end portion 21, the proximal end portion 22, the central portion 23, and the large diameter portion 24, the first insertion hole 31 a, the small diameter hole 41 a, and the large diameter hole in the probe pin 11. The inner diameter of each of 42a is defined by the magnitude relationship of the above formula (1). Therefore, the distal end portion 21 is inserted in this order into each large-diameter hole 42a, small-diameter hole 41a, and first insertion hole 31a and protrudes to the outside of the first support portion 31 (the lower side in the figure), and the central portion 23 Is inserted between each large-diameter hole 42a and each small-diameter hole 41a and is positioned between the first support part 31 and the second support part 32. Further, the end portion (specifically, the end surface of the coating material) on the distal end portion 21 side of the large diameter portion 24 comes into contact with the edge portion of the small diameter hole 41a in the first support plate 41, and further insertion (protrusion) of the probe pin 11 is performed. Movement to the side) is prevented. For this reason, the front-end | tip part 21 protrudes outside the 1st support part 31 by predetermined length. That is, the protruding length of the tip 21 is adjusted to a predetermined length.

  Here, in the probe pin 11, the end of the central portion 123 coated with the coating material is brought into contact with the edge of the insertion hole 131 a in the first support portion 131, thereby moving the probe pin 111 to the protruding side. Unlike the conventional configuration that regulates and adjusts the protruding length of the front end portion 121, the end of the large diameter portion 24 is brought into contact with the edge of the small diameter hole 41a in the first support plate 41 as described above. The protrusion length of the tip portion 21 is adjusted by restricting the movement of the probe pin 11 to the side. For this reason, by changing the distance between the 1st support part 31 and the 1st support plate 41, as a result of being able to arbitrarily change the protrusion length of the front-end | tip part 21, using the same probe pin 11, a front-end | tip Plural types of probe units 2 having different protrusion lengths of the portion 21 can be manufactured. Therefore, in this probe unit 2, it is possible to reduce the manufacturing cost because the probe pin 11 can be shared.

  Next, after the insertion of all the probe pins 11 into the first insertion holes 31a and the small diameter holes 41a is completed, the fixing pins 43 are pulled out from the insertion holes 41c and 42c. Subsequently, as shown in FIG. 6, the second support plate 42 is slid to a second position where the central axes of the small diameter hole 41 a and the large diameter hole 42 a are slightly shifted from each other. At this time, as a result of the sliding of the second support plate 42, the proximal end portion 22 (large diameter portion 24) side of the probe pin 11 is inclined in the sliding direction. As a result, as shown in FIG. Deformation). Further, by sliding to the second position, the center axis of the insertion hole 42 d in the second support plate 42 and the center axis of the insertion hole 41 d in the first support plate 41 become coaxial. Next, the fixing pin 43 is inserted into the insertion holes 42d and 41d. Thereby, the 1st support plate 41 and the 2nd support plate 42 are aligned by the 2nd position, and the center part 23 of the probe pin 11 is maintained in the state curved a little.

  Subsequently, in a state where the electrode plate 13 is in contact with the outside of the second support portion 32 (second support plate 42), the second support portion 32 (main body portion 12) is attached to an attachment plate (not shown) of the moving mechanism 3. ) With the electrode plate 13. Thus, the assembly of the probe unit 2 is completed.

  Next, a method for performing an electrical inspection on the circuit board 100 using the circuit board inspection apparatus 1 will be described with reference to the drawings.

  First, the circuit board 100 is fixed to the board support 4. Next, the circuit board inspection apparatus 1 is operated. At this time, the control unit 6 controls the moving mechanism 3 to move the probe unit 2 in the direction approaching the circuit board 100. Subsequently, the control unit 6 further moves the probe unit 2 by a predetermined distance from the position where the tip 21 of each probe pin 11 of the probe unit 2 contacts the terminal of the circuit board 100. In this case, in the probe unit 2, the central portion 23 of the probe pin 11 is slightly curved in advance. Therefore, when the distal end portion 21 of the probe pin 11 is moved to the second support portion 32 side with the movement of the probe unit 2, the bending amount of the central portion 23 changes (increases) and the bending amount The distal end of the base end portion 22 reliably contacts the terminal 13a of the electrode plate 13 by the elastic force resulting from the change.

  Next, the inspection unit 5 performs an electrical inspection on the circuit board 100 based on the electrical signal input via the probe pin 11 under the control of the control unit 6. Subsequently, when the inspection of the circuit board 100 is completed, the control unit 6 controls the moving mechanism 3 to move the probe unit 2 in a direction away from the circuit board 100. Next, when an electrical inspection is performed on another circuit board 100, the above steps are repeated.

