JP5031638B2 - Warpage correction device for screen printing machine - Google Patents

Description

  The present invention is provided in a screen printing machine that applies a coating agent on a screen plate onto a printed board by moving a squeegee, and presses the printed board supported by the board support device from above to correct the warp. The present invention relates to a warp correction device in a printing press.

This type of screen printing machine is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-228707, and generally includes a warp correction device that presses a printed circuit board supported by a substrate support device from above to correct the warpage.
JP 10-44370 A

  However, since the position of the pressing point differs depending on the type of printed circuit board, the pressing member provided on the descending warpage prevention body has to be rearranged, which is troublesome for the operator.

  Therefore, an object of the present invention is to provide a warp correction apparatus in a screen printing machine that can cope with a simple operation even if the type of a printed board changes.

  For this reason, the first invention is provided in a screen printing machine for applying the coating agent on the screen plate onto the printed circuit board by moving the squeegee, and warps the printed circuit board supported by the substrate supporting device from above. A warp correction device in a screen printing machine that corrects the above, and is provided in a movable main body that is movable between the screen plate and a printed circuit board supported by the substrate support device, and has a large diameter portion. A lifting body provided with a plurality of locking members each having a small diameter portion, a plurality of pressing members that press the printed circuit board supported by the substrate support device from above, and the large diameter portion of the locking member A warpage prevention body provided with a plurality of locking holes each comprising a large diameter hole to be fitted and a small diameter hole to which the small diameter portion communicating with the large diameter hole is fitted; After fitting the large-diameter portion of the locking member and the large-diameter hole of the locking hole of the warpage prevention body, the small-diameter portion of the locking member is moved by moving the warpage prevention body in the horizontal direction. And a small-diameter hole of the locking hole of the warpage prevention body, and the warpage prevention body is detachably attached to the elevating body.

  2nd invention is provided in the screen printer which apply | coats the coating agent on a screen board on a printed circuit board by moving a squeegee, and presses the printed circuit board supported by the board | substrate support apparatus from upper direction, and corrects curvature. A warp correction apparatus for a screen printing machine, wherein the apparatus main body is movable between a screen board and a printed board supported by the board support apparatus, and is provided with a large-diameter hole and a large-diameter hole. A lifting / lowering body provided with a plurality of locking holes each having a small-diameter hole communicating therewith, and a plurality of pressing members for pressing the printed circuit board supported by the substrate support device from above, and a large-diameter hole of the locking holes And a warpage prevention body provided with a plurality of locking members each having a large diameter portion that fits into a small diameter portion and a small diameter portion that fits into a small diameter hole, and the locking provided in the warpage prevention body After the large-diameter portion of the material and the large-diameter hole of the locking hole of the lifting body are fitted, the warp prevention body is moved in the horizontal direction, thereby engaging the small-diameter portion of the locking member and the lifting body. A small diameter hole of a stop hole is fitted, and a warp preventing body is detachably attached to the elevating body.

  The present invention can provide a warp correction apparatus in a screen printing machine that can cope with a simple operation even if the type of printed circuit board changes.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The screen printing machine shown in FIG. 1 is for printing cream solder as a coating agent on a printed circuit board P. A substrate support unit 2 installed on the apparatus main body 1 and above the substrate support unit 2 are provided. A screen 3 supported by a screen support means (not shown) provided with a moving mechanism for moving in the Y-axis direction (left-right direction in FIG. 1) extending in the horizontal direction, a substrate support unit 2, and a screen 3; And a substrate correction unit 9 which includes a substrate correction unit 9 which will be described later and corrects warping by pressing the printed circuit board from above. A recognition unit 4 and a printing mechanism 7 provided above the screen 3 and provided with a squeegee 6 are provided.

  The substrate support unit 2 includes a moving mechanism (not shown) that can move in the X-axis direction, the angular direction in the horizontal plane, and the vertical direction, and a substrate transfer mechanism (not shown) that transfers the printed board P in the X-axis direction. 2), a backup table 2A having a backup pin for supporting the printed circuit board P from below and movable in the Z direction, and a pair of support chutes 2B for supporting (clamping) the printed circuit board from the side. ing.

