JP4976341B2 - Substrate cleaning apparatus, substrate cleaning method, and storage medium - Google Patents

Description

  The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for brush cleaning at least an end surface of a substrate, and a storage medium.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a cleaning process is performed to remove particles, contamination, and the like adhering to a semiconductor wafer or glass substrate as a substrate to be processed. As a device for performing such a cleaning process, there is known a single wafer cleaning device that holds a substrate on a spin chuck and supplies a cleaning liquid to the surface of the wafer while the substrate is rotated to clean the surface of the wafer. ing.

  In the cleaning process of such a cleaning apparatus, the acid or alkali chemical used as the cleaning liquid remains on the periphery of the substrate in the course of the cleaning process, and is dried as it is to become a deposit or removed by cleaning. It occurs that the material redeposits on the periphery of the substrate. In the past, since the peripheral part of the substrate is not used as a product, no special measures have been taken against such deposits on the peripheral part of the substrate. Adverse effects caused by the adhering material attached to the substrate support arm or the like of the substrate transport mechanism have become apparent. As a technique for preventing such an adverse effect, a technique has been proposed in which a sponge-like brush is brought into contact with the peripheral edge of the substrate to remove deposits on the peripheral edge (for example, Patent Documents 1 and 2).

However, there are also deposits that are firmly attached to the peripheral edge of the substrate, particularly the end surface of the substrate, and cannot be removed simply by contacting the sponge brush.
Japanese Utility Model Publication No. 5-79939 JP 2007-165794 A

The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a substrate cleaning apparatus and a substrate cleaning method that can effectively remove at least deposits adhered to the substrate end face with a sponge-like brush. And
Moreover, it aims at providing the storage medium which memorize | stored the program for implementing such a method.

In order to solve the above problems, according to a first aspect of the present invention, there is provided a substrate cleaning apparatus for brush cleaning at least an end surface of a substrate, the substrate holding mechanism holding the substrate rotatably, and holding the substrate on the substrate holding mechanism. A substrate rotating mechanism for rotating the substrate that has been moved, a cleaning liquid supply mechanism for supplying a cleaning liquid to the substrate held by the substrate holding mechanism, and a brush made of sponge-like resin that comes into contact with at least the end surface of the substrate during cleaning The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous with the small-diameter portion, and is compressed and cured in a peripheral surface of the small-diameter portion. The end surface of the substrate and the peripheral portion of the front surface of the substrate are cleaned by the connection surface of the large diameter portion with the small diameter portion, and when the brush is compressed, the end surface of the substrate and the back surface of the substrate Or table As good detergency with respect to the peripheral portion is obtained, and wherein the initial shape is determined with a cutout wafer, which is formed between the large diameter portion and the small diameter portion is inserted A substrate cleaning apparatus is provided.
Moreover, the initial shape of the brush can be changed to one having a curved portion between the small diameter portion and the large diameter portion.

In the first aspect, pre-Symbol brush connecting surface of the large diameter portion is deformed by being compressed, it can be made to locally cleaning the periphery of the substrate by the deformed portion.

  Furthermore, the cleaning mechanism may have a brush compression mechanism that compresses the brush. In this case, the brush compression mechanism may include a pair of pressing members that vertically hold the brush and an actuator that moves at least one of the pressing members.

Furthermore, the cleaning mechanism includes a brush rotating mechanism that rotates the brush, and an contacting / separating mechanism that contacts and separates the brush from the substrate, and the brush rotated by the brush rotating mechanism is connected to the contacting / separating mechanism. The substrate can be brought into contact with the substrate rotated by the substrate rotating mechanism by the separation mechanism, and the edge surface and the back surface of the substrate or the peripheral portion of the surface can be cleaned in that state.

According to a second aspect of the present invention, there is provided a substrate cleaning method for brush cleaning at least an end face of a substrate, which has a cylindrical small diameter portion and a cylindrical large diameter portion continuous with the small diameter portion, and is compressed. In order to obtain a good cleaning power with respect to the edge surface of the substrate and the peripheral portion of the back surface or front surface of the substrate, the wafer formed between the small diameter portion and the large diameter portion has a notch into which the wafer is inserted. The brush made of sponge-like resin whose initial shape is determined is compressed and cured, the cleaning liquid is supplied to the substrate, and the peripheral surface of the small-diameter portion of the compressed and cured brush is rotated. Provided is a method for cleaning a substrate, wherein the substrate cleaning method is characterized in that the substrate is brought into contact with an end face, and the connecting surface of the large-diameter portion with the small-diameter portion is brought into contact with the back surface or the peripheral edge of the surface of the substrate being rotated. .
Moreover, the initial shape of the brush can be changed to one having a curved portion between the small diameter portion and the large diameter portion.

