JP5014185B2 - Method for manufacturing conductive resin molded article having conductive terminal - Google Patents

Description

  The present invention relates to a method of manufacturing a conductive resin molded product in which conductive fillers used as a telecommunications component, a conductive component for grounding, and the like are dispersed and mixed. The present invention relates to a method for manufacturing a conductive resin molded article having a terminal.

  For electrical components with a structure in which conductive plates, wiring components, grounding components, etc. are embedded in resin molded products, such as memory cards and electrical component connectors, presses for processing metal components such as conductive plates, A header is required. Further, an insert machine for inserting metal parts into the molding die is necessary. Furthermore, there is a problem with a molding die, such as difficulty in manufacturing a mold or high manufacturing cost depending on the accuracy of a metal part to be inserted and the difficulty of mold manufacturing. Furthermore, there is a problem that a resin molded product in which a metal is inserted is not suitable for recycling.

Here, in order to obtain a resin molded product having conductivity without inserting a metal component, it has been proposed to mold an electrical component using a conductive resin in which a conductive filler is dispersed and mixed. For example, it has been proposed to manufacture a resin molded product in which a wiring pattern is formed using a conductive resin and an insulating resin by two-color molding. Such proposals are disclosed in Patent Documents 1 to 4.
JP 2004-22790 A JP 2000-207906 A JP 2006-310135 A JP 2004-349198 A

  In the conductive resin molded product, a phenomenon occurs in which the conductive filler moves from the surface layer portion to the inside during the curing molding process, and the mixing density of the conductive filler tends to be lower in the surface layer portion than in the inside. For this reason, the surface of the obtained conductive resin molded product is often uniform and does not have sufficient conductivity. However, no attention has been paid to this point in the past, and no countermeasure has been proposed.

  Here, in the optical communication module described in Patent Document 1, a plated film in which a through hole is formed in a conductive resin molded product and a ground terminal to be connected through the conductive resin molded product is formed in a portion where the through hole is formed. The continuity is ensured by soldering. However, in the normal plating process, the surface of the conductive resin molded product is etched in the process, and the appearance quality of the conductive resin molded product is deteriorated. In the case of a conductive resin molded product arranged on the surface of an electric device or an electronic device, it is necessary to maintain the appearance quality, so that plating may not be employed.

  On the other hand, it is conceivable to form a conductive terminal by depositing a metal thin film on the surface of the conductive resin molded product. In the case of vapor deposition, since the adhesion of the vapor deposition film is not sufficient for resins other than ABS resin, primer treatment is generally performed on the resin surface. Since the primer itself is insulative, such a base treatment may be an obstacle, and sufficient conductivity may not be provided between the metal vapor-deposited film and the conductive resin molded product.

  An object of the present invention is to produce a conductive resin molded article having a conductive terminal capable of forming a conductive terminal having sufficient adhesion and conductivity on the surface of the conductive resin molded article without impairing the appearance quality. To propose a method.

In order to solve the above problems, a method for producing a conductive resin molded article provided with the conductive terminal of the present invention is as follows.
Molding a conductive resin molded product using a synthetic resin in which a conductive filler is dispersed and mixed,
A metal thin film is formed by a direct vapor deposition method on a predetermined portion of the surface of the conductive resin molded product, and the metal thin film is used as the conductive terminal.
By using the same metal material as the metal thin film for all or a part of the conductive filler, ensuring the adhesion of the metal thin film to the conductive resin molded product,
In the vapor deposition process of the metal thin film by the direct vapor deposition method, the conductive filler dispersed in the conductive resin molded article by eroding the surface layer portion of the conductive resin molded article to a depth of 1 nm to 50 μm. Is substantially exposed to ensure electrical continuity between the conductive filler and the metal thin film.

  In the present invention, a metal thin film made of the same material as the conductive filler is formed on the surface of the conductive resin molded article by a direct vapor deposition method. In the metal thin film vapor deposition step by the direct vapor deposition method, the surface layer portion of the conductive resin molded product is slightly eroded, thereby removing the surface layer portion having a low density of the conductive filler. Therefore, the electrical conductivity between the conductive filler dispersed and mixed in the conductive resin molded product and the metal thin film as the conductive terminal can be ensured without impairing the appearance quality. Moreover, since the metal thin film of the same material as the conductive filler is formed, adhesion between the conductive resin molded product and the metal thin film is also ensured.

  Here, nickel or nickel and carbon frit can be used as the conductive filler. In this case, the metal thin film may be a nickel vapor deposition film.

  Further, in the vapor deposition process of the metal thin film by the direct vapor deposition method, the surface layer portion of the conductive resin molded article may be controlled to erode to a depth of 1 nm to 50 μm.

  Furthermore, what is necessary is just to control the vapor deposition thickness of the metal thin film by a direct vapor deposition method to 20 micrometers or less.

  Next, the conductive resin molded article provided with the conductive terminal of the present invention is manufactured by the above manufacturing method. In the conductive resin molded article of the present invention, the appearance quality of the portion of the conductive terminal formed on the surface is maintained well, and the conductive state of the conductive terminal is good, and the conductive terminal and the conductive resin Adhesion with the molded product is also sufficient.

