JP4976247B2 - Component placement setting device, component placement device, program, and component supply unit arrangement method - Google Patents

Description

  The present invention provides a component mounting apparatus including a component mounting unit that mounts a component on a board, and one or more component supply bases that mount a component supply unit that supplies a component mounted by the component mounting unit. The present invention relates to a technique for specifying the arrangement of the component supply unit on the component supply base when a component is mounted on the substrate.

  In a component mounting device that mounts the sucked component on the board by sucking the component stored in the component supply unit with the mounting head and moving the mounting head to the mounting position on the board, the component to be mounted on the board in advance Must be mounted on a component supply stand (hereinafter referred to as a pallet) of the component mounting apparatus.

  For this reason, when components are mounted on a plurality of types of substrates, it is necessary to mount a component supply unit storing components to be mounted on each substrate on the pallet when switching the substrates to be mounted.

  Accordingly, the time required for component mounting on a plurality of types of substrates (hereinafter referred to as component mounting completion time) is the time required for the component mounting apparatus to mount components on the substrate (hereinafter referred to as component mounting time) and the components are mounted. When the board is switched, it is determined by the sum of the stop time of the component mounting apparatus required for the operation of mounting the component supply unit that stores the components to be mounted on the switched board on the pallet (hereinafter referred to as setup operation).

  In order to reduce the time required to complete component mounting, the conventional technology calculates the placement of component supply units that reduce component mounting time for each board. The circuit board types that require similar parts are collected as much as the component supply unit mounting capacity of the component mounting device allows to create a group (hereinafter referred to as a similar board group), and the circuit boards that belong to the same similar board group "Group setup" technology that uses a common component supply unit layout when mounting components, and components that are commonly mounted on the board before switching and the board after switching when switching boards For the component supply unit that stores the "partial setup" technology, where the same mounting position of the same pallet is set before and after the board switching (for example, non-patent document) See 1).

Jorge Leon.V, and B.A.Peters, A Comparison of Setup Strategies for Printed Circuit Board Assembly, Computers and Industrial Engineering, Vol. 34, No. 1, pp. 219-234, 1998

  However, according to the unique setup method, the component mounting time is short, but when switching the type of board on which the component is mounted, the mounting position of a large number of component supply units must be changed. The required stop time of the component mounting apparatus becomes longer, and as a result, the component mounting completion time may become longer.

  Also, according to the group setup technique, the setup work of the component supply unit required for a plurality of board types in the same similar board group can be reduced, but when switching the similar board group to which the parts are mounted. In the same manner as in the unique setup technique, there is a case where the stop time of the component mounting apparatus required for the setup operation occurs and the component mounting completion time becomes long.

  Furthermore, according to the partial setup technology, the board is loaded so that similar boards (or similar board groups) are continuously put on the basis of the production plan (boards, number of production) assumed when creating the setup plan. By setting the order (or similar board group insertion order), the amount of setup work can be reduced. For example, the board insertion order (or similar board group insertion order) can be received by receiving an express order. ) May need to be modified, a significant setup work may occur, resulting in a longer component installation completion time.

  Furthermore, according to the unique setup, group setup and partial setup, it is necessary to attach / detach the component supply unit every time the board type or similar board group is switched. Installation may occur.

  In view of this, the present invention determines whether or not a production plan for mounting components on a plurality of types of boards can be made by replacing a component supply base on which a component supply unit storing components required by each board is mounted. It is an object of the present invention to provide a technology capable of determining such a production plan.

  In order to solve the above problems, the present invention includes a component mounting unit that mounts a component on a board, and one or more component supply bases that mount a component supply unit that supplies a component mounted by the component mounting unit. Provided is a technology for detecting whether or not a component can be mounted on a plurality of types of substrates by exchanging the component supply table based on physical conditions of the component supply unit and the component supply table. .

For example, the present invention provides a component mounting apparatus comprising: a component mounting unit that mounts a component on a substrate; and one or more component supply bases that mount a component supply unit that supplies a component to be mounted by the component mounting unit. A component mounting setting device for specifying an arrangement of the component supply unit on the component supply base when mounting components on a plurality of types of boards, and for each component mounting device, component supply that can be installed in the component mounting device Component mounting device master data that specifies the number of units and the number of component supply units that can be mounted on a component supply table that can be mounted on the component mounting device, and a substrate that specifies the component to be mounted for each board type A storage unit for storing master data, production plan data for specifying at least the type of board to be produced, and production line data for specifying a component mounting device used for producing a board And an input unit that accepts input of the usable component supply number data that specifies the number of component supplies that can be used when producing the board, and a control unit, and the control unit includes the production plan data The parts to be mounted on all board types specified in (1) are specified from the board master data, and the combination of the parts supply unit on which the parts are mounted and the parts supply stand is specified by the production plan data. The number of component supply bases for mounting the component supply units required when mounting components on one board type is less than the number of component supply bases that can be equipped in the component mounting device specified by the production line data And the number of component supply bases on which component supply units required for mounting components on all board types specified in the production plan data are usable. A condition that the component supply volume data component supply table is less than the number of available identified by, detects whether there is a combination satisfying, when there is the combination by the combination, the board type The arrangement of the component supply unit to the component supply base used for the production of the board is specified, and the board type of the board type to the component mounting apparatus is specified by specifying the component supply base used in common for the production of the board type. It is characterized in that the charging order is calculated .

  As described above, according to the present invention, a production plan for mounting components on a plurality of types of boards can be established by replacing the component supply base on which the component supply unit storing the components required for each board is mounted. Therefore, it is possible to provide a technique that can determine whether or not the production can be performed and make such a production plan.

  FIG. 1 is a schematic view of a component mounting system 100 according to an embodiment of the present invention.

  As shown in the figure, the component mounting system 100 includes a component mounting setting device 110 and a component mounting device 130, and these component mounting setting device 110 and component mounting device 130 receive information via a network 150. You can send and receive. In FIG. 1, three component mounting apparatuses 130 are shown. However, the number is not limited to such a number, and at least one component mounting apparatus 130 may be provided.

  Here, the component mounting system 100 according to the present embodiment uses the component mounting device 130 to perform component processing on the substrate 161 transported by the substrate transport device 160 such as a belt conveyor from an upstream process (a cream solder printing process or the like). 162 is mounted and input to a downstream process (such as a reflow process).

  The component mounting setting device 110 receives input of predetermined information from the operator of the component mounting system 100 and stores it in the storage unit 111. The component mounting setting data generation unit 122 (to be described later) stores a pallet on which the component supply unit is mounted. The component mounting setting data including information specifying the arrangement, the mounting position of the component supply unit on the pallet and the component mounting order is generated and distributed to each component mounting device 130 via the network 150. The component mounting device 130 The component is mounted based on the component mounting setting data received from the mounting setting device 110.

  FIG. 2 is a schematic diagram of the component placement setting device 110.

  As illustrated, the component mounting setting device 110 includes a storage unit 111, a control unit 120, an input unit 123, an output unit 124, and a communication unit 125.

  The storage unit 111 includes a component mounting line master data storage region 112, a component mounting device master data storage region 113, a circuit board master data storage region 114, a component master data storage region 115, a production plan data storage region 116, A component supply unit arrangement data storage area 117, a component mounting setting data storage area 118, and a calculation data storage area 119 are provided.

  The component mounting line master data storage area 112 stores information for specifying the arrangement of the component mounting devices 130 that form a component mounting line.

  For example, in the present embodiment, a component mounting line master table 112a as shown in FIG. 3 (schematic diagram of the component mounting line master table 112a) is stored in the component mounting line master data storage area 112.

  As illustrated, the component line master table 112a includes a device order column 112b, a device type column 112c, and an IP address column 112d.

  The device order column 112b stores information for specifying the arrangement order of the component mounting devices 130 specified in the device type column 112c described later. In the present embodiment, as information for specifying the arrangement order of the component mounting apparatuses 130, each component mounting apparatus in a component mounting line on a substrate 161 transported by a substrate transport apparatus 160 such as a belt conveyor as shown in FIG. The device order is assigned so that the arrangement of 130 is a serial number from upstream to downstream in the component mounting line, and information specifying the device order is stored in this column. It is not necessarily limited to the embodiment.

  The device type column 112c stores identification information (for example, device type) for identifying the device type of each component mounting device 130.

  In the IP address column 112d, information for specifying an address in the network 150 of the component mounting device 130 specified in the device order column 112b and the device type column 112c is stored. In the present embodiment, the IP address allocated to each component mounting apparatus 130 is stored in this column, but the present invention is not limited to this mode.

  Returning to FIG. 2, information for specifying the hardware configuration of the component mounting apparatus 130 is stored in the component mounting apparatus master data storage area 113.

  For example, in this embodiment, a component mounting apparatus master table 113a as shown in FIG. 4 (schematic diagram of the component mounting apparatus master table 113a) is stored.

