JP5022796B2 - Multilayer printed circuit board base material - Google Patents

Description

  The present invention relates to an improvement in an arrangement structure of multilayer printed circuit boards in a multilayer printed circuit board base material, and in particular, a plurality of multilayer printed circuit boards are obtained by dividing a multilayer printed circuit board base material in which regions with low plate thickness accuracy are easily formed along the outer peripheral edge. The present invention relates to a technique that makes it possible to reduce the amount of discarded plates while minimizing the adverse effect of the low-thickness region on individual multilayer printed circuit boards.

Multi-layer printed circuit boards used in various electrical and electronic equipment are integrated by hot pressing in a mold with copper foil laminated on both sides of an insulating adhesive layer, and then a circuit pattern on the copper foil part. A double-sided board obtained by forming a substrate is manufactured by laminating a predetermined number of sheets and hot pressing, taking out from the mold, and then performing necessary processing such as cutting, through-hole processing, outer layer formation, and the like (Japanese Patent Laid-Open No. 2001). -308541).
The insulating adhesive layer has a structure in which a glass cloth is impregnated with an insulating resin and dried, but when a copper foil is laminated on the insulating adhesive layer by hot pressing, it is pressed with a flat hot plate. Then, the board thickness of the obtained double-sided board edge becomes thin compared with the center part. This is because when the insulating adhesive layer consisting of glass cloth and insulating resin is heated / pressurized, the glass cloth can only play a role in suppressing the fluidity of the resin, and the thickness of the double-sided substrate cannot be determined. In addition, the fluidity of the insulating resin is higher at the edge of the substrate than at the center, and the resin component in the insulating adhesive layer tends to flow out of the substrate from the edge of the substrate, resulting in insufficient resin at the edge. This is because a difference in plate thickness occurs.
For this reason, when performing batch processing for manufacturing a multilayer printed board requiring high plate thickness accuracy from a multilayer printed board base material having a large area, the discarded board width of the edge of the multilayer printed board base material is increased. There was a problem that it was necessary.

FIG. 5 shows an arrangement structure of multilayer printed circuit boards in a conventional multilayer printed circuit board base material.
Here, the multilayer printed circuit board base material 100 is referred to as a workpiece, each multilayer printed circuit board 110 is referred to as a piece, and the unit 120 including a plurality of multilayer printed circuit boards is referred to as a sheet.
In the rectangular workpiece (base material) 100, a low-accuracy region with low plate thickness accuracy is formed along the outer peripheral edge (four sides). In addition, within the area of each piece 110, due to the type of wiring pattern to be formed and the presence / absence of a connector portion, a portion (high accuracy portion) 111 that requires high plate thickness accuracy and accuracy are required. The part (low precision part) 112 which is not performed is formed. If the high-precision portion 111 in the piece 110 arranged at a position along the outer peripheral edge of the workpiece 100 is disposed close to the outer peripheral edge (low-precision area) of the workpiece 100, the plate thickness accuracy may be reduced due to the adverse effect of the low-precision area. Therefore, as shown in FIG. 5, the orientation of the piece is set so that the low accuracy portion 112 of the piece 110 located along the workpiece outer peripheral edge 101 faces the outer peripheral edge (low accuracy region) 101 of the workpiece. . However, if all the pieces 110 are directed in the same direction in this way, the pieces 110 located along the other three sides 102, 103, and 104 of the workpiece 100 are less likely to be adversely affected by the low precision region. It was necessary to ensure a wide width of the plate 130, which was wasteful.
Conventionally, as disclosed in Japanese Patent Laid-Open No. 2001-308541, a method of controlling the resin flow by adjusting the material for ground connection of the printed wiring board to the housing is generally used. There was a problem that increased.
JP 2001-308541 A

  The present invention has been made in view of the above, and as a result of using an insulating adhesive layer made of glass cloth and an insulating resin, a multilayer printed circuit board mother in which a region with low plate thickness accuracy is easily formed along the outer peripheral edge. When a material is manufactured and then divided into multiple multilayer printed circuit boards, the number of discarded boards is reduced while minimizing the adverse effect of the low thickness accuracy on each multilayer printed circuit board. An object of the present invention is to provide a multilayer printed circuit board base material that can be used.