  The substrate correction recognition unit 4 can move in the Y-axis direction (the left-right direction in FIG. 1) between the position below the screen 3 and the position retracted from the screen 3, and only a part of the substrate correction unit 9 can move in the vertical direction. It is.

  The printing mechanism 7 includes a squeegee 6 for printing cream solder on the printed circuit board P, a moving mechanism for moving in the Y-axis direction, and a vertical moving mechanism for moving the squeegee 6 in the vertical direction. ing.

  A screen cleaning unit 10 is disposed on the screen 3 obliquely below and to the left in FIG. The screen cleaning unit 10 includes a frame 12 and can be moved obliquely upward to the right, that is, toward the screen 3 by a driving source (not shown) along a guide provided in the apparatus main body 1 of the screen printing machine.

  In FIG. 2, the frame 12 has a long cleaning sheet 14 formed of a material for wiping off the cream solder adhering to the lower surface of the screen 3 and containing a solvent for dissolving the cream solder. A pressure contact head 15 that presses the cleaning sheet 14 against the lower surface of the screen 3 and guides the cleaning sheet 14 so that the feeding direction of the portion of the cleaning sheet 14 that contacts the screen is parallel to the moving direction A of the screen 3; A feeding mechanism 13 for sending the cleaning sheet 14 in the length direction and a solvent supply means for supplying the solvent to the cleaning sheet 14 are attached. However, in the present embodiment, the pressure contact head 15 and the solvent supply means are integrally formed.

  The frame 12 can be moved obliquely upward to the right, that is, toward the screen 3 by a driving source (not shown) along a guide provided in the apparatus main body 1 of the screen printing machine, and the pressure contact head 15 moves the cleaning sheet 14 to the screen 3. The pressure contact head 15 can move to a position where it is pressed against the screen 3 or a position where the pressure contact head 15 is spaced downward from the screen 3.

  The cleaning sheet 14 is mounted on the supply roller 16 of the feeding mechanism in a rolled state, is conveyed through a conveying roller 17 and a suction chamber 18 described later serving as a guide member, and is wound around a winding roller 19. Taken.

  Next, the solvent supply means will be described. A double solvent passage is formed along the longitudinal direction of the head main body 21, that is, a cylindrical groove is formed, and the hollow cylindrical body 23 is disposed in the groove with a space therebetween. Then, the solvent in the solvent tank (not shown) containing the solvent is driven by a supply pump (not shown), and the groove of the head main body 21 is connected via the supply hose and the plurality of joints 24 provided on the head main body 21. The inner hollow cylinder 23 is filled with a solvent. In addition, the solvent filled in the hollow cylinder 23 (inside the inner passage) is a space between the inner surface of the groove and the outer surface of the hollow cylinder 23 through a plurality of communication holes formed in the hollow cylinder 23. The inside (inside the outside passage) is filled sequentially from below.

  A plurality of solvents are provided on the upper surface 21 </ b> A, which is a surface for wiping off the cream solder of the head body 21, at equal intervals communicating with the space between the inner surface of the groove and the outer surface of the hollow cylindrical body 23 and the communication passage 25. An air outlet 26 is opened, and the solvent filled in the space between the groove inner surface and the outer surface of the hollow cylindrical body 23 is pumped by driving of a supply pump to be passed from the plurality of solvent air outlets 26 to the upper cleaning sheet 14. Can be sprayed. In this case, when pressure is applied to the solvent in the hollow cylindrical body 23 by the supply pump, the solvent can be evenly sprayed from the plurality of solvent outlets 26 to the cleaning sheet 14.

  A communication passage 31 communicating with the suction port 30 established on the upper surface 21A is formed in the head main body 21 of the pressure contact head 15, and the suction port 30 faces the back surface of the cleaning sheet 14 in contact with the screen 3. A suction chamber 18 connected to a suction source via a hose 32 is connected to the other end of the communication path 31. When the suction source is driven, cream solder attached to the screen 3 passes through the cleaning sheet 14. Sucked and adhered to the cleaning sheet 14.

