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JP4987500B2 - Inspection apparatus and inspection method for tape-like member attached to substrate - Google Patents
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JP4987500B2 - Inspection apparatus and inspection method for tape-like member attached to substrate - Google Patents

Inspection apparatus and inspection method for tape-like member attached to substrate Download PDF

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JP4987500B2
JP4987500B2 JP2007022062A JP2007022062A JP4987500B2 JP 4987500 B2 JP4987500 B2 JP 4987500B2 JP 2007022062 A JP2007022062 A JP 2007022062A JP 2007022062 A JP2007022062 A JP 2007022062A JP 4987500 B2 JP4987500 B2 JP 4987500B2
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睦 小木曽
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Shibaura Mechatronics Corp
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この発明は基板の側部に形成されたリードに粘着性のテープ状部材を貼着してから電子部品を実装する前に、上記テープ状部材の貼着状態を検査する検査装置及び検査方法に関する。   The present invention relates to an inspection apparatus and an inspection method for inspecting the adhesive state of the tape-shaped member before the electronic component is mounted after the adhesive tape-shaped member is adhered to the lead formed on the side portion of the substrate. .

たとえば、液晶表示装置の組立工程では、基板としての液晶表示パネルの側辺部に、液晶駆動用ICが搭載された電子部品としての複数のタブ(TAB:Tape Automated Bonding)を所定間隔で実装し、これらタブに対して同じく電子部品としての回路基板を電気的に接続して上記表示装置を組み立てるということが行われている。   For example, in the assembly process of a liquid crystal display device, a plurality of tabs (TAB: Tape Automated Bonding) as electronic components on which liquid crystal driving ICs are mounted are mounted at predetermined intervals on the side of a liquid crystal display panel as a substrate. Similarly, a circuit board as an electronic component is electrically connected to these tabs to assemble the display device.

上記液晶表示パネルにタブを実装する場合、表示パネルの側辺部の多数のリードが所定間隔で形成された上面に、テープ状部材としての粘着性を有する異方性導電部材を貼着する。ついで、この異方性導電部材に複数のタブを所定間隔で仮圧着した後、これらタブを本圧着するということが行なわれている。そして、液晶表示パネルにタブを本圧着したならば、これらタブに異方性導電部材が一側部に貼着された上記回路基板を本圧着するようにしている。   When a tab is mounted on the liquid crystal display panel, an anisotropic conductive member having adhesiveness as a tape-like member is attached to the upper surface where a large number of leads on the side portions of the display panel are formed at predetermined intervals. Next, after temporarily bonding a plurality of tabs to the anisotropic conductive member at a predetermined interval, the tabs are finally bonded. When the tabs are finally pressure-bonded to the liquid crystal display panel, the circuit board having the anisotropic conductive member attached to one side is pressure-bonded to the tabs.

上記液晶表示パネルや回路基板の側辺部に貼着される異方性導電部材は上述したように粘着性を有するから、供給リールに剥離性の高い樹脂製の離型テープと重ね合わせて巻かれている。そして、離型テープが接着されていない側面を下にして上記供給リールから繰り出されて所定長さに切断された後、上記液晶表示パネルの側辺部の上面に加圧貼着される。   Since the anisotropic conductive member attached to the side part of the liquid crystal display panel or the circuit board has adhesiveness as described above, the supply reel is overlapped with a highly peelable resin release tape and wound. It is. Then, after being fed from the supply reel and cut to a predetermined length with the side surface to which the release tape is not bonded down, it is pressure bonded to the upper surface of the side portion of the liquid crystal display panel.

ついで、上記異方性導電部材の上記液晶表示パネルに貼着された部分から上記離型テープを剥離した後、その基板は上記タブを仮圧着する次工程に搬送される。タブを仮圧着したならば、そのタブを次工程で本圧着し、その後、これらタブに上記回路基板を異方性導電部材によって圧着するということが行われる。   Next, after the release tape is peeled off from the portion of the anisotropic conductive member attached to the liquid crystal display panel, the substrate is transported to the next step of temporarily pressing the tab. If the tabs are temporarily crimped, the tabs are finally crimped in the next step, and then the circuit board is crimped to these tabs with an anisotropic conductive member.

液晶表示パネルや回路基板に貼着された異方性導電テープから離型テープを剥離する際、たとえば剥離ローラを離型テープに係合させ、この剥離ローラを異方性導電部材に沿って移動させることで、上記離型テープを上記異方性導電部材から引き離すようにしている。   When peeling the release tape from the anisotropic conductive tape affixed to the liquid crystal display panel or circuit board, for example, the release roller is engaged with the release tape and the release roller is moved along the anisotropic conductive member. By doing so, the release tape is separated from the anisotropic conductive member.

