JP4990749B2 - Resin sealing device - Google Patents

Description

  The present invention relates to a technical field of resin sealing in which a molded product on which a semiconductor chip is mounted is sealed with resin.

  In recent years, the market demand for resin sealing devices has become diversified and the level has become higher. For example, one of them is “improving productivity”. Various approaches can be considered to improve productivity.For example, the mold itself can be enlarged to increase the amount of resin that can be sealed at once, or the operation of the device can be accelerated to reduce the production volume per unit time. There are approaches such as improvement. There is also an approach of improving productivity by a so-called multi-press type resin sealing apparatus provided with a plurality of molds in the apparatus. Here, “multi-press” means a resin sealing device provided with a plurality of molds in one apparatus and sharing other material supply mechanisms and transport mechanisms.

  As this multi-press type resin sealing device, for example, a resin sealing device described in Patent Document 1 is known. In this resin sealing device, the molds can be added in units, and the mold units can be increased or decreased as necessary. The resin sealing device also includes a loader (conveying mechanism) that conveys a molded product (such as a lead frame) before resin sealing to a mold, and the loader sequentially transfers the molded product to a plurality of molds. Conveying. The molded product conveyed to the mold is clamped by the mold and sealed with resin. Thereafter, an unnecessary portion (for example, a cull portion) in the molded product after resin sealing is gate-breaked and stored in the storage portion. That is, a resin sealing device is configured by combining a plurality of modules that perform different types of work such as supply of a molded product, supply of resin as a sealing material, press work, gate break work, and storage work. .

Japanese Patent Application Laid-Open No. 2001-300975

  In this way, when the entire resin sealing device is configured in such a manner that “a plurality of modules performing different operations” are combined, it is necessary that the operating conditions of each module be controlled as the entire device. For example, in the case where only a specific molded product can be applied to a specific mold, and further, under a specific condition (for example, press pressure) with a specific resin (amount and quality of a specified resin, etc.) Unless the “operating conditions” in the broad sense of performing work in terms of time, temperature, temperature, etc.) are suitable for the entire apparatus, it is impossible to perform resin sealing with the required quality.

  More specifically, when resin sealing is performed with a specific mold (module), it is necessary to supply a specific type and a specific amount of resin to the mold. In the case where the specific type of resin is used, it is assumed that it is necessary to perform a gate break with sufficient time after sufficiently cooling. In such a case, if the resin supply unit (module) cannot supply the specific type of resin required by the specific mold (if the operating conditions do not match), the intended resin will be used unless the setup is changed as such. It is difficult to perform sealing. In addition, where it is necessary to sufficiently cool, if a gate break occurs in an insufficiently cooled state, the gate break cannot be performed as intended, and the expensive molded product itself may be damaged. Is also connected.

  In order to adapt the operating conditions, for example, it is necessary to perform an adjusting operation after grasping each “operating condition” in some form for each module performing different operations (for example, displaying for each module). However, in the display for each module, it is necessary for the operator to adjust the operating conditions between the modules by referring to a plurality of displays, which is troublesome and in some cases may hinder accurate adjustment work. (In other words, misadjustment is easy to induce).

  The present invention has been made to solve such problems, and an object thereof is to simplify the operation of adjusting the operating conditions between the modules by the operator.

  The present invention is a resin sealing device having a plurality of modules for performing different types of work, and at least two of the plurality of modules each having a selective operating condition, wherein the selective operating condition is A single monitor screen capable of displaying both an icon corresponding to each of at least two modules having the above and the operating condition of the module corresponding to the icon, and the icon displayed on the monitor screen being selected And selecting the icon by the selection means so that the corresponding operation condition is displayed while maintaining the corresponding relationship, thereby solving the above-mentioned problem.

  In other words, a module that requires adjustment of operating conditions (a module having selective operating conditions) and its operating conditions are displayed on one monitor screen (simultaneously or sequentially), so that the operator can only view the monitor screen. By referencing, it is possible to confirm whether or not adjustment work between modules (operation condition adjustment work) is necessary.

  A configuration in which the monitor screen displays that when the operating condition selected in the first module and the operating condition selected in the second module are incompatible. In this case, it is sufficient for the operator to perform the adjustment work only for the part displayed as being incompatible, and in some cases, the confirmation work for the other part can be omitted.

  In addition, by selecting a specific icon displayed on the monitor screen by the selection means and switching to a corresponding operation condition display, necessary information can be provided even on a small monitor screen. Is possible.

