JP5007261B2 - Management method of board assembly / mounting line - Google Patents

Description

  The present invention relates to a management method for a board assembly / mounting line including an electronic component mounting apparatus in which electronic components are taken out from a plurality of component supply units by suction nozzles and mounted on a printed circuit board.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but among the electronic components actually mounted on the printed circuit board, the electronic component in which mounting failure occurred has some abnormality during the mounting operation. It is considered a thing.
JP 2005-159209 A

  However, elucidating the cause of this mounting failure is a considerable burden on the operator, may require a long time, and the elucidation work is extremely difficult.

  Therefore, the present invention makes it easy to identify the cause of electronic component mounting failure, and can also reduce the time required to identify the cause, that is, to solve the problem. The purpose is to improve.

For this reason, the first invention is an electronic component mounting apparatus in which an electronic component is taken out from a plurality of component supply units by a suction nozzle, and the electronic component is mounted on a printed board with a symbol attached to the component mounting position. In the management method of the board assembly mounting line including
Mounting order data indicating in which order the suction nozzles are used to mount electronic components, using the symbols stored in each mounting order as clues to the mounting data on which position on the printed circuit board the electronic components are mounted in each mounting order Based on the above, the data of the suction nozzle specified by the symbol in the mounting failure data is acquired.

According to a second aspect of the present invention, there is provided a substrate including an electronic component mounting apparatus in which an electronic component is taken out from a plurality of component supply units by a suction nozzle, and the electronic component is mounted on a printed circuit board having a symbol attached to the component mounting position. In the management method of assembly mounting line,
Mounting based on the mounting order data on which suction nozzles are used to mount the electronic components, using the symbols stored in the mounting data as to which position on the printed circuit board to mount the electronic components for each mounting order Necessary information is acquired from the operation information of the suction nozzle specified by the symbol in the defect data.

A third invention is the first or Oite the second invention according to the method of managing board assembling line, the acquisition, and performing in said electronic component and connected management computer.

The fourth invention is characterized by creating Oite to the third invention according to method of managing board assembling line, the detailed implementation bad data from the information the management computer is the acquired.
A fifth invention is Oite the third invention according to method of managing board assembling line, the management computer to create and store a detailed implementation bad data from the acquired information, on the monitor of the management computer It is characterized by displaying the position of the electronic component on the printed circuit board where the mounting failure has occurred.

  The present invention makes it easy to identify the cause of a mounting failure of an electronic component, and can also reduce the time required to identify the cause, that is, to solve the problem, thereby reducing the number of mounting failures and improving the mounting accuracy of the electronic component. Can be achieved.

  Embodiments of the present invention will be described below. Fig. 1 shows a board assembly and mounting line for assembling a printed circuit board in a factory. A screen printing device for applying paste solder on the printed circuit board, an adhesive application device for applying adhesive on the printed circuit board, and mounting electronic components on the printed circuit board For convenience of explanation, only a combination of three electronic component mounting apparatuses 1 is shown in the figure.

  Each electronic component mounting apparatus 1 includes a control microcomputer (hereinafter referred to as “control microcomputer”) 2, and each control microcomputer 2 further includes a display device and an input device via a LAN cable 3 serving as a communication line. Is connected to a line management computer (hereinafter referred to as “management PC”) 4.

  In the electronic component mounting apparatus 1, a pair of beams that are long in the X direction are each a component supply unit that supplies a printed circuit board or an electronic component to a component suction / extraction position by driving a Y-axis motor 20 (sometimes in the drawings, In some cases, it may be abbreviated as “feeder”). Each beam is provided with a mounting head (sometimes abbreviated as “head”) that can be moved by the X-axis motor 21 in the longitudinal direction, that is, the X direction. Each mounting head is provided with a plurality of suction nozzles (sometimes abbreviated as “nozzles”) that can be rotated by a θ-axis motor 23, and a vertical axis motor for moving the suction nozzles up and down. 22 is mounted. Therefore, each suction nozzle of the mounting head can move in the X direction and the Y direction (plane direction), can rotate about a vertical line, and can move up and down.

