JP4970567B2 - Method for measuring metal layer thickness on flexible substrates - Google Patents
Method for measuring metal layer thickness on flexible substrates Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/04—Measuring microscopes
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
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Description
本発明は、フレキシブル基板上に備えられた金属層の厚さ測定方法に関し、より詳しくは、フレキシブルエレクトロニクスに使用されるフレキシブル配線基板の製造工程中に、フレキシブル基板上に積層された薄い金属層の厚さを容易に測定できる厚さ測定方法に関する。 The present invention relates to a method for measuring a thickness of a metal layer provided on a flexible substrate, and more particularly, a thin metal layer laminated on a flexible substrate during a manufacturing process of a flexible wiring substrate used in flexible electronics. The present invention relates to a thickness measuring method capable of easily measuring the thickness.
フレキシブル配線基板を利用するフレキシブルエレクトロニクス分野において、金属薄膜層の厚さに応じて素子の特性と寿命が大きく変わるため、金属薄膜層の厚さを正確に測定することは非常に重要である。一般に使用される金属薄膜層の厚さ測定方法としては、光、赤外線、Ｘ線、レーザなどの干渉、反射、屈折を利用した方法、赤外線サーモグラフィー装置を用いた方法、高周波を利用した方法などがある。 In the field of flexible electronics using a flexible wiring board, since the characteristics and lifetime of the element vary greatly depending on the thickness of the metal thin film layer, it is very important to accurately measure the thickness of the metal thin film layer. As a method for measuring the thickness of a metal thin film layer generally used, there are a method using interference, reflection and refraction of light, infrared rays, X-rays, lasers, a method using an infrared thermography device, a method using a high frequency, and the like. is there.
しかしながら、既存の厚さ測定方法は、赤外線、Ｘ線、高周波などの高価な光源を必要とするだけでなく、別途に光学装置である干渉計、分光計、検出器などを必要とする。さらに、薄膜の厚さ測定のためには、薄膜を製造した後、測定しようとする薄膜を採取して、別途の測定装置に移動して測定する必要がある。従って、厚さ測定作業を現場で適時に行うことができないので、厚さ測定には時間がかかり、厚さ測定の結果を反映するためのフィードバックが遅くならざるをえないという問題があった。 However, the existing thickness measurement method not only requires expensive light sources such as infrared rays, X-rays, and high frequencies, but also requires an optical device such as an interferometer, a spectrometer, and a detector. Furthermore, in order to measure the thickness of the thin film, after the thin film is manufactured, it is necessary to collect the thin film to be measured and move it to a separate measuring device for measurement. Therefore, since the thickness measurement work cannot be performed in the field in a timely manner, the thickness measurement takes time, and there is a problem that feedback for reflecting the result of the thickness measurement must be delayed.
本発明は、このような問題を解決するために提案されたものであり、本発明の目的は、フレキシブルエレクトロニクスで使用されるフレキシブル配線基板内の金属層の厚さをその場（in-situ）で測定する方法を提供することにある。 The present invention has been proposed to solve such problems, and the object of the present invention is to determine the thickness of a metal layer in a flexible wiring board used in flexible electronics in-situ. It is in providing the method of measuring by.
さらなる本発明の目的は、フレキシブル基板上に金属層がコーティングされたときに、残留応力又は外部から加えられた応力により金属層に周期的に発生するシワ現象を利用して、金属層の厚さを測定する方法を提供することにある。 A further object of the present invention is to take advantage of the wrinkle phenomenon that occurs periodically in the metal layer due to residual stress or externally applied stress when the metal layer is coated on the flexible substrate, and thereby the thickness of the metal layer. It is to provide a method of measuring.
前述したような目的を達成するために本発明は、フレキシブル基板の一面にコーティングされた金属薄膜層の厚さを測定する測定方法であって、前記金属薄膜層に圧縮応力を加えてシワを生成する第１段階と、前記シワの周期を測定する第２段階とを含むフレキシブル基板の金属層測定方法を提供する。前記フレキシブル基板は、粘弾性を有するポリマーである。 In order to achieve the above-described object, the present invention is a measuring method for measuring the thickness of a metal thin film layer coated on one surface of a flexible substrate, and generates wrinkles by applying a compressive stress to the metal thin film layer. There is provided a method for measuring a metal layer of a flexible substrate, including a first step of performing and a second step of measuring the wrinkle period. The flexible substrate is a polymer having viscoelasticity.
