JP4989198B2 - Transfer apparatus and transfer method - Google Patents

Description

  The present invention relates to a transfer apparatus and a transfer method, and in particular, a transfer apparatus (fine transfer apparatus) and a transfer method (fine transfer) for forming a fine pattern shape using a precise mold by an imprint method using a lithography technique. Method).

In recent years, a mold (template, stamper) is manufactured by forming an ultra-fine transfer pattern on a quartz substrate or the like by an electron beam drawing method, and the mold is predetermined on a resist film formed on the surface of the transfer substrate as a molded product. Research and development has been conducted on nanoimprint technology for transferring a transfer pattern formed on the mold by pressing with a pressure of (see Patent Document 1 and Non-Patent Document 1).

  Conventionally, a transfer apparatus 100 as shown in FIG. 6 is known as an apparatus for performing transfer by the nanoimprint technique.

  The transfer apparatus 100 includes a base frame 3, a mold holder 5 that holds the mold M and is movably provided on the base frame 3, and a molded product holder 7 that holds a molded product W. Has been. Further, when the rotation output shaft of the servo motor 9 rotates, the nut of the ball screw 11 rotates about the axis CL1, and the screw shaft of the ball screw 11 approaches the molded product holding body 7 together with the mold holding body 5. -It moves in the direction away (Z-axis direction).

  The servo motor 9 is provided with a rotary encoder 13 so that the rotation angle of the nut of the ball screw 11 (rotation output shaft of the servo motor 9) can be detected.

  Then, under the control of the control device 102, while performing feedback control based on the detection result of the rotary encoder 13, the mold holder 5 is appropriately moved and the mold M is brought into contact with the workpiece W as appropriate, for example, as described later. In the case of the UV imprinting method, ultraviolet light (UV light) generated by an ultraviolet ray generator (not shown) is applied to the product W as indicated by an arrow to perform transfer.

  By the way, molding methods for generating a fine transfer pattern on the product W by transfer are roughly classified into a thermal imprint method and a UV imprint method.

  In the thermal imprint method, the molded product W is pressed with a mold M and heated to a temperature at which a resin (molded layer) made of a thermoplastic polymer or a thermosetting polymer can flow sufficiently to form a fine pattern. After injecting the resin, in the case of a thermoplastic polymer, the mold M and the resin are cooled to below the glass transition temperature to solidify the fine pattern transferred to the molded product W (molded layer). Later, the mold M is pulled away from the product W. On the other hand, in the case of a thermosetting polymer, the molded product W is pressed by the mold M to cause the resin to flow into the fine pattern, and then the temperature of the resin is raised to cause thermosetting. After this thermosetting, the mold M is pulled away from the molded product W, and the molded product on which the fine pattern is formed is cooled.

  In the UV imprint method, a transparent mold M that transmits light is used. The mold M is pressed against a UV curable liquid (molded layer of the molded product W) and irradiated with UV light for an appropriate period of time. After the liquid is cured (solidified), the mold M is separated from the product W.

  Even if any of the above-described methods is adopted, the mold M is brought close to the molded product W (appropriately brought into contact), an appropriate pressure is applied to the resin (molded layer), and the fine pattern of the mold M (transfer pattern) It is necessary to allow the resin to flow into the recesses.

  That is, when pressing the molded product W (molded layer; resin) with the mold M, in order to transfer the fine pattern of the mold M to the resin accurately, both surfaces are brought into close and uniform contact. It is necessary to precisely control the pressure for pressing the position of the mold M with respect to the molded product W (the distance between the mold M and the molded product W).

  For this reason, using a precise servo control system using the ball screw 11 and the servo motor 9, the mold M is moved so as to approach the workpiece W while being fed back (position controlled) by the rotary encoder 13. When the distance between M and the workpiece W reaches a specific value, the servo control system is switched from the position control mode to the force control mode and the workpiece M is pressed with the mold M. Has been.

  The depth T1 (see FIG. 4A) of the fine pattern transferred by the imprint method is a very small value (several tens of nanometers to several tens of micrometers). In order to accurately transfer this fine pattern shape to the molding layer B2 made of a thin resin, the transfer device 100 can perform accurate positioning control (position control) in the position control mode and accurate in the force control mode. It is necessary to perform pressure control.

  The pressure control is performed by pressing the mold M against the workpiece W with the ball screw 11, detecting the pressing force with a load sensor such as a load cell (not shown), and feeding back the detected value to the pressure control loop of the control device 102. The torque generated by the servo motor 9 is accurately controlled. Normally, when a specific pattern pressure is applied to the molded product W made of resin, the accuracy of the shape of the fine pattern transferred to the molded product W can be kept substantially constant.