  Next, the control relationship of the electronic component mounting apparatus 1 will be described based on the control block diagram of FIG. The control microcomputer 2 includes a central processing unit (CPU) 5 that performs overall control, a ROM (read only memory) 6 that stores programs related to this control, and a RAM (random access) that stores various data. A memory) 7, which are connected via a bus line 8.

  The RAM 7 stores pattern program data for moving the electronic component mounting apparatus 1 for each type of printed circuit board. The pattern program data includes mounting data, suction and mounting order data, component arrangement data, and This is the basis of the arrangement data of the suction nozzle. That is, the RAM 7 stores mounting data (see FIG. 3) for each type of printed circuit board P related to component mounting, and for each mounting order (step number (represented by “P-No.”)). , X direction (represented by “X”), Y direction (represented by “Y”) and angle information (represented by “Z”) of each electronic component in the printed circuit board P, and each component The supply unit arrangement number information (represented by “Fdr No.”) and a symbol or the like are stored in the comment field.

  As shown in FIG. 4, the symbols stored in the comment column of the mounting data are attached around each component mounting position on the printed board P indicated by the step number. Therefore, from this symbol, the mounting position of the printed circuit board P of the electronic component of the step number can be directly understood, and the mounting head, suction nozzle, component supply unit, etc. using this symbol as a clue can be specified. This symbol serves as an identification mark and is composed of characters, figures, symbols, etc. The symbol used in this embodiment is a combination of characters and numbers, “C001” is a capacitor, and “R001” is a resistor. Means.

  Further, the RAM 7 has the suction and mounting order data as shown in FIG. 5 created by the CPU 5 in an optimized manner, information on the types of electronic components corresponding to the component supply unit arrangement numbers of the component supply units, That is, the component arrangement data is also stored, the arrangement data of the suction nozzle as shown in FIG. 6 is stored, and further, the electronic component representing the characteristics of the electronic component for each component ID which is a unique symbol of the electronic component is stored. Parts library data relating to the length in the X direction and the Y direction, thickness information, the nozzle ID of the suction nozzle used, and the like are stored.

  A recognition processing device 9 is connected to the CPU 5 via the interface 10. The recognition processing device performs recognition processing of an image captured by the component recognition camera 11 and captured by the component recognition camera 11. The processing result is sent to the CPU 5. That is, the CPU 5 outputs an instruction to the recognition processing device 9 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 11 and receives the recognition processing result from the recognition processing device 9. is there.

Further, a monitor 14 for displaying an operation screen and the like, and a touch panel switch 15 as an input device formed on the display screen of the monitor 14 are connected to the CPU 5 via the interface 10. The Y-axis motor 9 and the like are connected to the CPU 5 via the drive circuit 24 and the interface 10. Here, a mounting operation of the electronic component will be briefly described. When the printed circuit board production operation is started, if the printed circuit board is inherited from the upstream device (not shown) and exists on the substrate supply unit of the transport device, the printed circuit board on the substrate supply unit is moved to the substrate positioning unit. To position and fix. When the printed circuit board is positioned, the CPU 5 optimizes and creates the beam based on the mounting data stored in the RAM 7 and stores it in the RAM 7 according to the suction and mounting order data as shown in the figure. The Y-axis motor 20 is driven to move in the Y direction, and the X-axis motor 21 is used to move the mounting head in the X direction. The suction nozzle provided in the head is lowered to take out the electronic component from the component supply unit.

  After the removal, the suction nozzle of the mounting head is raised, and the beam mounting head is passed over the component recognition camera 11 as described above, and the plurality of suction nozzles held by the plurality of suction nozzles during this movement. The electronic components can be picked up in a lump, and the picked-up image can be recognized by the recognition processing device to grasp the positional deviation with respect to the suction nozzle.

  Then, by adding the position recognition result of the printed circuit board and each component recognition processing result to the mounting coordinates of the suction and mounting order data stored in the RAM 7, each of the electronic components is placed on the printed circuit board while the suction nozzle corrects the positional deviation. Attach to. When all the electronic components are mounted on the printed board in this way, the printed board is transferred from the board positioning unit to the downstream device via the board discharging unit.