前記フレキシブル基板にコーティングされた金属層にシワを生成する方法としては、金属層をコーティングした後、存在する残留応力を利用してシワを生成する方法、前記フレキシブル基板に引張力を加えた状態で金属層をコーティングして引張力を除去する方法を用いてシワを生成する方法、フレキシブル基板に金属層をコーティングした状態で曲げ応力を加えてシワを生成する方法、又はフレキシブル基板に金属層をコーティングした状態でいずれか一方向に引張力を加えることにより引張力が加えられる方向に対する垂直方向に圧縮応力がかかるようにしてシワを生成する方法を用いることができる。 As a method of generating wrinkles on the metal layer coated on the flexible substrate, a method of generating wrinkles using the residual stress existing after coating the metal layer, in a state where a tensile force is applied to the flexible substrate. A method of generating wrinkles using a method of removing a tensile force by coating a metal layer, a method of generating wrinkles by applying a bending stress while a metal layer is coated on a flexible substrate, or a coating of a metal layer on a flexible substrate In this state, a method of generating wrinkles by applying a tensile force in any one direction so that a compressive stress is applied in a direction perpendicular to the direction in which the tensile force is applied can be used.
前記シワの周期、すなわち、シワの間隔の測定は、光学顕微鏡、原子顕微鏡、電子顕微鏡を利用して行われ、前記フレキシブル基板にコーティングされた金属薄膜層は、１つの金属層、又は複数の金属層からなる。 The period of the wrinkles, that is, the interval between the wrinkles is measured using an optical microscope, an atomic microscope, or an electron microscope, and the metal thin film layer coated on the flexible substrate is one metal layer or a plurality of metals. Consists of layers.
また、前記シワ生成及びシワ測定は、フレキシブル配線基板の製造工程中にその場で実行できる。 The wrinkle generation and wrinkle measurement can be performed on the spot during the manufacturing process of the flexible wiring board.
また、本発明は、フレキシブル基板にコーティングされた金属薄膜層の厚さを測定する方法として、前記金属薄膜層にシワを生成した後、シワの間隔（λ）と金属層の厚さ（ｔｆ）の関係を示す下記（式１）を用いて金属層の厚さを測定するフレキシブル基板の金属層厚さ測定方法を提供する。
また、本発明は、フレキシブル基板にコーティングされた第１金属層と第２金属層の厚さを測定する方法として、前記第１及び第２金属層に圧縮応力を加えてシワを生成した後、下記式２を用いて金属層の厚さを測定するフレキシブル基板の金属層厚さ測定方法を提供する。
本発明は、前記構成により、フレキシブル基板上にコーティングされた金属層の厚さをその場で測定することができる。
すなわち、フレキシブル基板上に金属薄膜をコーティングした後、応力により発生するシワの周期を測定することにより、フレキシブル基板上の金属単一薄膜又は多層薄膜の厚さ測定を容易にすることができるものであり、フレキシブルエレクトロニクス配線基板の厚さを基板製造工程中にその場で測定することにより薄膜の厚さを容易に測定することができる。
According to the above configuration, the present invention can measure the thickness of the metal layer coated on the flexible substrate in situ.
In other words, after coating a metal thin film on a flexible substrate, the thickness measurement of the metal single thin film or multilayer thin film on the flexible substrate can be facilitated by measuring the period of wrinkles generated by stress. Yes, the thickness of the thin film can be easily measured by measuring the thickness of the flexible electronics wiring board in situ during the board manufacturing process.