On the other hand, in the case of position control, positioning of the mold M is performed using the ball screw 11, the servo motor 9, and the rotary encoder 13. That is, from the value detected by the rotary encoder 13 attached to the servo motor 9 (for example, the rotation angle of the nut of the ball screw 11 directly connected to the rotation output shaft of the servo motor 9), the mold M (the mold holding body 5) The position is obtained, and the obtained value is fed back to the position control loop of the control device 102 to control the position of the mold M. FIG. 7 shows waveforms of position control and torque control.
JP 2004-34300 A Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  By the way, in the thermal imprinting method, the layer to be molded is usually heated to a high temperature and a high pressure is applied to the mold M to perform molding (transfer). (Movement) operation is performed by position control, and thereafter, the molded product W is pressed by the mold M by torque control (pressure control) to perform molding. For this reason, pressure control plays a major role in molding (transferring).

  On the other hand, in the UV imprint method, since the layer to be molded (ultraviolet curable resin having a low viscosity, etc.) is cured with UV light, the mold M and the molded product W (molded layer) are not heated and molded by the mold M. The layer will be pressed with a weak pressure. Therefore, the role of position control is greater than that of the thermal imprint method. In particular, when an optical fine pattern is molded, the thickness of the molded fine pattern (layer to be formed on which the fine pattern is formed) has an important meaning in terms of optical characteristics. For this reason, in order to always mold an optical component having a certain characteristic, it is necessary to accurately position the mold M with respect to the molding target W.

  However, as shown by graph G3 in FIG. 8, the ball screw 11 has an inherent undulation error with a thread lead cycle. A graph G1 shown in FIG. 8 is obtained when there is no inherent swell error. There are also thermal deformations of the ball screw 11 and the like due to heat generated by the ball screw 11 and the servo motor 9, and assembly errors of the ball screw 11 and the like.

  Since such an error exists, it is difficult to position the mold M with high accuracy so as to perform imprint (transfer) on a highly accurate component (molded product W) only by performing feedback control with the rotary encoder 13. .

  Therefore, when transferring a fine transfer pattern formed on the mold M to the product W, there is a problem that it is difficult to perform transfer with high accuracy. This problem may occur not only in the UV imprint method but also in the thermal imprint method.

  The present invention has been made in view of the above problems, and in a transfer apparatus and transfer method for transferring a fine transfer pattern formed on a mold to a molded product, transfer capable of performing accurate transfer. An object is to provide an apparatus and a transfer method.

The invention according to claim 1 is provided in the base frame, the molded product holding body that holds the molded product, and moves in a direction approaching or separating from the molded product holding body. As described above, a mold holder that holds a mold on which a fine transfer pattern is formed, a driving means for moving the mold holder, and a movement stroke of the mold holder over the entire length of the mold holder. The first measuring means for measuring the distance between the mold holder and the molded article holder, and the displacement sensor attached to at least one of the mold holder and the molded article holder, A second measuring means for measuring the distance between the mold holder and the molded article holder only when the mold holder approaches the molded article holder, and is held by the mold holder. And the type From the state where the molded product held by the molded product holding body is separated from each other, the mold holding body is brought close to the molded product holding body by the driving unit, and the mold is moved by the first measuring unit. When it is measured that the molded product has reached a position where it contacts each other, or the mold held by the mold holder and the molded product held by the molded product holder From the state where they are separated from each other, the driving means brings the mold holder closer to the molded article holder, and the first measuring means moves the distance between the mold holder and the molded article holder. Is measured by the second measuring means when the distance between the mold holder and the molded article holder is measured. The measured value of the first measuring means is corrected by this measured value, and the driving means The mold holder is further moved, and the first measuring means detects that the distance between the mold and the molded product has reached a target value when transferring to the molded product with the mold. And a control unit that controls the driving unit so as to stop the movement of the mold holding member and hold the position when the mold holding member is moved.

According to a second aspect of the present invention, there is provided a base frame, a mold holder that is provided on the base frame and holds a mold on which a fine transfer pattern is formed, and a direction in which the mold holder approaches or separates from the mold holder. The molded product holder, which is provided on the base frame so as to be moved at a position, holds the molded product, driving means for moving the molded product holder, and the movement stroke of the molded product holder. By a first measuring means for measuring the distance between the molded product holder and the mold holder over the entire length, and a displacement sensor attached to at least one of the molded product holder and the mold holder A second measuring means for measuring a distance between the molded product holder and the mold holder only when the molded product holder approaches the mold holder; and the molded product holder Held in From the state where the molded product to be molded and the mold held by the mold holding body are separated from each other, the driving means brings the molded product holding body close to the mold holding body, and the first measuring means When it is measured that the molded product and the mold have reached a position where they come into contact with each other, or the molded product held by the molded product holder and held by the mold holder From the state where the molds are separated from each other, the driving means brings the molded product holder closer to the mold holding body, and the first measuring unit uses the mold holding body and the molded product holder. When it is measured that the distance between them is within a range measurable by the second measuring means, the distance between the molded product holder and the mold holder is measured by the second measuring means. While the measurement is being performed, the molded product holder is further moved by the driving means, and the second meter When the means detects that the distance between the mold and the molded article has reached a target value when transferring to the molded article with the mold, the movement of the molded article holding body is performed. And a control unit that controls the driving unit to stop and hold the position.