In the second aspect, it is preferable that the brush is rotated while the compressed and cured brush is rotated, and the brush is brought into contact with an edge surface and a back surface of the substrate being rotated or a peripheral portion of the surface . In addition, the connecting surface of the large-diameter portion is deformed by being compressed, and the peripheral portion of the substrate can be locally cleaned by the deformed portion.

According to a third aspect of the present invention, there is provided a storage medium that operates on a computer and stores a program for controlling the substrate cleaning apparatus, and the program is stored in the computer so that the substrate cleaning method is performed at the time of execution. Provided is a storage medium that controls the substrate cleaning apparatus .

  According to the present invention, when performing brush cleaning by contacting at least the end surface of the substrate, the sponge-like brush is in a compressed state, so that the cleaning power is increased by increasing the hardness of the brush during cleaning. Thus, deposits adhering to the end face of the substrate can be effectively cleaned. In addition, when using a brush in which a small-diameter portion and a large-diameter portion that simultaneously clean the substrate end surface and the peripheral portion of the substrate surface or the back surface are used, the large-diameter portion that cleans the peripheral portion is compressed by compressing the brush. A protrusion having high hardness is formed on the connecting surface of the small-diameter portion, so that cleaning with extremely high cleaning power can be performed locally.

  Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. FIG. 1 is a schematic configuration diagram showing a wafer cleaning apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the inside thereof.

  This wafer cleaning apparatus 1 has a chamber 2, and a spin chuck 3 for adsorbing and holding a semiconductor wafer (hereinafter simply referred to as a wafer) W as a substrate to be cleaned by vacuum suction in a horizontal state. Is provided. The spin chuck 3 can be rotated by a motor 4 provided below the chamber 2 via a shaft 3a. A cup 5 is provided in the chamber 2 so as to cover the wafer W held by the spin chuck 3. An exhaust / drain pipe 6 for exhaust and drainage is provided at the bottom of the cup 5 so as to extend below the chamber 2. On the side wall of the chamber 2, a loading / unloading port 7 for loading / unloading the wafer W is provided. A fluid seal 8 is provided between the shaft 3 a and the bottom of the cup 5 and the bottom of the chamber 2.

  The wafer cleaning apparatus 1 further includes a cleaning liquid supply mechanism 10 that supplies a cleaning liquid, and a cleaning mechanism 20 that brush-cleans a peripheral portion including the end surface of the wafer W.

  The cleaning liquid supply mechanism 10 includes a front surface side cleaning liquid nozzle 11 a provided above the cup 5 and a back surface side cleaning liquid nozzle 11 b provided on the back surface side of the wafer W held by the spin chuck 3. A front surface side cleaning liquid supply pipe 13a and a back surface side cleaning liquid supply pipe 13b are connected to the nozzle 11a and the back surface side cleaning liquid nozzle 11b, respectively. The other ends of the front surface side cleaning liquid supply pipe 13 a and the back surface side cleaning liquid supply pipe 13 b are connected to a common cleaning liquid supply source 12. Then, the cleaning liquid is supplied from the cleaning liquid supply source 12 to the vicinity of the center of the surface of the wafer W from the front surface side cleaning liquid nozzle 11a through the front surface side cleaning liquid supply pipe 13a, and from the back surface side cleaning liquid nozzle 11b to the wafer from the rear surface side cleaning liquid supply pipe 13b. A cleaning liquid is supplied to the back surface of W. Valves 14a and 14b are interposed in the front surface side cleaning liquid supply pipe 13a and the back surface side cleaning liquid supply pipe 13b, respectively. As the cleaning liquid, pure water, chemical liquid, or the like can be used.

  The cleaning mechanism 20 includes a brush 21 made of sponge-like resin for cleaning the peripheral portion including the end face of the wafer W, a rotation support member 22 that rotatably supports the brush 21, and a pair that presses the brush 21 in the vertical direction. Pressing members 23a and 23b, a cylinder 24 for applying a compressive force to the brush 21 via the pressing members 23a and 23b, a rotating arm 25 for rotating the brush 21, and a rotation of the rotating arm 25 Rotating / elevating part incorporating a shaft part 26 having a turning shaft as a shaft, a turning mechanism for turning the turning shaft to turn the turning arm 25, and a lifting mechanism for raising and lowering the turning arm 25. 27.