  As illustrated, the component mounting device master table 113a includes a device type column 113b, a device type column 113c, a mounting head number column 113d, a pallet width column 113e, and a pallet number column 113f.

  In the device type column 113b, identification information for identifying the device type of each component mounting device 130 is stored.

  The device type column 113c stores information for specifying the device type classification of the component mounting device 130 specified in the device type column 113b. Here, in this embodiment, since the device type classification of the component mounting device 130 is assumed to be a gantry type in which pallets can be exchanged in a lump, the character string “gantry” is displayed in this column. Although it is stored, any component mounting apparatus can be used as long as it can exchange pallets in a batch.

  The mounting head number column 113d stores information for specifying the number of mounting heads included in the component mounting device 130 of the device type specified in the device type column 113b.

  The pallet width column 113e stores information for specifying the number of component supply units that can be mounted on each pallet included in the component mounting device 130 of the device type specified in the device type column 113b.

  The pallet number column 113f stores information for specifying the number of pallets that can be mounted on the component mounting device 130 of the device type specified in the device type column 113b.

  Returning to FIG. 2, the circuit board master data storage area 114 stores information for specifying the position and type of a component to be mounted on a board of each board type in the component mounting system 100.

  For example, in the present embodiment, a circuit board master table 114a as shown in FIG. 5 (schematic diagram of the circuit board master table 114a) is stored.

  As illustrated, the circuit board master table 114a includes a board type column 114b, a mounting coordinate column 114c, an angle column 114d, and a component type column 114e.

  The board type column 114b stores identification information (for example, board type) for identifying the board type of the board on which the component specified in the mounting coordinate column 114c, the angle column 114d, and the component type column 114e described later is mounted. The

  In the mounting coordinate column 114c, information for specifying a position on the substrate on which a component of the type specified in the component type column 114e described later is mounted is stored for the type of substrate specified in the substrate type column 114b. . Here, in the present embodiment, as information for specifying the position on the board on which the component is to be mounted, for example, on the coordinates constituted by the X axis and the Y axis with the predetermined position at the lower left of the board as the origin Although the position is specified, it is not limited to such a mode.

  The angle column 114d stores information for specifying an angle for mounting a component of the type specified in the component type column 114e described later with respect to the type of board specified in the substrate type column 114b. Here, in the present embodiment, the mounting angle of the component is specified by setting the horizontal direction (for example, the X-axis direction) to the board as 0 °, but the present invention is not limited to such a mode.

  The component type column 114e stores information (for example, component type) that specifies the component type of the component to be mounted on the type of board specified in the board type column 114b.

  Returning to FIG. 2, the component master data storage area 115 stores information for specifying the configuration of components to be mounted in the component mounting system 100.

  For example, in the present embodiment, a component master table 115a as shown in FIG. 6 (schematic diagram of the component master table 115a) is stored.

  As illustrated, the component master table 115a includes a component type column 115b, a component size column 115c, and a weight column 115d.

  The component type column 115b stores information for specifying the component type.

  The component size column 115c stores information for specifying the size of the component of the type specified in the component type column 115b. In this embodiment, the component size is specified by the component width x, the component depth y, and the component height h as the component size. It is not limited to.

  The weight column 115d stores information for specifying the weight of the type of component specified in the component type column 115b.

  The information stored in the component mounting line master data storage area 112, the component mounting apparatus master data storage area 113, the circuit board master data storage area 114, and the component master data storage area 115 described above is as follows. An operator of the system 100 generates the information in the storage unit 111 in advance through the input unit 123 or by another device and through the communication unit 125.

  Returning to FIG. 2, the production plan data storage area 116 stores information for specifying a production plan for mounting parts in the part mounting system 100. Here, in the present embodiment, information for specifying the type, number and order of each board on which a component is mounted by the component mounting system 100 is stored.

  For example, in the present embodiment, a production plan table 116a as shown in FIG. 7 (schematic diagram of the production plan table 116a) is stored.

  As shown in the figure, the production plan table 116a includes a board type column 116b, a production number column 116c, and a loading order column 116d.

  The board type column 116b stores identification information for identifying the board type on which a component is mounted in the component mounting system 100.

  In the production number column 116c, information for specifying the number of substrates to be produced of the type specified in the substrate type column 116b is stored.

  The input order column 116 stores information specifying the order in which the types of boards specified in the board type column 116b are input to the component mounting system 100.

  In the production plan table 116a, the information stored in the board type column 116b and the production number column 116c is input by the operator of the component mounting setting device 110 via the input unit 123, as will be described later. The column 116d is specified and stored by a component mounting setting data generation unit 122 described later.

  Returning to FIG. 2, the component supply unit arrangement data storage area 117 stores information for specifying the type of component to be mounted on each pallet and the mounting position.

  For example, in the present embodiment, a component supply unit arrangement table 117a as shown in FIG. 8 (schematic diagram of the component supply unit arrangement table 117a) is stored.

  As shown in the figure, the component supply unit arrangement table 117a includes a manufacturable board type specifying region 117b and a pallet component mounting position specifying region 117c.

  In the manufacturable board type specifying area 117b, information for specifying the type of board that can be produced using the pallet specified in the pallet component mounting position specifying area 117c is stored.

  The pallet component mounting position specifying area 117c includes a pallet column 117d, a position column 117e, and a component type column 117f.

  The pallet column 117d stores identification information for identifying each pallet. Here, as identification information for identifying each pallet, in the present embodiment, identification information allocated so as to be unique to each pallet is stored. However, the present invention is limited to such an aspect. Do not mean.

  The position column 117e stores information for specifying a position at which a component supply unit for mounting a component of the type specified by the component type column 117f is mounted on the pallet specified by the pallet column 117d. Here, with regard to the information for specifying the position where the component supply unit is mounted, for example, the mounting position of the component supply unit on the pallet is numbered in ascending order from the end toward the other end of the pallet. It is predetermined so as to be unique.

  The component type column 117f stores information for specifying the type of component mounted on the component supply unit mounted at the position specified by the position column 117e of the pallet specified by the pallet column 117d.

  Returning to FIG. 2, the component mounting setting data storage area 118 stores information for specifying the arrangement of each pallet and the mounting order of components mounted on each pallet on the board.

  For example, in the present embodiment, a component mounting setting table 118a as shown in FIG. 9 (schematic diagram of the component mounting setting table 118a) is stored.

  As illustrated, the component mounting setting table 118a includes a board section 118b, a pallet placement section 118c, and a component mounting order section 118d.

  The board section 118b stores information for specifying the type of board on which a component is mounted based on the component mounting setting table 118a.

  The pallet arrangement section 118c stores information for specifying a pallet that picks up a component with a mounting head included in the component mounting apparatus 130 when mounting the component on the board specified by the board section 118b.

  For example, in the present embodiment, the pallet arrangement section 118c includes a mounting head number column 118e and a pallet column 118f.

  The mounting head number column 118e stores information for specifying each mounting head. For example, in the present embodiment, the mounting head of each component mounting device 130 is specified based on the arrangement stored in the device order column 112b of the component mounting line master table 112a, and the device order is assigned to the specified mounting head. By assigning serial numbers in correspondence with, the assigned serial numbers are used as identification information.

  The pallet column 118f stores identification information for identifying a pallet on which the mounting head specified in the mounting head number column 118e performs suction.

  The component mounting order section 118d stores information for specifying the mounting order of components.

  For example, in the present embodiment, the component mounting order section 118d includes a mounting coordinate column 118g, an angle column 118h, a component supply unit position column 118i, a mounting head number column 118j, and a mounting order column 118k.

  The mounting coordinate column 118g stores information for specifying a position on the board on which a component to be stored in the component supply unit specified in the component supply unit position column 118i described later is mounted. Here, in the present embodiment, the coordinate position corresponding to the mounting coordinate column 114c of the circuit board master table 114a is stored.

  The angle column 118h stores information for specifying an angle for mounting the component stored in the component supply unit specified in the component supply unit position column 118i described later. Here, in the present embodiment, angle information corresponding to the angle column 114d of the circuit board master table 114a is stored.

  The component supply unit position column 118i stores information for specifying the position on the pallet on which the component supply unit for storing the component to be mounted at the position of the board specified by the mounting coordinate column 118g is stored.

  The mounting head number column 118j stores information for identifying a mounting head that picks up components mounted on the component supply unit specified by the component supply unit position column 118i.

  The mounting order column 118k stores information for specifying the order in which the components are mounted on the substrate from the mounting head that sucks the components mounted on the component supply unit specified in the component supply unit position column 118i.

  The data stored in the component mounting setting data storage area 118 is generated and stored in a component mounting setting data generation unit 122 described later.

  Returning to FIG. 2, the calculation data storage area 119 stores information for specifying parameters and the like necessary for calculation by the component placement setting device 110, information input via the input unit 123, and the like.

  Returning to FIG. 2, the control unit 120 includes an overall control unit 121 and a component mounting setting data generation unit 122.

  The overall control unit 121 controls overall processing in the component placement setting device 110.