According to a third aspect of the present invention, there is provided a base frame, a mold holder provided on the base frame and holding a mold on which a fine transfer pattern is formed, and a direction approaching or separating from the mold holder. The molded product holder, which is provided on the base frame so as to be moved at a position, holds the molded product, driving means for moving the molded product holder, and the movement stroke of the molded product holder. By a first measuring means for measuring the distance between the molded product holder and the mold holder over the entire length, and a displacement sensor attached to at least one of the molded product holder and the mold holder A second measuring means for measuring a distance between the molded product holder and the mold holder only when the molded product holder approaches the mold holder; and the molded product holder Held in From the state where the molded product to be molded and the mold held by the mold holding body are separated from each other, the driving means brings the molded product holding body close to the mold holding body, and the first measuring means When it is measured that the molded product and the mold have reached a position where they come into contact with each other, or the molded product held by the molded product holder and held by the mold holder From the state where the molds are separated from each other, the driving means brings the molded product holder closer to the mold holding body, and the first measuring unit uses the mold holding body and the molded product holder. When it is measured that the distance between them is within the range measurable by the second measuring means, the distance between the mold holder and the molded article holder is measured by the second measuring means. Measure, correct the measured value of the first measuring means by this measured value, and drive The molded product holder is further moved in stages, and the distance between the mold and the molded product reaches the target value when the mold is transferred to the molded product by the mold in the first measuring means. when it was has been detected, a transfer device and a control means for controlling said drive means so as to retain its position stopping the movement of the HiNaru type article carrier.

Invention of Claim 4 is the transfer method to a to-be-molded product using the type | mold performed using the transfer apparatus of any one of Claims 1-3 .

  According to the present invention, in the transfer apparatus and transfer method for transferring a fine transfer pattern formed on a mold to a molding object, there is an effect that accurate transfer can be performed.

  FIG. 1 is a front view showing a schematic configuration of a transfer apparatus 1 according to an embodiment of the present invention.

  In the present specification, for convenience of explanation, one horizontal direction is defined as the X-axis direction, the other horizontal direction and the direction perpendicular to the X-axis direction is defined as the Y-axis direction, The vertical direction is the Z-axis direction.

  The transfer device (nanoimprint device) 1 is a device for transferring a fine pattern (for example, a concavo-convex pattern) formed on the surface of the mold M onto the surface of the product W, as in the case of the conventional transfer device 100. 3, a mold holder 5 that holds the mold M and is movably provided on the base frame 3, and a molded product holder 7 that holds the molded product W. When the rotation output shaft of an actuator (for example, servo motor) 9 which is an example of driving means for moving the mold holder 5 rotates, the nut of the ball screw 11 rotates about the axis CL1, and the screw shaft of the ball screw 11 is rotated. Moves together with the mold holder 5 in a direction (Z-axis direction) approaching and separating from the molded article holder 7.

  Further, the transfer device 1 is provided with a first measuring means for measuring the distance between the mold holder 5 and the molded article holder 7 over the entire length of the movement stroke of the mold holder 5. Specifically, the rotary encoder 13 is provided in the servo motor 9, and the position of the mold holder 5 can be measured by detecting the rotation angle of the nut of the ball screw 11 (rotation output shaft of the servo motor 9). It is like that.

  Then, while performing feedback control based on the detection result of the rotary encoder 13 under the control of the control device 2, the mold holder 5 is appropriately moved and the mold M is appropriately brought into contact with the workpiece W, for example, UV imprinting. In the case of the method, the ultraviolet ray (UV light) generated by an ultraviolet ray generator (not shown) is irradiated to the molded product W as indicated by an arrow to perform transfer.

  The mold holder 5 is provided on the base frame 3 so as to be movable in the Z-axis direction via, for example, a linear guide bearing (not shown). The nut of the ball screw 11 is rotatably provided on the base frame 3 via a bearing 15, and the nut of the ball screw 11 is integrally connected to the rotation output shaft of the servo motor 9 via a coupling or the like. . The screw shaft of the ball screw 11 is engaged with the nut of the ball screw 11, and the lower end is provided integrally with the mold holding body 5.

  The molded product holder 7 is provided integrally with the base frame 3, but the molded product holder 7 is controlled in the X-axis direction and the Y-axis direction by an actuator such as a servo motor under the control of the control device 2. It may be configured to be appropriately movable and positionable. Further, as in the conventional transfer device 100, a load cell may be provided to detect the pressing force of the product W by the mold M and perform pressure control.

  Here, the molded product W and the mold M will be described in detail.

  The to-be-molded product W that has been transferred is used as a light guide plate for a backlight of a CD-ROM, a DVD-ROM, or a liquid crystal display device. Further, the molded product W is formed in, for example, a circular or rectangular flat plate shape. Also, the base material B1 made of a resin such as polycarbonate and having a predetermined thickness, and the base material B1 It is comprised by the to-be-molded layer B2 provided in one surface of the thickness direction (refer Fig.4 (a)).

