JP5006746B2 - Three-dimensional circuit component structure - Google Patents

Description

  The present invention relates to a three-dimensional circuit component structure in which circuit boards on which electronic circuits or the like are formed are electrically connected to each other with a connection member formed with a conductive part adjacent to each other. The present invention relates to a three-dimensional circuit component structure in which an insulating partition wall is protruded at a boundary between parts, and a brazing layer connecting the conductive portion and the electronic circuit or the like is isolated from each other by the insulating partition wall.

  Conventionally, circuit boards in which an electronic circuit or the like is formed on the surface of an insulating substrate are electrically connected to each other by soldering or the like via a connecting member in which a conductive portion is formed on the opposite surface of the circuit board. A typical circuit component has been proposed (see, for example, Patent Documents 1 to 3). However, all of the conductive portions of the connecting member connected by soldering or the like protrude from the surface of the connecting member.

  That is, as shown in FIG. 4, a convex protrusion 211c is formed on the surface of an insulating base 211 made of an insulating resin constituting the connecting member 201, and there is no protrusion on the outer surface of the convex protrusion. A first conductive portion 212 is formed by electrolytic copper plating or the like. Further, as shown in FIG. 5, the surface of the insulating base 221 made of an insulating resin constituting the electronic circuit board 202 is formed flat, and an electronic circuit or the like by electroless copper plating or the like is formed on the flat surface. A second conductive portion 222 is formed.

As shown in FIG. 5, when the electronic circuit board 202 and the connection member 201 are electrically connected, the first conductive portion 212 formed on the connection member and the second conductivity formed on the electronic circuit board. The parts 222 are arranged so as to face each other, solder is deposited on one surface of these conductive parts and heated, and the conductive parts are electrically connected between the conductive parts by the soldering layer 203. .
JP 2005-251889 A (FIG. 1 etc.) JP 2006-286660 A (FIG. 1 etc.) Japanese Patent Laying-Open No. 2005-209596 (FIG. 6 etc.)

  However, the conventional three-dimensional circuit component structure described above has the following problems to be improved. That is, as shown in FIG. 5, in the circuit component structures described in Patent Documents 1 to 3, the first conductive portion 212 formed on the connection member 201 and the second conductive portion 222 formed on the electronic circuit board 202 are: Both project from the connection member and the surface of the electronic circuit board. Accordingly, when the conductive parts are arranged so as to face each other for soldering, a space 204 is generated between the adjacent conductive parts. For this reason, as shown in FIG. 6, when soldering, the solder scatters (called “explosion”) to form a solder bridge 205 in the space 204 and short-circuit adjacent conductive parts. There was a problem that.

  In the above-mentioned “explosion”, since solder or the like is a mixture of solder and other components such as solder made of organic matter, the vaporized organic bubbles burst when heated, and the components such as solder are thin thread-like. This is caused by scattering outside.

  In particular, recently, there are many electronic devices having many functions such as a digital camera function, an Internet function, a GPS function, or a television function as well as a telephone function, such as a mobile phone. Therefore, recent electronic devices are extremely miniaturized, and have higher functions and more functions. Therefore, the width of the electronic circuit and the pitch between the electronic circuits are reduced to the micron order. Therefore, the above-mentioned “explosion” is more likely to cause a problem that an adjacent electronic circuit is short-circuited.

  Accordingly, an object of the present invention is to provide a three-dimensional circuit component structure capable of preventing a short circuit between adjacent electronic circuits due to “explosion” generated during soldering or the like.

  The three-dimensional circuit component structure according to the present invention is characterized in that an insulating partition wall protrudes from the boundary portion of the first conductive portions adjacent to each other provided on the surface of the connecting member, and is brazed adjacent to each other by the insulating partition wall. In isolating layers. That is, the three-dimensional circuit component structure according to the present invention includes an electronic circuit board and a connecting member, and an insulating partition wall protrudes from the surface of the connecting member facing the electronic circuit board. First conductive portions adjacent to each other with the partition wall as a boundary are formed. On the surface of the electronic circuit board, second conductive portions adjacent to each other with the insulating region as a boundary are formed. The first conductive part and the second conductive part are electrically connected via a brazing layer. And the top part of the said insulation partition is contact | abutted with the said insulation area without gap, and isolate | separates the said brazing layer adjacent to each other.

The insulating region is composed of a second insulating partition protruding from the surface of the electronic circuit board, and the top of the insulating partition is in contact with the top of the second insulating partition without any gap and adjacent to each other. Configure to isolate the braze layer .