  The component mounting setting data generation unit 122 produces a plurality of board types input via the input unit 123 based on the data input via the input unit 123 and the data stored in the storage unit 111. When changing the board type, it is determined whether or not a production plan for production can be made by exchanging pallets. If such a production plan can be made, the loading order column 116d in the production plan table 116a is determined. The information for specifying the loading order of the boards to be stored, the information stored in the component supply unit table 117a, and the information stored in the component mounting setting table 118a are calculated and stored in the storage unit 111. Specific processing in the component mounting setting data generation unit 122 will be described using a PAD (Problem Analysis Diagram) described later.

  The input unit 123 receives input of information from the operator of the component mounting setting device 110.

  The output unit 124 outputs information in a predetermined format.

  The communication unit 125 transmits and receives information via the network 150.

  The component mounting setting device 110 described above is an external storage such as a CPU (Central Processing Unit) 171, a memory 172, and an HDD (Hard Disk Drive) as shown in FIG. 10 (schematic diagram of the computer 170). A device 173, a reader 175 for reading information from a portable storage medium 174 such as a CD-ROM (Compact Disk Read Only Memory) or a DVD-ROM (Digital Versatile Disk Read Only Memory), and an input such as a keyboard or a mouse This can be realized by a general computer 170 including a device 176, an output device 177 such as a display, and a communication device 178 such as a NIC (Network Interface Card) for connecting to a communication network.

  For example, the storage unit 111 can be realized by the CPU 171 using the memory 172 or the external storage device 173, and the control unit 120 loads a predetermined program stored in the external storage device 173 into the memory 172. The input unit 123 can be realized by the CPU 171 using the input device 176, and the communication unit 125 can be realized by the CPU 171 using the communication device 178. The output unit 124 can be realized by the CPU 171 using the output device 177.

  The predetermined program is downloaded from the storage medium 174 via the reading device 175 or from the network via the communication device 178 to the external storage device 173, and then loaded onto the memory 172 and executed by the CPU 171. You may do it. Alternatively, the program may be directly loaded on the memory 172 from the storage medium 174 via the reading device 175 or from the network via the communication device 178 and executed by the CPU 171.

  FIG. 11 is a schematic diagram of the component mounting apparatus 130.

  As illustrated, the component mounting apparatus 130 includes a storage unit 131, a control unit 135, a component mounting unit 138, a pallet 139, and a communication unit 140.

  The storage unit 131 includes a parts master data storage area 132, a production plan data storage area 133, and a parts mounting setting data storage area 134.

  The component master data storage area 132 stores information for specifying the configuration of components to be mounted in the component mounting system 100.

  Here, in the present embodiment, a component master table 115a as shown in FIG. 6 is stored.

  The component master table 115a is received from the component mounting setting device 110 via the network 150 and stored in this area. However, the present invention is not limited to this mode, and the portability is not limited. It may be read into the component mounting apparatus 130 via a storage medium or the like and stored in this area, or may be input by an operator via an input unit (not shown).

  The production plan data storage area 133 stores information for specifying a production plan for mounting parts by the part mounting system 100. Here, in the present embodiment, information for specifying the number and order of each board on which a component is mounted by the component mounting system 100 is stored.

  Here, in the present embodiment, a production plan table 116a as shown in FIG. 7 is stored. The production plan table 116a is also received from the component placement setting device 110 via the network 150 and stored in this area. However, the production plan table 116a is not limited to this mode, and is portable. It may be read into the component mounting apparatus 130 via a storage medium or the like and stored in this area.

  The component mounting setting data storage area 134 stores information for specifying the arrangement of each pallet and the mounting order of components mounted on each pallet on the board for each board type.

  Here, in the present embodiment, a component mounting setting table 118a as shown in FIG. 9 is stored. The component mounting setting table 118a is also received from the component mounting setting device 110 via the network 150 and stored in this area. However, the present invention is not limited to this mode. It may be read into the component mounting apparatus 130 via a portable storage medium or the like and stored in the storage unit 131, or may be input by an operator via an input unit (not shown).

  The control unit 135 includes an overall control unit 136 and a component mounting processing unit 137.

  The overall control unit 136 controls the overall processing in the component mounting apparatus 130.

  The component mounting processing unit 137 controls a component mounting unit 138 and a pallet 139, which will be described later, based on data stored in the storage unit 131, and is transported by the substrate transport device 160 such as a belt conveyor shown in FIG. The process of mounting components on the coming board 161 is controlled.

  The component mounting unit 138 sucks components from the component supply unit mounted on the pallet and mounts the components on the board.

  The pallet 139 controls the mounted component supply unit to supply components to the component suction position of the component mounting unit 138.

  The component mounting part 138 and the pallet 139 described above can be realized by an apparatus as shown in FIG. 12, for example.

  FIG. 12 is a plan view of the gantry-type component mounting device 180.

  As shown in the figure, the gantry type component mounting apparatus 180 includes at least one pallet 182 on which a plurality of component supply units 181 are mounted, at least one mounting head 184 moved by an XY robot 183, and a substrate 161. And a table 185 to be placed.

  In such a gantry type component mounting apparatus 180, the mounting head 184 is moved to the position of the component supply unit 181 storing a desired component by the XY robot 183, sucks the supplied component, and the substrate 161 by the XY robot 183. It is moved to the desired coordinates above, and is mounted on the substrate 161 by releasing the held components.

  That is, in the gantry type component mounting apparatus 180, the component mounting unit 138 includes the XY robot 183 and the mounting head 184.

  In such a gantry-type component mounting apparatus 180, when a component is mounted on a plurality of excellent boards, if the necessary component can be replaced by replacing the pallet 182, the time required for the setup work can be reduced. can do.

  Returning to FIG. 11, the communication unit 140 transmits and receives information via the network 150.

  In the component mounting apparatus 130 described above, for example, the control unit 135 can be realized by executing a predetermined program by the CPU, and the storage unit 131 can be configured such that the CPU is an auxiliary storage device such as a hard disk or a memory. The communication unit 140 can be realized by using a main storage device, and the communication unit 140 can be realized by the CPU using a communication device such as a NIC.

  FIG. 13 is a PAD showing a component mounting setting process performed by the component mounting setting data generation unit 122 of the component mounting setting apparatus 110 configured as described above.

  PAD is described in detail in Yoshihiko Fumimura, “Basic Course of Information Engineering 4 Programmed Structured Programming by PAD”, Ohmsha, 1984.

  The component mounting setting process includes a component supply unit arrangement setting process (S10) and a pallet arrangement setting process (S11).

  The component supply unit arrangement setting process in step S10 is a process of calculating and setting a pallet on which a component supply unit is arranged and a mounting position on the pallet for each board to be produced. Details of this process will be described with reference to FIG.

  The pallet arrangement setting process in step S11 is a process of calculating the board insertion order, the pallet arrangement at the time of component installation on each board type, and the component installation order. Details of this process will be described with reference to FIG.

  FIG. 14 is a PAD showing a component supply unit arrangement setting process executed by the component mounting setting data generation unit 112 of the component mounting setting apparatus 110.

  First, the component mounting setting data generation unit 112 of the component mounting setting device 110 receives an input of conditions for performing the component supply unit arrangement setting from the operator of the component mounting setting device 110 via the input unit 123 (S20). .

  For example, the component mounting setting data generation unit 112 outputs a component supply unit arrangement setting condition input screen 190 as shown in FIG. 15 (schematic diagram of the component supply unit arrangement setting condition input screen 190) to the output unit 124 for input. An input of necessary conditions is received from the operator of the component mounting setting device 110 via the unit 123.

  As shown in the drawing, the parts supply unit arrangement setting condition input screen 190 includes a production plan data input field 190a, a production line data input field 190b, an owned pallet number input field 190c, an identical component mountable number input field 190d, Is provided.

  In the production plan data input field 190a, input of information for specifying the type of board to be produced and information for specifying the number of produced boards of the type are accepted.

  In the production line data input field 190b, input of information for specifying line configuration data of a component mounting line for producing a board is accepted. Here, the input of the device order of the component mounting device 130 in the component mounting line, the device type of the component mounting device 130 arranged in the order, and the IP address of the component mounting device 130 arranged in the order is accepted.

  In the owned pallet number input column 190c, input of information specifying the number of pallets used in the component mounting line for producing the board is accepted.

  In the same component mountable number input column 190d, an input of the number of component supply units for each type of component that can be mounted in the component mounting line is received. Note that the same component mountable number is set to the same value for each component. For example, the number of mountable component supply units may be input for each component. .

  In the present embodiment, input of necessary conditions is received from the operator of the component mounting setting device 110 via the input unit 123. However, the present invention is not limited to such an aspect. A file in which necessary conditions are input by the operator of the mounting setting device 110 may be created, and the necessary conditions may be read from the file in step S20.