そのため、離型テープを剥がす力が上記異方性導電テープに加わることが避けられないから、その力によって液晶表示パネルや回路基板に貼着された異方性導電部材が剥離することがあり、そして剥離した異方性導電部材の端部は液晶表示パネルや回路基板から捲くれ上がるということがある。その結果、次工程で上記液晶表示パネルや回路基板に対してタブを確実に圧着できなくなるという問題が生じる。   Therefore, since it is inevitable that the force to peel the release tape is applied to the anisotropic conductive tape, the anisotropic conductive member attached to the liquid crystal display panel or the circuit board may be peeled off by the force, And the edge part of the anisotropically conductive member which peeled may rise up from a liquid crystal display panel or a circuit board. As a result, there arises a problem that the tab cannot be securely crimped to the liquid crystal display panel or the circuit board in the next step.

そこで、液晶表示パネルや回路基板に異方性導電テープを貼着したならば、次工程に送る前に異方性導電部材の端部が捲くれ上がってるいか否かを自動的に検査するということが行なわれている。   Therefore, if an anisotropic conductive tape is attached to a liquid crystal display panel or circuit board, it is automatically inspected whether the end of the anisotropic conductive member is rolled up before sending it to the next process. Has been done.

異方性導電部材の端部の捲くれ上がりを検査する場合、従来は特許文献1に示されているように基板に貼着された異方性導電部材の端部の部分を撮像カメラによって撮像し、その画像の撮像画素を白画素と黒画素とに二値化処理した後、どちらか一方の画素を計数し、その計数値を予め設定された閾値と比較する。   When inspecting the rising of the end of the anisotropic conductive member, conventionally, as shown in Patent Document 1, the end portion of the anisotropic conductive member attached to the substrate is imaged by an imaging camera. Then, after binarizing the imaging pixels of the image into white pixels and black pixels, either one of the pixels is counted, and the counted value is compared with a preset threshold value.

図6は撮像カメラによって撮像された視野範囲の基板及びリードの輝度及びこれらを二値化処理する際に設定される閾値B1を示す。同図において、X1は異方性導電部材が貼着された部分のリードの輝度で、X2は異方性導電部材が貼着されていないリードの輝度を示しており、X3はリード間の基板の地肌の輝度を示している。   FIG. 6 shows the luminance of the substrate and leads in the visual field range imaged by the imaging camera and the threshold value B1 set when binarizing these. In the figure, X1 is the luminance of the lead where the anisotropic conductive member is adhered, X2 is the luminance of the lead where the anisotropic conductive member is not adhered, and X3 is the substrate between the leads. The brightness of the background is shown.

異方性導電部材の端部が捲くれ上がっていれば、捲くれ上がっている部分からリードが露出することになる。リードは光を反射する輝度の高い金属が用いられているから、液晶表示パネルや回路基板などの基板のリードが設けられていない部分に比べて閾値B1よりも高い輝度を有し、二値化処理した場合には白画素となる。   If the end portion of the anisotropic conductive member is curled up, the lead is exposed from the curled up portion. Since the lead is made of a high-brightness metal that reflects light, the lead has a brightness higher than the threshold value B1 compared to a portion of the substrate such as a liquid crystal display panel or circuit board where the lead is not provided, and is binarized. When processed, it becomes a white pixel.

そのため、異方性導電部材の端部が捲くれ上がってリードが露出している場合、その部分は白画素になるから、異方性導電部材が正常に貼着されている場合に比べて白画素数が多くなる。   Therefore, when the end of the anisotropic conductive member is rolled up and the lead is exposed, the portion becomes a white pixel. Therefore, the white portion is compared with the case where the anisotropic conductive member is normally attached. The number of pixels increases.

それによって、白画素と黒画素のどちらか一方の計数値と、予め設定された異方性導電部材が正常に貼着された状態における白画素或いは黒画素の設定値を比較すれば、その差によって異方性導電部材の端部が捲くれ上がっているか否かを判定することができるというものである。
特開2003−75366号公報
Therefore, if the count value of one of the white pixel and the black pixel is compared with the set value of the white pixel or the black pixel when the preset anisotropic conductive member is normally attached, the difference Thus, it can be determined whether or not the end of the anisotropic conductive member is rolled up.
JP 2003-75366 A

ところで、液晶表示パネルや回路基板などの基板にリードを形成する場合、リード形成時の処理むらなどによってリードの輝度にはばらつきが生じるということがある。たとえば、上記リードの表面は、なし地状となっていて輝度が低い場合や光沢面となっていて輝度が高い場合などがある。   By the way, when leads are formed on a substrate such as a liquid crystal display panel or a circuit board, the brightness of the leads may vary due to uneven processing at the time of forming the leads. For example, there are cases where the surface of the lead has a solid shape and the luminance is low, or the surface of the lead is a glossy surface and the luminance is high.