  In the present invention, a metal thin film made of the same material as the conductive filler dispersed and mixed in the synthetic resin is formed on the surface of the conductive resin molded product by the direct vapor deposition method, and this is used as a conductive terminal. ADVANTAGE OF THE INVENTION According to this invention, the electroconductive resin molded product which was excellent in the external appearance quality, and ensured the electroconductivity and adhesiveness of the conduction | electrical_connection terminal formed in the surface can be obtained.

  Below, with reference to drawings, the manufacturing method of the conductive resin molding provided with the conduction | electrical_connection terminal to which this invention is applied is demonstrated.

  FIG. 1 is an explanatory view showing an example of a conductive resin molded article provided with a conductive terminal manufactured by the method of the present invention. The conduction component 1 shown in the figure can be used as an electrical wiring component and a grounding component of a telecommunication component. The conductive component 1 includes a rectangular main body portion 2 made of an insulating synthetic resin and a wiring pattern portion 3, 4, 4 made of three conductive synthetic resins incorporated in the main body portion 2. And 5. The conductive synthetic resin is obtained by mixing and dispersing conductive fillers made of nickel, and one end of each of the wiring pattern portions 3, 4, 5 is an exposed end surface exposed from the end surface 2 a of the main body portion 2, Conductive terminals 6, 7, and 8 made of a nickel thin film are formed on these exposed end faces.

  The conductive component 1 having this configuration is manufactured as follows. First, an insulating synthetic resin and a conductive synthetic resin are prepared. Using a multicolor molding machine, for example, a two-color molding machine, the conductive synthetic resin is injected into the molding die on the primary molding side, and each wiring pattern The parts 3, 4, and 5 are formed. Further, on the secondary molding side, the insulating synthetic resin is injected into the molding die to mold the main body portion 2.

  A nickel vapor deposition film is formed by a direct vapor deposition method on the end surfaces of the wiring pattern portions 3, 4, and 5 exposed on the end surface 2a of the conductive component 1 obtained by the two-color molding. In the vapor deposition process of the nickel thin film by the direct vapor deposition method, the surface layer portion on the exposed end face of each wiring pattern portion 3, 4, 5 which is a conductive resin molded product is eroded and dispersed in the conductive resin molded product. Nickel as the conductive filler is exposed, and conduction between the conductive filler and the nickel thin film is ensured. Further, since the exposed conductive filler and the deposited thin film are both nickel and the same metal, sufficient adhesion is secured between them. Therefore, the deposited thin film may be a thin film having a thickness of 20 μm or less. Furthermore, the amount of erosion of the exposed end faces of the respective wiring pattern portions 3 to 5 in the film forming process in the direct vapor deposition method is slight. For example, the depth ranges from 1 nm to 50 μm. Therefore, the appearance quality of the end surface 2a of the main body portion 2 is not deteriorated.

(Other embodiments)
Note that nickel and carbon frit can be used as the conductive filler. It is also possible to form a metal vapor deposition film other than nickel and use the same metal material as the metal vapor deposition film as the conductive filler.

  In the above example, the conductive wiring pattern portion is formed on the insulating main body portion by two-color molding. However, a conductive resin molded product having a predetermined shape is formed using a conductive synthetic resin, and the surface It is also possible to form a conduction terminal at a predetermined site by direct vapor deposition and use it as a grounding component.

It is explanatory drawing which shows an example of the conduction | electrical_connection component to which this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Conductive component 2 Insulating main-body part 2a End surface 3, 4, 5 Conductive wiring pattern part 6, 7, 8 Nickel thin film as a conductive terminal

Claims (4)

In the method for producing a conductive resin molded product provided with a conductive terminal,
Molding a conductive resin molded product using a synthetic resin in which a conductive filler is dispersed and mixed,
A metal thin film is formed by a direct vapor deposition method on a predetermined portion of the surface of the conductive resin molded product, and the metal thin film is used as the conductive terminal.
By using the same metal material as the metal thin film for all or a part of the conductive filler, ensuring the adhesion of the metal thin film to the conductive resin molded product,
In the vapor deposition process of the metal thin film by the direct vapor deposition method, the conductive filler dispersed in the conductive resin molded article by eroding the surface layer portion of the conductive resin molded article to a depth of 1 nm to 50 μm. Is substantially exposed to ensure conduction between the conductive filler and the metal thin film. A method for producing a conductive resin molded article having a conductive terminal. In the manufacturing method of the conductive resin molding provided with the conduction terminal according to claim 1,
The conductive filler is nickel or nickel and carbon frit,
The method for producing a conductive resin molded article having a conduction terminal, wherein the metal thin film is a nickel vapor deposition film. In the manufacturing method of the conductive resin molding provided with the conduction terminal according to claim 1 or 2,
A method for producing a conductive resin molded article having a conductive terminal, wherein a deposition thickness of the metal thin film is controlled to 20 μm or less . A conductive resin molded article produced by the production method according to claim 1 .

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