  Further, if the monitor screen can simultaneously display only the icon selected by the selection means and the operation condition corresponding to the icon, a large amount of information can be displayed without switching the screen. .

  Further, if the corresponding operating condition is additionally displayed (for example, pop-up display, etc.) by selecting a specific icon displayed on the monitor screen by the selection means, a small monitor screen is necessary. It is possible to display various information at the same time.

  The monitor screen can display all of the operation conditions that can be selected by the specific module, and includes condition selection means that can select any of the operation conditions displayed on the monitor screen. If the actual operating condition of the module can be changed by selecting any one of the operating conditions by the selection means, the adjustment work itself can be completed by an operation on the monitor screen.

  Further, if the icon on the monitor screen is arranged / displayed corresponding to the actual arrangement of the module, for example, when the apparatus needs to be changed as an adjustment operation, the position of the module is changed. It is possible to easily grasp whether or not to perform.

  By applying the present invention, it becomes easy to adjust the operation condition between modules.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram (plan view) of a resin sealing device 100 which is an example of an embodiment of the present invention. 2 to 6 are diagrams schematically showing display contents of the monitor screen according to the embodiments.

  For convenience of explanation, the left and right direction in FIG. 1 is described as the X direction, the up and down direction is defined as the Y direction, and the direction perpendicular to both the X direction and the Y direction is defined as the Z direction (height direction).

<Configuration of resin sealing device>
The resin sealing device 100 includes a substrate supply unit 102 to which a product to be molded (lead frame, substrate, etc.) before resin sealing is supplied on a base 101 serving as a base of the device; A molded product storage unit 104 in which the molded product is stored, and four molds 106 arranged side by side between the substrate supply unit 102 and the molded product storage unit 104 are linearly arranged. The four molds 106 have different shapes. In this embodiment, the substrate supply unit 102 supplies a molded product for cleaning (dummy frame, dummy substrate) used for cleaning in accordance with an instruction in addition to supplying a molded product used for normal resin sealing. It is also possible to supply. Further, in the vicinity of the substrate supply unit 102, a swivel table 103 that turns the molding product taken out from the substrate supply unit 102 to adjust the orientation, and after the orientation is adjusted by the turning table 103, the molding product is brought to a predetermined temperature. A pre-heater unit 105 that heats and maintains the temperature is disposed. Further, along with the turning table 103 and the preheater unit 105, a resin tablet supply unit (resin supply unit) 109 to which a resin tablet as a sealing material is supplied is arranged. In the resin tablet supply unit 109, the resin is supplied in such a manner that the resin tablet is accommodated in the resin holder 170. The resin tablet supply unit 109 is provided with a lifter, and the resin holder 170 can be lifted and transferred to the loader 130. In the present embodiment, the resin-supplied tablet supply unit 109 can supply a cleaning resin used for mold cleaning in addition to a resin used for normal resin sealing. The cleaning resin is supplied to the resin holder 170 dedicated to the cleaning resin.

  On the other hand, in the vicinity of the molded product storage unit 104, a cooling stage (cooling unit) 107 in which the molded product after resin sealing is cooled, and an unnecessary part (cull unit) of the molded product cooled by the cooling stage 107 are taken out. A gate break portion 108 is disposed.

  Further, an X-direction guide 120 is installed on the base portion 101 in parallel with the arrangement of the substrate supply unit 102, the molded product storage unit 104, and the mold 106. On this X direction guide 120, the loader 130 and the unloader 140 are arrange | positioned so that it can move freely along the said guide. These loader 130 and unloader 140 function as a transport mechanism for a plurality of molds 106 arranged. That is, the loader 130 carries the molded product before resin sealing supplied from the substrate supply unit 102 and the resin tablet supplied from the resin tablet supply unit 109 into the mold 106 at a predetermined timing. On the other hand, the unloader 140 has a function of carrying out a molded product sealed with resin in each mold 106 and storing it in the molded product storage unit 104 via the cooling stage 107 and the gate break unit 108. Yes.

  In the present embodiment, four molds 106 are arranged as described above. However, the number of molds 106 is not necessarily limited to four, and one to three or five or more molds are arranged. It may be. The substrate supply unit 102, the resin tablet supply unit 109, the preheater unit 105, the cooling stage 107, the gate break unit 108, the molded product storage unit 104, the loader 130, and the unloader 140 are also configured one by one as described above. There is no need, and in some cases, a plurality of arrangements may be configured. Furthermore, the substrate supply unit 102 and the molded product storage unit 104 may be arranged on the same side, and the loader 130 and the unloader 140 may be realized by a single transport mechanism.