リードの輝度が高い場合、そのリードに異方性導電部材が貼着されていても、異方性導電部材は薄くて透光性を有するため、異方性導電部材によって覆われた部分のリードの輝度が図6に鎖線で示すX4のように閾値B1よりも高くなることがある。   When the brightness of a lead is high, even if an anisotropic conductive member is attached to the lead, the anisotropic conductive member is thin and has translucency, so the lead in the portion covered with the anisotropic conductive member May become higher than the threshold value B1, as indicated by the dotted line X4 in FIG.

そのような状態で、撮像カメラによって異方性導電部材の端部を撮像し、その撮像画像を二値化処理して図7に示すように二値化画像P1を作成すると、異方性導電部材から露出したリードの部分だけでなく、異方性導電部材によって覆われたリードの部分も白画素になってしまう。この場合、黒画素はリード間から露出した基板の部分だけである。   In such a state, when the end portion of the anisotropic conductive member is imaged by the imaging camera and the captured image is binarized to create a binarized image P1 as shown in FIG. Not only the lead portion exposed from the member but also the lead portion covered by the anisotropic conductive member becomes a white pixel. In this case, the black pixel is only the portion of the substrate exposed from between the leads.

そのため、白画素の割合が予め設定された設定値よりも多くなるから、実際には異方性導電部材の端部が捲くれ上がっていないのに、捲くれ上がっているという判定結果になるということがある。   For this reason, since the ratio of white pixels is larger than a preset value, it is determined that the end of the anisotropic conductive member is not raised but actually rises. Sometimes.

この発明はリードの輝度が高い場合であっても、異方性導電部材の端部が捲くれ上がっているか否かを確実に判定することができるようにした基板に貼着されたテープ状部材の検査装置及び検査方法を提供することにある。   This invention is a tape-like member adhered to a substrate that can reliably determine whether or not the end of an anisotropic conductive member is rolled up even when the brightness of the lead is high An inspection apparatus and an inspection method are provided.

この発明は、複数のリードが所定間隔で設けられた基板の側部上面に貼着されるテープ状部材の貼着状態を検査する検査装置であって、
上記基板に貼着された上記テープ状部材の端部の部分を撮像する撮像手段と、
この撮像手段の撮像範囲における上記基板の一部を含む複数のリードにまたがる範囲の輝度を測定するリード明暗測定部と、
このリード明暗測定部が測定した範囲に含まれる上記基板の部分を除く部分の輝度を二値化処理して閾値を設定する二値化閾値設定部と、
この二値化閾値設定部によって設定された閾値に基づいて上記撮像手段の撮像画像を二値化処理する二値化画像作成部と、
この二値化画像作成部によって得られた二値化画像に基づいて上記テープ状部材の端部の状態を判定する判定手段と
を具備したことを特徴とする基板に貼着されたテープ状部材の検査装置にある。
This invention is an inspection device for inspecting the state of attachment of a tape-like member attached to the upper surface of a side surface of a substrate provided with a plurality of leads at predetermined intervals,
Imaging means for imaging an end portion of the tape-like member attached to the substrate;
A lead brightness measurement unit that measures the luminance of a range across a plurality of leads including a part of the substrate in the imaging range of the imaging means;
A binarization threshold setting unit that binarizes the luminance of a portion excluding the portion of the substrate included in the range measured by the lead brightness measurement unit, and sets a threshold;
A binarized image creating unit that binarizes the captured image of the imaging unit based on the threshold set by the binarized threshold setting unit;
A tape-like member affixed to a substrate, comprising: a determination unit that determines a state of an end portion of the tape-like member based on a binarized image obtained by the binarized image creating unit. In the inspection equipment.

上記リード明暗測定部は、上記基板の一部を含む複数のリードにまたがる範囲の輝度を測定し、
上記二値化閾値設定部は、上記リード明暗測定部が測定した範囲に含まれる上記基板の部分を除いて二値化処理することが好ましい。
The lead brightness measurement unit measures the luminance in a range spanning a plurality of leads including a part of the substrate,
It is preferable that the binarization threshold setting unit performs binarization processing except for the portion of the substrate included in the range measured by the lead brightness measurement unit.

上記二値化閾値設定部によって設定される閾値は、上記リード明暗測定部によって測定されたリードの輝度の平均値に係数αを乗じた値であって、
上記係数αは0.8〜0.9であることが好ましい。
The threshold set by the binarization threshold setting unit is a value obtained by multiplying the average value of the luminance of the lead measured by the lead brightness measurement unit by a coefficient α,
The coefficient α is preferably 0.8 to 0.9.