本発明によるフレキシブル基板上の金属層のその場での厚さ測定方法は、フレキシブル基板上に金属薄膜をコーティングした後、残留応力又は外部応力により発生するシワの周期を測定することにより、フレキシブル基板上の金属単一薄膜又は多層薄膜の厚さを容易に測定することができ、フレキシブルエレクトロニクス配線基板の厚さを基板製造工程中にその場で測定することにより薄膜の厚さを容易に測定することができる。 An in-situ thickness measurement method for a metal layer on a flexible substrate according to the present invention comprises: coating a flexible metal substrate with a metal thin film; and then measuring a period of wrinkles generated by residual stress or external stress. Easily measure the thickness of single metal thin film or multilayer thin film on the top, and easily measure the thickness of thin film by measuring the thickness of flexible electronics wiring board in situ during the board manufacturing process be able to.
以下、添付図面を参照して本発明の具体的な実施形態について説明する。 Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.
図１において、本発明の一実施形態による金属層厚さを測定するための流れを示す。まず、フレキシブル基板を準備し、該フレキシブル基板に金属層をコーティングした後、該金属層に応力を加えてシワを形成する。また、前記金属層に形成されたシワの周期を測定することにより、金属層の厚さを把握することができる。 FIG. 1 shows a flow for measuring a metal layer thickness according to an embodiment of the present invention. First, after preparing a flexible substrate and coating the flexible substrate with a metal layer, stress is applied to the metal layer to form wrinkles. Moreover, the thickness of a metal layer can be grasped | ascertained by measuring the period of the wrinkle formed in the said metal layer.
以下、本発明を説明するための実施形態においては、銅／ポリマー（Ｃｕ／ＰＤＭＳ）のフレキシブル基板において、単層薄膜であるＣｕの厚さを測定する方法についてて説明した後、次に、銅／チタン／ポリマー（Ｃｕ／Ｔｉ／ＰＤＭＳ）のフレキシブル基板において、多層薄膜であるＣｕ／Ｔｉの厚さ及びＣｕ、Ｔｉ層のそれぞれの厚さを測定する方法について説明する。また、本実施形態において説明のために使用されるフレキシブル基板としては、弾性係数が約２．７ＭＰａであるＰＤＭＳ（Polydimethylsiloxane）を利用し、このＰＤＭＳ上にＤＣマグネトロンスパッタリング方法を用いてＣｕ単層薄膜とＣｕ／Ｔｉ多層薄膜を蒸着した。 Hereinafter, in an embodiment for explaining the present invention, a copper / polymer (Cu / PDMS) flexible substrate will be described with respect to a method of measuring the thickness of Cu, which is a single layer thin film, and then copper. A method of measuring the thickness of Cu / Ti, which is a multilayer thin film, and the thickness of each of the Cu and Ti layers in a flexible substrate of / titanium / polymer (Cu / Ti / PDMS) will be described. Moreover, as a flexible substrate used for explanation in the present embodiment, PDMS (Polydimethylsiloxane) having an elastic modulus of about 2.7 MPa is used, and a Cu single layer thin film is formed on the PDMS by using a DC magnetron sputtering method. A Cu / Ti multilayer thin film was deposited.
蒸着装置の真空チャンバ内の圧力は、１０−６Ｐａ（＜１０−８ｔｏｒｒ）程度に維持され、金属薄膜層の蒸着後に薄膜層に圧縮応力を加えてシワが生成された。圧縮応力を加える方法としては、蒸着前にフレキシブル基板を予め引張応力を加えて蒸着した後に引張応力を除去する方法、直接圧縮応力を与える方法、蒸着後に曲げ変形（bending）を与える方法、ポアソン比の法則（Poisson rule）を利用してｘ軸方向に引張ることで、ｙ軸方向に圧縮応力がかかるようにする方法など、様々な方法が全て可能である。ただし、本実験では、蒸着前にＰＤＭＳを予め引張変形させ、薄膜蒸着後に引張応力を除去する方法を用いた。 The pressure in the vacuum chamber of the vapor deposition apparatus was maintained at about 10 −6 Pa (<10 −8 torr), and wrinkles were generated by applying compressive stress to the thin film layer after vapor deposition of the metal thin film layer. Methods for applying compressive stress include: removing the tensile stress after the flexible substrate is pre-deposited by vapor deposition before vapor deposition, applying direct compressive stress, applying bending after vapor deposition, Poisson's ratio Various methods such as a method of applying a compressive stress in the y-axis direction by pulling in the x-axis direction using the Poisson rule are all possible. However, in this experiment, PDMS was preliminarily tensile deformed before vapor deposition, and a method of removing tensile stress after thin film vapor deposition was used.