  As described above, the resin sealing apparatus 100 includes a plurality of modules (substrate supply unit 102, turning table 103, molded product storage unit 104, preheater unit 105, mold 106, cooling stage 107, gate break, and the like that perform different types of work. Unit 108, resin tablet supply unit 109, loader 130, and unloader 140).

  Further, all the above-mentioned parts (modules) are accommodated in a casing (not shown), and a monitor screen 190 (in FIG. 1) can display the operation status of the resin sealing device 100 on the side surface of the casing. Not shown: details regarding display contents will be described later).

<Display contents of monitor screen>
The monitor screen 190 in the present embodiment is displayed as shown in FIG. 2, for example.

  Icons P1 to P4 corresponding to the four molds 106, an icon TB1 corresponding to the resin tablet supply unit 109, and an icon GB1 corresponding to the gate break unit 108 are displayed. In addition, although only these icons are displayed here, depending on the case, icons corresponding to other modules may be displayed.

  Further, the monitor screen 190 has a touch panel function (selection means), and is configured to be able to select a specific icon with a finger or the like (in addition, a selection means such as a pointing device such as a mouse is used). Can also be).

  Thus, the image display on the monitor screen 190 is arranged / displayed corresponding to the actual arrangement / configuration of the resin sealing device provided with the monitor screen 190. That is, the display is a schematic representation of the actual arrangement of each module constituting the resin sealing device 100, and the correspondence between the monitor screen and the device can be grasped at a glance.

  In addition to the above, for example, the monitor screen can display the production status and the like by switching display contents.

<Operation of the entire resin sealing device>
Next, the operation of the resin sealing device 100 will be described.

  First, a single molded product before resin sealing is conveyed from the substrate supply unit 102 to the turning table 103. This conveyance is performed by a conveyance hand (not shown). When one molded product is conveyed to the turning table 103, the turning table 103 rotates. Thereafter, the other molded product is conveyed to the turning table 103, and a total of two molded products are arranged on the turning table 103. Thereafter, the two molded articles are simultaneously conveyed to the preheater 105 by the loader 130. Here, after the arm part (not shown) of the loader 130 slides in the Y direction, the product to be molded is clamped by a claw mechanism provided in the arm part and conveyed to the subsequent preheater part 105. In the preheater unit 105, the product to be molded is heated to a predetermined temperature and kept warm. In the present embodiment, two preheater units 105 are provided, and the preheater unit 105 is transported to one of them (the vacant side).

  On the other hand, in the resin tablet supply unit 109, the resin tablet 180 as a sealing material is supplied to the resin holder 170. Thereafter, the article to be molded that is kept warm by the preheater unit 105 is held again by the claw mechanism of the loader 130. Furthermore, the resin holder 170 in which the resin tablet is accommodated is lifted by the lifter and is held by the loader 130. That is, the product to be molded and the resin tablet are simultaneously conveyed to the mold 106 by the loader 130.

  The article to be molded and the resin tablet conveyed by the loader 130 are put into the mold 106 at a predetermined timing. Thereafter, the loader 130 retreats from the mold 106 and moves to the resin tablet supply unit 109 side while the empty resin holder 170 is mounted.

  When the resin sealing in the mold 106 is completed, the work after the resin sealing is transferred to the cooling stage 107 by the unloader 140 in the future. In the cooling stage 107, the workpiece after resin sealing is cooled to a predetermined temperature. Thereafter, the work is again transferred from the cooling stage 107 to the gate break unit 108 by the unloader 140. Here, an unnecessary portion of the work, that is, a resin corresponding to the cull portion is removed by gate break. Unnecessary parts are discarded, and the remaining work is conveyed to the product storage unit 104 by the unloader 140.

  Resin sealing is continuously performed by repeating such a procedure.

<Operating conditions for each module>
As described above, the resin sealing device 100 is configured by combining a plurality of modules (a module called a mold 106, a module called a resin tablet supply unit 109, a module called a gate break unit 108, etc.) that perform different operations. Each of these modules has a specific selective “operation condition”. The “operating conditions” here do not only indicate the operating conditions (speed, moving method, etc.) of each module, but include operating conditions including the types and sizes of usable materials, for example. It is said. In other words, it can be rephrased as “recipe” or “acceptable range”.