  In this case, in the conventional configuration, the end portion on the tip portion 121 side of the central portion 123 where the bending amount changes relatively large is brought into contact with the edge portion of the insertion hole 131a in the first support portion 131. Accordingly, the contact and separation between the end portion of the central portion 123 and the edge portion of the insertion hole 131a are repeated. For this reason, in the conventional configuration, the end portion of the central portion 123 may be damaged within a relatively short period of time, and the replacement frequency of the probe pin 111 may be relatively increased accordingly. On the other hand, in the probe unit 2, the end of the large diameter portion 24 provided on the base end portion 22 side with a relatively small amount of bending is brought into contact with the edge of the small diameter hole 41a in the first support plate 41. ing. For this reason, even if the inspection is repeated, the end portion of the large diameter portion 24 and the edge portion of the small diameter hole 41a are not greatly separated from each other. . Therefore, in this probe unit 2, since the damage of the contact portion can be suppressed to a low level, the replacement frequency of the probe pin 11 can be suppressed to a low level.

  Thus, according to the probe unit 2, the probe pin 11, and the circuit board inspection apparatus 1, the probe pin 11 is configured with the large diameter portion 24 having a larger diameter than the central portion 23 as a part of the base end portion 22, A small diameter hole 41a that is larger in diameter than the central part 23 and smaller in diameter than the large diameter part 24 and located on the first support part 31 side and larger in diameter than the large diameter part 24 and communicates with the small diameter hole 41a. By forming the diameter hole 42a in the second support portion 32, the end of the large diameter portion 24 is brought into contact with the edge of the small diameter hole 41a in the first support plate 41, whereby the probe pin 11 toward the protruding side is The protrusion length of the tip portion 21 can be adjusted by restricting the movement. For this reason, the end of the center part 123 coated with the coating material is brought into contact with the edge of the insertion hole 131a in the first support part 131, thereby restricting the movement of the probe pin 111 to the protruding side and thereby the tip part 121. Unlike the conventional configuration that adjusts the protrusion length of the first end portion 21, the protrusion length of the tip end portion 21 can be arbitrarily changed by changing the distance between the first support portion 31 and the first support plate 41. Therefore, according to the probe unit 2 and the circuit board inspection apparatus 1, it is possible to manufacture a plurality of types of probe units 2 having different protrusion lengths of the distal end portion 21 using the same probe pin 11 (that is, common use of probe pins). Therefore, the manufacturing cost of the probe unit 2 and thus the manufacturing cost of the circuit board inspection apparatus 1 can be reduced sufficiently. Further, according to the probe unit 2 and the circuit board inspection apparatus 1, the end portion of the large diameter portion 24 provided on the base end portion 22 side with a relatively small amount of curvature and the edge portion of the small diameter hole 41 a in the first support plate 41. Since the large diameter portion 24 and the edge portion of the small diameter hole 41a are not greatly separated from each other even if the inspection is repeated, the impact when the both abut can be sufficiently suppressed. Therefore, as a result of suppressing the damage of the abutting portion, the replacement frequency of the probe pin 11 can be sufficiently reduced.

  Further, according to the probe unit 2, the probe pin 11, and the circuit board inspection apparatus 1, the large diameter portion 24 is formed by coating a part of the base end portion 22 of the probe pin 11 with the coating material. Compared with the configuration in which the base end portion 22 of the probe pin 11 is cut and the large-diameter portion 24 is integrally formed with the base end portion 22, the probe pin 11 can be configured at a sufficiently low cost. The probe unit 2 and the circuit board inspection apparatus 1 can be configured sufficiently inexpensively.

  Further, according to the probe unit 2 and the circuit board inspection apparatus 1, the first support plate 41 in which the small diameter hole 41a is formed and the second support plate 42 in which the large diameter hole 42a is formed are provided as the second support. By configuring the portion 32, the second support portion 32 can be produced by forming the straight-shaped small-diameter hole 41a and the large-diameter hole 42a individually in the first support plate 41 and the second support plate 42. For example, as compared with the case where the second support portion 32 is formed by forming the insertion hole having the same shape as the stepped hole in a state where the small diameter hole 41a and the large diameter hole 42a are communicated with each other, The second support portion 32 can be manufactured with high accuracy and ease.

  Further, according to the probe unit 2 and the circuit board inspection apparatus 1, the first position where the central axes of the small-diameter hole 41a and the large-diameter hole 42a are in the coaxial state, and the state where the central axes are off-axis. The second support plate 42 is configured to be slidable with respect to the first support plate 41 between the second position and the probe pin 11 while the second support plate 42 is slid to the first position. Is inserted into the first insertion hole 31a, the small diameter hole 41a and the large diameter hole 42a, and then the central portion 23 of the probe pin 11 is reliably and easily determined by simply sliding the second support plate 42 to the second position. It can be curved in the direction.