図２においては、ポリマー（ＰＤＭＳ）上にコーティングされたＣｕ薄膜層に生成されたシワの形状及び周期を示す。フレキシブル基板の金属層が圧縮変形されると、金属薄膜層とポリマーが非線形変形して、図２に示す光学画像のように特殊なシワ周期を有するシワが生成される。このように生成された薄膜のシワ周期は、薄膜とポリマー基板の弾性係数及び薄膜層の厚さに応じて決定される。 FIG. 2 shows the shape and period of wrinkles generated in a Cu thin film layer coated on a polymer (PDMS). When the metal layer of the flexible substrate is compressed and deformed, the metal thin film layer and the polymer are nonlinearly deformed to generate wrinkles having a special wrinkle period as in the optical image shown in FIG. The wrinkle period of the thin film thus generated is determined according to the elastic modulus of the thin film and the polymer substrate and the thickness of the thin film layer.
図３は、このような方法でポリマー上に蒸着した弾性金属層のシワの形状を示す。 FIG. 3 shows the shape of the wrinkles of the elastic metal layer deposited on the polymer in this way.
図３の上図においては、フレキシブル基板２上に薄い金属薄膜層１が蒸着された状態を示し、図３の下図においては、前記金属層に圧縮応力を加えてシワを形成した状態を示す。 3 shows a state in which a thin metal thin film layer 1 is deposited on the flexible substrate 2, and the lower diagram in FIG. 3 shows a state in which wrinkles are formed by applying compressive stress to the metal layer.
ここで、フレキシブル基板２上の金属薄膜層の厚さをｔｆとし、弾性係数を下記（式３）とし、ポアソン比を下記（式４）とする。
フレキシブル基板が軟性ポリマー基板である場合、弾性係数を下記（式５）とし、ポアソン比を下記（式６）とすると、基板の厚さは薄膜層の厚さに比べて非常に大きいため、無限に大きいと仮定することができる。
すなわち、平面歪み（plane strain）条件で考えることができる。ここで、シワの形状又は輪郭は、以下の（式７）で表すことができ、シワの生成のための臨界変形量は以下の（式８）である。
このような臨界変形量以上で生成されるシワの間隔λは（式９）のように表される。また、平面歪み条件ではαが４．３５６であるため、（式９）は（式１０）のように表される。また、（式１０）を金属層の厚さについて整理すると、（式１１）のように金属層の厚さを求めることができる。 An interval λ of wrinkles generated with a critical deformation amount or more is expressed as (Equation 9). In addition, since α is 4.356 under the plane distortion condition, (Equation 9) is expressed as (Equation 10). Further, when (Equation 10) is arranged with respect to the thickness of the metal layer, the thickness of the metal layer can be obtained as (Equation 11).
ここで、平面歪み弾性係数（plane strain modulus）及び弾性係数（elastic modulus）の関係は以下の（式１２）であり、平面歪み弾性係数は（式１３）で示され、弾性係数は（式１４）で示される。
従って、ポリマー基板の弾性係数、金属層の弾性係数、シワの幅又は周期を利用して（式１１）のように金属層の厚さを測定することができる。ポリマー基板の弾性係数は、既存の文献の弾性係数値を使用すればよく、金属層の弾性係数は、金属層の結晶方位が同一である場合に一定の値を有するので、既存の文献の弾性係数値を使用すればよく、シワの幅は、光学顕微鏡又は原子顕微鏡を利用して測定すればよいため、上記（式１１）を用いると、金属層の厚さを直ちに測定することができる。 Therefore, the thickness of the metal layer can be measured as in (Equation 11) using the elastic coefficient of the polymer substrate, the elastic coefficient of the metal layer, the width or period of the wrinkles. The elastic modulus of the polymer substrate should be the elastic modulus value of the existing literature, and the elastic modulus of the metal layer has a constant value when the crystal orientation of the metal layer is the same, so the elasticity of the existing literature The coefficient value may be used, and the width of the wrinkle may be measured using an optical microscope or an atomic microscope. Therefore, using the above (Equation 11), the thickness of the metal layer can be measured immediately.