In order to achieve the above object, the invention of claim 1 is a multilayer in which a plurality of double-sided substrates having an insulating adhesive layer and conductive layers laminated and integrated on both sides of the insulating adhesive layer are laminated and integrated. A rectangular multilayer printed circuit board base material having a structure in which a plurality of multilayer printed circuit boards having a printed circuit board and a plurality of multilayer printed circuit board units arranged in a vertical and horizontal direction in the same direction are connected in a plate shape, substrate is rectangular, and has a high-precision parts accuracy of plate thickness is higher in the region along its end edge, having a lower thickness accuracy low-precision portion along the other end edge opposed region, the All the multilayer printed circuit boards are arranged along the four sides of the multilayer printed circuit board base material, with each substrate unit being arranged so as to be point symmetric or line symmetric with respect to the center point of the multilayer printed circuit board base material The low spirit Portion is characterized by being arranged to face the outside of the four sides of the multilayer printed circuit board base material.

According to a second aspect of the present invention, in the first aspect , the plurality of multilayer printed circuit boards constituting each of the board units are arranged such that the low precision portion faces the outer peripheral edge of each of the board units. And
According to a third aspect of the present invention, in the first aspect , the board unit disposed along the four sides of the multilayer printed circuit board base material has the low accuracy of the multilayer printed board disposed along two consecutive sides. It is characterized in that the portions are arranged so as to face outward, and the directions of the substrate units arranged at the four corners of the multilayer printed circuit board base material are changed in directions rotated by 90 degrees.
According to a fourth aspect of the present invention, in any one of the first to third aspects, the substrate unit is a square or a rectangle close to a square.
According to a fifth aspect of the present invention, in the third aspect , when the number of the board units constituting the single multilayer printed board base material is an odd number exceeding four, the multilayer printed board base material The arrangement of the multilayer printed circuit boards in the inner board unit other than the board units along the four sides is directed in one direction.

All the multilayer printed circuit boards arranged along the four sides of the multilayer printed circuit board base material are arranged so that the low precision portion faces the outside of the four sides of the multilayer printed circuit board base material, so that the plate thickness accuracy is low along the outer peripheral edge. When producing a multilayer printed circuit board base material in which regions are easily formed and then dividing the substrate to obtain a layer printed circuit board, while minimizing the adverse effects of the areas with low plate thickness accuracy on the individual multilayer printed circuit boards The amount of discarded board can be reduced.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
FIG. 1 is a plan view showing a configuration of a multilayer printed circuit board base material (work) 1 according to a first embodiment of the present invention.
The multilayer printed circuit board base material (work) 1 is a large-area plate-like body in which a plurality of multilayer printed circuit boards (pieces) 10 are arranged vertically and horizontally, and in this example, eight rectangular pieces 10 are formed as one unit. As the (substrate units) 20, eight substrate units 20 are arranged in two rows in the front-rear direction, and three substrate units (sheets) 20 are arranged horizontally on the left and right sides thereof.
The multilayer printed circuit board base material 1 is a rectangular multilayer printed circuit board in which a plurality of double-sided boards each having an insulating adhesive layer (not shown) and a conductive layer laminated and integrated on both sides of the insulating adhesive layer are stacked and integrated. 10 are connected in a plurality of plates, and the planar shapes of the multilayer printed board base material 1, the multilayer printed board 10, and the board unit 20 are all rectangular. In a region along the four sides of the rectangular multilayer printed circuit board base material 1, a low-accuracy region having a reduced amount of resin compared to the central portion is formed with a required width.
The multilayer printed circuit board 10 has a high-precision portion 11 with a high plate thickness accuracy in a region along one edge, and a low-precision portion 12 with a low plate thickness accuracy in a region along another opposite edge. Yes.