  The pressure contact head 15 and the solvent supply means are integrally formed, the solvent supply means and the pressure contact head 15 are provided adjacent to each other along the moving direction of the screen 3, and the solvent outlet 26 and the suction port 30 are It will be arrange | positioned in the position near. That is, by moving the screen 3 back and forth while the screen cleaning unit 10 is stopped, the cleaning sheet 14 is moved so as to rub the back surface of the screen 3, and the solvent is sprayed onto the cleaning sheet to dissolve the cream solder. Is cleaned by adhering the cream solder to the cleaning sheet 14, and the solvent outlet 26 and the suction port 30 are formed on the upper surface 21 </ b> A of the head main body 21 of the press contact head 15 that is the wiping surface of the cream solder. ing.

  Next, the substrate correction unit 9 that can move between the screen 3 and the printed circuit board P supported by the substrate support unit 2 and the retracted position will be described in detail with reference to FIGS. . FIG. 3 is a plan view of the substrate correction unit 9. The left part of FIG. 3 is the front side of the screen printer and the right part is the rear side. Reference numeral 40 denotes a support frame body having a U-shape in a plan view. This support frame body 40 is an apparatus main body of the substrate correction unit 9, and support pieces having an L-shaped cross section at the four corners of the support frame body 40. 41 is fixed upright.

  A lifting plate 44 is supported by the support frame 40 so as to be movable up and down, and a plurality of locking members 45 having a large diameter portion 45A and a small diameter portion 45B are provided. The left and right opposing sides (opposite sides on the back side and the near side in FIG. 1) of this lifting plate 44 are raised to form a support piece 44A.

  Reference numeral 47 denotes a warp prevention body, which includes a plurality of pressing members 48 that elastically press the printed circuit board P supported by the substrate support unit 2 from above with a spring (not shown), and the large diameter of the locking member 45. A plurality of locking holes 49 each having a large-diameter hole 49A into which the portion 45A is fitted and a small-diameter hole 49B into which the small-diameter portion 45B communicated therewith is provided. However, the inner diameter of the large-diameter hole 49A of the locking hole 49 provided in the warp prevention body 47 is slightly larger than the outer diameter of the large-diameter portion 45A of the locking member 45 provided on the elevating plate 44, and the small-diameter portion 45B The inner diameter of the small diameter hole 49B is slightly larger than the outer diameter, and the outer diameter of the large diameter portion 45A is larger than the inner diameter of the small diameter hole 49B.

  Accordingly, the operator raises the warp prevention body 47 to fit the large diameter portion 45A of the locking member 45 and the large diameter hole 49A opened in the warpage prevention body 47, and then slides the warpage prevention body 47. Thus, the warp prevention body 47 can be attached to the lift plate 44 by moving the warp prevention body 47 so that the small diameter portion 45B of the locking member 45 fits into the small diameter hole 49B (FIG. 3 to FIG. 3). (See FIG. 6).

  Then, a link shaft 51 that is provided with a pivotable shaft 50 that passes through the left and right support pieces 41, 41, and has an L-shape in a side view with an intermediate portion inserted through the shaft 50, 51 is fixed. When the shaft 52 passes through the front ends of the link pieces 51 and 51 and the support piece 44A of the lifting plate 44, and the link pieces 51 and 51 rotate together with the shaft 50 in the counterclockwise direction in FIG. It descends away from the support frame 40.

  Further, as shown in FIG. 7, when the contact member 53 fixed to the shaft 50 on the near side between the left and right link pieces 51, 51 is pressed forward by the operation of the cylinder 54 which is a pressing operation drive source, As described above, the link pieces 51 and 51 are rotated counterclockwise from the state of FIG. 8 as shown in FIG. 9, and the elevating plate 44 is lowered so as to be away from the support frame body 40.

  A spring 56 is stretched between the support portion 55 provided on the upper portion of the support piece 41 fixed to the support frame 40 and the shaft 52, and the link pieces 51 and 51 are rotated clockwise in FIG. Since it is biased to rotate and is biased to approach the support frame 40 when the cylinder 54 is not in operation, the lift plate 44 is in a raised state.