  FIG. 3 is a sectional view showing the cleaning mechanism in more detail. The rotation support member 22 has a cylindrical shape extending in the vertical direction, and a piston 24a of the cylinder 24 extends through the inside thereof in the vertical direction. The piston 24a is connected to a brush support member 21a extending in the vertical direction at the center of the brush 21, and the lower end of the brush support member 21a is fixed to the center of the lower pressing member 23b. The upper pressing member 23a is fixed to the lower end surface of the rotation support member 22, and the space between the brush support member 21a and the upper pressing member 23a is free. Therefore, by retracting the piston 24a of the cylinder 24, the lower pressing member 23b rises together with the brush support member 21a, and the brush 21 sandwiched between the upper pressing member 23a and the lower pressing member 23b is compressed. Is done. That is, the pressing members 23a and 23b and the cylinder 24 function as a brush compression mechanism. Note that the brush 21 may be compressed by moving both of the pressing members 23a and 23b. Further, instead of the cylinder 24, another actuator may be used.

  The rotating arm 25 has a horizontally extending rectangular tube shape, and a rotation support member 22 is rotatably provided at a tip portion thereof. In other words, the rotation support member 22 is rotatably supported by a pair of bearings 31 a and 31 b attached to the rotation arm 25. A pulley 32 is fitted around the center of the rotation support member 22, and a belt 33 is wound around the pulley 32. The belt 33 extends horizontally in the internal space of the rotating arm 25. In addition, a brush rotation motor 34 is provided inside the rotation arm 25 so as to be fixed to the bottom plate, and a pulley 35 is attached to a rotation shaft 34a of the brush rotation motor 34. The belt 33 is wound around the pulley 35. Therefore, by driving the motor 34, the rotation support member 22 is rotated via the belt 33, and the brush 21 is rotated accordingly.

  A vertically extending rotating shaft 38 is fixed to a base end portion of the rotating arm 25 by a pair of fixing members 39 provided on the upper and lower sides of the rotating arm 25. The rotating shaft 38 extends through the shaft portion 26 to the rotating / lifting portion 27.

  The rotating / elevating unit 27 includes a casing 41 that continues below the shaft unit 26, and a rotating mechanism 42 and an elevating mechanism 45 that are provided therein. The rotation mechanism 42 has a rotation motor 43, the rotation axis of which is connected to the lower end of the rotation shaft 38, and is fixed to the rotation shaft 38 by driving the rotation motor 43 to rotate. The rotating arm 25 is rotated. The elevating mechanism 45 includes a support member 46 that rotatably supports the rotating shaft 38 via a bearing 47, a ball screw 48 that extends vertically upward from the bottom of the housing 41, and is screwed with the support member 46, and a housing. A lifting motor 49 that is fixed to the bottom plate of the body 41 and rotates the ball screw 48, and a guide member 50 that is provided vertically in the housing 41 and guides the support member 46. That is, the elevating mechanism 45 elevates and lowers the rotating shaft 38 by a ball screw mechanism, and accordingly elevates the rotating arm 25.

  4A and 4B are cross-sectional views showing the brush 21 in an enlarged manner, in which FIG. 4A shows an uncompressed state and FIG. 4B shows a compressed state. The brush 21 has a cylindrical small diameter portion 21b and a cylindrical large diameter portion 21c continuous below the small diameter portion 21b. The peripheral surface of the small diameter portion 21b functions as an end surface cleaning portion of the wafer W, and the upper surface of the large diameter portion 21c, that is, the connection surface of the small diameter portion 21b functions as a back surface peripheral edge cleaning portion. In actual cleaning, the wafer W is cleaned in a state where the brush 21 is pressed by the pressing members 23a and 23b and compressed and cured as shown in FIG. The brush 21 is made of a sponge-like resin as described above, and polyvinyl alcohol (PVA) can be suitably used. Examples of other resins applicable to the brush 21 include polyethylene (PE). Further, since the brush support member 21a and the pressing members 23a and 23b need a certain degree of rigidity, metal or hard resin can be used. However, since the metal may cause contamination with the wafer W, a hard resin such as polyether ether ketone (PEEK) or polyethylene terephthalate (PET) is preferable.