  For example, in the case of the mold 106, the mold shape (cavity shape) is one of the operating conditions. For example, when the shape of the cavity can be selected by exchanging only a specific part of the mold, this is an operating condition. In addition, the resin that can be used may be limited depending on the type of mold surface treatment, and the cleaning procedure for the mold surface may be limited. Furthermore, since the press pressure that can be withstanding for each mold is different, these may be operating conditions. In addition, the speed of press movement, press pressure, time, temperature, and the like are also included in the “operation conditions”. In the case of the resin tablet supply unit 109, the type, amount, shape, dimension, layout, and the like of the resin supplied from the supply unit are “operation conditions”. Further, the type, amount, shape, and the like of the resin need to be matched in relation to the loader 130 (resin holder 170) to which the resin is conveyed as well as the mold into which the resin is charged. In the case of the gate break portion 108, the presence or absence of cooling in the gate break portion, the time, the speed and operation timing of the gate break, the folding direction when the gate break occurs, the mechanism of the gate break portion itself (for example, folding or punching), This corresponds to the type (difference in the position of the cull with respect to the molded product), the consistency between the jig used in the gate break portion and the mold, and the like. In the case of the molded product supply unit 102, the type of the molded product to be supplied (lead frame or substrate) is applicable. In the case of the preheater unit 105, the presence / absence of preheating, the temperature and time for preheating (the optimum temperature differs for each resin, and the accumulated preheating time may be limited depending on the molded product). In the case of the cooling unit 107, the presence / absence of cooling, the cooling temperature, the cooling time, and the like are applicable. In the case of the loader 130 or the unloader 140, the type of the molded product that can be conveyed corresponds. Also, in the molded product, the pressure pressure that can be endured is different, and the temperature that can be endured is also different, so these are also operating conditions.

  Thus, since each module which comprises the resin sealing apparatus 100 has the specific selective operation conditions, the resin sealing apparatus 100 works smoothly and performs accurate resin sealing. In order to do so, it is required that operating conditions be allowed between modules. If it is unacceptable, the module is not compatible.

  More specifically, when resin sealing is performed with a specific mold 106, it is necessary to supply a specific type and a specific amount of resin to the mold. When this kind of resin is used, it is assumed that a gate break needs to be made by taking sufficient time after sufficiently cooling. In such a case, if the resin tablet supply unit 109 cannot supply the specific type of resin required by the specific mold 106 (if the operating conditions do not match), the intended resin seal will be provided unless the setup is changed as such. It is difficult to stop. In addition, where it is necessary to cool sufficiently, if a gate break occurs with insufficient cooling, the gate break cannot be performed as intended and the expensive molded product itself is damaged. It also leads to things.

<Adjusting operating conditions using the monitor screen>
As described above, the monitor screen 190 in the resin sealing 100 according to the present embodiment includes the icons P1 to P4 corresponding to the four molds 106, the icon TB1 corresponding to the resin tablet supply unit 109, and the gate break unit 108. A corresponding icon GB1 is displayed. When each icon is selected on the touch panel, the operating condition of the module corresponding to the selected icon is displayed when the screen is switched (see FIG. 2).

  The information on the contents of the operation conditions of each module may be automatically loaded by assembling each module, for example, or may be manually input by an operator.

  In other words, the operator can quickly refer to whether or not the operating conditions of each module can be met while referring only to the monitor screen 190. As a result, it is easy to adjust the operating condition of the non-conforming module found by referring to the monitor screen so that it can be adapted, for example, by changing the setup.

  At this time, on the monitor screen 190, each displayed icon is arranged and displayed corresponding to the actual arrangement of each module. For example, it is easy to determine at which position the module should be replaced. It is possible to grasp.

  Further, the display of the monitor screen is not limited to the above, and for example, a configuration as shown in FIGS. 3 to 6 can be adopted.

  As shown in FIG. 3, with the operating conditions of each module loaded, the operating conditions selected in a specific module (first module: for example, a mold) and other specific modules (first Adopting a configuration that displays on the monitor screen that the operating conditions selected in the second mold (for example, gate break part) are not met (displayed by symbols, characters, blinking, and combinations thereof). It is also possible to do. With such a configuration, it is sufficient for the operator to perform the adjustment work only for the part displayed as being incompatible, and in some cases, the confirmation work for the other part can be omitted.