  As the molding layer B2, for example, an ultraviolet curable resin (UV curable resin), a thermosetting resin, or the like can be considered. In the present specification, the UV curable resin will be described as an example.

  The mold M is formed of, for example, quartz glass in a circular or rectangular flat plate shape, and a fine transfer pattern is formed on one surface in the thickness direction. More specifically, as shown in FIG. 4A, a plurality of recesses M1 are formed on the lower surface of the mold M (the lower surface when the mold M is installed in the transfer device 1). In addition, although the depth T1 of the transfer pattern (recessed portion M1) varies depending on the type of the mold M, as described above, it is several tens of nanometers to several tens of micrometers (micrometer). For example, the thickness T2 of the molding layer B2 before the mold M contacts the molding target W for transfer is larger than the transfer pattern depth T1.

  A horizontal plane is formed in the lower part of the mold holder 5, and the mold M is integrally attached to this plane. Further, a horizontal plane is also formed on the upper part of the molded product holder 7, and the molded product W is integrally attached to this plane. Then, the lower surface of the mold M (surface on which a fine transfer pattern is formed and expanded in the horizontal direction) and the upper surface of the molded product W (layer to be molded B2 is formed and parallel to the lower surface of the mold M in the horizontal direction). And the upper surface of the base material B1 that is facing each other.

  Further, the transfer device 1 is provided with a second measuring means. This second measuring means is used when the mold holder 5 approaches the molded article holder 7 by the displacement sensor 17 attached directly to at least one of the mold holder 5 and the molded article holder 7. Only the distance D1 (see FIG. 1) between the mold holder 5 and the molded article holder 7 can be directly measured with higher accuracy and higher resolution than the first measuring means. It is configured. The position of the mold holder 5 is feedback-controlled by the displacement sensor 17.

  More specifically, a relative distance measuring sensor (displacement sensor) is placed on a sample table to which the molded product W is attached (on the upper surface of the molded product holding body 7 other than the place where the molded product W is installed). ) 17 is attached integrally. As the displacement sensor 17, for example, a reflective CCD laser displacement sensor is employed, and an output signal of the reflective CCD laser displacement sensor is input to the control device 2 via the sensor controller 19.

  The displacement sensor 17 is disposed to face a reflecting member (reflecting plate) 21 that is integrally attached to the lower surface of the mold holder 5. A linear signal as shown in FIG. 3 is output at a distance in a range of ± several mm centered on a specific measurement distance.

  As the reflective CCD laser displacement sensor 17, for example, a high-precision CCD laser displacement sensor LK-G35 manufactured by Keyence Corporation is used. A signal can be output with a resolution of 05 μm. The resolution and measurement accuracy of the displacement sensor 17 are preferably smaller than the depth T1 of the transfer pattern (recessed portion M1) shown in FIG. 4A, for example, about 1/10 to 1/2 of the depth T1. It is desirable that

  Then, the mold is held when the mold M has moved to the closed position (which will be described in detail later, but the mold M and the molding layer B2 of the molding product W start to contact each other). The displacement sensor 17 is provided so that the distance between the body 5 and the molded article holding body 7 substantially matches the measurement center distance of the displacement sensor 17.

  In addition, although the displacement sensor 17 may be provided directly in the to-be-molded product holding body 7, it may be attached using fixing tools, such as a bracket. Moreover, the structure by which the displacement sensor 17 is attached to the side instead of the upper surface of the to-be-molded product holding body 7 may be sufficient. Moreover, the structure which attached the displacement sensor 17 to the type | mold holder 5 and provided the reflecting plate in the to-be-molded product holder 7 may be sufficient. Furthermore, instead of the non-contact type CCD laser displacement sensor described above, a contact type sensor may be employed as the displacement sensor 17. Moreover, you may employ | adopt an LED displacement sensor, an ultrasonic sensor, etc. as a non-contact-type displacement sensor.

  The control device 2 holds the mold by the driving means from the state in which the mold M held by the mold holder 5 and the molded article W held by the molded article holder 7 are separated from each other. When it is measured that the body 5 is brought close to the molded product holding body 7 and the first measuring means has reached the position where the mold M and the molded product W are in contact with each other (closed position of the mold M), Switching is performed such that the distance between the mold holder 5 and the molded article holder 7 is measured by the displacement sensor 17.

  Further, after the switching, the mold holding body 5 is further moved by the driving means, and the distance when the distance between the mold M and the molded product W is transferred to the molded product W by the mold M is transferred by the displacement sensor 17. When it is detected that the value has been reached, the driving means is controlled so as to stop the movement of the mold holder 5 and hold the position.

  Then, in a state where the movement of the mold holder 5 is stopped and the position is held, ultraviolet rays are irradiated as shown by arrows in FIG. 1 to cure the molding layer B2 of the molding product W and perform transfer. ing.