以下、図４のように金属層が複数の層で形成された場合に厚さを測定する方法について説明する。図４においては、フレキシブル基板上に金属層がＣｕ／Ｔｉのように２層に蒸着された場合を示し、この場合、Ｔｉ層上にコーティングされたＣｕ層の厚さは、以下のような方法で測定することができる。 Hereinafter, a method of measuring the thickness when the metal layer is formed of a plurality of layers as shown in FIG. 4 will be described. FIG. 4 shows a case where a metal layer is deposited in two layers on a flexible substrate like Cu / Ti. In this case, the thickness of the Cu layer coated on the Ti layer is determined by the following method. Can be measured.
まず、図４のようにＣｕ／Ｔｉ多層薄膜製造工程中にＴｉ層のみを蒸着した部分とＣｕ／Ｔｉを蒸着した部分に圧縮応力を加えてそれぞれシワを形成した後、これらシワの周期を測定する。 First, as shown in FIG. 4, after forming a wrinkle by applying compressive stress to the portion where only the Ti layer is deposited and the portion where Cu / Ti is deposited during the Cu / Ti multilayer thin film manufacturing process, the period of these wrinkles is measured. To do.
下記（式１５）によりＴｉ層の厚さを測定する。
次に、Ｃｕ／Ｔｉ金属層の厚さは、Ｃｕ金属層の厚さとＴｉ金属層の厚さの和であるので、下記（式１６）の関係が成立する。
また、Ｃｕ／Ｔｉ金属層の厚さは、下記（式１７）を用いて決定される。 Further, the thickness of the Cu / Ti metal layer is determined using the following (Equation 17).
また、下記（式１８）を（式１７）に代入して整理すると、（式１９）となる。 Further, when the following (Expression 18) is substituted into (Expression 17) and rearranged, (Expression 19) is obtained.
また、（式１９）をさらに整理すると、（式２０）となる。 Further, when (Equation 19) is further arranged, (Equation 20) is obtained.
従って、Ｃｕ／Ｔｉ金属層の厚さは、（式２０）の３次方程式を解いて正の実根を求めれば得ることができる。このような過程によりＣｕ／Ｔｉ／ＰＤＭＳにおいてＴｉ層とＣｕ層の厚さを決定することができる。 Therefore, the thickness of the Cu / Ti metal layer can be obtained by solving the cubic equation of (Equation 20) to obtain a positive real root. Through such a process, the thicknesses of the Ti layer and the Cu layer can be determined in Cu / Ti / PDMS.
以上、説明の便宜上、ＣｕとＴｉがコーティングされた場合を例にして説明したが、これをフレキシブル基板上に複数の金属薄膜層がコーティングされた一般の場合に適用すると、次のような（式２１）となる。すなわち、フレキシブル基板には第１金属層と第２金属層がコーティングされ、第１金属層の弾性係数と厚さをそれぞれ下付き文字「１」で表し、第２金属層の弾性係数と厚さをそれぞれ下付き文字「２」で表すと、（式２０）は、次の（式２１）のように一般の形式で表される。 For convenience of explanation, the case where Cu and Ti are coated has been described as an example. However, when this is applied to a general case where a plurality of metal thin film layers are coated on a flexible substrate, the following (formula 21). That is, the flexible substrate is coated with the first metal layer and the second metal layer, and the elastic coefficient and thickness of the first metal layer are represented by subscript “1”, respectively. Is expressed by a subscript “2”, (Expression 20) is expressed in a general form as (Expression 21) below.
（式２１）において、下付き文字「１／２」は、第１金属層及び第２金属層全体の厚さ及びシワの間隔を示す。 In (Formula 21), the subscript “1/2” indicates the thickness of the entire first metal layer and the second metal layer and the interval between wrinkles.