  Returning to FIG. 14, the component mounting setting data generation unit 112 then converts the information input in step S <b> 20 into the component mounting line master data storage area 112, the production plan data storage area 116, and the calculation data storage area 119, (S21).

  Specifically, in the component supply unit arrangement setting condition input screen 190, the information input via the production plan data input field 190a is stored in the production plan table 116a and input via the production line data input field 190b. Information is stored in the component mounting line master table 112a, and information input via the owned pallet number input column 190c and the same component mountable number input column 190d is stored in the calculation data storage area 119.

  Returning to FIG. 14, next, the component mounting setting data generation unit 112 calculates a component supply unit arrangement by executing steps S <b> 23 and S <b> 24 described later. The component supply unit arrangement calculated here is a process of specifying a pallet on which the component supply unit is mounted and a mounting position of the component supply unit on the pallet for each type of board.

  In step S23, the component mounting setting data generation unit 112 calculates component supply unit allocation for specifying a pallet on which the component supply unit is mounted for each type of board (S23). The component supply unit allocation calculation process will be described in detail using the PAD shown in FIG.

  In step S24, the mounting position of the component supply unit in each pallet is calculated based on the component supply unit allocation calculated in step S23.

  Since the procedure for calculating the mounting position of a component supply unit using a given component supply unit as an input for a pallet to be mounted is known (for example, Non-Patent Document 2, Non-Patent Document 3, Non-Patent Document below) 4, Non-Patent Document 5), detailed description is omitted, but in this embodiment, the calculation is performed by using a local search method using a 2-opt neighborhood.

Non-Patent Document 2: Jouni Smed, Mika Johnsson, Tommi Johtela, and Olli Nevalainen, Techniques and Applications of Production Planning in Electronics Manufacturing Systems, TUCS Technical Report, No 320, ISBN 952-12-0577-6, 1999
Non-Patent Document 3: Kimberly P. Ellis, Fernando J. Vittes, and John E. Kobza, Optimizing the Performance of a Surface Mount Placement Machine, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 160- 169, 2001
Non-Patent Document 4: Wonsik LEE, Sunghan LEE, Beomhee LEE, and Youngdae LEE, A Genetic Optimization Approach to Operation of a Multi-head Surface Mounting Machine, IEICE Transactions Fundamentals, Vol. E83-A, No. 9, pp. 1748 -1756, 2000
Non-Patent Document 5: Dong-Seok Sun, Tae-Eog Lee, Kyung-Hoon Kim, Component allocation and feeder arrangement for a dual-gantry multi-head surface mounting placement tool, Int. J. Production Economics 95, pp. 245- 264, 2005
Next, the component mounting setting data generation unit 112 stores the component supply unit arrangement calculated in step S22 in the component supply unit arrangement data storage area 117.

  Specifically, the information specifying the board type input via the production plan data input field 190a in step S20 is stored in the production possible board type specifying area 117b of the component supply unit arrangement table 117a.

  Further, the information for specifying the pallet for mounting the component supply unit calculated in step S22 and the mounting position of the component supply unit on the pallet is stored in the pallet component mounting position specifying region 117c of the component supply unit arrangement table 117a. To do.

  In addition, about the information memorize | stored in the component supply unit arrangement | positioning table 117a stored in step S22, the component mounting setting data generation part 122 receives the instruction | indication via the input part 123 from the operator of the component mounting setting apparatus 110, and the component mounting setting data generation part 122 receives. It is possible to change to a predetermined display format and output to the output unit 124.

  For example, the component mounting setting data generation unit 122 generates and outputs a component supply unit arrangement confirmation screen 191 as shown in FIG. 16 (schematic diagram of the component supply unit arrangement confirmation screen 191), thereby outputting the component mounting setting device. The operator 110 can easily confirm the position of the component supply unit mounted on each pallet.

  FIG. 17 is a PAD showing the component supply unit allocation calculation process in step S23 of FIG.

  Here, an example is shown in which the allocation of component supply units is calculated based on mathematical programming. That is, the component supply unit allocation is expressed by a variable group, a condition that the variable group should satisfy (a condition that the component supply unit allocation should satisfy, hereinafter, a constraint condition), and a desirable property of the variable group (a desirable component supply unit allocation) (E.g., the objective function) such as a component mounting time estimate value is small, the number of pallets used, the number of component supply units mounted is small, and so on, is expressed by a mathematical formula including the variable group, and the constraint condition is satisfied. The value of the variable group that minimizes (or maximizes) the objective function value is calculated by a mathematical procedure.

  And in this embodiment, in order to enable production of a plurality of substrates by exchanging pallets, it is necessary to satisfy the following conditions (a) to (c).

  (A) The number of component supply units storing each component type mounted on any pallet is one or more below the value specified by the user in advance (input in step S20 in FIG. 14). For example, when the number of owned component supply units (storage form in which components are attached to a tape) is limited, for example, from the viewpoint of inventory management, the user wants to limit the number of component supply units to be used. In some cases, the upper limit of the number of component supply units that store each component type may be one per component type.

  (B) The number of pallets on which the component supply unit is mounted is equal to or less than the value specified in advance by the user (input in step S20 in FIG. 14). For example, the number is limited to the number of pallets owned.

  (C) The number of pallets on which a component supply unit used for component mounting on each board type is mounted is the maximum number of pallets that can be simultaneously mounted on the component mounting device constituting the production line (in the component mounting device master table 113a). Specific)

  For this reason, first, the component mounting setting data generation unit 122 specifies the value of the constant group shown in FIG. 18 (description of the constant group and the variable group) from the information stored in the storage unit 111, and the mathematical programming model Is constructed (S30).

  Here, in the constant group shown in FIG. 18, r is the component type identification information, i is the board type identification information, and a predetermined approximate value may be used for UMT.

  Next, the component mounting setting data generation unit 122 uses the mathematical programming model constructed in step S30 to combine the pallet satisfying the constraint conditions shown in the following equations (1) to (6) and the component supply unit. Is specified for each substrate type (S31). As for this specifying method, it may be determined whether or not the constraint conditions shown in the equations (1) to (6) are satisfied in all combinations of the pallet and the component supply unit. Solve using the branch and bound method. In addition, since the branch and bound method is well-known (for example, nonpatent literature 8), detailed description is abbreviate | omitted.

  Non-Patent Document 8: Hiroshi Konno, Hisashi Suzuki, edited by integer programming and combinatorial optimization, ISBN 4817153075, Nikka Giren

  However, the variables in the equations (1) to (6) are as shown in the variable group shown in FIG. In the variable group shown in FIG. 18, p is pallet identification information.

  Here, the expression (1) requires that the number of each component supply unit mounted on the pallet to be used is equal to or less than the usable number.

  Expression (2) requires that the number of component supply units mounted on each pallet is equal to or less than the pallet width.

  The expression (3) requires that a component supply unit necessary for the board type i is mounted on any pallet to be used.

  Equation (4) requires that the number of pallets used for component mounting on the board type i is equal to or less than the number of mounting heads.

  The expression (5) requires that the component supply unit r be mounted on the pallet p if the component supply unit r mounted on the pallet p is used for the board type i.

  The expression (6) requires that the pallet p is a pallet used for component mounting on the board type i if the board type i uses the component supply unit r mounted on the pallet p. It is.

  If a combination of a pallet and a component supply unit that satisfies the constraint conditions shown in the equations (1) to (6) is not found, it is determined that there is no feasible solution, and there is one solution that satisfies these constraint conditions. If there is only one, the solution is the optimum solution. If there are a plurality of these constraint conditions, the solution having the minimum value in the objective function shown in the following equation (7) is taken as the optimum solution.

  Here, the first term of the equation (7) represents an approximate value of the component mounting time, the second term represents the number of pallets used (the number of pallets on which the component supply unit is mounted), and the third term The term represents the number of component supply units used (the number of component supply units mounted on the pallet). That is, by minimizing the value of the objective function shown in the equation (7), it is possible to obtain a component supply unit allocation in which the approximate component mounting time is small, the number of pallets used is small, the number of component supply units used is small. .

  Here, the constraint conditions for satisfying the objective function of the equation (7) are expressed by the following equations (8) and (9).

  Equation (8) requires that if the pallet p is used for component mounting on the board type i, the pallet p is used for component mounting on any board type.

  Equation (9) is a formula for calculating the component mounting time approximate value MTi for the board type i.

  Next, the component mounting setting data generation unit 122 determines whether or not an executable solution has been calculated in step S31 (S32). If there is no executable solution, an error message (given conditions given) is output to the output unit 124. Is displayed (S33), and the component placement setting process is terminated (S34).

  With the above processing, the component mounting setting data generation unit 122 identifies the component supply unit (component type) mounted on each pallet for each board type based on the definition of the executable solution (S35).

  FIG. 19 is a PAD showing a pallet arrangement setting process executed by the component mounting setting data generation unit 112 of the component mounting setting device 110.

  First, the component mounting setting data generation unit 112 receives an input of conditions for performing pallet arrangement setting from the operator of the component mounting setting device 110 via the input unit 123 (S40).