  Here, the mode when the mold M is brought close to the workpiece W for transfer will be described with reference to FIG. As understood from FIG. 4A and the like, in a state where the mold M and the molded product W are installed in the transfer apparatus 1, the surface on which the transfer pattern of the mold M is provided and the molded product W As described above, they are parallel to each other.

  First, it is assumed that the mold M is separated from the molded product W, and the mold M and the base material B1 of the molded product W are separated by a predetermined distance h1 (see FIG. 4A). From this state, when the mold holder 5 is lowered to bring the mold M closer to the product W, the top M2 of the transfer pattern of the mold M and the base of the product W are shown in FIG. The distance from the material B1 becomes h2, and the top M2 of the transfer pattern comes into contact (becomes in contact) with the molding layer B2. In this contacted state, the molding layer B2 may not enter the recess M1 of the mold M.

  When the die holder 5 is further lowered from the state shown in FIG. 4B to bring the die M closer to the product W, as shown in FIG. The distance between the molded product W and the base material B1 is h3, and the molding layer B2 enters all the concave portions M1 of the mold M.

  When the mold holder 5 is further lowered from the state shown in FIG. 4C and the mold M is brought closer to the molding target W, as shown in FIG. The distance between the molded product W and the base material B1 is h4. As described above, when the distance between the top M2 of the transfer pattern and the base material B1 of the molded product W is h4, the distance between the mold M and the molded product W is transferred. It is assumed that the target value is reached. In the state shown in FIG. 4D, ultraviolet rays (UV light) are irradiated to cure the molding layer B2, and transfer to the molding product W by the mold M is performed. As a matter of course, when the distance between the mold M and the workpiece W (base material B1) is the target value when performing the transfer, the mold holding the mold M is used. The distance between the holding body 5 and the molding target holding body 7 holding the molding target W is also a target value when performing the transfer.

  Here, the stroke of the mold holder 5 will be described. Since the mold M is installed integrally with the mold holder 5, the stroke of the mold M can be considered in the same manner as the stroke of the mold holder 5.

  FIG. 2 is a diagram schematically illustrating the stroke of the mold holder 5.

  The total stroke (hereinafter simply referred to as “stroke”) of the mold holder 5 is referred to as “S”. The mold holder 5 moves between the upper limit position Pu and the lower limit position Pd. Since the transfer is performed in a state where the mold M and the molded product W are in contact with each other, the transfer from the mold M to the molded product W is performed when the mold holder 5 is located near the molded product holder 7. Made when you are. That is, for example, transfer is performed when the mold holder 5 is positioned below the stroke S.

  Further, as shown in FIG. 4 (d), when the distance between the mold M and the base material B1 of the molded product W reaches the target value “h4”, the mold holder 5 is shown in FIG. It is located at the target position Pm1.

  In FIG. 2, the position (mold M closed position) Pu <b> 1 of the mold holder 5 when the mold holder 5 exists slightly above the target position Pm <b> 1 is that of the mold M and the workpiece W. It is a position where the molding layer B2 is in contact with each other and the mold M is a position farther from the molding target W (base material B1) than the target value h4.

  More specifically, as described above, the closed position Pu1 of the mold M is the position of the mold M as shown in FIG. Note that the position of the mold M as shown in FIG. 4C may be adopted as the closed position Pu1 of the mold M. Furthermore, as the closed position Pu1 of the mold M, a position of the mold M is adopted in which the distance between the mold M and the workpiece W is the distance between FIG. 4B and FIG. 4C. Also good.

  At the contact position Pd1 between the mold M and the base material B1 shown in FIG. 2, the mold M further approaches the base material B1 from the state shown in FIG. 4D, and the mold M and the base material B1 come into contact with each other (see FIG. 2). The distance h4 shown in 4 (d) becomes “0”).

  The range Ms that can be detected by the displacement sensor 17 is, for example, an upper range Lu and a lower range Ld in which the closed position Pu1 of the mold M is substantially in the center. The position of the mold holding body 5 in the range from the closed position Pu1 to the target position Pm1 to the contact position Pd1 of the mold M is measured in the lower range Ld.

  Since the closed position Pu1 of the mold M is substantially in the center, the upper range Lu and the lower range Ld are substantially equal to each other, but it is not always necessary to do this, and the range Lu> range Ld may be sufficient, and range Lu <range Ld may be sufficient.

  In short, when the distance between the mold M and the base material B1 of the molded product W is the target value for transfer or slightly away from this target value (the mold holder 5 is covered for transfer). If the displacement sensor 17 can measure the distance between the molded product holding body 7 and the mold holding body 5 only when the molded product holding body 7 is approaching a predetermined distance; Good. More specifically, it is sufficient that at least the detectable range Ms of the displacement sensor 17 covers the closed position Pu1 and the target position Pm1 of the mold M. That is, the distance between the mold M and the base material B1 when the mold holding body 5 is located between the closed position Pu1 and the target position Pm1 of the mold M can be detected by the displacement sensor 17. It only has to be.