  Here, a flowchart relating to automatic storage of pattern program data at the time of switching the type of printed circuit board in FIG. 7 will be described. First, the management PC 4 accesses the control microcomputer 2 of each electronic component mounting apparatus 1 and periodically checks the production model name of the printed circuit board. The management PC 4 receives this production model name from each control microcomputer 2.

  Then, the management PC 4 determines whether or not the production model name received this time is the same as the one received last time. If it is determined that the name is the same, the interval timer starts counting, for example, the communication is stopped every 1 minute. If the communication stop switch (not shown) is pressed and stopped, the process ends. If not, the process returns to the original state.

  When the management PC 4 determines that the production model name received this time is the same as the one received last time, if it is determined that they are not the same (model switching has been performed), does the current date folder exist? Judge whether or not. In this case, after creating the folder if it does not exist, and if it has already been created, the management PC 4 receives the pattern program data of the production model of the printed circuit board from the control microcomputer 2 and stores it in the folder. .

  When the storage is completed, as described above, the interval timer starts counting, and for example, it is determined whether or not the communication stop is executed every 1 minute, and the communication stop switch is pressed to stop. If it has stopped, it will end. If it has not stopped, it will return.

  In addition, the printed circuit board production operation as described above is performed, and each electronic component mounting apparatus 1 has the printed circuit board on which the electronic component is mounted arranged in the board assembly mounting line or outside the board assembly mounting line. The printed circuit board component mounting state is inspected by the board inspection apparatus. Therefore, the management PC 4 receives the mounting failure data directly from the board inspection device or receives it via some device, or the board inspection device prints out the mounting failure data directly or prints it out through some device. To do.

  Therefore, when the management PC 4 does not receive and prints out, as shown in the flowchart of FIG. 8, the work manager looks at the printed examination table and inputs the keyboard and mouse of the management PC 4. The mounting failure data is input using the device and stored in the storage device of the management PC 4.

  As described above, the contents received or input regarding the mounting defect data are the date and time of inspection or input, the model name of the printed circuit board, the symbol, the defect contents, etc., and the received or input contents are stored in the storage device of the management PC 4. Stored. When receiving or inputting, the management PC 4 searches whether the same symbol as the received or input symbol exists in the mounting data of the pattern program data of the printed circuit board stored in its own storage device.

  When all the pattern program data has been searched and the mounting failure has occurred, in other words, if the mounting data of the pattern program data in which the received or input symbol exists is not found, the process ends. The PC 4 acquires necessary information from the pattern program data. That is, as shown in FIG. 9, from the mounting data of the pattern program data storing the same symbol as the received or inputted symbol, the arrangement number of the component supply unit, the step number of the mounting data, the coordinates on the printed circuit board, The number of the mounting head used, the number of the suction nozzle in the used mounting head, and the component ID (name of the electronic component) are acquired from the suction and mounting order data corresponding to the printed circuit board.

  Also, the management PC 4 acquires necessary information from the operation information (control microcomputer 2) related to the step number in which the symbol is stored. That is, the suction nozzle and the component supply unit are obtained from the operation information (see FIG. 10) of the suction nozzle used for the electronic component of the step number of the mounting data storing the symbol and the operation information (see FIG. 11) of the component supply unit. 12, the number of suctions by suction nozzles from the start of production to the input time as shown in FIG. 12, the number of abnormal parts missing, the number of parts standing abnormalities, the number of parts recognition abnormalities, the total number of abnormalities And the rate of occurrence of abnormalities, the number of suctions per component supply unit from the start of production to the time received or input, the number of abnormalities with no parts, the number of abnormal standing parts, the number of abnormal parts recognition, the total number of abnormalities, and the occurrence of abnormalities The management PC 4 acquires the rate from the electronic component mounting apparatus 1.