The characteristic configuration of the present invention is that all the multilayer printed boards 10 (the outermost multilayer printed board 10A) arranged along the low-precision area formed along the four sides of the rectangular multilayer printed board base material 1 are arranged. The low-precision portion 12 is arranged so as to face each low-precision region side of the outer periphery of the multilayer printed circuit board base material 1. Since the multilayer printed circuit boards 10 in the individual substrate units 20 face the same direction, the low precision portion 12 of the inner multilayer printed circuit board 10B also faces the outside (low precision region) of the multilayer printed circuit board base material 1. Yes.
Speaking of the eight substrate units 20 located in the center, the directions of the multilayer printed circuit boards 10 constituting the four sheets are opposite in the front-rear direction (vertical direction) center. That is, the four substrate units 20 on the upper side of the drawing are arranged so that the low-precision portions of each piece face the upper edge (low-precision region) of the multilayer printed circuit board base material 1, and the four substrates on the lower side of the drawing. The unit 20 is arranged so that the low-precision portion 12 of each piece faces the lower edge (low-precision region) of the multilayer printed circuit board base material 1.

In addition, the direction of the multilayer printed circuit board 10 is reversed for each of the three board units 20 located on the left and right. That is, the three board units 20 on the left side of the drawing are arranged so that the low-precision portion of each piece faces the left edge (low-precision area) of the multilayer printed circuit board base material 1, and the three boards on the drawing → side. The unit 20 is arranged so that the low precision portion 12 of each piece faces the edge (low precision area) on the → side of the multilayer printed circuit board base material 1.
Since all the multilayer printed circuit boards 10 arranged along the outermost peripheral edge (four sides) of the multilayer printed circuit board base material 1 are arranged (impositioned) so that the low-precision portion 12 faces the outside as described above, the multilayer printed circuit board When the base material 1 is manufactured by hot pressing, all of the multilayer printed circuit boards 10 are within the high-precision region (high-precision region) in the center of the base material excluding the low-precision region along the four sides. The precision portion 11 will be located.
Therefore, the influence of the low accuracy region of the base material can be eliminated. In addition, since the discarded plate portion 30 can be reduced to a narrow range (in this example, only the narrow regions at the four corners), waste of material can be eliminated. In this way, the quality of the product can be stabilized by disposing a portion (high precision portion 11) that requires the plate thickness accuracy in each piece at the center of the multilayer printed circuit board base material 1 where the plate thickness is stable. it can.

In addition, when the high precision part 11 and the low precision part 12 are not clearly divided in each multilayer printed circuit board 10, a wiring pattern and a connector part that require a high precision plate thickness are formed. The high-accuracy portion 11 and the low-accuracy portion 12 for forming a wiring pattern that can be formed in the low-accuracy portion are clearly separated, and the low-accuracy portion 12 of each multilayer printed circuit board 10 is divided into the low-precision portions of the multilayer printed circuit board base material 1. It arrange | positions facing an area | region (outer periphery).
As described above, the high-precision portion 11 that requires plate thickness accuracy, the low-precision portion 12 that does not require plate-thickness accuracy, and a single piece are divided into two regions, and the low-precision portion 12 faces the outside of the substrate unit 20. The width (total area) of the discard plate 30 can be reduced.