  Even when it is measured by the rotary encoder 13 that the mold holder 5 has moved to the position where the mold M is closed, the actual position of the mold holder 5 has a waviness error as shown in FIG. However, it is necessary to define a range that can be detected by the displacement sensor 17 in consideration of such a shift.

  By the way, depending on the type (especially thickness) of the mold M and the type (particularly thickness) of the molded product W, as shown in FIGS. 5 (a) and 5 (b), the closed position Pu1, the target position Pm1, Although the contact position Pd1 changes, it is desirable that the detectable range Ms of the displacement sensor 17 is set on the assumption that the contact position Pd1 changes in this way.

  The mold holding body 5 is molded by the driving means from the state where the mold M held by the mold holding body 5 and the molded article W held by the molded article holding body 7 are separated from each other. It was measured that the distance between the mold holder 5 and the molded article holder 7 was within the range measurable by the second measuring means, approaching the article holder 7 by the first measuring means. Sometimes (when the distance is slightly smaller than the maximum detection distance of the displacement sensor 17), switching is performed such that the distance between the mold holder 5 and the molded article holder 7 is measured by the displacement sensor 17. It may be a configuration.

  In the transfer device 1, the mold holder 5 is moved in the Z-axis direction, but instead of or in addition to the mold holder 5, the molded product holder 7 is moved and positioned in the Z-axis direction. May be. Further, when the molded product holder 7 is configured to move and position in the X-axis and Y-axis directions, the mold holder 5 is moved in the X-axis and Y-axis directions instead of or in addition to the molded product holder 7. The structure which positions may be sufficient. Further, the mold holder 5 may move in the horizontal direction instead of the Z-axis direction.

  Next, the operation of the transfer device 1 will be described.

  First, as an initial state, a mold M is installed on the mold holder 5, a molded product W before transfer is installed on the molded article holder 7, and the mold holder 5 is positioned above the mold M. Is separated from the product W.

  From this initial state, the servo motor 9 is driven under the control of the control device 2, the mold holder 5 is lowered while feedback control is performed by the rotary encoder 13, and the rotary encoder 13 indicates that the mold M has reached the closed position. Is detected, the position of the mold holder 5 is detected by the displacement sensor 17 and feedback control is performed.

  When the distance between the mold M and the product to be molded W reaches a target value at the time of transfer, the movement of the mold holding body 5 is stopped, this position is held, and ultraviolet rays are irradiated. Thus, the molding layer B2 of the molding product W is cured. Thereafter, the mold holder 5 is raised, and the mold M is pulled away from the molded product W.

  According to the transfer apparatus 1, the distance between the molded product holder 7 and the mold holder 5 is measured by the displacement sensor 17 attached to the molded product holder 7. The distance between the molded product W can be made more accurate than before, in other words, the position of the mold M relative to the molded product W can be accurately controlled, and accurate transfer can be performed. It can be carried out. Further, by repeating the transfer to a plurality of molded products W, even if the ball screw 11 and the base frame 3 are thermally deformed, the distance between the mold M and the molded product W is accurately determined (the mold M The positional relationship between the mold and the molded product W can be kept accurate), and a constant and stable fine transfer pattern can be formed on the molded product W.

  In addition, the displacement sensor 17 measures the distance D1 between the mold holder 5 and the molded article holder 7 only when the mold M exists in the vicinity of the molded article W to perform the transfer. Therefore, the configuration of the transfer device 1 can be simplified, and the manufacturing cost of the transfer device 1 can be reduced.

  That is, in order to perform accurate transfer even when the ball screw 11 or the base frame 3 is thermally deformed, a linear scale is provided to measure the distance between the mold holder 5 and the molded article holder 7. Depending on this measurement result, a method of correcting the distance between the mold holder 5 and the molded article holder 7 at the time of transfer by feedback control is also conceivable, but if this method is adopted, the mold holder 5 The position of the mold holder 5 is measured by the linear scale over the entire stroke, and the configuration of the measurement system becomes complicated. However, according to the method using the displacement sensor 17, the position of the mold holding body 5 is measured only when the mold M is present near the workpiece W, so that the configuration of the measurement system is simplified. be able to.

  Furthermore, in the method of measuring using a linear scale, for example, the scale portion of the linear scale is provided in the base frame 3, and the reading head that moves linearly with respect to the scale portion is provided in the mold holder 5. Thus, the position of the mold holder 5 with respect to the base frame 3 is measured, and the distance between the molded article holder 7 and the mold holder 5 is not directly measured.

  That is, in the method of measuring using a linear scale, for example, when the base frame 3 is thermally deformed, the distance between the mold M and the product W cannot be accurately measured. However, according to the transfer device 1, since the distance between the mold holder 5 and the molded article holder 7 is directly measured by the displacement sensor 17, not only the ball screw 11 but also the base frame 3 is thermally deformed. Even in this case, accurate transfer can be performed.