上記判定手段は、
二値化画像作成部によって得られた二値化画像の白画素と黒画素の割合を算出するカウント部と、このカウント部によってカウントされた白画素と黒画素の割合を予め設定された設定値と比較する比較部と、この比較部での比較に基づいて上記テープ状部材の端部の貼着状態を判定する判定部とによって構成されていることが好ましい。
The determination means is
A count unit that calculates the ratio of white pixels and black pixels of the binarized image obtained by the binarized image creation unit, and a preset value that sets the ratio of white pixels and black pixels counted by the count unit It is preferable that it is comprised by the comparison part to compare with and the determination part which determines the sticking state of the edge part of the said tape-shaped member based on the comparison in this comparison part.

この発明は、複数のリードが所定間隔で設けられた基板の側部上面に貼着されるテープ状部材の貼着状態を検査する検査方法であって、
上記基板に貼着された上記テープ状部材の端部の部分を撮像する工程と、
撮像された上記テープ状部材の端部の部分における上記基板の一部を含む複数のリードにまたがる範囲の輝度を測定する工程と、
測定された範囲に含まれる上記基板の部分を除く部分の輝度を二値化処理して閾値を設定する工程と、
設定された閾値に基づいて上記テープ状部材の端部の部分の撮像画像を二値化処理する工程と、
二値化処理によって得られた二値化画像に基づいて上記テープ状部材の端部の状態を判定する工程と
を具備したことを特徴とする基板に貼着されたテープ状部材の検査方法にある。
The present invention is an inspection method for inspecting a sticking state of a tape-like member that is stuck on a side surface of a substrate provided with a plurality of leads at predetermined intervals,
Imaging a portion of the end of the tape-like member attached to the substrate;
Measuring the brightness of a range spanning a plurality of leads including a part of the substrate at the end portion of the imaged tape-shaped member;
A step of binarizing the luminance of a portion excluding the portion of the substrate included in the measured range to set a threshold;
A step of binarizing the captured image of the end portion of the tape-shaped member based on the set threshold;
And a step of determining the state of the end of the tape-shaped member based on the binarized image obtained by the binarization process. is there.

この発明によれば、基板に貼着されたテープ状部材の端部を撮像する際、テープ状部材が貼着されていない部分のリードの輝度を測定し、その輝度に基づいてその都度閾値を設定するため、リードの輝度にばらつきがあっても、その輝度に影響されずにテープ状部材の端部が捲くれてリードが露出しているか否かを確実に判定することが可能となる。   According to this invention, when imaging the end portion of the tape-like member attached to the substrate, the luminance of the lead in the portion where the tape-like member is not attached is measured, and the threshold value is determined each time based on the luminance. Therefore, even if the brightness of the lead varies, it is possible to reliably determine whether or not the lead is exposed because the end of the tape-like member is not affected by the brightness.

以下、この発明の実施の形態を図面を参照しながら説明する。
図1はこの発明の一実施の形態の検査装置1を示すブロック図である。この検査装置1は撮像カメラ2を有する。この撮像カメラ2は図2に示す液晶表示パネルや回路基板などの基板Wの複数のリード3が所定間隔で設けられた一側部の端部を撮像する。
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram showing an inspection apparatus 1 according to an embodiment of the present invention. This inspection apparatus 1 has an imaging camera 2. The imaging camera 2 images an end portion of one side where a plurality of leads 3 of a substrate W such as a liquid crystal display panel or a circuit board shown in FIG. 2 are provided at a predetermined interval.

上記基板Wの一側部にはテープ状部材としての異方性導電部材4が図示しない貼着装置によってほぼ全長にわたって貼着されていて、上記撮像カメラ2は上記異方性導電部材4の端部が視野範囲に入るよう、上記基板Wの一側部の端部を撮像する。上記撮像カメラ2の視野範囲を図2にRで示す。   An anisotropic conductive member 4 as a tape-like member is attached to one side of the substrate W by a sticking device (not shown) over the entire length, and the imaging camera 2 is connected to the end of the anisotropic conductive member 4. The edge part of the one side part of the said board | substrate W is imaged so that a part may enter into a visual field range. The visual field range of the imaging camera 2 is indicated by R in FIG.

図1に示すように、上記撮像カメラ2の撮像信号Sは画像メモリ5に出力されてここに格納される。画像メモリ5に格納された撮像信号Sはリード明暗測定部6に読み出される。このリード明暗測定部6は上記視野範囲R内の図2に示す検出範囲rのリード3の輝度の平均値Mを算出する。上記検出範囲rは異方性導電部材4が貼着されない1つのリード3の一部分であって、上記平均値Mは上記検出範囲rの輝度の平均値となる。   As shown in FIG. 1, the imaging signal S of the imaging camera 2 is output to the image memory 5 and stored therein. The imaging signal S stored in the image memory 5 is read out to the read brightness measurement unit 6. This lead brightness / darkness measurement unit 6 calculates an average value M of the luminance of the lead 3 in the detection range r shown in FIG. The detection range r is a part of one lead 3 to which the anisotropic conductive member 4 is not attached, and the average value M is an average luminance value of the detection range r.