  The acquired information is created as detailed mounting failure data as shown in FIG. 13 by the management PC 4 and stored in the storage device as mounting failure data. Further, a screen as shown in FIG. 14 is displayed on the monitor of the management PC 4, and the position of the electronic component on the printed circuit board where the mounting failure has occurred is displayed in white circle on the printed circuit board.

  Therefore, regarding the mounting of electronic components on the printed circuit board handled by the electronic component mounting apparatus 1, the position on the printed circuit board where mounting defects have occurred can be understood at a glance. It can also be useful for determining whether the position adjustment of the backup pin for supporting horizontally from the lower surface is bad.

  Moreover, as shown in FIG. 13, when the number of abnormalities is displayed for each suction nozzle and each feeder (component supply unit), the following effects are obtained. In other words, if there is no particular abnormality in the number of abnormalities by suction nozzle, the number of abnormalities by feeder (component supply unit), or if mounting defects are concentrated in a specific area of the printed circuit board, Since there are not enough printed circuit board fixing devices such as warp and backup pins, the vertical movement of the printed circuit board in the height direction occurs, causing unstable hardware problems, the printed circuit board thickness, and the height direction when installed. It can be concluded that the input value of is one of the wrong data problems.

  Further, by analyzing the mounting failure data as shown in FIG. 13, the cause of the component supply unit being in a poor position for picking up the component, the suction nozzle itself being defective, or the suction nozzle being attached to the mounting head is found. Can help. Accordingly, it is possible to easily identify the cause of the mounting failure of the electronic component, thereby reducing the number of mounting failures and improving the mounting accuracy of the electronic component.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a schematic block diagram of the management system of a board | substrate assembly mounting line. It is a control block diagram of an electronic component mounting apparatus. It is a figure which shows mounting data. It is a figure which shows a printed circuit board. It is a figure which shows adsorption | suction and mounting order data. It is a figure which shows the arrangement | positioning data of a suction nozzle. It is a figure which shows the flowchart which concerns on preservation | save of pattern program data. It is a figure which shows the flowchart which concerns on preservation | save of mounting defect data. It is a figure which shows the acquisition information from pattern program data. It is a figure which shows the operation information according to adsorption nozzle. It is a figure which shows the operation information according to component supply unit. It is a figure which shows the acquisition information from operation information. It is a figure which shows detailed mounting defect data. It is a figure which shows the screen of a monitor.

Explanation of symbols

1 Electronic component mounting device 4 Management PC
5 CPU
7 RAM

Claims (5)

A method for managing a board assembly / mounting line including an electronic component mounting apparatus in which an electronic component is taken out from a plurality of component supply units by a suction nozzle, and the electronic component is mounted on a printed board having a symbol attached to the component mounting position. In
Mounting order data indicating in which order the suction nozzles are used to mount electronic components, using the symbols stored in each mounting order as clues to the mounting data on which position on the printed circuit board the electronic components are mounted in each mounting order The board assembly / mounting line management method is characterized in that the data of the suction nozzle specified by the symbol in the mounting defect data is acquired based on the above. A method for managing a board assembly / mounting line including an electronic component mounting apparatus in which an electronic component is taken out from a plurality of component supply units by a suction nozzle, and the electronic component is mounted on a printed board having a symbol attached to the component mounting position. In
Mounting based on the mounting order data on which suction nozzles are used to mount the electronic components, using the symbols stored in the mounting data as to which position on the printed circuit board to mount the electronic components for each mounting order A method for managing a board assembly / mounting line, wherein necessary information is acquired from operation information of suction nozzles identified by the symbol in the defect data. 3. The board assembly / mounting line management method according to claim 1 , wherein the acquisition is performed by a management computer connected to the electronic component mounting apparatus. 4. The board assembly / mounting line management method according to claim 3, wherein the management computer creates detailed mounting failure data from the acquired information. The management computer creates and stores detailed mounting failure data from the acquired information, and displays the position of the electronic component on the printed circuit board on which the mounting failure has occurred on the monitor of the management computer. The method for managing a board assembly / mounting line according to claim 3 .