  Even when the mold M is too close to the base material B1 of the molded product W due to thermal deformation of the ball screw 11 or waviness error of the ball screw 11 as shown in FIG. If the layer B2 has a low viscosity such as an ultraviolet curable resin, the distance between the mold M and the base material B1 of the molded product W is then returned to the target value shown in FIG. Transfer can be performed without any problem.

  By the way, in the transfer apparatus 1, the mold M held by the mold holder 5 and the molded product W held by the molded product holder 7 are separated from each other by the servo motor 9. When the body 5 is brought close to the molded product holder 7 and it is measured by the rotary encoder 13 that the mold M and the molded product W have reached a position where they are in contact with each other, the mold holder 5 is stopped. The distance between the mold holder 5 and the molded article holder 7 is measured by the displacement sensor 17, the measurement value of the rotary encoder 13 is corrected by this measured value, and the mold holder 5 is further moved by the servo motor 9. When it is detected by the rotary encoder 13 that the distance between the mold M and the molded product W has reached the target value for transferring the mold M to the molded product W, the mold holder 5 Servo motor 9 so as to stop its movement and hold its position Control may be. Note that the distance between the mold holder 5 and the molded article holder 7 may be measured by the displacement sensor 17 without stopping the mold holder 5. In this case, it is desirable to reduce the moving speed of the mold holder 5. Further, for example, when the detected value by the rotary encoder 13 is “Z1” and the detected value by the displacement sensor 17 is “Z2”, the detected value of the rotary encoder 13 is changed to “Z2”. Done.

  In this way, if the measurement value of the rotary encoder 13 is corrected by the measurement value of the displacement sensor 17, the detection of the position of the mold holder 5 can be performed more quickly than when the rotary encoder 13 is switched to the displacement sensor 17. The position of the mold holder 5 can be corrected, and more efficient transfer can be performed. Further, since the mold holder 5 is stopped and the distance between the mold holder 5 and the molded article holder 7 is measured by the displacement sensor 17, accurate correction can be performed and transfer quality can be improved. Can do.

  The measurement value of the rotary encoder 13 using the displacement sensor 17 may be corrected every time one transfer is performed, or first transfer is performed immediately after the mold M is replaced, and then a predetermined value is obtained. This may be performed at a predetermined interval, for example, when the thermal deformation of the ball screw 11 or the like is increased by the number of times of transfer. Furthermore, in one transfer, not only one correction but two or more corrections may be performed.

  Further, the measurement by the displacement sensor 17 is performed while the mold holder 5 is stopped, for example, during the transfer (molding) to the workpiece W by the mold M, or the measurement by the displacement sensor 17 is performed by the mold M. When the transfer to the product W is completed and not during transfer (during molding) (for example, immediately after the transfer is finished, when the mold holder 5 is raised, when the mold holder 5 is at the rising end, Alternatively, the measurement value of the rotary encoder 13 may be corrected when the mold holder 5 is lowered from the rising end to the position immediately before the transfer.

  By the way, the transfer device 1 described above includes a mold holder that holds a mold on which a fine transfer pattern is formed, and a molded product holder that holds a molded product. A transfer apparatus for moving the mold holder relative to each other, bringing the mold into contact with the molding object, and transferring the transfer pattern to the molding article, the mold holder and the molding article A measuring unit that directly measures the distance between the mold holder and the molded article holder by a displacement sensor attached directly to at least one of the holders, and the measurement by the measuring means; This is an example of a transfer device configured to correct the distance between the mold holder and the molded article holder in accordance with the result and perform the transfer.

  Furthermore, the transfer device 1 includes a mold holder that holds a mold on which a fine transfer pattern is formed, and a molded product holder that holds a molded product. A transfer device that moves a mold holder relative to each other, brings the mold into contact with the molding object, and transfers the transfer pattern to the molding object. A measuring unit that performs the measurement only in the vicinity of a target value of the distance between the molded product holder and the mold holder and the molded product holder according to a measurement result of the measuring unit; The transfer device is configured to perform the transfer by correcting the distance between the two.

1 is a front view showing a schematic configuration of a transfer apparatus according to an embodiment of the present invention. It is a figure which illustrates roughly the stroke of a type | mold holding body. It is a figure which shows the output signal of a displacement sensor. It is a figure explaining the aspect when bringing a type | mold close to a to-be-molded product to perform transcription | transfer. It is a figure explaining the aspect when bringing a type | mold close to a to-be-molded product to perform transcription | transfer. It is a figure which shows schematic structure of the conventional transfer apparatus. It is a figure which shows the waveform of position control and torque control in a type | mold holding body. It is a figure which shows the wave | undulation error of a ball screw.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer apparatus 2 Control apparatus 3 Base frame 5 Mold holding body 7 Molded product holding body 9 Servo motor 11 Ball screw 13 Rotary encoder 17 Displacement sensor M Mold W Molded product B1 Base material B2 Molded layer h4 Target value