  Further, the width of the first conductive portion may be wider than the width of the insulating partition in a direction perpendicular to the boundary surface between the first conductive portion and the insulating partition.

  Here, the “electronic circuit board” means that a conductive part such as an electronic circuit or a connection terminal is formed on the surface of an insulating base, and an electronic component such as a resistor, a capacitor, or a semiconductor element is mounted. The “connecting member” means a member for electrically connecting the above-mentioned “electronic circuit boards” to each other, and is a surface of an insulating base, and a conductive portion provided on the “electronic circuit board”. It means that a conductive portion that is electrically connected via a brazing layer is formed at an opposing position. Note that the “connection member” is not limited to the one that electrically connects the “electronic circuit boards” stacked on both sides of the “connection member”, and electronic components and the like are mounted on the “connection member” itself. Including those that have been.

  Further, “facing the connection member to the electronic circuit board” includes not only the case where the “electronic circuit board” is overlapped on both side surfaces of the “connection member” but also the case where the connection member is overlapped only on one side surface. The “insulation zone” is not limited to a part of the flat surface of the electronic circuit board, that is, a boundary surface that separates the second conductive parts adjacent to each other. This includes the case where an insulating partition wall is projected at the boundary of the part. “First conductive portion” and “second conductive portion” mean an electronic circuit or a connection terminal made of a conductive member, respectively, and an electroless plating layer, an electrolytic plating layer formed on the surface of an insulating substrate, or For example, metal foil. “Brazing layer” means a layer of brazing material that melts a metal or alloy having a melting point lower than that of the base material to be joined and fills the gap between the base materials, and is soldered with a melting point of 450 ° C. or less. In addition to the layer, a hard brazing layer having a melting point of 450 ° C. or higher is also included.

  “A first conductive portion adjacent to each other” and “a second conductive portion adjacent to each other” mean that the conductive portions are arranged side by side with an insulating portion such as an insulating region or an insulating partition, In the case where the conductive portion is in the form of a passage such as an electronic circuit, it means that both passages are electrically separated from each other with an insulating portion interposed therebetween. Further, when the conductive portion is spot-like like a connection terminal, it means that the periphery of the spot-like connection terminal is surrounded by an insulating portion and electrically isolated from each other.

  The “top part of the insulating partition wall” means a ridge line or a ridge surface that forms the top part of the insulating partition wall as viewed from the surface of the circuit board on which the insulating partition wall protrudes. “Abutting without a gap” means that a passage penetrating both sides of the insulating partition is not formed in the abutting portion.

  An insulating partition wall is projected at the boundary portion of the first conductive portions adjacent to each other provided on the surface of the connecting member, and the top of the insulating partition wall is projected on the insulating area of the surface of the electronic circuit board or the electronic circuit board. By abutting the top of the second insulating partition wall without any gap and isolating the brazing parts adjacent to each other, even if an “explosion” occurs during brazing, the insulating partition wall prevents the mutual insulation from occurring. It can prevent that the brazing part which opposes is short-circuited.

  Since the insulating partition can reliably prevent a short circuit due to “explosion”, the width of the interval between adjacent conductive portions can be made narrower than the width of the conductive portions themselves. For this reason, the integration density of an electronic circuit etc. can be improved.

The configuration of the three-dimensional circuit component structure according to the present invention will be described with reference to FIGS. The best mode for carrying out the invention according to claims 1 and 2 of the present application will be described later in paragraphs “0030” to “0031” with reference to FIG. FIG. 1 shows a connecting member 1 for connecting electronic circuit boards to each other. In this connecting member, strip-shaped insulating partition walls 11a are formed in a plurality of rows over the entire circumference of the handle-like portion of the insulating base 11. It is set up. Conductive portions 12 are respectively formed over the entire circumference between adjacent strip-shaped insulating partition walls 11a. As shown in FIG. 2, the upper surface of the strip-shaped insulating partition wall 11a of the connecting member 1 is formed in a convex arc cross-sectional shape, and the first conductive portion is formed between the adjacent insulating partition walls. 12 are formed. The strip-shaped insulating partition 11a may be formed in a rectangular cross section.

  As shown in FIG. 2, electronic circuit boards 2 and 2 are connected to the upper and lower surfaces of the connection member 1, respectively. In the electronic circuit board 2, the second conductive portions 22 are provided adjacent to each other in a plurality of rows on the flat surface of the insulating base 21, and the second conductive portions are formed on the connecting members 1 that face each other. The first conductive part 12 and the soldering layer 3 are electrically connected to form a three-dimensional circuit component structure.