  As illustrated in the block diagram of FIG. 5, the control unit 30 includes a controller 61, a user interface 62, and a storage unit 63. The controller 61 controls each component of the substrate cleaning apparatus 1, such as the motor 4, the cylinder 24, the brush rotation motor 34, the rotation motor 43, and the lifting motor 49. The user interface 62 is connected to the controller 61 and includes a keyboard on which an operator inputs commands and the like to manage the wafer cleaning apparatus 1, a display that visualizes and displays the operation status of the wafer cleaning apparatus 1, and the like. . The storage unit 63 is also connected to the controller 61, and a control program for controlling the control target of each component of the wafer cleaning apparatus 1, a program for causing the wafer cleaning apparatus 1 to perform predetermined processing, that is, Processing recipe is stored. The processing recipe is stored in a storage medium in the storage unit 63. The storage medium may be a fixed medium such as a hard disk or a portable medium such as a CDROM, DVD, or flash memory. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example. Then, the controller 61 calls and executes an arbitrary processing recipe from the storage unit 63 according to an instruction from the user interface 62 or the like as necessary, and thereby a predetermined process is performed under the control of the controller 61.

  Next, a processing operation for cleaning the wafer W by using the wafer cleaning apparatus 1 will be described.

  First, the wafer W is loaded into the chamber 2 and the spin chuck 3 holds the wafer W. Next, the pressing member 23b is moved upward by a predetermined distance by the cylinder 24, the brush 21 is sandwiched by the pressing members 23a and 23b, and the brush 21 is compressed and cured. At this time, as shown in FIG. 4B, both the small diameter portion 21b and the large diameter portion 21c are compressed and hardened, and at the same time, the upper surface of the large diameter portion 21c is deformed to form a projection 21d.

  In this state, the motor 4 is driven to rotate the wafer W together with the spin chuck 3 at a predetermined number of revolutions, and while supplying the cleaning liquid from the front surface side cleaning liquid nozzle 11a and the rear surface side cleaning liquid nozzle 11b, the brush rotating motor 34 brushes the brush. The brush 21 is rotated together with the support member 22. The rotating motor 43 rotates the rotating arm 25 toward the wafer W on the spin chuck 3 to press the outer periphery of the small diameter portion 21b of the brush 21 against the end surface of the wafer W, and the lifting mechanism 45 rotates the rotating arm. The height of 25 is adjusted, and the upper surface of the large-diameter portion 21c of the brush 21 is pressed against the peripheral edge of the back surface of the wafer W to start brush cleaning.

  Not limited to this, the position of the brush 21 is first adjusted by the rotating motor 43 and the lifting mechanism 45, and then the pressing member 23b is moved upward by a predetermined distance by the cylinder 24, and the brush 21 is moved by the pressing members 23a and 23b. The cleaning may be started after the sandwiching and the brush 21 are compressed, and the brush 21 is pressed against the other surface and back surface peripheral edge of the wafer W at that time.

  At this time, since the sponge-like brush 21 is compressed and hardened, the cleaning power is higher than in a normal state, and the adhered matter firmly attached to the edge surface and back surface peripheral portion of the wafer W is also removed. be able to. In addition, the upper surface of the large-diameter portion 21c is deformed to form a protrusion 21d, and the peripheral edge of the back surface of the wafer W can be locally cleaned with the protrusion 21d having a small area. The power can be increased significantly. In other words, the brush 21 normally contacts the wafer W in a planar shape, but by forming the protrusion 21d in this way, the brush 21 comes in linear contact, and the brush pressure at the contact portion is very high. It will be a thing.