  In addition, this invention is not limited to said structure. For example, although the configuration example in which the base end portion 22 of the probe pin 11 is coated with a coating material to form the large diameter portion 24 has been described above, the configuration in which the large diameter portion 24 is integrally formed with the base end portion 22 by cutting or forging. That is, it is possible to employ the probe pin 11 in which the base end portion 22 is formed in a stepped state. Further, the example in which the second support portion 32 is configured by the first support plate 41 in which the small diameter hole 41a is formed and the second support plate 42 in which the large diameter hole 42a is formed has been described above, but the small diameter hole 41a and the large diameter hole 42a have The 2nd support part 32 can also be comprised with the single board member which formed the insertion hole of the same shape as the stepped hole of the state connected.

  In addition, the configuration example in which the distal end portion 21 of the probe pin 11 is not coated with the coating material has been described above. However, the probe pin 11 coated with the coating material is also used on the distal end portion 21 except the portion that contacts the inspection object. You can also. According to this configuration, by using a coating material having a small friction coefficient, the frictional force between the inner peripheral wall constituting the first insertion hole 31a and the tip 21 can be kept small. For this reason, the operation | movement at the time of moving the front-end | tip part 21 of the probe pin 11 to the 2nd support part 32 side with the movement of the probe unit 2 at the time of a test | inspection can be made smooth. Furthermore, although the example in which the inner diameter of the first insertion hole 31a in the first support part 31 is defined to be larger than the outer diameter of the center part 23 in the probe pin 11 has been described above, the inner diameter of the first insertion hole 31a is It is also possible to define the diameter larger than the outer diameter of 21 and smaller than the central portion 23. In this case, by defining the coating range in the central portion 23 short (in other words, defining the uncoated portion long), the above-described configuration (the inner diameter of the first insertion hole 31a is larger than the outer diameter of the central portion 23). In the same manner as in the configuration defined by the large diameter, by changing the distance between the first support portion 31 and the first support plate 41, the protruding length of the tip portion 21 can be arbitrarily changed.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 2 is a configuration diagram showing a configuration of a probe unit 2. FIG. 3 is a cross-sectional view of the probe unit 2. FIG. 2 is a cross-sectional view of a probe pin 11. FIG. 4 is a cross-sectional view of a state in which the probe pin 11 is inserted into a first insertion hole 31a, a small diameter hole 41a, and a large diameter hole 42a of the main body 12. FIG. 4 is a cross-sectional view of a state in which the central axes of the small diameter hole 41a and the large diameter hole 42a are offset from each other in a state where the probe pin 11 is inserted into the small diameter hole 41a and the large diameter hole 42a. It is a block diagram of the conventional probe unit 102 which the applicant has already developed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2 Probe unit 3 Movement mechanism 5 Inspection part 11 Probe pin 12 Main body part 21 Front-end | tip part 22 Base end part 23 Center part 24 Large diameter part 31 1st support part 31a 1st insertion hole 32 2nd support part 32a Second insertion hole 41 First support plate 41a Small diameter hole 42 Second support plate 42a Large diameter hole

Claims (3)

A main body having a plate-like first support portion in which a first insertion hole is formed and a plate-like second support portion that is disposed opposite to the first support portion and in which a second insertion hole is formed; The distal end and the base end are inserted into the first insertion hole and the second insertion hole, respectively, and the central portion formed so that the outer surface has non-conductivity is curved by the body portion. A probe unit comprising a probe pin to be supported,
The probe pin is configured to have a large diameter portion larger than the central portion as a part of the base end portion,
The second insertion hole is larger in diameter than the central portion, smaller in diameter than the large diameter portion, and located on the first support portion side, and larger in diameter than the large diameter portion. A large-diameter hole communicating with the small-diameter hole ,
The second support portion includes a first support plate in which the small diameter hole is formed, and a second support plate in which the large diameter hole is formed,
One of the first support plate and the second support plate includes a first position where the central axes of the small-diameter hole and the large-diameter hole are in a coaxial state, and a state where both the central axes are off-axis. A probe unit configured to be slidable with respect to either one of the two support plates between the second position .   The probe unit according to claim 1, wherein the large-diameter portion is formed by coating a part of the base end portion with a coating material. Includes a probe unit according to claim 1 or 2, wherein, a moving mechanism for moving the probe unit, and a checking unit for performing electrical inspection to the inspection object based on the electric signal input via the probe unit Circuit board inspection device.

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