  For example, the component placement setting data generation unit 112 displays a pallet placement setting condition input screen 192 as shown in FIG. 20 (schematic diagram of the pallet placement setting condition input screen 192) on the output unit 124. Thus, an input of necessary conditions is received from the operator of the component mounting setting device 110.

  As shown in the figure, the pallet arrangement setting condition input screen 192 includes a confirmed production plan data input field 192a. In the confirmed production plan data input field 192a, information for specifying the type of board to be produced, and the type The input of the information specifying the number of produced boards is accepted.

  Here, the board type to be input to the final production plan data entry field 192a is specified in the production possible board type specifying area 117b of the component supply unit arrangement table 117a stored in the part supply unit arrangement data storage area 117. It must be a substrate type that can be produced. For this reason, in the present embodiment, the board type to be input to the final production plan data input field 192a can be selected in a pull-down manner from the board type specified in the production possible board type specifying area 117b. Yes. Note that the present invention is not limited to such an embodiment. For example, when a board other than the board type specified in the manufacturable board type specifying area 117b is input, the input is inappropriate by changing the character color or the like. May be notified.

  In the present embodiment, input of necessary conditions is received from the operator of the component mounting setting device 110 via the input unit 123. However, the present invention is not limited to such an aspect. A file in which necessary conditions are input by the operator of the mounting setting device 110 may be created, and the necessary conditions may be read from the file in step S40.

  Returning to FIG. 19, the component mounting setting data generation unit 112 stores the information input in step S40 in the production plan data storage area 116 (S41). That is, the information input in step S40 is stored in the board type column 116b and the production number column 116c of the production plan table 116a.

  Then, the component placement setting data generation unit 112 acquires the production plan table 116a stored in step S41 from the production plan data storage area 116, and calculates the board loading order that is considered to have a small number of pallet replacements (S42). . Details of the calculation process of the substrate loading order will be described later.

  Then, the component mounting setting data generation unit 112 stores the board insertion order calculated in step S42 in the production plan data storage area 116 (S43). That is, it is stored in the input order column 116d of the production plan table 116a.

  Next, the component mounting setting data generation unit 112 acquires the production plan table 116a in which the board loading order is stored in step S43 from the production plan data storage area 116, and the pallet with a small number of pallet replacements in the loading order. Arrangement is calculated (S44). The details of the pallet arrangement calculation process will be described later.

  Then, the component mounting setting data generation unit 112 stores the pallet layout calculated in step S44 in the pallet layout section 118c of the component mounting setting table 118a stored in the component mounting setting data storage area 118 (S45).

  Next, the component mounting setting data generation unit 112 calculates the component mounting order for each board type based on the pallet layout stored in the pallet layout section 118c of the component mounting setting table 118a in step S45 (S46). Note that the procedure for calculating the component mounting order under the given component supply unit arrangement is a known technique (for example, Non-Patent Document 2, Non-Patent Document 3, and Non-Patent Document 4), and detailed description thereof is omitted. However, in the present embodiment, the example using the local search method using the 2-opt neighborhood is the best.

  Then, the component mounting setting data generation unit 112 stores the component mounting order calculated in step S46 in the component mounting order section 118d of the component mounting setting table 118a stored in the component mounting setting data storage area 118 (S47). .

  The operator of the component mounting setting device 110 inputs an instruction to confirm the board loading order, the component supply unit arrangement, and the component mounting order via the input unit 123, whereby the component mounting setting device 110. The part mounting setting data generation unit of FIG. 22 can obtain from the production plan table 116a and the part mounting setting table 118a, for example, the setup plan confirmation screen 193 shown in FIG. 21 (schematic diagram of the setup plan confirmation screen 193) or FIG. By outputting the setup plan confirmation screen 194 for each device shown in the schematic diagram of the setup plan confirmation screen 194 for each device from the output unit 124, the operator of the component placement setting device 110 can easily perform the setup plan. Can be confirmed. Then, the operator of the component mounting setting device 110 can mount the component on the board by attaching a pallet to each mounting head and putting the board into the component mounting line based on the setup plan.

  FIG. 23 is a PAD showing the substrate loading order calculation process in step S42 in FIG.

  First, the component mounting setting data generation unit 112 of the component mounting setting device 110 calculates a similarity matrix (similarity matrix) between the board types (S50). Here, for example, as shown in FIG. 24 (schematic diagram of the similarity matrix), the similarity matrix is the number of pallets commonly used for all board type pairs excluding pairs of the same board type ( (Similarity) is calculated. If the board types are input in descending order of the sum of the similarities (following the board input order from the top and taking the sum of the similarities), the number of pallet exchanges when switching the component mounting target board type is increased. It can be expected that this is the order of loading a small number of substrates.

  Next, the component placement setting data generation unit 112 sets an initial solution for the board loading sequence (S51). The initial solution for the substrate loading sequence can be determined by, for example, arranging the substrate types at random.

  Next, the component mounting setting data generation unit 112 calculates the sum of the similarities in the board loading order specified in step S51 (follows the board loading order from the top and takes the sum of the similarities), and creates a temporary variable. S is stored in the calculation data storage area 119 of the storage unit 111 as S (S52).

  Next, the component mounting setting data generation unit 112 repeatedly executes steps S54 to S57 described later while the similarity sum S is updated.

  In step S54, the component mounting setting data generation unit 112 executes steps S55 to S57 described later for all board type pairs (hereinafter referred to as board type pairs [A, B]).

  In step S55, the component mounting setting data generation unit 112 calculates the sum of the similarities of the board loading order when the board order A and board type B in the board type pair [A, B] are exchanged. The calculated value is stored in the calculation data storage area 119 of the storage unit 111 as a temporary variable S ′ (S55).

  In step S56, the component mounting setting data generation unit 112 compares the sum S of the similarities in the board loading order with the total sum S ′ of the similarities in the board loading order calculated in step S55, and S ′ is greater than S. If larger, the process proceeds to step S57.

  In step S57, the component mounting setting data generation unit 112 replaces the sum S of similarities with S ′ (S ← S ′), exchanges the order of circuit board types A and B, and updates the board insertion order ( S57).

  Through steps S53 to S57 described above, the substrate loading order is updated in the direction in which the sum of the similarities increases (the direction in which the number of pallet replacements is expected to be small) from the initial solution in the substrate loading sequence calculated in step S51. It will follow.

  FIG. 25 is a PAD showing the pallet arrangement calculation process in step S44 in FIG.

  First, the component mounting setting data generation unit 112 specifies board types in order from the top of the board loading order calculated in step S42 of FIG. 19 (referred to as the i-th board type or board type i), and each board type. On the other hand, by repeating the following steps S61 to S70, a pallet arrangement with a small number of pallet replacements is calculated (S60).

  In step S61, the component mounting setting data generation unit 112 determines whether the board type i identified in step S60 is the first board type (i = 1) in the board loading sequence calculated in step S42 of FIG. If it is not the first input substrate, the process proceeds to step S62.

  In step S62, the component mounting setting data generation unit 112 mounts the component on the board type i identified in step S60 and mounts the component on the board type (i-1) input immediately before the board type i. In addition, when there is a pallet that is used in common, the arrangement of the pallet that is used in common is set to be the same as the arrangement in the substrate type (i-1) even in the case of the substrate type i.

  By this processing, the number of pallet exchanges required when switching the board type (i-1) to the board type i for component mounting can be reduced.

  In step S63, the component mounting setting data generation unit 112 performs step for each of the pallets that are not specified in step S62 among the pallets used for component mounting on the board type i (hereinafter referred to as pallet p). The arrangement of the palette p is set by performing the processing from S64 to S70.

  In step S64, the component placement setting data generation unit 112 initializes the best placement head h_best (for example, h_best = −1).

  In step S65, the component mounting setting data generation unit 112 initializes a best evaluation value e_best when the pallet p is mounted on the component mounting apparatus 130 as a pallet used by the mounting head h_best (for example, e_best = ∞, where ∞ is a sufficiently large value. For example, it is desirable to set the maximum value that can be handled by the component mounting setting data generation unit 112).

  In step S66, the component mounting setting data generation unit 112 executes steps S67 to S69 for each of all mounting heads included in the production line (hereinafter referred to as a mounting head with head number h or mounting head h). .

  In step S <b> 67, the component mounting setting data generation unit 112 calculates the increment of the component mounting time approximate value when the pallet p is mounted as a pallet used by the mounting head h as the evaluation value est.

  In addition, about a component mounting time approximate value, since it is sufficient to use a known method, such as the method described in Non-Patent Document 5 and Non-Patent Document 6, for example, detailed description is omitted. Information necessary for calculating the mounting time for mounting a component on the storage unit 111, for example, the operating speed and operating acceleration of an actuator (such as a mounting head) required for calculating the required operating time of each part of the device is specified. Information (for example, the moving speed of the mounting head) is stored.