  Next, the operation of the screen printing machine will be described. When the printed circuit board P is supplied to the support chute 2A of the substrate support unit 2 by the transfer device and is locked and positioned by a stopper pin (not shown), it is positioned between the screen 3 and the substrate support unit 2. The lift plate 44 and the warp prevention body 47 of the substrate correction unit 9 of the substrate correction recognition unit 4 are lowered.

    That is, when the cylinder 54 is activated first, the extended rod presses the contact member 53 fixed to the shaft 50, and the shaft 50 and the link pieces 51, 51 are resisted against the biasing force of the spring 56. Is rotated counterclockwise (see FIG. 9), and the warp prevention body 47 that is rotatably connected to the link pieces 51, 51 via the shaft 52 is lowered.

  Then, the backup table 2B of the substrate support unit 2 is raised, and the printed circuit board P is sandwiched between the backup table 2B and the pressing member 48 of the warp prevention body 47 of the substrate correction unit 9, and this state is maintained for a certain time. The warp of the printed circuit board P is corrected.

  Next, by operating the cylinder 54 and retracting the rod, the urging force of the spring 56 rotates the shaft 50 and the link pieces 51 and 51 in the clockwise direction in FIG. 5 (see FIG. 4). Then, the warp prevention body 47 that is rotatably connected to the link pieces 51, 51 is raised, and the substrate correction recognition unit 4 is retracted from the screen 3.

  Then, the support chute 2A and the backup table 2B are raised, the printed board P is brought into contact with the lower surface of the screen 3, the printing mechanism 7 is operated, and the squeegee 6 causes the cream solder to pass through the printed pattern holes of the screen 3. Print on P. After this printing, the support chute 2A and the backup table 2B of the substrate support unit 2 are lowered to release the plate.

  In this way, the printing operation is performed. As this printing is repeated, a part of the cream solder pushed into the printing pattern hole oozes out to the lower surface side of the screen 3 and adheres to the lower surface of the screen 3. There are things to do. For this reason, it is necessary to clean the screen 3, which will be described below.

  First, after moving the screen 3 to a position above the screen cleaning unit 10, the screen cleaning unit 10 is rotated around the center line of the support shaft 11 and moved upward. As a result, the cleaning sheet 14 is brought into pressure contact with the lower surface of the screen 3 by the pressure contact head 15.

  When a pressure is applied to the solvent in the hollow cylindrical body 23 by the pumping means, a plurality of solvents filled in the space between the groove 22 and the outer surface of the hollow cylindrical body 23 are provided on the upper surface of the supply main body 21. It is possible to spray the cleaning sheet 14 from the solvent outlet 26. In this case, the cleaning sheet 14 can be evenly sprayed from the plurality of solvent outlets 26.

  Further, when the suction source is driven, the suction port of the press contact head 15 comes into contact with the back surface of the cleaning sheet 14 in contact with the screen 3, and the cream solder adhering to the screen 3 is sucked through the cleaning sheet 14. Thus, when the screen 3 is reciprocated in the left-right direction in FIG. The cream solder coming out from the pattern hole to the lower surface can be attached to the cleaning sheet 14 for cleaning. In this case, the cream solder is melted at the portion of the cleaning sheet 14 where the solvent is sprayed and wiped off at the portion where the solvent is not sprayed. In addition, the reciprocating range is determined in accordance with the printing area of the screen 3 (the range having the printing pattern holes), and all the printing pattern holes are cleaned.

  When the cleaning of the entire printing range of the screen 3 is completed, the reciprocation of the screen 3 is stopped, the screen cleaning unit 10 is rotated around the center line of the support shaft 11 and moved downward, and the screen cleaning unit 10 is moved. The cleaning is completed after moving away from the screen 3.

  Then, when the model is switched when the cream solder is screen-printed on a different type of printed circuit board P, the warp prevention body 47 attached to the elevating plate 44 is slid to reduce the small diameter portion 45B of the locking member 45. The locking member 45 is moved to the position of the large diameter hole 49A from the small diameter hole 49B in which is fitted, the large diameter portion 45A is removed from the large diameter hole 49A, and the warp prevention body 47 is removed from the lifting plate 44, Instead, by attaching the new warp prevention body 47 having a different position and number of the pressing members 48 to the elevating plate 44 as described above, it can be dealt with by a simple operation.