  Further, as shown in FIG. 4, all the icons including the selected icon G2 and all the operating conditions that can be selected by the gate break unit corresponding to the icon G2 can be displayed simultaneously while maintaining the correspondence. Then, it becomes possible to display a lot of information without switching the screen. Here, the selected icon G2 is displayed in a different manner from other icons in order to indicate that it is selected (for example, another icon G2 is selected depending on a shape, a pattern, a change in color, a combination thereof, or the like). Not clearly distinguishable from the icon.) Thereby, the correspondence with the displayed operating conditions is maintained. In addition, for example, as shown in FIG. 5, the operation condition displayed portion is displayed as a so-called “speech balloon” from the selected icon, so that the displayed operation condition and the selected icon are displayed. A configuration that maintains the relationship may be adopted.

  Further, by selecting a specific icon displayed on the monitor screen by the selection means and switching to the corresponding operation condition display, necessary information can be provided even on a small monitor screen. It becomes possible.

  Moreover, if a corresponding icon is additionally displayed by selecting a specific icon while maintaining a corresponding relationship, necessary information can be simultaneously displayed even on a small monitor screen. For example, as shown in FIG. 6, when a specific icon is selected, a corresponding recipe is additionally displayed (for example, as a pop-up display) in accordance with the selection. Here, the “arrow” maintains the correspondence between the selected icon and the displayed operating condition. Further, in FIG. 6, the operating conditions are displayed for all icons for easy understanding, but only selected items may be displayed.

  Further, as shown in FIGS. 4 and 5, the condition selection means (all of the operation conditions that can be selected by the specific module can be displayed on the monitor screen, and one of the displayed operation conditions can be selected. If it is possible to change the actual operating condition of the module by selecting any one of the operating conditions by the condition selecting means, the monitor screen can be used. The adjustment operation itself can be completed by the above operation. For example, in the case of work that does not require setup change such as replacing a part of a part (change of set temperature, change of operation speed, etc.), the selection can be made by selecting one of the operation conditions on the screen. The configuration of the actual module operating conditions is changed in conjunction with the above.

  In addition, although the resin sealing apparatus which performs "transfer molding" is demonstrated to the above as an example, it is not a thing of the meaning limited to this. In addition, it can be widely applied regardless of the resin sealing method such as “compression molding”.

  Regardless of the type of resin sealing, the present invention can be widely applied to a resin sealing device configured by combining a plurality of modules that perform different types of work.

Schematic configuration diagram of a resin sealing device 100 as an example of an embodiment of the present invention Figure showing a display configuration example of the monitor screen Figure showing a display configuration example of the monitor screen Figure showing a display configuration example of the monitor screen Figure showing a display configuration example of the monitor screen Figure showing a display configuration example of the monitor screen

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 101 ... Base part 102 ... Substrate supply part 103 ... Turning table 104 ... Molded article storage part 105 ... Preheater 106 ... Mold 107 ... Cooling stage 108 ... Gate break 109 ... Resin tablet supply part 120 ... X direction Guide 130 ... Loader 140 ... Unloader 170 ... Resin holder 180 ... Lead frame 190 ... Monitor screen

Claims (7)

A resin sealing device having a plurality of modules for performing different types of work, wherein at least two of the plurality of modules each have a selective operating condition;
A single monitor screen capable of displaying both an icon corresponding to each of at least two modules having the selective operation condition and the operation condition of the module corresponding to the icon;
Selecting means capable of selecting the icon displayed on the monitor screen,
By selecting the icon by the selection means, the corresponding operation condition is displayed while maintaining a correspondence relationship. In claim 1,
The monitor screen displays that when the operating condition selected in the first module and the operating condition selected in the second module are incompatible with each other. Resin sealing device. In claim 1 or 2,
The resin sealing device, wherein the selection means switches to a corresponding operation condition display by selecting a specific icon displayed on the monitor screen. In claim 1 or 2,
The monitor screen can simultaneously display only the icon selected by the selection means and the operation condition corresponding to the icon. In claim 1 or 2,
By selecting a specific icon displayed on the monitor screen by the selection means, a corresponding operation condition is additionally displayed. In any one of Claims 1 thru | or 5,
The monitor screen can display all of the operating conditions that can be selected by the specific module,
Comprising a condition selection means capable of selecting any of the operating conditions displayed on the monitor screen;
The resin sealing device, wherein the actual operating condition of the module can be changed by selecting any of the operating conditions by the condition selecting means. In any one of Claims 1 thru | or 6.
The resin sealing device, wherein the icons on the monitor screen are arranged and displayed corresponding to the actual arrangement of the modules.

Images