  Then, for example, the total of the component mounting time = the movement time of the mounting head is calculated.

  The moving time of the mounting head = the moving distance of the mounting head / the moving speed of the mounting head.

Non-Patent Document 6: Tero Laakso, Mika Johnsson, Tommi Johtela, Jouni Smed, and Olli Nevalainen, Estimating the Production Times in PCB Assembly, TUCS Technical Report, No 392, ISBN 952-12-0783-3, 2001
In step S68, the component placement setting data generation unit 112 compares the evaluation value est calculated in step S67 with the best evaluation value e_best. If the evaluation value est is smaller than the best evaluation value e_best, step S69 is performed. The best evaluation value e_best is replaced with the evaluation value est, and the best arrangement head h_best is replaced with identification information for identifying the mounting head h.

  Through the processing steps S66 to S69 described above, the best placement destination h_best of the pallet p is obtained.

  In step S70, the component placement setting data generation unit 112 sets the placement position of the pallet p so that it is attached to the placement position of the pallet used by the placement head identified by the best placement head h_best.

  FIG. 26 is a PAD showing another example of the component supply unit allocation calculation process in step S23 of FIG.

  Here, an example of calculating the component supply allocation based on the heuristic method (heuristic method) is shown.

  In the example based on the heuristic method described below, first, a set of board types that use one component supply unit is specified for each component supply unit, and a group of component supply units (hereinafter, component supply unit) in which the set is equal. Create a unit group. Next, an arrangement of component supply units for mounting the component supply unit groups on different pallets is set as an initial solution. In general, the placement of the component supply unit in such an initial solution violates the constraint condition, and hence the amount of violation of the constraint condition (for example, the number of pallets required for component mounting on the board of each circuit board type) The component supply unit groups are merged to generate a component supply unit arrangement that satisfies all the constraints so that the excess of the maximum number of pallets that can be mounted simultaneously on the component mounting device that constitutes the production line is reduced. To do. Finally, the component supply unit arrangement is improved so that the component mounting time is shortened as long as the constraint conditions are not violated.

  The processing procedure described above will be described in detail with reference to the drawings.

  First, the component mounting setting data generation unit 112 calculates executable component supply unit allocation by executing steps S81 to S96 described later (S80).

  In step S <b> 81, the component mounting setting data generation unit 112 aggregates a set of board types that need to mount components stored in each component supply unit for each component supply unit.

  In step S82, a group of component supply units in which the set of board types counted in step S81 is equal is created, and an arrangement in which the group is mounted on one pallet is set as the component supply unit group initial solution. However, if the number of component supply units belonging to the group exceeds the pallet width, the group is divided so that as many groups as possible can be created with the number of component supply units belonging to the group equal to the pallet width. To do.

  In the following steps, the component supply unit group initial solution is merged, so that the constraint conditions (for example, the number of pallets required for component mounting on each circuit board type substrate is the component mounting device constituting the production line. Parts that do not exceed the maximum number of pallets that can be mounted simultaneously, and that the number of parts supply units that store each part type is less than or equal to the value specified by the user in advance, etc.) A set of supply unit groups is calculated.

  In step S83, the component mounting setting data generation unit 112 repeatedly executes steps S84 to S96 while the component supply unit group is updated in steps S91 and S96.

  In step S84, the component mounting setting data generation unit 112 has a pallet on which the number of component supply unit groups necessary for component mounting can be simultaneously mounted on the component mounting devices constituting the production line based on the current component supply unit group. The board types that exceed the maximum number are identified, and the identified board types are rearranged in descending order of the number of component supply unit groups necessary for component mounting. Here, when the number of component supply unit groups required for component mounting is equal, the components are rearranged in descending order of the number of component supply units required for component mounting.

  In step S85, the component mounting setting data generation unit 112 executes steps S86 to S96 described later in order from the top of the board types rearranged in step S84.

In step S86, the component mounting setting data generation unit 112 executes steps S87 and S88, which will be described later, for all component supply unit group pairs (g ₁ , g ₂ ) that satisfy the merge conditions described later. Here, the merging condition, use the substrate of the set type component feeder unit group g ₁ is that it includes a set of use board type of the component supply unit group g _2.

In step S87, the component placement setting data generation unit 112 calculates the number of the component supply unit at the time of merging the component supply unit group g ₁ and g _2. If the number of component supply units is equal to or less than the pallet width, the component supply unit group pair (g ₁ , g ₂ ) can be merged.

In step S88, the component placement setting data generation unit 112 increases the number of fill-ins when the component supply unit group pair (g ₁ , g ₂ ) is merged (the component supply unit is used in each component supply unit). The total number of times that the component supply unit is mounted on the pallet used for mounting the component of the board type is calculated. In the following steps, each pallet is used efficiently by merging the component supply unit groups so that the increase in the number of fill-ins is small.

  In step S89, the component mounting setting data generation unit 112 determines whether there is a pair of component supply unit groups that can be merged, and if true, executes steps S90 to S92 described later, and if false, Executes steps S93 to S96 described later.

In step S90, the component mounting setting data generation unit 112 selects the pair (g ₁ , g ₂ ) with the smallest increase in the number of fill-ins from the pair of component supply unit groups that can be merged. If an increase in fill-in number is equal to, for example, using a substrate the number of kinds of component supply unit group g ₂ is small, the number of component supply units included in the group after merging is small, compared to the order.

In step S91, the component mounting setting data generation unit 112 merges the component supply unit group pair (g ₁ , g ₂ ) selected in step S90. This merging process, in use the substrate type of a component supply unit group g _2, so that the number of used pallets is reduced by one.

  In step S92, the component mounting setting data generation unit 112 rearranges the board types again by the same processing as in step S84.

  Next, in step S93 to S96, the component mounting setting data generation unit 112 performs a process of dividing any of the component supply unit groups and partially merging them.

  First, in step S93, the component mounting setting data generation unit 112 selects a component supply unit group to be divided. In the present embodiment, the component supply unit group necessary for component mounting on the substrate of the substrate type specified in step S85, and the substrate of the substrate type included in the group and specified in step S85. It is assumed that a component supply unit group having a small number of component supply units (hereinafter referred to as “insertion target component supply units”) required for component mounting on the device is selected.

  Next, in step S94, the component mounting setting data generation unit 112 specifies one insertion target component supply unit r for each of the insertion target component supply units, and executes steps S95 and S96 described later.

  In step S95, the component mounting setting data generation unit 112 selects a component supply unit group into which the insertion target component supply unit r is inserted (hereinafter referred to as an insertion destination component supply unit group). In the present embodiment, the set of board types on which components are mounted in the component supply unit group includes a set of board types on which components are mounted in the component supply unit r, and the components are inserted even if the component supply unit r is inserted. Other parts under the condition that the number of component supply units included in the supply unit group does not exceed the pallet width or the number of pallets used for each board type is not increased among the component supply units belonging to the component supply unit group A component supply unit group in which a movable component supply unit exists in the supply unit group is selected.

  In step S96, the component mounting setting data generation unit 112 inserts the component supply unit r into the insertion destination component supply unit group specified in step S95 (as described above, the number of component supply units included in the group is the pallet width). If the number exceeds P, the component supply unit is moved to another component supply unit group under the condition that the number of pallets used for each board type is not increased.

  Next, in step S97, the component mounting setting data generation unit 112 checks the pallets used for mounting components on the board of each board type, and the number of used pallets can be simultaneously attached to the component mounting apparatus constituting the production line. It is determined whether there is a board type exceeding the maximum value of the number of pallets (hereinafter referred to as an excess board type). If true, step S98 described later is executed.

  In step S98, the component mounting setting data generation unit 112 selects a component supply unit group with a small number of component supply units used for the excess board type from among the component supply unit groups used for each excess board type. Then, by mounting two or more component supply units belonging to the selected component supply unit group, the excess of the number of used pallets is solved.

  Specifically, the component supply unit belonging to the selected component supply unit group has the largest number of board types commonly used (in the same case, the increase in the number of fill-ins is small). Add and assign part supply units. In any component supply unit, if the number of mounted parts exceeds the value designated by the operator in advance, step S98 is terminated.

  In step S99, the component mounting setting data generation unit 112 determines whether the component supply unit allocation executable in step S80 could not be calculated. If true, the component mounting setting data generation unit 112 receives the component via the output unit 124. An error message (a solution that satisfies the given condition was not found) is output to the operator of the mounting element setting device 110 (S100), and the component supply unit allocation calculation process is terminated (step S101).

  Here, the component supply unit allocation calculated as in the PAD shown in FIG. 26 can be improved as in the PAD shown in FIG. 27 (PAD indicating the component supply unit allocation improvement process), for example.

  First, the component mounting setting data generation unit 112 improves the component supply unit allocation so that the component mounting time approximate value is shortened by the process defined in steps S110 to S114.

  In step S110, the component mounting setting data generation unit 112 executes steps S112 to S114 described later while the component supply unit allocation is updated in step S111 described later.