上記リード明暗測定部6で算出された平均値Mは二値化閾値設定部8に読み出される。この二値化閾値設定部8では平均値Mに所定の係数αを乗じた値を閾値B(図3に示す)として設定し、上記画像メモリ5から読み出された視野範囲Rの撮像信号Sを二値化処理する。   The average value M calculated by the read light / darkness measurement unit 6 is read by the binarization threshold value setting unit 8. The binarization threshold value setting unit 8 sets a value obtained by multiplying the average value M by a predetermined coefficient α as a threshold value B (shown in FIG. 3), and the imaging signal S of the visual field range R read from the image memory 5. Is binarized.

上記係数αは0.70〜0.95が好ましく、さらに好ましくは0.80〜0.90であって、この実施の形態では0.85に設定されている。すなわち、係数αは検出範囲rのリード3の輝度を、実際のリード3の輝度よりも低い85%の値に設定する。   The coefficient α is preferably 0.70 to 0.95, more preferably 0.80 to 0.90, and is set to 0.85 in this embodiment. That is, the coefficient α sets the luminance of the lead 3 in the detection range r to a value of 85% lower than the actual luminance of the lead 3.

つまり、係数αを0.85とすることで、閾値Bはリード3の異方性導電部材4が貼着された部分の輝度よりも高い値で、しかも異方性導電部材4から露出したリード3の輝度よりも低い値になるよう、それぞれの基板Wを検査する度に設定される。   That is, by setting the coefficient α to 0.85, the threshold value B is higher than the luminance of the portion of the lead 3 where the anisotropic conductive member 4 is adhered, and the lead exposed from the anisotropic conductive member 4. It is set every time each substrate W is inspected so as to have a value lower than the luminance of 3.

それによって、係数αを乗じて設定される閾値Bは、リード3の輝度に係らず、リード3が異方性導電部材4によって覆われているか否かを確実に判別することができる値となる。なお、閾値Bはリード3間から露出する基板Wの地肌の輝度よりも高い輝度であるから、基板Wの地肌の判別も確実に行なうことができる。   Thereby, the threshold value B set by multiplying by the coefficient α is a value that can reliably determine whether or not the lead 3 is covered with the anisotropic conductive member 4 regardless of the luminance of the lead 3. . Since the threshold value B is higher than the luminance of the background of the substrate W exposed between the leads 3, the background of the substrate W can also be reliably determined.

上記二値化閾値設定部8で二値化処理された撮像信号Sは二値化画像作成部9に読み出され、ここで図4に示す二値化画像Pが作成される。二値化画像作成部9で作成された二値化画像Pはカウント部11に読み出され、ここで二値化画像Pに含まれる白画素数と黒画素数とがカウントされる。   The imaging signal S binarized by the binarization threshold setting unit 8 is read out to the binarized image creating unit 9, where a binarized image P shown in FIG. 4 is created. The binarized image P created by the binarized image creating unit 9 is read out by the counting unit 11, where the number of white pixels and the number of black pixels included in the binarized image P are counted.

そして、白画素数と黒画素数の比率或いは白画素数または黒画素数がカウント信号Cとして上記カウント部11に格納される。この実施の形態では白画素数がカウント信号Cとしてカウント部11に格納されている。   Then, the ratio of the number of white pixels to the number of black pixels or the number of white pixels or the number of black pixels is stored in the count unit 11 as the count signal C. In this embodiment, the number of white pixels is stored in the count unit 11 as the count signal C.

上記カウント部11に格納されたカウント信号Cは比較部12に読み出され、この比較部12で予め設定された設定値Vと比較される。この設定値Vは、予め二値化画像Pにおけるリード3の異方性導電部材4によって覆われた部分及び基板Wの地肌の部分を黒画素とし、リード3の露出した部分を白画素としたときの、白画素の数に応じて設定される。   The count signal C stored in the count unit 11 is read by the comparison unit 12 and is compared with a set value V set in advance by the comparison unit 12. This set value V is a black pixel in the portion of the binarized image P previously covered with the anisotropic conductive member 4 of the lead 3 and the background portion of the substrate W, and a white pixel in the exposed portion of the lead 3. Is set according to the number of white pixels.