本発明による測定方法の有効性を検証するために実施した測定実験では、まずＴｉ単一薄膜において発生したシワの周期を測定し、その結果、図５のように３．８２μｍであった。また、基板のＰＤＭＳの平面歪み弾性係数（式１３）に２．７ＭＰａを、Ｔｉ薄膜の平面歪み弾性係数（式１３）の値に１２９ＧＰａを代入して（式１５）を用いてＴｉの厚さを計算した結果、Ｔｉの厚さは２４ｎｍであった。 In the measurement experiment conducted to verify the effectiveness of the measurement method according to the present invention, the period of wrinkles generated in the Ti single thin film was first measured, and as a result, it was 3.82 μm as shown in FIG. Further, by substituting 2.7 MPa for the plane strain elastic modulus (Equation 13) of the PDMS of the substrate and 129 GPa for the value of the plane strain elastic modulus (Equation 13) of the Ti thin film, the thickness of Ti is calculated using (Equation 15). As a result, the thickness of Ti was 24 nm.
同様の方法で、図６のように、Ｃｕ／Ｔｉ多層金属層において発生したシワの周期は２９．９μｍであり、（式２０）において、Ｃｕの平面歪み弾性係数（式１３）の値に１４７ＧＰａを代入して方程式を解いた結果、Ｃｕ／Ｔｉ金属層の厚さは１７７ｎｍであった。 In the same manner, as shown in FIG. 6, the period of wrinkles generated in the Cu / Ti multilayer metal layer is 29.9 μm. In (Equation 20), the value of the plane strain elastic modulus (Equation 13) of Cu is 147 GPa. As a result of solving the equation by substituting, the thickness of the Cu / Ti metal layer was 177 nm.
このように、シワを利用した多層薄膜の厚さ測定が有効であるか否かを確認するためにステッププロフィルメータ（step profilometer）を利用して実際のＣｕ／Ｔｉ多層膜の厚さを測定して比較した結果、測定されたＣｕ／Ｔｉ金属層の厚さは１７２ｎｍであった。 Thus, in order to confirm whether the measurement of the thickness of the multilayer thin film using wrinkles is effective, the thickness of the actual Cu / Ti multilayer film is measured using a step profilometer. As a result of comparison, the measured thickness of the Cu / Ti metal layer was 172 nm.
また、（式１６）により計算されたＣｕの厚さは１５３ｎｍであり、Ｃｕ／Ｔｉ多層金属層中のＣｕの蒸着条件と同一条件でコーティングした図２のようなＣｕ単一薄膜のシワの周期を測定して得たＣｕの厚さは１４８ｎｍであった。従って、シワを利用した多層薄膜の厚さ測定は非常に正確で有効である。 Further, the Cu thickness calculated by (Equation 16) is 153 nm, and the wrinkle cycle of the Cu single thin film as shown in FIG. 2 coated under the same conditions as the deposition conditions of Cu in the Cu / Ti multilayer metal layer. The thickness of Cu obtained by measuring was 148 nm. Therefore, the measurement of the thickness of the multilayer thin film using wrinkles is very accurate and effective.
Claims (13)
前記金属薄膜層に圧縮応力を加えてシワを生成する第１段階と、
前記シワの周期を測定する第２段階と
を含む
フレキシブル基板の金属層厚さ測定方法。 A measurement method for measuring the thickness of a metal thin film layer coated on one surface of a flexible substrate,
A first step of applying a compressive stress to the metal thin film layer to generate wrinkles;
A second step of measuring the wrinkle period. A method for measuring a metal layer thickness of a flexible substrate.
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 The method for measuring a metal layer thickness of a flexible substrate according to claim 1, wherein the flexible substrate is a polymer having viscoelasticity.
前記フレキシブル基板に金属層をコーティングした後、存在する残留応力を利用してシワを生成する
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 In the first stage,
The method for measuring a thickness of a metal layer on a flexible substrate according to claim 1, wherein after the metal layer is coated on the flexible substrate, wrinkles are generated by utilizing the existing residual stress.
前記フレキシブル基板に引張力を加えた状態で金属層をコーティングする段階と、
前記引張力を除去する段階とを利用して金属層にシワを生成する
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 In the first stage,
Coating the metal layer with a tensile force applied to the flexible substrate;
The method for measuring a thickness of a metal layer on a flexible substrate according to claim 1, wherein wrinkles are generated in the metal layer using the step of removing the tensile force.