In step S111, the component mounting setting data generation unit 112 executes steps S112 to S114 to be described later for all pairs (r ₁ , r ₂ ) of replaceable component supply units. Here, “replaceable” component supply unit pairs (r ₁ , r ₂ ) are a component supply unit group to which the component supply unit r ₁ is assigned and a component to which the component supply unit r ₂ is assigned. Even when the supply unit group is replaced, the number of pallets required for component mounting on the board of each board type does not exceed the maximum number of pallets that can be simultaneously mounted on the component mounting device that constitutes the production line. Means a pair of component supply units.

In step S112, the component placement setting data generation unit 112 calculates a before and after replacing the allocation destination component supply unit group between the component supply unit r ₁ and r _2, an estimate of the component mounting time. Note that the approximate value of the component mounting time may be calculated by the same method as that described in step S67 of FIG.

  In step S113, the component mounting setting data generation unit 112 compares the component mounting time approximate values calculated in step S112 before and after replacement, determines whether the component mounting approximate value is shortened by replacement, and if true. Executes step S114.

In step S114, the component mounting setting data generation unit 112 replaces the allocation destination component supply unit group of the component supply unit pair (r ₁ , r ₂ ), and updates the component supply unit allocation.

  Through the steps S110 to S114 described above, the calculated component supply unit allocation can be updated so that the approximate value of the component mounting time is shortened. That is, the component supply unit allocation that satisfies all the constraint conditions and has a short component mounting time approximate value is obtained.

  FIG. 28 is a Gantt chart for explaining an example of a usage pattern of the component mounting system 100 configured as described above.

  As shown in the figure, in the component mounting system 100, component supply unit arrangements that can be mounted on all board types to be planned are prepared in advance ("pallet preparation" in the figure), and after production starts, the pallet Switch the board type for mounting components by simply exchanging all the parts. Thereby, the apparatus stop time can be shortened.

  Furthermore, if the board type is a plan target, the number of pallet exchanges only increases and the time required for pallet exchange is short, even if the circuit board type insertion order is changed (rearranged, deleted, added). Therefore, the effect on production completion time is negligible. In addition, since the component supply unit placement operation can be minimized, the possibility of erroneous mounting of the component supply unit due to a human error or the like can be minimized.

  As shown in the drawing, at time 195a, the component mounting setting device 110 executes the component supply unit arrangement setting (S10) shown in FIG. The component supply unit arrangement is calculated and set in each component mounting device 130.

  Then, the operator of the component mounting system 100 mounts the component supply unit on each pallet according to the component supply unit arrangement setting.

  Further, at times 195b, 195c, and 195d, the component placement setting device 110 executes the pallet placement setting (S11) shown in FIG. 13, for example, based on the determined production plan (substrate type, number of production). The number of times of replacement is small (the operator's workload is small), the board loading sequence, and the pallet arrangement at the time of component mounting on each board type are calculated and set in each component mounting device 130 (for example, at the start of daily production) , Etc. when the production plan is revised by adding an express order).

  Then, the operator of the component mounting system 100 can produce a substrate by performing a pallet replacement operation according to the set substrate input sequence and pallet arrangement, and then inputting the substrate into the component mounting line.

  It should be noted that when producing a substrate of a type that was not assumed when setting the component supply unit arrangement, the component supply unit arrangement may be set again after correcting the assumed production plan data.

  In the embodiment described above, each board type is handled independently. For example, a group of a plurality of board types is created in advance by a similar board grouping technique used in the group setup technique, and individual boards are created. The present invention can be similarly applied even if the types are handled independently as a group.

  Further, according to the embodiment described above, the number of pallets on which the component supply unit used for component mounting on each substrate of the production target substrate type input by the operator can be simultaneously mounted on the component mounting line. The number of pallets used for confirming that the number of pallets is less than the number of pallets (for example, the number of mounted heads) and the number of pallets used for mounting components on all production board types is the upper limit (for example, owned by the operator). The number of component supply units that store the type of component to be mounted on the pallet for all component types is the upper limit value entered by the operator (for example, the number of owned component reels). In order to provide a process for confirming that: Possible component supply unit layout can be set. As a result, the component mounting unit down time is short, the production plan can be easily changed, and the component mounting setting with few component mounting units is set. Can do.

  Furthermore, according to the present embodiment, the component mounting that reduces the user's pallet replacement work load is provided by providing a process for calculating the board loading sequence with a small number of pallet replacements occurring when switching the board type on which the component is mounted. Settings can be made.

  Furthermore, according to the present embodiment, since the screen for displaying the loading order of the board and the mounting position of the pallet used for mounting the component on the board of each board type is provided, the user can perform the pallet replacement work necessary for board production. Can be easily grasped.

  In the embodiment described above, the component mounting setting device 110 and the component mounting device 130 are described as separate devices. However, the present invention is not limited to such an embodiment, and these devices are combined into one device. Is also possible. In such a case, the function of the component mounting setting device 110 may be added to at least one component mounting device 130 of the plurality of component mounting devices 130 in the production line.

Schematic of a component mounting system. Schematic of a component mounting setting device. Schematic of a component mounting line master table. Schematic of a component mounting apparatus master table. Schematic of a circuit board master table. Schematic of a parts master table. Schematic diagram of a production plan table. Schematic of a component supply unit arrangement table. Schematic of a component mounting setting table. Schematic diagram of a computer. Schematic of a component mounting apparatus. The top view of a gantry type component mounting apparatus. PAD showing component placement setting processing. PAD showing a component supply unit arrangement setting process. The schematic diagram of a component supply unit arrangement | positioning setting condition input screen. Schematic of a component supply unit arrangement confirmation screen. PAD showing component supply unit allocation calculation processing. Explanatory drawing of a constant group and a variable group. PAD indicating palette placement setting processing. Schematic of a pallet arrangement setting condition input screen. Schematic diagram of setup plan confirmation screen. Schematic diagram of setup plan confirmation screen for each device. PAD showing a substrate loading order calculation process. Schematic of similarity matrix. PAD showing palette arrangement calculation processing. PAD which shows the other example of a component supply unit allocation calculation process. PAD showing parts supply unit allocation improvement processing. The Gantt chart for demonstrating an example of the usage pattern of a component mounting system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting system 110 Component mounting setting apparatus 111 Storage part 112 Component mounting line master data storage area 113 Component mounting apparatus master data storage area 114 Circuit board master data storage area 115 Parts master data storage area 116 Production plan data storage area 117 Parts supply Unit placement data storage area 118 Component mounting setting data storage area 119 Calculation data storage area 120 Control unit 121 Overall control unit 122 Component mounting setting data generation unit 130 Component mounting device

Claims (20)