したがって、上記カウント信号Cが設定値Vよりも大きければ、黒画素よりも白画素が多いということであるから、異方性導電部材4の端部が捲れてリード3が露出していると判定される。逆に上記設定値Vがカウント信号Cよりも小さければ、白画素よりも黒画素が多いということであるから、異方性導電部材4の端部が捲れていないと判定される。   Therefore, if the count signal C is larger than the set value V, it means that there are more white pixels than black pixels, and therefore it is determined that the end of the anisotropic conductive member 4 is turned and the lead 3 is exposed. Is done. On the contrary, if the set value V is smaller than the count signal C, it means that there are more black pixels than white pixels, and therefore it is determined that the end of the anisotropic conductive member 4 is not rolled.

そして、それらの判定結果が上記比較部12から判定部13に出力され、その判定結果が上記判定部13によって表示或いは警報されて作業者に知らされる。   Then, the determination results are output from the comparison unit 12 to the determination unit 13, and the determination results are displayed or alarmed by the determination unit 13 to notify the operator.

このような構成の検査装置1によれば、異方性導電部材4の端部が捲くれているか否かを検査する場合、撮像カメラ2によって基板Wの一側部に貼着された異方性導電部材4の端部を撮像する。撮像カメラ2の撮像信号Sは画像メモリ5に取り込まれ、リード明暗測定部6に読み出される。   According to the inspection apparatus 1 having such a configuration, when inspecting whether or not the end of the anisotropic conductive member 4 is curled, the anisotropic material adhered to one side of the substrate W by the imaging camera 2 The edge part of the conductive conductive member 4 is imaged. The imaging signal S of the imaging camera 2 is taken into the image memory 5 and read out to the lead brightness measurement unit 6.

上記リード明暗測定部6では、撮像カメラ2の視野範囲Rの異方性導電部材4が貼着されていないリード3の一部を検出範囲rとして抽出し、その検出範囲rの輝度の平均値Mを求める。 In the lead brightness measuring unit 6 extracts a portion of the leads 3 anisotropic conductive member 4 of the field-of-view range R of the imaging camera 2 is not adhered as a detection range r, the average value of the luminance of the detection range r Find M.

そして、二値化閾値設定部8では上記平均値Mに1よりも小さな係数α、この実施の形態ではα=0.85を乗じて閾値Bを設定し、その閾値Bによって二値化画像作成部9で撮像信号Sを白画素と黒画素とに二値化処理し、二値化画像Pを作成する。   Then, the binarization threshold setting unit 8 sets the threshold B by multiplying the average value M by a coefficient α smaller than 1, in this embodiment, α = 0.85. The image signal S is binarized into white pixels and black pixels by the unit 9 to create a binarized image P.

上記閾値Bは、リード3の異方性導電部材4が貼着されていない部分である、検出範囲rの平均輝度に係数αを乗じて設定される。そのため、リード3の輝度が高い場合であっても、その閾値Bは図3に示すようにリード3の異方性導電部材4が貼着されていない露出部分の輝度X2よりも低い値であり、リード3の異方性導電部材4が貼着された部分の輝度X1及び基板Wの地肌の輝度X3よりも高い値である。 The threshold value B is set by multiplying the average luminance of the detection range r, which is a portion where the anisotropic conductive member 4 of the lead 3 is not attached, by a coefficient α. Therefore, even when the luminance of the lead 3 is high, the threshold value B is lower than the luminance X2 of the exposed portion where the anisotropic conductive member 4 of the lead 3 is not attached as shown in FIG. The luminance X1 of the portion where the anisotropic conductive member 4 of the lead 3 is adhered and the luminance X3 of the background of the substrate W are higher.

そのため、二値化画像作成部9で二値化画像Pを作成すれば、図4に示すようにリード3の異方性導電部材4が貼着された部分及びリード3が形成されていない基板Wの地肌の部分は黒画素となり、リード3の異方性導電部材4によって覆われていない部分である、露出したリード3の部分は白画素となる。   Therefore, if the binarized image creating unit 9 creates the binarized image P, the portion where the anisotropic conductive member 4 of the lead 3 is pasted and the substrate on which the lead 3 is not formed as shown in FIG. The portion of the background of W is a black pixel, and the exposed portion of the lead 3 that is not covered by the anisotropic conductive member 4 of the lead 3 is a white pixel.

したがって、基板Wに形成されたリード3の輝度X2が高い場合であっても、リード3が異方性導電部材4によって覆われていれば、その部分の輝度X1は閾値Bよりも小さいため黒画素となり、リード3の異方性導電部材4から露出した部分の輝度X2は閾値Bより大きいため白画素となる。   Therefore, even when the luminance X2 of the lead 3 formed on the substrate W is high, if the lead 3 is covered with the anisotropic conductive member 4, the luminance X1 of the portion is smaller than the threshold value B, and thus the black. Since the luminance X2 of the portion exposed from the anisotropic conductive member 4 of the lead 3 is larger than the threshold value B, it becomes a white pixel.