Next, FIG. 2 is a configuration explanatory view of a multilayer printed board base material having an array of multilayer printed boards according to another embodiment of the present invention.
As shown in FIG. 5, in the case where plate thickness accuracy is required in the vicinity of the outer edge of one multilayer printed board 10 and on one side or more, if the directions of each multilayer printed board 10 and each board unit 20 are the same, It is necessary to enlarge the three-sided discard plate 30 during imposition.
In the present invention, the multilayer printed circuit board base material 1 has a configuration in which a plurality of multilayer printed circuit boards 10 are arranged in the form of a plurality of board units 20 that are arranged in the vertical and horizontal directions in the same direction. 20 are arranged so as to be point-symmetric or line-symmetric with respect to the center point (intersection of diagonal lines) of the rectangular multilayer printed circuit board base material 1.
In this embodiment, the low-precision portion 12 is not simply arranged along the outer peripheral edge of the multilayer printed board base material 1 as shown in FIG. 1, but each multilayer printed board 10 or a board including a plurality of multilayer printed boards 10. Since the unit 20 is provided point-symmetrically or line-symmetrically with respect to the center point of the rectangular multilayer printed circuit board base material 1, the low-precision portion 12 that does not require plate thickness accuracy is arranged outside the workpiece. The discard plate 30 formed at the four corners as shown in FIG. 1 can be eliminated, and the entire discard plate area can be reduced.

Next, FIG. 3 is a plan view showing a configuration of a multilayer printed circuit board base material according to another embodiment of the present invention.
As shown in FIG. 5, when the discard board is arranged outside the board unit, the total number of multilayer printed boards that can be imposed on one multilayer printed board base material is reduced. Further, in the configuration example of FIG. 3, a discarded plate portion is formed at a corner portion in each substrate unit 20. In the embodiment of FIG. 2, there is a waste of forming a discarded plate portion in each substrate unit 20.
Therefore, in the multilayer printed wiring board base material 1 according to the embodiment of FIG. 3, each of the multiple multilayer printed circuit boards 10 constituting each board unit 20 has the low precision portion 12 on two continuous sides 20 a of each board unit 20. It is characteristic that it is arranged so as to face each other.
If attention is paid to the arrangement of the multilayer printed circuit boards 10 in the individual circuit board units 20, the eight rectangular printed circuit boards 10 are directed in the same direction (each multilayer printed circuit board 10 in the low precision region of the multilayer printed circuit board base material 1). Are arranged in two rows (so that the low-precision portion 12 of the two are facing), and the two multilayer printed circuit boards 10 are disposed outside the surplus space S on the side of the eight multilayer printed circuit boards 10. It arrange | positions so that it may face (the outer periphery of each board | substrate unit 20).

Further, the individual board units 20 are arranged so as to be point symmetric or line symmetric with respect to the center point of the multilayer printed board base material 1. When imposing the multilayer printed circuit board, by disposing each substrate unit 20 point-symmetrically with respect to the center point of the multilayer printed circuit board base material 1, it is possible to dispose low precision portions that do not require plate thickness accuracy to the outside. It is possible to reduce the width of the discarded plate.
Furthermore, in this embodiment, the multilayer printed circuit board 10 is arranged so that the low-precision portions 12 face each other along two adjacent sides of the four sides of each board unit 20 or along two or more sides. By arranging and rotating the substrate units 20 located at the four corners of the multilayer printed circuit board base material 1 by 90 degrees (in different directions by 90 degrees), each multilayer print The low-precision portion 12 of the substrate 10 can be prevented from coming to the edge of the multilayer printed circuit board base material 1, and the total number of multilayer printed circuit boards 10 that can be imposed on one multilayer printed circuit board base material 1 is calculated. Can be increased.
Thus, according to the present embodiment, when imposing the multilayer printed circuit board 10 in the board unit 20, the high-precision portions 11 that require plate thickness accuracy are arranged facing the inside of the board unit 20, and are individually The quality of the multilayer printed circuit board is stable. In other words, by arranging the low-precision portion 12 that does not require plate thickness accuracy toward the outer peripheral edge of the substrate unit 10, the plate thickness accuracy is set when imposing the multilayer printed circuit board 10 in the multilayer printed circuit board base material 1. Therefore, the high-precision portion 11 that needs to be disposed inside the work can reduce the area of the discarded plate in each substrate unit 20.