Claims (4)

With a base frame;
A molded product holder provided on the base frame for holding the molded product;
A mold holder that is provided on the base frame so as to move in a direction approaching or moving away from the molded article holder and holds a mold on which a fine transfer pattern is formed;
Driving means for moving the mold holder;
First measuring means for measuring the distance between the mold holder and the molded article holder over the entire length of the movement stroke of the mold holder;
The mold holder and the molded article holder only when the mold holder approaches the molded article holder by a displacement sensor attached to at least one of the mold holder and the molded article holder. A second measuring means for measuring the distance between
The mold holding body is held by the driving means from the state where the mold held by the mold holding body and the molded article held by the molded article holding body are separated from each other. When the first measuring means measures that the mold and the molded product have reached a position where they are in contact with each other, or the mold held by the mold holder and the workpiece From a state in which the molded product held by the molded product holding body is separated from each other, the mold holding body is brought close to the molded product holding body by the driving unit, and the mold holding is performed by the first measuring unit. When it is measured that the distance between the body and the molded article holder is within the range measurable by the second measuring means, the distance between the mold holder and the molded article holder the distance measured by the second measuring means, said first measured by the measured value Correcting the measured value of stages, the further moving the mold carrier in the drive unit, transferred to the first device under molding the distance between the mold and the object to be molded article in the mold by measuring means Control means for controlling the driving means so as to stop the movement of the mold holding body and hold the position when it is detected that the target value for performing is reached;
A transfer apparatus comprising: With a base frame;
Wherein provided on the base frame, and a fine transfer pattern type that holds a type that is formed retained body;
Provided on the base frame for movement in a direction approaching or away from the front Symbol type hold body, and the molded article holder for holding a molded product;
And drive means for moving said HiNaru type article carrier;
Over the entire length of the movement stroke of the HiNaru type article carrier, a first measuring means for measuring a distance between the HiNaru type article carrier and the front Symbol type coercive bearing member;
The HiNaru type article carrier, prior SL-type by the displacement sensor at least attached to any of the retained material, only the HiNaru type products when the HiNaru type article carrier has approached the prior SL-type hold member a second measuring means for measuring a distance between the holding member and the front Symbol type coercive bearing member;
From a state where the mold that has been held in HiNaru type products before and SL-type hold member held by the HiNaru type article carrier is away from each other, the HiNaru type article carrier in said driving means close the prior SL-type hold member, when said is said HiNaru type products before Symbol type in the first measuring means reaches a position in contact with each other is measured, or the HiNaru type from a state where the mold that has been held in HiNaru type products before and SL-type hold member which is held by the article holder is away from each other, before Symbol type the HiNaru type article carrier in said driving means close to the hold member, when the distance between the mold carrier and the object to be molded article holder enters the measurable range by the second measurement means is measured by the first measuring means in the HiNaru type products held by the driving means while measuring with said second measuring means the distance between the HiNaru type article carrier and the front Symbol type coercive bearing member The further movement, when the distance between the mold and the object to be molded article has reached the target value when performing transfer to the object to be molded in the mold is detected by said second measuring means and control means for controlling said drive means so as to retain its position stopping the movement of the HiNaru type article carrier;
A transfer apparatus comprising: With a base frame;
A mold holder provided on the base frame and holding a mold on which a fine transfer pattern is formed;
A molded article holder that is provided on the base frame so as to move in a direction approaching or separating from the mold holder, and holds the molded article;
Drive means for moving the molded article holder;
First measuring means for measuring the distance between the molded product holder and the mold holder over the entire length of the movement stroke of the molded product holder;
The molded article holder and the mold holder only when the molded article holder approaches the mold holder by a displacement sensor attached to at least one of the molded article holder and the mold holder. A second measuring means for measuring the distance between
From the state in which the molded product held by the molded product holding body and the mold held by the mold holding body are separated from each other, the driving means holds the molded product holding body to the mold holding body. When the first measuring means measures that the molded product and the mold have reached a position where they are in contact with each other, or the molded product held by the molded product holder From the state where the product and the mold held by the mold holding body are separated from each other, the driving means brings the molded article holding body closer to the mold holding body, and the first measuring means holds the mold When it is measured that the distance between the body and the molded article holder is within the range measurable by the second measuring means, the distance between the mold holder and the molded article holder the distance measured by the second measuring means, said first measured by the measured value Correcting the measured value of the stage, further moves the object to be molded article holder in the drive unit, the first of the object to be molded distance between the mold and the object to be molded article in the mold by measuring means and control means for controlling the driving means to hold when it is detected that reaches the target value, the position to stop the movement of the HiNaru type article carrier when performing transfer to;
A transfer apparatus comprising: The transfer method to the to-be-molded product using the type | mold characterized by performing using the transfer apparatus of any one of Claims 1-3 .

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