そのため、二値化画像作成部9で作成される二値化画像Pに含まれる白画素の数は、リード3の異方性導電部材4が貼着されていない部分及び異方性導電部材4が捲くれた部分だけとなり、リード3の輝度X2が高くなることで、従来のように白画素が増大するということがないから、カウント部11でカウントされた二値化画像Pの白画素の数を比較部12で設定値Vと比較すれば、異方性導電部材4が捲くれているか否かを確実に判定することができる。   Therefore, the number of white pixels included in the binarized image P created by the binarized image creation unit 9 is the portion where the anisotropic conductive member 4 of the lead 3 is not attached and the anisotropic conductive member 4. As the brightness X2 of the lead 3 is increased and the white pixels are not increased as in the conventional case, the white pixels of the binarized image P counted by the count unit 11 are not increased. When the number is compared with the set value V by the comparison unit 12, it can be reliably determined whether or not the anisotropic conductive member 4 is bald.

上記一実施の形態ではリード明暗測定部6によって測定するリード3の輝度の平均値Mを、撮像カメラ2の視野範囲Rから1つのリード3の一部分を検出範囲rとして抽出して測定するようにしたが、図5に示すように基板Wの地肌の部分を含む複数のリード3の部分を検出範囲r´として抽出する。   In the above embodiment, the average value M of the luminance of the lead 3 measured by the lead light / darkness measuring unit 6 is measured by extracting a part of one lead 3 from the visual field range R of the imaging camera 2 as the detection range r. However, as shown in FIG. 5, the portions of the plurality of leads 3 including the background portion of the substrate W are extracted as the detection range r ′.

そして、検出範囲r´のうちから、基板Wの地肌の部分を除く複数のリード3の部分の輝度の平均値Mを求め、その平均値Mに係数αを乗じて閾値Bを設定するようにしてもよい。   Then, from the detection range r ′, the average value M of the luminance of the portions of the leads 3 excluding the background portion of the substrate W is obtained, and the threshold value B is set by multiplying the average value M by the coefficient α. May be.

このように検出範囲r´を複数のリード3にまたがる範囲とすることで、たとえば基板Wや撮像カメラ2の位置決め精度が低下し、抽出される検出範囲r´にずれが生じてその範囲に含まれる基板Wの地肌の面積の割合が変化しても、基板Wの輝度を除外するため、リード3の輝度の平均値Mを高い精度で求めることができる。   Thus, by setting the detection range r ′ to a range that spans the plurality of leads 3, for example, the positioning accuracy of the substrate W and the imaging camera 2 is reduced, and the extracted detection range r ′ is shifted and included in the range. Even if the ratio of the surface area of the substrate W to be changed changes, the luminance M of the leads 3 can be obtained with high accuracy in order to exclude the luminance of the substrate W.

この発明の一実施の形態を示す検査装置のブロック図。1 is a block diagram of an inspection apparatus showing an embodiment of the present invention. 撮像カメラの視野範囲から検出範囲を抽出するときの説明図。Explanatory drawing when extracting a detection range from the visual field range of an imaging camera. 検出範囲の輝度の平均値から設定された閾値と、視野範囲の基板及びリードの輝度の関係を示す図。The figure which shows the relationship between the threshold value set from the average value of the brightness | luminance of a detection range, and the brightness | luminance of the board | substrate of a visual field range, and a lead | read | reed. 設定された閾値に基づいて視野範囲の撮像信号を二値化処理して得られた二値化画像を示す図。The figure which shows the binarized image obtained by binarizing the imaging signal of a visual field range based on the set threshold value. この発明の他の実施の形態を示す撮像カメラの視野範囲から検出範囲を抽出するときの説明図。Explanatory drawing when extracting a detection range from the visual field range of the imaging camera which shows other embodiment of this invention. 従来の閾値と、撮像カメラの視野範囲の基板及びリードの輝度の関係を示す図。The figure which shows the relationship between the conventional threshold value and the brightness | luminance of the board | substrate of a visual field range of an imaging camera, and a lead | read | reed. 従来のリードの輝度が高い場合に得られる二値化画像の図。The figure of the binarized image obtained when the brightness | luminance of the conventional lead is high.

符号の説明Explanation of symbols

2…撮像カメラ(撮像手段)、3…リード、4…異方性導電部材、5…画像メモリ、6…リード明暗測定部、8…二値化閾値設定部、9…二値化画像作成部、11…カウント部(判定手段)、12…比較部(判定手段)、13…判定部(判定手段)。   DESCRIPTION OF SYMBOLS 2 ... Imaging camera (imaging means), 3 ... Lead, 4 ... Anisotropic conductive member, 5 ... Image memory, 6 ... Lead brightness measurement part, 8 ... Binarization threshold value setting part, 9 ... Binarization image creation part 11... Counting unit (determination unit) 12... Comparison unit (determination unit) 13.