前記フレキシブル基板に金属層をコーティングした状態で曲げ応力を加えてシワを生成する
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 In the first stage,
The method for measuring a thickness of a metal layer on a flexible substrate according to claim 1, wherein wrinkles are generated by applying a bending stress in a state where the metal layer is coated on the flexible substrate.
前記フレキシブル基板に金属層をコーティングした状態でいずれか一方向に引張力を加えることにより、引張力が加えられる方向に対する垂直方向に圧縮応力がかかるようにしてシワを生成する
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 In the first stage,
The wrinkles are generated by applying a compressive stress in a direction perpendicular to a direction in which the tensile force is applied by applying a tensile force in any one direction with the metal layer coated on the flexible substrate. Item 2. A method for measuring a metal layer thickness of a flexible substrate according to Item 1.
前記シワの周期の測定は、光学顕微鏡、原子顕微鏡、電子顕微鏡を利用して行われる
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 In the second stage,
The method for measuring a thickness of a metal layer on a flexible substrate according to claim 1, wherein the wrinkle period is measured using an optical microscope, an atomic microscope, or an electron microscope.
ことを特徴とする請求項１に記載のフレキシブル基板の金属層厚さ測定方法。 The metal thin film layer coated on the flexible substrate includes a plurality of layers. The method for measuring a metal layer thickness of a flexible substrate according to claim 1.
ことを特徴とする請求項１〜８のいずれか１項に記載のフレキシブル基板の金属層厚さ測定方法。 The method for measuring a metal layer thickness of a flexible substrate according to any one of claims 1 to 8, wherein the first step and the second step are performed in situ during the manufacturing process of the flexible wiring substrate.
前記金属薄膜層にシワを生成した後、シワの間隔（λ）と金属層の厚さ（ｔｆ）の関係を示す下記式を用いて金属層の厚さを測定する
フレキシブル基板の金属層厚さ測定方法。
（式１）において、以下の（式５）は、フレキシブル基板の弾性計数であり、（式３）は、金属薄膜層の弾性係数である。
After generating wrinkles in the metal thin film layer, the thickness of the metal layer is measured using the following formula showing the relationship between the wrinkle interval (λ) and the thickness of the metal layer (t f ). Measuring method.
In (Expression 1), the following (Expression 5) is an elastic coefficient of the flexible substrate, and (Expression 3) is an elastic coefficient of the metal thin film layer.
ことを特徴とする請求項１０に記載のフレキシブル基板の金属層厚さ測定方法。 The method for measuring a metal layer thickness of a flexible substrate according to claim 10, wherein the wrinkles are generated by applying a compressive stress to the metal thin film layer.
ことを特徴とする請求項１０又は１１に記載のフレキシブル基板の金属層厚さ測定方法。 The thickness measurement of the said metal thin film layer is measured in-situ during the manufacturing process of a flexible wiring board. The metal layer thickness measuring method of the flexible substrate of Claim 10 or 11 characterized by the above-mentioned.
前記第１及び第２金属層に圧縮応力を加えてシワを生成した後、下記式を用いて金属層の厚さを測定する
フレキシブル基板の金属層厚さ測定方法。
（式２）において、以下の（式２２）（式２３）（式２４）は、それぞれ第１金属層、第２金属層、及びフレキシブル基板の弾性計数であり、（式２５）及び（式２６）はそれぞれ第１金属層と第２金属層が重なった部分の全体厚さ及びシワの間隔を示す。
A method for measuring a metal layer thickness of a flexible substrate, wherein compressive stress is applied to the first and second metal layers to generate wrinkles, and then the thickness of the metal layer is measured using the following formula.
In (Expression 2), the following (Expression 22), (Expression 23), and (Expression 24) are the elastic coefficients of the first metal layer, the second metal layer, and the flexible substrate, respectively (Expression 25) and (Expression 26). ) Indicates the overall thickness and the wrinkle spacing of the portion where the first metal layer and the second metal layer overlap each other.
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