  This cleaning operation may be performed periodically depending on the production operation time or the number of printed boards, and the screen 3 is cleaned based on the result of detecting the clogging state of the cream solder on the screen 3. Alternatively, the screen 3 may be cleaned based on the determination result of the print paste quality determination means after applying the cream solder on the printed circuit board P.

  In the above embodiment, the screen 3 is moved by moving the screen 3 while the screen cleaning unit 10 is stopped. Instead, the screen 3 is stopped while the screen 3 is stopped. The screen 3 may be cleaned by moving the cleaning unit 10.

  In the above-described embodiment, the elevating plate 44 is provided with the locking member 45 having the large diameter portion 45A and the small diameter portion 45B, and the warpage preventing body 47 has the large diameter hole 49A and the small diameter hole 49A. 49, but the present invention is not limited to this, and a locking member provided with a large-diameter portion and a small-diameter portion in the warpage prevention body 47 while providing a locking hole with a large-diameter hole and a small-diameter hole in the lifting plate 44. May be provided.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic side view of a screen printing machine. It is a side view which makes a partial cross section of a screen cleaning unit. It is a top view of a substrate correction unit. It is a right view of the board | substrate correction unit before attachment of a curvature prevention body. It is a partial right view of the board | substrate correction unit before attachment of a curvature prevention body. It is a partial right view of the board | substrate correction unit before attachment of a curvature prevention body. It is a front view of a substrate correction unit. It is a right view of the board | substrate correction unit of the state which the curvature prevention body rose. It is a right view of the board | substrate correction unit of the state which the curvature prevention body fell.

Explanation of symbols

2 Substrate support unit 3 Screen 6 Squeegee 9 Substrate correction unit 44 Elevating plate 45 Locking member 45A Large diameter portion 45B Small diameter portion 47 Warpage prevention body 48 Press member 49 Locking hole 49A Large diameter hole 49B Small diameter hole

Claims (2)

  Warpage in a screen printing machine that is provided in a screen printing machine that applies a coating agent on a screen board onto a printed circuit board by moving a squeegee and presses the printed circuit board supported by the board support device from above to correct the warping. A straightening device, which is provided on the main body of the device movable between the screen plate and the printed circuit board supported by the substrate support device so as to be movable downward and has a large diameter portion and a small diameter portion. A lifting hole provided with a plurality of members, a plurality of pressing members that press the printed circuit board supported by the substrate support device from above, and a large-diameter hole into which the large-diameter portion of the locking member fits. And a warp preventing body provided with a plurality of locking holes each having a small diameter hole into which the small diameter portion is fitted, and a large size of the locking member provided in the elevating body. The small diameter portion of the locking member and the locking hole of the warpage prevention body are moved by moving the warpage prevention body in the horizontal direction after fitting the portion and the large diameter hole of the locking hole of the warpage prevention body. A warp correction apparatus in a screen printing machine, wherein a warp prevention body is detachably attached to the elevating body.   Warpage in a screen printing machine that is provided in a screen printing machine that applies a coating agent on a screen board onto a printed circuit board by moving a squeegee and presses the printed circuit board supported by the board support device from above to correct the warping. A correction device, which is provided on a device main body movable between the screen plate and the printed circuit board supported by the substrate support device and is movably provided downward, and has a large diameter hole and a small diameter hole communicating with the large diameter hole. A large-diameter hole that includes a plurality of locking holes and a plurality of pressing members that press the printed circuit board supported by the substrate support device from above and that fits into the large-diameter hole of the locking hole And a warp preventing body provided with a plurality of locking members each having a small diameter portion fitted to the small diameter hole, and a large diameter portion of the locking member provided on the warpage preventing body, After fitting the large diameter hole of the locking hole of the lifting body, the small diameter portion of the locking member and the small diameter hole of the locking hole of the lifting body by moving the warpage prevention body in the horizontal direction And a warpage prevention device in a screen printing machine, wherein a warpage prevention body is detachably attached to the elevating body.

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