Claims (4)

複数のリードが所定間隔で設けられた基板の側部上面に貼着されるテープ状部材の貼着状態を検査する検査装置であって、
上記基板に貼着された上記テープ状部材の端部の部分を撮像する撮像手段と、
この撮像手段の撮像範囲における上記基板の一部を含む複数のリードにまたがる範囲の輝度を測定するリード明暗測定部と、
このリード明暗測定部が測定した範囲に含まれる上記基板の部分を除く部分の輝度を二値化処理して閾値を設定する二値化閾値設定部と、
この二値化閾値設定部によって設定された閾値に基づいて上記撮像手段の撮像画像を二値化処理する二値化画像作成部と、
この二値化画像作成部によって得られた二値化画像に基づいて上記テープ状部材の端部の状態を判定する判定手段と
を具備したことを特徴とする基板に貼着されたテープ状部材の検査装置。
An inspection device for inspecting the attached state of a tape-like member attached to the upper surface of a side surface of a substrate provided with a plurality of leads at predetermined intervals,
Imaging means for imaging an end portion of the tape-like member attached to the substrate;
A lead brightness measurement unit that measures the luminance of a range across a plurality of leads including a part of the substrate in the imaging range of the imaging means;
A binarization threshold setting unit that binarizes the luminance of a portion excluding the portion of the substrate included in the range measured by the lead brightness measurement unit, and sets a threshold;
A binarized image creating unit that binarizes the captured image of the imaging unit based on the threshold set by the binarized threshold setting unit;
A tape-like member affixed to a substrate, comprising: a determination unit that determines a state of an end portion of the tape-like member based on a binarized image obtained by the binarized image creating unit. Inspection equipment.
上記二値化閾値設定部によって設定される閾値は、上記リード明暗測定部によって測定されたリードの輝度の平均値に係数αを乗じた値であって、
上記係数αは0.8〜0.9であることを特徴とする請求項1記載の基板に貼着されたテープ状部材の検査装置。
The threshold set by the binarization threshold setting unit is a value obtained by multiplying the average value of the luminance of the lead measured by the lead brightness measurement unit by a coefficient α,
2. The inspection apparatus for a tape-like member adhered to a substrate according to claim 1, wherein the coefficient [alpha] is 0.8 to 0.9.
上記判定手段は、
二値化画像作成部によって得られた二値化画像の白画素と黒画素の割合を算出するカウント部と、このカウント部によってカウントされた白画素と黒画素の割合を予め設定された設定値と比較する比較部と、この比較部での比較に基づいて上記テープ状部材の端部の貼着状態を判定する判定部とによって構成されていることを特徴とする請求項1記載の基板に貼着されたテープ状部材の検査装置。
The determination means is
A count unit that calculates the ratio of white pixels and black pixels of the binarized image obtained by the binarized image creation unit, and a preset value that sets the ratio of white pixels and black pixels counted by the count unit The substrate according to claim 1, comprising: a comparison unit that compares with a determination unit that determines a sticking state of an end portion of the tape-shaped member based on comparison in the comparison unit. Inspection device for stuck tape-like members.
複数のリードが所定間隔で設けられた基板の側部上面に貼着されるテープ状部材の貼着状態を検査する検査方法であって、
上記基板に貼着された上記テープ状部材の端部の部分を撮像する工程と、
撮像された上記テープ状部材の端部の部分における上記基板の一部を含む複数のリードにまたがる範囲の輝度を測定する工程と、
測定された範囲に含まれる上記基板の部分を除く部分の輝度を二値化処理して閾値を設定する工程と、
設定された閾値に基づいて上記テープ状部材の端部の部分の撮像画像を二値化処理する工程と、
二値化処理によって得られた二値化画像に基づいて上記テープ状部材の端部の状態を判定する工程と
を具備したことを特徴とする基板に貼着されたテープ状部材の検査方法。
It is an inspection method for inspecting the attached state of a tape-like member attached to the upper surface of a side portion of a substrate provided with a plurality of leads at a predetermined interval,
Imaging a portion of the end of the tape-like member attached to the substrate;
Measuring the brightness of a range spanning a plurality of leads including a part of the substrate at the end portion of the imaged tape-shaped member;
A step of binarizing the luminance of a portion excluding the portion of the substrate included in the measured range to set a threshold;
A step of binarizing the captured image of the end portion of the tape-shaped member based on the set threshold;
And a step of determining a state of an end portion of the tape-shaped member based on a binarized image obtained by the binarization process. A method for inspecting a tape-shaped member attached to a substrate.
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