In a component mounting apparatus including a component mounting unit that mounts a component on a substrate and one or more component supply bases that mount a component supply unit that supplies the component mounted on the component mounting unit, the component is mounted on a plurality of types of substrates. A component mounting setting device for specifying an arrangement of the component supply unit on the component supply base when mounting
A component mounting device master that identifies, for each component mounting device, the number of component supply bases that can be mounted on the component mounting device and the number of component supply units that can be mounted on the component supply base that can be mounted on the component mounting device. A storage unit for storing data and board master data for specifying a component to be mounted for each board type;
Production plan data that identifies at least the type of board to be produced, production line data that identifies the component mounting device used when producing the board, and use that identifies the number of parts that can be used when producing the board An input unit that accepts input of possible parts supply quantity data,
A control unit,
The controller is
From the combination of the component supply unit that mounts the component and the component supply stand, by specifying the component to be mounted on all the board types specified by the production plan data from the substrate master data,
The number of component supply bases on which component supply units required for mounting components on one board type specified by the production plan data can be installed in the component mounting device specified by the production line data. The condition that the number is less than the number of parts supply stands,
The number of component supply units on which component supply units required for mounting components on all the board types specified in the production plan data are usable as specified in the usable component supply number data. The condition that the number is less than the number of parts supply stands,
If there is a combination that satisfies the condition, if there is such a combination, the arrangement specifies the arrangement of the component supply unit on the component supply base used for the production of the board type ,
Calculating the order of loading the board types into the component mounting device by specifying a component supply base commonly used in the production of the board types ;
A component placement setting device. The component mounting setting device according to claim 1,
The input unit further accepts input of the same component mountable number data for specifying the number of component supply units that can be mounted on the component supply table,
The control unit further includes:
The number of component supply units mounted on all component supply bases used when mounting components on all board types specified by the production plan data is specified by the same component mountable number data. Detecting whether there is a combination that satisfies the condition that it is less than or equal to the number of possible component supply units;
A component placement setting device. The component mounting setting device according to claim 1,
The input unit accepts selection of at least a board type to be produced from the board types specified in the production plan data,
The control unit identifies a component supply base necessary for producing the board type selected by the input unit, and a component supply unit arranged on the component supply base, from among combinations that satisfy the conditions. Output the processed data to the output unit,
A component placement setting device. The component mounting setting device according to claim 1,
The on sequence, it replaced the number arrangement of the component supply table specified in the component supply unit is projecting input sequence that minimizes,
A component placement setting device. The component mounting setting device according to claim 1,
Specifying a combination of the component supply base and the component mounting portion so that the component mounting time using the component supply base in which the arrangement of the component supply unit is specified is minimized;
A component placement setting device. When a component is mounted on a plurality of types of boards, including a component mounting unit that mounts a component on the board and one or more component supply bases that mount a component supply unit that supplies the component mounted on the component mounting unit A component mounting device for specifying an arrangement of the component supply unit on the component supply base in
A component mounting device master that identifies, for each component mounting device, the number of component supply bases that can be mounted on the component mounting device and the number of component supply units that can be mounted on the component supply base that can be mounted on the component mounting device. A storage unit for storing data and board master data for specifying a component to be mounted for each board type;
Production plan data that identifies at least the type of board to be produced, production line data that identifies the component mounting device used when producing the board, and use that identifies the number of parts that can be used when producing the board An input unit that accepts input of possible parts supply quantity data,
A control unit,
The controller is
From the combination of the component supply unit and the component supply stand,
From the combination of the component supply unit that mounts the component and the component supply stand, by specifying the component to be mounted on all the board types specified by the production plan data from the substrate master data,
The number of component supply bases on which component supply units required for mounting components on one board type specified by the production plan data can be installed in the component mounting device specified by the production line data. The condition that the number is less than the number of parts supply stands,
The number of parts that can be supplied with the parts supply unit required when mounting parts on all the board types specified by the production plan data is the available parts supply that is specified by the usable parts supply quantity data. The condition that it is less than the number of units, and
If there is a combination that satisfies the condition, if there is such a combination, the arrangement specifies the arrangement of the component supply unit on the component supply base used for the production of the board type ,
Calculating the order of loading the board types into the component mounting device by specifying a component supply base commonly used in the production of the board types ;
Parts instrumentation wearing location characterized by. The component mounting apparatus according to claim 6,
The input unit further accepts input of the same component mountable number data for specifying the number of component supply units that can be mounted on the component supply table,
The control unit further includes:
The number of component supply units mounted on all component supply bases used when mounting components on all board types specified by the production plan data is specified by the same component mountable number data. Detecting whether there is a combination that satisfies the condition that it is less than or equal to the number of possible component supply units;
A component mounting device characterized by The component mounting apparatus according to claim 6,
The input unit accepts selection of at least a board type to be produced from the board types specified in the production plan data,
The control unit identifies a component supply base necessary for producing the board type selected by the input unit, and a component supply unit arranged on the component supply base, from among combinations that satisfy the conditions. Output the processed data to the output unit,
A component mounting device characterized by The component mounting apparatus according to claim 6,
The on sequence, it replaced the number arrangement of the component supply table specified in the component supply unit is projecting input sequence that minimizes,
Parts instrumentation wearing location characterized by. The component mounting apparatus according to claim 6,
Specifying a combination of the component supply base and the component mounting portion so that the component mounting time using the component supply base in which the arrangement of the component supply unit is specified is minimized;
Parts instrumentation wearing location characterized by. On the computer,
In a component mounting apparatus including a component mounting unit that mounts a component on a substrate and one or more component supply bases that mount a component supply unit that supplies the component mounted on the component mounting unit, the component is mounted on a plurality of types of substrates. A program for performing a process of specifying the arrangement of the component supply unit on the component supply base when mounting
The computer,
A component mounting device master that identifies, for each component mounting device, the number of component supply bases that can be mounted on the component mounting device and the number of component supply units that can be mounted on the component supply base that can be mounted on the component mounting device. Storage means for storing data and board master data for specifying a component to be mounted for each board type;
Production plan data that identifies at least the type of board to be produced, production line data that identifies the component mounting device used when producing the board, and use that identifies the number of parts that can be used when producing the board Input means for accepting input of possible parts supply quantity data,
Control means,
Function as
The control means includes
From the combination of the component supply unit that mounts the component and the component supply stand, by specifying the component to be mounted on all the board types specified by the production plan data from the substrate master data,
The number of component supply bases on which a component supply unit required to be used when mounting components on one board type specified by the production plan data is specified in the component mounting device specified by the production line data. The condition that the number is less than the number of parts supply stands that can be equipped;
The number of parts that can be supplied with the parts supply unit required when mounting parts on all the board types specified by the production plan data is the available parts supply that is specified by the usable parts supply quantity data. The condition that it is less than the number of units, and
Detecting whether there is a combination that satisfies the condition, and if there is such a combination, a process of specifying the arrangement of the component supply unit on the component supply base used for the production of the board type by the combination; and
Performing a process of calculating a loading order of the board types to the component mounting apparatus by specifying a component supply base commonly used for production of the board types ;
A program characterized by The program according to claim 11,
The input means further accepts input of the same component mountable number data for specifying the number of component supply units that can be mounted on the component supply table,
The control means further includes
The number of component supply units mounted on all component supply bases used when mounting components on all board types specified by the production plan data is specified by the same component mountable number data. Detecting whether there is a combination that satisfies the condition that it is less than or equal to the number of possible component supply units;
A program characterized by The program according to claim 11,
The input means accepts selection of at least the board type to be produced from the board types specified in the production plan data,
The control means identifies a component supply base necessary for producing the board type selected by the input unit, and a component supply unit arranged on the component supply base, from among the combinations that satisfy the condition. Output the processed data to the output means,
A program characterized by The program according to claim 11,
The control means, the frequency of replacement arrangement of the component supply table specified in the component supply unit and calculates the supply sequence that minimizes,
A program characterized by The program according to claim 11,
The control means specifies a combination of the component supply base and the component mounting portion so that the component mounting time using the component supply base in which the arrangement of the component supply units is specified is minimized.
A program characterized by In a component mounting apparatus including a component mounting unit that mounts a component on a substrate and one or more component supply bases that mount a component supply unit that supplies the component mounted on the component mounting unit, the component is mounted on a plurality of types of substrates. A component supply unit arrangement method performed by a component mounting setting device that specifies the arrangement of the component supply unit on the component supply base when mounting
The component mounting setting device includes, for each component mounting device, the number of component supply bases that can be mounted on the component mounting device, the number of component supply units that can be mounted on the component supply base that can be mounted on the component mounting device, A storage unit that stores component mounting device master data for specifying the board and board master data for specifying a component to be mounted for each board type, an input unit, and a control unit,
The input unit at least produces production plan data that identifies the type of board to be produced, production line data that identifies a component mounting device used when producing the board, and component supply that can be used when producing the board An input process for receiving input of usable part supply unit data for specifying the number of units,
The control unit is
From the combination of the component supply unit that mounts the component and the component supply stand, by specifying the component to be mounted on all the board types specified by the production plan data from the substrate master data,
The number of component supply bases on which component supply units required for mounting components on one board type specified by the production plan data can be installed in the component mounting device specified by the production line data. The condition that the number is less than the number of parts supply stands,
The number of parts that can be supplied with the parts supply unit required when mounting parts on all the board types specified by the production plan data is the available parts supply that is specified by the usable parts supply quantity data. The condition that it is less than the number of units, and
A detection process for detecting whether there is a combination that satisfies
If there is such a combination, a specific process for specifying the arrangement of the component supply unit on the component supply base used for the production of the board type by the combination, and
A board loading sequence calculation process for calculating a loading sequence of the board types to the component mounting apparatus by specifying a component supply base commonly used in the production of the board types;
A component supply unit arrangement method comprising: It is the component supply unit arrangement method according to claim 16,
The input unit further accepts input of the same component mountable number data specifying the number of component supply units that can be mounted on the component supply base in the input process,
In the detection process, the control unit further includes:
The number of component supply units mounted on all component supply bases used when mounting components on all board types specified by the production plan data is specified by the same component mountable number data. Detecting whether there is a combination that satisfies the condition that it is less than or equal to the number of possible component supply units;
A component supply unit arrangement method characterized by the above. It is the component supply unit arrangement method according to claim 16,
A selection input process for receiving selection of at least a board type to be produced from among the board types specified in the production plan data.
The control unit identifies a component supply base necessary for producing the board type selected by the input unit from among the combinations satisfying the condition, and a component supply unit arranged on the component supply base Output process to output the processed data to the output unit,
The component supply unit arranging method further comprising: It is the component supply unit arrangement method according to claim 16,
The substrate on sequence specific process, the frequency of replacement arrangement of the component supply table specified in the component supply unit and calculates the supply sequence that minimizes,
A component supply unit arrangement method characterized by the above. It is the component supply unit arrangement method according to claim 16,
Component supply base arrangement specification that specifies the combination of the component supply base and the component mounting section so that the control section minimizes the part mounting time using the component supply base in which the arrangement of the component supply units is specified Having further processes,
A component supply unit arrangement method characterized by the above.

Images