Next, FIG. 4 is a plan view showing a configuration of a multilayer printed board unit base material according to another embodiment of the present invention.
In the embodiment of FIG. 3, a crank-shaped discard plate 30 is formed at the center of the multilayer printed circuit board base material 1.
In the present embodiment, since the planar shape of each board unit 20 is a square or a rectangle close to a square, no discarded board is formed at the center of the multilayer printed circuit board base material, or the number of discarded boards is reduced. It becomes possible.
Next, in FIG. 3, when the number of substrate units 20 to be applied to one multilayer printed circuit board base material 1 exceeds 2 × 2 = 4, useless discard plates other than the substrate units arranged at the four corners Will occur.
In order to cope with such a problem, when the number of substrate units 20 to be applied to one multilayer printed circuit board base material 1 is an odd number exceeding four, four sides (four corners) of the multilayer printed circuit board base material are used. The imposition of the multilayer printed circuit board 10 in the inner board unit 20 other than the board unit 20 along the same line as FIG. That is, the direction of the printed wiring board 10 in all the board units 20 located inside is set so as to face one direction.
According to this, the area of the discard plate can be reduced.

It is a top view which shows the structure of the multilayer printed circuit board base material (workpiece | work) which concerns on the 1st Embodiment of this invention. It is composition explanatory drawing of the multilayer printed circuit board base material provided with the arrangement | sequence of the multilayer printed circuit board which concerns on other embodiment of this invention. It is a top view which shows the structure of the multilayer printed circuit board base material which concerns on other embodiment of this invention. It is a top view which shows the structure of the multilayer printed circuit board unit base material which concerns on other embodiment of this invention. It is structure explanatory drawing of the multilayer printed circuit board base material of a prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multilayer printed circuit board base material (workpiece), 10 ... Printed wiring board (piece), 10 ... Multilayer printed circuit board, 10A ... Outer multilayer printed circuit board, 10B ... Inner multilayer printed circuit board, 11 ... High precision part, 11 ... Low precision Part 12: Low precision part 20 ... Substrate unit 30 ... Discard plate

Claims (5)

A multilayer printed circuit board in which a plurality of double-sided boards each having an insulating adhesive layer and a conductive layer laminated and integrated on both sides of the insulating adhesive layer are integrated; A rectangular multi-layer printed circuit board base material having a structure in which a plurality of board units arranged vertically and horizontally in a direction are connected in a plate shape ,
The multilayer printed circuit board has a rectangular shape, and has a high-precision portion with high plate thickness accuracy in a region along one edge of the multilayer printed circuit board, and a low-precision portion with low plate thickness accuracy in a region along another opposite edge. And
All the multilayer prints arranged along the four sides of the multilayer printed circuit board base material while arranging the respective board units so as to be point symmetric or line symmetric with respect to the center point of the multilayer printed circuit board base material A multilayer printed circuit board base material, wherein the substrate is disposed such that the low-precision portion faces the outside of the four sides of the multilayer printed circuit board base material. 2. The multilayer printed circuit board mother according to claim 1 , wherein each of the plurality of multilayer printed circuit boards constituting each of the circuit board units is arranged such that the low precision portion faces the outer peripheral edge of each circuit board unit. Wood. The board unit arranged along the four sides of the multilayer printed circuit board base material is arranged such that the low-precision portion faces the outside of the multilayer printed board arranged along two continuous sides, and 2. The multilayer printed circuit board base material according to claim 1 , wherein the directions of the substrate units arranged at the four corners of the multilayer printed circuit board base material are changed to directions rotated by 90 degrees. The multilayer printed circuit board base material according to any one of claims 1 to 3 , wherein the substrate unit is a square or a rectangle close to a square. In Claim 3 , when the number of the board units constituting the single multilayer printed circuit board base material is an odd number exceeding four, other than the board unit along the four sides of the multilayer printed wiring board base material A multilayer printed circuit board base material characterized in that the arrangement of the multilayer printed circuit boards in the substrate unit on the inside is directed in one direction.

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