  The shape of the brush 21 may be a shape that allows for deformation when compressed. That is, the initial shape of the brush 21 is determined so that a good cleaning power can be obtained when it is compressed and deformed. For example, if a notch 21e into which the wafer W is inserted is formed between the small-diameter portion 21b and the large-diameter portion 21c as shown in FIG. 6A, it is shown in FIG. 6B when compressed. As described above, the edge surface and the back surface peripheral edge of the wafer W to be cleaned can be deformed so that the entire cleaning object can be cleaned evenly. Furthermore, by crushing the brush 21, the pressure of the brush 21 can be increased and the overall cleaning power can be increased. Further, by forming a curved portion 21f between the small diameter portion 21b and the large diameter portion 21c as shown in FIG. 7A, as shown in FIG. The wafer W that is the object to be cleaned can be deformed so as to wrap around the peripheral edge of the end surface and the back surface, and almost the entire object to be cleaned can be cleaned. Also in this case, by further crushing the brush 21, the pressure of the brush 21 can be increased and the overall cleaning power can be increased.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above embodiment, an example in which the edge surface and the back surface peripheral edge of the wafer are cleaned using a brush having an upper portion as a small-diameter portion and a lower portion as a large-diameter portion, as shown in FIG. By using a brush 21 ′ having an upper portion having a large diameter portion 21 b ′ and a lower portion having a small diameter portion 21 c ′, the wafer end surface and the surface peripheral portion are cleaned by being compressed vertically as shown in FIG. 8B. You can also In this case, the same effect as in FIGS. 6 and 7 can be obtained by replacing the small diameter portion and the large diameter portion in FIGS. 6 and 7. Further, as shown in FIG. 9, it is also possible to use a brush 21 ″ having a cylindrical shape as a whole for cleaning only the end face of the wafer W. In this case, the brush 21 ″ is at least a part of the wafer W when compressed. The initial shape may be determined so as to obtain a good cleaning power for the end face. For example, as shown in FIG. 10, a notch 21a ″ for inserting a wafer W may be provided on the outer peripheral face thereof.

  In the above-described embodiment, only the cleaning mechanism for cleaning the edge surface and the back surface peripheral portion of the wafer has been described. However, an appropriate cleaning mechanism for cleaning the surface of the wafer may be provided. Furthermore, the present invention can be applied not only to the apparatus of the above embodiment, but also to a cleaning apparatus that cleans the front and back surfaces of the wafer or an apparatus that cleans the back surface of the wafer.

  Furthermore, the brush compression method is not limited to the above embodiment, and various methods can be employed. Alternatively, the brush may be set in a predetermined compressed state in advance and attached to the apparatus.

  Furthermore, in the above-described embodiment, the case where a semiconductor wafer is applied as the substrate to be processed has been described. However, the present invention is not limited to this. For example, a flat panel display device substrate represented by a glass substrate for a liquid crystal display device, and the like. It can also be applied to other substrates.

1 is a schematic configuration diagram showing a substrate cleaning apparatus according to an embodiment of the present invention. The top view which shows the inside of the board | substrate cleaning apparatus which concerns on one Embodiment of this invention. Sectional drawing which shows the cleaning mechanism provided in the board | substrate cleaning apparatus which concerns on one Embodiment of this invention further in detail. Sectional drawing which expands and shows the state which the brush of the cleaning mechanism provided in the substrate cleaning apparatus which concerns on one Embodiment of this invention has not compressed, and the compressed state. The block diagram which shows the structure of the control part provided in the substrate cleaning apparatus which concerns on one Embodiment of this invention. Sectional drawing which expands and shows the state which is not compressed in the modification of the brush of FIG. 4, and the compressed state. Sectional drawing which expands and shows the state which is not compressed in the other modification of the brush of FIG. 4, and the compressed state. Sectional drawing which expands and shows the state which is not compressed in the other structural example of a brush, and the compressed state. Sectional drawing which expands and shows the further another structural example of a brush. Sectional drawing which expands and shows the modification of the brush of FIG.

Explanation of symbols

1: Wafer cleaning device (substrate cleaning device)
2; Chamber 3; Spin chuck 4; Motor 5; Cup 6; Exhaust / drain tube 7; Loading / unloading port 10; Cleaning liquid supply mechanism 11a; Front side cleaning liquid nozzle 11b; Back side cleaning liquid nozzle 12; Cleaning liquid supply source 20; Brush 21a; Brush support member 21b, 21c '; Small diameter part 21c, 21b'; Large diameter part 22; Rotation support member 23a, 23b; Press member 24; Cylinder 25; Shaft part 27; Rotation / lifting part 30; Control part 61; Controller 62; User interface 63; Storage part W; Semiconductor wafer (substrate)

Claims (11)