  The top portion of the strip-shaped insulating partition 11a of the connecting member 1 formed in a convex arc cross-sectional shape is a flat surface of the insulating base 21 constituting the electronic circuit board 2 and is adjacent to the second conductive portion 22. It is in contact with the insulating region 21a forming the boundary without any gap.

  Next, a method for manufacturing the connection member 1 and the electronic circuit board 2 will be described. The insulating base 11 of the connecting member 1 is formed by injection molding an electrically insulating thermoplastic resin such as liquid crystal polymer, heat resistant polyamide, or polyphenylene sulfide. For example, the trade name “Vectra” of Polyplastics Co., Ltd. is used as the aromatic polyester liquid crystal polymer. Next, the entire surface of the insulating substrate 11 is roughened (etched). As this etching process, caustic soda or an alkaline aqueous solution in which caustic potash is dissolved at a predetermined concentration, for example, 45% by weight is heated to a predetermined temperature, for example, 50 to 90 ° C., and the insulating substrate 11 is immersed for a predetermined time, for example, 30 minutes. By this etching process, the entire surface of the insulating substrate 11 is roughened.

  Next, a covering material is injection-molded so as to cover the convex arc-shaped cross-sectional surface of the strip-shaped insulating partition 11a and both side walls of the insulating partition. As this coating material, for example, an oxyalkylene group-containing polyvinyl alcohol resin is applicable. In addition, as an oxyalkylene group containing polyvinyl alcohol-type resin, the brand name "Ekomati AX" of Nippon Synthetic Chemical Industry Co., Ltd. can be used.

  Next, a catalyst such as palladium or gold is applied to the exposed surface of the insulating substrate 11, that is, the surface sandwiched between both side walls of the strip-shaped insulating partition wall 11a. This catalyst application uses a known means. For example, the insulating substrate 11 is immersed in a mixed catalyst solution of tin and palladium, and then activated with an acid such as hydrochloric acid or sulfuric acid to deposit palladium on the surface. Alternatively, a reducing agent having a relatively strong reducing action such as stannous chloride is adsorbed on the surface of the insulating substrate 11 and immersed in a catalyst solution containing a noble metal ion such as gold to deposit gold on the surface. In addition, what is necessary is just to immerse the temperature of a liquid at 15-23 degreeC for 5 minutes.

  Further, the insulating substrate 11 after the catalyst application is immersed in hot water at 60 ° C. for 10 minutes, and the ecomatic AX of the coating material is eluted and removed in the hot water. Next, an electroless copper plating layer or an electroless nickel plating is formed on the exposed surface of the insulating substrate 11 that is not covered with the covering material, that is, the portion sandwiched between both side walls of the strip-like insulating partition wall 11a provided with the catalyst. A first conductive portion 12 made of a layer is formed. Since the surface of the insulating base 11 on which the plating layer is formed is roughened as described above, the first conductive portion 12 is firmly bonded by the anchor effect. Finally, heat treatment is performed to remove moisture inside.

  The electronic circuit board 2 is also formed in substantially the same manner as the connection member 1 described above. That is, the insulating base 21 of the electronic circuit board 2 is injection-molded using an electrically insulating thermoplastic resin such as a liquid crystal polymer. Next, the entire surface of the insulating base 21 is roughened (etched). Then, the entire surface of the insulating base 21 is covered by injection molding with a coating agent such as an oxyalkylene group-containing polyvinyl alcohol resin, leaving the surface portion where the second conductive portion 22 is to be formed.

  Next, a catalyst such as palladium or gold is applied to the exposed surface of the insulating substrate 21 that is not covered with the coating agent, and then the coating material is eluted in hot water and removed. And the 2nd electroconductive part 22 which consists of an electroless copper plating layer or an electroless nickel plating layer is formed in the surface of the insulation base | substrate 21 to which the catalyst was provided. Finally, heat treatment is performed to remove moisture inside.

  In addition, the electroless copper plating or the electroless nickel plating mentioned above can use any known electroless plating means. Moreover, the 1st electroconductive part 12 and the 2nd electroconductive part 22 may adhere not only when forming a plating layer but a conductive thin film, or a metal terminal may be fitted. Further, an electrolytic plating layer may be formed on the electroless plating layer.