A substrate cleaning apparatus for brush cleaning at least an end surface of a substrate,
A substrate holding mechanism for rotatably holding the substrate;
A substrate rotation mechanism for rotating the substrate held by the substrate holding mechanism;
A cleaning liquid supply mechanism for supplying a cleaning liquid to the substrate held by the substrate holding mechanism;
A cleaning mechanism having a brush made of sponge-like resin that is brought into contact with at least the end surface of the substrate during cleaning,
The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous to the small-diameter portion, and in a compressed and cured state, the end surface of the substrate is washed with a peripheral surface of the small-diameter portion, and the large-diameter The peripheral surface of the back surface or the front surface of the substrate is cleaned by the connection surface of the portion with the small diameter portion, and when the brush is compressed, the edge surface of the substrate and the peripheral surface of the back surface or the front surface of the substrate are cleaned well. An initial shape having a notch into which a wafer formed between the small diameter portion and the large diameter portion is inserted is determined so as to obtain a force . A substrate cleaning apparatus for brush cleaning at least an end surface of a substrate,
A substrate holding mechanism for rotatably holding the substrate;
A substrate rotation mechanism for rotating the substrate held by the substrate holding mechanism;
A cleaning liquid supply mechanism for supplying a cleaning liquid to the substrate held by the substrate holding mechanism;
A cleaning mechanism having a brush made of sponge-like resin that is brought into contact with at least an end surface of the substrate during cleaning;
Comprising
The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous to the small-diameter portion, and in a compressed and cured state, the end surface of the substrate is washed with a peripheral surface of the small-diameter portion, and the large-diameter The peripheral surface of the back surface or the front surface of the substrate is cleaned by the connection surface of the portion with the small diameter portion, and when the brush is compressed, the edge surface of the substrate and the peripheral surface of the back surface or the front surface of the substrate are cleaned well. An initial shape having a curved portion between the small-diameter portion and the large-diameter portion is determined so as to obtain a force. 3. The substrate according to claim 1, wherein the connecting surface of the large-diameter portion is deformed when the brush is compressed, and the peripheral portion of the substrate is locally cleaned by the deformed portion. Cleaning device. The substrate cleaning apparatus according to claim 1 , wherein the cleaning mechanism includes a brush compression mechanism that compresses the brush. The substrate cleaning apparatus according to claim 4 , wherein the brush compression mechanism includes a pair of pressing members that sandwich the brush up and down and an actuator that moves at least one of the pressing members. The cleaning mechanism includes a brush rotating mechanism that rotates the brush and an contacting / separating mechanism that contacts and separates the brush from the substrate, and the brush rotated by the brush rotating mechanism is moved by the contacting / separating mechanism. the substrate rotation is brought into contact with the substrate being rotated by a mechanism, any one of claims 1 to 5, characterized in that to clean the periphery of the end surface and the back surface or the surface of the substrate in this state A substrate cleaning apparatus according to claim 1. A substrate cleaning method for brush cleaning at least an end surface of a substrate,
It has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous with the small-diameter portion, and when compressed, a good cleaning power can be obtained for the end surface of the substrate and the peripheral surface of the back surface or front surface of the substrate. In addition, a brush made of a sponge-like resin whose initial shape having a notch into which a wafer formed between the small diameter portion and the large diameter portion is inserted is compressed and cured,
Supply cleaning liquid to the substrate,
The peripheral surface of the small-diameter portion of the compressed and cured brush is brought into contact with the end surface of the rotating substrate , and the connection surface of the large-diameter portion with the small-diameter portion is the back surface or surface of the rotating substrate. A substrate cleaning method comprising: cleaning the substrate by bringing it into contact with the peripheral edge of the substrate. A substrate cleaning method for brush cleaning at least an end surface of a substrate,
It has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous with the small-diameter portion, and when compressed, a good cleaning power can be obtained for the end surface of the substrate and the peripheral surface of the back surface or front surface of the substrate. In addition, the brush made of a sponge-like resin having an initial shape having a curved portion between the small diameter portion and the large diameter portion is compressed and cured,
Supply cleaning liquid to the substrate,
The peripheral surface of the small-diameter portion of the compressed and cured brush is brought into contact with the end surface of the substrate being rotated, and the connection surface of the large-diameter portion with the small-diameter portion is formed on the back surface or surface of the substrate being rotated. A method for cleaning a substrate, wherein the cleaning is performed by contacting the periphery. While rotating the brush, which is cured by the compression, to claim 7 or claim 8, characterized in that washing in contact with the peripheral edge of the end surface and the back surface or the surface of the substrate being rotated the brush The substrate cleaning method as described . 10. The brush according to claim 7, wherein the connecting surface of the large-diameter portion is deformed by being compressed, and the peripheral portion of the substrate is locally cleaned by the deformed portion. The substrate cleaning method according to Item . Running on a computer, a storage medium storing a program for controlling the substrate cleaning apparatus, wherein the program, when executed, the substrate cleaning method rows according to any one of claims 10 claims 7 A storage medium that causes a computer to control the substrate cleaning apparatus .

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