  A method for electrically connecting the connection member 1 thus formed and the electronic circuit board 2 to each other will now be described with reference to FIG. First, on the surface of the first conductive portion 12 of the connection member 1, a predetermined amount of solder is placed on the portion to be soldered. The amount of solder to be deposited is set to an appropriate amount in consideration of the surface area of the first conductive portion 12 and the like. Next, the electronic circuit boards 2 and 2 are superimposed on the upper and lower surfaces of the connection member 1 so that the soldering portions of the first conductive portion 12 and the second conductive portion 22 face each other, and heated to a predetermined soldering temperature. To do. The solder is melted to form a soldering layer 3 between the first conductive portion 12 and the second conductive portion 22, and the two are electrically connected.

  As described above, the upper surface, i.e., the top portion, of the insulating partition wall 11a of the connecting member 1 formed in the convex arc cross-sectional shape is the surface of the electronic circuit board 2, and the boundary between the second conductive portions 22 adjacent to each other. Since it is in contact with the insulating region 21a formed without any gap, the soldering layers 3 adjacent to each other are isolated from each other by this insulating partition. Therefore, even if “explosion” occurs when the soldering layer 3 is formed, an electrical short circuit does not occur in the soldering layers adjacent to each other.

  FIG. 3 shows another embodiment. In other embodiments, in order to facilitate understanding, the same reference numerals as those in the above-described embodiments are given the same number plus 100. In this other embodiment, a second insulating partition wall 121a protrudes in place of the flat insulating region 11a provided on the electronic circuit board 2 described above. That is, on the surface of the insulating base 121 of the electronic circuit board 102, a plurality of rows of strip-shaped second insulating partition walls 121a are projected. The top of the second insulating partition 111a is also formed in a convex arc cross-sectional shape, and a second conductive portion 122 is formed in a portion sandwiched between the insulating partitions adjacent to each other. Note that the strip-shaped insulating partition wall 121a may be formed in a rectangular cross-sectional shape. On the other hand, the connecting member 101 that connects the electronic circuit boards 102 is equivalent to the connecting member 1 described above with reference to FIGS. The electronic circuit board 102 is also manufactured by a method equivalent to that of the connection member 1 described above.

  Thus, when the connection member 101 and the electronic circuit board 102 are formed and the two are overlapped and connected, the top of the insulating partition wall 111a protruding from the connection member and the second protrusion protruding from the electronic circuit board are provided. By configuring the top of the insulating partition wall 121a so as to contact with no gap, the soldering layers 103 adjacent to each other are separated from each other by the insulating partition wall and the second insulating partition wall. Therefore, even if “explosion” occurs when the soldering layer 103 is formed, an electrical short circuit does not occur between the soldering layers adjacent to each other.

  The three-dimensional circuit component structure according to the present invention avoids a short circuit during brazing, reduces the yield, and prevents the occurrence of a short circuit failure during use. Therefore, the three-dimensional circuit component structure can be widely used in industries related to electronic devices and the like. is there.

It is a partial perspective view of the 1st base. It is a partial cross section figure of a three-dimensional circuit component structure. It is a partial cross section figure of another three-dimensional circuit component structure. It is a partial perspective view of the 1st base | substrate by a prior art example. It is a partial sectional view of a three-dimensional circuit component structure according to a conventional example. It is explanatory drawing which shows the short circuit in the three-dimensional circuit component structure by a prior art example.

Explanation of symbols

1, 101, 201 Connecting member 11, 111, 211 Insulating substrate 11a, 111a Insulating partition 12, 112, 212 First conductive part 2, 102, 202 Electronic circuit board 21, 121, 212 Insulating substrate 21a, 121a Insulating region, first Insulating partition wall 2, 122, 222 Second conductive part 3, 103, 203 Soldering layer (brazing layer)

Claims (2)

An electronic circuit board and a connection member;
On the surface of the connection member facing the electronic circuit board, an insulating partition wall protrudes, and first conductive portions adjacent to each other with the insulating partition wall as a boundary are formed.
On the surface of the electronic circuit board, second conductive portions adjacent to each other with an insulating region as a boundary are formed,
The first conductive part and the second conductive part are electrically connected via a brazing layer,
The insulating region comprises a second insulating partition wall protruding from the surface of the electronic circuit board,
A three-dimensional circuit component structure characterized in that a top portion of the insulating partition wall is in contact with a top portion of the second insulating partition wall without any gap, thereby isolating the brazing layers adjacent to each other . 2. The three-dimensional circuit component structure according to claim 1, wherein the width of the first conductive portion is wider than the width of the insulating partition in a direction perpendicular to the boundary surface between the first conductive portion and the insulating partition. .

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